Multilayer electronic component

Abstract

This disclosure provides a multilayer electronic component. The multilayer electronic component may include: a body including a dielectric layer and inner electrodes alternating with the dielectric layer in the thickness direction; a first side edge portion and a second side edge portion respectively disposed on a fifth surface and a sixth surface of the body opposite to each other in the width direction; a first glass layer and a second glass layer disposed on the first side edge and the second side edge and extending to a portion of a third surface of the body and a portion of a fourth surface of the body opposite to the third surface in the length direction; and a first external electrode and a second external electrode respectively disposed on the third surface and the fourth surface. The inner electrodes include: a first inner electrode, the two ends of the first inner electrode located on the third surface in the width direction being covered by the first glass layer; and a second inner electrode, the two ends of the second inner electrode located on the fourth surface in the width direction being covered by the second glass layer.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0198410, filed on December 27, 2024, and Korean Patent Application No. 10-2025-0036666, filed on March 21, 2025, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are chip capacitors mounted on printed circuit boards of various types of electronic products, such as image display devices (including liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, and mobile phones, for charging or discharging from them.

[0004] Because multilayer ceramic capacitors can have small size and high capacitance and are easy to install, such multilayer ceramic capacitors can be used as components in a variety of electronic devices.

[0005] Recently, with the miniaturization and high performance of electronic devices, multilayer ceramic capacitors have also tended towards miniaturization and higher capacitance, and the importance of ensuring high reliability of multilayer ceramic capacitors is increasing. Furthermore, high reliability characteristics are required when used in automotive electronic components.

[0006] To achieve miniaturization and high capacitance in multilayer ceramic capacitors, it is necessary to maximize the effective electrode area (increasing the effective volume fraction required to achieve capacitance).

[0007] To achieve the small size and high capacitance of the multilayer ceramic capacitor as described above, during the manufacture of the multilayer ceramic capacitor, the area of ​​the inner electrode in the width direction is maximized by exposing the inner electrode in the width direction of the body through a borderless design, and before sintering, the side edges are individually attached to the exposed surface of the inner electrode in the width direction of the body with ceramic green sheets, and then sintering is performed.

[0008] While forming the side edges using ceramic green sheets by attaching them separately can improve the capacitance per unit volume of the capacitor, stress may be generated at the interface between the side edges and the body during sintering, potentially causing problems such as delamination and cracking. Furthermore, there are concerns that moisture may penetrate through gaps created by delamination and cracks, thereby reducing reliability.

[0009] Therefore, it may be necessary to develop a multilayer electronic component that can improve reliability by suppressing the occurrence of delamination, cracks, etc. Summary of the Invention

[0010] One aspect of this disclosure is to provide a multilayer electronic component with excellent reliability.

[0011] One aspect of this disclosure is to provide a multilayer electronic component with excellent capacitance per unit volume.

[0012] One aspect of this disclosure is to provide a multilayer electronic component that suppresses delamination, cracks, etc. in the side edges.

[0013] One aspect of this disclosure is to provide a multilayer electronic component with excellent moisture resistance and reliability.

[0014] However, the problems to be solved by this disclosure are not limited to those described above, and will be more readily understood in the process of describing specific embodiments of this disclosure.

[0015] A multilayer electronic component according to embodiments of the present disclosure may include: a body comprising a dielectric layer and inner electrodes alternately disposed with respect to the dielectric layer in a thickness direction, and including a first surface and a second surface opposite to each other in the thickness direction, a third surface and a fourth surface opposite to each other in a length direction, and a fifth surface and a sixth surface opposite to each other in a width direction; a first side edge portion and a second side edge portion disposed on the fifth surface and the sixth surface, respectively; a first glass layer disposed on the first side edge portion and the second side edge portion and configured to extend to a portion of the third surface; a second glass layer disposed on the first side edge portion and the second side edge portion and configured to extend to a portion of the fourth surface; and a first outer electrode and a second outer electrode disposed on the third surface and the fourth surface, respectively, wherein the inner electrodes may include: a first inner electrode, the two ends of the first inner electrode located on the third surface in the width direction being covered by the first glass layer; and a second inner electrode, the two ends of the second inner electrode located on the fourth surface in the width direction being covered by the second glass layer.

[0016] A multilayer electronic component according to embodiments of the present disclosure may include: a body comprising: a first inner electrode exposed through a first surface of the body and spaced apart in a length direction from a second surface of the body opposite to the first surface; and a second inner electrode exposed through the second surface of the body and spaced apart from the first surface, the second inner electrode and the first inner electrode being alternately stacked in a thickness direction and a dielectric layer disposed between the second inner electrode and the first inner electrode; a first side edge portion and a second side edge portion respectively disposed on a third surface and a fourth surface of the body opposite to each other in a width direction, and contacting the first inner electrode and the second inner electrode at the edges of the respective surfaces of the body in the width direction; a first glass layer disposed on an edge of the body formed by the first surface and the third surface and the fourth surface, and extending to a portion of the first surface; a second glass layer disposed on an edge of the body formed by the second surface and the third surface and the fourth surface, and extending to a portion of the second surface; and a first outer electrode and a second outer electrode respectively disposed on the first surface and the second surface of the body, and covering portions of the first glass layer and the second glass layer respectively extending to the first surface and the second surface of the body.

