Multilayer electronic component

Abstract

This disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including a dielectric layer and a first inner electrode and a second inner electrode, and including a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction, and a fifth surface and a sixth surface opposite to each other in a third direction; a glass layer disposed on the fifth surface and / or the sixth surface; a first outer electrode disposed on the glass layer; and a second outer electrode and a third outer electrode disposed on the third surface and the fourth surface, respectively, wherein the first inner electrode has a connection terminal extending to the fifth surface and / or the sixth surface, and the glass layer is configured to cover a portion of the connection terminal, and when the length of the connection terminal in the second direction is L1, and the length of the area of ​​the connection terminal in contact with the first outer electrode in the second direction is L2, L1 and L2 can satisfy 0.74≤L2 / L1≤0.90.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0194884, filed on December 24, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are chip capacitors mounted on printed circuit boards in various types of electronic products, such as image display devices (including liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, and mobile phones, for charging or discharging from them. These multilayer ceramic capacitors are used as components in a wide variety of electronic devices due to their small size, ability to ensure high capacitance, and ease of installation.

[0004] Currently, in addition to dual-terminal MLCCs with two external electrodes, three-terminal or four-terminal MLCCs with altered internal and external electrode structures are also being developed to improve frequency characteristics.

[0005] Specifically, a three-terminal MLCC may have a structure in which ground inner electrodes and signal inner electrodes with leads are alternately stacked. In the case of a three-terminal MLCC, the outer electrode should precisely cover the exposed portion of the leads, and when the outer electrode does not precisely cover the leads, resulting in the leads being exposed to the outside, there is a concern that external moisture may penetrate into the interior of the MLCC through the exposed area. Furthermore, when there is a thickness deviation between the ground inner electrode and the outer electrode, there is a concern that external moisture may penetrate into the interior of the MLCC through the thinner portions of the ground inner electrode and / or the outer electrode.

[0006] Since external moisture penetrating into MLCCs can degrade their reliability (such as reducing their insulation resistance), it is necessary to study the internal and external electrode structures that can prevent external moisture penetration. Summary of the Invention

[0007] Technical issues One aspect of this disclosure is to provide a multilayer electronic component with excellent reliability.

[0008] However, the problems to be solved by this disclosure are not limited to those described above, and will be more readily understood in the process of describing specific embodiments of this disclosure.

[0009] Solution to the problem A multilayer electronic component according to embodiments of the present disclosure may include: a body comprising: a dielectric layer and a first inner electrode and a second inner electrode alternately disposed in a first direction, the dielectric layer being between the first inner electrode and the second inner electrode, and including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in the third direction; a glass layer disposed on at least one of the fifth surface and the sixth surface; a first outer electrode disposed on the glass layer and connected to the first inner electrode; and a second outer electrode and a third outer electrode disposed on the third surface and the fourth surface and connected to the second inner electrode, wherein the first inner electrode has a connection terminal extending to at least one of the fifth surface and the sixth surface, and the glass layer is configured to cover a portion of the connection terminal, wherein when the length of the connection terminal in the second direction is L1, and the length of the area of ​​the connection terminal in contact with the first outer electrode in the second direction is L2, L1 and L2 may satisfy 0.74≤L2 / L1≤0.90.

[0010] Beneficial effects of the invention According to one aspect of this disclosure, multilayer electronic components with excellent reliability can be provided. Attached Figure Description

[0011] Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to an embodiment of the present disclosure.

[0012] Figure 2 yes Figure 1 A three-dimensional view of the removal of the first external electrode.

[0013] Figure 3 schematically showing along Figure 1 The cross-sectional view taken from line I-I'.

[0014] Figure 4 schematically showing along Figure 1 The cross-sectional view taken from line II-II'.

[0015] Figure 5A schematically showing along Figure 1 The section cut by line III-III' shows a cross-sectional view of the planar structure of the first internal electrode.

[0016] Figure 5B schematically showing along Figure 1The section cut by line III-III' shows a cross-sectional view of the planar structure of the second inner electrode.

[0017] Figure 6 It is shown schematically. Figure 5A A magnified view of region K.

[0018] Figure 7 yes Figure 6 A variant example. Detailed Implementation

[0019] In the following description, embodiments of the present disclosure will be illustrated with reference to the accompanying drawings. However, embodiments of the present disclosure may be modified in various other forms, and the scope of the present disclosure is not limited to the embodiments described below. Furthermore, embodiments of the present disclosure are provided to provide a more complete description of the disclosure to those skilled in the art. Therefore, for clarity of description, the shape and size of elements in the drawings may be exaggerated, and elements indicated by the same reference numerals in the drawings may be the same elements.

[0020] In the accompanying drawings, for the purpose of clarifying this disclosure, parts irrelevant to the description will be omitted, and thicknesses may be enlarged to clearly show layers and regions. The same reference numerals will be used to indicate the same components. Furthermore, throughout the specification, unless otherwise expressly stated, when an element is referred to as "comprising" or "including" another element, it means that the element may also include other elements, without excluding other elements.

[0021] In the accompanying drawings, the X direction can be defined as a first direction or the thickness direction, the Y direction can be defined as a second direction or the length direction, and the Z direction can be defined as a third direction or the width direction.

