Tin removal device

Abstract

The embodiment of the present application provides a tin removing device, which comprises a tin melting mechanism, a tin shoveling mechanism and a vacuum generating mechanism. The tin melting mechanism comprises a laser generator, which is used for melting waste tin. The tin shoveling mechanism comprises a shoveling block and a driving module, which is connected with the shoveling block and can drive the shoveling block to move along a welding surface to separate the melted waste tin from a packaging substrate. The vacuum generating mechanism comprises an adsorption block, which is used for adsorbing the melted waste tin. The laser can sufficiently melt the waste tin without affecting surrounding welding points. Meanwhile, the driving module drives the shoveling block to move along the welding surface, so that the bottom of the waste tin can be separated from the packaging substrate in time after being melted, heat transfer between the waste tin and the packaging substrate is cut off, the waste tin is prevented from solidifying on the packaging substrate again, and the shoveling block can disturb the waste tin to help heat transfer to the bottom of the waste tin, so that the bottom of the waste tin is sufficiently melted and can be adsorbed by the adsorption block, thereby thoroughly removing the waste tin.

Description

Technical Field

[0001] This invention relates to the field of ball grid array packaging technology, and in particular to a tin removal device. Background Technology

[0002] Ball Grid Array (BGA) is an integrated circuit packaging technology that involves placing solder balls onto corresponding points on the packaging substrate and then melting the solder balls with a laser to form spherical solder joints. During the packaging process, errors can occur, such as inaccurate ball placement, improper laser parameters, or inconsistent solder joint heights, resulting in some defective solder joints. The waste solder from these defective joints needs to be removed.

[0003] In related technologies, desoldering devices use a hot air gun to melt waste solder, and then a suction nozzle removes the molten waste solder. Because the hot air from the hot air gun has a large effective range, excessively high temperatures can affect the normal solder joints around the waste solder, while excessively low temperatures can result in incomplete melting of the waste solder, preventing the suction nozzle from removing all of it. Furthermore, since the bottom of the waste solder is bonded to the packaging substrate, it can easily re-solidify due to heat release from the substrate, and heat is difficult to transfer to the bottom of the waste solder, resulting in incomplete melting at the bottom. Therefore, existing desoldering devices are insufficient to completely remove waste solder. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention proposes a tin removal device capable of thoroughly removing waste tin.

[0005] This invention provides a desoldering device, comprising: a desoldering mechanism including a laser generator for emitting laser light onto waste solder located on the soldering surface of a packaging substrate to melt the waste solder; a desoldering mechanism including a desoldering block and a drive module connected to the desoldering block and capable of driving the desoldering block to move along the soldering surface to separate the molten waste solder from the packaging substrate; and a vacuum generating mechanism including an adsorption block for sucking up the molten waste solder.

[0006] The desoldering device provided by the embodiments of the present invention has at least the following beneficial effects: A laser generator emits a laser beam onto the waste solder, melting it. The concentrated laser beam effectively melts the waste solder without affecting surrounding solder joints, allowing it to be easily removed by the adsorption block. Simultaneously, a drive module moves a shovel along the soldering surface, ensuring that the bottom of the melted waste solder is promptly separated from the packaging substrate. This cuts off heat transfer between the waste solder and the packaging substrate, preventing the waste solder from re-solidifying on the substrate. Furthermore, the shovel can agitate the molten waste solder, helping to transfer heat to its bottom, ensuring it is fully melted and can be removed by the adsorption block, thus achieving thorough removal of the waste solder.

[0007] In one embodiment of this implementation, the drive module includes a first driver and a second driver. The first driver can drive the shovel block to move along a first direction, and the second driver can drive the shovel block to move along a second direction. The first direction and the second direction intersect and are both parallel to the welding surface.

[0008] In one embodiment of this implementation, the solder scraping mechanism includes a third driver connected to the scraper block and capable of driving the scraper block to move along a third direction intersecting the soldering surface.

