Method and system for water guided laser processing of CVD-SiC micro-holes

By synergistically controlling picosecond lasers and small-diameter water jets and using real-time plasma feedback, the accuracy and efficiency issues of water-guided laser systems in CVD-SiC micro-hole processing have been solved, achieving high-precision, low-damage, and high-efficiency micro-hole processing results.

CN122184577APending Publication Date: 2026-06-12ZHEJIANG LIUFANG CARBON TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ZHEJIANG LIUFANG CARBON TECH CO LTD
Filing Date
2026-02-10
Publication Date
2026-06-12

AI Technical Summary

Technical Problem

Existing water-guided laser systems suffer from insufficient water flow stability, unoptimized laser parameters, high residual thermal stress, and lack of real-time feedback control when processing CVD-SiC micropores, making it difficult to achieve high-precision, low-damage, and high-efficiency micropore processing.

Method used

By coupling picosecond lasers with small-diameter water jets, combined with helical feed and stepped retraction strategies, and real-time monitoring of plasma emission spectra for power control, a five-axis laser processing center is used to achieve coordinated control and real-time feedback of laser-water flow-material.

Benefits of technology

It achieves ±1 μm aperture control, eliminates amorphous layers and microcracks, reduces single-hole processing time by more than 60%, and supports efficient forming of high aspect ratio holes with a depth-to-diameter ratio ≥15:1.

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Abstract

The present application relates to a kind of water guide laser processing CVD-SiC micropore method and system, the method includes the following steps: coupling picosecond laser and water flow and emit, form water guide laser;Using the water guide laser is processed to CVD-SiC matrix with spiral feed, and real-time collection plasma emission spectrum, when detecting that Si or C spectrum line intensity suddenly increases and exceeds set value, determine that it is overburning and automatically reduce laser power, until micro-hole is processed.The present application adopts small diameter water jet+ultraviolet picosecond laser, suppresses diffraction and heat diffusion, spiral feed+step tool withdrawal strategy eliminates cumulative error, realizes ±1 μm aperture control.Instant cooling+power density precision control, realize no amorphous layer, no microcrack;Real-time plasma feedback avoids local overburning.High repetition frequency+high speed feed+continuous chip removal, realize single-hole processing time is shortened by more than 60%;Support high aspect ratio hole high-efficiency forming of deep-diameter ratio ≥15:1.
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