An inductive sensor

Abstract

The application discloses an inductive sensor, comprising: an integrated chip, an oscillation circuit, an output circuit, a power signal end, a ground end and a signal output end; the integrated chip is electrically connected with the oscillation circuit, the output circuit, the power signal end and the ground end; the integrated chip is used for receiving a calibration signal through the power signal end during calibration and receiving a power signal through the power signal end during signal detection; the oscillation circuit is used for generating an alternating magnetic field signal during signal detection; the integrated chip is further used for controlling an output signal output by the output circuit according to the alternating magnetic field signal during signal detection; the output circuit is electrically connected with the signal output end; and the output circuit is used for controlling a detection signal output by the signal output end according to the output signal. The technical scheme of the application can simplify the hardware structure and volume of the inductive sensor and reduce the cost.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and more particularly to an inductive sensor. Background Technology

[0002] Inductive sensors are non-contact detection devices based on the principle of electromagnetic induction. They generate an alternating magnetic field through an internal oscillation circuit to sense the approach and positional changes of metal objects. They are widely used in industrial automation, equipment limit detection, and other scenarios, and can realize the identification and displacement measurement of metal targets. They have advantages such as fast response, high reliability, and strong anti-interference ability.

[0003] In existing technologies, inductive sensors generally adopt a wiring architecture that separates power supply lines and calibration communication lines, which results in redundant wiring and cumbersome wiring. Furthermore, parameter calibration requires the addition of a dedicated communication chip, which increases hardware costs, occupies internal installation space, and leads to the large size of inductive sensors, which is not conducive to miniaturization and integrated design. Summary of the Invention

[0004] This invention provides an inductive sensor that simplifies the hardware structure and size of inductive sensors and reduces costs.

[0005] This invention provides an inductive sensor, comprising: an integrated chip, an oscillation circuit, an output circuit, a power signal terminal, a ground terminal, and a signal output terminal; The integrated chip is electrically connected to the oscillation circuit, the output circuit, the power signal terminal, and the ground terminal, respectively; the integrated chip is used to receive a calibration signal through the power signal terminal during calibration and to receive a power signal through the power signal terminal during signal detection. The oscillation circuit is used to generate an alternating magnetic field signal during signal detection; The integrated chip is also used to control the output signal output by the output circuit according to the alternating magnetic field signal during signal detection; The output circuit is electrically connected to the signal output terminal; the output circuit is used to control the detection signal output by the signal output terminal according to the output signal.

[0006] Optionally, the integrated chip includes a controller, an OTP memory, an oscillator, a demodulator, a threshold switch unit, and an output unit; The controller is connected to the power signal terminal, the OTP memory, the threshold switch unit, and the output unit respectively. The controller is used to receive the calibration signal through the power signal terminal during calibration and control the calibration signal to be stored in the OTP memory, and to receive the power signal through the power signal terminal during signal detection to control the integrated chip to power on and run, and to control the threshold signal of the threshold switch unit according to the signal stored in the OTP memory. The oscillator is connected to both the oscillation circuit and the demodulator; the oscillator is used to output an oscillation detection signal to the demodulator based on the alternating magnetic field signal generated by the oscillation circuit. The demodulator is also connected to the threshold switch unit; the demodulator is used to modulate and demodulate the oscillation detection signal and output a modulated signal to the threshold switch unit. The threshold switch unit is electrically connected to the output circuit through the output unit; the threshold switch unit is used to control the output signal provided by the output unit to the output circuit according to the modulation signal and the threshold signal.

[0007] Optionally, the controller is also configured to control the calibration path in the OTP memory to be in a fuse-off state when calibration is completed.

[0008] Optionally, the demodulator includes a signal shaping module; the signal shaping module is used to shape the oscillation detection signal into the DC modulation signal.

[0009] Optionally, the integrated chip further includes an overcurrent detection unit, which is electrically connected to the signal output terminal and the output unit respectively; the overcurrent detection unit is used to control the working state of the output unit according to the detection signal output by the signal output terminal.

[0010] Optionally, the overcurrent detection unit is further configured to time the stop time of the output unit when controlling the output unit to stop outputting the output signal, and to control the output unit to continue outputting the output signal when the stop time reaches a preset time.

