A power thick film discharge resistor for vehicles and a processing apparatus thereof

Abstract

This invention discloses a thick-film power discharge resistor for automotive applications and its processing equipment, relating to the field of resistor processing technology. The resistor comprises an insulating substrate, a thick-film electrode layer, a thick-film resistor layer, an insulating pad, leads, a silicone layer, a shell, and an encapsulation layer. The thick-film electrode layer is printed on the upper surface of the insulating substrate and consists of input and output electrodes. The thick-film resistor layer is also printed on the upper surface of the insulating substrate and connects the two ends of the thick-film electrode layer. A thick-film protective layer is printed on the upper surface of the insulating substrate, covering the resistor layer. The insulating pad is bonded to the surface of the insulating substrate. Using thick-film power resistor technology, a ceramic substrate is directly used as the bottom surface. Because the resistor element is printed on the ceramic surface, the resistor generates a large amount of heat during operation. The ceramic substrate directly contacts the heat sink, which can quickly conduct away the heat generated during operation, allowing the resistor to achieve greater continuous power.

Description

Technical Field

[0001] This invention relates to the field of resistor processing technology, and in particular to a thick-film discharge resistor for automotive power applications, its processing equipment, and its recycling process. Background Technology

[0002] With the rapid development of the new energy vehicle industry, the performance requirements of vehicle electronic systems for power resistors are becoming increasingly stringent, especially for resistors used for DC bus capacitor discharge. These resistors need to possess high power dissipation capability, good thermal stability, vibration and shock resistance, and adaptability to extreme vehicle environments (high and low temperatures, high humidity, electrical stress). Currently, automotive discharge resistors are mainly divided into two categories: wire-wound resistors and ordinary thick-film resistors.

[0003] Existing automotive thick-film discharge resistors mostly adopt traditional packaging structures with unreasonable heat dissipation designs. Heat cannot be quickly conducted to external heat dissipation components, which further aggravates the heat loss of the resistor. Summary of the Invention

[0004] The purpose of this invention is to provide a thick-film discharge resistor for automotive power applications, its processing equipment, and recycling process, in order to solve the problem of unreasonable heat dissipation design in the prior art, which prevents heat from being quickly conducted to external heat dissipation components and further exacerbates the heat loss of the resistor.

[0005] The technical problem to be solved by this invention can be achieved through the following technical solution: A thick-film discharge resistor for automotive applications includes an insulating substrate, a thick-film electrode layer, a thick-film resistor layer, an insulating pad, a lead-out terminal, a silicone layer, a housing, and an encapsulation layer. The thick-film electrode layer is printed on the upper surface of the insulating substrate and is divided into input electrodes and output electrodes. The thick-film resistor layer is printed on the upper surface of the insulating substrate and connects the two ends of the thick-film electrode layer. The thick-film protective layer is printed on the upper surface of the insulating substrate and covers the resistor layer. The insulating pad is bonded to the surface of the insulating substrate.

[0006] Preferably, the insulating substrate is made of high-purity alumina or aluminum nitride. The thick film electrode layer is printed using a high palladium-silver alloy paste. The lead-out terminal includes three lead-out methods: pin, connector, or wire.

[0007] A processing equipment for automotive power thick film discharge resistors includes a processing table, a storage mechanism fixedly provided on the processing table, a dispensing mechanism slidably provided on one side of the storage mechanism, and a splicing mechanism slidably provided on the other side of the storage mechanism. The splicing mechanism includes a liftable mounting back plate, and the mounting back plate is provided with several sets of clamping mechanisms. The clamping mechanism includes an openable first clamping plate and a second clamping plate, and a push plate is slidably provided between the first clamping plate and the second clamping plate. The storage mechanism includes a support assembly, which includes a support side plate, and a plurality of support components are fixedly mounted on the support side plate. The dispensing mechanism includes several sets of dispensing ports. Preferably, the processing table includes a table surface, on which a first threaded rod is rotatably provided and a first limiting rod is fixedly provided. One end of the first threaded rod is fixedly connected to the output end of the motor, the motor is fixedly connected to the table surface, and the splicing mechanism is threadedly engaged with the first threaded rod and slidably engaged with the first limiting rod.

[0008] Preferably, the splicing mechanism includes a first mounting plate, which is threadedly engaged with a first threaded rod and slidably engaged with a first limiting rod. The first mounting plate is provided with a liftable mounting back plate, which is lifted by a cylinder. The mounting back plate is provided with several sets of clamping mechanisms for clamping and fixing insulating pads. The structures of the several sets of clamping mechanisms are identical.

