A local gold plating device and electroplating system

Abstract

This application relates to the field of partial gold plating technology for leads, and provides a partial gold plating apparatus and electroplating system. The partial gold plating apparatus includes: a receiving component, a first conductive element, and a second conductive element. The receiving component has a receiving cavity and a receiving channel communicating with the receiving cavity. The receiving cavity is used to hold the plating solution, and the receiving channel is used to receive the lead to be gold-plated. The first conductive element is disposed in the receiving cavity and is used to electrically connect to one of the positive or negative terminals of a power supply. The second conductive element is disposed in the receiving cavity and is used to electrically connect to the other of the positive or negative terminals of the power supply. Along the height direction of the partial gold plating apparatus, the receiving channel, the second conductive element, and the first conductive element are arranged sequentially from top to bottom at intervals. At least one of the receiving channel and / or the second conductive element abuts against the lead to be gold-plated to limit the movement of the lead to be gold-plated. This application can solve the problem of gold resource waste caused by full gold plating.

Description

Technical Field

[0001] This application relates to the field of partial gold plating technology for leads, and more particularly to a partial gold plating apparatus and electroplating system. Background Technology

[0002] In laser manufacturing, the surface treatment of the lead wires is usually done by electroplating to form a gold plating layer to meet the process requirements of chip bonding, conductive connection and anti-oxidation protection.

[0003] However, existing full gold plating processes typically involve uniformly plating the entire lead wire, which consumes a large amount of gold material in non-bonding areas, resulting in higher manufacturing costs. At the same time, the plating thickness in different parts is prone to fluctuation due to the influence of current distribution and plating solution flow, which in turn affects bonding consistency and long-term reliability, and increases the difficulty of process control and the burden of waste liquid treatment.

[0004] In related technologies, full gold plating leads to a waste of gold resources. Summary of the Invention

[0005] This application provides a partial gold plating device and electroplating system, which can solve the problem of gold resource waste caused by full gold plating.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] In a first aspect, this application provides a local gold plating apparatus, comprising:

[0008] The receiving assembly has a receiving cavity and a receiving channel communicating with the receiving cavity. The receiving cavity is used to hold the plating solution, and the receiving channel is used to hold the lead wire to be plated with gold.

[0009] A first conductive element is disposed within the receiving cavity, and the first conductive element is used to electrically connect to either the positive or negative terminal of the power supply.

[0010] The second conductive element is disposed in the receiving cavity. The second conductive element is used to electrically connect to the other of the positive or negative pole of the power supply. Along the height direction of the partial gold plating device, the receiving channel, the second conductive element and the first conductive element are arranged alternately from top to bottom.

[0011] In this embodiment, at least one of the receiving channel and / or the second conductive element abuts against the lead to be plated with gold to limit the movement of the lead to be plated with gold.

[0012] In some possible implementations, the second conductive element is a mesh component, and the plating solution is used to flow through the pores of the mesh component to the lead to be plated with gold;

[0013] Alternatively, a flow guide hole is provided on the second conductive component, through which the plating solution flows to the gold-plated lead.

[0014] In some possible implementations, the second conductive element is a mesh component, the lead to be plated with gold abuts against the mesh component, and the cross-sectional area of ​​the pores on the mesh component is smaller than the cross-sectional area of ​​the lead to be plated with gold.

[0015] In some possible implementations, the outer periphery of the lead to be gold-plated is covered with an insulating shell on the side away from the receiving component, and the insulating shell abuts against the receiving component;

[0016] The cross-sectional area of ​​the receiving channel is A1, the cross-sectional area of ​​the lead to be gold-plated is A2, and the total cross-sectional area of ​​the lead to be gold-plated and the insulating shell is A3. The cross-sectional areas A1 and A2 of the receiving channel and the lead to be gold-plated, and the total cross-sectional area of ​​the lead to be gold-plated and the insulating shell, A3, satisfy the following:

[0017] A2≤A1<A3.

[0018] In some possible implementations, multiple receiving channels are provided, and the multiple receiving channels are arranged sequentially at intervals along the height direction intersecting the local gold plating device.

[0019] In some possible implementations, the housing component includes:

[0020] A first receiving member, and a first conductive member disposed in the first receiving member;

[0021] The second receiving member is disposed on the first receiving member, and the second conductive member and the receiving channel are disposed on the second receiving member respectively. The first receiving member and the second receiving member enclose each other to form a receiving cavity.

[0022] In some possible implementations, the first receiving member is a groove-shaped structure;

[0023] The partial gold plating device also includes:

[0024] A separator is provided at the bottom of the groove-shaped structure, and the separator extends along the height direction of the partial gold plating device. The highest position of the separator is lower than the opening of the groove-shaped structure along the height direction of the partial gold plating device. The separator is used to divide the groove-shaped structure into an inner groove and an outer groove. The first conductive element is located in the inner groove.

[0025] The second receiving element is placed on the inner groove and covers part of the groove opening.

[0026] In some possible implementations, the second receiving member has a mounting ear that is detachably disposed on the partition.

[0027] In some possible implementations, along the height direction of the partial gold plating device, the surface where the lowest position of the receiving channel is located is coplanar with the surface where the highest position of the separator is located.

[0028] Secondly, this application provides an electroplating system, including a local gold plating device.

