A thermoelectric coupling fluid circulation temperature control assembly and refrigeration system

Abstract

The application discloses a thermoelectric coupling fluid circulation temperature control assembly and a refrigerating system, and relates to the technical field of refrigeration. The assembly comprises a fluid conduit part and a thermoelectric conversion module. The fluid conduit part sequentially forms a fluid inlet, a first heat exchange section, a load connection loop section, a second heat exchange section and a fluid outlet along a fluid flow direction. The thermoelectric conversion module is clamped between the first and second heat exchange sections, the cold end surface of the thermoelectric conversion module cools the fluid flowing through the first heat exchange section, and the hot end surface of the thermoelectric conversion module is cooled by the fluid flowing back to the second heat exchange section through the load connection loop section. The application utilizes the cold energy recovery of fluid circulation to cool the hot end of the thermoelectric module, and utilizes the cold end of the thermoelectric module to supercool or precool the fluid, so that the heat energy management of self-cooling by using backflow cold energy is realized, the assembly can be efficiently operated without external fans, and the assembly has the advantages of compact structure, high energy efficiency, silence and the like.

Description

Technical Field

[0001] This invention belongs to the field of refrigeration and thermal management technology, specifically relating to a thermoelectric coupling fluid circulation temperature control component that uses a fluid circulation loop to perform dual-sided thermal management of a thermoelectric conversion module, and a refrigeration system including the component. Background Technology

[0002] Thermoelectric cooling (TEC), also known as semiconductor refrigeration, utilizes the Peltier effect to transfer heat. Compared to traditional vapor compression refrigeration, TEC has advantages such as no moving parts, no noise, small size, and precise temperature control.

[0003] However, existing thermoelectric cooling technologies face the challenge of low coefficient of performance (COP). The cooling efficiency of a thermoelectric cooling chip primarily depends on the temperature difference between its cold and hot ends. The greater the temperature difference, the lower the cooling efficiency. In traditional applications, as shown in Chinese patents CN104329871A or CN103591730A, air-cooled heat sinks or separate heat pipes are typically used to dissipate the heat generated at the hot end into the environment. This approach has significant drawbacks:

[0004] 1. Limited heat dissipation: In order to maintain a low hot end temperature, bulky heat sinks and fans are often required, which not only negates the advantage of TEC's small size, but also introduces noise and mechanical failure risks.

[0005] 2. Energy waste: In systems that combine vapor compression and TEC, the subcooling potential of the working fluid and the cooling capacity of the low-temperature return gas are often not coupled and utilized, resulting in low overall thermodynamic efficiency of the system.

[0006] 3. Complex structure: The heat transfer paths of the cold end and the hot end are usually physically isolated, which leads to complex assembly and problems such as condensation or low heat transfer efficiency.

[0007] 4. Heat transfer interface challenges: The combination of traditional TEC with heat sinks and cold plates requires the connection through interface materials such as thermal grease. The thermal resistance of this interface not only reduces the overall heat transfer efficiency, but also poses a risk of aging and drying failure of the interface material during long-term hot and cold cycles, affecting the long-term stability and reliability of the system.

[0008] Therefore, there is an urgent need for a new type of temperature control component that can efficiently utilize the temperature change characteristics of fluid circulation itself to achieve coordinated thermal management of the hot and cold ends of TEC, and that is compact in structure and more energy efficient. Summary of the Invention

[0009] To address the problems of bulky hot-end heat dissipation structures, low system thermodynamic efficiency, and fragmented thermal management at the hot and cold ends in existing thermoelectric refrigeration components, this invention provides a thermoelectric coupled fluid circulation temperature control component and refrigeration system. This invention utilizes a unique flow channel design to leverage the different states of the same working fluid during circulation, separately utilizing subcooling and hot-end cooling of the thermoelectric cooling system (TEC), thereby significantly improving refrigeration efficiency and simplifying the system structure.

