A highly reliable adaptive assembly and welding equipment for curved circuits and its welding method

Abstract

This application discloses a highly reliable adaptive assembly and welding equipment and method for curved circuits. The welding equipment includes a base platform equipped with a five-axis turntable module, a three-dimensional reconstruction module, a solder paste removal module, a solder paste spraying module, a resistor mounting module, a laser welding and AOI inspection module, and a solder joint repair module. The welding method utilizes the aforementioned welding equipment. The beneficial effects of this application are: it enables precise assembly and adaptive welding of micro-mount and through-hole components; it supports multi-functional collaborative control of solder paste removal, solder paste spraying, resistor mounting, laser welding and AOI inspection, and solder joint repair; and it features intelligent perception of process characteristics, quality data analysis and decision-making, and adaptive execution of the process. This improves both production efficiency and the consistency and stability of curved circuit assembly and welding quality, ensuring the performance and long-term reliability of antenna products.

Description

Technical Field

[0001] This application belongs to the field of microelectronic assembly technology, specifically relating to a highly reliable adaptive assembly and welding equipment for curved circuits and its welding method. Background Technology

[0002] Curved circuits refer to electronic circuits fabricated on non-planar substrates, breaking through the limitations of traditional circuit boards (PCBs) which must be rigid and flat, allowing electronic components to be attached to curved and irregular substrate surfaces. Compared to traditional planar circuits, curved circuits have the advantages of maximizing space utilization and functional integration, and can perfectly fit the product shape to achieve "mechatronics integration," which is beneficial for the ultra-thinning and miniaturization of electronic devices.

[0003] The curved circuit, mainly composed of surface-mount components, through-hole components, and radiating patterns, is a crucial functional component that determines the performance of antenna products. The quality of its assembly and soldering directly affects the performance of the antenna product. Its structure is characterized by a large radius of curvature, small component size, and high distribution density, making it difficult to manufacture and resulting in poor stability of forming quality.

[0004] Compared to flat surfaces, curved surfaces exhibit uneven gravity distribution, which can easily lead to uneven solder paste application, difficulty in positioning and displacement of small resistors, and challenges in controlling mounting pressure. During soldering, the varying distances between different locations on the curved surface and the heat source result in uneven thermal and tension distribution, making it highly susceptible to quality issues such as cold solder joints, tombstoning, and overheating damage. Furthermore, traditional AOI inspection methods struggle to provide clear and consistent imaging of solder joints on curved surfaces, leading to high rates of misjudgment and missed detection of solder joint quality. Currently, the assembly and soldering of curved circuits primarily relies on manual operation, resulting in low production efficiency, high labor costs, poor soldering consistency and stability, high long-term reliability risks, and difficulties in reworking and repairing defective solder joints. Summary of the Invention

[0005] The purpose of this application is to provide a highly reliable adaptive assembly and welding equipment and welding method for curved circuits, which can realize the precision assembly and adaptive welding of antenna radiation patterns and micro-mounted and through-hole components. It supports multi-functional collaborative control of the entire process of tinning and gold removal, solder paste spraying, resistor mounting, laser welding and AOI inspection and solder joint rework, thereby improving production efficiency while enhancing welding consistency and solder joint reliability.

[0006] The objective of this application is achieved through the following technical solution: A highly reliable adaptive assembly and welding equipment for curved circuits includes a base platform. The base platform is equipped with a five-axis rotary table module, a 3D reconstruction module, a tinning and gold removal module, a solder paste spraying module, a resistor mounting module, a laser welding and AOI inspection module, and a solder joint repair module. The five-axis rotary table module is used to clamp the workpiece and move it to the processing station, while also adjusting the workpiece's posture to ensure that the surface processing points remain perpendicular to the execution end during processing. The 3D reconstruction module is used to determine the difference between the actual and theoretical models of the workpiece and to obtain the normal vectors of the curved solder joints, providing a foundation for surface alignment data in subsequent processing. The tinning and gold removal module is used to tinnate, remove gold, and then tinnate again the areas of the workpiece to be welded. The solder paste spraying module is used to precisely spray solder paste onto the processing points of the workpiece before soldering through-hole devices or before resistor mounting. The resistor mounting module is used for the precise mounting of chip resistors on the workpiece. The laser welding and AOI inspection module is used for the precision welding of micro-devices on the workpiece and for post-weld photographic inspection of the processing points. The solder joint repair module is used to desolder defective solder joints on the workpiece and to clean up the solder pads.

[0007] Furthermore, the five-axis rotary table module includes a rotary table adjustment base, a high-precision AC dual-axis rotary module, a workpiece clamping table, and a clamping fixture. The rotary table adjustment base is mounted on the base platform for moving the position of the workpiece. The high-precision AC dual-axis rotary module is mounted on the rotary table adjustment base for adjusting the workpiece's posture. The workpiece clamping table is mounted on the high-precision AC dual-axis rotary module for supporting the workpiece. The clamping fixture is mounted on the workpiece clamping table for positioning and clamping workpieces of different specifications.

