Method and apparatus for temperature distribution

Abstract

The present technology relates to methods and apparatus for temperature distribution. In particular, various embodiments of the present technology can provide a radiation shield formed from a body having a plurality of cutouts. The radiation shield can also include a plurality of removable segments shaped to be disposed within the cutouts.

Description

Invention Field

[0001] This disclosure generally relates to methods and apparatus for temperature distribution. More specifically, this disclosure relates to a radiation shield disposed below a base in the lower chamber of a reactor. Background Technology

[0002] Non-uniform patterns in the film on the wafer can be partly caused by temperature gradients within the reactor. In many cases, the substrate heats the wafer during processing; however, heat loss at the substrate can produce undesirable temperature non-uniformities on both the substrate and the wafer. Summary of the Invention

[0003] Various embodiments of this technology can provide a radiation shield formed from a body having multiple cutouts. The radiation shield may also include multiple removable segments shaped to be disposed within the cutouts.

[0004] According to one aspect, an apparatus includes: a body comprising a plurality of cutouts arranged in a plurality of circular regions; and a plurality of removable segments, each segment disposed within one of the plurality of cutouts.

[0005] In one embodiment, the plurality of circular areas includes at least two circular areas.

[0006] In one embodiment, the device further includes a plurality of stabilizers arranged on the bottom surface of the body, wherein the stabilizers extend toward the cutout.

[0007] In one embodiment, the plurality of removable segments directly contact at least one of the plurality of stabilizers.

[0008] In one embodiment, the body is formed of a metallic material including at least one of aluminum, nickel, or tungsten.

[0009] In one embodiment, the number of removable segments ranges from 20 to 48 segments.

[0010] In one embodiment, each of the plurality of removable segments includes a first surface having a first emissivity and a second opposing surface having a second emissivity.

[0011] In one embodiment, the first emission rate is different from the second emission rate.

[0012] In one embodiment, the number of cuts is equal to the number of removable segments.

[0013] In one embodiment, each cut includes an inward-facing edge containing a groove.

[0014] In one embodiment, each segment includes an outer edge containing a protrusion, the protrusion being sized to mate with a groove.

[0015] In one embodiment, the body has a height in the range of 1 mm to 2 mm, and each segment has a height in the range of 1 mm to 2 mm.

[0016] In another aspect, a system includes: a reaction chamber including a support assembly, the support assembly including a base and a pedestal coupled to the base; and a plate coupled to the support assembly, the plate including: a body including a recess; and a plurality of removable segments disposed within the recess.

[0017] In one embodiment, each segment includes a body and a lip extending outward from the body.

[0018] In one embodiment, the lip edge of one segment overlaps with the lip edge of the adjacent segment.

[0019] In one embodiment, a first segment of a plurality of removable segments has a first emission rate, and a second segment of a plurality of removable segments has a second emission rate.

[0020] In one embodiment, the plate has a height in the range of 1 mm to 2 mm.

[0021] In another aspect, a system includes: a reaction chamber including a support assembly including a base and a pedestal coupled to the base; and a plate coupled to the support assembly, the plate including: a body including: a plurality of cutouts, wherein a first cutout is arranged at the geometric center of the plate and a second cutout is arranged adjacent to the first cutout and has an arched shape; and at least one region on the upper surface of the body having an emissivity different from the remaining area of ​​the upper surface.

[0022] In one embodiment, the plate has a thickness in the range of 1 mm to 2 mm.

[0023] In one embodiment, the cut has a width ranging from 5 mm to 30 mm. Attached Figure Description

[0024] A more complete understanding of the art can be obtained by referring to the detailed description when considered in conjunction with the following illustrative drawings. In the following drawings, the same reference numerals refer to similar elements and steps throughout all the drawings.

