Substrate surface treatment for rib bonding
By treating the substrate surface, especially by texturing and marking the barrier layer in areas prone to failure, the bonding defect problem between the reinforcing rib and the substrate was solved, improving the bonding strength and reliability.
CN122294941APending Publication Date: 2026-06-26INTEL CORP
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Patent Information
- Application Number
- CN202511689279.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-12-24
- Filing Date
- 2025-11-18
- Publication Date
- 2026-06-26
AI Technical Summary
Technical Problem
In the prior art, bonding defects between the reinforcing ribs and the substrate surface, such as delamination and solder mask tearing, lead to copper trace interconnection breakage, which is difficult to effectively control through online detection.
Method used
Before attaching the reinforcing ribs, the substrate surface is treated with marking equipment to clean and increase wettability and roughness, especially in areas prone to failure, and adhesive bonding is improved through texturing and barrier layers.
Benefits of technology
It effectively reduces defects such as stiffener delamination and solder mask tearing, improves the bonding strength between the stiffener and the substrate, and reduces the risk of defects.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122294941A_ABST
Abstract
A device package and a method for forming the device package are described. The device package includes a substrate and reinforcing ribs. A portion of the top surface of the substrate is treated to alter the contour of the portion before the reinforcing ribs are attached. When the reinforcing ribs are attached to the substrate, an adhesive material applied between the bottom surface of the reinforcing ribs and the treated substrate creates a more durable bond. The in-line process of treating the substrate to alter the contour includes marking the portion of the top surface with patterning and / or barrier layers, which generate textures that improve the surface wettability and effectiveness of the adhesive material filling and reduce defects in the device package, including reinforcing rib delamination.
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