[0009] In one embodiment of this implementation, the adsorption block has a negative pressure chamber, a light-transmitting hole, and an adsorption hole. The light-transmitting hole is connected to the top side of the negative pressure chamber, and the adsorption hole is connected to the bottom side of the negative pressure chamber. The laser generator is located on the top side of the adsorption block and is capable of emitting laser light that passes sequentially through the light-transmitting hole, the negative pressure chamber, and the adsorption hole.

[0010] In one embodiment of this implementation, the vacuum generating mechanism includes an optical lens disposed on the top side of the adsorption block and sealing the opening of the light-transmitting hole.

[0011] In one embodiment of this implementation, the adsorption block has a sealing groove surrounding the opening of the light-transmitting hole, and the vacuum generating mechanism includes a sealing ring, which is disposed in the sealing groove and abuts against the optical lens.

[0012] In one embodiment of this implementation, the vacuum generating mechanism includes a pressure block disposed on the adsorption block and abutting against the side of the optical lens facing away from the light-transmitting hole.

[0013] In one embodiment of this implementation, the vacuum generating mechanism includes a vacuum generator, the adsorption block has a negative pressure hole, the negative pressure hole is connected to the periphery of the negative pressure chamber, the vacuum generator is connected to the negative pressure hole, and can provide negative pressure to the negative pressure chamber through the negative pressure hole.

[0014] In one embodiment of this implementation, the solder melting mechanism includes a fourth driver connected to the laser generator and capable of driving the laser generator to move axially along the adsorption hole.

[0015] In one embodiment of this implementation, the solder melting mechanism includes a driving component connected to the laser generator and capable of driving the laser generator to move radially along the adsorption hole.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a schematic diagram of the tin removal device and packaging substrate according to one embodiment of the present invention; Figure 2 yes Figure 1 A front view of the desoldering device; Figure 3 yes Figure 2 A schematic diagram of the solder melting mechanism in the desoldering device; Figure 4 yes Figure 2 A schematic diagram of the tin-removing mechanism in a tin removal device; Figure 5 yes Figure 2 A schematic diagram of the vacuum generating mechanism in the detinning device; Figure 6 yes Figure 5 A cross-sectional view of the vacuum generating mechanism; Figure 7 yes Figure 2 An enlarged schematic diagram of region I of the detinning device.

[0018] Figure label: Detin removal device 100; Solder melting mechanism 10; laser generator 11; fourth driver 12; drive assembly 13; fifth driver 131; sixth driver 132; Solder removal mechanism 20; Solder removal block 21; Solder removal surface 211; Drive module 22; First driver 221; Second driver 222; Third driver 23; Extension block 24; Vacuum generating mechanism 30; adsorption block 31; adsorption surface 311; negative pressure chamber 3101; light transmission hole 3102; adsorption hole 3103; negative pressure hole 3104; sealing groove 3105; optical lens 32; sealing ring 33; pressure block 34; Mounting plate 40; Lifting drive mechanism 50; Packaging substrate 200; soldering surface 210. Detailed Implementation

[0019] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0020] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0021] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0022] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0023] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0024] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of the detinning device 100 and the packaging substrate 200 according to one embodiment of the present invention; Figure 2 yes Figure 1A front view of a desoldering device 100. This invention provides a desoldering device 100, which includes a solder melting mechanism 10, a solder scraping mechanism 20, and a vacuum generating mechanism 30. The solder melting mechanism 10 includes a laser generator 11, which emits a laser beam onto waste solder located on the soldering surface 210 of the packaging substrate 200 to melt the waste solder. The solder scraping mechanism 20 includes a scraper block 21 and a drive module 22. The drive module 22 is connected to the scraper block 21 and can drive the scraper block 21 to move along the soldering surface 210 to separate the molten waste solder from the packaging substrate 200. The vacuum generating mechanism 30 includes an adsorption block 31, which is used to remove the molten waste solder.

[0025] Specifically, the packaging substrate 200 can be a circuit board, chip, or other package.