[0009] Preferably, the mounting back plate is provided with a plurality of snap-fit ​​grooves for snapping in insulating gaskets. The mounting back plate is connected to the snap-fit ​​grooves by a mounting groove. A first clamping plate and a second clamping plate are symmetrically and slidably arranged on both sides of the snap-fit ​​groove in the mounting groove. A push plate is slidably arranged in the mounting groove at the middle position of the first clamping plate and the second clamping plate. The length of the push plate is greater than or equal to the length of the insulating gasket.

[0010] Preferably, a sealing plate is fixedly provided on the side of the mounting back plate, and a first gear and a second gear are rotatably provided on the sealing plate outside the mounting back plate. The first gear and the second gear are respectively rotated with the sealing plate through a first connecting shaft and a second connecting shaft. The first gear is also coaxially and fixedly provided with a third gear through the first connecting shaft, and the second gear is coaxially and fixedly provided with a fourth gear through the second connecting shaft. A first rack is fixedly provided on the first clamping plate, wherein the first rack meshes with the third gear for transmission. A second rack is coaxially and fixedly provided on the second clamping plate, wherein the second rack meshes with the fourth gear for transmission. A vertical rod is fixedly provided on the side of the push plate, and a third rack and a fourth rack are symmetrically provided at both ends of the vertical rod, wherein the third rack meshes with the first gear for transmission, and the fourth rack meshes with the second gear for transmission.

[0011] Preferably, the push plates on the clamping mechanisms are all fixedly connected to the positioning rods, and the mounting back plate is interactively connected to the positioning rods through a telescopic mechanism. The telescopic mechanism includes a cylinder, and the mounting back plate is also fixedly provided with a connecting rod that passes through the inside of the storage mechanism and is fixedly connected to the dispensing mechanism.

[0012] Preferably, the dispensing mechanism includes a connector, which is fixedly connected to the connecting rod, that is, the dispensing mechanism moves synchronously with the splicing mechanism. A glue box is fixedly provided on the connector, and the glue box is provided with a number of glue outlets. The number of glue outlets are arranged in an equidistant array, and each group of glue outlets is provided with at least one set of outlet tubes.

[0013] Preferably, the storage mechanism includes a bottom support with a through slot, where both the connector and the connecting rod can move. The bottom support is provided with a support assembly for storing insulating substrates in layers. The support assembly is slidably engaged with the bottom support. The support assembly includes a support side plate with several sets of support components fixedly mounted on it. Each support component includes several sets of support plates. Several insertion slots are provided on the support side plate between the several sets of support components. One side of the bracket side plate is provided with a U-shaped groove, and the other end of the bracket side plate is provided with a sealing strip. The bottom of several support components is provided with positioning plates or positioning grooves. The positioning grooves or positioning plates are straight grooves, and the spacing of the straight grooves is adapted to the size of the insulating gasket.

[0014] The beneficial effects of this invention are: 1. This invention provides a thick-film power discharge resistor for automotive applications. Utilizing thick-film power resistor technology, a ceramic substrate is directly used as the bottom surface. Since the resistive element is printed on the ceramic surface, the resistor generates a significant amount of heat during operation. The ceramic substrate directly contacts the heat sink, enabling rapid heat dissipation and allowing the resistor to achieve greater continuous power. The leads can be provided in various ways, including pin-type, plug-in type, and lead-wire type, suitable for multiple installation methods. Customization is also available upon request, ensuring high market compatibility. An insulating pad is added to the surface of the insulating substrate to address the insufficient strength of the insulating substrate as the bottom, improving the reliability of the resistor substrate. A high-reliability automotive plastic shell is used, which is resistant to deformation under high temperatures during long-term use, offering both lightweight design and high reliability. Furthermore, multiple reinforcing ribs are added inside the shell to increase the bonding strength between the encapsulation layer and the shell, improving the overall vibration resistance of the resistor.

[0015] 2. The invention also proposes a resistor processing equipment, mainly used to achieve the bonding of insulating pads and insulating substrates. The processing equipment includes a splicing mechanism and a storage mechanism. The splicing mechanism is used to place and move the insulating pads, and the storage mechanism is used to place the insulating substrates in layers. The splicing mechanism is also equipped with several sets of synchronously opening and closing clamping mechanisms for synchronously clamping and lowering the insulating pads, thereby achieving the splicing of the insulating pads and insulating substrates. The clamping mechanism is also equipped with a movable push plate to realize the movement of the insulating pads on the insulating substrates. The insulating pads and insulating substrates achieve better splicing. At the same time, the relative displacement between the insulating pads and insulating substrates can better eliminate air bubbles inside the adhesive, resulting in a better bonding effect. The invention has a simple structure and strong functionality, and can simultaneously meet the bonding processing of multiple sets of insulating pads and insulating substrates. After the bonding processing, the bracket assembly can be directly removed for individual heat curing, making the resistor processing efficiency higher. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the resistor housing structure of the present invention; Figure 2 This is a cross-sectional view of the internal structure of the resistor of the present invention; Figure 3 This is a front view of the cross-sectional view of the internal structure of the resistor in this invention; Figure 4 This is a schematic diagram of the overall structure of the processing equipment in this invention. Figure 1 ; Figure 5 This is a front view of the processing equipment portion of the present invention; Figure 6 This is an enlarged schematic diagram of part A of the structure in this invention; Figure 7 This is a schematic diagram of the overall structure of the processing equipment in this invention. Figure 2 ; Figure 8 This is an enlarged schematic diagram of part B of the structure in this invention; Figure 9 This is a front view of the processing equipment of the present invention; Figure 10 This is an enlarged schematic diagram of part C of the present invention; Figure 11 This is a schematic diagram of part of the processing equipment of the present invention. Figure 1 ; Figure 12 This is an enlarged schematic diagram of part D of the present invention; Figure 13 This is a schematic diagram of part of the processing equipment of the present invention. Figure 2 ; Figure 14 This is an enlarged schematic diagram of part E of the present invention.

