Semiconductor testing apparatus and inspection system

Abstract

This application relates to semiconductor testing apparatus and inspection system. The lower base unit includes: a lower base plate; a float plate that abuts against the lower base unit connector portion and is movable relative to the lower base plate in the mounting direction in which the substrate connector portion is mounted relative to the lower base unit connector portion; and a helical spring that is elastically deformable and is located between the lower base plate and the float plate in the mounting direction.

Description

Technical Field

[0001] This invention relates to semiconductor testing apparatus and inspection system. Background Technology

[0002] For example, Patent Document 1 discloses a wafer testing system comprising a test head and a probe station. The wafer testing system disclosed in Patent Document 1 includes a test head and a test head support and vibration damping device.

[0003] Prior art literature Patent documents Patent document 1: JP 2004-172551. Summary of the Invention

[0004] (The technical problem that the invention aims to solve) The wafer inspection system disclosed in Patent Document 1 includes a semiconductor testing apparatus for inspecting semiconductor integrated circuits, similar to the test head in Patent Document 1. The semiconductor testing apparatus includes multiple units such as performance board units and substrate units. These units have connectors that can be connected to each other, and are electrically connected by connecting the connectors. However, there are cases where the connectors do not fit together sufficiently due to dimensional errors, etc.

[0005] The present invention addresses the aforementioned problems and aims to enable more reliable connection between connectors in a semiconductor testing apparatus comprising multiple units connected by connectors.

[0006] (Technical solutions used to solve technical problems) A semiconductor testing apparatus according to a technical solution of the present invention includes: a first unit having a first connector portion; and a second unit having a second connector portion capable of connecting to the first connector portion. The first unit includes: a base portion; a movable portion for abutting the first connector portion and capable of moving relative to the base portion in a mounting direction in which the second connector portion is mounted relative to the first connector portion; and an elastically deformable portion capable of elastic deformation and located between the base portion and the movable portion in the mounting direction.

[0007] The inspection system according to one technical solution of the present invention includes: the above-mentioned semiconductor testing apparatus; and a test object transport device, which moves a test object provided with a semiconductor integrated circuit and connects it to the above-mentioned semiconductor testing apparatus.

[0008] (Invention effect) According to a technical solution of the present invention, in a semiconductor testing apparatus having multiple units connected by connectors, the connectors can be connected to each other more reliably. Attached Figure Description

[0009] Figure 1 This is a schematic diagram showing the general structure of an inspection system according to one embodiment of the present invention.

[0010] Figure 2 This is a perspective view of the tester according to one embodiment of the present invention.

[0011] Figure 3 This is an exploded perspective view of the tester according to one embodiment of the present invention.

[0012] Figure 4 This is a schematic exploded perspective view of the main body portion according to one embodiment of the present invention.

[0013] Figure 5 This is a schematic perspective view of a substrate unit according to one embodiment of the present invention.

[0014] Figure 6 This is a schematic exploded perspective view of a performance board unit according to one embodiment of the present invention.

[0015] Figure 7 This is a schematic exploded perspective view of the lower base unit in one embodiment of the present invention.

[0016] Figure 8 This is a schematic, partially enlarged perspective view of the lower base unit in one embodiment of the present invention, viewed from a slightly below-the-angle view.

[0017] Figure 9 yes Figure 8 A sectional view along line AA.

[0018] Figure 10 yes Figure 8 BB line section view.

[0019] Figure 11 This is a schematic enlarged cross-sectional view of the bolts of the lower base unit in one embodiment of the present invention.

[0020] Figure 12 This is a schematic enlarged cross-sectional view of the bolts of the lower base unit in one embodiment of the present invention.

[0021] Figure 13 This is a schematic enlarged cross-sectional view of the bolts of the lower base unit in one embodiment of the present invention.

[0022] Figure 14 This is a schematic enlarged cross-sectional view of a connector retaining pin according to one embodiment of the present invention.

[0023] Figure 15This is a schematic enlarged cross-sectional view of a connector retaining pin according to one embodiment of the present invention.

[0024] Figure 16 This is a schematic enlarged cross-sectional view of a connector retaining pin according to one embodiment of the present invention. Detailed Implementation

[0025] Hereinafter, an embodiment of the semiconductor testing apparatus and inspection system according to the present invention will be described with reference to the accompanying drawings.