[0026] Specifically, the drive module 22 can drive the shovel block 21 to rotate along an axis perpendicular to the welding surface 210, so as to scoop up the molten waste solder by rotation. The drive module 22 can also drive the shovel block 21 to move in a direction parallel to the welding surface 210, so as to scoop up the molten waste solder by translation. When the shovel block 21 moves along the welding surface 210, the shovel block 21 can scoop up a portion of the waste solder, so that this portion of the waste solder is separated from the packaging substrate 200. The shovel block 21 can also push a portion of the waste solder to help the bottom of the waste solder absorb heat and melt.

[0027] Specifically, the adsorption block 31, the laser generator 11, and the tin scraping mechanism 20 can operate synchronously. For example, while the laser generator 11 emits a laser to melt the waste tin, the adsorption block 31 sucks up the melted waste tin, and the drive module 22 drives the tin scraping block 21 to scrape the waste tin.

[0028] Specifically, the desoldering device 100 includes a mounting plate 40 and a lifting drive mechanism 50. The solder melting mechanism 10, the solder scraping mechanism 20, and the vacuum generating mechanism 30 are all mounted on the mounting plate 40. The lifting drive mechanism 50 is connected to the mounting plate 40 to drive the solder melting mechanism 10, the solder scraping mechanism 20, and the vacuum generating mechanism 30 to move up and down synchronously, facilitating the switching of the desoldering device 100 between a working state and a standby state. It can be understood that when the desoldering device 100 needs to switch from a working state to a standby state, the lifting drive mechanism 50 drives the mounting plate 40 to raise the solder melting mechanism 10, the solder scraping mechanism 20, and the vacuum generating mechanism 30, moving them away from the packaging substrate 200. When the desoldering device 100 needs to switch from a standby state to a working state, the lifting drive mechanism 50 drives the mounting plate 40 to lower the solder melting mechanism 10, the solder scraping mechanism 20, and the vacuum generating mechanism 30, bringing them closer to the packaging substrate 200.

[0029] The laser generator 11 emits a laser beam onto the waste solder, causing it to melt. The laser's effective range is concentrated, allowing the waste solder to melt completely without affecting surrounding solder joints, making it easier for the adsorption block 31 to remove it. Simultaneously, the drive module 22 drives the shovel block 21 to move along the welding surface 210, ensuring that the bottom of the waste solder can be separated from the packaging substrate 200 in a timely manner after melting. This cuts off the heat transfer between the waste solder and the packaging substrate 200, preventing the waste solder from solidifying again on the packaging substrate 200. Furthermore, the shovel block 21 can disturb the molten waste solder, helping to transfer heat to the bottom of the waste solder, ensuring that the bottom of the waste solder melts completely and can be removed by the adsorption block 31, thereby achieving thorough removal of the waste solder.

[0030] In one embodiment of this implementation, please refer to Figure 1 and Figure 4 , Figure 4 yes Figure 2 A schematic diagram of the slag removal mechanism 20 in the slag removal device 100 is shown. To enable the slag block 21 to move along the soldering surface 210, the drive module 22 includes a first driver 221 and a second driver 222. The first driver 221 can drive the slag block 21 to move along a first direction, and the second driver 222 can drive the slag block 21 to move along a second direction. The first and second directions intersect and are both parallel to the soldering surface 210. With this configuration, the drive module 22 can drive the slag block 21 to move along the soldering surface 210 in a dual-axis manner, thereby better separating waste tin from the packaging substrate 200 and agitating the waste tin to help melt the bottom of the waste tin.

[0031] In one embodiment of this implementation, please refer to Figure 1 and Figure 4 The solder scraping mechanism 20 includes a third driver 23, which is connected to the scraper block 21 and can drive the scraper block 21 to move along a third direction intersecting the soldering surface 210. It should be noted that the scraper block 21 moves along the soldering surface 210, that is, the scraper block 21 moves within a plane at a certain distance from the soldering surface 210 (defined as the scraping surface). It can be understood that the third driver 23 can drive the scraper block 21 to move closer to or further away from the soldering surface 210 along the third direction to adjust the height position of the scraping surface. In conjunction with the drive module 22, it can effectively scrape and agitate the waste solder from high to low, ensuring that the waste solder is fully removed.