[0010] To address the aforementioned technical problems, in a first aspect, the present invention provides a thermoelectrically coupled fluid circulation temperature control component, comprising:

[0011] A fluid conduit section, which internally defines a continuous flow channel for accommodating fluid flow; the fluid conduit section extends along the fluid flow direction and sequentially defines: a fluid inlet, a first heat exchange section, a load connection circuit section, a second heat exchange section, and a fluid outlet;

[0012] A thermoelectric conversion module is disposed between the first heat exchange section and the second heat exchange section; the thermoelectric conversion module has a first temperature control surface (i.e., cold end surface) and a second temperature control surface (i.e., hot end surface) disposed opposite to each other, and the thermoelectric conversion module is configured to generate a cooling effect on the first temperature control surface and a heating effect on the second temperature control surface after being powered on;

[0013] The first heat exchange section is thermally coupled to the first temperature control surface, so that the fluid entering from the fluid inlet is cooled by the first temperature control surface when passing through the first heat exchange section (e.g., to achieve subcooling).

[0014] The second heat exchange section is thermally coupled to the second temperature control surface, so that the fluid flowing back through the load connection circuit section absorbs the heat from the second temperature control surface when passing through the second heat exchange section (achieving heat dissipation at the hot end).

[0015] Through the above-described scheme, this invention creatively embeds the TEC (Thermal Design Equipment) into the fluid circulation loop, utilizing the fluid before cooling to absorb the cold energy of the TEC's cold end (increasing the fluid's subcooling), and using the return fluid after work (but still at a temperature lower than the TEC's hot end) to cool the TEC's hot end. This "self-cascading" thermal management greatly reduces the temperature of the TEC's hot end, improves the TEC's COP (Coefficient of Performance), and eliminates the need for an external fan.

[0016] In a preferred embodiment of the present invention, the flow cross-sectional area of ​​the fluid conduit in the first heat exchange section is less than or equal to its flow cross-sectional area in the second heat exchange section. This design allows for adaptation to the throttling requirements of the refrigeration system, enabling the first heat exchange section to function as a throttling or pre-throttling zone for high-pressure liquids, while the second heat exchange section serves as a low-resistance channel for low-pressure gaseous states, conforming to the thermodynamic characteristics of phase change refrigeration.

[0017] In a preferred embodiment of the present invention, the flow channel in the first heat exchange section is configured as a throttling channel, and its hydraulic diameter is smaller than that of the flow channel in the second heat exchange section; alternatively, the inner wall of the flow channel in the first heat exchange section is provided with a micro-turbulence structure for increasing fluid flow resistance. This feature further enhances the heat exchange capacity and flow resistance effect of the first heat exchange section, which is helpful for refrigerant phase change control.

[0018] In a preferred embodiment of the present invention, a thermally conductive buffer adapter assembly is further included, disposed between the thermoelectric conversion module and the fluid conduit section; the thermally conductive buffer adapter assembly includes: a first adapter disposed between the first heat exchange section and the first temperature control surface; and a second adapter disposed between the second heat exchange section and the second temperature control surface. The thermally conductive buffer adapter assembly (such as an aluminum or copper block) not only serves to buffer and equalize the temperature, but also provides a reliable mechanical connection interface between the flat tube and the flat TEC surface.

[0019] In a preferred embodiment of the present invention, the thermally conductive buffer adapter component is provided with a cantilever portion extending beyond the projection range of the thermoelectric conversion module. The cantilever portion is locked with fasteners to press and fix the thermoelectric conversion module. This cantilever locking structure avoids applying perforation stress directly to the TEC body, ensuring the structural safety of the brittle semiconductor ceramic sheet, while providing uniform contact pressure and reducing contact thermal resistance.

[0020] In a preferred embodiment of the present invention, the fluid conduit is an integrally extruded porous flat tube; an insulating filler layer is further provided between the first heat exchange section and the second heat exchange section. The porous flat tube has extremely high pressure resistance and heat exchange efficiency; the insulating filler layer (such as foamed material) effectively blocks the "thermal short circuit" between the hot and cold ends, ensuring the efficiency of unidirectional heat flow.

