A three-dimensional printing method and device for heterogeneous multi-component integrated molding

Abstract

This invention discloses a 3D printing method and apparatus for the integrated molding of heterogeneous multi-component components, specifically relating to the fields of advanced manufacturing and intelligent microsystems technology. This invention overcomes the limitations of traditional multi-material 3D printing, which can only integrate electronic components and cannot embed drivers. It employs a dual-mode embedding method combining vacuum adsorption and pneumatic gripping, achieving integrated manufacturing of micro-drivers, electronic components, high-precision conductive lines, and structural substrates. By preparing wires through mask scraping, it solves the problems of low precision and difficulty in adapting to micro-circuits in direct writing, improving interconnect reliability and miniaturization level. The direct embedding of mature drivers avoids the polarization process and performance degradation issues required for direct printing of piezoelectric materials, ensuring stable and reliable driving performance. Through in-situ wire fabrication and a closed-loop printing process, it eliminates the risk of post-assembly errors and interconnect failures.

Description

Technical Field

[0001] This invention belongs to the field of advanced manufacturing and intelligent microsystems technology, specifically relating to a three-dimensional printing method and apparatus for integrated molding of heterogeneous multi-component components. Background Technology

[0002] Currently, multi-material 3D printing technology still faces many key technological bottlenecks in the manufacturing of micro-robots. Although existing technologies can achieve the embedding and positioning of some passive electronic components and interconnecting wires, the overall technology remains at the level of electronic device manufacturing and cannot support the fabrication of micro-robot systems with autonomous movement capabilities. The specific limitations are mainly reflected in the following aspects:

[0003] First, current technologies can only embed passive electronic components such as resistors, capacitors, and sensor chips that lie flat. They have not yet achieved in-situ implantation, attitude control, and rigid fixation of micro-actuators that require upright mounting. The core of micro-robots lies in their ability to be driven, moved, and controlled. Without the effective integration of drive units, only static circuits or simple functional structures can be formed, making it impossible to build a complete robot system with autonomous movement capabilities.

[0004] Secondly, the method of directly printing piezoelectric resin as the driving unit has inherent drawbacks. This type of method requires subsequent high-voltage polarization to generate a driving effect, which not only involves a complex process and difficulty in adapting to miniaturized structures, but also significantly reduces piezoelectric performance, resulting in insufficient driving force and poor stability. More importantly, this technology has not yet been proven to be able to be integrated synchronously with electronic components and control chips, making it difficult to achieve closed-loop coordination of driving, sensing, and computing. It still requires a lot of post-processing and assembly, and cannot achieve "printing as manufacturing".

[0005] Furthermore, existing wire fabrication methods mostly employ direct writing, which limits the precision of the circuits and makes it difficult to meet the demands of miniaturized, high-density circuits. Direct-written wires exhibit poor width uniformity, rough lines, and large positioning deviations, making them unsuitable for the high-density, high-precision microcircuits within the confined spaces of microrobots. This can easily lead to problems such as short circuits, open circuits, and excessive contact resistance, thus limiting the miniaturization and functional integration of devices.

[0006] In summary, the difficulties in embedding actuators for microrobots, poor driving performance, insufficient wire forming precision, and weak full-function collaborative integration capabilities have become the core bottlenecks restricting the field's development towards miniaturization, high precision, and intelligence. Summary of the Invention

[0007] The purpose of this invention is to provide a three-dimensional printing method and apparatus for integral molding of heterogeneous multi-component components, so as to solve the above-mentioned problems.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a three-dimensional printing method for integrated molding of heterogeneous multi-component components, the specific steps of which are as follows:

[0009] S1. Establish a three-dimensional digital model including the micro-robot structure, drive unit, circuit pattern and electronic component placement positions, and complete layer slicing to obtain photocurable cross-sectional data; use a microscopic vision system to perform full-area scanning of the driver, chip, resistor, capacitor and other components in the feeding area, and accurately obtain the component type, coordinates, angle and posture information through image recognition, plan the coordinated motion trajectory of the print head, pick-and-place mechanism, scraper and dispensing system, and generate an integrated control program;

[0010] S2, the printing device starts according to the predetermined program. First, it performs the conventional photopolymerization printing process: the printing platform is lowered along the Z-axis to a preset layer thickness, the digital light processing projector is turned on, and the liquid photosensitive resin area is selectively exposed according to the slice data. After a few seconds of curing, a solid sheet is formed. The above "lowering-exposure-curing" process is repeated to build a three-dimensional polymer matrix structure layer by layer. When the printing reaches the preset functional component embedding layer, the printing process is automatically paused and the functional unit embedding process begins.