[0017] A multilayer electronic component according to embodiments of the present disclosure may include: a body; a first inner electrode extending to a first surface of the body and spaced apart in a length direction from a second surface of the body opposite to the first surface; a second inner electrode extending to the second surface of the body and spaced apart from the first surface; a dielectric layer disposed in a thickness direction between adjacent first inner electrodes and second inner electrodes; a first outer electrode disposed on the first surface and in contact with at least a portion of the first inner electrode extending to the first surface; a first glass layer disposed on opposite edges in a width direction of the first surface and having a first portion extending to a portion of the first surface, the first portion being disposed between the body and the first outer electrode; a second outer electrode disposed on the second surface and in contact with at least a portion of the second inner electrode extending to the second surface; and a second glass layer disposed on opposite edges in a width direction of the second surface and having a second portion extending to a portion of the second surface, the second portion being disposed between the body and the second outer electrode.

[0018] According to one aspect of this disclosure, the reliability of multilayer electronic components can be improved by disposing a glass layer on the side edge and extending to the third and / or fourth surface of the body.

[0019] According to one aspect of this disclosure, the capacitance per unit volume of a multilayer electronic component can be improved.

[0020] According to one aspect of this disclosure, delamination, cracking, etc., can be suppressed in the side edge portion.

[0021] According to one aspect of this disclosure, the moisture resistance reliability of multilayer electronic components can be improved.

[0022] However, the purpose of this disclosure is not limited to the foregoing, and it can be more easily understood in the process of explaining specific embodiments of this disclosure. Attached Figure Description

[0023] Figure 1 A perspective view of a multilayer electronic assembly according to an embodiment of the present disclosure is shown schematically.

[0024] Figure 2 This shows the part excluding the external electrodes. Figure 1 A three-dimensional image.

[0025] Figure 3 It shows the area excluding the glass layer. Figure 2 A three-dimensional image.

[0026] Figure 4 It shows the portion excluding the side edges. Figure 3 A three-dimensional image.

[0027] Figure 5 Schematic illustration along Figure 1 The cross-sectional view taken from line I-I'.

[0028] Figure 6 Schematic illustration along Figure 1 The cross-sectional view taken from line II-II'.

[0029] Figure 7 Schematic illustration along Figure 1 The cross-sectional view taken from line III-III'.

[0030] Figure 8 yes Figure 7 A magnified view of region P1.

[0031] Figure 9A This is a SEM scan image of the region corresponding to region P1, according to an embodiment of this disclosure. Figure 9B The image is an image captured by an optical microscope of the region corresponding to region P1, which is an embodiment of this disclosure.

[0032] Figure 10 A perspective view of a multilayer electronic assembly according to another embodiment of the present disclosure is shown schematically.

[0033] Figure 11 Schematic illustration along Figure 10 A cross-sectional view taken from line IV-IV'.

[0034] Figure 12 It is a diagram used to explain the lamination process.

[0035] Figure 13 It is a diagram used to explain the cutting process.

[0036] Figure 14 This is a diagram showing the unit stack after the cutting process.

[0037] Figure 15 This is a diagram used to explain the side edge attachment process.

[0038] Figure 16 This is a diagram showing a unit stack with the first side edge attached.

[0039] Figure 17 It is a diagram used to explain the glass layer formation process. Detailed Implementation

[0040] In the following description, embodiments of the present disclosure will be described with reference to specific examples and accompanying drawings. However, embodiments of the present disclosure may be modified in various other forms, and the scope of the present disclosure is not limited to the embodiments described below. Furthermore, embodiments of the present disclosure may be provided to describe the present disclosure more completely to those skilled in the art. Therefore, for clarity of description, the shape and size of elements in the drawings may be exaggerated, and elements indicated by the same reference numerals in the drawings may be the same elements.

[0041] In the accompanying drawings, for the purpose of clarifying this disclosure, parts irrelevant to the description will be omitted, and thicknesses may be enlarged to clearly show layers and regions. The same reference numerals will be used to denote the same components. Furthermore, throughout the specification, unless otherwise expressly stated, when an element is referred to as "comprising" or "including," it means that the element may further include other elements, without excluding other elements.

[0042] In the accompanying drawings, the X direction can be defined as a first direction, a stacking direction, or a thickness (T) direction; the Y direction can be defined as a second direction or a length (L) direction; and the Z direction can be defined as a third direction or a width (W) direction.

[0043] Multilayer electronic components Figure 1 A perspective view of a multilayer electronic assembly according to an embodiment of the present disclosure is shown schematically.

[0044] Figure 2 This shows the part excluding the external electrodes. Figure 1 A three-dimensional image.

[0045] Figure 3 It shows the area excluding the glass layer. Figure 2 A three-dimensional image.

[0046] Figure 4 It shows the portion excluding the side edges. Figure 3 A three-dimensional image.

[0047] Figure 5 Schematic illustration along Figure 1 The cross-sectional view taken from line I-I'.

[0048] Figure 6 Schematic illustration along Figure 1 The cross-sectional view taken from line II-II'.

[0049] Figure 7 Schematic illustration along Figure 1 The cross-sectional view taken from line III-III'.

[0050] Figure 8 yes Figure 7 A magnified view of region P1.

[0051] In the following text, reference will be made to Figures 1 to 8 A multilayer electronic assembly 100 according to embodiments of the present disclosure is described in detail.