[0026] Figure 1 This is a schematic diagram showing the general structure of the inspection system 1 according to this embodiment. The inspection system 1 of this embodiment uses a wafer W containing semiconductor circuitry as the test object to inspect the electrical characteristics of a semiconductor integrated circuit. Figure 1 As shown, the inspection system 1 includes a tester 2 (semiconductor testing apparatus) and a probe station 3 (test object transport device). The inspection system 1 inspects the electrical characteristics of each semiconductor circuit before dicing multiple semiconductor circuits formed on the wafer W into individual chips.

[0027] A probe card 4 is mounted on the tester 2. The probe card 4 has multiple probes. A probe stage 3 brings the multiple probes mounted on the probe card 4 into contact with the pads of multiple semiconductor circuits formed on the wafer W. The probe stage 3 includes a tester moving device 3a, a stage device 3b, and a wafer transport device 3c.

[0028] The tester moving device 3a has a moving mechanism (not shown) to move the tester 2 between the standby position 1A and the inspection position 1B. The stage device 3b supports the wafer W and aligns the tester 2, located at the inspection position 1B, with the wafer W. The stage device 3b can move in the planar direction along the horizontal plane, in the vertical direction perpendicular to the horizontal plane, and can rotate in the θ direction about the vertical axis. The wafer transport device 3c transports the wafer W onto the stage device 3b.

[0029] During inspection, the stage device 3b moves the wafer W, causing the pads of multiple semiconductor circuits formed on the wafer W to contact the tips of multiple probes on the probe card 4 located at the tester 2 at inspection position 1B. In this state, the tester 2 simultaneously inputs test signals to each semiconductor circuit using the multiple probes and receives output signals from each semiconductor circuit, thereby inspecting each semiconductor circuit.

[0030] Figure 2 This is a 3D view of tester 2. Additionally, Figure 3 These are exploded perspective views of tester 2. As shown in these figures, tester 2 includes a main body 2a and a performance board unit 2b. Furthermore, in Figure 2 as well as Figure 3The diagram shows a tester 2 positioned in standby position 1A. In standby position 1A, the tester 2 is positioned with the side holding the probe card 4 facing upwards. The following description is based on the orientation of the tester 2 in standby position 1A.

[0031] The main body 2a is a unit for signal processing and other tests for wafer W, and the performance board unit 2b is supported in a detachable manner. Figure 4 This is a schematic exploded perspective view of the main body 2a. (For example...) Figure 4 As shown, the main body 2a includes a main body housing 10, multiple substrate units 11 (second units), and a control processing unit 12.

[0032] The main housing 10 is a housing that houses the substrate unit 11 and the control processing unit 12. In this embodiment, the main housing 10 is formed as a box with an upward opening. Inside the main housing 10, a plurality of slots for inserting the substrate unit 11 are provided. The substrate unit 11 is inserted one by one into these slots, thereby being housed inside the main housing 10. In addition, a plurality of positioning pins 10a for performance board units are provided on the upper surface of the main housing 10. When the performance board unit 2b is mounted on the main body 2a from above, these positioning pins 10a are used to position the performance board unit 2b in the horizontal direction.

[0033] The substrate unit 11 is a substrate on which electronic components for various signal processing are mounted, and can be replaced according to the type of test performed on the wafer W. Figure 5 This is a schematic perspective view of the substrate unit 11. As shown in the figure, the substrate unit 11 includes a substrate body 11a, an upper plate 11b, and a substrate connector portion 11c (second connector portion).

[0034] The substrate body 11a is an electronic substrate, housed in the main body housing 10 with its front and back sides facing horizontally. For example... Figure 4 As shown, multiple substrate units 11 are arranged with their substrate bodies 11a facing each other. Furthermore, in this embodiment, the main body housing 10 is rectangular in shape when viewed from above. Each substrate body 11a is arranged along the long side of the main body housing 10 when viewed from above.

[0035] The upper plate 11b is a strip-shaped plate member connected to the upper end of each substrate body 11a. The upper plate 11b extends along the long side of the main body housing 10 when viewed from above. Each upper plate 11b is fixed with a substrate connector portion 11c. Furthermore, the upper plate 11b can be formed from a single strip-shaped plate member, or it can be formed by stacking multiple plate members.