[0011] S3 involves in-situ forming of metal interconnect lines on the surface of the substrate structure; controlling the dispensing printhead to move above a custom stainless steel mask, extruding a quantitative amount of conductive silver paste onto the mask surface; then controlling the squeegee to scrape the silver paste at a certain scraping speed and angle, allowing the silver paste to seep through the precision gaps in the mask to the surface of the cured polymer structure below, forming a high-precision conductive wire consistent with the design pattern; the distance the squeegee moves must be greater than the total width of the line and retain edge redundancy, and the scraping speed and angle are determined based on rheological principles and the width of the mask gaps;

[0012] S4, dual-mode precise embedding of heterogeneous functional components;

[0013] Based on the geometry and mounting requirements of the components, the following two embedding operations are performed:

[0014] S41: Vacuum adsorption and planar placement of flat-lying parts;

[0015] For components that need to be laid parallel to the structural surface, control the multi-degree-of-freedom pick-and-place printhead to move it directly above the target component; lower the printhead to a point approximately 1 mm above the center of the component and stop, then activate the vacuum suction system to firmly lift the component using a negative pressure suction cup; rotate the printhead to a preset angle to adjust the component's orientation; then move it to the predetermined target coordinate position, lower the printhead to a point approximately 1 mm above the center, release the positive pressure, and place the component stably on the wire or substrate surface; repeat this process to complete the batch implantation of all flat-laid components.

[0016] S42: Mechanical clamping and vertical mounting of upright components;

[0017] For piezoelectric actuators, micro actuators, and other drive units that require upright installation and directional force application, the pneumatic gripper mechanism is moved above the component; the gripper is lowered so that its opening completely covers the component, and positive pressure is applied to drive the gripper claws to close, achieving rigid clamping; the gripper is moved to a preset coordinate and rotated to a specific tilt angle or azimuth angle according to design requirements; after reaching the target position, negative pressure is applied to release the gripper, so that the component is vertically fixed at the preset position; the operation is repeated to complete the positioning and installation of all upright components.

[0018] Preferably, it also includes S5, after all circuit drawing and component embedding are completed, the printing platform resumes its ascent; continues to execute the conventional photopolymerization printing process to cover and cure the entire structure with subsequent layers; finally, under the action of the light field, the conductive wires, functional components and polymer matrix interfaces undergo physical and chemical bonding to form an integrated micro-robot component with high bonding strength and dense structure.

[0019] A three-dimensional printing device for integrated molding of heterogeneous multi-component components includes a three-axis moving platform;

[0020] The three-axis moving platform includes an optical breadboard, which is fixed on an optical platform. A scissor lift platform and a Y-axis moving platform are fixed to the optical breadboard with hexagonal bolts. An X-axis moving platform is fixed to a liftable breadboard with hexagonal bolts. A Z-axis moving platform is fixed to the X-axis moving platform with hexagonal bolts. The three-axis platform has been installed.

[0021] Preferably, it also includes a positive and negative pressure adjustable suction nozzle. The positive and negative pressure adjustable suction nozzle is inserted into a detachable syringe clamp and fixed from the left side with an internal hex nut. The microscope is inserted into a microscope barrel clamp and fixed with an internal hex nut. The microscope barrel clamp is fixed to the projector mounting plate. The detachable syringe clamp, stepper motor, motor-suction nozzle module, motor-gripper module, stepper motor L-shaped clamp, idler wheel and blade clamp are fixed to the suction nozzle module support plate. The synchronous belt is connected between the idler wheel and the stepper motor and connected to the stepper motor L-shaped clamps at both ends to ensure that the motor-suction nozzle module and the motor-gripper module can move up and down. The blade is clamped on the blade clamp. The suction nozzle set support plate is connected to the projector mounting plate by internal hex bolts and L-shaped connections to achieve a vertical placement effect. The projector mounting plate and the Z-axis moving platform are connected by four 100mm optical support rods. The projector is mounted on the projector mounting plate.

[0022] Preferably, the optical breadboard is fixed to the Y-axis moving platform by hexagonal bolts, and then the idler wheel and L-shaped connector 11 are fixed by hexagonal nuts. The feeding table and the feeding table support are connected by hexagonal nuts. The feeding table support is connected to the guide rail connecting plate by a slider connecting rod. The L-shaped arm is connected to the movable Z-axis by an L-shaped arm pad. The stepper motor, the liftable Z-axis platform, and the guide rail connecting plate are fixed to the optical breadboard by hexagonal bolts. The resin tank support plate and the optical breadboard can be connected by four 50mm optical support rods. The synchronous belt is connected between the idler wheel and the stepper motor and is connected to the slider connecting rod, so that the material table can move back and forth.