[0029] This localized gold plating apparatus, by setting up a receiving component with a receiving cavity and a receiving channel, concentrates the plating solution onto a localized area of ​​the lead to be plated. A first conductive element and a second conductive element, respectively connected to the two poles of a power supply, are set in the receiving cavity. The receiving channel, the second conductive element, and the first conductive element are arranged sequentially and alternately along the height direction. At the same time, the receiving channel and / or the second conductive element are used to abut and limit the lead to be plated. This can limit the position of the lead and stabilize the electroplating area and electric field distribution during the localized gold plating process, thereby reducing the ineffective consumption of gold material in non-bonding areas and improving the uniformity, consistency, and process adaptability of the plating layer in the target area.

[0030] Therefore, the partial gold plating device provided in this application can solve the problem of gold resource waste caused by full gold plating. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 One of the schematic diagrams of the main structure of the partial gold plating device provided in the embodiments of this application;

[0033] Figure 2 A second schematic diagram of the main structure of the partial gold plating device provided in the embodiments of this application;

[0034] Figure 3 The third schematic diagram of the main structure of the partial gold plating device provided in the embodiments of this application.

[0035] Explanation of reference numerals in the attached figures:

[0036] 100 - Receiving assembly; 101 - Receiving cavity; 102 - Receiving channel; 103 - First receiving element; 104 - Second receiving element; 1041 - Mounting ear;

[0037] 200 - First conductive element;

[0038] 300 - Second conductive element;

[0039] 400 - Separator;

[0040] A1 - Cross-sectional area of ​​the accommodating channel;

[0041] A2 - Cross-sectional area of ​​the lead wire to be gold-plated;

[0042] A3 - The total cross-sectional area of ​​the gold-plated leads and insulating shell. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0044] Laser manufacturing falls under the fields of optoelectronic packaging and precision surface treatment. In the production of semiconductor lasers, communication lasers, medical lasers, and high-power lasers, the lead wires in the casing serve as the electrical connection between the chip and external circuits. Their surface condition directly affects subsequent bonding quality, conductivity, and oxidation resistance. To ensure a stable connection between the lead wire ends and the chip or bonding wire, a gold plating layer is typically formed on the lead wire surface on the production line. Corresponding application scenarios generally include lead wire pretreatment, lead wire positioning, electroplating, subsequent cleaning, and drying processes, which are integrated with steps such as casing assembly, die bonding, and wire bonding. Especially in mass production packaging scenarios, lead wires of different specifications need to undergo surface treatment in a relatively stable electroplating environment, thus placing high demands on the plating solution coverage, lead wire placement, and electrical connection stability.

[0045] To overcome the shortcomings of existing technologies, a receiving assembly with a receiving cavity and a receiving channel is provided, which concentrates the plating solution on a local area of ​​the lead to be plated with gold. A first conductive element and a second conductive element are respectively connected to the two poles of the power supply in the receiving cavity. The receiving channel, the second conductive element and the first conductive element are arranged sequentially and alternately along the height direction. At the same time, the receiving channel and / or the second conductive element are used to abut and limit the lead to be plated with gold. This can limit the position of the lead and stabilize the electroplating area and electric field distribution during local gold plating, thereby reducing the ineffective consumption of gold material in non-bonding areas and improving the uniformity, consistency and process adaptability of the plating layer in the target area.

[0046] Therefore, the partial gold plating device provided in this application can solve the problem of gold resource waste caused by full gold plating.

[0047] The contents of this application will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can have a clearer and more detailed understanding of the contents of this application.

[0048] like Figure 1 and Figure 2As shown in the embodiment of this application, a partial gold plating apparatus is provided, including a receiving component 100, a first conductive element 200, and a second conductive element 300. The receiving component 100 includes a receiving cavity 101 and a receiving channel 102 communicating with the receiving cavity 101. The receiving cavity 101 is used to hold the plating solution, and the receiving channel 102 is used to receive the lead wire to be gold-plated. The first conductive element 200 is disposed in the receiving cavity 101 and is used to electrically connect to one of the positive or negative terminals of a power supply. The second conductive element 300 is disposed in the receiving cavity 101 and is used to electrically connect to the other of the positive or negative terminals of the power supply. Along the height direction of the partial gold plating apparatus, the receiving channel 102, the second conductive element 300, and the first conductive element 200 are arranged sequentially from top to bottom at intervals. At least one of the receiving channel 102 and / or the second conductive element 300 abuts against the lead wire to be gold-plated to limit the movement of the lead wire to be gold-plated.

[0049] It should be noted that the receiving component 100 refers to a structural unit used to carry the plating solution and provide a local plating space for the gold-plated lead. Through the spatial cooperation of the cavity and the channel, it limits the gold-plating area of ​​the lead to be plated within a predetermined range, so that the plating solution only acts on the target lead segment and reduces the consumption of precious metals in non-target areas.

[0050] For example, in terms of position and relationship, the receiving component 100 preferably includes an integrally formed receiving member, the receiving member forming a receiving cavity 101, the receiving cavity 101 communicating with the outside through a receiving channel 102 opened on the upper or side, the lead wire to be gold plated is inserted into the receiving channel 102 during assembly and partially extends into the plating solution area of ​​the receiving cavity 101; in terms of shape and material, the receiving member may be an insulating plastic part in one possible embodiment, a ceramic part in another possible embodiment, and a part made of acetal alloy in yet another possible embodiment, and its shape may be a tank type, plug type or detachable modular cavity structure, so as to cooperate with the fixtures, conveying mechanisms or cleaning stations on the production line.

[0051] It should be noted that the first conductive element 200 refers to the electrode component disposed in the receiving cavity 101 and used to electrically connect to one of the positive or negative terminals of the power supply. Its function is to provide a potential end for the migration of metal ions in the plating solution and to form the current path required for electrochemical deposition together with the second conductive element 300.