[0032] Specifically, the welding surface 210 is parallel to the horizontal plane, the first direction and the second direction are both horizontal and perpendicular to each other, and the third direction is vertical. In this embodiment, the first direction is parallel to the y-axis, the second direction is parallel to the x-axis, and the third direction is parallel to the z-axis.

[0033] Specifically, the first driver 221, the second driver 222, the third driver 23 and the shovel block 21 are connected in sequence. The first driver 221 can drive the second driver 222 to move the third driver 23 and the shovel block 21 along the y-axis direction. The second driver 222 can drive the third driver 23 to move the shovel block 21 along the x-axis direction. The third driver 23 can drive the shovel block 21 to move along the z-axis direction.

[0034] Specifically, a pressure sensor (not shown) is provided between the third actuator 23 and the shovel block 21. The pressure sensor can detect the pressure on the shovel block 21 in the x-axis, y-axis, and z-axis directions. The pressure sensor is electrically connected to the first actuator 221, the second actuator 222, and the third actuator 23 so that the corresponding actuator can be stopped when the pressure is too high, in order to avoid damaging the packaging substrate 200.

[0035] Specifically, in order to avoid the solder melting mechanism 10 and the vacuum generating mechanism 30, the solder scraping mechanism 20 includes an extension block 24. One end of the extension block 24 is connected to the third driver 23, and the other end of the extension block 24 extends along the z-axis and is fitted with a scraper block 21.

[0036] Specifically, one end of the shovel block 21 is connected to the drive module 22, and the other end has a shovel-off surface 211 facing away from the packaging substrate 200. The shovel-off surface 211 is inclined to the welding surface 210 so that when the drive module 22 drives the shovel block 21 to move along the welding surface 210, the molten waste solder can climb onto the shovel-off surface 211.

[0037] For details, please refer to Figure 2 , Figure 6 and Figure 7 , Figure 7 yes Figure 2 This is an enlarged schematic diagram of region I of the desoldering device 100. The adsorption block 31 has an adsorption surface 311 facing the soldering surface 210, and the adsorption surface 311 has an adsorption hole 3103. The adsorption surface 311 is parallel to the scraping surface 211. With this configuration, the adsorption hole 3103 can be aligned with the waste solder on the working surface, so as to remove the waste solder more thoroughly and quickly. At the same time, there is a larger clearance space between the adsorption block 31 and the packaging substrate 200, so as to avoid the scraping block 21. In addition, the adsorption block 31 can be closer to the packaging substrate 200, so as to adsorb at a shorter distance.

[0038] In one embodiment of this implementation, please refer to Figure 2 and Figure 6 , Figure 6 yes Figure 5A cross-sectional view of the vacuum generating mechanism 30. The adsorption block 31 has a negative pressure chamber 3101, a light-transmitting hole 3102, and an adsorption hole 3103. The light-transmitting hole 3102 is connected to the top side of the negative pressure chamber 3101, and the adsorption hole 3103 is connected to the bottom side of the negative pressure chamber 3101. The laser generator 11 is located on the top side of the adsorption block 31 and can emit laser light that passes through the light-transmitting hole 3102, the negative pressure chamber 3101, and the adsorption hole 3103 in sequence. With this configuration, the laser generator 11 is located on the top side of the adsorption block 31, and the emitted laser light can pass through the adsorption block 31 and act on the waste tin, reducing the space occupied. At the same time, the laser generator 11 irradiates the waste tin through the adsorption hole 3103, which can achieve simultaneous melting and adsorption of the waste tin, which is beneficial for timely removal of the molten waste tin, exposing the bottom of the waste tin for laser melting.