[0023] Preferably, the three-axis moving platform, projector, motor-nozzle module, stepper motor, motor-gripper module, and liftable Z-axis platform are all connected to a computer via a microcontroller, and the air duct channels of the motor-nozzle module and the nozzle are connected to a high-precision pressure control valve.

[0024] Preferably, the motor-nozzle module includes a connecting column, and a negative pressure suction component is fixed to the bottom of the connecting column by an extension assembly. The negative pressure suction component has a cross-shaped partition inside, which divides the negative pressure suction component into four equal parts. Rubber is fixed to the bottom edge of both the negative pressure suction component and the cross-shaped partition for sealing and buffering. Each of the four equal parts is connected to a negative pressure connecting pipe. One end of the negative pressure connecting pipe is connected to an annular negative pressure intermediate pipe, and a negative pressure device is connected to the annular negative pressure intermediate pipe to provide suction.

[0025] Preferably, a negative pressure detection chamber and four solenoid valves are provided between the negative pressure connecting pipe and the annular negative pressure intermediate pipe. One end of the multiple negative pressure connecting pipes is connected to the negative pressure detection chamber, and the four solenoid valves are fixed on the negative pressure detection chamber corresponding to the positions of the four negative pressure connecting pipes. The negative pressure detection chamber is connected to the annular negative pressure intermediate pipe through the solenoid valves.

[0026] Preferably, the negative pressure detection chamber is provided with several partitions and the negative pressure detection chamber is divided into four equal spaces by the several partitions. Each negative pressure connecting pipe is connected to one space. Each space is provided with a negative pressure detection component, and the negative pressure status is detected by the negative pressure detection component.

[0027] Preferably, the negative pressure detection assembly includes a mounting plate fixed to the outside of the negative pressure detection chamber. A metal telescopic component is elastically connected to the inside of the mounting plate via a spring and is placed in an independent space. When the external negative pressure equipment draws in negative pressure, the metal telescopic component retracts inward. A tactile switch is fixed to one side of the metal telescopic component near the mounting plate. A tactile switch is provided on the mounting plate. The tactile switch is moved by the retraction of the metal telescopic component, triggering the tactile switch to control the opening and closing of the corresponding solenoid valve.

[0028] The technical effects and advantages of this invention are as follows: 1. This invention breaks through the limitations of traditional multi-material 3D printing, which can only integrate electronic components and cannot embed drivers. It adopts a dual-mode embedding method of vacuum adsorption and pneumatic gripping, realizing the integrated manufacturing of micro-drivers, electronic components, high-precision conductive lines and structural substrates. The preparation of wires by mask scraping solves the problems of low precision and difficulty in adapting to micro-circuits in the direct writing method, improving interconnect reliability and miniaturization level. The direct embedding of mature drivers avoids the polarization process and performance degradation problems required for direct printing of piezoelectric materials, ensuring stable and reliable driving performance. Through in-situ wire making and closed-loop printing process, the risk of post-assembly errors and interconnect failures is eliminated, realizing the collaboration of driving-sensing-computing and printing as manufacturing. It can directly prepare micro-robots with programmable motion capabilities, significantly improving the functional integration, manufacturing precision and operational reliability of devices.

[0029] 2. By setting up the cross-shaped partition, the negative pressure suction stage in the dual-mode precise embedding of heterogeneous functional parts can be adapted to the suction position on the surface of the parts by using the segmented suction of the cross-shaped partition. When there is no smooth surface, the cross-shaped partition can adsorb the area on the smooth surface through multiple areas. The negative pressure adsorption causes the corresponding metal telescopic parts to contract under the negative pressure. When there is an obstruction or groove, the corresponding area will have a gap during negative pressure suction, and the corresponding metal telescopic parts will not be contracted enough to trigger the corresponding tactile switch. This allows us to identify whether the local negative pressure generation conditions are suitable. The tactile switch controls the opening and closing of the corresponding solenoid valve to close the suction in the grooved area. This avoids the situation where a gap in one part of the integrated suction causes the entire suction to be unstable. By automatically opening and closing the solenoid valve, the negative pressure power at the source remains unchanged, and the number of through holes at the negative pressure suction end is reduced. Similarly, the negative pressure distribution in the other three areas is larger, which also indirectly forms an automated negative pressure distribution effect. This achieves stable suction and fixation when the negative pressure suction range is maintained, and automatically increases the negative pressure in other areas when the negative pressure suction range is reduced, so as to ensure the fixation and stability of the components. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the multi-component 3D printing method of the present invention for realizing the integrated manufacturing of photosensitive resin material, driver, interconnecting wires and electronic components;

[0031] Figure 2 This is an overall structural diagram of the three-dimensional printing device of the present invention;

[0032] Figure 3 This is an isometric view of the three-dimensional printing device of the present invention;

[0033] Figure 4 This is a side view of the three-dimensional printing apparatus of the present invention;

[0034] Figure 5 This is a schematic diagram showing the separation of the image recognition and silver paste extrusion systems in the multi-component 3D printing device of the present invention;

[0035] Figure 6 This is a schematic diagram showing the separation of the scraper, the pick-up and place nozzle head, and the gripping system in the multi-component 3D printing device of the present invention.