[0022] Multilayer electronic components Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to an embodiment of the present disclosure.

[0023] Figure 2 yes Figure 1 A three-dimensional view of the removal of the first external electrode.

[0024] Figure 3 schematically showing along Figure 1 The cross-sectional view taken from line I-I'.

[0025] Figure 4 schematically showing along Figure 1 The cross-sectional view taken from line II-II'.

[0026] Figure 5A schematically showing along Figure 1 The section cut by line III-III' shows a cross-sectional view of the planar structure of the first internal electrode.

[0027] Figure 5B schematically showing along Figure 1 The section cut by line III-III' shows a cross-sectional view of the planar structure of the second inner electrode.

[0028] Figure 6 It is shown schematically. Figure 5A A magnified view of region K.

[0029] Figure 7 yes Figure 6 A variant example.

[0030] In the following text, reference will be made to Figures 1 to 7 A multilayer electronic assembly 100 according to embodiments of the present disclosure is described in detail. Additionally, a multilayer ceramic capacitor is described as an example of a multilayer electronic assembly, but the present disclosure is not limited thereto, and is applicable to various multilayer electronic assemblies such as inductors, piezoelectric elements, varistors, or thermistors.

[0031] A multilayer electronic assembly 100 according to an embodiment of the present disclosure may include a body 110 comprising a dielectric layer 111 and inner electrodes 121 and 122, outer electrodes 131, 132, 133 and 134, and a glass layer 140.

[0032] There are no particular restrictions on the specific shape of the main body 110, but as Figure 1 As shown, the body 110 may have a hexahedral shape or a shape similar to a hexahedron. Due to the shrinkage of the ceramic powder included in the body 110 during the sintering process or due to the polishing process of the corners of the body 110, the body 110 may not have a hexahedral shape with perfectly straight lines, but may have a generally hexahedral shape.

[0033] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and are opposite to each other in a third direction.

[0034] The multiple dielectric layers 111 forming the main body 110 are in a sintered state, which allows adjacent dielectric layers 111 to be integrated, making it difficult to identify the boundaries between them without a scanning electron microscope (SEM).

[0035] The dielectric layer 111 may include, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 may include, for example, compounds selected from BaTiO3, (Ba... 1-x Ca x)TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, and (Ca 1-x Sr x )(Zr 1- y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5) in the group consisting of one or more.

[0036] The average thickness of the dielectric layer 111 is not particularly limited. For example, the average thickness of the dielectric layer 111 can be 0.1 μm to 20 μm, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm.

[0037] The main body 110 may include first inner electrodes 121 and second inner electrodes 122 alternately arranged in the first direction, and the dielectric layer 111 is interposed between the first inner electrode 121 and the second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 (a pair of electrodes with different polarities) may be arranged opposite to each other and the dielectric layer 111 is interposed between the first inner electrode 121 and the second inner electrode 122.

[0038] Referring Figure 5A , the first inner electrode 121 may have first connection terminals C1 and C4 extending to the fifth surface 5 and / or the sixth surface 6. For example, the first inner electrode 121 may include: a first main portion 121a, which is stacked with the second inner electrode 122 in the first direction; and first lead-out portions 121b and 121c, which extend from the first main portion 121a to the fifth surface 5 and the sixth surface 分别延伸到第五表面5和第六表面6,在第一方向上不与第二内电极122叠置,并且具有第一连接端子C1和C4。也就是说,第一引出部121b和121c的在第三方向上的一个端部可被定义为第一连接端子C1和C4。

[0039] The first inner electrode 121 is spaced apart from the third surface 3 and the fourth surface 4, and may be connected to the first outer electrodes 131 and 134 through a pair of first lead-out portions 121b and 121c respectively exposed to the fifth surface 5 and the sixth surface 6. However, the present disclosure is not limited thereto, and the first inner electrode 121 may be exposed to only one of the fifth surface 5 and the sixth surface 6, in which case the first inner electrode 121 may have one first lead-out portion. It should be noted that there seems to be some incomplete or unclear expressions in the original text, especially in the part of "分别延伸到第五表面5和第六表面6,在第一方向上不与第二内电极122叠置,并且具有第一连接端子C1和C4。也就是说,第一引出部121b和121c的在第三方向上的一个端部可被定义为第一连接端子C1和C4。", which may need further clarification in the original context for a more accurate translation.

[0040] The shape of the first main portion 121a is not particularly limited, but it may have, for example, a flat plate shape perpendicular to the first direction. In an embodiment, the maximum length Lm of the first main portion 121a in the second direction may be greater than the length L1 of the first connecting terminals C1 and C4 in the second direction (see...). Figure 6 ).

[0041] although Figure 5A The diagram shows a structure in which the lengths of the first leads 121b and 121c in the second direction are constant, but the present disclosure is not limited thereto. For example, the first leads 121b and 121c may have a form in which the length in the second direction decreases from the first main portion 121a toward the first external electrodes 131 and 134, or the first leads 121b and 121c may have a form in which the length in the second direction increases from the first main portion 121a toward the first external electrodes 131 and 134.