[0017] Explanation of reference numerals in the attached figures: 100. Processing table; 200. Assembly mechanism; 300. Storage mechanism; 400. Dispensing mechanism; 500. Resistor; 101. Tabletop; 102. First limit rod; 103. Motor; 201. First mounting plate; 202. Mounting back plate; 203. Mounting slot; 204. First clamping plate; 205. Second clamping plate; 206. Push plate; 207. Positioning rod; 208. Vertical rod; 209. Third rack; 210. Fourth rack; 211. First gear; 212. Third gear; 213. First connecting shaft; 214. First rack; 215. Second gear; 21 6. Second connecting shaft; 217. Fourth gear; 218. Second rack; 219. Connecting rod; 220. Telescopic mechanism; 221. Sealing plate; 301. Bottom support; 302. Through slot; 303. Support side plate; 304. Insertion slot; 305. Support assembly; 306. Sealing strip; 307. U-shaped groove; 401. Glue box; 402. Glue outlet; 403. Connector; 501. Outer shell; 502. Lead-out end; 503. Insulating substrate; 504. Thick film electrode layer; 505. Thick film resistor layer; 506. Insulating gasket; 507. Silicone layer; 508. Encapsulation layer. Detailed Implementation

[0018] The specific embodiments of the present invention will be described in detail below, but it should be understood that the scope of protection of the present invention is not limited to the specific embodiments.

[0019] like Figure 1 , Figure 2 and Figure 3 The image shows a thick-film discharge resistor 500 for automotive applications, comprising an insulating substrate 503, a thick-film electrode layer 504, a thick-film resistive layer 505, an insulating pad 506, a lead 502, a silicone layer 507, a housing 501, and an encapsulation layer 508. The insulating substrate 503 is made of high-purity alumina or aluminum nitride. The thick-film electrode layer 504 is printed on the upper surface of the insulating substrate 503 and consists of an input electrode and an output electrode. The thick-film resistive layer 505 is printed on the upper surface of the insulating substrate 503 and connects the two ends of the thick-film electrode layer 504. A thick-film protective layer is printed on the upper surface of the insulating substrate 503, covering the resistive layer. The lead 502 is soldered to the electrode layer and extends to the outside of the encapsulation layer 508. The housing 501 is mounted on the insulating substrate 503, and the encapsulation layer 508 covers the space between the housing 501 and the insulating substrate 503, sealing the thick-film resistive layer 505 and the electrode layer.

[0020] Furthermore, the thickness of the insulating substrate 503 is 0.8 to 1.5 mm, and it is made of high-purity alumina (Al2O3) or aluminum nitride (AlN). The thermal conductivity of the insulating substrate 503 made of aluminum nitride is not less than 180 W / (mK), and the thermal conductivity of the insulating substrate 503 made of alumina is not less than 30 W / (mK). This can significantly improve the heat conduction efficiency, quickly conduct the heat generated by the thick film resistor layer 505, and avoid heat accumulation.

[0021] Furthermore, the thick film electrode layer 504 is printed using a high palladium-silver alloy paste, with a thickness of 20–60 μm. The contact resistance between the thick film electrode layer 504 and the thick film resistor layer 505 is no greater than 5 mΩ, ensuring smooth current transmission and reducing contact loss. The palladium content in the palladium-silver alloy paste is 10%–20%, which forms a dense, low-porosity electrode layer after sintering to prevent electrode oxidation and sulfidation, thereby improving welding reliability and corrosion resistance.