[0052] According to embodiments of this disclosure, a multilayer electronic component 100 includes: a body 110 including a dielectric layer 111 and inner electrodes 121 and 122 alternately disposed with the dielectric layer in the thickness direction, and including a first surface 1 and a second surface 2 opposite to each other in the thickness direction, a third surface 3 and a fourth surface 4 opposite to each other in the length direction, and a fifth surface 5 and a sixth surface 6 opposite to each other in the width direction; a first side edge portion 141 and a second side edge portion 142 respectively disposed on the fifth surface and the sixth surface; a first glass layer GL1 disposed on the first side edge portion and the second side edge portion and extending to a portion of the third surface; a second glass layer GL2 disposed on the first side edge portion and the second side edge portion and extending to a portion of the fourth surface; a first outer electrode 131 and a second outer electrode 132 respectively disposed on the third surface and the fourth surface, wherein the inner electrodes may include: a first inner electrode 121, the two ends of the first inner electrode 121 located on the third surface in the width direction being covered by the first glass layer; and a second inner electrode 122, the two ends of the second inner electrode 122 located on the fourth surface in the width direction being covered by the second glass layer.

[0053] While forming the side edges using ceramic green sheets by attaching them separately can improve the capacitance per unit volume of the capacitor, stress may be generated at the interface between the side edges and the body during sintering, potentially causing problems such as delamination and cracking. Furthermore, there are concerns that moisture may penetrate through gaps created by delamination and cracks, thereby reducing reliability.

[0054] According to embodiments of this disclosure, a glass layer may be disposed on the side edge and extend to the third or fourth surface of the body, thereby suppressing the occurrence of delamination, cracks, etc., and preventing moisture penetration by blocking the moisture penetration path, thus improving the reliability of the multilayer electronic component.

[0055] In the following, each component included in the multilayer electronic assembly 100 according to embodiments of the present disclosure will be described in detail.

[0056] The main body 110 is not limited to a specific shape, and may have a hexahedral shape or a shape similar to a hexahedron, such as... Figures 1 to 7 As shown in the figure. Because the ceramic powder included in the body 110 can shrink during the sintering process of the body, the body 110 may not have a hexahedral shape with perfect straight lines; however, the body 110 may have a roughly hexahedral shape.

[0057] Reference Figure 4 The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in the thickness direction (X direction), a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in the length direction (Y direction), and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and are opposite to each other in the width direction (Z direction).

[0058] The multiple dielectric layers 111 forming the body 110 are in a sintered state, and adjacent dielectric layers 111 can be integrated with each other, making it difficult to identify the boundary between adjacent dielectric layers 111 without using a scanning electron microscope (SEM).

[0059] According to embodiments of this disclosure, the raw materials used to form the dielectric layer 111 are not particularly limited, as long as sufficient electrostatic capacitance can be obtained. For example, barium titanate-based materials, lead-based perovskite composite materials, strontium titanate-based materials, etc., can be used. Barium titanate-based materials may include BaTiO3-based ceramic powder, and examples of BaTiO3-based ceramic powder may include BaTiO3, wherein calcium (Ca), zirconium (Zr), etc., are partially dissolved in BaTiO3 (Ba... 1-x Ca x TiO3 (0) <x<1)、Ba(Ti 1-y Ca y)O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0060] In addition, the raw material for forming the dielectric layer 111 can be a powder including barium titanate (BaTiO3), and various ceramic additives such as organic solvents, binders, dispersants, etc. can be added to the raw material according to the purpose of the present disclosure.

[0061] The average thickness td of the dielectric layer 111 is not particularly limited and can be arbitrarily set according to the desired characteristics or purposes. For a specific example, the average thickness td of the dielectric layer 111 can be greater than or equal to 300 nm and less than or equal to 10 μm. In addition, the average thickness td of one or more of the plurality of dielectric layers 111 can be greater than or equal to 300 nm and less than or equal to 10 μm.

[0062] In this case, the average thickness td of the dielectric layer 111 can refer to the average thickness of the dielectric layer 111 provided between the adjacent first inner electrode 121 and the second inner electrode 122.

[0063] The average thickness of the dielectric layer 111 can be measured by scanning the cross-section (L-T cross-section) of the main body 110 in the length direction and the thickness direction by using a scanning electron microscope (SEM) with a magnification of 10,000 times. More specifically, the thickness of one dielectric layer can be measured at 30 points equally spaced from each other in the length direction in the scanned image, and the average value can be calculated. The 30 equally spaced points can be specified in the capacitance forming portion Ac. In addition, when the average value measurement is extended to 10 dielectric layers to calculate the average value, the average thickness of the dielectric layer can be made more general.

[0064] The inner electrodes 121 and 122 can be a pair of first inner electrodes 121 and second inner electrodes 122 with different polarities from each other. One end of the plurality of inner electrodes 121 and 122 provided inside the main body 110 can be exposed to the third surface 3 or the fourth surface 4 of the main body 110.

[0065] The first inner electrode 121 and the second inner electrode 122 can be alternately provided in the first direction and the dielectric layer 111 is interposed therebetween.

[0066] One end of the first inner electrode 121 may be exposed to the third surface 3, and one end of the second inner electrode 122 may be exposed to the fourth surface 4. The other end of the first inner electrode 121 may be spaced apart from the fourth surface 4, and the other end of the second inner electrode 122 may be spaced apart from the third surface 3. In an embodiment, the first inner electrode 121 may be exposed to the third, fifth, and sixth surfaces, and the second inner electrode 122 may be exposed to the fourth, fifth, and sixth surfaces. Side edge portions 141 and 142 may be configured to cover the portions of the inner electrodes 121 and 122 exposed to the fifth and sixth surfaces. Therefore, the capacitance per unit volume of the multilayer electronic assembly can be improved. A first outer electrode 131 may be disposed on the third surface 3 of the body 110 to connect to the first inner electrode 121, and a second outer electrode 132 may be disposed on the fourth surface 4 of the body 110 to connect to the second inner electrode 122.