[0008] Furthermore, the three-dimensional reconstruction module includes a field-of-view adjustment base and a three-dimensional modeling camera. The field-of-view adjustment base is mounted on the base platform to adjust the field of view of the three-dimensional modeling camera. The three-dimensional modeling camera is mounted on the field-of-view adjustment base to cooperate with the workpiece pose adjustment to realize the all-round information acquisition of the workpiece and the reconstruction of the three-dimensional digital model.

[0009] Furthermore, the tinning and gold removal module includes a tinning adjustment base, a tinning monitoring camera, a wire feeding and soldering module, and a tinning suction gun. The tinning adjustment base is mounted on the base platform to adjust the tinning and gold removal operation position. The tinning monitoring camera, the wire feeding and soldering module, and the tinning suction gun are all mounted on the tinning adjustment base. The tinning monitoring camera is used to identify the position of the tinning and gold removal operation. The wire feeding and soldering module is used for automated supply of solder wire and soldering. The tinning suction gun is used for melting and suction of solder.

[0010] Furthermore, the solder paste spraying module includes a spraying adjustment base, a glue spraying module, a coordinate acquisition module, and a recycling and cleaning module. The spraying adjustment base is mounted on the base platform to adjust the position of the solder paste spraying. The glue spraying module and the coordinate acquisition module are both mounted on the spraying adjustment base. The glue spraying module is used to spray solder paste and precisely control the spraying amount. The coordinate acquisition module is used to acquire the pad size and coordinate information. The recycling and cleaning module is mounted on the base platform to recycle excess solder paste on the glue spraying module and clean the nozzle.

[0011] Furthermore, the resistor mounting module includes a mounting adjustment base, a material tray, a mounting test module, a position acquisition module, and a ZR force control module. The mounting adjustment base is mounted on the base platform to adjust the position of the resistor mounting. The material tray is mounted on the base platform to place the raw materials of the chip resistor. The mounting test module is mounted on the base platform to perform real-time detection of mounting pressure. The position acquisition module and the ZR force control module are both mounted on the mounting adjustment base. The position acquisition module is used to obtain the processing point position information. After the ZR force control module picks up the chip resistor, it performs precise mounting of the chip resistor in conjunction with the resistor mounting position and workpiece posture adjustment.

[0012] Furthermore, the laser welding and AOI inspection module includes a welding and measurement adjustment base, a temperature measuring welding module, and an inspection module. The welding and measurement adjustment base is mounted on the base platform to adjust the welding or inspection position. The temperature measuring welding module and the inspection module are both mounted on the welding and measurement adjustment base. The temperature measuring welding module performs laser welding on the processing point in conjunction with the workpiece posture adjustment. The inspection module is used to inspect the weld points and screen out defective weld points.

[0013] Furthermore, the solder joint rework module includes a rework adjustment base, a desoldering module, and a desoldering desoldering gun. The rework adjustment base is mounted on the base platform for adjusting the desoldering position. The desoldering module and the desoldering desoldering gun are both mounted on the rework adjustment base. The desoldering module is used for desoldering the solder joints, and the desoldering desoldering gun is used for removing solder and cleaning the solder pads.

[0014] Furthermore, it also includes a collaborative control system. The collaborative control system is used for information reading and independent control of each functional module, and supports the establishment of hardware communication links and collaborative control between functional modules. The collaborative control system is composed of a CNC system and process software. The CNC system realizes precise motion control of functional modules through drivers and completes signal acquisition and control of each functional module. At the same time, it monitors the position of functional modules in real time. The process software is responsible for coordinating and controlling process parameters and equipment processing parameters.

[0015] A welding method using a highly reliable adaptive assembly and welding equipment for curved circuits, comprising the following steps: Step 1: Place the workpiece in the machine. The five-axis rotary table module clamps and positions the workpiece. The collaborative control system performs a self-check and determines whether the workpiece is clamped. After the self-check is completed, the workpiece model is imported into the equipment database. Step 2: The five-axis rotary table module moves the workpiece to the three-dimensional reconstruction module. The three-dimensional reconstruction module collects data, and the collaborative control system analyzes the data to perform three-dimensional digital model reconstruction, intelligently plan the machining path motion data, and transmit it to the host computer. The collaborative control system drives the five-axis rotary table module to complete the workpiece's pose adjustment. Step 3: Depending on the requirements, proceed to Step 3 or directly to Step 4. The five-axis rotary table module moves the workpiece to the tinning and gold removal module. The collaborative control system interacts with the workpiece to identify the size and position of the pads at the processing point, and intelligently retrieves the tinning and gold removal process parameters. The tinning and gold removal module heats, tinns and removes gold from the pads and electronic component pins at the processing point, and then tinns them again. Step 4: The five-axis rotary table module moves the workpiece to the solder paste spraying module. The collaborative control system interacts with the workpiece to identify the size and position of the solder pads at the processing point, intelligently retrieves the solder paste spraying process parameters, and the solder paste spraying module sprays a quantitative amount of solder paste at the processing point. Step 5: The five-axis rotary table module moves the workpiece to the resistor mounting module. The collaborative control system completes real-time intelligent force control by collecting data. The resistor mounting module picks up the chip resistor of the corresponding specification and performs accurate mounting by adjusting the workpiece position. Step 6: The five-axis rotary table module moves the workpiece to the laser welding and AOI inspection module. The collaborative control system intelligently matches the optimal laser welding process parameters based on the data acquisition, and performs laser welding on the mounted or through-hole components through the laser welding and AOI inspection module. Step 7: After laser welding is completed, the weld quality is inspected by the laser welding and AOI inspection module, and then defective welds are screened and their locations are fed back. Step 8: The solder joint repair module moves to desolder and clean up defective solder joints. Repeat steps 4 to 7 to complete the assembly and welding of all electronic components. Step 9: Processing complete, remove the workpiece.