[0022] Furthermore, the thick film resistor layer 505 is printed using a specially optimized resistor paste, which is a mixture of precious metal powder, glass powder, ceramic powder, and modifying additives. The precious metal powder is palladium-silver alloy powder, with an addition amount of 30% to 50%, and the modifying additives are anti-sulfurization agents and anti-silver migration agents, with an addition amount of 5% to 10%. The thickness of the thick film resistor layer 505 is 10 to 50 μm. Through innovative sintering process and precision laser trimming technology, the resistance value range is 10Ω to 1MΩ, with a tolerance of ±5% or ±10%, and a temperature coefficient (TCR) of ±100ppm / K or ±150ppm / K. This effectively improves the sulfur resistance, resistance stability, and power carrying capacity of the thick film resistor layer 505, and avoids silver migration and sulfurization failure problems.

[0023] Furthermore, the thickness of the insulating pad 506 is 0.8 to 1.5 mm, and it is made of high-purity alumina (Al2O3). The thermal conductivity of the alumina insulating pad 506 is not less than 30 W / (m·K). It is attached to the surface of the insulating substrate 503 by an adhesive process, which can significantly improve the stress strength of the insulating substrate 503 and avoid substrate damage caused by improper installation.

[0024] Furthermore, the lead-out terminal 502 is made of oxygen-free copper, and the specially designed package 501 allows for three lead-out methods: pins, leads, or wires. The lead thickness for the pin-type lead-out is 0.8–1.2 mm; the lead thickness for the screw-mount and lead-mount methods is 0.8–1.2 mm; and the wire for the connector-mount and lead-mount methods is 0.5–1.5 mm² silicone wire. The length and terminal type can be customized as needed. These three structural designs on the package 501 enable three lead-out terminal 502 structures, and the product can contain up to three resistors (four lead-out terminals 502). The solder joints between the pins and the electrode layer are soldered with high-temperature solder at a temperature of 260–280°C, and the solder joints are wrapped with heat-shrink tubing to enhance solder strength and prevent pin detachment under vibration.

[0025] Furthermore, such as Figure 1 The housing 501 shown is made of high-reliability PA9T automotive plastic, which has a longer-term temperature resistance and a heat distortion temperature higher than the traditional PA66 thick-film resistor housing 501, exceeding those of PA9T. It also features high CTI, low moisture absorption, high hardness, aging resistance, hydrolysis resistance, and high reliability. Furthermore, several reinforcing ribs are added inside the housing 501, increasing its strength and improving the adhesion of the cured epoxy resin, thus enhancing the resistor's resistance to vibration and shock.

[0026] Furthermore, the encapsulation layer 508 is made of high-temperature resistant and aging-resistant epoxy resin. The thickness of the encapsulation layer 508 is 4.0-10mm. The encapsulation layer 508 is seamlessly bonded to the outer shell 501, the insulating substrate 503, and the electrode layer. The upper surface of the outer shell 501 is provided with several heat dissipation holes to increase the heat dissipation area. The material of the encapsulation layer 508 complies with RoHS standards and has good insulation and vibration resistance. The dielectric strength is not less than 4000Vrms, which can effectively protect the internal structure, prevent moisture and dust intrusion, and adapt to the extreme environment of the vehicle.

[0027] 1. High power density and good heat dissipation: This invention uses a highly thermally conductive insulating substrate (aluminum nitride or high-purity alumina). The insulating substrate directly contacts the heat sink structure, which can quickly conduct and dissipate the heat generated by the thick film resistor layer, avoiding heat accumulation. Combined with the optimized design of the thick film resistor layer, the power dissipation capacity can reach 200W (at a bottom shell temperature of 80℃). The power density is significantly higher than that of traditional thick film resistors in the same volume, which can meet the high power discharge requirements of vehicles. At the same time, it solves the problem of heat concentration in single-pulse discharge mode, eliminating the need to increase the shell and heat dissipation area, thus reducing material and manufacturing costs.

[0028] 2. High reliability and strong environmental resistance: The thick film resistor layer is infused with anti-sulfurization agents and anti-silver migration agents, combined with an innovative sintering process, effectively solving the defects of traditional thick film resistors such as easy sulfidation and silver migration; the encapsulation layer is made of high-temperature resistant and aging-resistant epoxy resin material, seamlessly wrapping the internal structure, which can effectively resist interference from moisture, dust, vibration and other factors in the automotive environment. In addition, the resistor has passed AEC-Q200 automotive-grade certification, has a wide operating temperature range (-55℃ to +150℃), strong resistance to vibration, high humidity and electrical stress, and is not prone to aging and failure problems after long-term use, with significantly improved stability.

[0029] 3. Compact size and lightweight, suitable for automotive applications: Encased in a high-reliability PA9T automotive plastic shell, it boasts a long-term temperature resistance and heat distortion temperature exceeding that of traditional thick-film resistors using PA66 shells by 20-40°C. It also features high CTI, low moisture absorption, high hardness, aging resistance, hydrolysis resistance, and high reliability. Furthermore, several reinforcing ribs are added internally to increase the shell's strength and improve the adhesion of the cured epoxy resin, enhancing the resistor's resistance to vibration and shock. With the same power rating, its small overall size and light weight meet the lightweight and miniaturized design requirements of new energy vehicles, simplifying design, saving board space, and allowing for flexible installation in confined spaces such as on-board chargers and battery management systems.