[0042] Reference Figure 5B The second inner electrode 122 may have a second connection terminal C2 extending to the third surface 3 and a third connection terminal C3 extending to the fourth surface 4. For example, the second inner electrode 122 may include: a second main portion 122a, superimposed on the first inner electrode 121 in a first direction; and a second lead-out portion 122b and a third lead-out portion 122c, extending from the second main portion 122a toward the third surface 3 and the fourth surface 4, respectively, and the second lead-out portion 122b and the third lead-out portion 122c are not superimposed on the first inner electrode 121 in the first direction. The second lead-out portion 122b and the third lead-out portion 122c may each have a second connection terminal C2 and a third connection terminal C3. That is, one end of the second lead-out portion 122b in the second direction and one end of the third lead-out portion 122c in the second direction may be defined as the second connection terminal C2 and the third connection terminal C3, respectively.

[0043] For example, the second inner electrode 122 can be connected to the second outer electrode 132 and the third outer electrode 133 via a second lead-out 122b and a third lead-out 122c exposed on the third surface 3 and the fourth surface 4, respectively. The second inner electrode 122 is spaced apart from the fifth surface 5 and the sixth surface 6, but this disclosure is not limited thereto, and the second lead-out 122b and the third lead-out 122c can extend to the fifth surface 5 and the sixth surface 6, respectively. In this case, the second lead-out 122b can be connected to the second outer electrode 132 on the third surface 3, the fifth surface 5, and the sixth surface 6, and the third lead-out 122c can be connected to the third outer electrode 133 on the fourth surface 4, the fifth surface 5, and the sixth surface 6.

[0044] although Figure 5BThe diagram shows a structure in which the lengths of the second lead-out portion 122b and the third lead-out portion 122c are constant in the third direction, but this disclosure is not limited thereto. For example, the second lead-out portion 122b and the third lead-out portion 122c may have a form in which the lengths in the third direction decrease from the second main portion 122a toward the second external electrode 132 and the third external electrode 133, respectively, or the second lead-out portion 122b and the third lead-out portion 122c may have a form in which the lengths in the third direction increase from the second main portion 122a toward the second external electrode 132 and the third external electrode 133, respectively. In this disclosure, having a form in which the lengths decrease or increase in the second or third direction can indicate that although the length remains constant in a certain segment of the entire interval from one point to another, the overall length still tends to decrease or increase.

[0045] The metals included in the inner electrodes 121 and 122 may be one or more selected from the group consisting of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti and alloys thereof, and more preferably, the inner electrodes 121 and 122 may include Ni, but this disclosure is not limited thereto.

[0046] There is no particular limitation on the average thickness of the inner electrodes 121 and 122. For example, the average thickness of the inner electrodes 121 and 122 can be 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0047] The average thickness of dielectric layer 111 refers to the average dimension of dielectric layer 111 in the first direction, and the average thickness of inner electrodes 121 and 122 refers to the average dimension of inner electrodes 121 and 122 in the first direction. The average thickness of dielectric layer 111 and the average thickness of inner electrodes 121 and 122 can be measured by scanning images of cross-sections of the body 110 in the first and second directions using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average thickness of dielectric layer 111 can be measured by measuring the thickness of dielectric layer 111 at multiple points (e.g., at 5 equally spaced points) in the second direction and then averaging the results. Similarly, the average thickness of inner electrodes 121 and 122 can be measured by measuring the thickness of either inner electrode 121 or 122 at multiple points (e.g., at 5 equally spaced points) in the second direction and then averaging the results. The 5 equally spaced points can be specified in the capacitor forming section Ac, which will be described later. When the average measurement is extended to 10 dielectric layers 111 and 10 inner electrodes 121 and 122, the average thickness of dielectric layer 111 and the average thickness of inner electrodes 121 and 122 can be more generalized.

[0048] The main body 110 may include: a capacitor forming portion Ac, in which a capacitor is formed by alternately providing a first inner electrode 121 and a second inner electrode 122 with a dielectric layer 111 between them; and cover portions 112 and 113, provided on two opposing surfaces of the capacitor forming portion Ac in a first direction. Except that they do not include the inner electrodes, the cover portions 112 and 113 may have a similar structure to the dielectric layer 111.

[0049] The average thickness of the covering portions 112 and 113 is not particularly limited. For example, the average thickness of the covering portions 112 and 113 may be less than or equal to 200 μm, less than or equal to 150 μm, less than or equal to 100 μm, less than or equal to 30 μm, or less than or equal to 20 μm. For example, the average thickness of the covering portions 112 and 113 may be greater than or equal to 5 μm, greater than or equal to 10 μm, or greater than or equal to 30 μm. In this case, the average thickness of the covering portions 112 and 113 may refer to the average thickness of each of the first covering portion 112 and the second covering portion 113.

[0050] The average thickness of the covers 112 and 113 may refer to the average dimension of the covers 112 and 113 in the first direction, and may be the average value of the dimensions of the covers 112 and 113 in the first direction measured at 5 equally spaced points in the second direction in the cross section of the body 110 in the first and second directions.