[0036] Additionally, the upper plate 11b is provided with an insertion hole 11d (see reference) for the insertion of the connector retaining pin 35 (described later) of the performance board unit 2b from above. Figure 10 For each fixing part of the substrate connector 11c, two insertion holes 11d are provided. These two insertion holes 11d are configured to sandwich the fixing part of the substrate connector 11c between them. That is, for the upper plate 11b, twice the number of insertion holes 11d as the number of fixing parts of the substrate connector 11c are provided.

[0037] A substrate connector portion 11c is provided relative to each substrate body 11a. For example, one to three substrate connector portions 11c are provided relative to each substrate body 11a. Each substrate connector portion 11c is fixed relative to the upper plate 11b and electrically connected to the substrate body 11a. Such a substrate connector portion 11c can be connected to the lower base unit connector portion 34 (described later) of the performance board unit 2b. In this embodiment, the substrate connector portion 11c is a male connector and the lower base unit connector portion 34 is a female connector. However, it is also possible for the substrate connector portion 11c to be a female connector and the lower base unit connector portion 34 to be a male connector. The substrate unit 11 is electrically connected to the performance board unit 2b by connecting the substrate connector portion 11c to the lower base unit connector portion 34.

[0038] Each substrate unit 11 is housed inside the main body housing 10 by inserting its substrate body 11a into a slot provided in the main body housing 10. Furthermore, each substrate unit 11 is connected to wiring for electrical connection with the control processing unit 12. That is, each substrate unit 11 is electrically connected to the control processing unit 12 inside the main body housing 10.

[0039] The control processing unit 12 is connected to each substrate unit 11. Based on pre-stored test programs, the control processing unit 12 inputs control signals to each substrate unit 11. Furthermore, the control processing unit 12 can also process the signals input from each substrate unit 11. Additionally, a battery may be housed in the main housing 10. The control processing unit 12 may also include a power supply unit for supplying power from the battery to each substrate unit 11, etc.

[0040] The performance board unit 2b is detachable from the main body 2a and is fixed to the main body 2a by a locking mechanism (not shown). The performance board unit 2b is connected to the probe card 4 from above and can be electrically connected to the wafer W via the probe card 4. Figure 6 This is a schematic exploded perspective view of performance plate unit 2b. As shown in the figure, performance plate unit 2b includes a lower base unit 20 (first unit), a frame unit 21, an upper base unit 22, and a cover unit 23.

[0041] The lower base unit 20 is located below the upper base unit 22 and includes a lower base unit connector 34. The lower base unit 20 is electrically connected to the main body 2a by connecting the substrate connector 11c to the lower base unit connector 34. The lower base unit 20 will be described in more detail later.

[0042] The frame unit 21 is a frame-like component located between the lower base unit 20 and the upper base unit 22, forming a space between the lower base unit 20 and the upper base unit 22. For example, a flexible substrate (not shown) that connects the lower base unit connector portion 34 to the upper base unit connector portion 22b (described later) is accommodated in the space between the lower base unit 20 and the upper base unit 22.

[0043] The upper base unit 22 includes an upper base plate 22a and multiple upper base unit connector portions 22b. The upper base plate 22a is a plate member with its front and back facing vertically, and multiple upper base unit connector portions 22b are fixed thereon. The upper base unit 22 is fixed to and supported by the frame unit 21. The upper base unit connector portions 22b are connector portions that are electrically connected to the probe card 4, and each can connect to the probe card 4.

[0044] Cover unit 23 is a cover component that covers the performance plate unit 2b, the lower base unit 20, and the frame unit 21. For example... Figure 3 As shown, the performance plate unit 2b, the lower base unit 20, and the frame unit 21 are covered with the upper surface of the upper base unit 22 exposed.

[0045] The lower base unit 20 will be described in more detail. Figure 7 This is a schematic exploded perspective view of the lower base unit 20. Additionally, Figure 8 These are schematic, partially enlarged perspective views of the lower base unit 20 viewed from a slightly lower angle. As shown in these figures, the lower base unit 20 includes: a lower base plate 30 (base portion), a float plate 31 (movable portion), a coil spring 32 (elastic deformation portion), a bolt 33, a lower base unit connector portion 34 (first connector portion), and a connector fixing pin 35 (positioning pin).

[0046] The lower base plate 30 is a plate member that directly or indirectly supports the float plate 31, the helical spring 32, the bolt 33, the lower base unit connector 34, and the connector fixing pin 35. The lower base plate 30 is arranged with its front and back facing vertically. The lower base plate 30 is rectangular in shape when viewed from above, and positioning holes 30a are provided at three of its four corners for the insertion of positioning pins 10a for the performance plate unit. The positioning pins 10a for the performance plate unit are inserted into the positioning holes 30a of the lower base plate 30, thereby positioning the performance plate unit 2b relative to the main body 2a in the horizontal direction.