[0030] 4. Simple structure and controllable cost: The present invention has a reasonable structural design, which can achieve constant power discharge without complex control circuits, simplifying the production process; it uses conventional and readily available materials, resulting in high production efficiency and enabling large-scale mass production, while reducing manufacturing costs. Compared with imported similar products, it has a higher cost performance and helps to achieve independent control of key automotive components.

[0031] 5. Reliable connection and long service life: This invention features three lead-out structures: pin type (pin thickness 0.8-1.2mm, screw mounting), plug type (plug thickness 0.8-1.2mm, connector mounting), and lead wire type (0.5-1.5mm² silicone wire, length and terminal type can be customized). This allows for three lead-out structures, and the product can contain up to three resistors (four leads). The pins and electrode layer are soldered with high-temperature solder, and the solder joint is wrapped with heat-shrink tubing. Combined with the tin plating of the pins, this effectively improves the solder joint's strength and oxidation resistance, preventing problems such as desoldering and poor contact under vehicle vibration environments. The thick-film resistor layer utilizes precision laser trimming technology, resulting in high resistance accuracy and stability, with a service life exceeding 10,000 hours, meeting the long-term usage requirements of automotive electronic components. In this embodiment, the insulating pad 506 is attached to the surface of the insulating substrate 503 by an adhesive process to improve the stress resistance of the insulating substrate 503. Specifically, the insulating pad 506 is bonded to the surface of the insulating substrate 503 with an adhesive. The bonding methods between the insulating pads 506 in this embodiment include I-shaped installation, U-shaped installation, and full-coverage installation. Specifically, the I-shaped installation means that the insulating pad 506 and the insulating substrate 503 are of the same length, and the insulating pad 506 has a notch at the edge of the thick film electrode layer 504 to ensure that the thick film electrode layer 504 will not be covered after bonding. The U-shaped installation means that the size of the insulating pad 506 is smaller than that of the insulating substrate 503, and the insulating pad 506 is bonded to the middle position of the insulating substrate 503. The full-coverage installation means that the insulating pad 506 and the insulating substrate 503 are of the same shape, and the insulating pad 506 has a corresponding groove pre-set on it to prevent the thick film electrode layer 504 from being covered. This embodiment also proposes a processing apparatus for a discharge resistor to meet the bonding requirements of the insulating pad 506 and the insulating substrate 503.

[0032] Specific examples Figure 4 As shown, the device includes a processing table 100, on which a storage mechanism 300 is fixedly mounted. A dispensing mechanism 400 is slidably mounted on one side of the storage mechanism 300, and a splicing mechanism 200 is slidably mounted on the other side of the storage mechanism 300. The storage mechanism 300 is used to place several insulating substrates 503, and the splicing mechanism 200 is used to place corresponding insulating pads 506. The dispensing mechanism 400 applies glue to the insulating substrates 503, and then the splicing mechanism 200 is moved laterally to complete the splicing and pasting of the insulating substrates 503 and the insulating pads 506.

[0033] like Figure 7 As shown, the processing table 100 includes a table surface 101. A first threaded rod (not marked in the figure) is rotatably mounted on the table surface 101, and a first limiting rod 102 is fixedly mounted on it. One end of the first threaded rod is fixedly connected to the output end of a motor 103. The motor 103 is fixedly connected to the table surface 101. The splicing mechanism 200 is threadedly engaged with the first threaded rod and slidably engaged with the first limiting rod 102. The motor 103 drives the first threaded rod to rotate, thereby realizing the movement of the splicing mechanism 200. like Figure 7 As shown, the splicing mechanism 200 includes a first mounting plate 201, which is threadedly engaged with a first threaded rod and slidably engaged with a first limiting rod 102. The first mounting plate 201 is provided with a liftable mounting back plate 202, which is lifted by a cylinder. The mounting back plate 202 is provided with several sets of clamping mechanisms for clamping and fixing insulating gaskets 506. These clamping mechanisms have identical structures. Taking one set of clamping mechanisms as an example, specifically... Figure 5 and Figure 6As shown, the mounting back plate 202 has several snap-fit ​​slots arranged in an array for snapping in the insulating gasket 506. A mounting groove 203 communicates with the snap-fit ​​slots on the mounting back plate 202. A first clamping plate 204 and a second clamping plate 205 are symmetrically and slidably arranged on both sides of the snap-fit ​​slot within the mounting groove 203. A push plate 206 is slidably arranged within the mounting groove 203 at the middle position between the first clamping plate 204 and the second clamping plate 205. The length of the push plate 206 is greater than or equal to the length of the insulating gasket 506. During use, the insulating gasket 506 is... Inserting the 6 into the snap-fit ​​slot can temporarily limit its position, ensuring that the insulating pad 506 will not shift when stationary, which facilitates the feeding of the insulating pad 506. During the movement, the first clamping plate 204 and the second clamping plate 205 are used to clamp and fix both ends of the insulating pad 506 to prevent the insulating pad 506 from falling or shifting during the movement. When the insulating pad 506 moves as a whole to the top of the installation position, the control push plate 206 moves to push the insulating pad 506 forward to install the mounting back plate 202.