[0051] The first external electrodes 131 and 134 may be disposed on the glass layer 140 and connected to the first internal electrode 121. For example, a pair of first external electrodes 131 and 134 may be disposed on the fifth surface 5 and the sixth surface 6, respectively, and connected to the first leads 121b and 121c, respectively. The pair of first external electrodes 131 and 134 may be configured to extend onto a portion of the first surface 1 and a portion of the second surface 2. However, this disclosure is not limited thereto, and the first external electrodes 131 and 134 may be disposed on only one of the fifth surface 5 and the sixth surface 6. In addition, the first external electrode 131 disposed on the fifth surface 5 and the first external electrode 134 disposed on the sixth surface 6 may be connected to each other on the first surface 1 and / or the second surface 2.

[0052] The second external electrode 132 and the third external electrode 133 may be disposed on the third surface 3 and the fourth surface 4, respectively, and may be connected to the second internal electrode 122. The second external electrode 132 may be connected to the second lead-out portion 122b on the third surface 3, and the third external electrode 133 may be connected to the third lead-out portion 122c on the fourth surface 4. The second external electrode 132 may be configured to extend from the third surface 3 to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and / or a portion of the sixth surface 6, and the third external electrode 133 may be configured to extend from the fourth surface 4 to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and / or a portion of the sixth surface 6.

[0053] The type or shape of the external electrodes 131, 132, 133, and 134 is not particularly limited, and they may have a multilayer structure. For example, the external electrodes 131, 132, 133, and 134 may include: base electrode layers 131a, 132a, 133a, and 134a, respectively in contact with the connecting terminals C1, C2, C3, and C4; and plating layers 131b, 132b, 133b, and 134b, respectively disposed on the base electrode layers 131a, 132a, 133a, and 134a. That is, the first external electrodes 131 and 134 may include: first base electrode layers 131a and 134a, respectively in contact with the first connecting terminals C1 and C4; and first plating layers 131b and 134b, respectively disposed on the first base electrode layers 131a and 134a. The second external electrode 132 may include a second base electrode layer 132a in contact with the second connection terminal C2 and a second plating layer 132b disposed on the second base electrode layer 132a. The third external electrode 133 may include a third base electrode layer 133a in contact with the third connection terminal C3 and a third plating layer 133b disposed on the third base electrode layer 133a.

[0054] The substrate electrode layers 131a, 132a, 133a, and 134a may be sintered electrode layers comprising metal and glass. The metal included in the substrate electrode layers 131a, 132a, 133a, and 134a may include at least one selected from, for example, the group consisting of Cu, Ni, Pd, Pt, Au, Ag, Pb, and alloys thereof.

[0055] The substrate electrode layers 131a, 132a, 133a, and 134a may consist solely of sintered electrode layers, but this disclosure is not limited thereto, and the substrate electrode layers 131a, 132a, 133a, and 134a may have a multilayer structure. For example, the substrate electrode layers 131a, 132a, 133a, and 134a may include sintered electrode layers and resin electrode layers disposed on the sintered electrode layers and comprising metal particles and resin.

[0056] The metal particles included in the resin electrode layer may include one or both of spherical particles and flake-shaped particles. The metal particles included in the resin electrode layer may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn, and / or alloys thereof. The resin included in the resin electrode layer may include, for example, one or more of epoxy resin, acrylic resin, and ethyl cellulose resin.

[0057] The plating layers 131b, 132b, 133b, and 134b may include, for example, Ni, Sn, Pd, and / or alloys thereof, and may be formed as multiple layers. The plating layers 131b, 132b, 133b, and 134b may be, for example, Ni plating layers or Sn plating layers, or may be in the form where Ni plating layers and Sn plating layers are sequentially formed on the substrate electrode layers 131a, 132a, 133a, and 134a. Additionally, the plating layers 131b, 132b, 133b, and 134b may include multiple Ni plating layers and / or multiple Sn plating layers.

[0058] Although the accompanying drawings depict a structure in which the multilayer electronic assembly 100 has four external electrodes 131, 132, 133 and 134, it is not limited thereto, and the number and / or shape of the external electrodes may be varied depending on the shape of the internal electrodes or for other purposes.

[0059] Reference Figure 5A and Figure 6 The glass layer 140 may be disposed on at least one of the fifth surface 5 and the sixth surface 6. For example, the glass layer 140 may be disposed on the fifth surface 5 and the sixth surface 6, respectively. The glass layer 140 may be configured to cover a portion of the first connecting terminals C1 and C4.

[0060] When the first external electrodes 131 and 134 do not precisely cover the first connection terminals C1 and C4, the first connection terminals C1 and C4 may be exposed to the outside. In this case, external moisture can easily penetrate into the interior of the multilayer electronic assembly 100 through the exposed first connection terminals C1 and C4. Additionally, due to manufacturing limitations, the first connection terminals C1 and C4 may have thin portions, or the first external electrodes 131 and 134 may have thin portions, and external moisture can penetrate into the multilayer electronic assembly 100 through these corresponding portions (e.g., thin portions).

[0061] On the other hand, according to embodiments of this disclosure, the length L1 of the first connecting terminals C1 and C4 in the second direction and the length L2 of the area of ​​the first connecting terminals C1 and C4 in contact with the first external electrodes 131 and 134 in the second direction can satisfy 0.74≤L2 / L1≤0.90. This can improve the moisture-proof reliability of the multilayer electronic assembly 100 while preventing excessive ESR. In this case, the area of ​​the first connecting terminals C1 and C4 in contact with the first external electrodes 131 and 134 can refer to the area of ​​the first connecting terminals C1 and C4 that is not covered by the glass layer 140.