[0025] Figure 1 A system according to an embodiment of the present technology is shown in a representative manner;

[0026] Figure 2 This is a top view of a radiation shielding component according to an embodiment of the present technology;

[0027] Figure 3 This is a perspective view of a radiation shielding component according to an embodiment of the present technology;

[0028] Figure 4 This is a bottom view of a portion of a radiation shielding component according to an embodiment of the present technology;

[0029] Figure 5 This is a partial cross-sectional view of a radiation shielding component according to an embodiment of the present technology;

[0030] Figure 6A This is a cross-sectional view of a radiation shielding component according to an embodiment of the present technology;

[0031] Figure 6B This is a partial cross-sectional view of a radiation shielding component according to an embodiment of the present technology;

[0032] Figure 7A and Figure 7B A perspective view of a radiation shielding member according to an embodiment of the present technology; and

[0033] Figure 8 This is a perspective view of a radiation shielding component according to an embodiment of the present technology. Detailed Implementation

[0034] This technology can be described in terms of functional block components and various processing steps. Such functional blocks can be implemented by any number of components configured to perform specified functions and achieve various results. For example, this technology can employ various reaction chambers, containers, and bases.

[0035] refer to Figure 1 The exemplary system 100 may include a reactor 105 configured to perform processing on an object to be processed, such as a substrate 135, for example, a wafer. For example, reactor 105 may be configured to perform heating, deposition, etching, polishing, ion implantation, and / or other processing on the object to be processed. In some embodiments, reactor 105 may be configured to perform moving functions, vacuum sealing functions, and venting functions. In some embodiments, reactor 105 may perform atomic layer deposition (ALD) processes or chemical vapor deposition (CVD) processes.

[0036] In various embodiments, reactor 105 may include a reaction chamber 110 and a spray head 115. The reaction chamber 110 may include sidewalls forming a lower chamber volume 140. The spray head 115 may be configured to deliver vapor into the reaction chamber 110. Specifically, the spray head 115 may be configured to deliver vapor into a reaction space 145, in which the substrate 135 is located during the deposition process or other processes. The spray head 115, together with the reaction chamber 110, forms an enclosed space comprising the lower chamber volume 140 and the reaction space 145.

[0037] In various embodiments, the spray head 115 may be disposed on the top surface of the reaction chamber 110. In some embodiments, the spray head 115 may be fastened to the side wall; however, in other cases, the spray head 115 may simply rest on the side wall of the reaction chamber 110.

[0038] In various embodiments, system 100 may further include a support assembly disposed within reactor 105. The support assembly may include: a base 120 having a surface for supporting substrate 135; and a base 125 coupled to base 120. In various embodiments, base 120 may include a heating element 150 for heating substrate 225. For example, heating element 150 may include a resistance heating element or any other suitable heating element. Heating element 150 may be embedded within base 120.

[0039] To load / unload substrate 135, the support assembly can be configured to move vertically (up and down) by being connected to a drive unit (not shown). For example, base 125 can be coupled to the drive unit such that base 125 moves together with base 120.

[0040] In various embodiments, the support assembly may be arranged within the lower chamber 140 of the reaction chamber 110. For example, a base 125 may be arranged in the lower chamber 140, while the pedestal 120 may be exposed to both the lower chamber 140 and the reaction space 145, depending on the location of the support assembly. Figure 1 The support assembly is shown in the processing position, which is the location of the support assembly and base 120 during the deposition process.

[0041] Additionally, when the base 120 is in the processing position, the reaction space 145 may be formed by the base 120 and the spray head 115. In some embodiments, the reaction space 145 may also be formed by a portion of the reaction chamber 110, such as the sidewall of the reaction chamber 110, and / or other components within the reaction chamber 110, such as a partition (not shown) or a flow control ring (not shown).

[0042] In various embodiments, and referring to Figure 1 As shown in Figure 7, system 100 may further include a radiation shield 130 to provide temperature distribution and regulation to base 120. Radiation shield 130 may be formed of a metallic material, such as aluminum, nickel, tungsten, or a metal alloy. Radiation shield 130 may be disposed in the lower chamber 140 of reaction chamber 110, opposite reaction space 145, and adjacent to the bottom surface of base 120. Furthermore, radiation shield 130 may be coupled to a support assembly. For example, radiation shield 130 may be fastened to base 120 and / or base 125 using bolts or the like. Radiation shield 130 may have a height ranging from 1 mm to 2 mm.

[0043] In various embodiments, the radiation shield 130 may include a top surface 250 and a bottom surface 400. The top surface 250 may face the bottom surface of the base 120. In various embodiments, the radiation shield 130 may include a region having a texture different from the rest of the body 235. For example, the body 235 may include a region 700 with a different texture to change the emissivity of that region. For example, region 700 may be polished or textured / roughened to change the emissivity of that region. Polishing may reduce emissivity, while texturing / roughening may increase emissivity. Region 700 may be located near the central opening 210 and may include any surface area. The surface area of ​​region 700 may be selected based on desired temperature regulation. For example, Figure 7A The region 700 is less than Figure 8 In region 700, each pattern provides a desired temperature gradient to wafer 135.

