A circuit board manufacturing method, apparatus, system, and storage medium thereof
By fusing high-precision data and solder paste status data, and combining them with component-differentiated weighting coefficients, the problem of poor placement caused by FPCB/PCB incoming material deformation and solder paste printing offset was solved, improving placement accuracy and yield, and realizing full-process data association and traceability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ALEADER VISION TECH
- Filing Date
- 2026-04-17
- Publication Date
- 2026-06-09
Smart Images
Figure CN122179998A_ABST
Abstract
Claims
1. A method for manufacturing a circuit board, characterized in that, Including: Obtaining high-precision data of the circuit board; Performing solder paste printing on the circuit board; Collecting solder paste state data on the circuit board; Fusing the high-precision data and the solder paste state data to generate component mounting data; Based on the component mounting data, mounting different types of components onto the corresponding pads of the circuit board; Heating the circuit board to solder different types of components onto the corresponding pads of the circuit board.
2. The circuit board manufacturing method according to claim 1, characterized in that, The high-precision data at least includes at least one of the actual coordinates of the whole-board fiducial points, the actual coordinates of the sub-board fiducial points, the actual coordinates of all pads of the sub-board, the offset of the positioning holes, and the sub-board partition information.
3. The circuit board manufacturing method according to claim 2, characterized in that, The collecting the solder paste state data on the circuit board includes: After performing solder paste printing on the circuit board, transporting the circuit board to the station of the solder paste inspection machine; The solder paste inspection machine performs high-precision positioning on the sub-board fiducial points of each sub-board of the circuit board to generate a sub-board positioning result; Based on the sub-board positioning result, performing point-by-point data collection on the solder paste at each pad of the sub-board to obtain the solder paste state data.
4. The circuit board manufacturing method according to claim 2, characterized in that, The fusing the high-precision data and the solder paste state data to generate component mounting data includes: Confirming the component information corresponding to each pad; Based on the component information, high-precision data, and the solder paste state data, establishing one-to-one component mounting data of component-pad-solder paste.
5. The circuit board manufacturing method according to claim 4, characterized in that, The establishing one-to-one component mounting data of component-pad-solder paste based on the component information, high-precision data, and the solder paste state data includes: Unifying the coordinate systems of the high-precision data and the solder paste state data; Based on the pad coordinates in the high-precision data, confirming the component mounting coordinates A(x, y), Based on the offset data of the solder paste state data relative to the pad coordinates, confirming the component mounting position offset BA(x, y), Based on the component information, component mounting coordinates A(x, y), and the component mounting position offset BA(x, y), generating component mounting data.
6. The circuit board manufacturing method according to claim 5, characterized in that, The generating component mounting data based on the component information, component mounting coordinates A(x, y), and the component mounting position offset BA(x, y) includes: According to the component information of the component to be mounted, confirming the solder paste offset weight coefficient k corresponding to the component to be mounted; Using the solder paste offset weight coefficient k to adjust the component mounting data to generate target mounting data.
7. The circuit board manufacturing method according to claim 6, characterized in that, The calculation method of the target mounting data is: C(x, y)=A(x, y)+k×BA(x, y), where the component types include three categories. The first category of components (k = 0) are large-size components; the second category of components (0 < k < 1) are medium-size components; the third category of components (k = 1) are small-size components.
8. A circuit board manufacturing apparatus, characterized in that, Including: A printer, used for obtaining high-precision data of the circuit board and for performing solder paste printing on the circuit board; A solder paste inspection machine, used for collecting the solder paste state data on the circuit board; fusing the high-precision data and the solder paste state data to generate component mounting data; A mounter, used for mounting different types of components onto the corresponding pads of the circuit board based on the component mounting data; A reflow oven is used to heat the circuit board to solder different types of components to the corresponding pads on the circuit board.
9. A circuit board manufacturing system, characterized in that, include: One or more processors; Memory, used to store one or more programs; When the one or more programs are executed by the one or more processors, the one or more processors implement the circuit board manufacturing method as described in any one of claims 1-7.
10. A storage medium having a computer program stored thereon, characterized in that, When the program is executed by the processor, it implements the circuit board manufacturing method as described in any one of claims 1-7.