[0067] The internal electrodes 121 and 122 can be stacked in 400 or more layers to achieve a high-capacitance multilayer electronic component, but are not limited thereto.

[0068] There are no particular limitations on the materials used to form the internal electrodes 121 and 122, and materials with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0069] Alternatively, the internal electrodes 121 and 122 can be formed by printing a conductive paste containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof onto a ceramic green sheet. The conductive paste for the internal electrodes can be printed using screen printing or gravure printing, but this disclosure is not limited thereto.

[0070] There are no particular limitations on the average thickness te of the inner electrodes 121 and 122. For example, the average thickness te of the inner electrodes 121 and 122 can be greater than or equal to 0.2 μm and less than or equal to 3 μm.

[0071] The average thickness te of the inner electrodes 121 and 122 may refer to the average thickness of one or more of the inner electrodes 121 and 122.

[0072] The average thickness of the inner electrodes 121 and 122 can be measured by scanning a cross-section (L-T cross-section) of the main body 110 in the length direction and the thickness direction using a scanning electron microscope (SEM) with a magnification of 10,000 times. More specifically, the thickness of one inner electrode can be measured at 30 points equidistantly spaced from each other in the length direction, and then the average value can be taken. 30 points equidistantly spaced can be specified in the capacitance forming portion Ac. In addition, when the average value measurement is extended to 10 inner electrodes to calculate the average value, the average thickness of the inner electrodes can be made more general.

[0073] The main body 110 may include: a capacitance forming portion Ac, in which a dielectric layer and inner electrodes are alternately provided in the thickness direction; and covering portions 112 and 113 provided on the upper and lower portions of the capacitance forming portion Ac in the thickness direction.

[0074] The covering portions 112 and 113 may include an upper covering portion 112 provided on the upper portion of the capacitance forming portion Ac in the thickness direction and a lower covering portion 113 provided on the lower portion of the capacitance forming portion Ac in the thickness direction.

[0075] The capacitance forming portion Ac may be a portion that contributes to the formation of the capacitance of the capacitor, and may be formed by repeatedly stacking a plurality of first inner electrodes 121 and a plurality of second inner electrodes 122 with a dielectric layer 111 interposed therebetween.

[0076] The covering portions 112 and 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper surface and the lower surface of the capacitance forming portion Ac in the thickness direction, respectively, and may serve to prevent damage to the inner electrodes due to physical stress or chemical stress.

[0077] The covering portions 112 and 113 do not include inner electrodes, and the covering portions 112 and 113 may include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which calcium (Ca), zirconium (Zr), etc. are partially solid-solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc. <00,00248>The average thickness tc of the covering portions 112 and 113 is not particularly limited. For example, the average thickness tc of the covering portions 112 and 113 can be from 10 μm to 300 μm. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average thickness tc of the covering portions 112 and 113 can be less than or equal to 15 μm. That is, the average thickness tc of the upper covering portion 112 can be less than or equal to 15 μm, and the average thickness tc of the lower covering portion 113 can also be less than or equal to 15 μm.

[0079] The average thickness tc of the covering portions 112 and 113 can refer to the average dimension in the thickness direction, and can be the average value of the dimensions in the thickness direction of the covering portion 112 or 113 measured at five equally spaced points on the upper or lower part of the capacitance forming portion Ac.

[0080] The side edge portions 141 and 142 can be provided on the fifth surface 5 and the sixth surface 6 respectively. The side edge portions 141 and 142 can include a first side edge portion 141 provided on the fifth surface 5 of the main body 110 and a second side edge portion 142 provided on the sixth surface 6 of the main body 110.

[0081] The side edge portions 141 and 142 can include a perovskite-type compound represented by ABO3 as the main component, and the perovskite-type compound represented by ABO3 can include, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) and Ba(Ti 1-y Zr y )O3 (0 < y < 1) and one or more of them. That is, the side edge portions 141 and 142 can include Ba and Ti. The side edge portions 141 and 142 can also include one or more of Ca and Zr to prevent the dielectric properties from deteriorating under high temperature / high voltage conditions, but the present disclosure is not limited thereto.

[0082] In the present disclosure, the "main component" of the side edge portions 141 and 142 can refer to a component that occupies a relatively large weight ratio or atomic number ratio compared with other components, and can refer to a component that exceeds 50 wt%, exceeds 50 at% based on the atomic number, or exceeds 50 mol% based on the mole number based on the total weight of the composition or the entire side edge portion.

[0083] The side edges 141 and 142 serve to prevent damage to the internal electrodes due to physical or chemical stress. In addition, the side edges 141 and 142 serve to suppress the step difference caused by the internal electrodes 121 and 122, and to improve the capacitance per unit volume of the multilayer electronic assembly 100.

[0084] Side edges 141 and 142 can be formed by stacking a single dielectric layer or two or more dielectric layers along the width direction on a fifth surface 5 and a sixth surface 6 of the body 110, where both the first inner electrode 121 and the second inner electrode 122 are exposed.

