Chip wire structure in LCD narrow lower frame

Abstract

This invention discloses a chip wiring structure within a narrow bottom bezel of an LCD screen, comprising an LCD display area and a bottom bezel. A flexible circuit board is connected to the bottom of the bottom bezel. A chip base for mounting a liquid crystal driver chip is disposed within the bottom bezel. The wiring on the liquid crystal driver chip extends out to both sides of the chip base and connects to the LCD display area and the flexible circuit board, respectively. A protective heat dissipation sleeve is disposed outside the horizontal wiring extending outside the chip base. The protective heat dissipation sleeve includes a protective inner layer, a heat dissipation component layer disposed outside the protective inner layer, a flame-retardant layer wrapped outside the heat dissipation component layer, a buffer layer disposed outside the flame-retardant layer, and a protective outer layer disposed outside the buffer layer. By connecting the wiring of the liquid crystal driver chip to the LCD display area and the flexible circuit board from both sides of the liquid crystal driver chip, this invention can make the bottom bezel narrower, significantly compressing the chin area, thereby increasing the screen-to-body ratio and achieving a narrow chin effect.

Description

Technical Field

[0001] This invention relates to the field of LCD display technology, and more particularly to a chip wire structure within a narrow lower bezel of an LCD. Background Technology

[0002] With the development of technology, people have higher and higher requirements for display areas. Improving the screen-to-body ratio is a major selling point. Narrow bezels are the most important way to improve the screen-to-body ratio. However, the narrow bottom bezel of LCDs is the most difficult to achieve. The total length of the bottom bezel of an LCD is affected by the width of the liquid crystal driver chip and the height of the traces from the liquid crystal driver chip to the LCD and the flexible circuit board. The bottom bezel of conventional products is relatively wide. This is mainly because the traces of the liquid crystal driver chip are routed to the LCD and the flexible circuit board from the top and bottom sides. In order to achieve the goal of a narrow bottom bezel for LCDs, and due to manufacturing process and reliability reasons, most industries will use the following approach: create a new liquid crystal driver chip and make the liquid crystal driver chip narrower.

[0003] However, narrowing the LCD driver chip is costly. LCD driver chip manufacturing processes are typically below 20nm, with mold costs exceeding 20 million RMB. Narrowing the LCD driver chip is limited, at most within 0.2mm. Furthermore, reducing the size of the LCD driver chip sacrifices some functionality, resulting in limited versatility or exclusive use by the manufacturer. This limits the production volume, significantly increasing costs and leading to inconsistent supply. Additionally, during operation, the LCD driver chip's conductor shielding layer has only a simple outer layer. The conductor itself generates considerable heat during operation, which is transferred to the air through the outermost protective layer. However, ordinary protective layers have poor heat dissipation capabilities. Over prolonged operation, heat can accumulate, causing the conductor to burn out or char, rendering the cable ineffective and reducing its lifespan.

[0004] Therefore, this application provides a chip wire structure within a narrow lower bezel of an LCD. Summary of the Invention

[0005] The purpose of this invention is to solve the technical problems existing in the prior art and to provide a chip wire structure within the narrow lower bezel of an LCD.

[0006] To achieve the above objectives, the technical solution provided by the present invention is: a chip wire structure within a narrow lower bezel of an LCD screen, comprising an LCD display area and a lower bezel of the LCD screen, a flexible circuit board connected to the bottom of the lower bezel, a chip base for mounting a liquid crystal driver chip disposed within the lower bezel, wires on the liquid crystal driver chip extending out of the chip base on both sides and connected to the LCD display area and the flexible circuit board respectively, and a protective heat dissipation sleeve disposed outside the horizontal wires extending outside the chip base. The protective heat dissipation sleeve includes an insulation layer wrapped around the conductor, a shielding layer wrapped around the insulation layer, a pyromitra matte layer wrapped around the shielding layer, a protective inner layer wrapped around the pyromitra matte layer, the protective inner layer being made of graphene-polymer composite material, a heat dissipation component layer outside the protective inner layer, a flame-retardant layer wrapped around the heat dissipation component layer, a buffer layer outside the flame-retardant layer, and a protective outer layer outside the buffer layer. The heat dissipation component layer includes a heat dissipation layer wrapped around the protective inner layer, the heat dissipation layer also being made of graphene-polymer composite material. A heat dissipation channel is formed between the heat dissipation layer and the flame-retardant layer, and the heat dissipation channel is connected to the interior of the lower frame. The heat dissipation channel forms multiple heat dissipation cavities through multiple sets of support frames. A heat-conducting block is set inside the heat dissipation cavity, a heat-conducting plate is set on the heat-conducting block, multiple sets of heat dissipation fins are set on the heat-conducting plate, and multiple heat dissipation holes are set on the heat dissipation fins. The heat dissipation fins are made of graphene-polymer aluminum composite material.

