Wafer clamping device

Abstract

This application discloses a wafer clamping device, comprising a carrier disk, inner ring clamping members, outer ring clamping members, a locking member, and a trigger member. The carrier disk has a bearing surface and a mounting surface, and also has several clamping working openings arranged around a center. Each inner ring clamping member is rotatably disposed in a clamping working opening and has an inner ring clamping portion. Each outer ring clamping member is rotatably disposed on the circumferential outer side of the carrier disk and has an outer ring clamping portion. The locking member, in the locked state, can keep the inner ring clamping portions within the clamping working openings. The trigger member is disposed on one side of the mounting surface of the carrier disk. During the movement from the initial position to the clamping position, the inner ring clamping member in contact with the first triggering portion of the trigger member gradually rotates toward the mounting surface to clamp the wafer, or the outer ring clamping member in contact with the second triggering portion of the trigger member gradually rotates toward the mounting surface to clamp the wafer. The wafer clamping device can trigger the action of the inner ring clamping members or the action of the outer ring clamping members through a set of structures.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more particularly to a wafer clamping device. Background Technology

[0002] In semiconductor CD-SEM metrology equipment, it is necessary to use clamping devices to quickly and stably clamp wafers. In some cases, it is necessary to clamp wafers of different sizes. For example, the wafer clamping device must be able to clamp both 6-inch and 8-inch wafers.

[0003] This places design requirements on wafer clamping devices: how to design a device that can stably clamp wafers of different sizes within a limited space, and how the wafer clamping device can quickly switch to the corresponding clamping state for wafers of different sizes. Summary of the Invention

[0004] To address the aforementioned issues, this application discloses a wafer clamping device that uses a single structure to trigger the action of both the inner and outer clamping components. This allows for convenient switching between clamping actions for wafers of two different sizes and effectively utilizes the available space.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] This application provides a wafer clamping device, comprising a carrier disk, inner ring clamping members, outer ring clamping members, a locking member, and a triggering member. The carrier disk has a circular structure with opposing bearing surfaces and mounting surfaces, and also has several clamping working openings arranged around its center. Several inner ring clamping members are provided, each rotatably disposed in a clamping working opening, and each has an inner ring clamping portion capable of rotating towards the center and towards the bearing surface. Several outer ring clamping members are provided, each rotatably disposed on the circumferential outer side of the carrier disk, and each has an outer ring clamping portion capable of rotating towards the bearing surface. The locking member, in the locked state, prevents the inner ring clamping members from rotating and keeps the inner ring clamping portions within the clamping working openings. A trigger element is disposed on one side of the mounting surface of the carrier disk and can move along the height direction from an initial position to a clamping position. The trigger element also has a first trigger portion that can contact and restrict the rotational position of each inner ring clamping member, and a second trigger portion that can contact and restrict the rotational position of each outer ring clamping member. During the movement from the initial position to the clamping position, the inner ring clamping members in contact with the first trigger portion gradually rotate toward the mounting surface to clamp the wafer, or the outer ring clamping members in contact with the second trigger portion gradually rotate toward the mounting surface to clamp the wafer.

[0007] The wafer clamping device can trigger either the inner or outer clamping element to operate via a single trigger. This allows for easy switching between clamping actions for two wafer sizes, eliminating the need for two separate clamping structures for each size. Furthermore, the overall structure of the wafer clamping device makes efficient use of the space beneath the support tray, without interfering with or affecting the setup and operation of other devices.

[0008] In one illustrative embodiment of the wafer clamping device, the wafer clamping device includes several inner ring connecting frames, which are mounted to the mounting surface of a carrier tray. The inner ring clamping element is rotatably connected to the inner ring connecting frames and has a rotatable first clamping end and a first contact end. The inner ring clamping part is disposed at the first clamping end, and the inner ring clamping element contacts a first triggering part through the first contact end. The inner ring connecting frame is also provided with a first force-applying part, which can provide a force to the first contact end to push the first clamping end to rotate towards the center side for clamping the wafer.

[0009] In one illustrative embodiment of the wafer clamping device, a locking member is disposed on the side of the clamping working opening opposite to the center. The locking member in the unlocking state can be retracted to this side, and the locking member in the locked state can extend out of this side to contact and restrict the inner clamping portion from rotating away from the center and to be held within the clamping working opening.

[0010] In one illustrative embodiment of the wafer clamping device, the locking element is an adjusting bolt.