[0039] In one embodiment of this implementation, please refer to Figure 5 and Figure 6 , Figure 5 yes Figure 2 A schematic diagram of the vacuum generating mechanism 30 in the desoldering device 100 is shown. To ensure a negative pressure environment in the negative pressure chamber 3101 and to ensure that the laser can pass through the light-transmitting hole 3102, the vacuum generating mechanism 30 includes an optical lens 32. The optical lens 32 is located on the top side of the adsorption block 31 and seals the opening of the light-transmitting hole 3102. It can be understood that the optical lens 32 provides the conditions for light to pass through while also ensuring the sealing of the light-transmitting hole 3102.

[0040] Specifically, the optical lens 32 can be selected as a condenser lens to concentrate the laser beam.

[0041] In one embodiment of this implementation, please refer to Figure 5 and Figure 6 In order to improve the sealing performance of the light-transmitting hole 3102, the adsorption block 31 has a sealing groove 3105 surrounding the opening of the light-transmitting hole 3102. The vacuum generating mechanism 30 includes a sealing ring 33, which is disposed in the sealing groove 3105 and abuts against the optical lens 32.

[0042] Specifically, the sealing ring 33 is a rubber ring, and the sealing groove 3105 is an annular groove.

[0043] In one embodiment of this implementation, please refer to Figure 5 and Figure 6 To improve the sealing performance of the light-transmitting hole 3102, the vacuum generating mechanism 30 includes a pressure block 34, which is disposed on the adsorption block 31 and abuts against the side of the optical lens 32 facing away from the light-transmitting hole 3102. This arrangement allows the optical lens 32 to press firmly against the rubber ring, thereby improving the sealing performance.

[0044] Specifically, the pressure block 34 is fixed to the top side of the adsorption block 31 by screws and abuts against the side of the optical lens 32 facing away from the sealing ring 33, so that the optical lens 32 can better cooperate with the sealing ring 33 to seal the light passage 3102.

[0045] Specifically, the pressure block 34 has a through hole opposite to the light-transmitting hole 3102 so that the laser can pass through.

[0046] In one embodiment of this implementation, please refer to Figure 5 and Figure 6 To achieve the adsorption function of the adsorption hole 3103, the vacuum generating mechanism 30 includes a vacuum generator (not shown). The adsorption block 31 has a negative pressure hole 3104, which is connected to the periphery of the negative pressure chamber 3101. The vacuum generator is connected to the negative pressure hole 3104 and can provide negative pressure to the negative pressure chamber 3101 through the negative pressure hole 3104. It can be understood that placing the negative pressure hole 3104 on the periphery of the negative pressure chamber 3101 can avoid interference between the vacuum generator and the laser generator 11 and make full use of space.

[0047] In one embodiment of this implementation, please refer to Figure 1 and Figure 3 , Figure 3 yes Figure 2 A schematic diagram of the solder melting mechanism 10 in the solder removal device 100 is shown. The solder melting mechanism 10 includes a fourth driver 12, which is connected to a laser generator 11 and can drive the laser generator 11 to move axially along the adsorption hole 3103. With this configuration, the relative distance between the laser generator 11 and the waste solder can be adjusted by the fourth driver 12 so that the laser can be focused on the waste solder.

[0048] In one embodiment of this implementation, please refer to Figure 1 and Figure 3 The solder melting mechanism 10 includes a drive assembly 13, which is connected to a laser generator 11 and can drive the laser generator 11 to move radially along the adsorption hole 3103. With this configuration, the relative position of the laser generator 11 and the adsorption block 31 can be adjusted by the drive assembly 13 so that the laser can be aligned with the adsorption hole 3103 and irradiate the waste solder on the bottom side of the adsorption hole 3103.

[0049] Understandably, when dealing with waste solder formed by soldering solder balls of different diameters, it is necessary to use suction nozzles (bottom components of suction block 31) with different diameter suction holes 3103. The positions of the suction holes 3103 differ for different specifications of suction nozzles. After changing the suction nozzle, the relative position of the laser generator 11 and the suction block 31 can be adjusted by the drive component 13, so that the laser can pass through the suction hole 3103 of the new suction nozzle, thereby improving compatibility.