[0047] In addition, the lower base plate 30 is provided with a plurality of through openings 30b through which the lower base unit connector section 34 extends in the vertical direction. For example, Figure 7 As shown, the lower base plate 30 has a plurality of through openings 30b, each formed in a rectangular shape. In this embodiment, the lower base plate 30 has three through openings 30b. A plurality of lower base unit connector portions 34 arranged in one direction pass through each through opening 30b. Furthermore, the number of through openings 30b provided in the lower base plate 30 can be varied. In addition, the number of lower base unit connector portions 34 passing through one through opening 30b can also vary, for example, depending on the through opening 30b.

[0048] Figure 9 yes Figure 8 A sectional view along line AA. (e.g.) Figure 9 As shown, the lower base plate 30 is provided with bolt holes 30c for bolts 33 to be screwed in. Multiple bolt holes 30c are provided on both sides of the through opening 30b, sandwiching it between them. Multiple bolt holes 30c located on the same side relative to the through opening 30b are arranged along the arrangement direction of multiple lower base unit connector portions 34 that penetrate one through opening 30b.

[0049] The float plate 31 is a frame-shaped component that receives multiple lower base unit connector portions 34 from below. The float plate 31 is a movable part connected to the lower base plate 30 via a helical spring 32 and capable of moving vertically relative to the lower base plate 30. In this embodiment, the lower base unit connector portions 34 are mounted on the substrate connector portion 11c from below towards above. That is, the float plate 31 can move relative to the lower base plate 30 in the mounting direction in which the substrate connector portion 11c is mounted relative to the lower base unit connector portion 34.

[0050] In this embodiment, two floating plates 31 are provided relative to one through opening 30b of the lower base plate 30. That is, in this embodiment, the lower base unit 20 has six floating plates 31. However... Figure 7 as well as Figure 8 For ease of explanation, only one of the six floats 31 is shown in the diagram, and the other floats are omitted.

[0051] The float plate 31 is formed in the shape of a frame with a central opening 31a. The central opening 31a is configured to overlap with the through opening 30b of the lower base plate 30 when viewed from above and below, and is an opening through which the lower base unit connector portion 34 passes in the vertical direction. In this embodiment, the float plate 31 is formed to a size that allows multiple lower base unit connector portions 34 to pass through the central opening 31a.

[0052] Furthermore, for the float plate 31, multiple bolt openings 31b (openings) are provided on both sides of the central opening 31a, respectively, for the shaft portion 33a (described later) of the bolt 33 to pass through, such that the central opening 31a is sandwiched therebetween. As an example, for Figure 7 as well as Figure 8 The floating plate 31 shown is equipped with 6 bolts 33. Therefore, in this embodiment, for Figure 7 as well as Figure 8 The floating plate 31 shown is provided with 6 bolt openings 31b.

[0053] Additionally, the floating plate 31, for example, Figure 9 As shown, a spring abutment surface 31c is provided around each bolt opening 31b for the helical spring 32 to abut from above. In this embodiment, such a spring abutment surface 31c is located below the upper surface of the float plate 31. A recess 31d is provided on the float plate 31 corresponding to each bolt opening 31b. The bottom surface of this recess 31d is the spring abutment surface 31c. Furthermore, the portion of the lower surface of the float plate 31 located on the back side of the spring abutment surface 31c is the abutment surface of the head 33b of the bolt 33, which will be described later.

[0054] Figure 10 yes Figure 8 A BB-line sectional view. For example, as shown below. Figure 10 As shown, for the float 31, multiple pin insertion holes 31e are provided on both sides of the central opening 31a, for inserting the connector fixing pins 35, so as to sandwich the central opening 31a therebetween. As an example, for... Figure 7 as well as Figure 8 The floating plate 31 shown can accommodate eight connector retaining pins 35. Therefore, in this embodiment, for Figure 7 as well as Figure 8 The float plate 31 shown is provided with eight pin insertion holes 31e. In addition, the surface around the pin insertion holes 31e in the lower surface of the float plate 31 is the abutting surface of the protrusion 34a of the lower base unit connector 34, which will be described later.