[0052] For example, in terms of position and relationship, the first conductive element 200 is installed in the lower part or a relatively deep position of the receiving cavity 101 and is in direct contact with the plating solution. It is preferably connected to an external power source by means of screw fixing, clamp fixing, welding fixing or conductive spring connection to ensure conductivity reliability and assembly convenience. In terms of shape and material, the first conductive element 200 may be a stainless steel plate in one possible embodiment, a nickel-plated metal plate in another possible embodiment, and a titanium-based conductive plate in yet another possible embodiment. Its structure may be a flat plate, an arc plate or a conductive plate with openings to adapt to different tank shapes and plating solution flow conditions. In terms of size and proportion, the area of ​​the first conductive element 200 usually covers the effective area of ​​the bottom of the receiving cavity 101 to obtain a more uniform electric field distribution. Its thickness is limited to meet mechanical strength and conductivity performance and is usually less than the effective depth of the receiving cavity 101, thereby reserving space for plating solution circulation and lead wire immersion.

[0053] It should be noted that the second conductive element 300 refers to the electrode component disposed in the receiving cavity 101 and used to electrically connect the other pole of the power supply. It cooperates with the first conductive element 200 to form an electrochemical circuit in the local gold plating process, and adjusts the electric field distribution by its position in the plating solution, so that the target area of ​​the lead wire can more easily obtain a stable and uniform gold layer deposition.

[0054] For example, in terms of position and relationship, the second conductive element 300 is located in the lower middle region between the receiving channel 102 and the first conductive element 200; the second conductive element 300 preferably forms a close-to-face relationship with the lead wire to be plated, or further suppresses swaying by slightly abutting against the lead wire, and can be connected to the power supply by means of screw connection, clamp connection, welding connection or conductive spring connection to adapt to different batch production scenarios; in terms of shape and material, the second conductive element 300 can be a stainless steel mesh in one possible embodiment, a perforated metal plate in another possible embodiment, and a multi-layer composite conductive plate in yet another possible embodiment, and its outline can be a planar sheet, an arc sheet or a partially enclosed shape, so as to ensure the conductive area while taking into account the flow of plating solution and the positioning of the lead wire.

[0055] It should be noted that the receiving channel 102 refers to the channel structure that is connected to the receiving cavity 101 and is used to receive and guide the lead wire to be gold-plated. It determines the starting and ending positions of the gold-plating area by constraining the path of the lead wire, thereby giving the local gold-plating process a clear boundary.

[0056] For example, in terms of position and relationship, the receiving channel 102 is located at the upper part of the partial gold plating device. During assembly, the lead wire to be gold-plated enters the receiving channel 102 from top to bottom and partially extends into the receiving cavity 101. The outlet end of the receiving channel 102 is close to the second conductive element 300 so that the lower end of the lead wire enters the electroplating area. In terms of shape and material, the receiving channel 102 can be a through hole in one possible embodiment, a socket with a guide chamfer in another possible embodiment, and a sleeve structure with a limiting step in yet another possible embodiment. The receiving channel 102 can be set as a round hole, an elliptical hole, or an irregular opening to accommodate leads with different cross-sectional shapes. In terms of size and proportion, the aperture or opening size of the receiving channel 102 matches the outer diameter of the lead wire to be gold-plated, usually forming a small gap fit, so as to achieve stable guidance without significantly damaging the surface of the lead wire. Its length can be set according to the lead wire insertion depth and plating position requirements, thereby defining the gold plating coverage area in the longitudinal direction.

[0057] It should be noted that at least one of the receiving channel 102 and / or the second conductive element 300 abuts against the lead wire to be plated in order to limit the movement of the lead wire. This means that after the lead wire enters the receiving channel 102, it is mechanically limited by the contact between the inner wall of the channel and the outer periphery of the lead wire, or by the slight contact between the second conductive element 300 and the lead wire, or by the cooperation of both, thereby suppressing the swaying, deflection or floating of the lead wire in the plating solution. In terms of position and relationship, the abutment position is preferably set at the upper end or middle boundary of the lead wire entering the gold plating area, so that the lead wire maintains a relatively fixed posture when affected by the buoyancy of the plating solution, liquid flow disturbance or external clamping error.

[0058] Understandably, after the gold-plated lead passes through the receiving channel 102 from above, the receiving channel 102 first guides and initially positions the lead. Then, the lower end of the lead enters the plating solution area within the receiving cavity 101 and is within the electric field range between the second conductive element 300 and the first conductive element 200. After an external power supply applies a potential, gold ions in the plating solution migrate to the target surface of the lead under the drive of the electric field and deposit to form a gold plating layer. Since the receiving channel 102, the second conductive element 300, and the first conductive element 200 are arranged in layers along the height direction, and the receiving channel 102 and / or the second conductive element 200 are layered... The 300 pairs of leads form a contact limit, which can stably maintain the posture of the leads in the plating solution. Therefore, the gold layer can be formed only in the predetermined local area and is not easy to spread to non-target areas. At the same time, it reduces problems such as uneven plating thickness, blurred boundaries or poor adhesion caused by lead shaking. In addition, the receiving cavity 101 concentrates the plating solution, and with the electrode structure arranged at intervals, the electric field distribution can be more concentrated and controllable. This improves the consistency and repeatability of local gold plating and the adaptability of batch processing on the production line, and reduces the need for plating solution overflow, precious metal waste and subsequent finishing processes.

[0059] Furthermore, the second conductive element 300 is a mesh component, and the plating solution is used to flow through the pores of the mesh component to the lead wire to be plated with gold; or, the second conductive element 300 is provided with a flow guide hole, and the plating solution is used to flow through the flow guide hole to the lead wire to be plated with gold.