[0021] To solve the above-mentioned technical problems, in a second aspect, the present invention provides a refrigeration system, including the thermoelectric coupling fluid circulation temperature control component described in the first aspect, and further including an energy storage unit; the load connection loop section of the fluid conduit section is thermally coupled to the energy storage unit to form the heat absorption evaporation end of the refrigeration system, the energy storage unit absorbs and stores the cold energy from the loop connection section; the fluid conduit section is filled with a working fluid.

[0022] In a preferred embodiment of the present invention, the working fluid is a phase change refrigerant; the first heat exchange section is configured as a throttling subcooling zone of the refrigeration system, wherein the fluid is in a high-pressure liquid state or a gas-liquid mixture state; the second heat exchange section is configured as a return gas heat dissipation zone of the refrigeration system, wherein the fluid is in a low-pressure gas state or a gas-liquid mixture state. In this system, the TEC essentially plays a dual role as an enhanced subcooler and a suction pipe regenerator, significantly improving the energy efficiency ratio of the entire thermodynamic cycle.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. Significantly improved energy efficiency: By using a reflux low-temperature working fluid to cool the hot end of the TEC, the temperature of the hot end is greatly reduced compared to traditional air cooling, allowing the TEC to operate in a more efficient temperature difference range; at the same time, the cold end of the TEC subcools the working fluid, increasing the heat absorption potential of the working fluid in the evaporation section.

[0025] 2. Highly compact structure: The bulky heat sink and fan are eliminated, and the thermal management function is integrated into the fluid pipe itself, which greatly saves system space.

[0026] 3. Easy and reliable installation: The use of thermally conductive buffer adapter components and cantilever clamping structure not only solves the problem of flat tube and TEC plane fitting, but also ensures long-term stability through mechanical locking, avoiding the aging and falling off problems that may occur with simple adhesive.

[0027] 4. Quiet operation: By removing the fan, the main source of noise is eliminated, making it particularly suitable for bedroom refrigerators or precision instrument cooling scenarios where extremely quiet operation is required. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments disclosed in this invention, the accompanying drawings of the embodiments will be briefly described below. These drawings are for illustrative purposes only and are not intended to limit the scope of protection of this invention.

[0029] Figure 1 This is a cross-sectional structural schematic diagram of a thermoelectric coupled fluid circulation temperature control component according to an embodiment of the present invention.

[0030] Figure 2 yes Figure 1 The side view of the temperature control component shown illustrates the bent loop structure of the fluid conduit section.

[0031] Figure 3 This is a schematic diagram of a structure with a thermally conductive buffer adapter (aluminum plate) according to an embodiment of the present invention.

[0032] Figure 4 This is a schematic diagram of an assembly structure with fasteners and a cantilever, according to a preferred embodiment of the present invention.

[0033] Figure 5 yes Figure 4 Side view of the embodiment shown.

[0034] Figure 6 This is a schematic diagram of the first embodiment of the refrigeration system of the present invention applied to an energy storage tank.

[0035] Figure 7This is a schematic diagram of a second embodiment of the refrigeration system of the present invention applied to an energy storage tank.

[0036] In the diagram: 10. Fluid conduit section; 11. Fluid inlet; 12. First heat exchange section; 13. Load connection circuit section; 14. Second heat exchange section; 15. Fluid outlet;

[0037] 20. Thermoelectric conversion module (TEC); 21. First temperature control surface (cold end); 22. Second temperature control surface (hot end); 23. Semiconductor cooling unit;

[0038] 30. Thermally conductive buffer adapter assembly; 31. First adapter (aluminum plate); 32. Second adapter (aluminum plate); 33. Cantilever section;

[0039] 40. Fasteners;

[0040] 50. Thermal insulation filling layer (thermal insulation layer);

[0041] 60. Energy storage unit (energy storage tank); 61. Energy storage liquid. Detailed Implementation

[0042] The technical solutions (including preferred technical solutions) of the present invention will be further described in detail below with reference to the accompanying drawings and by way of listing some optional embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0043] Example 1

[0044] like Figure 1 and Figure 2 As shown, this embodiment provides a thermoelectric coupled fluid circulation temperature control component, which mainly consists of a fluid conduit section 10 and a thermoelectric conversion module 20.