[0011] Optionally, the integrated chip further includes a voltage regulator unit; the voltage regulator unit is connected to the controller; the voltage regulator unit is used to provide a regulated signal to the controller.

[0012] Optionally, the inductive sensor further includes: a voltage regulator circuit; the voltage regulator unit is electrically connected to the ground terminal through the voltage regulator circuit; the voltage regulator circuit is used to control the voltage regulator signal provided by the voltage regulator unit.

[0013] Optionally, the oscillation circuit includes a first inductor and a first capacitor; The first inductor is electrically connected between the integrated chip and the ground terminal; The first capacitor is electrically connected between the integrated chip and the ground terminal.

[0014] Optionally, the output circuit includes a first transistor and a sampling resistor; The control terminal of the first transistor is electrically connected to the integrated chip, the first terminal of the first transistor is electrically connected to the signal output terminal, and the second terminal of the first transistor is electrically connected to the ground terminal through the sampling resistor.

[0015] The technical solution of this invention allows the integrated chip to receive calibration signals through a power signal terminal to complete parameter calibration, and also to receive power signals through the power signal terminal to power the integrated chip. After the integrated chip is powered on, the oscillation circuit can generate an alternating magnetic field signal. When metal approaches the inductive sensor, the alternating magnetic field signal attenuates, and the integrated chip outputs a detection signal through the signal output terminal to realize the identification and displacement measurement of the metal target. The power signal terminal simultaneously realizes power supply and calibration communication functions, which can simplify the hardware structure and size of the inductive sensor and reduce costs. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of an inductive sensor provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of an integrated chip provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of a signal shaping module provided in an embodiment of the present invention; Figure 4 This is a voltage timing diagram of the signal shaping module provided in an embodiment of the present invention. Detailed Implementation

[0017] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0018] The terminology used in the embodiments of this invention is for the purpose of describing specific embodiments only and is not intended to limit the invention. It should be noted that directional terms such as "upper," "lower," "left," and "right" described in the embodiments of this invention are used to describe the angles shown in the accompanying drawings and should not be construed as limiting the embodiments of this invention. Furthermore, in the context, it should be understood that when referring to an element being formed "on" or "below" another element, it can be formed not only directly on or below the other element, but also indirectly on or below it through intermediate elements. The terms "first," "second," etc., are used for descriptive purposes only and do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0019] The term "comprising" and its variations as used in this invention are open-ended, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment".

[0020] It should be noted that the concepts of "first" and "second" mentioned in this invention are only used to distinguish the corresponding contents and are not used to limit the order or interdependence.

[0021] It should be noted that the terms "a" and "a plurality of" used in this invention are illustrative rather than restrictive. Those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0022] Figure 1 This is a schematic diagram of the structure of an inductive sensor provided in an embodiment of the present invention, as shown below. Figure 1 As shown, the inductive sensor includes an integrated chip 10, an oscillation circuit 20, an output circuit 30, a power signal terminal BN, a ground terminal BU, and a signal output terminal BK. The integrated chip 10 is electrically connected to the oscillation circuit 20, the output circuit 30, the power signal terminal BN, and the ground terminal BU, respectively. The integrated chip 10 is used to receive a calibration signal through the power signal terminal BN during calibration and to receive a power signal through the power signal terminal BN during signal detection. The oscillation circuit 20 is used to generate an alternating magnetic field signal during signal detection. The integrated chip 10 is also used to control the output signal output by the output circuit 30 according to the alternating magnetic field signal during signal detection. The output circuit 30 is electrically connected to the signal output terminal BK. The output circuit 30 is used to control the detection signal output by the signal output terminal BK according to the output signal.

[0023] Integrated chip 10 is connected to oscillation circuit 20 via LC pin, to power signal terminal BN via VCC pin, to output circuit 30 via CO and SO pins, and to ground terminal BU via GND and RS pins. The TST pin of integrated chip 10 is used as a test pin and is left floating. When integrated chip 10 is powered on, oscillation circuit 20 oscillates under its drive, generating an alternating magnetic field signal. When metal approaches the inductive sensor, the amplitude of the alternating magnetic field signal generated by oscillation circuit 20 attenuates. When the alternating magnetic field signal changes, integrated chip 10 can control the output signal of output circuit 30 according to the alternating magnetic field signal, controlling the detection signal output from signal output terminal BK. Signal output terminal BK can be connected to external devices such as a host computer or PLC to achieve metal target identification and displacement measurement.

