Multi-station injection semi-solid injection molding mold

Abstract

This invention discloses a multi-station injection semi-solid injection mold in the field of injection molding dies, including a lower mold, an upper mold, and a rotating motor. Three mold slots are provided on one side of the lower mold, and three cleaning slots are provided on the other side. Mounting side plates are welded to the sides of the cleaning slots, and triangular prism-shaped angle adjustment blocks are welded to the mounting side plates. Three cleaning electric push rods are bolted to the angle adjustment blocks. An L-shaped mounting bracket is welded to the bottom of the lower mold, and a mounting base plate is welded to the center of the mounting bracket. The rotating motor is located at the center of the mounting base plate. The upper mold is slidably connected to the top of the lower mold. The upper mold has vertically arranged top injection ports corresponding to the mold slots and cleaning slots, and side injection ports are obliquely downwards on the sides of the upper mold. This invention allows for cleaning of the other half of the mold while one half is being processed, making it convenient to use, delaying the solidification time of the semi-solid raw material, and enabling the mold to process larger workpieces.

Description

Technical Field

[0001] This invention relates to the field of injection molding dies, specifically to semi-solid injection molding dies for multi-station injection. Background Technology

[0002] The principle of semi-solid metal injection molding is similar to that of plastic injection molding. Injection molding integrates the preparation, transportation, and molding of semi-solid metal slurry, effectively solving the problems of difficulty in storing, transporting, and controlling the molding of semi-solid metal slurry, thus opening up new prospects for the application of semi-solid metal forming technology.

[0003] Existing semi-solid injection molding dies often leave some raw material residue at the injection port after processing and demolding, requiring manual cleaning to avoid affecting subsequent processing. Furthermore, due to the rapid solidification rate of semi-solid materials, when processing larger workpieces, the material at the bottom may begin to solidify before injection is complete, impacting product quality. Therefore, those skilled in the art have provided multi-station injection semi-solid injection molding dies to solve the problems mentioned in the background art. Summary of the Invention

[0004] The purpose of this invention is to provide a semi-solid injection molding die with multi-station injection to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A multi-station semi-solid injection molding die includes a lower die, an upper die, and a rotating motor. The lower die has an "I"-shaped structure. Three mold slots are provided on one side of the lower die, and three cleaning slots are provided on the other side. A cleaning column is vertically provided at the bottom of each cleaning slot. A mounting side plate is welded to the side of the cleaning slot. An angle adjustment block in the shape of a triangular prism is welded to the mounting side plate. Three cleaning electric push rods are bolted to the angle adjustment block. The output end of the cleaning electric push rod passes through the angle adjustment block and the mounting side plate. An L-shaped mounting bracket is welded to the bottom of the lower die. A mounting base plate is welded to the center of the mounting bracket. A rotating motor is located at the center of the mounting base plate. The upper die is slidably connected to the top of the lower die. The upper die has a top injection port vertically provided at the positions corresponding to the mold slots and cleaning slots. Side injection ports are obliquely downward provided on the sides of the upper die. A rotating shaft is located at the center of the bottom of the upper die. The output end of the rotating motor is slidably connected to the rotating motor.

[0007] As a further aspect of the present invention: a semiconductor cooling chip is provided at the bottom of each mold slot, an electric temperature control module is provided at the bottom of the semiconductor cooling chip, and a heat dissipation module is provided at the bottom of the electric temperature control module.

[0008] As a further embodiment of the present invention: the side injection port is located at the center of the mold groove, the top injection port is located at an eccentric position in the mold groove, and the cleaning column is slidably connected to the top injection port.

[0009] As a further embodiment of the present invention: a rotating hole is provided through the center of the lower mold, the rotating shaft is slidably connected to the rotating hole, and a limit connector is connected to the bottom of the rotating shaft by a thread, and a square rotating bolt insertion groove is provided at the center of the limit connector.

[0010] As a further embodiment of the present invention: a square column-shaped rotating bolt is fixedly connected to the output end of the rotating motor, and the rotating bolt and the rotating bolt insertion groove are slidably connected.

[0011] As a further embodiment of the present invention: a rotating column is provided at the top of the upper mold, a rotating connector is provided at the top of the rotating column, a square equipment connecting plate is welded to the top of the rotating connector, the four corners of the equipment connecting plate are provided with connecting threaded holes, and a rotating tenon mounting groove is provided at the bottom of the rotating connector. The rotating column and the tenon mounting groove are rotatably connected.

[0012] As a further embodiment of the present invention, a reinforcing crossbeam is horizontally welded to the inner side of the mounting bracket.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] 1. In this invention, after processing is completed, the upper mold is lifted by the lifting device, and the upper mold and lower mold are slidably connected. After demolding, the rotating motor drives the upper mold to rotate 180°, and the half of the upper mold that has just been processed is transferred to the cleaning groove of the lower mold. After the upper mold is pressed down, one side of the mold groove continues to be processed. The cleaning column on one side of the cleaning groove is inserted into the top injection port to discharge the waste material from the upper mold. The cleaning electric push rod works to discharge the waste material in the side injection port into the bottom of the cleaning groove, reducing manual operation and improving processing quality and efficiency.