[0045] The fluid conduit section 10 is constructed as a continuous pipe structure with interconnected fluid channels inside. Preferably, the fluid conduit section 10 is made of a high thermal conductivity material with good thermal conductivity, such as, but not limited to, aluminum, copper and their alloys, or non-metallic materials such as graphite and ceramic matrix composites with high thermal conductivity, and is an integrally extruded porous flat tube structure (e.g., Figure 1 (As shown in the cross-section). The fluid conduit section 10 extends sequentially along the fluid flow direction and defines the following functional sections:

[0046] Fluid inlet 11: Located at the beginning of the flow path, used to introduce the initial working fluid. For example, it is used to connect to an upstream pipeline (such as a condenser outlet).

[0047] First heat exchange section 12: Located downstream of fluid inlet 11, it is the heat exchange area through which the fluid first passes.

[0048] Load connection loop section 13: A pipe connected between the first heat exchange section 12 and the second heat exchange section 14, and constructed as a curved pipe, coil structure or fin structure extending to the outside of the thermoelectric conversion module 20, used to connect or form a heat exchange unit for external heat load.

[0049] The second heat exchange section 14 is located downstream of the load connection circuit section 13 and is arranged in parallel with the first heat exchange section 12 in space.

[0050] Fluid outlet 15: Located at the end of the flow path, used to discharge the fluid after heat exchange. For example, it is used to connect to downstream pipelines (such as the compressor suction port).

[0051] The thermoelectric conversion module 20 is disposed between the first heat exchange section 12 and the second heat exchange section 14. The thermoelectric conversion module 20 includes one or more semiconductor cooling units 23 arranged at intervals along the fluid flow direction. The module has a first temperature control surface 21 (i.e., cold end surface) disposed opposite to each other, which is the cold end of the semiconductor cooling unit 23 in this embodiment, and a second temperature control surface 22 (i.e., hot end surface), which is the hot end of the semiconductor cooling unit 23 in this embodiment.

[0052] The specific assembly and thermal coupling relationships are as follows:

[0053] The first heat exchange section 12 is thermally coupled to the first temperature control surface 21. When the fluid enters from the fluid inlet 11 and flows through the first heat exchange section 12, it is cooled by the cooling effect generated by the first temperature control surface 21 (e.g., increasing the subcooling).

[0054] The second heat exchange section 14 is thermally coupled to the second temperature control surface 22. When the fluid absorbs heat through the load connection circuit section 13 and flows back, it absorbs the heat generated by the second temperature control surface 22 as a cooling medium when flowing through the second heat exchange section 14, and then is discharged from the fluid outlet 15.

[0055] Through the above structure, this embodiment constructs a fluid thermal management loop that uses reflux cooling energy for self-cooling, cleverly utilizing reflux fluid to cool the hot end of the thermoelectric conversion module 20, eliminating the need for a traditional air-cooled radiator.

[0056] To facilitate understanding, a core concept of this invention will first be explained. The "self-cascade" thermal management mentioned throughout this specification refers to an architecture that utilizes a single, continuous fluid circulation loop to collaboratively manage the cold and hot ends of a thermoelectric conversion module (TEC) within the loop, based on the thermodynamic states at different locations along the circulation path. Specifically, this involves pre-cooling or subcooling the cold end of the TEC using a low-temperature fluid before it enters the load, and then using the return fluid, which has risen slightly but remains relatively cool after load heat exchange, to dissipate heat from the hot end of the TEC. This cascaded utilization and self-supporting mode of heat within a single loop is referred to as "self-cascade" in this invention, and it differs fundamentally from traditional cascade refrigeration systems with multiple independent refrigerant loops in both structure and principle.

[0057] Example 2

[0058] like Figure 3 and Figure 5 As shown, this embodiment is an optimization based on embodiment 1, addressing the potential microscopic unevenness on the surface of the flat tube.