[0062] When L2 / L1 exceeds 0.9, the glass layer 140 may not adequately cover the first connection terminals C1 and C4, potentially reducing the moisture resistance reliability of the multilayer electronic assembly 100. When L2 / L1 is less than 0.74, the glass layer 140 may over-cover the first connection terminals C1 and C4, potentially reducing the connectivity between the first inner electrode 121 and the first outer electrodes 131 and 134. In these cases, there is a concern that the ESR of the multilayer electronic assembly 100 may increase.

[0063] In this embodiment, L1 and L2 can satisfy L2 / L1≥0.81. In this case, the moisture resistance reliability and ESR of the multilayer electronic component 100 can be improved more effectively.

[0064] For example, L1 and L2 can be measured from images of the polished cross-section of the multilayer electronic assembly 100 to the central portion in the first direction and in the second and third directions, as observed by an optical microscope (OM) or a scanning electron microscope (SEM).

[0065] The glass layer 140 can satisfy 0.74≤L2 / L1≤0.90, and the arrangement of the glass layer 140 is not particularly limited. For example, the glass layer 140 may include: first glass layers 141 and 143, configured to cover one end of the first connecting terminals C1 and C4 in the second direction; and second glass layers 142 and 144, spaced apart from the first glass layers 141 and 143, and configured to cover the other end of the first connecting terminals C1 and C4 in the second direction.

[0066] External moisture can easily penetrate into the interior of the multilayer electronic assembly 100 through the boundary between the first connection terminals C1 and C4 and the dielectric layer 111. In other words, the boundary between the first connection terminals C1 and C4 and the dielectric layer 111 may be a vulnerable area for moisture penetration. To cover the vulnerable area for moisture penetration with a glass layer 140 while maintaining the connectivity between the first inner electrode 121 and the first outer electrodes 131 and 134, the glass layer 140 may be configured to cover the two ends of the first connection terminals C1 and C4 in a second direction, and may include first glass layers 141 and 143 and second glass layers 142 and 144 spaced apart from each other.

[0067] Reference Figure 2 For example, first glass layers 141 and 143 may be configured to extend from at least one of the fifth surface 5 and the sixth surface 6 to a portion of the first surface 1 and a portion of the second surface 2, and second glass layers 142 and 144 may be configured to extend from at least one of the fifth surface 5 and the sixth surface 6 to a portion of the first surface 1 and a portion of the second surface 2. A pair of first glass layers 141 and 143 may be respectively disposed on the fifth surface 5 and the sixth surface 6 and may extend to a portion of the first surface 1 and a portion of the second surface 2, and a pair of second glass layers 142 and 144 may be respectively disposed on the fifth surface 5 and the sixth surface 6 and may extend to a portion of the first surface 1 and a portion of the second surface 2.

[0068] Glass layer 140 is spaced apart from the second external electrode 132 and the third external electrode 133. First glass layers 141 and 143 are spaced apart from the second external electrode 132, and second glass layers 142 and 144 are spaced apart from the third external electrode 133. When glass layer 140 contacts the second external electrode 132 and the third external electrode 133, it may hinder the contact between the second external electrode 132 and the third external electrode 133 and the solder when mounting the multilayer electronic component 100 on a printed circuit board, thereby affecting the mounting stability.

[0069] In an embodiment, in the cross-sections of the multilayer electronic assembly 100 in the second and third directions, the length of the region of the glass layer 140 that does not contact the first connection terminals C1 and C4 in the second direction may be greater than the length of the remaining region of the glass layer 140 that does contact the first connection terminals C1 and C4 in the second direction. The outer surface of the body 110 may be formed primarily of ceramic composition, and the bonding force between the ceramic and the glass may be greater than the bonding force between the metal and the glass. When the length of the region of the glass layer 140 that does not contact the first connection terminals C1 and C4 in the second direction is greater than the length of the remaining region of the glass layer 140 that does contact the first connection terminals C1 and C4 in the second direction, the bonding force between the body 110 and the glass layer 140 can be improved, resulting in a more effective improvement in the moisture resistance reliability of the multilayer electronic assembly 100.

[0070] In an embodiment, the first external electrodes 131 and 134 may be configured to completely cover the glass layer 140. For example... Figure 5A and Figure 5B As shown, the first external electrode 131 can be configured to completely cover the first glass layer 141 and the second glass layer 142, and the first external electrode 134 can be configured to completely cover the first glass layer 143 and the second glass layer 144.

[0071] For example, one end of the glass layer 140 in the second direction may be exposed from the first substrate electrode layers 131a and 134a, and the first plating layers 131b and 134b may be configured to cover that one end of the glass layer 140 in the second direction. That is, one end of the glass layer 140 in the second direction may be exposed from the first substrate electrode layers 131a and 134a and may be in contact with the first plating layers 131b and 134b, and the other end of the glass layer 140 in the second direction may be in contact with the first connection terminals C1 and C4.