[0016] The beneficial effects of this application are: (1) It can realize the precision assembly and adaptive soldering of micro-mounted components and through-hole components. It supports multi-functional collaborative control of tinning and gold removal, solder paste spraying, resistor mounting, laser welding and AOI inspection and solder joint repair. It has the characteristics of intelligent perception of process features, quality data analysis and decision-making, and adaptive execution of process. It realizes the leap from "experience-based welding-dominated manual assembly welding" to "adaptive intelligent control automatic assembly welding", which not only improves production efficiency, but also improves the consistency and stability of curved circuit assembly welding quality, and ensures the performance and long-term reliability of antenna products.

[0017] (2) A high-precision process control technology with multi-actuator coordination guided by vision tracking is adopted, which can realize the precise positioning, identification and data acquisition of feature points. Through the interaction of algorithms and databases, high-precision control of the end effector is achieved, with repeatability better than ±30μm. Non-contact laser welding is adopted, which is clean and simple to process, and the micron-level spot forming accuracy is much higher than that of traditional welding processes. Through automatic inspection and repair technology, the quality of all solder joints in curved circuit assembly is fully automated in real time, and defective solder joints are repaired. This solves the problems of omissions and misjudgments caused by manual inspection, and the overall quality of solder joints is improved.

[0018] The aforementioned main solution and its various further alternatives can be freely combined to form multiple solutions, all of which are solutions that can be adopted and are claimed in this application; furthermore, the (non-conflicting alternatives) can also be freely combined with each other and with other alternatives. Those skilled in the art, after understanding the solution of this application, will realize from the prior art and common general knowledge that there are many combinations, all of which are technical solutions to be protected by this application, and will not be exhaustively listed here. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the external shape of the welding equipment in this application.

[0020] Figure 2 This is a structural schematic diagram of the welding equipment of this application.

[0021] Figure 3 This is a structural schematic diagram of the five-axis rotary table module of this application.

[0022] Figure 4 This is a schematic diagram of the structure of the three-dimensional reconstruction module of this application.

[0023] Figure 5 This is a schematic diagram of the tinning and gold removal module of this application.

[0024] Figure 6 This is a structural schematic diagram of the solder paste spraying module of this application.

[0025] Figure 7 This is a schematic diagram of the resistor mounting module of this application.

[0026] Figure 8 This is a schematic diagram of the laser welding and AOI inspection module of this application.

[0027] Figure 9 This is a structural schematic diagram of the solder joint repair module in this application.

[0028] Figure 10 This is the control principle diagram of the collaborative control system of this application.

[0029] Figure 11 This is a schematic diagram of the welding method of this application.

[0030] In the diagram: 1-Basic platform, 2-Five-axis rotary table module, 3-3D reconstruction module, 4-Tinning and gold removal module, 5-Solder paste spraying module, 6-Resistor mounting module, 7-Laser welding and AOI inspection module, 8-Solder joint repair module, 9-Collaborative control system; 201-Rotary table adjustment base, 202-High-precision AC dual-axis rotary module, 203-Workpiece clamping table, 204-Clamping fixture; 301-Field of view adjustment base, 302-3D modeling camera; 401-Tinning adjustment base, 402-Tinning monitoring camera, 403-Wire feeding welding... Modules include: 404-Tinking desoldering gun; 501-Spraying adjustment base; 502-Glue spraying module; 503-Coordinate acquisition module; 504-Recycling and cleaning module; 601-Placement adjustment base; 602-Packet; 603-Placement testing module; 604-Point acquisition module; 605-ZR force control module; 701-Soldering test adjustment base; 702-Temperature measuring soldering module; 703-Detection module; 801-Rework adjustment base; 802-Desoldering module; 803-Desoldering desoldering gun; 901-CNC system; 902-Process software. Detailed Implementation

[0031] The following non-limiting embodiments are used to illustrate this application.