[0085] The average width wm of the side edges 141 and 142 is not particularly limited. For example, the average width wm of the side edges 141 and 142 can be from 5 μm to 300 μm. However, in order to more easily achieve miniaturization and high capacitance of multilayer electronic components and to improve the capacitance per unit volume of multilayer electronic components, the average width wm of the side edges 141 and 142 can be less than or equal to 15 μm.

[0086] The average width wm of the side edges 141 and 142 can refer to the average dimension of the side edges 141 and 142 in the width direction, and can be the average value of the dimensions of the side edges 141 and 142 in the width direction measured at 5 equally spaced points in the thickness direction.

[0087] The glass layer GL may be disposed on the side edges 141 and 142 and extend to the third or fourth surface.

[0088] The glass layer GL may include a first glass layer GL1 and a second glass layer GL2. The first glass layer GL1 is disposed on the first side edge portion 141 and the second side edge portion 142 and extends to a portion of the third surface. The second glass layer GL2 is disposed on the first side edge portion 141 and the second side edge portion 142 and extends to a portion of the fourth surface. The inner electrodes 121 and 122 may include: a first inner electrode 121, the two ends of the first inner electrode 121 located on the third surface 3 in the width direction (Z direction) are covered by the first glass layer GL1; and a second inner electrode 122, the two ends of the second inner electrode 122 located on the fourth surface 4 in the width direction (Z direction) are covered by the second glass layer GL2. Therefore, the bonding force between the side edges 141 and 142 and the body 110 can be improved, and the moisture-proof reliability can be improved by blocking or extending the moisture penetration path.

[0089] In the first inner electrode 121 exposed to the third surface, the area not covered by the first glass layer GL1 is directly connected to the first outer electrode 131, and in the second inner electrode 122 exposed to the fourth surface, the area not covered by the second glass layer GL2 is directly connected to the second outer electrode 132.

[0090] The first glass layer GL1 may include a 1-1 glass layer GL1-1 disposed on one surface of the first side edge portion 141 in the longitudinal direction and a 1-2 glass layer GL1-2 disposed on one surface of the second side edge portion 142 in the longitudinal direction, and the second glass layer GL2 may include a 2-1 glass layer GL2-1 disposed on another surface of the first side edge portion 141 in the longitudinal direction and a 2-2 glass layer GL2-2 disposed on another surface of the second side edge portion 142 in the longitudinal direction.

[0091] 1-1 Glass layer GL1-1 may be disposed on one surface of the first side edge portion 141 in the length direction, and may cover one end of the first inner electrode 121 exposed on the third surface by extending to the third surface in the width direction; and 1-2 Glass layer GL1-2 may be disposed on one surface of the second side edge portion 142 in the length direction, and may cover the other end of the first inner electrode 121 exposed on the third surface by extending to the third surface in the width direction.

[0092] 2-1 Glass layer GL2-1 may be disposed on another surface of the first side edge portion 141 in the length direction, and may cover one end of the second inner electrode 122 exposed to the fourth surface by extending to the fourth surface in the width direction; and 2-2 Glass layer GL2-2 may be disposed on another surface of the second side edge portion 142 in the length direction, and may cover the other end of the second inner electrode 122 exposed to the fourth surface by extending to the fourth surface in the width direction.

[0093] In an embodiment, when the width of the first inner electrode 121 in the third direction is Wb and the width of the portion of the first inner electrode 121 not covered by the first glass layer GL1 in the third direction is Wa, the average value of Wa / Wb can be greater than or equal to 0.90 and less than or equal to 0.98. Therefore, the reliability improvement effect according to this disclosure can be further improved, the degradation of electrical connectivity between the outer electrodes 131 and 132 and the inner electrodes 121 and 122 can be suppressed, and the equivalent series resistance (ESR) of the multilayer electronic component 100 can be reduced.

[0094] Therefore, it is preferable that the average value of Wa / Wb is greater than or equal to 0.90 and less than or equal to 0.98, and more preferably greater than or equal to 0.94 and less than or equal to 0.98.

[0095] Because the first inner electrode 121 and the first glass layer GL1 are symmetrical with the second inner electrode 122 and the second glass layer GL2 in the length direction (Y direction), when the width of the second inner electrode 122 in the third direction is Wb' and the width of the portion of the second inner electrode 122 not covered by the second glass layer GL2 in the third direction is Wa', the average value of Wa' / Wb' can be greater than or equal to 0.90 and less than or equal to 0.98.

[0096] Wa, Wb, Wa', and Wb' can be measured, for example, from the following images: images of the central portion of a multilayer electronic assembly 100 polished in the thickness direction, and of cross sections (LW sections) observed using an optical microscope (OM) or a scanning electron microscope (SEM) in the length and width directions.

[0097] In the following description, the focus will be on the first inner electrode 121 and the first glass layer GL1, but it can also be applied to the second inner electrode 122 and the second glass layer GL2. Furthermore, since glass layer 1-1 GL1-1 and glass layer 1-2 GL1-2 can be symmetrical in the width direction, and glass layer 2-1 GL2-1 and glass layer 2-2 GL2-2 can also be symmetrical in the width direction, the following description will focus on glass layer 1-1 GL1-1. However, by considering their respective symmetry, it can also be applied to glass layers 1-2 GL1-2, 2-1 GL2-1, and 2-2 GL2-2.