[0059] The component includes a thermally conductive buffer adapter component 30, specifically comprising a first adapter 31 and a second adapter 32. These two adapters are typically metal blocks with excellent thermal conductivity (such as aluminum or copper blocks).

[0060] The first adapter 31 is disposed between the first heat exchange section 12 and the cold end face 21; the second adapter 32 is disposed between the second heat exchange section 14 and the hot end face 22.

[0061] Connection process optimization:

[0062] To ensure optimal heat transfer efficiency, the adapter and the fluid conduit 10 are not simply crimped together, but preferably brazed.

[0063] It is worth noting that process grooves (not shown in the figure, but present in actual manufacturing, such as micro-grooves or grid patterns opened along the edge of the mating surface of the adapters) are provided on the mating surfaces of the first adapter 31 and the second adapter 32 and the fluid conduit portion 10. These process grooves are used to contain molten solder during the brazing process or to contain overflowing adhesive when using thermally conductive adhesive to prevent it from flowing onto the TEC surface and affecting performance.

[0064] Furthermore, the ceramic surface of the thermoelectric conversion module 20 and the surface of the adapter are preferably bonded together by low-temperature solder or a nano-silver sintered layer. This rigid connection has lower thermal resistance and higher reliability than thermal grease, preventing displacement of the TEC during long-term thermal expansion and contraction.

[0065] Example 3

[0066] like Figure 4 As shown, this embodiment further considers the mechanical strength and thermal insulation performance of the components.

[0067] Based on Embodiment 2, the thermally conductive buffer adapter component 30 in this embodiment is designed to be wider than the thermoelectric conversion module 20, thereby forming an outwardly extending cantilever portion 33.

[0068] The assembly also includes fasteners 40 (such as bolt and nut assemblies). The fasteners 40 pass through the cantilever portions 33 of the upper and lower adapters, and by tightening the nuts, the thermoelectric conversion module 20 sandwiched in the middle is pressed together using the lever principle.

[0069] The advantages of this design are:

[0070] 1. Protect TEC: The fastening force acts on the metal cantilever, rather than directly through the brittle semiconductor ceramic sheet, avoiding stress concentration that could lead to breakage.

[0071] 2. Uniform pressure: The metal plate has a certain degree of elasticity, which can convert the point pressure of the bolt into surface pressure, ensuring close contact between the TEC and the fittings.

[0072] Furthermore, to prevent direct heat transfer (i.e., "regenerative heat loss") between the first heat exchange section 12 (cold) and the second heat exchange section 14 (hot), an insulating filler layer 50 is filled in the gap between them, particularly in the area surrounding the thermoelectric conversion module 20. This filler layer can be polyurethane foam, thermal insulation cotton, or aerogel, effectively blocking bypass heat conduction and forcing heat to be transferred through the TEC.

[0073] Of course, an insulating filling layer can also be provided between the first heat exchange section 12 (cold) and the second heat exchange section 14 (hot) in embodiments 1 and 2.

[0074] Example 4

[0075] like Figure 6 and Figure 7 As shown in the figure, this embodiment demonstrates the specific application of the above-mentioned thermoelectric coupled fluid circulation temperature control component in a refrigeration system.

[0076] The system includes the thermoelectric coupling fluid circulation temperature control component and the energy storage unit 60 as described in any of the above embodiments.

[0077] The loop connection section 13 of the fluid conduit section 10 is immersed in the energy storage liquid 61 of the energy storage section 60, forming the evaporator of the system.

[0078] Working fluid and circulation process:

[0079] The system is filled with a working fluid, preferably a phase change refrigerant (such as R600a).