[0032] Example 1 refer to Figures 1-10 As shown, a highly reliable adaptive assembly and welding equipment for curved circuits includes a base platform 1, on which are mounted a five-axis turntable module 2, a three-dimensional reconstruction module 3, a tinning and gold removal module 4, a solder paste spraying module 5, a resistor mounting module 6, a laser welding and AOI inspection module 7, a solder joint repair module 8, and a collaborative control system 9.

[0033] The basic platform 1 serves as a load-bearing, protective, alarm, and ventilation unit, consisting of a bed, worktable, and structural components. The five-axis rotary table module 2 clamps the workpiece and moves it to the machining station, while also adjusting the workpiece's pose to ensure that the machining points on the curved surface remain perpendicular to the end effector. The 3D reconstruction module 3 determines the difference between the actual workpiece model and the theoretical model, and obtains the normal vectors of the weld points on the curved surface, providing a foundation of surface alignment data for subsequent machining processes.

[0034] The tinning and gold removal module 4 is used to tin-plat, remove gold, and then tin-plat again the areas of the workpiece to be soldered. The solder paste spraying module 5 is used to precisely spray solder paste onto the processing points of the workpiece before soldering through-hole devices or mounting resistors. The resistor mounting module 6 is used for the precise mounting of chip resistors on the workpiece. The laser welding and AOI inspection module 7 is used for the precision welding of micro-devices on the workpiece and for post-weld photographic inspection of the processing points. The solder joint rework module 8 is used for desoldering defective solder joints on the workpiece and for cleaning the solder pads.

[0035] The collaborative control system 9 is developed based on the equipment's processing workflow. It is used for information reading and independent control of each functional module. Specifically, it is responsible for information reading and independent control of all module units such as end effectors, turntable motion, vision recognition and detection, and supports the establishment of hardware communication links and collaborative control between functional modules.

[0036] The five-axis rotary table module 2 includes a rotary table adjustment base 201, a high-precision AC dual-axis rotary module 202, a workpiece clamping table 203, and a clamping fixture 204. The rotary table adjustment base 201, mounted on the base platform 1, is used to move the workpiece to its corresponding module position. The high-precision AC dual-axis rotary module 202, mounted on the rotary table adjustment base 201, is used to adjust the workpiece's posture. It has bidirectional rotation functions along the A-axis and C-axis, enabling leveling of the machining points on curved workpieces, ensuring that the machining points remain perpendicular to the end effector, and improving machining quality.

[0037] The workpiece clamping table 203 is mounted on the high-precision AC dual-axis rotary module 202 to support the workpiece. The clamping fixture 204 is mounted on the workpiece clamping table 203 and works with the workpiece clamping table 203 to position and clamp workpieces of different specifications. The clamping fixture 204 can be replaced according to the workpiece's external dimensions.

[0038] The 3D reconstruction module 3 includes a field-of-view adjustment base 301 and a 3D modeling camera 302. The field-of-view adjustment base 301, mounted on the base platform 1, is used to adjust the field of view of the 3D modeling camera 302. The field of view is adjusted by moving the 3D modeling camera 302 via the field-of-view adjustment base 301. Different travel ranges of the field-of-view adjustment base 301 can be replaced according to the size of the product under test. The 3D modeling camera 302, mounted on the field-of-view adjustment base 301, works in conjunction with workpiece pose adjustment to achieve omnidirectional information acquisition and 3D digital model reconstruction of the workpiece.

[0039] The soldering and gold removal module 4 includes a soldering adjustment base 401, a soldering monitoring camera 402, a wire feeding and soldering module 403, and a soldering suction gun 404. The soldering adjustment base 401 is mounted on the base platform 1 to adjust the operation position of the soldering and gold removal. The soldering monitoring camera 402, the wire feeding and soldering module 403, and the soldering suction gun 404 are all mounted on the soldering adjustment base 401. The soldering monitoring camera 402 is used to identify the position of the soldering and gold removal operation. The wire feeding and soldering module 403 is used for automated supply and soldering of solder wire. The soldering suction gun 404 is used for melting and suction of solder.

[0040] Tinning and gold removal are only for pre-soldering treatments where there is a risk of gold brittleness. The heating temperature and time for tinning and gold removal should be adjusted according to the grade of solder to be soldered. The 404 tinning desoldering gun used in this example can also be changed to other commonly used soldering tools such as soldering irons and solder pots, depending on the specifications and characteristics of different soldering components.

[0041] The solder paste spraying module 5 includes a spraying adjustment base 501, a glue spraying module 502, a coordinate acquisition module 503, and a recycling and cleaning module 504. The spraying adjustment base 501 is mounted on the base platform 1 to adjust the position of the solder paste spraying. The glue spraying module 502 and the coordinate acquisition module 503 are both mounted on the spraying adjustment base 501. The glue spraying module 502 is used to spray solder paste and precisely control the spraying amount. The coordinate acquisition module 503 is used to acquire the pad size and coordinate information. The recycling and cleaning module 504 is mounted on the base platform 1 to collect excess solder paste from the glue spraying module 502 and clean the nozzle.