[0098] In the embodiments, the average thickness tg of the first glass layer and the second glass layer can be greater than or equal to 5 μm and less than or equal to 15 μm, respectively.

[0099] The average thickness of the first glass layer can be measured on the outer surfaces of the third surface, the first side edge, and the second side edge in the width direction, and the average thickness of the second glass layer can be measured on the fourth surface, the first side edge, and the second side edge in the width direction.

[0100] Reference Figure 8 The distance Es1, the extension line of the portion of glass layer 1-1 GL1-1 disposed on the third surface in the width direction to the outer surface of the first side edge in the width direction, is divided into ten equal parts. The average value of the dimensions of glass layer 1-1 GL1-1 in the second direction measured at five central points is defined as the average thickness of glass layer 1-1 GL1-1. The average thickness of glass layer 1-2 GL1-2 can also be measured using a similar method, and the average value of the average thicknesses of glass layers 1-1 GL1-1 and 1-2 GL1-2 can be the average thickness of the first glass layer GL1. Furthermore, the average thickness of the second glass layer GL2 can also be measured and obtained in a similar manner.

[0101] In an embodiment, glass layer 1-1 GL1-1 and glass layer 2-1 GL2-1 may each include side surface extensions GL1-1b and GL2-1b, respectively, which extend to the outer surface of the first side edge portion 141 in the width direction. Similarly, glass layer 1-2 GL1-2 and glass layer 2-2 GL2-2 may each include side surface extensions GL1-2b and GL2-2b, respectively, which extend to the outer surface of the second side edge portion 142 in the width direction. In this case, the surface of the first side edge portion 141 that does not contact the fifth surface in the width direction can be defined as the outer surface of the first side edge portion 141 in the width direction, and the surface of the first side edge portion 141 that contacts the fifth surface in the width direction can be defined as the inner surface of the first side edge portion 141 in the width direction. Similarly, the surface of the second side edge portion 142 that does not contact the sixth surface in the width direction can be defined as the outer surface of the second side edge portion 142 in the width direction, and the surface of the second side edge portion 142 that contacts the sixth surface in the width direction can be defined as the inner surface of the second side edge portion 142 in the width direction.

[0102] Reference Figure 7 Glass layer GL1-1 (1-1) may include a region GL1-1a disposed on one surface of the first side edge 141 in the longitudinal direction and a 1-1 side surface extension GL1-1b extending to the outer surface of the first side edge 141 in the width direction. Glass layer GL2-1 (2-1) may include a region GL2-1a disposed on another surface of the first side edge 141 in the longitudinal direction and a 2-1 side surface extension GL2-1b extending to the outer surface of the first side edge 141 in the width direction. Glass layer GL1-2 (1-2) may include a region GL1-2a disposed on one surface of the second side edge 142 in the longitudinal direction and a 1-2 side surface extension GL1-2b extending to the outer surface of the second side edge 142 in the width direction. The 2-2 glass layer GL2-2 may include a region GL2-2a disposed on another surface of the second side edge portion 142 in the length direction and a 2-2 side surface extension GL2-2b disposed on the outer surface of the second side edge portion 142 in the width direction. Since the glass layer GL may include the side surface extensions GL1-1b, GL1-2b, GL2-1b and GL2-2b, the bonding force between the side edges 141 and 142 and the body 110 can be further improved.

[0103] The first glass layer GL1 may include first side surface extensions GL1-1b and GL1-2b, and the second glass layer GL2 may include second side surface extensions GL2-1b and GL2-2b.

[0104] In an embodiment, when the length of the extension line Es1 from the outer surface of the first side edge portion 141 in the width direction to the end of the portion of the 1-1 glass layer GL1-1 disposed on the third surface in the width direction is Le, and the length of the extension line E3 from the third surface to the end of the side surface extension portion GL1-1b of the 1-1 glass layer GL1-1 in the length direction is Lf, Le / Lf can be greater than or equal to 0.8 and less than or equal to 1.2.

[0105] The ratio D / C of the maximum thickness D of the region GL1-1a on one surface of the first side edge portion 141 in the length direction and the maximum thickness C of the 1-1 side surface extension GL1-1b extending to the outer surface of the first side edge portion 141 in the width direction is not particularly limited. For example, D / C can be greater than or equal to 0.5 and less than or equal to 1.5, but is not limited thereto, and can be D>C, such as... Figure 9A and Figure 9B As shown in the image.

[0106] The maximum thickness C of the 1-1 side surface extension GL1-1b can refer to the maximum dimension in the width direction of the distance between the outer surface of the 1-1 side surface extension GL1-1b and the outer surface of the first side edge 141, and the maximum thickness D of the region GL1-1a provided on one surface of the first side edge 141 in the length direction can refer to the maximum dimension in the length direction of the distance between the outer surface of the region GL1-1a and the third surface.

[0107] In an embodiment, the first glass layer GL1 may include first side surface extensions GL1-1b and GL1-2b extending to the outer surface of the first side edge in the width direction and extending to the outer surface of the second side edge in the width direction, respectively. The second glass layer GL2 may include second side surface extensions GL2-1b and GL2-2b extending to the outer surface of the first side edge in the width direction and extending to the outer surface of the second side edge in the width direction, respectively. The first external electrode 131 and the second external electrode 132 may each include side surface strips Sb1 and Sb2 extending to the outer surface of the first side edge in the width direction and extending to the outer surface of the second side edge in the width direction, respectively.