[0060] In one possible embodiment, the mesh component refers to a conductive carrier with interconnected pores, or the flow guide hole refers to a through-hole structure formed on the body of the second conductive component 300 for liquid passage. Its purpose is to enable the plating solution to form a continuous flow path in the area where the second conductive component 300 is located, and to provide a stable ion supply to the surface of the lead to be plated when energized. This structure serves both as an electrode and as a liquid guide, thus preventing the second conductive component 300 from completely blocking the plating solution, thereby reducing the risk of uneven plating caused by localized shielding. It also allows the plating solution to pass through the mesh or flow guide hole to reach the lead surface under the influence of gravity, liquid surface pressure difference, and electric field, forming a flow field environment suitable for localized gold plating.

[0061] For example, the mesh components can be made of woven stainless steel mesh, welded wire mesh or perforated metal plate, or further use sintered metal mesh to improve structural stability and corrosion resistance; the guide holes can be set as a circular hole array, an oblong hole array or a honeycomb hole array, or slit holes, micro-hole arrays or partial window structures can be used according to structural needs.

[0062] Understandably, the lead to be plated is guided into the receiving cavity 101 by the receiving channel 102 and held in a predetermined position by the contact action of the receiving channel 102 and / or the second conductive element 300. Subsequently, the plating solution establishes a liquid surface in the receiving cavity 101 and forms an electric field after the power is connected. The first conductive element 200 and the second conductive element 300 work as the anode and cathode, or the cathode and anode work together, so that gold ions are deposited in a directional manner on the surface of the lead to be plated. Since the second conductive element 300 adopts a mesh component or has a flow guide hole, the plating solution can continuously flow through the pores or channels to the periphery of the lead and the area to be plated, avoiding the complete blockage of local areas by the second conductive element 300, which would cause liquid stagnation or current shielding. This makes the gold ion concentration distribution on the lead surface more uniform, the current density more stable, and the thickness of the deposited layer more consistent along the length of the lead. At the same time, the second conductive element 300 can still maintain the support and limiting function of the lead, preventing the lead from drifting, lifting, or deviating during the gold plating process. Therefore, a balance can be achieved between smooth conduction and stable positioning. Based on the above process, it can be seen that the structure can improve the coverage of the plating solution on the gold-plated leads, reduce dead corners and local underplating, improve the continuity and consistency of the local gold-plated layer, and facilitate a more stable electrical connection interface during subsequent welding and bonding.

[0063] In one possible implementation, the second conductive element 300 is a mesh component, the lead to be plated with gold abuts against the mesh component, and the cross-sectional area of ​​the pores on the mesh component is smaller than the cross-sectional area of ​​the lead to be plated with gold.

[0064] It should be noted that the cross-sectional area of ​​the pores on the mesh component is smaller than the cross-sectional area of ​​the lead wire to be plated, thus preventing the lead wire from passing through the pores and forcing it to rest on the mesh surface. In this way, the mesh component not only performs the conductive function of the second conductive element 300, but also achieves mechanical restraint through the constraint of the pore size, thereby stabilizing the spatial posture of the lead wire during the gold plating process.

[0065] Understandably, the receiving cavity 101 is pre-filled with plating solution. The second conductive element 300, acting as a mesh component, is installed inside the receiving cavity 101 and electrically connected to one pole of the power supply. After the lead to be plated extends into the receiving channel 102, its plated area moves downward and abuts against the upper surface of the mesh component. Since the cross-sectional area of ​​the pores on the mesh component is smaller than the cross-sectional area of ​​the lead to be plated, the lead will not pass through the pores but will be supported by the mesh surface and held at a predetermined height. At the same time, the plating solution can flow up and down on the mesh surface through the pores of the mesh component, creating a relatively uniform electrolytic environment around the lead. After an electric field is established between the first conductive element 200 and the second conductive element 300, the portion of the lead to be plated exposed in the plating solution receives the gold plating treatment in a stable posture. Because the mesh component has a continuous supporting function and an open-pore guiding function, the lead to be plated is less likely to deviate, sag, or slip through pores during the energization and plating solution disturbance process, thus making the plating deposition position more stable and the thickness distribution more uniform, and helping to improve the surface consistency and conductivity reliability of the subsequent bonding area.

[0066] like Figure 3 As shown, in one possible implementation, the outer periphery of the lead to be gold-plated on the side away from the receiving component 100 is covered with an insulating shell, and the insulating shell abuts against the receiving component 100; the cross-sectional area of ​​the receiving channel 102 is A1, the cross-sectional area of ​​the lead to be gold-plated is A2, and the total cross-sectional area of ​​the lead to be gold-plated and the insulating shell is A3. The cross-sectional area A1 of the receiving channel 102, the cross-sectional area A2 of the lead to be gold-plated, and the total cross-sectional area A3 of the lead to be gold-plated and the insulating shell satisfy the following condition: A2≤A1<A3.

[0067] It should be noted that the insulating shell is an insulating covering layer disposed on the outer periphery of the lead to be gold-plated, away from the receiving assembly 100, for electrical insulation, protection, and limiting of the lead on that side. Its function is to allow the exposed conductive section of the lead to be gold-plated to enter the receiving channel 102, while the portion covered by the insulating shell, after insertion, contacts or closely engages with the receiving assembly 100 through the insulating shell, thereby constraining the radial position and axial insertion depth of the lead, and limiting the contact range of the plating solution through insulation, preventing the gold-plating area from spreading to non-target sections. The insulating shell is typically disposed at the end of the lead to be gold-plated away from the receiving cavity 101 and the second conductive element 300. After installation, it forms a mating interface with the inner wall of the receiving channel 102, the end edge of the receiving assembly 100, or the guide section, so that the lead is first guided into the channel during insertion, and then the outer peripheral covering layer completes the terminal limiting.