[0072] However, this disclosure is not limited thereto. (See also...) Figure 7 One end of glass layers 141-1 and 142-1 in the second direction may be exposed from the first plating layer 131b. That is, one end of glass layers 141-1 and 142-1 in the second direction may be exposed to the outside of the first external electrode 131, and the other end of glass layers 141-1 and 142-1 in the second direction may be in contact with the first connection terminal C1.

[0073] Reference Figure 6 and Figure 7In an embodiment, the maximum length Le of the first external electrode 131 in the second direction can be greater than the length L1 of the first connecting terminal C1 in the second direction. As a result, even if the central portion of the first external electrode 131 is not precisely aligned with the central portion of the first connecting terminal C1 for coating to form the first external electrode 131, the first connecting terminal C1 can be prevented from being exposed to the outside of the first external electrode 131.

[0074] There is no particular limitation on the thickness tg of the glass layer 140; however, in this embodiment, the thickness tg of the glass layer 140 may be less than the thickness te of the first external electrode 131. When tg is greater than te, there may be a problem of excessively large dimensions of the multilayer electronic components. For example, tg may be greater than or equal to 5 μm and less than or equal to 20 μm.

[0075] Glass layer 140 may include, for example, a first glass. The first glass may include one or more selected from the group consisting of Ba, Si, Zn, Ca, Al, and Mg. Furthermore, the first external electrodes 131 and 134 may include first substrate electrode layers 131a and 134a, which are in contact with the first connection terminals C1 and C4 and comprise a metal and a second glass. The second glass may include one or more selected from the group consisting of Ba, Si, Zn, Ca, Al, and Mg, and may also have a different composition than the first glass.

[0076] In an embodiment, when the ratio of the sum of the moles of Ba and Si constituting the first glass to the total moles of all elements constituting the first glass except oxygen is M1, and the ratio of the sum of the moles of Ba and Si constituting the second glass to the total moles of all elements constituting the second glass except oxygen is M2, M1 > M2 can be satisfied. When M1 > M2, the softening temperature of the first glass can be higher than that of the second glass. As a result, when the first substrate electrode layers 131a and 134a are formed after the glass layer 140 is formed, softening of the first glass can be prevented, thereby maintaining the shape of the glass layer 140.

[0077] The molar number of the components of the first and second glasses can be measured from images observed using scanning electron microscopy-energy dispersive X-ray spectroscopy (SEM-EDS). Specifically, after polishing the multilayer electronic assembly 100 to expose cross-sections in the second and third directions at the central portion in the first direction, the composition of the central portion of the glass layer 140 can be analyzed using EDS, and M1 and M2 can be calculated based on the sum of the molar numbers of Ba and Si and the total molar number of the remaining elements except oxygen.

[0078] Hereinafter, an example of a method for forming a multilayer electronic component 100 will be described. However, the manufacturing method of the multilayer electronic component 100 is not limited thereto.

[0079] First, a ceramic powder for forming the dielectric layer 111 is prepared. The ceramic powder may include, for example, one or more selected from the group consisting of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5). For example, BaTiO3 powder can be synthesized by reacting a titanium raw material such as titanium dioxide with a barium raw material such as barium carbonate. The synthesis method of the ceramic powder may include, for example, methods such as the solid-phase method, the sol-gel method, the hydrothermal synthesis method, etc., but the present disclosure is not limited thereto. Next, the prepared ceramic powder is dried and milled, and then an organic solvent (such as ethanol) and a binder (such as polyvinyl butyral) are mixed to prepare a ceramic slurry, and then the ceramic slurry is coated on a carrier film and dried to prepare a ceramic green sheet.

[0080] Next, a conductive paste (containing metal powder, binder, organic solvent, etc.) for forming an internal electrode is printed onto the ceramic green sheet with a predetermined thickness using a screen printing method or a gravure printing method to form an internal electrode pattern.

[0081] Thereafter, the ceramic green sheet printed with the internal electrode pattern is peeled off from the carrier film, and then a predetermined number of layers of the ceramic green sheets printed with the internal electrode pattern are stacked and pressed to form a ceramic stack. On the upper and lower parts of the ceramic stack, ceramic green sheets without an internal electrode pattern for forming the covering parts 112 and 113 can be stacked in a predetermined number of layers to form the covering parts 112 and 113 after sintering. Thereafter, the ceramic stack can be cut into pieces with a predetermined size, and the cut pieces can be sintered at a temperature of greater than or equal to 1000°C and less than or equal to 1400°C to form the main body 110.

[0082] Next, a glass layer 140 may be formed. For example, a paste (including first glass powder, adhesive, organic solvent, etc.) for forming the glass layer may be applied to the fifth surface 5 and / or the sixth surface 6 of the body 110, and then the glass layer 140 may be formed by sintering at a first temperature of 500°C to 900°C.

[0083] Subsequently, external electrodes 131, 132, 133, and 134 can be formed. For example, when the substrate electrode layers 131a, 132a, 133a, and 134a include sintered electrode layers, the conductive paste (including metal powder, second glass powder, binder, organic solvent, etc.) used to form the external electrodes can be sintered at a second temperature of 500°C to 900°C to form the substrate electrode layers 131a, 132a, 133a, and 134a, thereby forming sintered electrode layers. The first substrate electrode layers 131a and 134a can be formed by transferring the conductive paste used to form the external electrodes onto the glass layer 140 and then sintering it, and the second substrate electrode layer 132a and the third substrate electrode layer 133a can be formed by immersing the third surface 3 and the fourth surface 4 of the body 110 into the conductive paste used to form the external electrodes and then sintering it, respectively; however, this disclosure is not limited thereto.