[0024] The integrated chip 10 can receive calibration signals through the power signal terminal BN during calibration and power signals through the power signal terminal BN during signal detection. When calibrating the integrated chip 10, the power signal terminal BN can serve as a communication port for a power carrier, connecting the power signal terminal BN of the integrated chip 10 to a calibration fixture. The calibration fixture can then transmit calibration data to the integrated chip 10 via a communication protocol to calibrate the parameters of the inductive sensor. For example, the parameters of the inductive sensor may include distance value, hysteresis value, coarse and fine adjustment, response time, output mode, fuse bit, and check bit. For example, the communication protocol can be a 0-code high level time of 2μs, a 0-code low level time of 6μs, a 1-code high level time of 3μs, and a 1-code low level time of 1.5μs. The communication protocol can be set according to actual needs, and this embodiment of the invention does not limit this. When using the inductive sensor for signal detection, the power signal terminal BN can receive power signals to power the integrated chip 10, the oscillation circuit 20, and the output circuit 30.

[0025] The integrated chip in this embodiment can receive calibration signals through the power signal terminal to complete parameter calibration, and can also receive power signals through the power signal terminal to power the integrated chip. After the integrated chip is powered on, the oscillation circuit can generate an alternating magnetic field signal. When metal approaches the inductive sensor, the alternating magnetic field signal attenuates, and the integrated chip outputs a detection signal through the signal output terminal to realize the identification of metal targets and displacement measurement. The power signal terminal simultaneously realizes power supply and calibration communication functions, which can simplify the hardware structure and size of the inductive sensor and reduce costs.

[0026] Optional, Figure 2 This is a schematic diagram of the structure of an integrated chip provided in an embodiment of the present invention, such as... Figure 2As shown, the integrated chip 10 includes a controller 11, an OTP memory 12, an oscillator 13, a demodulator 14, a threshold switch unit 15, and an output unit 16. The controller 11 is connected to the power signal terminal BN, the OTP memory 12, the threshold switch unit 15, and the output unit 16. The controller 11 is used to receive a calibration signal through the power signal terminal BN during calibration and control the storage of the calibration signal in the OTP memory 12; to receive a power signal through the power signal terminal BN during signal detection to control the power-on operation of the integrated chip 10; and to control the threshold according to the signal stored in the OTP memory 12. The threshold signal of the switching unit 15; the oscillator 13 is connected to the oscillation circuit 20 and the demodulator 14 respectively; the oscillator 13 is used to output an oscillation detection signal to the demodulator 14 according to the alternating magnetic field signal generated by the oscillation circuit 20; the demodulator 14 is also connected to the threshold switching unit 15; the demodulator 14 is used to output a modulated signal to the threshold switching unit 15 after modulating and demodulating the oscillation detection signal; the threshold switching unit 15 is electrically connected to the output circuit 30 through the output unit 16; the threshold switching unit 15 is used to control the output signal provided by the output unit 16 to the output circuit 30 according to the modulated signal and the threshold signal.

[0027] During the calibration of the integrated chip 10, the calibration fixture can transmit the carrier signal to the controller 11 through the power signal terminal BN. The controller 11 demodulates the carrier signal into a calibration signal and stores the calibration signal in the OTP memory 12. When an inductive sensor is used for signal detection, the power signal terminal BN can receive a power signal to control the integrated chip 10 to power on and operate. At the same time, the controller 11 can determine the threshold signal of the threshold switching unit 15 based on the calibration data such as distance value and hysteresis value stored in the OTP memory 12, and use the threshold signal as the detection judgment basis of the inductive sensor.

[0028] In an optional embodiment, the controller 11 is further configured to control the calibration path in the OTP memory 12 to be in a fuse-off state when calibration is completed.

[0029] Among them, the OTP memory 12 is a one-time programmable non-volatile memory. After the inductive sensor is calibrated, the calibration fixture can set the fuse bit to 1. When the controller 11 receives the fuse-breaking signal transmitted by the calibration fixture, the power supply voltage of the inductive sensor is briefly increased to 38V, so that a larger current flows through the wires inside the OTP memory 12, thereby putting the calibration path in the OTP memory 12 into a fuse-breaking state. The output unit 16 feeds back the calibration completion signal to the calibration fixture through the output circuit 30. After the OTP memory 12 is fused, the data in the storage area cannot be changed, which can avoid the configuration parameters being tampered with due to interference and affect the performance of the inductive sensor.