[0055] The helical spring 32 is an elastically deformable portion that abuts against the lower base plate 30 from below at its upper end and against the float plate 31 from above at its lower end. That is, the helical spring 32 is positioned between the lower base plate 30 and the float plate 31, sandwiched between them in a vertical direction. The helical spring 32 is formed as a cylindrical shape through which the shaft portion 33a of the bolt 33 passes. The helical spring 32 can elastically deform by being compressed in the vertical direction and can apply force to the float plate 31 from above to below using its restoring force. As an example, for Figure 7 as well as Figure 8 The floating plate 31 shown is equipped with 6 bolts 33. Therefore, in this embodiment, for Figure 7 as well as Figure 8 The floating plate 31 shown is equipped with 6 helical springs 32.

[0056] Bolt 33 has a shaft portion 33a and a head 33b. For example, Figure 9 As shown, the shaft portion 33a has a front end portion 33c that screws into the lower base plate 30 and a shaft portion 33d with a larger diameter than the front end portion 33c. The front end portion 33c is inserted from below into the bolt hole 30c of the lower base plate 30. The shaft portion 33d is located between the front end portion 33c and the head 33b and passes through the cylindrical helical spring 32. The diameter of the shaft portion 33d is smaller than the diameter of the head 33b.

[0057] The head 33b is connected to the shaft portion 33a and can abut against the lower surface of the float plate 31 from below. The head 33b can restrict the movement of the float plate 31 from top to bottom. Furthermore, the mounting direction of the substrate connector portion 11c to the base unit connector portion 34, as described above, is from bottom to top. That is, the head 33b can restrict the movement of the float plate 31 in the opposite direction to this mounting direction, i.e., from top to bottom.

[0058] Furthermore, when the float plate 31 abuts from above, the head 33b is positioned to create a gap (referred to as the bolt position upper gap Sa) between the float plate 31 and the lower base plate 30. That is, the head 33b is positioned between the head 33b and the lower base plate 30 such that the float plate 31 can move from below to above (along the mounting direction along the substrate connector portion 11c to the lower base unit connector portion 34).

[0059] As an example, for Figure 7 as well as Figure 8 The floating plate 31 shown is equipped with 6 bolts 33. However, the number of bolts 33 provided for one floating plate 31 can be changed.

[0060] The lower base unit connector section 34 is a connector section for mounting the substrate connector section 11c of the substrate unit 11. Each lower base unit connector section 34 is electrically connected to the upper base unit connector section 22b of the upper base unit 22. The lower base unit connector section 34 electrically connects the substrate connector section 11c and the upper base unit connector section 22b by inserting into the substrate connector section 11c.

[0061] The lower base unit connector section 34 has a protrusion 34a at its lower part. The protrusion 34a is located below the float plate 31 and abuts against the lower surface of the float plate 31 from below. In addition, the protrusion 34a has a through hole 34b through which the connector fixing pin 35 passes. The protrusion 34a is configured to protrude outward from the main body of the lower base unit connector section 34 in a horizontal direction orthogonal to the arrangement direction of the plurality of lower base unit connector sections 34 passing through the same through opening 30b.

[0062] Two connector retaining pins 35 are provided for each lower base unit connector section 34. One connector retaining pin 35 is provided for each protrusion 34a of the lower base unit connector section 34. The connector retaining pin 35 passes through the through hole 34b of each protrusion. Additionally, the connector retaining pin 35 also passes through the pin insertion hole 31e of the float plate 31. That is, the protrusion through hole 34b and the pin insertion hole 31e are arranged overlapping when viewed from above, and the connector retaining pin 35 is inserted into both of these overlapping protrusion through holes 34b and pin insertion holes 31e. The float plate 31 through which the connector retaining pin 35 passes, and the lower base unit connector section 34, can move vertically.

[0063] Additionally, the connector uses a retaining pin 35, such as Figure 10 As shown, a flange portion 35a is provided. The flange portion 35a is a portion that protrudes radially outward toward the connector retaining pin 35. The flange portion 35a is located below the protrusion 34a of the lower base unit connector portion 34, so that the protrusion 34a of the lower base unit connector portion 34 abuts against it from above.