[0042] Before spraying, the coordinate acquisition module 503 uses a camera and telecentric lens to photograph and identify the workpiece processing points, obtaining the pad dimensions and X and Y axis coordinates. A displacement sensor is used to measure the height, obtaining the Z-axis coordinates of the point to be processed. During adhesive spraying, the adhesive spraying module 502 adjusts its position via the spraying adjustment base 501, and the nozzle sprays the adhesive. The adhesive spraying valve and level sensor work together to precisely control the amount of solder paste sprayed. Before the actual solder paste spraying, a soldering test is performed, and a cleaning box is used to collect the test solder paste and excess solder paste. After soldering, the nozzles are cleaned promptly with a brush to prevent clogging.

[0043] The resistor mounting module 6 includes a mounting adjustment base 601, a material tray 602, a mounting test module 603, a position acquisition module 604, and a ZR force control module 605. The mounting adjustment base 601 is mounted on the base platform 1 to adjust the resistor mounting position. The material tray 602 is mounted on the base platform 1 to hold the raw materials for the chip resistors. The mounting test module 603 is mounted on the base platform 1 for real-time detection of mounting pressure. Both the position acquisition module 604 and the ZR force control module 605 are mounted on the mounting adjustment base 601. The position acquisition module 604 obtains the processing point position information. After picking up the chip resistor, the ZR force control module 605, in conjunction with the resistor mounting position and workpiece posture adjustment, performs precise mounting of the chip resistor.

[0044] The material tray 602 is used to hold the raw materials for the chip resistors. Before mounting, chip resistors of the appropriate specifications must be configured according to the pad size. A mounting force test is required before mounting. Precise positioning is achieved using the Mark board in the mounting test module 603, and real-time monitoring of mounting pressure is performed using a pressure sensor to control steady-state pressure accuracy and prevent pressure overshoot. The point acquisition module 604 uses a camera and telecentric lens to photograph and identify the workpiece processing points and collect information, obtaining the processing point location information.

[0045] The laser welding and AOI inspection module 7 includes a welding and measurement adjustment base 701, a temperature-measuring welding module 702, and an inspection module 703. The welding and measurement adjustment base 701 is mounted on the base platform 1 to adjust the welding or inspection position. The temperature-measuring welding module 702 and the inspection module 703 are both mounted on the welding and measurement adjustment base 701. The temperature-measuring welding module 702 performs laser welding on the processing point in conjunction with the workpiece posture adjustment, and the inspection module 703 is used for weld point inspection and screening out defective weld points.

[0046] The temperature-measuring welding module 702 is positioned and moved under the detection module 703 via the welding measurement adjustment base 701 to adjust the orientation of the processing point and perform laser welding. During the welding process, the temperature-measuring welding module 702 simultaneously exhausts fumes. After welding is completed, the detection module 703 photographs and inspects the weld points and identifies defective weld points. The types of defective weld points include tombstoning, incomplete welding, misalignment, weld accumulation, and bridging.

[0047] The solder joint rework module 8 includes a rework adjustment base 801, a desoldering module 802, and a desoldering desoldering gun 803. The rework adjustment base 801 is mounted on the base platform 1 to adjust the desoldering position. The desoldering module 802 and the desoldering desoldering gun 803 are both mounted on the rework adjustment base 801. The desoldering module 802 is used for desoldering the solder joints, and the desoldering desoldering gun 803 is used for removing solder and cleaning the solder pads.

[0048] The desoldering module 802 can use suitable desoldering tools such as hot air guns and miniature electric tweezers to desolder the solder joints. Excess solder is removed by the desoldering desoldering gun 803, and the pads are cleaned with anhydrous ethanol. Flux is then applied to the pads in the cleaned area. The desoldering tools can be changed and adjusted according to the type of component and the type of defective solder joint. Other common tools include desoldering wicks, soldering irons, and lint-free paper.

[0049] The collaborative control system 9 is mainly responsible for reading and independently controlling the information of all module units, including the end effectors (turntable adjustment base 201, high-precision AC dual-axis rotation module 202, clamping fixture 204, field of view adjustment base 301, tinning adjustment base 401, wire feeding and soldering module 403, tinning desoldering gun 404, spraying adjustment base 501, glue spraying module 502, recycling and cleaning module 504, mounting adjustment base 601, material tray 602, mounting test module 603, ZR force control module 605, soldering test adjustment base 701, temperature measurement soldering module 702, rework adjustment base 801, desoldering module 802 and desoldering desoldering gun 803) and vision recognition and detection (3D modeling camera 302, tinning monitoring camera 402, coordinate acquisition module 503, point acquisition module 604, detection module 703). It also supports the establishment of hardware communication links and collaborative control between functional modules.