[0084] To prevent the first glass from softening during the process of forming the substrate electrode layers 131a, 132a, 133a, and 134a, preferably, the first temperature may be higher than the second temperature. For example, the first temperature may be higher than the softening temperature of the first glass, and the second temperature may be lower than the softening temperature of the first glass but higher than the softening temperature of the second glass.

[0085] In addition, when the substrate electrode layers 131a, 132a, 133a and 134a include resin electrode layers, after the sintered electrode layers are formed, a conductive resin composition (including metal powder, resin, binder and organic solvent) can be coated onto the sintered electrode layers, and then a curing heat treatment can be performed at a temperature of 250°C to 550°C to form the resin electrode layers.

[0086] In addition, electroplating and / or electroless plating can be further performed to form plating layers 131b, 132b, 133b and 134b on the substrate electrode layers 131a, 132a, 133a and 134a.

[0087] (Example) The present disclosure will be described in more detail below with examples. However, the examples are intended only to help in understanding the present disclosure, and the scope of the disclosure is not limited to the examples.

[0088] Sample sheets of Examples 1 to 7 were prepared using the method described above for manufacturing multilayer electronic components. In the sample sheets, glass layers are respectively disposed on the fifth and sixth surfaces, and include a first glass layer and a second glass layer spaced apart from each other in a second direction. The substrate electrode layer consists of a sintered electrode layer, and the sintered electrode layer includes Cu as a metallic component. The plating consists of a Ni plating layer and a Sn plating layer sequentially formed on the substrate electrode layer. The sample sheets have dimensions of 1005 (length: approximately 1.0 mm, width: approximately 0.5 mm, thickness: approximately 0.5 mm).

[0089] Example 1 In Example 1, the first and second glass layers are configured not to cover the first connection terminal. Specifically, the first and second glass layers are disposed outside the first connection terminal. Since the first and second glass layers do not cover the first connection terminal, L2 / L1 is determined to be 1.

[0090] Examples 2 to 7 In Examples 2 through 7, the first glass layer is configured to cover one end of the first connecting terminal in the second direction, and the second glass layer is configured to cover the other end of the first connecting terminal in the second direction. The polished sections of each sample piece to the center in the first direction are observed using an optical microscope or a scanning electron microscope in the second and third directions to measure L1 and L2, and the values ​​of L2 / L1 are then listed in Table 1 below.

[0091] Comparative example Except for the absence of a glass layer, the comparative example sample sheet was manufactured using the same method as that used to manufacture the sample sheet according to the embodiment. Since no glass layer was formed on the comparative example sample sheet, L2 / L1 was determined to be 1.

[0092] Moisture-proof reliability evaluation For the comparative examples and each of Examples 1 through 7, 100 sample pieces were mounted on a printed circuit board (PCB) and subjected to a voltage of 6.3V for 15 hours at 85°C and 85% relative humidity (RH). Sample pieces were evaluated as defective when the insulation resistance (IR) value decreased by more than an order of magnitude or more compared to the initial IR value. The number of defective sample pieces was then measured, and the results are listed in Table 1 below.

[0093] ESR rating ESR was measured using an inductance-capacitance-resistance (LCR) meter (frequency: 500kHz, surface mount device (SMD) clamp-on probe). For the comparative example and each of Examples 1 through 7, ESR was measured for 10 sample pieces, and the average values ​​are shown in Table 1 below.

[0094] The final evaluation result is determined by considering both moisture resistance reliability and ESR. Excellent moisture resistance reliability and ESR are marked with ◎, good moisture resistance reliability and ESR are marked with ○, average moisture resistance reliability and ESR are marked with △, and poor moisture resistance reliability and ESR are marked with X.

[0095] [Table 1]

[0096] Referring to Table 1, it can be confirmed that because the comparative example sample does not include a glass layer, the moisture-proof reliability of the comparative example sample is significantly lower (e.g., the number of defective sample pieces is relatively large). Furthermore, it can be confirmed that because the glass layer is configured not to cover the first connection terminal, the moisture-proof reliability of the sample in Example 1 is insufficient. In the cases of Examples 2 and 3, it can be confirmed that although the moisture-proof reliability is improved compared to the comparative examples and Example 1, a moisture-proof reliability defect still exists because L2 / L1 exceeds 0.90.

[0097] However, it can be confirmed that because L2 / L1 satisfies less than or equal to 0.90, no moisture-proof reliability defects are found in Examples 4 to 7.

[0098] In Examples 4 and 5, it is confirmed that the ESR increases by only about 0.2 mΩ compared to Examples 2 and 3, without any defects in moisture-proof reliability. In Example 6, the ESR increases by about 0.8 mΩ compared to Examples 2 and 3, without any defects in moisture-proof reliability. Therefore, Examples 4 to 6 are evaluated as having a practical advantage compared to Examples 1 to 3.

[0099] In Example 7, the moisture resistance reliability was improved, but the ESR increased by about 1.5 mΩ compared with Examples 2 and 3. Therefore, the electrical characteristics of the sample were confirmed to be significantly degraded.