[0007] Preferably, the buffer layer is provided with multiple sets of accelerated heat dissipation components. The accelerated heat dissipation components include elastic airbags, which are provided with air inlets and air outlets. Both the air inlets and air outlets are provided with one-way valves. The air outlets penetrate the flame-retardant layer and communicate with the heat dissipation cavity, while the air inlets penetrate the protective outer layer and communicate with the lower frame.

[0008] Preferably, an auxiliary heat dissipation mechanism is provided inside the lower frame. The auxiliary heat dissipation mechanism includes a fixed arc plate disposed at the top and bottom of the lower frame, a mounting plate fixedly disposed on the chip base, a pressing block slidably connected to the mounting plate, a linkage plate fixedly disposed on the pressing block, and a movable arc plate fixedly disposed on the linkage plate. The movable arc plate and the fixed arc plate are located on the upper and lower sides of the protective heat dissipation sleeve and are used to press the protective heat dissipation sleeve. Both the movable arc plate and the fixed arc plate are provided with through holes corresponding to the air inlet.

[0009] Preferably, the auxiliary heat dissipation mechanism further includes a turntable, which is rotatably connected to the inner rear wall of the lower frame via a rotating shaft. The pressing block is hinged to the turntable via a first connecting rod. A guide rail is fixedly provided between the chip base and the inner wall of the lower frame. A moving block is slidably provided on the guide rail. The side of the moving block closest to the chip base is hinged to the turntable via a second connecting rod. A pressing key is fixedly connected to the other side of the moving block, and the other end of the pressing key extends out of the lower frame.

[0010] Preferably, the outer ring of the pressing key is provided with a spring, one end of which is fixedly mounted on the inner wall of the lower frame, and the other end of which is fixedly mounted on the moving block.

[0011] Preferably, the protective inner layer is made of graphene-polymer composite material or graphene-epoxy resin composite material, and the heat dissipation layer is made of graphene / polyamide composite material.

[0012] Preferably, the inner wall of the flame-retardant layer is evenly distributed with multiple filling layers, and the filling layers are filled with flame-retardant material, which is flame-retardant polyurethane foam material. The outer wall of the flame-retardant layer is embedded with a metal mesh, which is stainless steel wire mesh.

[0013] Preferably, the protective outer layer is made of ethylene propylene rubber.

[0014] Beneficial effects of this invention: This invention connects the wires of the liquid crystal driver chip to the LCD display area and the flexible circuit board from both sides of the liquid crystal driver chip, making the bottom bezel narrower and significantly compressing the chin area, thereby increasing the screen-to-body ratio and achieving the effect of a narrow chin.

[0015] In this invention, the heat dissipation layer of the heat dissipation component uses a graphene / polyamide composite material. The graphene is modified with dopamine, introducing active groups (-OH, -NH2) on its surface, which makes it more tightly bonded to polyamide (PA6), reduces interfacial thermal resistance, and makes heat conduction more efficient, resulting in good heat dissipation of the protective heat dissipation sleeve. The support frame, heat-conducting block, and heat-conducting plate are all made of thermally conductive silicon material. The heat dissipation fins use a graphene-polymer aluminum composite material. The graphene-polymer aluminum composite material has advantages in heat dissipation by improving thermal conductivity and enhancing radiation heat dissipation capacity, resulting in good heat dissipation effect of the protective heat dissipation sleeve. In addition, the multiple heat dissipation holes on the heat dissipation fin plate can increase the contact area with air and improve the heat dissipation effect.