[0050] The collaborative control system 9 consists of a CNC system 901 and process software 902. The CNC system 901 achieves precise motion control of the functional modules through drivers and completes signal acquisition and control of each functional module, while monitoring the position of the functional modules in real time. The process software 902 is responsible for coordinating and controlling process parameters and equipment processing parameters.

[0051] The CNC system 901 achieves precise motion control of the end effector by driving the motor and completes signal acquisition and control of various functional modules, as well as real-time monitoring of the end effector position. The process software 902 is mainly responsible for coordinating and controlling process parameters and equipment processing parameters, including process parameter database, equipment database, intelligent assembly and welding control integrated software, and multi-vision measurement system integrated software.

[0052] The process parameter database functions to regulate and record key process parameters for the assembly and soldering of curved circuits. Specifically, it includes relevant process parameters for soldering and gold removal, solder paste application, resistor mounting, and laser soldering. Soldering and gold removal process parameters include: soldering temperature, soldering time, gold removal temperature, gold removal time, re-soldering temperature, and re-soldering time. Solder paste application process parameters include: solder paste application time, solder paste application pressure, and re-soldering time. Resistor mounting process parameters include: mounting pressure, mounting time, and component mounting position. Laser soldering process parameters include: soldering duration, soldering temperature, laser spot size, and soldering power.

[0053] The equipment database functions to regulate and record key equipment data during production, including equipment operating speed, power, position, assembly force, and temperature. The intelligent assembly and welding control software is used to achieve intelligent planning of model tasks, simulation, coordinate import, visual positioning, height measurement, wire feeding, heating, solder suction, solder application, chip placement, welding, and post-weld inspection. The multi-vision measurement system software has functions such as system calibration, image preprocessing, 3D surface reconstruction, precise solder joint identification and positioning, through-hole gap identification and display, data storage and display, and data output.

[0054] Example 2 refer to Figures 1-11 As shown, a welding method for a highly reliable adaptive assembly welding equipment for curved circuits, using the highly reliable adaptive assembly welding equipment for curved circuits as described in Example 1, includes the following steps.

[0055] Step 1: Place the workpiece in the machine. The five-axis rotary table module 2 (clamping fixture 204) clamps and positions the workpiece. The collaborative control system 9 performs a self-check and determines whether the workpiece is clamped. After the self-check is completed, the workpiece model is imported into the equipment database.

[0056] Step 2: The five-axis rotary table module 2 (driven by the CNC system) moves the workpiece to the three-dimensional reconstruction module 3. The three-dimensional reconstruction module 3 (three-dimensional modeling camera 302) collects data, and the collaborative control system 9 analyzes the data, performs three-dimensional digital model reconstruction, intelligently plans the machining path motion data, and transmits it to the host computer. The collaborative control system 9 (CNC system) drives the five-axis rotary table module 2 to complete the workpiece's pose adjustment.

[0057] Step 3: Depending on the requirements, proceed to Step 3 or directly to Step 4. The five-axis rotary table module 2 (driven by the CNC system) moves the workpiece to the tinning and gold removal module 4. The collaborative control system 9 (CNC system and process software) interacts with the workpiece to identify the size and position of the pads at the processing point, and intelligently retrieves the tinning and gold removal process parameters. The tinning and gold removal module 4 (wire feeding and welding module 403 in conjunction with tinning and desoldering gun 404) heats, tinns and removes gold from the pads and electronic component pins at the processing point, and then tinns them again.

[0058] Step 4: The five-axis rotary table module 2 (driven by the CNC system) moves the workpiece to the solder paste spraying module 5. The collaborative control system 9 (CNC system and process software) interacts with the workpiece to identify the size and position of the solder pads at the processing point, and intelligently retrieves the solder paste spraying process parameters. The solder paste spraying module 5 (spraying module 502) sprays the solder paste at the processing point in a quantitative manner.

[0059] Step 5: The five-axis rotary table module 2 (driven by the CNC system) moves the workpiece to the resistor mounting module 6. The collaborative control system 9 (process software) completes real-time intelligent force control by collecting data. The resistor mounting module 6 picks up the chip resistor of the corresponding specification (ZR force control module 605 picks up the chip resistor on the tray 602) and accurately mounts it by adjusting the workpiece position.

[0060] Step 6: The five-axis rotary table module 2 (driven by the CNC system) moves the workpiece to the laser welding and AOI inspection module 7. The collaborative control system 9 (process software) intelligently matches the optimal laser welding process parameters based on the data acquisition, and performs laser welding on the mounted or through-hole components through the laser welding and AOI inspection module 7 (temperature measuring welding module 702).

[0061] Step 7: After laser welding is completed, the weld quality is inspected by laser welding and AOI detection module 7 (detection module 703), and then defective welds are screened and their locations are fed back.