[0080] 1. Throttling and Subcooling Stage: The refrigerant enters the first heat exchange section 12 from the fluid inlet 11. At this time, the refrigerant is in a high-pressure liquid state or a gas-liquid mixture state. To meet the throttling requirements of the system, the fluid channel in the first heat exchange section 12 is configured as a throttling channel. For example, its hydraulic diameter is designed to be smaller than that of the second heat exchange section 14, or it has a micro-turbulence structure inside to increase flow resistance. During this process, the TEC cold end face 21 strongly cools it, increasing its subcooling degree. Preferably, the micro-turbulence structure can be micro-toothed, finned, or a rough structure with an uneven inner wall provided on the inner side of the pipe wall.

[0081] 2. Heat absorption and evaporation stage: The subcooled refrigerant enters the load connection circuit section 13, absorbs heat and evaporates in the energy storage section 60, and becomes a low-pressure gaseous state, while cooling the energy storage liquid 61.

[0082] 3. Return Gas Heat Dissipation Stage: The gaseous refrigerant flows back to the second heat exchange section 14. At this time, although the refrigerant temperature is higher than the evaporation temperature, it is lower than the temperature of the TEC hot end face 22. Therefore, the refrigerant efficiently absorbs heat from the TEC hot end here. Due to the large cross-sectional area of ​​the flow channel in the second heat exchange section 14, smooth flow of low-pressure gas is ensured, reducing return gas resistance.

[0083] It should be noted that the working fluid of this invention is not limited to phase change refrigerants. In other application scenarios, the working fluid can also be a single-phase refrigerant, such as an aqueous solution of ethylene glycol, deionized water, or a specific heat transfer oil. In this case, the first heat exchange section pre-cools or deeply cools the single-phase refrigerant. After being loaded (e.g., dissipating heat from a heat-generating chip), the fluid temperature rises but remains below the TEC hot-end temperature, at which point it flows back to the second heat exchange section to cool the TEC hot end. The self-cascading thermal management architecture of this invention is also applicable and offers significant advantages in energy efficiency and structural simplification.

[0084] Figure 6 A solution for directly combining TEC with a flat tube (corresponding to Example 1) is shown, which has a simple structure and is suitable for low-cost applications.

[0085] Figure 7 The solution using an aluminum plate (adapter) as a transition is demonstrated (corresponding to embodiments 2 and 3), which is suitable for scenarios with higher requirements for reliability and thermal stability.

[0086] By combining the above embodiments, the present invention achieves a highly efficient, quiet and compact refrigeration system.

[0087] It will be readily understood by those skilled in the art that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, combinations, substitutions, improvements, etc., made under the spirit and principles of the present invention are included within the protection scope of the present invention.

Claims

1. A thermoelectrically coupled fluid circulation temperature control component, characterized in that, include: A fluid conduit section, which internally defines a continuous flow channel for accommodating fluid flow; the fluid conduit section extends along the fluid flow direction and sequentially forms: a fluid inlet, a first heat exchange section, a load connection circuit section, a second heat exchange section, and a fluid outlet; A thermoelectric conversion module is disposed between the first heat exchange section and the second heat exchange section; the thermoelectric conversion module has a first temperature control surface and a second temperature control surface disposed opposite to each other, and the thermoelectric conversion module is configured to generate a cooling effect on the first temperature control surface and a heating effect on the second temperature control surface after being powered on; The first heat exchange section is thermally coupled to the first temperature control surface and is configured to use the cooling effect of the first temperature control surface to cool the fluid flowing through the first heat exchange section. The second heat exchange section is thermally coupled to the second temperature control surface and is configured to absorb the heat generated by the second temperature control surface using the fluid flowing through the second heat exchange section.

2. The thermoelectrically coupled fluid circulation temperature control component according to claim 1, characterized in that, The fluid conduit section is constructed as an integrally formed or welded pipe structure. The flow cross-sectional area of ​​the fluid conduit in the first heat exchange section is less than or equal to its flow cross-sectional area in the second heat exchange section, so that the flow velocity or flow resistance of the fluid in the first heat exchange section is higher than that in the second heat exchange section.

3. The thermoelectrically coupled fluid circulation temperature control component according to claim 2, characterized in that, The flow channel in the first heat exchange section is configured as a throttling channel, and its hydraulic diameter is smaller than that of the flow channel in the second heat exchange section; or, the inner wall of the flow channel in the first heat exchange section is provided with a micro-turbulence structure to increase fluid flow resistance.