[0100] In other words, when 0.74≤L2 / L1≤0.90 is satisfied, it can be confirmed that multilayer electronic components with excellent moisture resistance, reliability and excellent electrical properties can be provided.

[0101] This disclosure is not limited to the embodiments and drawings described above, and the scope of this disclosure is defined by the appended claims. Therefore, those skilled in the art can make various substitutions, modifications, or alterations without departing from the scope of this disclosure as defined by the appended claims, and such substitutions, modifications, or alterations should be construed as being included within the scope of this disclosure.

[0102] Furthermore, the phrase "example embodiment" does not imply the same embodiment and is provided to emphasize and explain different unique features. However, the embodiments presented above do not preclude implementation in combination with features of another embodiment. For example, although something described in a particular embodiment is not described in another embodiment, it may be understood as a description relating to the other embodiment unless there is a description in another embodiment that contradicts or contradicts it.

[0103] In this disclosure, the term "connection" includes not only direct connections but also indirect connections such as those via adhesive layers. Furthermore, the term "electrical connection" includes both cases where elements are physically connected and cases where elements are not physically connected. Additionally, the terms "first," "second," etc., can be used to distinguish one element from another and do not limit the order and / or importance associated with said elements. In some cases, without departing from the scope of the claims, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0104] While embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component, comprising: The main body includes: a dielectric layer and a first inner electrode and a second inner electrode alternately disposed in a first direction, wherein the dielectric layer is disposed between the first inner electrode and the second inner electrode, and includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in the third direction; A glass layer is disposed on at least one of the fifth and sixth surfaces; A first external electrode is disposed on the glass layer and connected to the first internal electrode; and The second and third external electrodes are respectively disposed on the third and fourth surfaces and connected to the second internal electrode. The first inner electrode has a connection terminal extending to at least one of the fifth and sixth surfaces. The glass layer is configured to cover a portion of the connection terminal. When the length of the connecting terminal in the second direction is L1, and the length of the area of ​​the connecting terminal in contact with the first external electrode in the second direction is L2, L1 and L2 satisfy 0.74≤L2 / L1≤0.

90.

2. The multilayer electronic component according to claim 1, wherein, L1 and L2 satisfy L2 / L1≥0.

81.

3. The multilayer electronic component according to claim 1, wherein, The glass layer includes: a first glass layer configured to cover one end of the connection terminal in the second direction; and a second glass layer spaced apart from the first glass layer and configured to cover the other end of the connection terminal in the second direction.

4. The multilayer electronic component according to claim 3, wherein, The first glass layer is configured to extend from at least one of the fifth and sixth surfaces to a portion of the first surface and / or a portion of the second surface. The second glass layer is configured to extend from at least one of the fifth and sixth surfaces to a portion of the first surface and / or a portion of the second surface.

5. The multilayer electronic component according to claim 1, wherein, In the cross-sections of the multilayer electronic assembly in the second direction and the third direction, the length of the region of the glass layer that does not contact the connection terminal in the second direction is greater than the length of the remaining region of the glass layer that contacts the connection terminal in the second direction.

6. The multilayer electronic assembly according to claim 1, wherein, The first external electrode is configured to completely cover the glass layer.

7. The multilayer electronic assembly according to claim 1, wherein, The first external electrode includes a base electrode layer in contact with the connection terminal and a plating layer disposed on the base electrode layer.

8. The multilayer electronic component according to claim 7, wherein, One end of the glass layer in the second direction is exposed from the substrate electrode layer. The coating is configured to cover one end of the glass layer in the second direction.

9. The multilayer electronic assembly according to claim 7, wherein, One end of the glass layer in the second direction is exposed from the coating.

10. The multilayer electronic assembly according to claim 1, wherein, The glass layer includes a first glass, which comprises one or more selected from the group consisting of Ba, Si, Zn, Ca, Al and Mg.

11. The multilayer electronic assembly according to claim 10, wherein, The first external electrode includes a substrate electrode layer, which is in contact with the connection terminal and includes metal and a second glass. When the ratio of the sum of the moles of Ba and Si constituting the first glass to the total moles of all elements constituting the first glass except oxygen is M1, and the ratio of the sum of the moles of Ba and Si constituting the second glass to the total moles of all elements constituting the second glass except oxygen is M2, The condition M1 > M2 is satisfied.

12. The multilayer electronic assembly according to claim 1, wherein, The thickness of the glass layer in the third direction is less than the thickness of the first external electrode in the third direction.

13. The multilayer electronic assembly according to claim 1, wherein, The glass layer is configured to be spaced apart from the second external electrode and the third external electrode.

14. The multilayer electronic assembly according to claim 1, wherein, The maximum length of the first external electrode in the second direction is greater than L1.

15. The multilayer electronic assembly according to claim 1, wherein, The first inner electrode includes: a main portion, stacked with the second inner electrode in the first direction; and a lead-out portion extending from the main portion to at least one of the fifth and sixth surfaces. The lead-out portion is not overlapped with the second inner electrode in the first direction and has the connection terminal.

16. The multilayer electronic assembly according to claim 15, wherein, The maximum length of the main part in the second direction is greater than L1.

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