[0044] In various embodiments, the radiation shield 130 may include a body 235 and a plurality of cutouts 200 or openings within the body 235. For example, the radiation shield 130 may include a central opening 210 at the geometric center of the radiation shield 130. The central opening 210 can be used to receive a base 125. In other words, the base 125 can be inserted into the central opening 210. The body 235 may have a height H1 in the range of 1 mm to 2 mm. The diameter of the body 235 may be in the range of 300 mm to 500 mm, more specifically in the range of 380 mm to 420 mm. The body 235 may be formed of a metallic material, such as aluminum, nickel, tungsten, or a metal alloy.

[0045] In various embodiments, the cutouts 200 may be arranged in a circular pattern across multiple zones. For example, the radiation shield 130 may include one or more cutouts 200 in a first zone 215, a second zone 220 concentric with the first zone 215, a third zone 225 concentric with the second zone 220, and a fourth zone 230 concentric with the third zone 225. Each zone may be concentric with the central opening 210. The cutouts 200 may be of any desired shape or size. In some embodiments, the width of the cutouts 200 may range from 5 mm to 30 mm, more specifically from 9 mm to 24 mm. The width of the cutouts 200 may be selected based on the number of zones, as a larger number of zones will result in a smaller width.

[0046] In various embodiments, the radiation shield 130 may further include a plurality of removable segments 205. Each removable segment 205 may be shaped to be disposed within one of a plurality of cutouts 200. Each removable segment 205 may have a height H2 in the range of 1 mm to 2 mm. The removable segments 205 may be formed of a metallic material, such as aluminum, nickel, tungsten, or a metal alloy. Each segment 205 may have a different emissivity than adjacent segments. For example, the top surface of segment 205 may have a different emissivity than the bottom surface of the same segment 205. The emissivity may be altered by polishing (to reduce emissivity) or texturing / roughening (to increase emissivity).

[0047] In various embodiments, the radiation shield 130 may further include a plurality of stabilizers 405 disposed on the bottom surface 400 of the body 235. The stabilizers 405 may extend inward toward the cutout 200. Each cutout 200 may have a plurality of stabilizers 405, one stabilizer along each edge of the cutout 200. The stabilizers 405 may support the removable segment 205. For example, when the removable segment is disposed within the cutout 200, the removable segment 205 may be in direct contact with the stabilizer 405. The stabilizer 405 may be of any size or shape suitable for supporting the removable segment 205. In some embodiments, the stabilizer 405 may have a length L1 in the range of 2 mm to 6 mm.

[0048] In various embodiments, each cutout 200 may include an inner-facing edge 500 containing a groove. A removable segment 205 may include an outer edge 520 that mates with the groove.

[0049] In some embodiments, and with reference to Figure 6A and Figure 6B The radiation shield 130 may include a recess 605. In this embodiment, a plurality of removable segments 205(a), 205(b) may be disposed within the recess 605 and supported by a body 235, wherein the portion of the body 235 supporting the removable segments 205 is a solid continuous material. In this embodiment, the removable segment 205 may include a body 605 and a lip 600. In this case, the lip 600 may extend outward from the body 605, such that the removable segment 205 forms an L-shape. In this case, the body 235 may be formed of a metallic material, such as aluminum, nickel, tungsten, or a combination thereof. Furthermore, the removable segments 205(a), 205(b) may be formed of a metallic material, such as aluminum, nickel, tungsten, or a metal alloy.

[0050] In the foregoing description, the present technology has been described with reference to specific exemplary embodiments. The specific embodiments shown and described are illustrative of the present technology and its best mode, and are not intended to limit the scope of the present technology in any way. In fact, for the sake of brevity, conventional manufacturing, connection, fabrication, and other functional aspects of the method and system may not be described in detail. Furthermore, the connecting lines shown in the figures are intended to represent exemplary functional relationships and / or steps between various elements. In actual systems, many alternative or additional functional relationships or physical connections may exist.