4. The thermoelectrically coupled fluid circulation temperature control assembly according to claim 1, characterized in that, The fluid conduit is a porous flat tube, the first heat exchange section and the second heat exchange section are arranged in parallel stacks, and the thermoelectric conversion module is sandwiched between the first heat exchange section and the second heat exchange section.

5. The thermoelectrically coupled fluid circulation temperature control assembly according to any one of claims 1 to 4, characterized in that, It also includes a thermally conductive buffer adapter component, which is disposed between the thermoelectric conversion module and the fluid conduit section; The thermally conductive buffer adapter component includes: The first adapter is fitted between the first heat exchange section and the first temperature control surface; The second adapter is fitted between the second heat exchange section and the second temperature control surface.

6. The thermoelectrically coupled fluid circulation temperature control assembly according to claim 5, characterized in that, The thermally conductive buffer adapter component is also provided with a cantilever portion, which extends outward from the projection area of ​​the thermoelectric conversion module; The temperature control component also includes a fastener that passes through the cantilever portion to lock the first adapter and the second adapter, thereby pressing and fixing the thermoelectric conversion module between the first adapter and the second adapter.

7. The thermoelectrically coupled fluid circulation temperature control assembly according to claim 5, characterized in that, The first adapter and the first heat exchange section, and the second adapter and the second heat exchange section are fixedly connected by a brazing layer, a thermally conductive structural adhesive layer, or a nano-silver sintered layer.

8. The thermoelectrically coupled fluid circulation temperature control assembly according to claim 7, characterized in that, The first and second adapters have process grooves on their mating surfaces with the fluid conduit portion to accommodate overflowing solder or glue.

9. The thermoelectrically coupled fluid circulation temperature control assembly according to claim 1, characterized in that, It also includes a heat insulation filling layer, which fills the gap between the first heat exchange section and the second heat exchange section and covers the periphery of the thermoelectric conversion module to block heat conduction between the first heat exchange section and the second heat exchange section except through the thermoelectric conversion module.

10. The thermoelectrically coupled fluid circulation temperature control assembly according to claim 1, characterized in that, The load connection loop section is constructed as a curved pipe, coil structure, or finned tube structure extending to the outside of the thermoelectric conversion module, for heat exchange with the external heat load.

11. The thermoelectrically coupled fluid circulation temperature control assembly according to claim 1, characterized in that, The thermoelectric conversion module includes multiple semiconductor cooling units arranged at intervals along the fluid flow direction, which are electrically connected and operate in a controlled manner.

12. A refrigeration system, characterized in that, The thermoelectrically coupled fluid circulation temperature control assembly as described in any one of claims 1 to 11 further includes an energy storage unit; The load connection circuit section of the fluid conduit is thermally coupled to the energy storage section, forming the heat absorption and evaporation end of the refrigeration system. The fluid conduit is filled with working fluid, which is configured to circulate along the following path: it enters from the fluid inlet, is subcooled in the first heat exchange section, then enters the load connection loop section to absorb the heat of the energy storage section, and finally returns to the second heat exchange section via the load connection loop section to cool the second temperature control surface of the thermoelectric conversion module before flowing out from the fluid outlet.

13. The refrigeration system according to claim 12, characterized in that, The working fluid is a phase change refrigerant; The first heat exchange section is configured as a throttling subcooling zone of the refrigeration system, wherein the phase change refrigerant is in a high-pressure liquid state or a gas-liquid mixture state. The second heat exchange section is configured as the return gas heat dissipation zone of the refrigeration system, in which the phase change refrigerant is in a low-pressure gaseous state or a gas-liquid mixture state.

14. The refrigeration system according to claim 12, characterized in that, The initial temperature range of the working fluid at the fluid inlet is -3°C to 8°C.

15. The refrigeration system according to claim 12, characterized in that, The working fluid has a temperature range of -15°C to 10°C within the load connection circuit section.

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