[0016] This invention uses an auxiliary heat dissipation mechanism to compress the protective heat dissipation sleeve, increasing the air pressure inside the elastic airbag within the buffer layer. The airflow from the elastic airbag enters the heat dissipation cavity through the air outlet, accelerating the airflow within the heat dissipation cavity. The spring in the auxiliary heat dissipation mechanism resets the elastic airbag when the moving arc plate stops compressing the protective heat dissipation sleeve, creating negative pressure inside the elastic airbag. This allows air to enter the elastic airbag through the air inlet. This process repeats, thereby accelerating the airflow within the heat dissipation cavity, increasing heat dissipation efficiency, and improving the heat dissipation effect. Attached Figure Description

[0017] The accompanying drawings, which are provided to further illustrate the invention and constitute a part of this invention, are illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention.

[0018] Figure 1 This is a schematic diagram of the Driver IC cable structure of the present invention; Figure 2 This is a schematic diagram of the overall structure of the present invention; Figure 3 This is a schematic diagram of the protective heat dissipation sleeve structure of the present invention; Figure 4 This is a schematic diagram of the auxiliary heat dissipation mechanism of the present invention; Figure 5 This is a schematic diagram of the heat dissipation fin plate structure of the present invention.

[0019] Attached image captions: 1-LCD display area, 2-Auxiliary heat dissipation mechanism, 3-Lower bezel, 4-Flexible circuit board, 5-Chip base, 6-LCD driver chip, 7-Protective heat dissipation sleeve, 8-Wire, 9-Insulation layer, 10-Shielding layer, 11-Fire mica tape layer, 12-Inner protective layer, 13-Heat dissipation layer, 14-Heat dissipation cavity, 15-Flame retardant layer, 16-Buffer layer, 17-Outer protective layer, 18-Heat conductive block, 19-Support frame, 20- - Heat dissipation fins, 21- Heat conduction plate, 22- Elastic airbag, 23- Air inlet, 24- Air outlet pipe, 25- Filling layer, 26- Metal mesh, 27- Fixed arc plate, 28- Moving arc plate, 29- Linkage plate, 30- Mounting plate, 31- Extrusion block, 32- First connecting rod, 33- Turntable, 34- Rotating shaft, 35- Second connecting rod, 36- Moving block, 37- Guide rail, 38- Pressing key lever, 39- Spring. Detailed Implementation

[0020] This section will describe in detail specific embodiments of the present invention. Preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and overall technical solution of the present invention, but they should not be construed as limiting the scope of protection of the present invention.

[0021] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0022] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0023] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0024] Reference Figures 1-5 According to a preferred embodiment of the present invention, a chip wire structure within a narrow lower bezel of an LCD screen includes an LCD display area 1 and a lower bezel 3. A flexible circuit board 4 is connected to the bottom of the lower bezel 3. A chip base 5 for mounting a liquid crystal driver chip 6 is disposed within the lower bezel 3. Wires 8 on the liquid crystal driver chip 6 extend from both sides of the chip base 5 and are connected to the LCD display area 1 and the flexible circuit board 4, respectively. A protective heat dissipation sleeve 7 is disposed outside the horizontally extending wires 8 outside the chip base 5. Ventilation holes are opened on both sides of the lower bezel 3, directly opposite the protective heat dissipation sleeve 7; the ventilation holes are connected to the outside.

[0025] Specifically, compared to the conventional method where the wires 8 of the liquid crystal driver chip 6 are connected to the LCD display area 1 and the flexible circuit board 4 from the top and bottom sides, the present invention connects the wires 8 of the liquid crystal driver chip 6 to the LCD display area 1 and the flexible circuit board 4 from both sides of the liquid crystal driver chip 6. By adjusting the wiring method of the wires 8 of the liquid crystal driver chip 6, the bottom bezel 3 can be made narrower, the chin area can be significantly compressed, thereby improving the screen-to-body ratio and achieving the effect of a narrow chin.