[0036] Figure 7 This is a schematic diagram showing the separation of the component placement feeding platform and the photopolymerization printing system in the multi-component 3D printing device of the present invention;

[0037] Figure 8 This is a detailed structural diagram of the motor-nozzle module of the present invention;

[0038] Figure 9 This is a partial schematic diagram of the motor-nozzle module of the present invention;

[0039] Figure 10 This is an exploded view of the suction portion of the motor-nozzle module of the present invention;

[0040] Figure 11 For the present invention Figure 10 Enlarged view of a partial structure of section A in the middle;

[0041] Figure 12 This is a partial unfolded view of the motor-nozzle module of the present invention.

[0042] In the diagram: 1. Optical metal breadboard; 2. Scissor lift platform; 3. Z-axis moving platform; 4. X-axis moving platform; 5. Y-axis moving platform; 6. 100mm optical support rod; 7. Liftable Z-axis platform; 8. L-shaped arm pad; 9. L-shaped arm; 10. Synchronous belt; 11. L-shaped connector; 12. Idler pulley; 13. Stepper motor; 14. Detachable dispensing syringe clamp; 15. Dispensing syringe; 16. Microscope; 17. Microscope barrel clamp; 18. Projector mounting plate; 19. Nozzle module support plate; 20. Ultraviolet projector; 21. Blade holder; 22. Blade; 23. Motor-gripper module; 24. Motor-nozzle module; 2401. Annular negative pressure intermediate... 2402. Pipe; 2403. Negative pressure detection chamber; 2404. Negative pressure connecting pipe; 2405. Connecting column; 2406. Solenoid valve; 2407. Extension assembly; 2408. Negative pressure suction component; 2409. Cross-shaped partition; 2409. Negative pressure detection assembly; 24091. Mounting plate; 24092. Metal telescopic component; 24093. Spring; 24094. Tactile switch; 24095. Driven rod; 2410. Partition; 25. Stepper motor L-shaped clamp; 26. 50mm optical support rod; 27. Guide rail connecting plate; 28. Feeding platform support; 29. ​​Slider connecting rod; 30. Resin tank support plate; 31. Feeding platform for placing the component to be embedded; 32. Resin tank. Detailed Implementation

[0043] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0044] Example 1: As Figures 1-7 The method and apparatus for integrated molding of heterogeneous multi-component 3D printing shown herein include step one: pre-processing and path planning before printing.

[0045] A three-dimensional digital model including the microrobot structure, drive unit, circuit pattern, and electronic component placement locations is established, and layered slicing is performed to obtain photocurable cross-sectional data. A microscopic vision system is used to perform a full-area scan of the drivers, chips, resistors, capacitors, and other components in the feeding area. Image recognition is used to accurately obtain component type, coordinates, angles, and orientation information. The coordinated motion trajectory of the print head, pick-and-place mechanism, scraper, and dispensing system is planned, generating an integrated control program.

[0046] Step 2: Layer-by-layer photocuring and intermittent layer stop

[0047] The printing device starts according to a predetermined program. As shown in Figure 1, it first executes the conventional photopolymerization printing process: the printing platform is lowered along the Z-axis to a preset layer thickness, the digital light processing (DLP) projector is turned on, and the liquid photosensitive resin area is selectively exposed according to the slice data. After a few seconds of curing, a solid sheet is formed; the above "lowering-exposure-curing" process is repeated to build a three-dimensional polymer matrix structure layer by layer. When printing reaches the preset functional component embedding layer, the printing process automatically pauses and enters the functional unit embedding process.

[0048] Step 3: In-situ fabrication of high-precision functional circuits

[0049] In-situ molding of metal interconnect circuits is performed on the surface of the substrate structure. The dispensing printhead is controlled to move above a custom stainless steel mask, extruding a precise amount of conductive silver paste onto the mask surface. Subsequently, a squeegee is controlled to scrape the silver paste at a specific speed and angle, allowing it to seep through the precision gaps in the mask to the already cured polymer structure surface below, forming high-precision conductive wires consistent with the design pattern. The squeegee movement distance must be greater than the total width of the circuit while retaining edge redundancy (2-3 mm) to ensure complete coating. The scraping speed and angle can be determined based on rheological principles and the mask gap width. For fabricating circuits with a 150-micron linewidth, a speed range of 1 mm / s–5 mm / s and an angle range of 45°–60° are suitable. This step effectively overcomes the shortcomings of low circuit precision and poor uniformity in direct-write methods, achieving in-situ composite and reliable bonding between the conductive phase and the polymer matrix, eliminating the risk of contact resistance and interface failure during later assembly.