[0051] The present technology has been described with reference to specific exemplary embodiments. However, various modifications and changes can be made without departing from the scope of the present technology. The specification and drawings are to be considered illustrative rather than restrictive, and all such modifications are intended to be included within the scope of the present technology. Therefore, the scope of the present technology should be determined by the general embodiments described and their legal equivalents, and not solely by the specific examples described above. For example, unless expressly stated otherwise, the steps described in any method or process embodiment may be performed in any order, and are not limited to the explicit order presented in the specific examples. Furthermore, the components and / or elements described in any device embodiment may be assembled or otherwise configured to produce substantially the same results as the present technology in various arrangements, and are therefore not limited to the specific configurations described in the specific examples.

[0052] The benefits, other advantages, and solutions to problems have been described above with respect to specific embodiments. However, any benefit, advantage, solution to a problem, or any element that may cause any particular benefit, advantage, or solution to occur or become more apparent should not be construed as a critical, essential, or necessary feature or component.

[0053] The terms “comprising,” “including,” or any variation thereof are intended to indicate a non-exclusive inclusion, such that a process, method, article, composition, or apparatus that comprises a list of elements includes not only those elements listed but also other elements not expressly listed or inherent to such process, method, article, composition, or apparatus. Other combinations and / or modifications of the aforementioned structures, arrangements, applications, proportions, elements, materials, or components used in the practice of this art, except those specifically described, may vary or otherwise be adapted particularly to particular environments, manufacturing specifications, design parameters, or other operational requirements without departing from its general principles.

[0054] The present technology has been described above with reference to exemplary embodiments. However, changes and modifications may be made to the exemplary embodiments without departing from the scope of the present technology. These and other changes or modifications are intended to be included within the scope of the present technology, as set forth in the following claims.

Claims

1. An apparatus comprising: The main body includes multiple cutouts arranged in multiple circular areas; as well as Multiple removable segments, each set within one of multiple cutouts.

2. The device according to claim 1, wherein, The plurality of circular areas includes at least two circular areas.

3. The device according to claim 1, wherein, The device also includes a plurality of stabilizers arranged on the bottom surface of the body, wherein the stabilizers extend toward the cut.

4. The device according to claim 3, wherein, The plurality of removable segments are in direct contact with at least one of the plurality of stabilizers.

5. The device according to claim 1, wherein, The body is formed of a metallic material, including at least one of aluminum, nickel, or tungsten.

6. The device according to claim 1, wherein, The number of removable segments ranges from 20 to 48.

7. The device according to claim 1, wherein, Each of the plurality of removable segments includes a first surface having a first emissivity and a second opposing surface having a second emissivity.

8. The device according to claim 1, wherein, The first emissivity is different from the second emissivity.

9. The device according to claim 1, wherein, The number of cuts is equal to the number of removable segments.

10. The device according to claim 1, wherein, Each cut includes an inward-facing edge containing a groove.

11. The device according to claim 10, wherein, Each segment includes an outer edge containing protrusions, the size of which is designed to mate with the groove.

12. The device according to claim 1, wherein, The main body has a height in the range of 1 mm to 2 mm, and each segment has a height in the range of 1 mm to 2 mm.

13. A system comprising: A reaction chamber, which includes a support assembly, the support assembly including a base and a pedestal connected to the base; as well as A plate, which is connected to a support assembly, includes: The main body includes the pit; and Multiple removable segments are set within the recesses.

14. The reactor according to claim 13, wherein, Each segment includes the body and the lip extending outward from the body.

15. The reactor according to claim 14, wherein, The lip edge of one segment overlaps with the lip edge of the adjacent segment.

16. The reactor according to claim 13, wherein, The first segment of the plurality of removable segments has a first emission rate, and the second segment of the plurality of removable segments has a second emission rate.

17. The reactor according to claim 13, wherein, The plate has a height in the range of 1 mm to 2 mm.

18. A system comprising: A reaction chamber, which includes a support assembly, the support assembly including a base and a pedestal connected to the base; as well as A plate, which is connected to a support assembly, includes: The main body includes: Multiple cuts, wherein a first cut is located at the geometric center of the plate, and a second cut is located adjacent to the first cut and has an arched shape; and At least one region on the upper surface of the body has an emissivity different from the rest of the upper surface.

19. The system according to claim 18, wherein, The plate has a thickness in the range of 1 mm to 2 mm.

20. The system according to claim 18, wherein, The cut has a width ranging from 5 mm to 30 mm.

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