[0030] Oscillator 13 drives oscillation circuit 20 to generate alternating magnetic field signal and outputs oscillation detection signal to demodulator 14. Demodulator 14 modulates and demodulates the oscillation detection signal at a preset sampling period and converts it into a DC signal. For example, the sampling period of demodulator 14 may include 16 oscillation periods, 64 oscillation periods, 128 oscillation periods, and 256 oscillation periods. The longer the sampling period of demodulator 14, the stronger the anti-interference capability of the inductive sensor, and the higher the detection accuracy and working stability.

[0031] In an optional embodiment, the demodulator 14 includes a signal shaping module. Figure 3 This is a schematic diagram of the structure of a signal shaping module provided in an embodiment of the present invention, as shown below. Figure 3 As shown, the signal shaping module is used to shape the oscillation detection signal into a DC modulated signal.

[0032] The signal shaping module receives an 8V or 24V input signal. After being divided by the fourth resistor R4 and the fifth resistor R5, and filtered by the third capacitor C3, the voltage at pin 3 of comparator U1 becomes a 1V or 3V square wave signal. The 3.3V power supply voltage is then passed through the sixth resistor R6 and the seventh resistor R7, so the voltage at pin 4 of comparator U1 remains constant at 2V. Figure 4 This is a voltage timing diagram of the signal shaping module provided in an embodiment of the present invention, as shown below. Figure 4 As shown, when the input signal V at the input terminal of the signal shaping module... IN When the voltage is 8V, the voltage V3 at pin 3 of comparator U1 is 1V, the voltage V4 at pin 4 of comparator U1 is 2V, and the DC output signal V at the output terminal of the signal shaping module is... OUT The input signal V at the input terminal of the signal shaping module is 0V. IN When the voltage is 24V, the voltage V3 at pin 3 of comparator U1 is 3V, the voltage V4 at pin 4 of comparator U1 is 2V, and the DC output signal V at the output of the signal shaping module is... OUT The voltage is 3.3V, thus achieving level conversion and shaping the oscillation detection signal into a DC modulated signal.

[0033] The threshold switch unit 15 is connected to the ground terminal BU through the third resistor R3. The threshold switch unit 15 can detect whether metal is near the inductive sensor based on the modulation signal and the threshold signal, and control the output unit 16 to provide the output signal to the output circuit 30. For example, when the threshold signal is 1V, if the modulation signal is less than 1V, it is determined that metal is near the inductive sensor, and the output unit 16 is controlled to provide a high-level output signal to the output circuit 30; if the modulation signal is greater than 1V, it is determined that no metal is near the inductive sensor, and the output unit 16 is controlled to provide a low-level output signal to the output circuit 30.

[0034] In this embodiment, the controller stores the calibration signal and controls the power supply of the integrated chip through the power signal terminal. The alternating magnetic field signal generated by the oscillation circuit is demodulated by the demodulator and compared with the threshold signal of the threshold switch unit, thereby controlling the output signal provided by the output unit to the output circuit. The integrated design of the integrated chip reduces the structure of the inductive sensor, solves the problem of complicated wiring and redundant wiring of the inductive sensor, and improves the detection accuracy and working stability.

[0035] Optional, continue to refer to Figure 2 The integrated chip 10 also includes an overcurrent detection unit 17, which is electrically connected to the signal output terminal BK and the output unit 16 respectively. The overcurrent detection unit 17 is used to control the working state of the output unit 16 according to the detection signal output by the signal output terminal BK.