[0015] 2. In the multi-station injection process, the present invention heats the semiconductor cooling chip through the temperature control module at the bottom of the mold groove, thereby increasing the temperature of the mold groove. After the semi-solid metal raw material is injected into the mold groove, the solidification rate is slowed down. After the injection is completed, the polarity of the current of the temperature control module is changed to cool down the semiconductor cooling chip, thereby increasing the solidification rate of the raw material and improving work efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the present invention;

[0017] Figure 2This is a top view of the structure of the present invention;

[0018] Figure 3 This is a schematic diagram of the cross-section AA in this invention;

[0019] Figure 4 This is a schematic diagram of the lower mold structure in this invention;

[0020] Figure 5 This is a schematic diagram of the bottom structure of the upper mold in this invention;

[0021] Figure 6 This is a schematic diagram of the rotating connector in this invention.

[0022] In the diagram: 1. Lower mold; 2. Upper mold; 3. Mounting bracket; 4. Reinforcing beam; 5. Heat dissipation module; 6. Rotating connector; 7. Mounting side plate; 8. Angle adjustment block; 9. Cleaning electric push rod; 10. Mounting base plate; 11. Top injection port; 12. Side injection port; 13. Semiconductor cooling chip; 14. Temperature control module; 15. Rotating column; 16. Rotating motor; 17. Rotating bolt; 18. Rotating shaft; 19. Limiting connector; 20. Mold groove; 21. Cleaning groove; 22. Cleaning column; 23. Rotating hole; 24. Rotating bolt insertion groove; 25. Equipment connecting plate; 26. Connecting threaded hole; 27. Rotating tenon mounting groove. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Please see Figures 1-6In this embodiment of the invention, the multi-station injection semi-solid injection molding die includes a lower die 1, an upper die 2, and a rotating motor 16. The lower die 1 has an "I"-shaped structure. Three mold slots 20 are provided on one side of the lower die 1, and three cleaning slots 21 are provided on the other side of the lower die 1. A cleaning post 22 is vertically provided at the bottom of each cleaning slot 21. A mounting side plate 7 is welded to the side of the cleaning slot 21. An angle adjustment block 8 in the shape of a triangular prism is welded to the mounting side plate 7. Three cleaning electric push rods 9 are bolted to the angle adjustment block 8. The output end of the cleaning electric push rod 9 passes through the angle adjustment block 8 and the mounting side plate 7. An L-shaped mounting rod is welded to the bottom of the lower die 1. The bracket 3 has a mounting base plate 10 welded to its center. A rotating motor 16 is located at the center of the mounting base plate 10. The upper mold 2 is slidably connected to the top of the lower mold 1. The upper mold 2 has a top injection port 11 vertically positioned corresponding to the mold groove 20 and the cleaning groove 21. Side injection ports 12 are obliquely downward positioned on the sides of the upper mold 2. A rotating shaft 18 is located at the center of the bottom of the upper mold 2. The output end of the rotating motor 16 is slidably connected to the rotating shaft. When the mold is working, half of the mold groove 20 is processed, and the other half of the cleaning groove 21 cleans the injection ports of the upper mold 2, reducing manual operation, facilitating subsequent processing, and improving work efficiency.

[0025] Each mold groove 20 is provided with a semiconductor cooling chip 13 at the bottom, an electric temperature control module 14 at the bottom of the semiconductor cooling chip 13, and a heat dissipation module 5 at the bottom of the electric temperature control module 14. The semiconductor cooling chip 13 is used to keep the mold groove 20 of the lower mold 1 warm, slowing down the solidification rate of the semi-solid raw material, so that larger workpieces can be processed.

[0026] The side injection port 12 is located at the center of the mold groove 20, and the top injection port 11 is located at the eccentric position of the mold groove 20. The cleaning column 22 and the top injection port 11 are slidably connected to reduce the distance between the two injection ports and prevent the raw materials from interfering with each other during injection.

[0027] Among them, a rotating hole 23 is provided through the center of the lower mold 1, and the rotating shaft 18 is slidably connected to the rotating hole 23. The bottom of the rotating shaft 18 is connected to a limit connector 19 by a thread to prevent the upper mold 2 from rising too high and disengaging from the lower mold 1. A square rotating bolt insertion groove 24 is provided at the center of the limit connector 19.

[0028] Among them, a square column-shaped rotating bolt 17 is fixedly connected to the output end of the rotating motor 16. The rotating bolt 17 and the rotating bolt insertion slot 24 are slidably connected. The connection method is simple and reliable and easy to disassemble.

[0029] The upper mold 2 is provided with a rotating column 15 at its top, a rotating connector 6 at its top, a square equipment connecting plate 25 welded to the top of the rotating connector 6, and connecting threaded holes 26 at the four corners of the equipment connecting plate 25 to facilitate the installation of the upper mold 2 on the pressing equipment. The bottom of the rotating connector 6 is provided with a rotating tenon mounting groove 27, and the rotating column 15 and the tenon mounting groove are rotatably connected.