[0108] The first external electrode 131 may include a first side surface strip Sb1 extending to the outer surface in the width direction of the first side edge portion 141 and the outer surface in the width direction of the second side edge portion 142, and the second external electrode 132 may include a second side surface strip Sb2 extending to the outer surface in the width direction of the first side edge portion 141 and the outer surface in the width direction of the second side edge portion 142.

[0109] In an embodiment, the side surface strips Sb1 and Sb2 may be configured to cover all the side surface extensions GL1-1b, GL1-2b, GL2-1b and GL2-2b.

[0110] The first side surface strip Sb1 can be configured to cover all the first side surface extensions GL1-1b and GL1-2b, and the second side surface strip Sb2 can be configured to cover all the second side surface extensions GL2-1b and GL2-2b.

[0111] In an embodiment, the first glass layer GL1 and the second glass layer GL2 may include two surfaces in the thickness direction extending to the first side edge portion 141 and the upper surface extension and lower surface extension of the two surfaces in the thickness direction of the second side edge portion 142, respectively.

[0112] Reference Figure 2 The first glass layer GL1 may include an upper surface extension and a lower surface extension of two surfaces in the thickness direction extending to the first side edge 141 and the second side edge 142, respectively, and the upper surface extension and the lower surface extension may cover a portion of the first surface 1 and a portion of the second surface 2 of the body 110. Similarly, the second glass layer GL2 may also include an upper surface extension and a lower surface extension of two surfaces in the thickness direction extending to the first side edge 141 and the second side edge 142, respectively, and the upper surface extension and the lower surface extension may cover a portion of the first surface 1 and a portion of the second surface 2 of the body 110.

[0113] In this case, both the first external electrode 131 and the second external electrode 132 may include an upper surface strip and a lower surface strip extending to the first side edge portion and the second side edge portion in the thickness direction, and the upper surface strip and the lower surface strip may be configured to cover all the upper surface extension portions and all the lower surface extension portions, respectively.

[0114] In an embodiment, the four vertices located at the edge of the outer surface of the first side edge portion 141 in the width direction and the four vertices located at the edge of the outer surface of the second side edge portion 142 in the width direction can be covered by the first glass layer GL1 and the second glass layer GL2. Therefore, according to this disclosure, the airtight sealing effect can be further improved by the glass layers GL1 and GL2, thereby further improving reliability.

[0115] External electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4, respectively. The multilayer electronic assembly 100 may include a first external electrode 131 disposed on the third surface 3 and a second external electrode 132 disposed on the fourth surface 4. The first external electrode 131 and the second external electrode 132 may extend to a portion of the first surface 1 and a portion of the second surface 2, respectively.

[0116] There are no particular limitations on the type or shape of the outer electrodes 131 and 132, and they may have a multilayer structure. For example, the outer electrodes 131 and 132 may include base electrode layers 131a and 132a in contact with the inner electrodes 121 and 122, and plating layers 131b and 132b disposed on the base electrode layers 131a and 132a.

[0117] The substrate electrode layers 131a and 132a may be sintered electrode layers comprising metal and glass. The metals included in the substrate electrode layers 131a and 132a may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or alloys thereof. The glass included in the substrate electrode layers 131a and 132a may include, for example, one or more oxides of each of Ba, Ca, Zn, Al, B, and Si.

[0118] The substrate electrode layers 131a and 132a may consist of only sintered electrode layers, but this disclosure is not limited thereto. Furthermore, the substrate electrode layers 131a and 132a may include sintered electrode layers and resin electrode layers. The sintered electrode layers include metal and glass, and the resin electrode layers are disposed on the sintered electrode layers and include metal particles and resin.

[0119] The metal particles included in the resin electrode layer may include one or more of spherical particles and flake-shaped particles. The metal particles included in the resin electrode layer may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn, and / or alloys thereof. The resin included in the resin electrode layer may include one or more of, for example, epoxy resin, acrylic resin, and ethyl cellulose resin.

[0120] The plating layers 131b and 132b may comprise, for example, Ni, Sn, Pd, and / or alloys thereof, and may be formed using multiple layers. The plating layers 131b and 132b may be, for example, Ni plating layers or Sn plating layers, and may also be in the form of Ni plating layers and Sn plating layers sequentially formed on the substrate electrode layers 131a and 132a. The plating layers 131b and 132b may comprise multiple Ni plating layers and / or multiple Sn plating layers.

[0121] Although the accompanying drawings depict a multilayer electronic assembly 100 having two external electrodes 131 and 132, it is not limited thereto, and the number or shape of the external electrodes 131 and 132 may be changed depending on the shape of the internal electrodes 121 and 122 or for other purposes.

[0122] In an embodiment, the two ends of the first external electrode 131 and the second external electrode 132 in the width direction may have a shape that protrudes in the length direction. (Refer to...) Figure 7 As can be seen, since the multilayer electronic component 100 includes glass layers GL1 and GL2, the thickness of the two ends in the width direction can be increased, thereby giving the two ends of the first external electrode 131 and the second external electrode 132 a convex shape in the width direction.

[0123] Additionally, the central portions of the first external electrode 131 and the second external electrode 132 in the width direction may have a convex shape in the length direction. This can be achieved by immersing the first external electrode 131 and the second external electrode 132 in a paste for external electrodes.