[0011] In one illustrative embodiment of the wafer clamping device, the wafer clamping device includes several outer ring connecting frames, which are mounted to the mounting surface of a carrier tray. An outer ring clamping member is rotatably connected to the outer ring connecting frames and has a rotatable second clamping end and a second contact end. An outer ring clamping portion is disposed at the second clamping end, and the outer ring clamping member contacts a second triggering portion through the second contact end. The outer ring connecting frame is also provided with a second force-applying portion, which can provide a force to the second contact end to push the second clamping end to rotate towards the center for clamping the wafer.

[0012] In one illustrative embodiment of the wafer clamping device, the wafer clamping device includes several outer ring connecting frames, which are mounted to the mounting surface of a carrier disk. Outer ring clamping members are rotatably connected to the outer ring connecting frames and have a rotatable second clamping end and a second contact end. An outer ring clamping portion is disposed at the second clamping end, and the outer ring clamping member contacts a second triggering portion through the second contact end. The wafer clamping device also includes several force-applying devices corresponding to each outer ring clamping member. Each force-applying device includes a mounting frame and a third force-applying portion. The mounting frame is mounted to the circumferential side of the carrier disk. The third force-applying portion is disposed on the mounting frame and is capable of providing a force to the second clamping end to push the second clamping end to rotate towards the center for clamping the wafer.

[0013] In one illustrative embodiment of the wafer clamping device, the trigger element has several first connecting rods and several second connecting rods arranged around a center. A first trigger portion is disposed on a first connecting rod, and a second trigger portion is disposed on a second connecting rod. Effectively utilizing space in the arrangement of the first and second trigger portions ensures that the transmission forces on the first and second trigger portions are consistent.

[0014] In one illustrative embodiment of the wafer clamping device, both the first and second triggering parts are cylindrical structures. The first triggering part has a first contact slope on the side facing the center, and the second triggering part has a second contact slope on the side facing the center. The inner clamping member has a first roller that contacts the first contact slope, and the outer clamping member has a second roller that contacts the second contact slope. This structure reduces friction, making movement more stable and precise.

[0015] In one illustrative embodiment of the wafer clamping device, the wafer clamping device further includes several support columns, which are disposed on a first connecting rod and / or a second connecting rod. The support columns are movable with the trigger and pass through a support plate to support the wafer. Before the trigger moves to the clamping position, the support columns are located below the support surface in the height direction. The design of the support columns helps to support wafers from other devices and directly coordinates with subsequent centering and clamping actions, improving work efficiency and simplifying the structure.

[0016] In one illustrative embodiment of the wafer clamping device, the clamping stroke of the trigger moving from the initial position to the clamping position is divided into a first stroke and a second stroke. After the support portion places the wafer on the bearing surface, it enters the second stroke, and the movement speed of the second stroke is slower than that of the first stroke. The first stroke can improve work efficiency, while the second stroke can prevent wafer displacement during clamping. Attached Figure Description

[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0018] Figure 1 An exploded three-dimensional view illustrating a schematic embodiment of a wafer clamping device.

[0019] Figure 2 For explanation Figure 1 The diagram shows the structure of the assembled wafer clamping device.

[0020] Figure 3 Used to explain Figure 1 A partial structural schematic diagram of the wafer clamping device shown.

[0021] Figure 4 An installation structure diagram illustrating another illustrative embodiment of the outer ring clamping member.

[0022] Figures 5 to 8 This is used to illustrate the process of the inner ring clamping element holding the wafer.

[0023] Figure 9 This is a structural diagram illustrating the locking mechanism in the locked state.