[0050] Step 4: Precise Embedding of Heterogeneous Functional Components in Dual Modes

[0051] Based on the geometry and mounting requirements of the components, the following two embedding operations are performed:

[0052] Operation A: Vacuum adsorption and flat placement of flat parts

[0053] For components that need to be laid parallel to the structural surface (such as chip resistors and capacitor chips), control the multi-degree-of-freedom pick-and-place printhead to move it directly above the target component. Lower the printhead to a point approximately 1 mm above the center of the component and stop. Activate the vacuum suction system to firmly lift the component using a negative pressure suction cup. Rotate the printhead to a preset angle to adjust the component's orientation; then move it to the predetermined target coordinate position, lower the printhead to a height difference of approximately 1 mm, release the positive pressure (or cut off the vacuum), and smoothly place the component on the wire or substrate surface. Repeat this process to complete the batch implantation of all flat-laid components.

[0054] Operation B: Mechanical clamping and erection of upright components

[0055] For piezoelectric actuators, micro actuators, and other drive units that require upright installation and directional force application, the pneumatic gripping mechanism is moved above the component. The gripper is lowered so that its opening completely covers the component, and positive pressure is applied to close the gripper jaws, achieving rigid clamping. The gripper is moved to a preset coordinate and rotated to a specific tilt or azimuth angle according to design requirements. Upon reaching the target position, negative pressure is applied to release the gripper, fixing the component vertically at the preset position. This process is repeated to complete the positioning and installation of all upright components.

[0056] Step 5: Subsequent curing and overall shaping

[0057] After all circuit diagrams and component embeddings are completed, the printing platform resumes its ascent. The standard photopolymerization printing process continues, covering and curing the entire structure with subsequent layers. Finally, under the influence of the light field, the conductive wires, functional components, and polymer matrix undergo physicochemical bonding at their interfaces, forming a highly bonded, dense, integrated microrobot component.

[0058] 3D printing devices such as Figure 2-7 As shown, the printing device consists of an optical metal breadboard 1, a scissor lift platform 2, a Z-axis moving platform 3, an X-axis moving platform 4, a Y-axis moving platform 5, a 100mm optical support rod 6, a liftable Z-axis platform 7, an L-shaped arm pad 8, an L-shaped arm 9, a synchronous belt 10, an L-shaped connector 11, an idler wheel 12, a stepper motor 13, a detachable dispensing syringe clamp 14, a dispensing syringe 15, a microscope 16, a microscope barrel clamp 17, a projector fixing plate 18, a nozzle module support plate 19, an ultraviolet projector 20, a blade clamp 21, a blade 22, a motor-gripper module 23, a motor-nozzle module 24, a stepper motor L-shaped clamp 25, a 50mm optical support rod 26, a guide rail connecting plate 27, a feeding platform support 28, a slider connecting rod 29, a resin tank support plate 30, a feeding platform 31 for placing the components to be embedded, and a resin tank 32. Among them, the L-shaped connector 11, the stepper motor L-shaped clamp 25, the blade clamp 21, the L-shaped arm pad 8 and the L-shaped arm 9 are made of aluminum alloy, while the other customized parts are made of acrylic sheet.