[0026] In this embodiment, the protective heat dissipation sleeve 7 includes an insulating layer 9 wrapped around the outside of the wire 8, a shielding layer 10 wrapped around the insulating layer 9, a pyromitra matte layer 11 wrapped around the shielding layer 10 (preferably, polyurethane foam material is filled between the shielding layer 10 and the pyromitra matte layer 11), a protective inner layer 12 wrapped around the pyromitra matte layer 11, the protective inner layer 12 being made of graphene-polymer composite material, a heat dissipation component layer disposed outside the protective inner layer 12, a flame retardant layer 15 wrapped around the heat dissipation component layer, a buffer layer 16 disposed outside the flame retardant layer 15, and a protective outer layer 17 disposed outside the buffer layer 16. The heat dissipation component layer includes a protective outer layer 17 wrapped around the wire 8. The heat dissipation layer 13 outside the protective inner layer 12 is also made of graphene-polymer composite material. A heat dissipation channel is formed between the heat dissipation layer 13 and the flame retardant layer 15. The heat dissipation channel is connected to the interior of the lower frame 3. The heat dissipation channel forms multiple heat dissipation cavities 14 by setting multiple sets of support frames 19. A heat-conducting block 18 is set in the heat dissipation cavity 14. A heat-conducting plate 21 is set on the heat-conducting block 18. Multiple sets of heat dissipation fins 20 are set on the heat-conducting plate 21. Multiple heat dissipation holes are set on the heat dissipation fins 20. The support frame 19, heat-conducting block 18, and heat-conducting plate 21 are all made of thermally conductive silicon material. The heat dissipation fins 20 are made of graphene-polymer aluminum composite material.

[0027] Graphene-polymer aluminum composite is a novel material combining graphene and an aluminum matrix, possessing both the high strength and high thermal conductivity of graphene and the lightweight properties of aluminum. Graphene's planar thermal conductivity reaches 5300 W / (m·K), far exceeding aluminum's 237 W / (m·K). The composite material can rapidly transfer heat, reducing localized hotspots. Optimized coatings (such as a modified graphene addition of 4 wt%) improve heat dissipation efficiency to 24.15% and reduce temperature by 14.2℃. The graphene coating significantly increases the surface infrared emissivity to nearly 0.93, enhancing radiative heat dissipation. Under natural convection, the proportion of radiative heat transfer increases from 3.8% of the aluminum plate to 32.2%; under forced convection, it increases from 1.7% to 8.9%, highlighting the more prominent radiative heat dissipation effect. Graphene-polymer aluminum composite material exhibits advantages in heat dissipation by improving thermal conductivity and enhancing radiative heat dissipation capacity, resulting in good heat dissipation performance of protective heat dissipation sleeves.

[0028] Specifically, when the conductor 8 generates heat during operation, the heat is dissipated outward from the pyromitra tape layer 11. At this time, the heat passes through the inner protective layer 12 to the heat dissipation layer 13, and then dissipates through the heat dissipation channel between the heat dissipation layer 13 and the flame-retardant layer 15. At the same time, the heat-conducting blocks 18 in the multiple heat dissipation cavities 14 in the heat dissipation channel can conduct the heat of the heat dissipation layer 13 to the heat-conducting plate 21 and then dissipate through the heat dissipation fin plate 20. In addition, the multiple heat dissipation holes on the heat dissipation fin plate 20 can increase the contact area with the air and improve the heat dissipation effect. The heat in the heat dissipation cavity 14 is dissipated to the lower frame 3 and then dissipated to the outside of the lower frame 3 for heat dissipation (the heat dissipation channel is connected to the lower frame 3, and the lower frame 3 is connected to the outside through the ventilation holes on the side of the lower frame 3). Thus, the protective heat dissipation sleeve 7 provides protection while achieving excellent heat dissipation effect.

[0029] In this embodiment, the protective inner layer 12 is made of graphene-polymer composite material, which is graphene-epoxy resin composite material, and the heat dissipation layer 13 is made of graphene / polyamide composite material.

[0030] Specifically, graphene-polymer composites are a novel type of material that combines graphene with a polymer matrix. The addition of graphene significantly improves the thermal conductivity of epoxy resin. For example, three-dimensional graphene foam made using polyurethane foam templates achieves a thermal conductivity of 8.04 W / mK when the graphene content is 6.8 wt%, which is 44 times higher than that of pure epoxy resin. If the graphene content reaches 10.1%, the thermal conductivity can even increase by 22 times.

[0031] Graphene can significantly improve the tensile strength and Young's modulus of composite materials. For example, graphene / epoxy resin modified with coupling agents increases tensile strength by 91.38% and Young's modulus by 153.01%. Other studies have shown that when the graphene content is 1-5 wt%, the stiffness can be increased by 10%-30%.

[0032] Therefore, the inner protective layer 12 improves the mechanical and thermal conductivity of the inner protective layer, thereby improving the mechanical properties of the protective heat dissipation sleeve.