[0064] When the protrusion 34a of the lower base unit connector 34 abuts from above, the flange 35a is positioned to form a gap (referred to as the pin position upper gap Sb) between the float 31 and the lower base plate 30. That is, the flange 35a is positioned such that the float 31 and the lower base plate 30 can move from below to above (along the mounting direction along which the base plate connector 11c is mounted to the lower base unit connector 34). For example, the vertical dimension of the pin position upper gap Sb is the same as the vertical dimension of the bolt position upper gap Sa. Alternatively, the vertical dimension of the pin position upper gap Sb may be smaller than the vertical dimension of the bolt position upper gap Sa.

[0065] Additionally, the upper end of the connector retaining pin 35 is inserted from below into the threaded hole 30d of the lower base plate 30 and screwed into the lower base plate 30. Furthermore, the lower end of the connector retaining pin 35 is inserted from above into the insertion hole 11d provided in the substrate unit 11.

[0066] Next, in the inspection system 1 of this embodiment, referring to Figures 11-16 To explain the operation when the performance plate unit 2b is installed on the main body 2a.

[0067] Figures 11-13 This is a schematic enlarged sectional view including the bolts 33 of the lower base unit 20. Figure 11 The illustration shows the float 31 positioned at its lowest point between the head 33b and the lower base plate 30. Figure 11 The position of the floating plate 31 shown is called the lowest position. Additionally, Figure 12 The diagram illustrates the state in which the float 31 is positioned between the head 33b and the lower base plate 30. Figure 12 The position of the floating plate 31 shown is called the middle position. Figure 13 The illustration shows the float 31 positioned at the top between the head 33b and the lower base plate 30. Figure 11 The position of the floating plate 31 shown is called the uppermost position.

[0068] Figures 14-16 This is a schematic enlarged cross-sectional view of the connector retaining pin 35, including the lower base unit 20. Figure 14 The illustration shows the float 31 positioned at its lowest point between the flange 35a and the lower base plate 30. Figure 14 The position of the floating plate 31 shown is... Figure 11 The bottom position shown is consistent. Additionally, Figure 15 The illustration shows the floating plate 31 positioned between the flange portion 35a and the lower base plate 30. Figure 15 The position of the floating plate 31 shown is... Figure 12 The middle positions shown are consistent. Additionally... Figure 16 The illustration shows the float 31 positioned at its uppermost position between the flange 35a and the lower base plate 30. Figure 16 The position of the floating plate 31 shown is... Figure 13 The top position shown is consistent.

[0069] When the base unit connector section 34 is not equipped with the base plate connector section 11c, for example, due to the force of the helical spring 32, the weight of the float plate 31, and the weight of the lower base unit connector section 34, such as Figure 11 as well as Figure 14 As shown, the float 31 is located at the lowest position. At this time, Figure 11 The dimensions of the gap Sa above the bolt position shown are... Figure 14 The size of the gap Sb above the pin position shown becomes the largest.

[0070] Next, the performance plate unit 2b is installed on the main body 2a. For example, with the main body 2a mounted, the performance plate unit 2b is removed from above and attached to the upper surface of the main body 2a, and the performance plate unit 2b is fixed relative to the main body 2a by a locking mechanism (not shown).

[0071] Here, the lower base unit connector portion 34 is mounted to the substrate connector portion 11c from above. That is, the substrate connector portion 11c is mounted to the lower base unit connector portion 34 from below and upwards.

[0072] For example, there may be cases where the position of the substrate connector portion 11c relative to the mounting position of the substrate body 11a is lower than the design value, or where the mounting position of the substrate unit 11 relative to the main body housing 10 is lower than the design value. In such cases, the floating plate 31, for example, remains at the lowest position and is connected to the substrate connector portion 11c.

[0073] On the other hand, when the mounting position of the substrate connector portion 11c relative to the substrate body 11a and the mounting position of the substrate unit 11 relative to the main body housing 10 are within the design value range, such as Figure 12 as well as Figure 15 As shown, the float 31 is, for example, in the middle position. This is because the lower base unit connector 34 is lifted by the base plate connector 11c, and the helical spring 32 is elastically deformed in a compressed manner.

[0074] Furthermore, if the mounting position of the substrate connector 11c relative to the substrate body 11a and the mounting position of the substrate unit 11 relative to the main body housing 10 are higher than the design value range, such as Figure 13 as well as Figure 16 As shown, the float 31 is, for example, in the uppermost position. This is because the lower base unit connector 34 is further lifted by the base plate connector 11c, and the helical spring 32 is further compressed.