[0059] Optical breadboard 1 is fixed to the optical platform. Scissor lift platform 2 and Y-axis moving platform 5 are fixed to optical breadboard 1 with hex bolts. Then, X-axis moving platform 4 is fixed to liftable breadboard 2 with hex bolts, and Z-axis moving platform 3 is fixed to X-axis moving platform 4 with hex bolts. The three-axis platform is now installed. Next, components for the projector, pick-and-place, scraping, and microscopy functions are installed. The positive and negative pressure adjustable suction nozzle 15 is inserted into the detachable syringe clamp 14 and secured from the left side with a hex nut. The microscope 16 is inserted into the microscope barrel clamp 17 and secured with a hex nut. The microscope barrel clamp 17 is fixed to the projector mounting plate 18. The detachable syringe clamp 14, stepper motor 13, motor-suction nozzle module 24, motor-gripper module 23, stepper motor L-shaped clamp 25, idler wheel 12, and blade clamp 21 are fixed to the suction nozzle module support plate 19. A synchronous belt 10 connects the idler wheel 12 and the stepper motor. The motor-nozzle module 24 and the motor-gripper module 23 are connected to the stepper motor L-shaped clamps 11 at both ends to ensure that they can move up and down. The blade 22 is clamped on the blade clamp 21. The nozzle set support plate 19 is connected to the projector mounting plate 18 through the internal hex bolts and L-shaped connectors 11 to achieve a vertical placement effect. The projector mounting plate 18 and the Z-axis moving platform 3 can be connected through four 100mm optical support rods 6. After that, the projector 20 is installed on the projector mounting plate 18 (incorrect sequence will cause the projector 20 to fail to install). This part of the installation is completed. Then, the components that enable the printing function are installed. The optical breadboard 1 is fixed to the Y-axis moving platform 5 with hex bolts. The idler wheel 12 and the L-shaped connector 11 are fixed with hex nuts. The feeding table 31 and the feeding table support 28 are connected with hex nuts. The feeding table support 28 is connected to the guide rail connecting plate 27 through the slider connecting rod 29. The L-shaped arm 9 is connected to the movable Z-axis 7 through the L-shaped arm pad 8. The stepper motor 13, the liftable Z-axis platform 7, and the guide rail connecting plate 27 are fixed to the optical breadboard 1 with hex bolts. The resin tank support plate 30 and the optical breadboard 1 can be connected by four 50mm optical support rods 26. The synchronous belt 10 is connected between the idler wheel 12 and the stepper motor 13 and connected to the slider connecting rod 29, so that the material table can move back and forth. This part is now installed. The above three-axis moving platform, projector 20, motor-nozzle module 24, stepper motor 13, motor-grip module 23 and liftable Z-axis platform 7 are all connected to the computer via a microcontroller. The air channels of motor-nozzle module 24 and nozzle 15 are connected to a high-precision pressure control valve (not shown in the figure). Positive or negative pressure is applied using the pressure control valve, which is also connected to and controlled by the computer via a microcontroller.

[0060] The motor-nozzle module includes a connecting post 2404. A negative pressure suction component 2407 is fixed to the bottom of the connecting post 2404 via an extension assembly 2406. The negative pressure suction component 2407 has a cross-shaped partition 2408 inside, which divides the negative pressure suction component 2407 into four equal parts. Rubber is fixed to the bottom edge of both the negative pressure suction component 2407 and the cross-shaped partition 2408 for sealing and buffering. Each of the four equal parts is connected to a negative pressure connecting pipe 2403. One end of the negative pressure connecting pipe 2403 is connected to an annular negative pressure intermediate pipe 2401, and suction is provided by an external negative pressure device connected through the annular negative pressure intermediate pipe 2401.

[0061] A negative pressure detection chamber 2402 and four solenoid valves 2405 are also provided between the negative pressure connecting pipe 2403 and the annular negative pressure intermediate pipe 2401. One end of each negative pressure connecting pipe 2403 is connected to the negative pressure detection chamber 2402. The four solenoid valves 2405 are fixed to the negative pressure detection chamber 2402 corresponding to the positions of the four negative pressure connecting pipes 2403, and the negative pressure detection chamber 2402 is connected to the annular negative pressure intermediate pipe 2401 through the solenoid valves 2405. The negative pressure detection chamber 2402 is provided with several partitions 2410, dividing it into four equal spaces. Each negative pressure connecting pipe 2403 connects to one space. A negative pressure detection component 2409 is provided inside each space. The negative pressure state is detected by a negative pressure detection component 2409. The negative pressure detection component 2409 includes a mounting plate 24091 fixed to the outside of the negative pressure detection chamber 2402. A metal telescopic component 24092 is elastically connected to the inside of the mounting plate 24091 by a spring 24093 and is placed in an independent space. When the external negative pressure equipment draws in negative pressure, the metal telescopic component 24092 retracts inward. A driven rod 24095 is fixed to one side of the metal telescopic component 24092 near the mounting plate 24091. A tactile switch is provided on the mounting plate 24091. The driven rod 24095 is triggered by the retraction of the metal telescopic component 24092 to trigger the tactile switch 24094 to control the opening and closing of the corresponding solenoid valve 2405.