[0062] Step 8: The solder joint repair module 8 moves to desolder and clean up defective solder joints. Repeat steps 4 to 7 to complete the assembly and welding of all electronic components.

[0063] Step 9: Processing complete, remove the workpiece.

[0064] The foregoing basic examples and their further alternative examples can be freely combined to form multiple embodiments, all of which are embodiments that can be adopted and claimed in this application. In the scheme of this application, each alternative example can be arbitrarily combined with any other basic example and alternative example.

[0065] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A highly reliable adaptive assembly and welding equipment for curved circuits, comprising a base platform (1), characterized in that: The basic platform (1) is equipped with a five-axis rotary table module (2), a three-dimensional reconstruction module (3), a tinning and gold removal module (4), a solder paste spraying module (5), a resistor mounting module (6), a laser welding and AOI inspection module (7), and a solder joint repair module (8). The five-axis rotary table module (2) is used to clamp the workpiece and move it to the processing station. It is also used to adjust the workpiece posture to ensure that the surface processing points are perpendicular to the execution end during processing. The three-dimensional reconstruction module (3) is used to obtain the difference between the actual model and the theoretical model of the workpiece and to obtain the normal vector of the surface solder joint, which is used for subsequent processing. The continuous processing flow provides the data basis for surface alignment. The tinning and gold removal module (4) is used to tinnate, remove gold and tinnate again the parts of the workpiece to be welded. The solder paste spraying module (5) is used to accurately spray solder paste on the processing points of the workpiece before welding the through-hole device or before mounting the resistor. The resistor mounting module (6) is used for the accurate mounting of chip resistors on the workpiece. The laser welding and AOI inspection module (7) is used for the precision welding of micro-devices on the workpiece and to take post-weld photos of the processing points. The solder joint repair module (8) is used to desolder the defective solder joints on the workpiece and to clean up the solder pads.

2. The highly reliable adaptive assembly and welding equipment for curved circuits according to claim 1, characterized in that: The five-axis rotary table module (2) includes a rotary table adjustment base (201), a high-precision AC dual-axis rotary module (202), a workpiece clamping table (203), and a clamping fixture (204). The rotary table adjustment base (201) is mounted on the base platform (1) for moving the position of the workpiece. The high-precision AC dual-axis rotary module (202) is mounted on the rotary table adjustment base (201) for adjusting the position of the workpiece. The workpiece clamping table (203) is mounted on the high-precision AC dual-axis rotary module (202) for supporting the workpiece. The clamping fixture (204) is mounted on the workpiece clamping table (203) for positioning and clamping workpieces of different specifications.

3. The highly reliable adaptive assembly and welding equipment for curved circuits according to claim 1, characterized in that: The three-dimensional reconstruction module (3) includes a field-of-view adjustment base (301) and a three-dimensional modeling camera (302). The field-of-view adjustment base (301) is mounted on the base platform (1) to adjust the field of view of the three-dimensional modeling camera (302). The three-dimensional modeling camera (302) is mounted on the field-of-view adjustment base (301) to cooperate with the workpiece pose adjustment to realize the all-round information acquisition of the workpiece and the reconstruction of the three-dimensional digital model.

4. The highly reliable adaptive assembly and welding equipment for curved circuits according to claim 1, characterized in that: The tinning and gold removal module (4) includes a tinning adjustment base (401), a tinning monitoring camera (402), a wire feeding and soldering module (403), and a tinning suction gun (404). The tinning adjustment base (401) is mounted on the base platform (1) to adjust the tinning and gold removal operation position. The tinning monitoring camera (402), the wire feeding and soldering module (403), and the tinning suction gun (404) are all mounted on the tinning adjustment base (401). The tinning monitoring camera (402) is used to identify the position of the tinning and gold removal operation. The wire feeding and soldering module (403) is used for the automated supply of solder wire and soldering. The tinning suction gun (404) is used for the melting and suction of solder.

5. The highly reliable adaptive assembly and welding equipment for curved circuits according to claim 1, characterized in that: The solder paste spraying module (5) includes a spraying adjustment base (501), a glue spraying module (502), a coordinate acquisition module (503), and a recycling and cleaning module (504). The spraying adjustment base (501) is mounted on the base platform (1) to adjust the position of the solder paste spraying. The glue spraying module (502) and the coordinate acquisition module (503) are both mounted on the spraying adjustment base (501). The glue spraying module (502) is used to spray the solder paste and accurately control the amount of spraying. The coordinate acquisition module (503) is used to acquire the size of the solder pad and coordinate information. The recycling and cleaning module (504) is mounted on the base platform (1) to recycle excess solder paste on the glue spraying module (502) and clean the nozzle.