[0034] like Figure 9 and Figure 10 As shown, a sealing plate 221 is fixedly provided on the side of the mounting back plate 202, and a first gear 211 and a second gear 215 are rotatably provided on the sealing plate 221 outside the mounting back plate 202. Figure 8 As shown, the first gear 211 and the second gear 215 are rotated with the sealing plate 221 through the first connecting shaft 213 and the second connecting shaft 216, respectively. The first gear 211 is coaxially connected to and fixedly mounted with the third gear 212 through the first connecting shaft 213. The second gear 215 is coaxially connected to and fixedly mounted with the fourth gear 217 through the second connecting shaft 216. The first rack 214 is fixedly mounted on the first clamping plate 204, wherein the first rack 214 meshes with the third gear 212 for transmission. The second rack 218 is coaxially connected to and fixedly mounted on the second clamping plate 205, wherein the second rack 218 meshes with the fourth gear 217 for transmission. The push plate 206 is fixedly mounted with a vertical rod 208 on its side. The two ends of the vertical rod 208 are symmetrically mounted with a third rack 209 and a fourth rack 210, wherein the third rack 209 meshes with the first gear 211 for transmission, and the fourth rack 210 meshes with the second gear 215 for transmission.

[0035] In use, when the control push plate 206 moves toward the end of the insulating pad 506, the third rack 209 and the fourth rack 210 move synchronously. The third rack 209 and the fourth rack 210 mesh with the first gear 211 and the second gear 215 respectively, realizing the rotation of the first gear 211 and the second gear 215. The rotation directions of the first gear 211 and the second gear 215 are opposite. The first gear 211 and the second gear 215 are respectively connected to the third gear via the first connecting shaft 213 and the second connecting shaft 216. The rotation of gears 212 and 217, and the rotation of gears 212 and 217 in opposite directions, and the meshing of gears 212 and 217 with racks 214 and 218 respectively, ultimately realize the opening and closing motion of the first clamping plate 204 and the second clamping plate 205. That is, when the push plate 206 moves toward the end of the insulating pad 506, the first clamping plate 204 and the second clamping plate 205 move open to release the insulating pad 506, so that the push plate 206 can push out the insulating pad 506.

[0036] In this embodiment, several sets of clamping mechanisms work synchronously. This embodiment provides a specific synchronous driving method, such as... Figure 6 and Figure 7 As shown, several push plates 206 on the clamping mechanisms are fixedly connected to the positioning rods 207. The mounting back plate 202 is interactively connected to the positioning rods 207 via a telescopic mechanism 220. The telescopic mechanism 220 includes a cylinder, which enables the lateral movement of the positioning rods 207, further enabling the synchronous movement of the push plates 206. The movement of the push plates 206 drives several sets of first clamping plates 204 and second clamping plates 205 to open and close. In this embodiment, the number of clamping mechanisms is any number greater than one. The number of clamping mechanisms can be designed according to the actual processing situation to maximize processing efficiency and avoid resource waste and inefficiency caused by focusing on processing and using a single drive source. The mounting back plate 202 is also fixedly provided with a connecting rod 219, which passes through the inside of the storage mechanism 300 and is fixedly connected to the dispensing mechanism 400.

[0037] like Figure 5 and Figure 7 As shown, the dispensing mechanism 400 includes a connector 403, which is fixedly connected to the connecting rod 219. That is, the dispensing mechanism 400 moves synchronously with the splicing mechanism 200. A glue box 401 is fixedly provided on the connector 403. The glue box 401 is provided with several sets of glue outlets 402. The several sets of glue outlets 402 are arranged at equal intervals, and each set of glue outlets 402 is provided with at least one set of outlet tubes.

[0038] like Figure 11 and Figure 12As shown, the storage mechanism 300 includes a bottom support 301 with a through slot 302. Both the connector 403 and the connecting rod 219 can move within the through slot 302. A support assembly is mounted on the bottom support 301 for layered storage of the insulating substrate 503. The support assembly is slidably engaged with the bottom support 301, allowing it to be slidably removed from the bottom support 301. The support assembly includes a support side plate 303, on which several sets of support components 305 are fixedly mounted. Each support component 305 includes several... The support plate and the bracket side plate 303 are provided with several insertion slots 304. The insertion slots 304 are located between several sets of support components 305. The insertion slots 304 facilitate the insertion and removal of several sets of glue outlets 402. The support components 305 are used to place the insulating substrate 503. The glue outlets 402 move along the insertion slots 304 to the top of the insulating substrate 503 to apply glue. As the glue outlets 402 are removed, the splicing mechanism 200 moves synchronously to move the insulating pad 506 to the top of the glued insulating substrate 503 to achieve splicing of the two.