[0062] Example 2: Figure 1 , Figures 5-12As shown, by setting the cross-shaped partition 2408, the negative pressure suction stage of the dual-mode precise embedding of heterogeneous functional parts can be adapted to the suction position on the surface of the parts by using the segmented suction of the cross-shaped partition 2408. When there is no smooth surface, the cross-shaped partition 2408 can adsorb the area on the smooth surface through multiple regions. The negative pressure adsorption causes the corresponding metal telescopic component 24092 to contract under negative pressure. When there is an obstruction or groove, the corresponding area will have a gap during negative pressure suction, and the corresponding metal telescopic component 24092 cannot be contracted and the corresponding tactile switch 24094 cannot be triggered. This can identify whether the local negative pressure generation conditions are suitable. The tactile switch 24094 controls the corresponding solenoid valve 2405 to open and close, so that the area with the groove is closed for suction. This avoids the situation where a gap in one part of the integrated suction causes the entire suction to be unstable. By automatically opening and closing the solenoid valve 2405, the source negative pressure power remains unchanged, and the number of through holes at the negative pressure suction end is reduced. Similarly, the negative pressure distribution in the other three places is larger, which also indirectly forms an automated negative pressure distribution effect. This achieves stable suction and fixation when the negative pressure suction range is guaranteed, and automatically increases the negative pressure intensity in other areas when the negative pressure suction range is reduced, so as to ensure the fixation stability of the components and adapt to the adsorption and fixation of irregular surfaces.

[0063] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A heterogeneous multi-component integrated forming three-dimensional printing method, characterized by: The specific steps are as follows: S1. Establish a three-dimensional digital model including the micro-robot structure, drive unit, circuit pattern and electronic component placement positions, and complete layer slicing to obtain photocurable cross-sectional data; use a microscopic vision system to perform full-area scanning of the driver, chip, resistor, capacitor and other components in the feeding area, and accurately obtain the component type, coordinates, angle and posture information through image recognition, plan the coordinated motion trajectory of the print head, pick-and-place mechanism, scraper and dispensing system, and generate an integrated control program; S2, the printing device starts according to the predetermined program. First, it performs the conventional photopolymerization printing process: the printing platform is lowered along the Z-axis to a preset layer thickness, the digital light processing projector is turned on, and the liquid photosensitive resin area is selectively exposed according to the slice data. After a few seconds of curing, a solid sheet is formed. The above "lowering-exposure-curing" process is repeated to build a three-dimensional polymer matrix structure layer by layer. When the printing reaches the preset functional component embedding layer, the printing process is automatically paused and the functional unit embedding process begins. S3, in-situ forming of metal interconnect lines on the surface of the substrate structure; control the dispensing printhead to move above the customized stainless steel mask, and extrude a quantitative amount of conductive silver paste onto the surface of the mask; then control the scraper to scrape the silver paste at a certain scraping speed and scraping angle, so that the silver paste seeps through the precision gaps on the mask to the surface of the solidified polymer structure below, forming a high-precision conductive wire consistent with the design pattern. The distance the scraper moves must be greater than the total width of the line and edge redundancy must be retained. The scraping speed and angle are determined based on rheological principles and the width of the mask gap. S4, dual-mode precise embedding of heterogeneous functional components; Based on the geometry and mounting requirements of the components, the following two embedding operations are performed: S41: Vacuum adsorption and planar placement of flat-lying parts; For components that need to be laid parallel to the structural surface, control the multi-degree-of-freedom pick-and-place printhead to move directly above the target component; Lower the print head to a point approximately 1 mm above the center of the component and stop. Activate the vacuum suction system and use the negative pressure suction cup to firmly lift the component. Rotate the print head to a preset angle to adjust the component's orientation. Then move the print head to the predetermined target coordinate position, lower it to a point approximately 1 mm above the center, release the positive pressure, and place the component stably on the wire or substrate surface. Repeat this process to complete the batch implantation of all flat components. S42: Mechanical clamping and vertical mounting of upright components; For piezoelectric actuators, micro actuators, and other drive units that require upright installation and directional force application, the pneumatic gripper mechanism is moved above the component; the gripper is lowered so that its opening completely covers the component, and positive pressure is applied to drive the gripper claws to close, achieving rigid clamping; the gripper is moved to a preset coordinate and rotated to a specific tilt angle or azimuth angle according to design requirements; after reaching the target position, negative pressure is applied to release the gripper, so that the component is vertically fixed at the preset position; the operation is repeated to complete the positioning and installation of all upright components.

2. The heterogeneous multi-component integrated forming three-dimensional printing method according to claim 1, characterized in that: It also includes S5, after completing all circuit drawing and component embedding, the printing platform resumes its ascent; continues to execute the conventional photopolymerization printing process, covering and curing the entire structure with subsequent layers; finally, under the action of the light field, the conductive wires, functional components and polymer matrix interfaces undergo physical and chemical bonding to form an integrated micro-robot component with high bonding strength and dense structure.