[0033] The graphene / polyamide composite material used in heat dissipation layer 13 is a high-performance material that combines graphene with polyamide (such as PA6). Graphene is modified with dopamine to introduce active groups (-OH, -NH2) on its surface, which makes it more tightly bonded to polyamide (PA6), reduces interfacial thermal resistance, and makes heat conduction more efficient. Therefore, the graphene / polyamide composite material has good heat dissipation performance, which makes the heat dissipation line of the protective heat dissipation sleeve better.

[0034] In this embodiment, multiple sets of accelerated heat dissipation components are provided in the buffer layer 16. The accelerated heat dissipation components include an elastic airbag 22. The elastic airbag 22 is provided with an air inlet 23 and an air outlet 24. Both the air inlet 23 and the air outlet 24 are provided with one-way valves. The air outlet 24 penetrates the flame-retardant layer 15 and communicates with the heat dissipation cavity 14. The air inlet 23 penetrates the protective outer layer 17 and communicates with the lower frame 3.

[0035] Specifically, when the elastic airbag 22 in the buffer layer 16 is compressed, the internal air pressure of the elastic airbag 22 increases. The airflow inside the elastic airbag 22 enters the heat dissipation cavity 14 through the air outlet 24, accelerating the airflow inside the heat dissipation cavity 14. When the moving arc plate 28 does not compress the protective heat dissipation sleeve 7, the elastic airbag 22 returns to its original state, generating negative pressure inside the elastic airbag 22, which allows air to enter the elastic airbag 22 through the air inlet 23. This process is repeated, thereby accelerating the airflow inside the heat dissipation cavity 14, increasing the heat dissipation efficiency, and improving the heat dissipation effect.

[0036] In this embodiment, an auxiliary heat dissipation mechanism 2 is provided inside the lower frame 3. The auxiliary heat dissipation mechanism 2 includes a fixed arc plate 27 disposed at the top and bottom of the lower frame 3, a mounting plate 30 fixedly disposed on the chip base 5, a pressing block 31 slidably connected to the mounting plate 30 (preferably, a limit plate is provided at the end of the pressing block 31), a linkage plate 29 fixedly disposed on the pressing block 31, and a movable arc plate 28 fixedly disposed on the linkage plate 29. The movable arc plate 28 and the fixed arc plate 27 are located on the upper and lower sides of the protective heat dissipation sleeve 7 and are used to press the protective heat dissipation sleeve 7. Both the movable arc plate 28 and the fixed arc plate 27 are provided with through holes corresponding to the air inlet 23 on the protective outer layer 17.

[0037] Furthermore, the auxiliary heat dissipation mechanism 2 also includes a turntable 33, which is rotatably connected to the inner rear wall of the lower frame 3 via a rotating shaft 34. The pressing block 31 is hinged to the turntable 33 via a first connecting rod 32 (preferably, the upper and lower first connecting rods are hinged at the same hinge point on the turntable, and the hinge point is located below the rotating shaft, such as...). Figure 4 As shown), a guide rail 37 is fixedly installed between the chip base 5 and the inner wall of the lower frame 3. A moving block 36 is slidably installed on the guide rail 37. The side of the moving block 36 closest to the chip base 5 is hinged to the turntable 33 through the second connecting rod 35. A pressing key rod 38 is fixedly connected to the other side of the moving block 36. The other end of the pressing key rod 38 extends out of the lower frame 3.

[0038] Furthermore, a spring 39 is provided on the outer ring of the pressing key lever 38. One end of the spring 39 is fixedly mounted on the inner wall of the lower frame 3, and the other end of the spring 39 is fixedly mounted on the moving block 36.