[0024] Label Explanation

[0025] 10. Support plate

[0026] 12 Bearing surface

[0027] 14 Assembly Surface

[0028] 16 Clamping port

[0029] 17 Outer ring slot

[0030] 19 Through Holes

[0031] 22 Inner ring clamping parts

[0032] 21 Inner Ring Connector

[0033] 212 First Force-Applying Unit

[0034] 221 First clamping end

[0035] 222 Inner ring clamping part

[0036] 223 First contact end

[0037] 225 First Roller

[0038] 23 Outer ring connecting bracket

[0039] 232 Second Force Application Unit

[0040] 24 Outer ring clamping parts

[0041] 241 Second clamping end

[0042] 242 Outer ring clamping part

[0043] 243 Second contact end

[0044] 245 Second Roller

[0045] 30 Locking components

[0046] 40 triggers

[0047] 41 First connecting rod

[0048] 42 First trigger section

[0049] 421 First contact slope

[0050] 43 Second connecting rod

[0051] 44 Second Trigger Section

[0052] 441 Second contact slope

[0053] 49 Support Columns

[0054] 50 Force application device

[0055] 52 mounting brackets

[0056] 54 Third Force-Exerting Unit

[0057] 80 base

[0058] 82 Connecting Column

[0059] 90 wafers Detailed Implementation

[0060] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0061] In this document, “illustrative” means “serving as an example, illustration or description”, and any illustration or implementation described herein as “illustrative” should not be construed as a more preferred or advantageous technical solution.

[0062] To keep the drawings concise, only the parts relevant to this application are shown schematically in each drawing, and they do not represent the actual structure of the product. In addition, to make the drawings concise and easy to understand, in some drawings, only one of the components with the same structure or function is shown schematically, or only one of them is labeled.

[0063] The technical solutions provided by the various embodiments of this application are described in detail below with reference to the accompanying drawings.

[0064] Figure 1 An exploded three-dimensional view illustrating a schematic embodiment of a wafer clamping device. Figure 2 For explanation Figure 1The diagram shows the assembled structure of the wafer clamping device. Figure 1 and Figure 2 As shown, the wafer clamping device includes a carrier disk 10, an inner ring clamping member 22, an outer ring clamping member 24, a locking member 30, and a trigger member 40.

[0065] The carrier disk 10 has a circular disk-shaped structure with two opposing surfaces: a carrier surface 12 facing upwards and an assembly surface 14 facing downwards. The carrier surface 12 is used to support the circular wafer and can selectively support two wafer sizes: a large-size wafer 92 (e.g., an 8-inch wafer) and a small-size wafer 94 (e.g., a 6-inch wafer). See [reference needed] for details. Figure 2 The dotted lines in the figure represent the structure. One side of the assembly surface 14 can be used to assemble other structures, which will be described in detail later. Three clamping ports 16 are also provided on the support plate 10, penetrating the support surface 12 and the assembly surface 14 of the support plate 10. The three clamping ports 16 are arranged around the center of the support plate 10. In the embodiment shown in the figure, the support plate 10 can be fixedly connected to a base 80 by three connecting posts 82. Of course, depending on the design requirements, the support plate 10 can also be positioned using other structures or methods.

[0066] exist Figure 1 In the illustrated embodiment, there are three inner ring clamping members 22. Of course, other numbers of inner ring clamping members 22 can be designed depending on the design requirements. Each inner ring clamping member 22 is rotatably disposed in the clamping working opening 16, and each inner ring clamping member 22 has an inner ring clamping portion 222 that can extend out of the clamping working opening 16. (See [reference]) Figure 2 It can rotate toward the center and the bearing surface 12. The inner ring clamping member 22 can be used to clamp small-sized wafers 94.

[0067] To better understand the specific configuration of the inner ring clamping member 22, please refer to [the relevant documentation]. Figure 3 ,like Figure 3 As shown, the wafer clamping device includes three inner ring connecting frames 21, which can be mounted to the mounting surface 14 of the carrier plate 10. An inner ring clamping member 22 is rotatably connected to the inner ring connecting frames 21 and has a rotatable first clamping end 221 and a first contact end 223. The inner ring clamping part 222 is located at the first clamping end 221. The inner ring clamping member 22 contacts the first trigger part 42 through the first contact end 223 and engages with the first trigger part 42 in a coordinated manner; the specific engagement method will be described in detail later.

[0068] The inner ring connecting bracket 21 is also provided with a first force-applying part 212, which can provide force to the first contact end 223 to push the inner ring clamping member 22 and the first clamping end 221 to rotate towards the center through the first contact end 223 for clamping the wafer, as will be described in detail below. In one embodiment, the first force-applying part 212 can be a spring plunger.

[0069] exist Figure 1 In the illustrated embodiment, the number of outer ring clamping members 24 is also three (the outer ring clamping members 24 at the top of the figure are obscured). Of course, other numbers of outer ring clamping members 24 can be designed according to different design requirements. Each outer ring clamping member 24 is rotatably disposed on the circumferential outer side of the support disk 10. Each clamping member 30 is rotatable and has an outer ring clamping portion 242 that can rotate about its rotation axis. The outer ring clamping portion 242 can rotate toward the support surface 12 of the support disk 10. The outer ring clamping member 24 can be used for clamping. Figure 2 The large-size wafer 92 shown in the image.