[0068] For example, in terms of form, the insulating shell in one possible embodiment may be a heat-shrink tubing, which tightly wraps around the outer periphery of the lead after heating; in another possible embodiment, it may be a polytetrafluoroethylene sleeve, a polyimide tube, or a silicone sheath to obtain resistance to chemical corrosion and electrolyte immersion; it may also be an injection-molded insulating shell, a ceramic sleeve, or a resin insulating layer formed by partially coating the outer periphery of the lead. In terms of material, the insulating shell may be made of polyimide, silicone rubber, epoxy resin, or other insulating materials resistant to electroplating environments to adapt to plating solutions, temperatures, and mechanical friction conditions. In terms of size and proportion, the cross-sectional area A1 of the accommodating channel 102 is not less than the cross-sectional area A2 of the lead body to be gold-plated, ensuring that the bare lead can pass through smoothly and be guided, while A1 is less than the total cross-sectional area A3 of the lead to be gold-plated and the insulating shell, so that the outer periphery after wrapping cannot pass through the channel completely unobstructed, thereby forming a contact limit.

[0069] Understandably, the lead wire to be plated first enters the receiving channel 102 with its bare conductive section exposed, and gradually approaches the plating solution area inside the receiving cavity 101 under the guidance of the receiving channel 102. Since the cross-sectional area A1 of the receiving channel 102 is not less than the cross-sectional area A2 of the lead wire body, the bare lead wire can smoothly enter and maintain a basically coaxial insertion posture. The insulating shell covering the outer periphery of the side away from the receiving component 100, together with the lead wire, forms a total cross-sectional area A3, and A3 is greater than A1. When the lead wire is further inserted, it will abut against the inner wall of the receiving channel 102 or the end of the receiving component 100, thereby limiting the lead wire from sinking further and stabilizing its predetermined position. At this time, the insulating shell provides electrical insulation shielding to the non-gold-plated section, which can prevent the plating solution from adhering to the area that does not need to be gold-plated. At the same time, through contact and cooperation with the receiving component 100, it suppresses the sway and axial movement of the lead wire, so that the area of ​​the lead wire to be plated is stably exposed to the plating solution environment inside the receiving cavity 101. Based on the above-mentioned cooperation relationship, when the plating solution forms an effective current path between the first conductive element 200 and the second conductive element 300, the electrochemical deposition mainly acts on the target gold plating section, while the insulating shell and its limiting effect constrain the plating boundary, reducing the risk of edge plating buildup, plating climb or local short circuit, thereby improving the consistency, selectivity and processing stability of local gold plating.

[0070] Furthermore, multiple receiving channels 102 are provided, and multiple receiving channels 102 are arranged sequentially at intervals along the height direction intersecting the local gold plating device.

[0071] It should be noted that the multiple receiving channels 102 are multiple independent lead receiving holes, slots, or sockets provided on the receiving assembly 100, used to respectively receive the leads to be plated and define their positions, so that each lead to be plated can be arranged in an orderly manner within the same device. Its function is to increase the processing capacity of the local gold plating device by carrying multiple channels in parallel, and by arranging them sequentially at intervals along the height direction, the leads to be plated in different channels do not interfere with each other during loading, insertion, and gold plating, thereby helping to maintain a relatively stable contact relationship between the ends of each lead and the plating solution, the first conductive element 200, and the second conductive element 300.

[0072] Understandably, operators can insert multiple leads to be plated into multiple sequentially spaced receiving channels 102, allowing each lead to maintain a predetermined posture and complete initial positioning under the guidance of the receiving channels 102. Subsequently, the section of the lead to be plated enters the working area connected to the plating solution within the receiving cavity 101. A stable localized electroplating environment is formed through the combined action of the receiving channels 102, the second conductive element 300, and the first conductive element 200. Because the multiple receiving channels 102 are spaced apart along their intersecting height directions of the localized plating device, sufficient space isolation is maintained between different leads, reducing interference from mutual contact, swaying, or liquid cross-contamination. This also facilitates the simultaneous localized plating of multiple leads within the same batch, thereby increasing the processing capacity per unit time. Meanwhile, each receiving channel 102 limits the upper position of the lead wire, making it easier to maintain a consistent insertion depth of the lead wire end in the plating solution. Combined with the current path formed by the second conductive element 300 and the first conductive element 200, multiple leads can be subjected to gold plating under similar immersion and electric field conditions, thereby improving the consistency of the plating thickness distribution and the repeatability of batch processing. Based on the above working process, it can be seen that the structure of multiple receiving channels 102 arranged in sequence and at intervals not only enhances the device's ability to accommodate multiple leads in parallel, but also reduces mutual interference while ensuring stable electrical connection and uniform plating solution coverage, thereby improving the efficiency and stability of local gold plating operations and the adaptability to leads of different specifications.

[0073] The accommodating component 100 provided in the embodiments of this application includes: a first accommodating member 103 and a second accommodating member 104, a first conductive member 200 disposed in the first accommodating member 103; a second accommodating member 104 disposed in the first accommodating member 103, a second conductive member 300 and an accommodating channel 102 disposed in the second accommodating member 104, and the first accommodating member 103 and the second accommodating member 104 forming an accommodating cavity 101.