[0075] As described above, the tester 2 of this embodiment includes a lower base unit 20 and a base plate unit 11. The lower base unit 20 has a lower base unit connector 34. The base plate unit 11 has a base plate connector 11c that can be connected to the lower base unit connector 34. Furthermore, the lower base unit 20 includes a lower base plate 30, a float plate 31, and a helical spring 32. The float plate 31 is abutted against by the lower base unit connector 34. Additionally, the float plate 31 is movable relative to the lower base plate 30 in the mounting direction in which the base plate connector 11c is mounted relative to the lower base unit connector 34. The helical spring 32 is elastically deformable and is positioned between the lower base plate 30 and the float plate 31 in the mounting direction.

[0076] According to the tester 2 of this embodiment, the float 31 can move relative to the substrate unit 11 in the vertical direction (mounting direction). That is, as described above, the float 31 can move to different positions such as the lowest position, the middle position, and the highest position. Therefore, according to the tester 2 of this embodiment, for example, when the position of the substrate connector portion 11c is lower than the designed target value due to dimensional errors, etc., by placing the float 31 in the lowest position, the substrate connector portion 11c and the lower base unit connector portion 34 can be more reliably engaged. In addition, according to the tester 2 of this embodiment, for example, when the position of the substrate connector portion 11c is higher than the designed target value due to dimensional errors, etc., by placing the float 31 in the highest position, the substrate connector portion 11c and the lower base unit connector portion 34 can be more reliably engaged. In addition, for example, when the position of the substrate connector portion 11c is the designed target value, by placing the float 31 in the middle position, the substrate connector portion 11c and the lower base unit connector portion 34 can be more reliably engaged. Therefore, according to the tester 2 of this embodiment, the connectors (in this embodiment, the substrate connector 11c and the lower base unit connector 34) can be connected to each other more reliably in the tester 2 which has multiple units connected by using connectors.

[0077] Furthermore, in the tester 2 of this embodiment, the lower base unit 20 includes a bolt 33 for fixing the shaft portion 33a to the lower base plate 30. For example, the float plate 31 is provided with a bolt opening 31b through which the shaft portion 33a passes. Additionally, for example, the coil spring 32 is formed into a cylindrical shape through which the shaft portion 33a passes and is located between the lower base plate 30 and the float plate 31.

[0078] According to the tester 2 of this embodiment, the shaft portion 33a through which the bolt 33 passes is located in the helical spring 32, thus preventing the helical spring 32 from coming out of the bolt 33 and enabling reliable positioning of the helical spring 32.

[0079] Furthermore, in the tester 2 of this embodiment, the bolt 33 has a head 33b connected to the shaft portion 33a. Additionally, the head 33b can restrict the movement of the float 31 in the direction opposite to the installation direction. Furthermore, the head 33b is positioned between the head 33b and the lower base plate 30, allowing the float 31 to move along the installation direction.

[0080] According to the tester 2 of this embodiment, the movable distance of the float 31 in the vertical direction can be determined based on the position of the head 33b. Therefore, by adjusting the position of the head 33b by changing the tightening amount of the bolt 33 on the base plate 30, the movable distance of the float 31 in the vertical direction can be easily adjusted.

[0081] Furthermore, in the tester 2 of this embodiment, the lower base unit 20 includes a connector retaining pin 35 that can be inserted into the base plate unit 11. Additionally, the helical spring 32, viewed from the mounting direction, is positioned differently from the connector retaining pin 35.

[0082] According to the tester 2 of this embodiment, it is not necessary to provide a helical spring 32 around the connector retaining pin 35. Therefore, according to the tester 2 of this embodiment, a helical spring 32 can be provided regardless of the shape of the connector retaining pin 35.

[0083] Furthermore, in the tester 2 of this embodiment, a plurality of helical springs 32 are provided for each float 31. According to the tester 2 of this embodiment, the load on the float 31 can be distributed among the plurality of helical springs 32, thereby reducing the load on the helical springs 32.

[0084] Furthermore, in the tester 2 of this embodiment, multiple lower base unit connector sections 34 abut against a single float plate 31. According to this embodiment of the tester 2, a single float plate 31 is provided relative to the multiple lower base unit connector sections 34. For example, a single float plate 31 can also be provided relative to each lower base unit connector section 34. As in this embodiment, by providing a single float plate 31 relative to the multiple lower base unit connector sections 34, the structure of the lower base unit 20 can be simplified.