[0039] Specifically, when auxiliary cooling is required, the user presses the key lever 38, which pushes the moving block 36 to slide on the guide rail 37. During the movement of the moving block 36, the second connecting rod 35 drives the turntable 33 to rotate. During the rotation of the turntable 33, the hinged first connecting rod 32 pushes the pressing block 31 to move on the mounting plate 30 in the direction of approaching the conductor 8. At this time, the pressing block 31 pushes the linkage plate 29 to move. The linkage plate 29 drives the moving arc plate 28 to move towards the protective heat dissipation sleeve 7 outside the conductor 8. Together with the fixed arc plate 27, the protective heat dissipation sleeve 7 is compressed. When the protective heat dissipation sleeve 7 is compressed, the elastic airbag 22 in the buffer layer 16 buffers the compression of the protective heat dissipation sleeve 7 while the elastic airbag... When the internal air pressure of the elastic airbag 22 increases, the airflow inside the elastic airbag 22 enters the heat dissipation cavity 14 through the air outlet 24, accelerating the airflow inside the heat dissipation cavity 14, increasing heat dissipation efficiency, and improving heat dissipation effect. After releasing the pressing key lever 38, the pressing key lever 38 resets under the action of the spring 39, and then drives the moving arc plate 28 to reset through the moving block 36, the second connecting rod 35, the turntable 33, the first connecting rod 32, the squeezing block 31, etc. At this time, the elastic airbag 22 returns to its original state, generating negative pressure inside the elastic airbag 22, causing air to enter the elastic airbag 22 through the air inlet 23. This process is repeated, thereby accelerating the airflow inside the heat dissipation cavity 14, assisting in accelerating the heat dissipation efficiency and effect in the heat dissipation channel, and extending the service life of the protective heat dissipation sleeve 7 in this invention.

[0040] It should be further explained that the present invention can also include a temperature alert module, which includes an external PLC controller and a temperature transmitter. The core components of the temperature transmitter include: a temperature sensor: directly in contact with the measured medium (in this invention, the temperature sensor directly contacts the protective heat sink), generating a raw signal based on the thermoelectric effect or resistance change principle; a signal conditioning circuit: amplifying, linearizing, and compensating the weak sensor signal to ensure output accuracy; and an output unit: converting the processed signal into a standard industrial signal for easy reception by the controller. (The temperature transmitter in this invention is a general standard part or a component known to those skilled in the art. Its structure and principle can be learned by those skilled in the art through technical manuals. Those skilled in the art can flexibly select it as needed. It belongs to the prior art and will not be described in detail here.)

[0041] In operation, the temperature reminder module uses a temperature sensor mounted on the outer protective layer 17 of the protective heat dissipation sleeve 7 (which does not interfere with the movement of the fixed arc plate 27). An LED light is mounted on the back of the lower frame 3. When the protective heat dissipation sleeve 7 outside the wire 8 is naturally dissipating heat from the wire, heat will accumulate in the sleeve 7, causing its temperature to rise. The temperature sensor will then transmit the temperature data to an external PLC controller (the PLC controller has a built-in microcontroller with a preset temperature threshold). When the temperature exceeds the threshold (i.e., when a large amount of heat has accumulated inside the protective heat dissipation sleeve 7 during natural heat dissipation), the PLC controller will control the LED light to illuminate, reminding the user to use the auxiliary heat dissipation mechanism 2 to accelerate the heat dissipation of the protective heat dissipation sleeve 7 outside the wire 8 inside the lower frame 3. This will improve the heat dissipation effect of the protective heat dissipation sleeve 7 and extend its service life.

[0042] In this embodiment, multiple filling layers 25 are evenly distributed around the inner wall of the flame-retardant layer 15. The filling layers 25 are filled with flame-retardant material, which is flame-retardant polyurethane foam. The flame-retardant polyurethane foam is formed by adding flame retardants to rigid polyurethane foam. Flame retardants include halogenated flame retardants, nitrogen-based flame retardants, phosphorus-based flame retardants, and inorganic flame retardants. Existing flame-retardant polyurethane foam can meet the UL-94 V0 flame retardant standard. At the same time, while having excellent flame-retardant properties, the use of flame-retardant polyurethane foam can also provide a certain cushioning effect, thereby improving the impact resistance of the entire protective heat dissipation sleeve. The outer wall of the flame-retardant layer 15 is embedded with a metal mesh 26, which is made of stainless steel wire mesh, which can improve the strength of the protective heat dissipation sleeve and enhance its protective capabilities.

[0043] In this embodiment, the protective outer layer 17 is made of ethylene propylene rubber, which has excellent weather resistance, ozone resistance, heat resistance, acid and alkali resistance, water vapor resistance, color stability, electrical properties, oil extensibility and room temperature flowability.

[0044] Without causing conflict, those skilled in the art can freely combine and use the above-mentioned additional technical features.

[0045] The above description is only a preferred embodiment of the present invention. Any technical solution that achieves the purpose of the present invention by essentially the same means is within the protection scope of the present invention.