[0074] It should be noted that the first receiving member 103 is a basic housing component used to carry the plating solution and install the first conductive member 200. In a local gold plating device, it is usually used as a lower liquid-carrying structure, a support structure, and an electrical connection installation structure. The first conductive member 200 is disposed in the first receiving member 103, specifically it can be fixed in the side wall, bottom wall or reserved installation groove of the first receiving member 103, and is connected to one pole of an external power supply through a wire to provide a corresponding potential to the plating solution in the receiving cavity 101.

[0075] It should be noted that the second receiving member 104 is located above or opposite to the first receiving member 103, and a receiving channel 102 is formed on it and a second conductive member 300 is installed. The receiving channel 102 is used for the gold-plated lead wire to pass through and be positioned, and the second conductive member 300 is used to conduct to the other pole of the power supply, thereby forming a stable electric field distribution in the receiving cavity 101.

[0076] It should be noted that after the first receiving member 103 and the second receiving member 104 enclose the receiving cavity 101, the plating solution can be confined within a predetermined area, and the lead wire can form a predetermined local gold plating path with the plating solution and conductive parts after passing through the receiving channel 102. The second receiving member 104 can be understood structurally as a cover, a shield, or a modular component with a channel. It can be connected to the first receiving member 103 by snap-fit, screw-fit, plug-in, or press-fit, so as to achieve separation and maintenance during assembly, cleaning, or specification change. The first receiving member 103 can be a tank, a box, or a base-type shell, preferably made of insulating engineering plastic, ceramic, acetal, or corrosion-resistant composite material to meet the requirements of resistance to plating solution corrosion and dimensional stability.

[0077] In one possible embodiment, the first receiving member 103 can be designed as a rectangular groove, with screw holes, slots, or conductive inserts on its inner wall for fixing the first conductive member 200. The first conductive member 200 can be a plate-shaped copper part, a nickel-based conductive sheet, or a precious metal-coated conductor, with a thickness of 0.5 mm to 5 mm to balance conductivity stability and assembly space. The second receiving member 104 can be designed as a cover-type structure, a top cover-type structure, or a slot-type structure that matches the first receiving member 103. It has a receiving channel 102 and installs the second conductive member 300. The width, height, or diameter of the receiving channel 102 can be set according to the outer diameter, cross-sectional shape, and insulating shell size of the lead wire to be gold-plated to ensure that the lead wire can be accurately guided. The second conductive member 300 is preferably a mesh component, a perforated plate, or a strip-shaped conductive member. The material can be stainless steel, nickel alloy, titanium alloy, copper-based nickel-plated part, or a gold-plated conductive material, which can provide stable conductivity and adapt to the plating bath environment. The mating surfaces of the first receiving member 103 and the second receiving member 104 can be provided with sealing rings, stepped surfaces or positioning bosses, so as to form a controllable receiving cavity 101 after enclosure and reduce the risk of plating solution leakage; the connection method can be detachable or semi-permanent to adapt to the switching of different lead specifications in mass production.

[0078] Understandably, the lead to be plated passes through the receiving channel 102 on the second receiving member 104 and enters the predetermined position in the receiving cavity 101. The first conductive element 200 in the first receiving member 103 is connected to one pole of the power supply, and the second conductive element 300 in the second receiving member 104 is connected to the other pole of the power supply. After the plating solution is injected into the receiving cavity 101, it surrounds the first conductive element 200 and the second conductive element 300 and forms a local immersion environment for the area of ​​the lead to be plated. Since the second receiving member 104 integrates the receiving channel 102 and the second conductive element 300 on the same structure, and the first receiving member 103 and the second receiving member 104 together form the receiving cavity 101, the lead to be plated can be accurately guided by the receiving channel 102 after entering the cavity and obtain a stable electric field constraint near the second conductive element 300. At the same time, the plating solution forms a controllable flow field around the conductive element and the lead in the receiving cavity 101, so that the gold layer is preferentially deposited in the designated section rather than the non-gold plated section. As the electroplating process proceeds, the potential difference between the first conductive element 200 and the second conductive element 300 drives metal ions to precipitate on the local surface of the lead wire. The limiting effect of the receiving channel 102, combined with the enclosing structure of the receiving cavity 101, can suppress lead wire swaying and liquid surface disturbance, reducing the risk of uneven plating thickness or plating solution overflow. Since the first receiving element 103 and the second receiving element 104 are separate structures, the electrodes and channels can be pre-assembled independently first, and then the complete cavity can be formed through positioning and fitting. Therefore, it is convenient for cleaning and replacement, and also convenient for quickly replacing the second receiving element 104 or adjusting the form of the second conductive element 300 for different lead wire specifications. Based on the above operation process, it can be seen that this solution can improve the assembly convenience, maintenance convenience, and adaptability of the plating solution and electrode layout of the device while maintaining precise control of the local gold plating area, thereby helping to obtain a highly consistent gold plating effect.

[0079] Furthermore, the first receiving member 103 is a groove-shaped structure; the partial gold plating device also includes: a separator 400, which is disposed at the bottom of the groove-shaped structure and extends along the height direction of the partial gold plating device. Along the height direction of the partial gold plating device, the highest position of the separator 400 is lower than the groove opening of the groove-shaped structure. The separator 400 is used to divide the groove-shaped structure into an inner groove and an outer groove. The first conductive member 200 is located in the inner groove; the second receiving member 104 is disposed in the inner groove and covers part of the groove opening of the inner groove.