[0085] Furthermore, the inspection system 1 of this embodiment includes a tester 2 and a probe station 3. The probe station 3 moves the wafer W, on which a semiconductor integrated circuit is disposed, to connect with the tester 2.

[0086] According to the inspection system 1 of this embodiment, since it is equipped with a tester 2, the connector parts (in this embodiment, the substrate connector part 11c and the lower base unit connector part 34) can be connected to each other more reliably.

[0087] It should be understood that although preferred embodiments of the present invention have been described and illustrated above, these are merely illustrative examples and should not be considered as limiting the invention. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the invention. Therefore, the present invention should not be considered limited by the foregoing description, but rather by the scope of the technical solution.

[0088] For example, in the above embodiments, an example of applying the present invention to an inspection system having a probe station 3 as a test object transport device has been described. However, the present invention is not limited thereto. For example, the present invention can also be applied to an inspection system having a sorter as a test object transport device. In the case of applying the present invention to an inspection system having a sorter, the tester 2 is moved relative to the sorter, and the tester 2 is connected to the wafer via a probe card.

[0089] Furthermore, the test object is not limited to a wafer. For example, the test object can also be a packaged device. In such cases, the tester 2 is connected to the device via a test socket.

[0090] Furthermore, in the above embodiment, the structure in which the elastic deformation part is a helical spring 32 has been described. However, the present invention is not limited thereto. For example, it can also be configured such that the elastic deformation part is a type of spring different from a helical spring, or that the elastic deformation part is a rubber structure.

[0091] Furthermore, in the above embodiment, the structure in which the first unit is the lower base unit 20 and the second unit is the substrate unit 11 has been described. However, the present invention is not limited thereto. That is, when the tester 2 has multiple units, the choice of which unit is the first unit and which unit is the second unit can be arbitrarily set.

[0092] (Explanation of reference numerals in the attached image) 1 Inspection System 2. Tester (Semiconductor Testing Equipment) 2a Main body 2b performance board unit 3. Probe station (test object transport device) 10 Main body shell 11. Substrate unit (second unit) 11a substrate body 11b upper plate 11c board connector section (second connector section) 11d insertion hole 20 Lower base unit (first unit) 30 Lower base plate (base section) 30a positioning hole 30b Through Opening 30c bolt hole 30d threaded hole 31. Floating plate (movable part) 31a Central opening 31b bolt with an opening (opening) 31c spring contact surface 31e pin insertion hole 32 Helical Spring (Elastic Deformation Section) 33 bolts 33a shaft section 33b head 34 Lower base unit connector section (first connector section) 34a protrusion 34b Protrusion Through Hole 35 connector retaining pin (positioning pin) 35a flange portion W wafer (test subject).

Claims

1. A semiconductor testing apparatus, comprising: The first unit, having a first connector portion; and The second unit has a second connector portion that can be connected to the first connector portion. The first unit has: Base section; A movable part, which abuts against the first connector part and is movable relative to the base part in the mounting direction in which the second connector part is mounted relative to the first connector part; and An elastically deformable portion, capable of elastic deformation, is located between the base portion and the movable portion in the mounting direction.

2. The semiconductor testing apparatus according to claim 1, wherein, The first unit includes a bolt, and the shaft portion of the bolt is fixed to the base portion. The movable part is provided with an opening through which the shaft part passes. The elastically deformable portion is formed into a cylindrical shape through which the shaft portion passes. The elastically deformable portion is located between the base portion and the movable portion.

3. The semiconductor testing apparatus according to claim 2, wherein, The bolt has a head that connects to the shaft portion. The head can restrict the movement of the movable part in the opposite direction to the mounting direction, and is positioned between the head and the base to allow the movable part to move along the mounting direction.

4. The semiconductor testing apparatus according to any one of claims 1 to 3, wherein, The first unit has a positioning pin that can be inserted into the second unit. Viewed from the installation direction, the elastically deformable portion is positioned at a different location than the locating pin.

5. The semiconductor testing apparatus according to any one of claims 1 to 3, wherein, Each movable part is provided with a plurality of elastic deformation parts.

6. The semiconductor testing apparatus according to any one of claims 1 to 3, wherein, Multiple first connector portions abut against one of the movable portions.

7. An inspection system, comprising: The semiconductor testing apparatus according to any one of claims 1 to 3; and A test object transport device that moves a test object equipped with a semiconductor integrated circuit to connect it to the semiconductor test apparatus.

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