[0039] like Figure 12 and Figure 13 , Figure 14 As shown, a U-shaped groove 307 is provided on one side of the bracket side plate 303, and a sealing strip 306 is provided at the other end of the U-shaped groove 307 on the bracket side plate 303. That is, the insulating substrate 503 can be inserted along one end of the U-shaped groove 307. When the insulating substrate 503 contacts the sealing strip 306, it stops, which makes it easy to constrain the position of the insulating substrate 503.

[0040] In use, when the insulating pad 506 in this embodiment is I-shaped or fully covered, firstly, several insulating pads 506 and insulating substrate 503 are installed in designated positions. The dispensing mechanism 400 is controlled to dispense adhesive and then withdraw. Subsequently, the splicing mechanism 200 enters the designated area. First, the mounting back plate 202 on the splicing mechanism 200 is controlled to descend, so that several insulating pads 506 are attached to the insulating substrate 503. At this time, the insulating pads 506 and the insulating substrate 503 are not yet aligned and spliced. Then, the push plate 206 is controlled to move forward, pushing the insulating pads 506 toward the insulating substrate 503 to complete the side splicing. After the splicing is completed, one end of the insulating pad 506 is pushed into the U-shaped groove 307, realizing the alignment of the insulating pad 506 and the insulating substrate 503. At the same time, the process of pushing the insulating pads 506 toward the insulating substrate 503 also helps to separate air bubbles in the adhesive between the insulating pads 506 and the insulating substrate 503, resulting in a better bonding effect and a stronger bond.

[0041] When the insulating pad 506 in this embodiment is U-shaped, it is pasted. The same splicing method is used, that is, the push plate 206 is used to push the insulating pad 506 to the middle position of the insulating substrate 503. In order to avoid displacement during the pushing process, a positioning plate or positioning groove can be provided at the bottom of several support components 305. The positioning groove or positioning plate is in the shape of a straight groove, and the spacing of the straight groove is adapted to the size of the insulating pad 506 to ensure that the push plate 206 will not shift during the process of pushing the insulating pad 506 to the middle.

[0042] After the assembly is completed, the bracket assembly is removed to facilitate the overall thermosetting of the insulating gasket 506 and the insulating substrate 503 after the bracket assembly is completed.

[0043] The above-disclosed embodiments are merely a few specific examples of the present invention. However, the embodiments of the present invention are not limited thereto, and any variations that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A thick-film discharge resistor for automotive applications, characterized in that, It includes an insulating substrate (503), a thick film electrode layer (504), a thick film resistor layer (505), an insulating pad (506), a lead-out terminal (502), a silicone layer (507), a shell (501), and an encapsulation layer (508). The thick-film electrode layer (504) is printed on the upper surface of the insulating substrate (503) and is divided into an input electrode and an output electrode. The thick-film resistor layer (505) is printed on the upper surface of the insulating substrate (503) and connects the two ends of the thick-film electrode layer (504). The thick-film protective layer is printed on the upper surface of the insulating substrate (503) and covers the resistor layer. The insulating pad (506) is bonded to the surface of the insulating substrate (503).

2. The automotive power thick-film discharge resistor according to claim 1, characterized in that, The insulating substrate (503) is made of high-purity alumina or aluminum nitride. The thick film electrode layer (504) is printed using a high palladium silver alloy paste; The lead-out terminal (502) includes three lead-out methods: pin, connector, or lead wire.

3. A processing equipment for an automotive power thick-film discharge resistor, applied to the automotive power thick-film discharge resistor as described in claim 1, characterized in that, It includes a processing table (100), a storage mechanism (300) is fixedly provided on the processing table (100), a dispensing mechanism (400) is slidably provided on one side of the storage mechanism (300), and a splicing mechanism (200) is slidably provided on the other side of the storage mechanism (300). The splicing mechanism (200) includes a liftable mounting back plate (202), and the mounting back plate (202) is provided with several sets of clamping mechanisms. The clamping mechanisms include an openable first clamping plate (204) and a second clamping plate (205), and a push plate (206) is slidably provided between the first clamping plate (204) and the second clamping plate (205). The storage mechanism (300) includes a support assembly, which includes a support side plate (303) and a plurality of support components (305) are fixedly provided on the support side plate (303). The dispensing mechanism (400) includes several sets of dispensing ports (402).