[0080] It should be noted that when the first receiving member 103 adopts a groove-shaped structure, the groove-shaped structure can form a receiving space with an opening, which facilitates the formation of a liquid environment for local electroplating inside it. In one possible embodiment, the groove-shaped structure can be a U-shaped groove, a rectangular groove, or an arc-shaped groove, with its bottom used to support the subsequently installed separator 400 and conductive components, and its walls used to limit the lateral diffusion of the plating solution and provide an installation boundary for the second receiving member 104.

[0081] It should be noted that the separator 400 is located at the bottom of the trough-shaped structure and extends along the height direction of the local gold plating device. It is defined as a vertical partition member located at the bottom of the trough, used to divide the interior of the trough-shaped structure into an inner trough and an outer trough, which are interconnected but have different functions. The function of the separator 400 is to confine the area where the first conductive element 200 is located within the inner trough, thereby allowing the plating solution to mainly form a local electroplating environment around the lead wire to be plated within the inner trough. The outer trough can be used to accommodate excess plating solution, provide a liquid level buffer, and connect a return channel. Along the height direction of the local gold plating device, the highest point of the separator 400 is lower than the opening of the trough-shaped structure. This maintains an upper connecting space between the top of the separator 400 and the opening, allowing controlled exchange between the inner and outer troughs under hydrostatic pressure, while preventing the separator 400 from being completely closed, which would make liquid level adjustment difficult.

[0082] It should be noted that after the second receiving component 104 covers part of the tank opening, it can form a semi-enclosed working space above the inner tank, making it difficult for the plating solution to overflow from the tank opening over a large area. At the same time, in conjunction with the partition component 400 to divide the inner and outer tanks, it can further constrain the liquid level and the effective gold plating area.

[0083] Furthermore, the separator 400 and the bottom of the tank can be integrally formed or fixedly connected. Its material can be polytetrafluoroethylene, polypropylene, ceramic, epoxy resin insulating material or acid and alkali resistant engineering plastic to meet the requirements of corrosion resistance and insulation in the electroplating environment.

[0084] Understandably, because the separator 400 divides the tank structure into an inner tank and an outer tank, and its top is lower than the tank opening, the plating solution can form a limited connection between the inner and outer tanks. This allows the liquid level in the inner tank to remain relatively stable during electroplating, while the outer tank collects and buffers excess plating solution, preventing excessive local fluctuations in liquid level that could lead to uneven plating thickness. The second receiving component 104, after covering part of the inner tank opening, further restricts plating solution splashing and evaporation. By constraining the upper position of the lead wire, it ensures that the lead wire to be plated maintains a relatively consistent immersion depth and plating area during electroplating. Based on the above structural coordination, this solution can form a controllable local gold plating area within the tank structure. Through the partitioning of the inner and outer tanks, the partial coverage of the upper part, and the arrangement of conductive components, it achieves the goals of effective utilization of the plating solution, reduced waste, and improved plating consistency. It also helps improve the gold plating quality of the lead wire surface and the reliability of subsequent bonding. It should be understood that...

[0085] Furthermore, the second receiving member 104 has a mounting ear 1041, which is detachably provided on the partition 400.

[0086] It should be noted that the mounting ear 1041 is an assembly and positioning structure set on the second receiving member 104. It is typically used to achieve a detachable connection between the second receiving member 104 and the separator 400, and to provide stable support and positional limitation for the second receiving member 104. Its function is to enable the second receiving member 104 to be modularly installed on the separator 400, thereby facilitating quick replacement and maintenance according to the specifications of different leads to be gold-plated, the length of the gold-plating area, and the requirements of the plating solution level. At the same time, it ensures that the second receiving member 104 maintains the preset height, orientation, and coverage area during the electroplating process, avoiding the impact of positional deviation on the lead limiting effect and gold plating consistency.

[0087] For example, in terms of position and relationship, the mounting ear 1041 is typically located at the edge, side edge, or bottom edge of the second receiving member 104, and mates with corresponding slots, holes, insertion slots, or screw positions on the separator 400. During assembly, a detachable fixed relationship is formed by insertion, snapping, tightening, or pinning, so that the second receiving member 104 can be reliably supported on the separator 400 and together with the first receiving member 103 to form the receiving cavity 101. In one possible embodiment, the mounting ear 1041 can be a plate ear, a protruding ear, or a folded ear, and the corresponding structure on the separator 400 can be a screw hole, a snap hole, a guide groove, or an insertion slot. The mounting ear 1041 and the second receiving member 104 can be integrally molded, or fixed to the body of the second receiving member 104 by welding, riveting, or injection molding. In terms of material, the mounting ear 1041 can be made of corrosion-resistant metal, insulating plastic, or engineering composite material, consistent with the body of the second receiving member 104, to meet the requirements of long-term use in the plating solution environment. In terms of size and proportion, the thickness, length, and opening position of the mounting ear 1041 are typically designed based on the stress conditions and assembly precision of the second receiving member 104. Its thickness can range from 1mm to 5mm, and its length from 5mm to 30mm. The hole diameter or insertion size forms a clearance fit or transition fit with the screw, pin, or snap-fit ​​to improve positioning stability while ensuring removability. The number of mounting ears 1041 can be two, three, or more, distributed symmetrically or along the stress points of the second receiving member 104 to enhance support balance. It should be understood that the above examples are merely illustrative and not limiting.