[0070] To better understand the specific configuration of the outer ring clamping member 24, please refer to [the relevant documentation]. Figure 3 ,like Figure 3 As shown, the wafer clamping device includes three outer ring connectors 23 (one of which is obscured by the structure), and the three outer ring connectors 23 are mounted to the mounting surface 14 of the carrier plate 10. An outer ring clamping member 24 is rotatably connected to the outer ring connectors 23 and has a rotatable second clamping end 241 and a second contact end 243, with an outer ring clamping portion 242 located at the second clamping end 241. The outer ring clamping member 24 makes contact with the second trigger portion 44 through the second contact end 243.

[0071] In order to provide clamping force to the outer ring clamping member 24, Figure 3 In the illustrated embodiment, the wafer clamping device further includes three force-applying devices 50, each corresponding to an outer ring clamping member 24. Each force-applying device 50 includes a mounting frame 52 and a third force-applying part 54. The mounting frame 52 is mounted to the circumferential side of the support plate 10, and the third force-applying part 54 is disposed on the mounting frame 52. The third force-applying part 54 can provide a force to the second clamping end 241 of the outer ring clamping member 24 to push the second clamping end 241 to rotate towards the center for clamping the wafer. In a specific embodiment, the third force-applying part 54 can be a plunger spring.

[0072] Of course, the structure providing clamping force to the outer ring clamping member 24 can also adopt a similar structural arrangement to the first force-applying part 44 of the inner ring clamping member 22. Please refer to Figure 4Another mounting structure diagram of the outer ring clamping component shows that a second force-applying part 232 can be directly provided on the outer ring connecting frame 23. The second force-applying part 232 can provide a force to the second contact end 243 to push the second clamping end 241 to rotate towards the center for clamping the wafer. In a specific embodiment, the second force-applying part 232 can also be a plunger spring.

[0073] A trigger 40 is disposed on one side of the mounting surface 14 of the carrier disk 10, and is provided with a first trigger part 42 and a second trigger part 44. The trigger 40 can contact the inner ring clamping member 22 through the first trigger part 42, and can contact the outer ring clamping member 22 through the second trigger part 44. After the trigger 40 moves, the first trigger part 42 contacts the inner ring clamping member 22, thereby limiting the rotational position of the inner ring clamping member 22 and controlling the clamping action of the inner ring clamping member on the small-sized wafer 94. After the trigger 40 moves, the second trigger part 44 can also contact the outer ring clamping member 24, thereby limiting the rotational position of the outer ring clamping member 24 and controlling the clamping action of the outer ring clamping member on the large-sized wafer 92. Therefore, by moving the trigger 40, both the inner ring clamping member 94 and the outer ring clamping member 94 can be controlled and limited. That is, the same trigger 40 can trigger the inner ring clamping member 22 to complete clamping, and can trigger the outer ring clamping member 24 to complete clamping.

[0074] Regarding the specific structure of trigger 40, Figure 1 In the illustrated embodiment, the trigger member 40 has three first connecting rods 41 and three second connecting rods 43 arranged around its center. Those skilled in the art will understand that the number and position of the first connecting rods 41 correspond to the inner ring clamping members 22, and the number and position of the second connecting rods 43 correspond to the outer ring clamping members 24. Each first contact 42 is disposed on each first connecting rod 41 for simultaneously contacting each inner ring clamping member 22. Each second contact portion 44 is disposed on each second connecting rod 43 for simultaneously contacting each outer ring clamping member 24.

[0075] exist Figure 1 In the illustrated embodiment, both the first trigger portion 42 and the second trigger portion 44 are cylindrical structures. The first trigger portion 42 has a first contact slope 421 on its side facing the center, and the second trigger portion 44 has a second contact slope 441 on its side facing the center. The inner ring clamping member 22 has a first roller 225 capable of contacting the first contact slope 421. See also... Figure 5 The outer ring clamping member 24 has a second roller 245 capable of contacting the second contact slope 441, which can be seen simultaneously. Figure 4 Such a structure reduces friction, making movement more stable and precise.