[0050] Specifically, the drive assembly 13 includes a fifth driver 131 and a sixth driver 132. The fifth driver 131 can drive the laser generator 11 to move along the fourth direction, and the sixth driver 132 can drive the laser generator 11 to move along the fifth direction. Both the fourth and fifth directions are perpendicular to the axial direction of the adsorption hole 3103.

[0051] Specifically, the axial direction of the adsorption hole 3103 and the laser emission direction of the laser generator 11 are both vertical, while the fourth and fifth directions are both horizontal and perpendicular to each other. In this embodiment, the fourth direction is parallel to the y-axis, the fifth direction is parallel to the x-axis, and the axial direction of the adsorption hole 3103 and the laser emission direction of the laser generator 11 are parallel to the z-axis.

[0052] Specifically, the fifth driver 131, the sixth driver 132, the fourth driver 12, and the laser generator 11 are connected in sequence. The fifth driver 131 can drive the sixth driver 132 to move the fourth driver 12 and the laser generator 11 along the y-axis. The sixth driver 132 can drive the fourth driver 12 to move the laser generator 11 along the x-axis. The fourth driver 12 can drive the laser generator 11 to move along the z-axis.

[0053] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A tin removal device, characterized in that, include: A solder melting mechanism includes a laser generator for emitting a laser beam onto scrap solder located on the soldering surface of a packaging substrate to melt the scrap solder. A solder scraping mechanism includes a scraper block and a drive module. The drive module is connected to the scraper block and can drive the scraper block to move along the soldering surface to separate the molten waste solder from the packaging substrate. A vacuum generating mechanism includes an adsorption block for removing the molten waste tin.

2. The detinning device according to claim 1, characterized in that, The drive module includes a first driver and a second driver. The first driver can drive the shovel block to move along a first direction, and the second driver can drive the shovel block to move along a second direction. The first direction and the second direction intersect and are both parallel to the welding surface.

3. The detinning device according to claim 1, characterized in that, The solder scraping mechanism includes a third driver connected to the scraper block and capable of driving the scraper block to move along a third direction intersecting the soldering surface.

4. The detinning device according to claim 1, characterized in that, The adsorption block has a negative pressure chamber, a light-transmitting hole, and an adsorption hole. The light-transmitting hole is connected to the top side of the negative pressure chamber, and the adsorption hole is connected to the bottom side of the negative pressure chamber. The laser generator is located on the top side of the adsorption block and is capable of emitting laser light that passes through the light-transmitting hole, the negative pressure chamber, and the adsorption hole in sequence.

5. The detinning device according to claim 4, characterized in that, The vacuum generating mechanism includes an optical lens, which is disposed on the top side of the adsorption block and closes the opening of the light-transmitting hole.

6. The detinning device according to claim 5, characterized in that, The adsorption block has a sealing groove with an opening surrounding the light-transmitting hole. The vacuum generating mechanism includes a sealing ring, which is disposed in the sealing groove and abuts against the optical lens.

7. The detinning device according to claim 5, characterized in that, The vacuum generating mechanism includes a pressure block, which is disposed on the adsorption block and abuts against the side of the optical lens facing away from the light-transmitting hole.

8. The detinning device according to claim 4, characterized in that, The vacuum generating mechanism includes a vacuum generator, the adsorption block has a negative pressure hole, the negative pressure hole is connected to the periphery of the negative pressure chamber, the vacuum generator is connected to the negative pressure hole, and can provide negative pressure to the negative pressure chamber through the negative pressure hole.

9. The detinning device according to claim 4, characterized in that, The solder melting mechanism includes a fourth driver connected to the laser generator and capable of driving the laser generator to move axially along the adsorption hole.

10. The detinning device according to claim 4, characterized in that, The solder melting mechanism includes a driving component connected to the laser generator and capable of driving the laser generator to move radially along the adsorption hole.

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