[0036] The overcurrent detection unit 17 is connected to the sampling resistor R1. The overcurrent detection unit 17 determines the voltage drop of the sampling resistor R1 based on the current current value and the resistance value of the sampling resistor R1, and then determines whether the load current of the output circuit 30 is too large, thereby controlling the working state of the output unit 16 to protect the electronic components. For example, if the voltage drop threshold of the sampling resistor R1 is 0.2V, and the resistance of the sampling resistor R1 is 0.6Ω, and the load current of the output circuit 30 is 400mA, then the voltage drop of the sampling resistor R1 is 0.24V. The load current of the output circuit 30 is too large, which can easily burn out electronic components and cause permanent damage to the inductive sensor. At this time, the overcurrent detection unit 17 outputs an overcurrent signal and controls the output unit 16 to stop outputting the output signal. If the resistance of the sampling resistor R1 is 0.6Ω, and the load current of the output circuit 30 is 300mA, then the voltage drop of the sampling resistor R1 is 0.18V. The load current of the output circuit 30 is relatively small. At this time, the overcurrent detection unit 17 does not output an overcurrent signal, and the output unit 16 continues to output the output signal.

[0037] In an optional embodiment, the overcurrent detection unit 17 is also used to time the stop time of the output unit 16 when the control output unit 16 stops outputting the output signal, and to control the output unit 16 to continue outputting the output signal when the stop time reaches a preset time. Through the overcurrent automatic protection and delay automatic reset functions of the overcurrent detection unit 17, the ease of use and continuous working capability of the inductive sensor can be improved, the false protection caused by instantaneous interference can be effectively filtered out, and the working stability of the inductive sensor can be improved.

[0038] This embodiment, by setting up an overcurrent detection unit, can control the working state of the output unit in real time according to the detection signal output by the signal output terminal, thereby protecting the electronic components inside the inductive sensor and improving the working stability of the inductive sensor.

[0039] Optionally, the integrated chip 10 also includes a voltage regulator unit 18; the voltage regulator unit 18 is connected to the controller 11; the voltage regulator unit 18 is used to provide a regulated signal to the controller 11. For example, the voltage regulator unit 18 can stabilize the voltage at 3.5V to power the internal circuitry of the integrated chip 10, thereby avoiding the impact of voltage fluctuations on the detection accuracy of the inductive sensor.

[0040] Optionally, the inductive sensor also includes a voltage regulator circuit 40; the voltage regulator unit 18 is electrically connected to the ground terminal BU through the voltage regulator circuit 40; the voltage regulator circuit 40 is used to control the voltage regulator signal provided by the voltage regulator unit 18.

[0041] The integrated chip 10 is connected to the voltage regulator circuit 40 through the VB pin. The voltage regulator circuit 40 includes a second capacitor C2, which is electrically connected between the integrated chip 10 and the ground terminal BU. The voltage regulator circuit 40 can filter, regulate, and suppress noise in the power supply signal, thereby providing a regulated signal for the voltage regulator unit 18 and improving power supply stability.

[0042] Optionally, the oscillation circuit 20 includes a first inductor L1 and a first capacitor C1; the first inductor L1 is electrically connected between the integrated chip 10 and the ground terminal BU; the first capacitor C1 is electrically connected between the integrated chip 10 and the ground terminal BU.

[0043] The first inductor L1 and the first capacitor C1 are connected in parallel to form an LC oscillation circuit. The LC oscillation circuit can generate an alternating magnetic field signal under the drive of the oscillator 13. When metal approaches the inductive sensor, the amplitude of the alternating magnetic field signal generated by the oscillation circuit 20 is attenuated, thereby controlling the signal output terminal BK to output a detection signal, realizing the identification and displacement measurement of the metal target, and improving the detection accuracy of the inductive sensor.

[0044] Optionally, the output circuit 30 includes a first transistor Q1 and a sampling resistor R1; the control terminal of the first transistor Q1 is electrically connected to the integrated chip 10, the first terminal of the first transistor Q1 is electrically connected to the signal output terminal BK, and the second terminal of the first transistor Q1 is electrically connected to the ground terminal BU through the sampling resistor R1.

[0045] The output unit 16 is connected to the control electrode of the first transistor Q1 via the second resistor R2. The first transistor Q1 can be an NPN or PNP transistor. Different transistor types correspond to different output modes of the inductive sensor. For example, the output modes of the inductive sensor can include NPN normally open mode, NPN normally closed mode, PNP normally open mode, and PNP normally closed mode. The output signal of the output unit 16 can control the conduction or de-conduction of the first transistor Q1, thereby controlling the detection signal output at the signal output terminal BK.