3. A three-dimensional printing apparatus of heterogeneous multi-component integrated molding, which operates the method of claim 2, characterized by: Including a three-axis mobile platform; The three-axis moving platform includes an optical breadboard, which is fixed on an optical platform. A scissor lift platform and a Y-axis moving platform are fixed to the optical breadboard with hexagonal bolts. An X-axis moving platform is fixed to a liftable breadboard with hexagonal bolts. A Z-axis moving platform is fixed to the X-axis moving platform with hexagonal bolts. The three-axis platform has been installed.

4. The heterogeneous multi-component integrated formed three-dimensional printing device of claim 3, wherein: It also includes a positive and negative pressure adjustable suction nozzle, which is inserted into a detachable syringe clamp and secured from the left side with an internal hex nut. The microscope is inserted into a microscope barrel clamp and secured with an internal hex nut. The microscope barrel clamp is fixed to the projector mounting plate. The detachable syringe clamp, stepper motor, motor-suction nozzle module, motor-gripper module, stepper motor L-shaped clamp, idler wheel, and blade clamp are fixed to the suction nozzle module support plate. A synchronous belt is connected between the idler wheel and the stepper motor and connected to the stepper motor L-shaped clamps at both ends to ensure that the motor-suction nozzle module and the motor-gripper module can move up and down. The blade is clamped on the blade clamp. The suction nozzle set support plate is connected to the projector mounting plate by internal hex bolts and L-shaped connections to achieve a vertical placement effect. The projector mounting plate and the Z-axis moving platform are connected by four 100mm optical support rods. The projector is mounted on the projector mounting plate.

5. A heterogeneous multi-component integrated formed three-dimensional printing device according to claim 4, wherein: The optical breadboard is fixed to the Y-axis moving platform with hexagonal bolts. Then, the idler wheel and L-shaped connector 11 are fixed with hexagonal nuts. The feeding table and feeding table support are connected with hexagonal nuts. The feeding table support is connected to the guide rail connecting plate through the slider connecting rod. The L-shaped arm is connected to the movable Z-axis through the L-shaped arm pad. The stepper motor, the liftable Z-axis platform, and the guide rail connecting plate are fixed to the optical breadboard with hexagonal bolts. The resin tank support plate and the optical breadboard can be connected by four 50mm optical support rods. The synchronous belt is connected between the idler wheel and the stepper motor and is connected to the slider connecting rod, so that the material table can move back and forth.

6. A heterogeneous multi-component integrated formed three-dimensional printing device according to claim 5, wherein: The three-axis moving platform, projector, motor-nozzle module, stepper motor, motor-gripper module, and liftable Z-axis platform are all connected to the computer via a microcontroller. The air duct channels of the motor-nozzle module and the nozzle are connected to a high-precision pressure control valve.

7. The heterogeneous multi-component integrated formed three-dimensional printing device of claim 6, wherein: The motor-nozzle module includes a connecting column. A negative pressure suction component is fixed to the bottom of the connecting column via an extension assembly. The negative pressure suction component has a cross-shaped partition inside, which divides the negative pressure suction component into four equal parts. Rubber is fixed to the bottom edge of both the negative pressure suction component and the cross-shaped partition for sealing and buffering. Each of the four equal parts is connected to a negative pressure connecting pipe. One end of the negative pressure connecting pipe is connected to an annular negative pressure intermediate pipe, and a negative pressure device is connected to the annular negative pressure intermediate pipe to provide suction.

8. The heterogeneous multi-component integrated formed three-dimensional printing device of claim 7, wherein: A negative pressure detection chamber and four solenoid valves are also provided between the negative pressure connecting pipe and the annular negative pressure intermediate pipe. One end of the multiple negative pressure connecting pipes is connected to the negative pressure detection chamber, and the four solenoid valves are fixed on the negative pressure detection chamber corresponding to the positions of the four negative pressure connecting pipes. The negative pressure detection chamber is connected to the annular negative pressure intermediate pipe through the solenoid valves.

9. The heterogeneous multi-component integrated formed three-dimensional printing device of claim 8, wherein: The negative pressure detection chamber is equipped with several partitions, which divide the chamber into four equal parts. Each negative pressure connection pipe connects to one part of the chamber. Each part of the chamber is equipped with a negative pressure detection component, which is used to detect the negative pressure status.

10. The heterogeneous multi-component integrated formed three-dimensional printing device of claim 9, wherein: The negative pressure detection assembly includes a mounting plate fixed to the outside of the negative pressure detection chamber. A metal telescopic component is elastically connected to the inside of the mounting plate by a spring and is placed in an independent space. When the external negative pressure equipment draws in negative pressure, the metal telescopic component retracts inward. A driven rod is fixed to one side of the metal telescopic component near the mounting plate. A tactile switch is provided on the mounting plate. The driven rod moves due to the retraction of the metal telescopic component, triggering the tactile switch to control the opening and closing of the corresponding solenoid valve.

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