4. A thick-film power discharge resistor for automotive applications according to claim 3, characterized in that, The processing table (100) includes a table surface (101), on which a first threaded rod is rotatably provided and a first limiting rod (102) is fixedly provided. One end of the first threaded rod is fixedly connected to the output end of a motor (103), and the motor (103) is fixedly connected to the table surface (101). The splicing mechanism (200) is threadedly engaged with the first threaded rod and slidably engaged with the first limiting rod (102).

5. A thick-film discharge resistor for automotive applications according to claim 4, characterized in that, The splicing mechanism (200) includes a first mounting plate (201), which is threadedly engaged with a first threaded rod and slidably engaged with a first limiting rod (102). The first mounting plate (201) is provided with a liftable mounting back plate (202), which is lifted by a cylinder. The mounting back plate (202) is provided with several sets of clamping mechanisms for clamping and fixing insulating pads (506). The structures of the several sets of clamping mechanisms are the same.

6. A thick-film power discharge resistor for automotive applications according to claim 5, characterized in that, The mounting back plate (202) is provided with a plurality of snap-fit ​​grooves for snapping the insulating gasket (506). The mounting back plate (202) is connected to the snap-fit ​​grooves by a mounting groove (203). A first clamping plate (204) and a second clamping plate (205) are symmetrically and slidably arranged on both sides of the snap-fit ​​groove in the mounting groove (203). A push plate (206) is slidably arranged in the middle position of the first clamping plate (204) and the second clamping plate (205) in the mounting groove (203). The length of the push plate (206) is greater than or equal to the length of the insulating gasket (506).

7. A thick-film power discharge resistor for automotive applications according to claim 6, characterized in that, The mounting back plate (202) is fixedly provided with an edge sealing plate (221) on its side. A first gear (211) and a second gear (215) are rotatably provided on the edge sealing plate (221) outside the mounting back plate (202). The first gear (211) and the second gear (215) are respectively connected to the edge sealing plate (221) via a first connecting shaft (213) and a second connecting shaft (216). The first gear (211) is also coaxial with and fixedly provided with a third gear (212) via the first connecting shaft (213). The second gear (215) is coaxial with and fixedly provided with a fourth gear (217) via the second connecting shaft (216). A first rack (214) is fixedly provided on the first clamping plate (204), wherein the first rack (214) meshes with the third gear (212) for transmission. A second rack (218) is coaxially fixedly provided on the second clamping plate (205), wherein the second rack (218) meshes with the fourth gear (217) for transmission. A vertical rod (208) is fixedly provided on the side of the push plate (206), wherein a third rack (209) and a fourth rack (210) are symmetrically provided at both ends of the vertical rod (208), wherein the third rack (209) meshes with the first gear (211) for transmission, and the fourth rack (210) meshes with the second gear (215) for transmission.

8. A thick-film power discharge resistor for automotive applications according to claim 6, characterized in that, The push plates (206) on several of the clamping mechanisms are fixedly connected to the positioning rods (207). The mounting back plate (202) is interactively connected to the positioning rods (207) through the telescopic mechanism (220). The telescopic mechanism (220) includes a cylinder. The mounting back plate (202) is also fixedly provided with a connecting rod (219). The connecting rod (219) passes through the inside of the storage mechanism (300) and is fixedly connected to the dispensing mechanism (400).

9. A thick-film discharge resistor for automotive applications according to claim 5, characterized in that, The dispensing mechanism (400) includes a connector (403), which is fixedly connected to the connecting rod (219). That is, the dispensing mechanism (400) moves synchronously with the splicing mechanism (200). A glue box (401) is fixedly provided on the connector (403). The glue box (401) is provided with several sets of glue outlets (402). The several sets of glue outlets (402) are arranged equidistantly, and each set of glue outlets (402) is provided with at least one set of outlet tubes.

10. A thick-film power discharge resistor for automotive applications according to claim 3, characterized in that, The storage mechanism (300) includes a bottom support (301), a through groove (302) is provided in the bottom support (301), the connector (403) and the connecting rod (219) can both move in the through groove (302), a support assembly is provided on the bottom support (301), the support assembly is used to store the insulating substrate (503) in layers, the support assembly is slidably snapped onto the bottom support (301), the support assembly includes a support side plate (303), a number of support components (305) are fixedly provided on the support side plate (303), the support components (305) include a number of support plates, a number of insertion slots (304) are opened on the support side plate (303), and the number of insertion slots (304) are located between the number of support components (305); A U-shaped groove (307) is provided on one side of the bracket side plate (303), and a sealing strip (306) is provided at the other end of the U-shaped groove (307) on the bracket side plate (303). A positioning plate or positioning groove is provided at the bottom of several support components (305). The positioning groove or positioning plate is in the shape of a straight groove, and the spacing of the straight groove is adapted to the size of the insulating gasket (506).

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