Claims

1. A chip wiring structure within a narrow lower bezel of an LCD, characterized in that: The LCD screen includes an LCD display area and a bottom bezel. A flexible circuit board is connected to the bottom of the bottom bezel. A chip base for mounting a liquid crystal driver chip is set inside the bottom bezel. The wires on the liquid crystal driver chip extend out of the chip base on both sides and are connected to the LCD display area and the flexible circuit board respectively. A protective heat dissipation sleeve is set outside the horizontal wires extending out of the chip base. The protective heat dissipation sleeve includes an insulation layer wrapped around the conductor, a shielding layer wrapped around the insulation layer, a pyromitra matte layer wrapped around the shielding layer, a protective inner layer wrapped around the pyromitra matte layer, the protective inner layer being made of graphene-polymer composite material, a heat dissipation component layer outside the protective inner layer, a flame-retardant layer wrapped around the heat dissipation component layer, a buffer layer outside the flame-retardant layer, and a protective outer layer outside the buffer layer. The heat dissipation component layer includes a heat dissipation layer wrapped around the protective inner layer, the heat dissipation layer also being made of graphene-polymer composite material. A heat dissipation channel is formed between the heat dissipation layer and the flame-retardant layer, and the heat dissipation channel is connected to the interior of the lower frame. The heat dissipation channel forms multiple heat dissipation cavities through multiple sets of support frames. A heat-conducting block is set inside the heat dissipation cavity, a heat-conducting plate is set on the heat-conducting block, multiple sets of heat dissipation fins are set on the heat-conducting plate, and multiple heat dissipation holes are set on the heat dissipation fins. The heat dissipation fins are made of graphene-polymer aluminum composite material.

2. The chip wiring structure within a narrow lower bezel of an LCD according to claim 1, characterized in that: The buffer layer is equipped with multiple sets of accelerated heat dissipation components, including elastic airbags. The elastic airbags are equipped with air inlets and air outlets. Both the air inlets and air outlets are equipped with one-way valves. The air outlets penetrate the flame-retardant layer and connect to the heat dissipation cavity, while the air inlets penetrate the outer protective layer and connect to the lower frame.

3. The chip wiring structure within a narrow lower bezel of an LCD according to claim 2, characterized in that: An auxiliary heat dissipation mechanism is provided inside the lower frame. The auxiliary heat dissipation mechanism includes fixed arc plates at the top and bottom of the lower frame, a mounting plate fixedly mounted on the chip base, a pressing block slidably connected to the mounting plate, a linkage plate fixedly mounted on the pressing block, and a movable arc plate fixedly mounted on the linkage plate. The movable arc plate and the fixed arc plate are located on the upper and lower sides of the protective heat dissipation sleeve and are used to press the protective heat dissipation sleeve. Both the movable arc plate and the fixed arc plate are provided with through holes corresponding to the air inlet.

4. The chip wiring structure within a narrow lower bezel of an LCD according to claim 3, characterized in that: The auxiliary heat dissipation mechanism also includes a turntable, which is rotatably connected to the inner rear wall of the lower frame via a rotating shaft. The pressing block is hinged to the turntable via a first connecting rod. A guide rail is fixedly installed between the chip base and the inner wall of the lower frame. A moving block is slidably installed on the guide rail. The side of the moving block closest to the chip base is hinged to the turntable via a second connecting rod. A pressing button is fixedly connected to the other side of the moving block, and the other end of the pressing button extends out of the lower frame.

5. The chip wiring structure within a narrow lower bezel of an LCD according to claim 4, characterized in that: The outer ring of the press button is equipped with a spring. One end of the spring is fixedly mounted on the inner wall of the lower frame, and the other end of the spring is fixedly mounted on the moving block.

6. The chip wiring structure within a narrow lower bezel of an LCD according to claim 1, characterized in that: The inner protective layer is made of graphene-polymer composite material and graphene-epoxy resin composite material, while the heat dissipation layer is made of graphene / polyamide composite material.

7. The chip wiring structure within a narrow lower bezel of an LCD according to claim 1, characterized in that: The inner wall of the flame-retardant layer is evenly distributed with multiple filling layers, which are filled with flame-retardant material, namely flame-retardant polyurethane foam. The outer wall of the flame-retardant layer is embedded with a metal mesh, which is stainless steel wire mesh.

8. The chip wiring structure within a narrow lower bezel of an LCD according to claim 1, characterized in that: The protective outer layer is made of ethylene propylene rubber.

Images