[0076] Meanwhile, the trigger 40 may also be provided with a support column 49 that can pass through the bearing plate 10. Figure 1 In the embodiment shown, the carrier plate 10 has a through hole 19 corresponding to the support column 49. The support column 49, which moves with the trigger 40, can extend out of the carrier plate 10 through the through hole 19 to receive the wafer. Before the trigger moves to the clamping position, the support column 49 is located below the carrier surface 12 in the height direction, and the wafer has been placed on the carrier surface 12, which will be described in detail later.

[0077] The following is combined Figures 5 to 8 This is used to illustrate the engagement process between the first trigger part 42 and the inner ring clamping member 22, which is also the clamping process of the small-sized wafer 94. Figures 5 to 8 The diagram only schematically illustrates the interaction between a first trigger 42 and an inner ring clamping member 22. Those skilled in the art will understand that similar interaction processes will occur simultaneously between other first triggers 42 and other inner ring clamping members 22.

[0078] like Figure 5 As shown, before selecting and clamping the small-sized wafer 94, under the action of the first force application part 212, the inner ring clamping part 222 of the inner ring clamping member 22 is tightly attached to the carrier disk 10, and part of the structure of the inner ring clamping part 222 will be located above the carrier surface 12. At this time, the wafer cannot be placed on the carrier surface 12 of the carrier disk 10, and the trigger member 40 needs to be driven (see Figure 1 The first trigger module 42 moves upward as shown in the figure. As the first trigger module 42 moves, the first contact slope 421 of the first trigger module 42 contacts the first roller 225 of the inner ring clamping member 30, pushing the first contact end 223 of the inner ring clamping member 22. This causes the first clamping end 221 and the inner ring clamping part 222 of the inner ring clamping member 22 to rotate in a direction away from the center (counterclockwise in the figure) until... Figure 6 .

[0079] like Figure 6 As shown, at this time, the inner ring clamping part 222 has avoided the bearing surface 12 of the bearing disk 10, and the support part 49 extends out of the bearing surface 12 of the bearing disk 10 after the trigger moves, in order to support the small-sized wafer 94.

[0080] Figure 6 The first triggering part 40 shown is composed of a trigger element 40 (see Figure 1 Driven by the trigger, the position of the trigger 40 at this time can be understood as its initial position. Those skilled in the art will understand that in this application, the initial position of the trigger 40 does not refer to a specific position. The initial position can be any position of the trigger 40 before it drives the first trigger part and the second trigger part to clamp the wafer.

[0081] like Figure 6 As shown, to complete the clamping action, the trigger 40 needs to be driven (see...). Figure 1 The first contact end 223 of the inner ring clamp 22 and its first trigger part 42 begin to move downward in the figure. As the first trigger part 42 begins to move downward, the second contact slope 421 of the first trigger part 42 allows the first contact end 223 of the inner ring clamp 22 to rotate under the action of the first force application part 212, so that the first clamping end 221 and the inner ring clamp 222 rotate toward the center (in the instantaneous direction in the figure).

[0082] Simultaneously, as the trigger 40 moves downward, the support 49 also moves downward, driving the small-sized wafer 94 towards the bearing surface 12 until... Figure 7 The support section 49 will first place the small-sized wafer 94 on the bearing surface 12, and continue towards... Figure 8 Move to the indicated position.

[0083] Until Figure 8 When the trigger 40 and its first trigger part 42 reach the clamping position, the support part 49 moves to a height position below the bearing surface 12, and the inner ring clamping part 222 of the inner ring clamping member 222 clamps the small-sized wafer 94 to the bearing surface 12.

[0084] Those skilled in the art will understand that, because the trigger 40 simultaneously drives the first trigger part 42 and the second trigger part 44 to move, the above-mentioned Figures 5 to 8 During the operation, the second trigger part 44 will also drive the outer ring clamping part 24 to perform a similar action, but it will not affect the clamping action of the small-sized wafer 94.

[0085] And if you want to complete Figure 2 The clamping of the large-size wafer 92 shown requires preventing the inner ring clamping part 222 of the inner ring clamping member 22 from moving above the bearing surface 12. In this case, a locking member 30 is needed to lock the inner ring clamping member 22.

[0086] exist Figure 1 and Figure 3 In the embodiment shown, the locking member 30 is disposed on the side of the clamping working port 16 away from the center. The locking member 30 in the locked state can extend out of this side, while the locking member 30 in the unlocking device can retract to this side.