[0088] Understandably, after the second receiving member 104 is assembled and connected to the separator 400 via its mounting ear 1041, the second receiving member 104 can stably cover the inner tank and partially cover the opening of the inner tank, thereby defining the receiving cavity 101 for holding the plating solution together with the first receiving member 103, and forming a mating relationship with the receiving channel 102, so that the lead to be plated can be reliably limited after insertion. Since the mounting ear 1041 and the separator 400 are detachably connected, when it is necessary to replace the second receiving member 104 of different specifications, the fastening, screwing or plugging relationship between the mounting ear 1041 and the separator 400 can be directly released without disassembling the first receiving member 103 and its internal conductive structure as a whole, thereby reducing maintenance difficulty and shortening downtime. Meanwhile, the mounting ear 1041 positions and supports the second receiving member 104, ensuring a stable relative position between the second conductive member 300 and the receiving channel 102. This guarantees that the plating solution can flow within the predetermined area and that the gold-plated lead maintains reliable contact or is constrained by the second conductive member 300, preventing the lead from shifting, shaking, or making poor contact during electroplating. Based on the above structural and operational relationship, this solution can improve the modularity, adaptability, and ease of disassembly and maintenance of the device while maintaining local gold plating precision, and it is also beneficial for improving process stability in mass production packaging scenarios.

[0089] In one possible implementation, along the height direction of the local gold plating device, the surface where the lowest position of the receiving channel 102 is located is coplanar with the surface where the highest position of the separator 400 is located.

[0090] It is understood that the lowest position of the receiving channel 102 refers to the lowest boundary support surface or limiting surface of the receiving channel 102 in the vertical direction, and the highest position of the separator 400 refers to the top boundary surface formed after the separator 400 extends along the height direction. The two are kept at the same horizontal height to form a unified geometric reference, so as to reduce the influence of liquid surface fluctuation on the gold plating range and reduce the plating offset, liquid seepage or overflow caused by inconsistent height, thereby helping to improve the consistency of local gold plating position and electroplating stability.

[0091] This application provides an electroplating system, including the aforementioned local gold plating device.

[0092] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0093] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0094] It should be readily understood that the terms “on,” “above,” and “on top of” in this application should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on something” but also “on something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0095] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90° or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0096] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A local gold plating device, characterized in that, include: The receiving assembly (100) has a receiving cavity (101) and a receiving channel (102) communicating with the receiving cavity (101), the receiving cavity (101) being used to hold the plating solution, and the receiving channel (102) being used to hold the lead wire to be plated with gold; A first conductive element (200) is disposed in the receiving cavity (101), and the first conductive element (200) is used to electrically connect to one of the positive or negative terminals of the power supply. The second conductive element (300) is disposed in the receiving cavity (101). The second conductive element (300) is used to electrically connect to the positive or negative terminal of the power supply. Along the height direction of the partial gold plating device, the receiving channel (102), the second conductive element (300) and the first conductive element (200) are arranged at intervals from top to bottom. In this embodiment, at least one of the receiving channel (102) and / or the second conductive element (300) abuts against the lead to be plated with gold to limit the movement of the lead to be plated with gold.

2. The partial gold plating apparatus according to claim 1, characterized in that, The second conductive element (300) is a mesh component, and the plating solution is used to flow through the pores of the mesh component to the gold-plated lead wire; Alternatively, the second conductive element (300) may have a flow guide hole, through which the plating solution flows to the gold-plated lead wire.

3. The partial gold plating apparatus according to claim 1, characterized in that, The second conductive element (300) is a mesh component, the lead to be plated with gold abuts against the mesh component, and the cross-sectional area of ​​the pores on the mesh component is smaller than the cross-sectional area of ​​the lead to be plated with gold.

4. The partial gold plating apparatus according to claim 1, characterized in that, The outer periphery of the lead to be plated with gold is covered with an insulating shell on the side away from the receiving component (100), and the insulating shell abuts against the receiving component (100). The cross-sectional area of ​​the receiving channel (102) is A1, the cross-sectional area of ​​the lead to be gold-plated is A2, and the total cross-sectional area of ​​the lead to be gold-plated and the insulating shell is A3. The cross-sectional areas A1 and A2 of the receiving channel (102) and the total cross-sectional area of ​​the lead to be gold-plated and the insulating shell satisfy the following relationship: A2≤A1<A3.

5. The partial gold plating apparatus according to any one of claims 1-4, characterized in that, Multiple receiving channels (102) are provided, and the multiple receiving channels (102) are arranged sequentially at intervals along the height direction intersecting the local gold plating device.

6. The partial gold plating apparatus according to any one of claims 1-4, characterized in that, The receiving component (100) includes: The first receiving member (103) is provided with the first conductive member (200). The second receiving member (104) is disposed on the first receiving member (103), the second conductive member (300) and the receiving channel (102) are respectively disposed on the second receiving member (104), and the first receiving member (103) and the second receiving member (104) enclose to form the receiving cavity (101).

7. The partial gold plating apparatus according to claim 6, characterized in that, The first receiving member (103) has a groove-shaped structure; The partial gold plating device also includes: A separator (400) is provided at the bottom of the groove structure, and the separator (400) extends along the height direction of the partial gold plating device. Along the height direction of the partial gold plating device, the highest position of the separator (400) is lower than the groove opening of the groove structure. The separator (400) is used to divide the groove structure into an inner groove and an outer groove. The first conductive element (200) is located in the inner groove. The second receiving member (104) is placed on the inner groove and covers part of the opening of the inner groove.

8. The partial gold plating apparatus according to claim 7, characterized in that, The second receiving member (104) has a mounting ear (1041) which is detachably provided on the partition (400).

9. The partial gold plating apparatus according to claim 7, characterized in that, Along the height direction of the partial gold plating device, the surface at the lowest position of the receiving channel (102) is coplanar with the surface at the highest position of the separator (400).

10. An electroplating system, characterized in that, Includes a partial gold plating device according to any one of claims 1-9.

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