[0030] Among them, a reinforcing beam 4 is horizontally welded to the inner side of the mounting frame to improve the structural strength of the lower mold 1 during installation.

[0031] The working principle of this invention is as follows: An external lifting device presses down to make the upper mold 2 fit against the lower mold 1. The rotating shaft 18 is slidably connected to the rotating hole 23. The injection device injects raw material into the top injection port 11 and side injection port 12 of the upper mold 2 located on one side of the mold groove 20. During this process, the temperature control module 14 activates the semiconductor cooling chip 13 to heat the raw material in the mold groove 20, preventing solidification before injection is complete and improving processing quality. After injection is complete, the temperature control module 14 cools the semiconductor cooling chip 13, accelerating the solidification speed of the raw material in the mold groove 20 and improving work efficiency. After processing is complete, the upper mold 2 is lifted by the lifting device. Mold 2 is slidably connected to lower mold 1, rotating shaft 18 is slidably connected to rotating hole 23, and rotating bolt 17 is slidably connected to rotating bolt insertion slot 24. After demolding, rotating motor 16 rotates to drive upper mold 2 to rotate 180°. Upper mold 2 is slidably connected to rotating connector 6, and the half of upper mold 2 that has just been processed is transferred to the cleaning groove 21 above lower mold 1. After upper mold 2 is pressed down, one side of mold groove 20 continues to be processed, while the cleaning column 22 on one side of cleaning groove 21 is inserted into the top injection port 11 to discharge waste material from upper mold 2. The cleaning electric push rod 9 works to discharge the waste material in the side injection port 12 into the bottom of cleaning groove 21, reducing manual operation and improving processing quality and efficiency.

[0032] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A semi-solid injection molding die with multi-station injection, comprising a lower die (1), an upper die (2), and a rotating motor (16), characterized in that: The lower mold (1) has an "I" shaped structure. Three mold slots (20) are provided on one side of the lower mold (1), and three cleaning slots (21) are provided on the other side. A cleaning column (22) is vertically installed at the bottom of each cleaning slot (21). A mounting side plate (7) is welded to the side of each cleaning slot (21). An angle adjustment block (8) in the shape of a triangular prism is welded to the mounting side plate (7). Three cleaning electric push rods (9) are bolted to the angle adjustment block (8). The output end of each cleaning electric push rod (9) passes through the angle adjustment block (8) and the mounting side plate (7). The lower mold (1)... The bottom of the lower mold (1) is welded with an L-shaped mounting bracket (3), and a mounting base plate (10) is welded to the center of the mounting bracket (3). A rotating motor (16) is set at the center of the mounting base plate (10). The top of the lower mold (1) is slidably connected to an upper mold (2). The upper mold (2) is vertically provided with a top injection port (11) corresponding to the mold groove (20) and the cleaning groove (21). The upper mold (2) is obliquely provided with a side injection port (12) on its side. A rotating shaft (18) is set at the center of the bottom of the upper mold (2). The output end of the rotating motor (16) is slidably connected to the rotating shaft.

2. The semi-solid injection molding die with multi-station injection as described in claim 1, characterized in that: Each of the mold slots (20) is provided with a semiconductor cooling chip (13) at the bottom, an electric temperature control module (14) is provided at the bottom of the semiconductor cooling chip (13), and a heat dissipation module (5) is provided at the bottom of the electric temperature control module (14).

3. The semi-solid injection molding die with multi-station injection as described in claim 1, characterized in that: The side injection port (12) is located at the center of the mold groove (20), the top injection port (11) is located at the eccentric position of the mold groove (20), and the cleaning column (22) is slidably connected to the top injection port (11).

4. The semi-solid injection molding die with multi-station injection as described in claim 1, characterized in that: A rotating hole (23) is provided through the center of the lower mold (1). The rotating shaft (18) is slidably connected to the rotating hole (23). The bottom of the rotating shaft (18) is connected to a limit connector (19) by a thread. A square rotating bolt insertion groove (24) is provided at the center of the limit connector (19).

5. The semi-solid injection molding die with multi-station injection as described in claim 1, characterized in that: A square column-shaped rotating bolt (17) is fixedly connected to the output end of the rotating motor (16), and the rotating bolt (17) and the rotating bolt insertion groove (24) are slidably connected.

6. The semi-solid injection molding die with multi-station injection as described in claim 1, characterized in that: The top of the upper mold (2) is provided with a rotating column (15), the top of the rotating column (15) is provided with a rotating connector (6), the top of the rotating connector (6) is welded with a square equipment connecting plate (25), the four corners of the equipment connecting plate (25) are provided with connecting threaded holes (26), the bottom of the rotating connector (6) is provided with a rotating tenon mounting groove (27), and the rotating column (15) and the tenon mounting groove are rotatably connected.

7. The semi-solid injection molding die with multi-station injection as described in claim 1, characterized in that: A reinforcing crossbeam (4) is horizontally welded to the inner side of the mounting bracket.

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