[0087] Please also see Figure 9 The locking member 30 can contact the inner ring clamping part 222 and resist the force of the first force-applying part 212, causing the inner ring clamping part 222 to rotate away from the center and remain within the clamping working opening. This ensures that the inner ring clamping part 222 does not protrude from the bearing surface 12 in the height direction, so as not to affect the clamping of the large-size wafer 94 by the outer ring clamping member 24. In one illustrative embodiment, the locking member 30 can be an adjusting bolt.

[0088] The specific clamping process of the outer clamping member 24 for the large-size wafer 94 is similar to that of the inner clamping member 22, and will not be described in detail here. Furthermore, those skilled in the art will understand that regardless of whether the support part 94 is located on the first connecting rod 41, the second connecting rod 43, or both, it can support both the large-size wafer 94 and the small-size wafer 92.

[0089] In addition, for clamping large-size wafers 94, to facilitate the process of supporting wafers 90 with the support pillars 49, a corresponding slot structure can be provided in the circumference of the support disk 10. For specific implementation details, please refer to [link to relevant documentation]. Figure 3 The bearing plate 10 has outer ring slots 17 in the circumferential direction corresponding to each outer ring clamping part 242.

[0090] When the support post 49 contacts the large-size wafer 94, the trigger 40 will activate the outer ring clamping member 24 through the second trigger part 44, causing the outer ring clamping part 242 of the outer ring clamping member 24 to disengage from the outer ring slot 17 to the side away from the center. This engagement method takes into account the situation where the wafer is placed at a position far from the center, and can prevent the wafer from being damaged by contacting the outer ring clamping part 242 during the process of supporting and placing the wafer.

[0091] As can be seen, the wafer clamping device simultaneously triggers the clamping actions of the inner clamping member 22 and the outer clamping member 24 via a single trigger 40. When clamping a small-sized wafer 92, this clamping action can be completed directly. When clamping a large-sized wafer 94, the position of the inner clamping member 22 is restricted by the locking member 30. The clamping actions for the two wafer sizes can be easily switched without the need for two separate clamping structures for different wafer sizes. Furthermore, the overall structure of the wafer clamping device makes full and effective use of the space below the carrier disk 10, without interfering with or affecting the setup and operation of other devices.

[0092] In addition, to ensure more precise and stable wafer clamping and minimize wafer displacement during the clamping process, the trigger 40 can be moved from its initial position ( Figure 6 Position) to clamping position ( Figure 8 The clamping stroke of the position movement is divided into a first stroke and a second stroke. The process of the trigger 40 placing the wafer on the bearing surface 12 through the support part 49 is in the first stroke. After the support part 49 places the wafer on the bearing surface 12, it enters the second stroke. The moving speed of the trigger 40 in the second stroke is slower than the moving speed in the first stroke.

[0093] In the above design, the second stroke is the process where the inner ring clamping member 22 or the outer ring clamping member 24 prepares to contact and clamp the wafer. At this time, the speed of the trigger member 40 decreases, so that the inner ring clamping member 22 or the outer ring clamping member 24 will not cause wafer displacement due to rapid contact with the wafer. In the first stroke, the moving speed of the trigger member 40 can be faster to improve the overall work efficiency.

[0094] The above description is merely a specific embodiment of this application. Under the guidance of the above teachings, those skilled in the art can make other improvements or modifications based on the above embodiments. Those skilled in the art should understand that the above specific description is only to better explain the purpose of this application, and the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A wafer clamping device, characterized in that, It includes: The carrier plate (10) is a disc structure with opposite bearing surfaces (12) and assembly surfaces (14), and the carrier plate (10) is also provided with several clamping working ports (16) arranged around the center. Several inner ring clamping members (22) are rotatably disposed on the clamping working port (16) and have an inner ring clamping part (222) that can rotate toward the center and toward the bearing surface (12). Several outer ring clamping members (24) are rotatably disposed on the circumferential outer side of the bearing disk (10) and have an outer ring clamping part (242) that can rotate toward the bearing surface. The locking member (30), when in the locked state, can prevent the inner ring clamping member (23) from rotating and keep the inner ring clamping part (222) within the clamping working port (16); A trigger (40) is disposed on one side of the mounting surface (114) of the carrier plate (10) and is movable in the height direction from an initial position to a clamping position. The trigger also has a first trigger part (42) that can contact and limit the rotation position of each of the inner ring clamping members (20) and a second trigger part (44) that can contact and limit the rotation position of each of the outer ring clamping members (24). During the movement from the initial position to the clamping position The inner ring clamping member (22) in contact with the first trigger part (42) gradually rotates toward the mounting surface (14) to clamp the wafer, or The outer ring clamping member (24) that is in contact with the second trigger part (44) gradually rotates toward the mounting surface (14) to clamp the wafer.

