A semiconductor wafer coating device

Abstract

The application belongs to the technical field of semiconductor processing equipment, and particularly relates to a semiconductor wafer coating device, which comprises the following: a mounting seat, a coating cylinder fixedly arranged at the top of the mounting seat; a mounting cover, the bottom of the mounting cover movably sleeved with the top of the coating cylinder; a spraying device, the spraying device penetratingly and fixedly arranged in the middle of the mounting cover; a negative pressure mechanism, the negative pressure mechanism arranged at the bottom of the inner wall of the coating cylinder; a mounting plate, the mounting plate movably placed at the bottom of the inner wall of the coating cylinder; and a plurality of supporting rods, the bottoms of the supporting rods fixedly arranged at the top of the mounting plate. The air pressure difference generated when the inclined disc and the piston cover move up and down in the piston cylinder disappears with time, and the two check cylinders with the check function and the negative pressure cylinder are matched to ensure that the negative pressure state of the inside of the negative pressure cylinder is always maintained, so that the suction disc is always adsorbed at the bottom of the wafer, and the application has the advantages of high adsorption stability and stable wafer fixation.

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