6. The highly reliable adaptive assembly and welding equipment for curved circuits according to claim 1, characterized in that: The resistor mounting module (6) includes a mounting adjustment base (601), a material tray (602), a mounting test module (603), a position acquisition module (604), and a ZR force control module (605). The mounting adjustment base (601) is mounted on the base platform (1) to adjust the position of the resistor mounting. The material tray (602) is mounted on the base platform (1) to place the raw materials of the chip resistor. The mounting test module (603) is mounted on the base platform (1) to perform real-time detection of mounting pressure. The position acquisition module (604) and the ZR force control module (605) are both mounted on the mounting adjustment base (601). The position acquisition module (604) is used to obtain the processing point position information. After the ZR force control module (605) picks up the chip resistor, it performs precise mounting of the chip resistor in conjunction with the resistor mounting position and workpiece posture adjustment.

7. The highly reliable adaptive assembly and welding equipment for curved circuits according to claim 1, characterized in that: The laser welding and AOI inspection module (7) includes a welding and measurement adjustment base (701), a temperature measuring welding module (702), and an inspection module (703). The welding and measurement adjustment base (701) is mounted on the base platform (1) to adjust the welding or inspection position. The temperature measuring welding module (702) and the inspection module (703) are both mounted on the welding and measurement adjustment base (701). The temperature measuring welding module (702) performs laser welding on the processing point in conjunction with the workpiece posture adjustment. The inspection module (703) is used for weld point inspection and screening out defective weld points.

8. The highly reliable adaptive assembly and welding equipment for curved circuits according to claim 1, characterized in that: The solder joint repair module (8) includes a repair adjustment base (801), a desoldering module (802), and a desoldering desoldering gun (803). The repair adjustment base (801) is mounted on the base platform (1) to adjust the desoldering position. The desoldering module (802) and the desoldering desoldering gun (803) are both mounted on the repair adjustment base (801). The desoldering module (802) is used for desoldering the solder joints, and the desoldering desoldering gun (803) is used for removing solder and cleaning the solder pads.

9. The highly reliable adaptive assembly and welding equipment for curved surface circuits according to claim 1, characterized in that: It also includes a collaborative control system (9), which is used for information reading and independent control of each functional module, and supports the establishment of hardware communication links and collaborative control between each functional module. The collaborative control system (9) is composed of a numerical control system (901) and process software (902). The numerical control system (901) realizes precise motion control of the functional modules through the driver and completes the signal acquisition and control of each functional module. At the same time, it monitors the position of the functional modules in real time. The process software (902) is responsible for coordinating and controlling the process parameters and equipment processing parameters.

10. A welding method for a highly reliable adaptive assembly and welding equipment for curved circuits, characterized in that, The highly reliable adaptive assembly and welding equipment for curved circuits as described in any one of claims 1 to 9 includes the following steps: Step 1: Place the workpiece in the machine. The five-axis rotary table module (2) clamps and positions the workpiece. The collaborative control system (9) performs a self-check and determines whether the workpiece is clamped. After the self-check is completed, the workpiece model is imported into the equipment database. Step 2: The five-axis rotary table module (2) drives the workpiece and moves it to the three-dimensional reconstruction module (3). The three-dimensional reconstruction module (3) collects data, and the collaborative control system (9) analyzes the data, performs three-dimensional digital model reconstruction, intelligently plans the machining path motion data and transmits it to the host computer. The collaborative control system (9) drives the five-axis rotary table module (2) to move and complete the workpiece's pose adjustment. Step 3: Depending on the requirements, proceed to Step 3 or directly to Step 4. The five-axis rotary table module (2) moves the workpiece to the tinning and gold removal module (4). The collaborative control system (9) performs action interaction to identify the size and position of the processing point pads and intelligently retrieves the tinning and gold removal process parameters. The tinning and gold removal module (4) heats, tinns and removes gold from the pads and electronic component pins that need tinning and gold removal at the processing point. Step 4: The five-axis rotary table module (2) moves the workpiece to the solder paste spraying module (5), and the collaborative control system (9) performs action interaction to realize the identification of the size and position of the processing point solder pad, intelligently retrieves the solder paste spraying process parameters, and the solder paste spraying module (5) performs quantitative spraying of solder paste at the processing point. Step 5, the five-axis turntable module (2) moves the workpiece to the resistor mounting module (6), the collaborative control system (9) completes real-time intelligent force control by collecting data, the resistor mounting module (6) picks up the chip resistor of the corresponding specification and performs accurate mounting by adjusting the workpiece position; Step 6: The five-axis turntable module (2) moves the workpiece to the laser welding and AOI inspection module (7). The collaborative control system (9) intelligently matches the optimal laser welding process parameters based on the data acquisition and performs laser welding on the mounted or through-hole devices through the laser welding and AOI inspection module (7). Step 7: After laser welding is completed, the weld quality is inspected by the laser welding and AOI detection module (7), and then defective welds are screened and their locations are fed back. Step 8: The solder joint repair module (8) moves to desolder and clean up the defective solder joints. Repeat steps 4 to 7 to complete the assembly and welding of all electronic components. Step 9: Processing complete, remove the workpiece.

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