2. The wafer clamping device as described in claim 1, characterized in that, The wafer clamping device includes several inner ring connecting frames (21), which are mounted to the mounting surface (14) of the carrier disk (10). The inner ring clamping member (22) is rotatably connected to the inner ring connecting frame (21), and has a rotatable first clamping end (221) and a first contact end (223). The inner ring clamping part (222) is disposed at the first clamping end (221), and the inner ring clamping member (22) contacts the first trigger part (42) through the first contact end. The inner ring connecting frame (21) is also provided with a first force application part (212), which can provide a force to the first contact end (223) to push the first clamping end (221) to rotate toward the center side for clamping the wafer.

3. The wafer clamping device as described in claim 2, characterized in that, The locking member (30) is disposed on the side of the clamping working port (16) opposite to the center. The locking member (30) of the unlocking device can be retracted to this side. The locking member (30) in the locked state can extend out of this side, contact and restrict the inner ring clamping part (222) from rotating to the side away from the center and remain in the clamping working opening (16).

4. The wafer clamping device as described in claim 3, characterized in that, The locking component (30) is an adjusting bolt.

5. The wafer clamping device as described in claim 1, characterized in that, The wafer clamping device includes several outer ring connectors (23), which are mounted to the mounting surface (14) of the carrier disk (10). The outer ring clamping member (24) is rotatably connected to the outer ring connecting frame (23), and has a rotatable second clamping end (241) and a second contact end (243). The outer ring clamping part (242) is disposed at the second clamping end (241), and the outer ring clamping member (24) contacts the second trigger part (44) through the second contact end (243). The outer ring connecting frame (23) is also provided with a second force application part (232), which can provide a force to the second contact end (243) to push the second clamping end (243) to rotate towards the center side for clamping the wafer.

6. The wafer clamping device as described in claim 1, characterized in that, The wafer clamping device includes several outer ring connectors (23), which are mounted to the mounting surface (14) of the carrier disk (10). The outer ring clamping member (24) is rotatably connected to the outer ring connecting frame (23), and has a rotatable second clamping end (241) and a second contact end (243). The outer ring clamping part (242) is disposed at the second clamping end (241), and the outer ring clamping member (24) contacts the second trigger part (44) through the second contact end (243). The wafer clamping device further includes several force-applying devices (50) corresponding to each of the outer ring clamping members (24), the force-applying devices (50) including: Mounting bracket (52), said mounting bracket (52) is mounted to the circumferential side of the support plate (10), The third force-applying part (54) is disposed on the mounting frame (52) and can provide a force to the second clamping end (44) to push the second clamping end (243) to rotate toward the center side for clamping the wafer.

7. The wafer clamping device as described in claim 1, characterized in that, The trigger has several first connecting rods (41) and several second connecting rods (43) arranged around a center, with the first trigger part (42) disposed on the first connecting rod (41) and the second trigger part (44) disposed on the second connecting rod (43).

8. The wafer clamping device as described in claim 7, characterized in that, Both the first trigger part (42) and the second trigger part (44) are cylindrical structures, and the first trigger part (42) has a first contact slope (421) on the side facing the center of the circle, and the second trigger part (44) has a second contact slope (441) on the side facing the center of the circle. The inner ring clamp (22) has a first roller (225) that contacts the first contact slope (421), and the outer ring clamp (24) has a second roller (245) that contacts the second contact slope (441).

9. The wafer clamping device as described in claim 8, characterized in that, The wafer clamping device further includes several support columns (49), which are disposed on the first connecting rod (41) and / or the second connecting rod (43). The support columns (49) can move with the trigger (40) and pass through the carrier plate (10) to support the wafer. Before the trigger moves to the clamping position, the support columns (49) are located below the carrier surface (12) in the height direction.

10. The wafer clamping device as described in claim 9, characterized in that, The clamping stroke of the trigger (40) moving from the initial position to the clamping position is divided into a first stroke and a second stroke. When the support (49) places the wafer on the bearing surface (12), it enters the second stroke. The moving speed of the second stroke is slower than that of the first stroke.

Images