[0046] In an exemplary embodiment, when the first transistor Q1 is an NPN transistor, when the output signal of the output unit is high, the first transistor Q1 is turned on, and the detection signal output by the signal output terminal BK is low, indicating that a metal target is near the inductive sensor; when the output signal of the output unit is low, the first transistor Q1 is turned off, and the detection signal output by the signal output terminal BK is high, indicating that no metal target is near the inductive sensor.

[0047] This embodiment, by setting a first transistor, can control the detection signal output from the signal output terminal, thereby significantly improving the driving capability of the integrated chip, meeting the load requirements of external devices such as PLCs and host computers, and improving the output stability of the detection signal.

[0048] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. An inductive sensor, characterized in that, include: Integrated chip, oscillation circuit, output circuit, power signal terminal, ground terminal and signal output terminal; The integrated chip is electrically connected to the oscillation circuit, the output circuit, the power signal terminal, and the ground terminal, respectively; the integrated chip is used to receive a calibration signal through the power signal terminal during calibration and to receive a power signal through the power signal terminal during signal detection. The oscillation circuit is used to generate an alternating magnetic field signal during signal detection; The integrated chip is also used to control the output signal output by the output circuit according to the alternating magnetic field signal during signal detection; The output circuit is electrically connected to the signal output terminal; the output circuit is used to control the detection signal output by the signal output terminal according to the output signal.

2. The inductive sensor according to claim 1, characterized in that, The integrated chip includes a controller, an OTP memory, an oscillator, a demodulator, a threshold switch unit, and an output unit; The controller is connected to the power signal terminal, the OTP memory, the threshold switch unit, and the output unit respectively. The controller is used to receive the calibration signal through the power signal terminal during calibration and control the calibration signal to be stored in the OTP memory, and to receive the power signal through the power signal terminal during signal detection to control the integrated chip to power on and run, and to control the threshold signal of the threshold switch unit according to the signal stored in the OTP memory. The oscillator is connected to the oscillation circuit and the demodulator, respectively. The oscillator is used to output an oscillation detection signal to the demodulator based on the alternating magnetic field signal generated by the oscillation circuit; The demodulator is also connected to the threshold switch unit; the demodulator is used to demodulate the oscillation detection signal and output a modulated signal to the threshold switch unit. The threshold switch unit is electrically connected to the output circuit through the output unit; the threshold switch unit is used to control the output signal provided by the output unit to the output circuit according to the modulation signal and the threshold signal.

3. The inductive sensor according to claim 2, characterized in that, The controller is also used to control the calibration path in the OTP memory to be in a fuse-off state when calibration is completed.

4. The inductive sensor according to claim 2, characterized in that, The demodulator includes a signal shaping module; the signal shaping module is used to shape the oscillation detection signal into the DC modulation signal.

5. The inductive sensor according to claim 2, characterized in that, The integrated chip also includes an overcurrent detection unit, which is electrically connected to the signal output terminal and the output unit respectively; the overcurrent detection unit is used to control the working state of the output unit according to the detection signal output by the signal output terminal.

6. The inductive sensor according to claim 5, characterized in that, The overcurrent detection unit is also used to time the stop time of the output unit when controlling the output unit to stop outputting the output signal, and to control the output unit to continue outputting the output signal when the stop time reaches a preset time.

7. The inductive sensor according to claim 2, characterized in that, The integrated chip also includes a voltage regulator unit; the voltage regulator unit is connected to the controller; the voltage regulator unit is used to provide a regulated signal to the controller.

8. The inductive sensor according to claim 7, characterized in that, Also includes: A voltage regulator circuit; the voltage regulator unit is electrically connected to the ground terminal through the voltage regulator circuit; the voltage regulator circuit is used to control the voltage regulator signal provided by the voltage regulator unit.

9. The inductive sensor according to claim 1, characterized in that, The oscillation circuit includes a first inductor and a first capacitor; The first inductor is electrically connected between the integrated chip and the ground terminal; The first capacitor is electrically connected between the integrated chip and the ground terminal.

10. The inductive sensor according to claim 1, characterized in that, The output circuit includes a first transistor and a sampling resistor; The control terminal of the first transistor is electrically connected to the integrated chip, the first terminal of the first transistor is electrically connected to the signal output terminal, and the second terminal of the first transistor is electrically connected to the ground terminal through the sampling resistor.

Images