[0124] In this embodiment, glass layers GL1 and GL2 may comprise a first glass. The first glass may comprise one or more of Ba, Si, Zn, Ca, Al, and Mg. External electrodes 131 and 132 may comprise substrate electrode layers 131a and 132a comprising a metal and a second glass. The second glass may comprise one or more of Ba, Si, Zn, Ca, Al, and Mg, but may have a different composition than the first glass.

[0125] In this embodiment, when the ratio of the sum of the moles of Ba and Si constituting the first glass to the total moles of elements excluding oxygen is M1, and the ratio of the sum of the moles of Ba and Si constituting the second glass to the total moles of elements excluding oxygen is M2, M1 > M2 can be satisfied. When M1 > M2, the softening temperature of the first glass can be higher than that of the second glass. Therefore, when the substrate electrode layers 131a and 132a are formed after the glass layers GL1 and GL2 are formed, softening of the first glass can be prevented, thereby maintaining the shape of the glass layers GL1 and GL2.

[0126] The compositions of the first and second glasses can be calculated from images observed using SEM-EDS (Scanning Electron Microscopy-Energy Dispersive X-ray Spectroscopy). Specifically, after exposing the cross-sections (LW sections) of the multilayer electronic assembly 100 obtained by polishing to the central portion in the thickness direction of the multilayer electronic assembly 100 in the length and width directions, the composition of the central regions of glass layers GL1 and GL2 can be analyzed using ESD, and M1 and M2 can be calculated based on the mol% of the remaining elements other than oxygen.

[0127] Figure 9A This is a SEM scan image of the region corresponding to region P1, according to an embodiment of this disclosure. Figure 9BThis is an image captured by an optical microscope of the region corresponding to region P1, according to an embodiment of this disclosure. (Refer to...) Figure 9A and Figure 9B It can be confirmed that the 1-1 glass layer GL1-1 is essentially made of glass and is clearly distinguishable from the substrate electrode layer 131a, which includes both metal and glass. Furthermore, it can be confirmed that the shape of the 1-1 glass layer GL1-1 is well maintained even after the sintering process.

[0128] In an embodiment, the area ratio of the glass in the first glass layer GL1 and the second glass layer GL2 in the cross section can be greater than or equal to 95%. Therefore, the first glass layer GL1 and the second glass layer GL2 can be clearly distinguished from the substrate electrode layers 131a and 132a, which include metal and glass.

[0129] The size of the multilayer electronic component 100 is not particularly limited. According to this disclosure, since the size of the multilayer electronic component 100 is advantageous in terms of miniaturization and high capacitance, it can be applied to the size of small IT products, and since it can ensure high reliability in a variety of environments, it can also be applied to the size of automotive electrical products that require high reliability.

[0130] like Figure 1 and Figure 7 As shown, side surface strips Sb1 and Sb2 are configured to cover all side surface extensions GL1-1b, GL1-2b, GL2-1b, and GL2-2b. In the case of a multilayer electronic assembly 100' according to another embodiment of the present disclosure, side surface strips Sb1' and Sb2' may be configured to cover a portion of side surface extensions GL1-1b', GL1-2b', GL2-1b', and GL2-2b'.

[0131] Figure 10 A perspective view of a multilayer electronic assembly 100' according to another embodiment of the present disclosure is schematically shown. Figure 11 Schematic illustration along Figure 10 The cross-sectional view taken from line IV-IV'. (Refer to...) Figure 10 and Figure 11 The first side surface strip Sb1' of the first external electrode 131' can be configured as a part of the first side surface extensions GL1-1b' and GL1-2b' covering the first glass layers GL1-1' and GL1-2', and the second side surface strip Sb2' of the second external electrode 132' can be configured as a part of the second side surface extensions GL2-1b' and GL2-2b' covering the second glass layers GL2-1' and GL2-2'.

[0132] Glass layer 1-1 GL1-1' may include a region GL1-1a' disposed on one surface of the first side edge portion 141 in the longitudinal direction and a 1-1 side surface extension GL1-1b' extending to the outer surface of the first side edge portion 141 in the width direction. Glass layer 2-1 GL2-1' may include a region GL2-1a' disposed on another surface of the first side edge portion 141 in the longitudinal direction and a 2-1 side surface extension GL2-1b' extending to the outer surface of the first side edge portion 141 in the width direction. Glass layer 1-2 GL1-2' may include a region GL1-2a' disposed on one surface of the second side edge portion 142 in the longitudinal direction and a 1-2 side surface extension GL1-2b' extending to the outer surface of the second side edge portion 142 in the width direction. The 2-2 glass layer GL2-2' may include a region GL2-2a' disposed on another surface in the length direction of the second side edge portion 142 and a 2-2 side surface extension GL2-2b' disposed on the outer surface in the width direction of the second side edge portion 142.

[0133] Furthermore, the first glass layer GL1' and the second glass layer GL2' may include upper surface extensions and lower surface extensions of two surfaces in the thickness direction extending to the first side edge 141 and the second side edge 142, respectively. In this case, both the first external electrode 131' and the second external electrode 132' include upper surface strips and lower surface strips of two surfaces in the thickness direction extending to the first side edge and two surfaces in the thickness direction extending to the second side edge, and the upper surface strips and lower surface strips may be configured to cover a portion of the upper surface extensions and lower surface extensions. In addition, the external electrodes 131' and 132' may include substrate electrode layers 131a' and 132a' and plating layers 131b' and 132b' disposed on the substrate electrode layers 131a' and 132a'.

[0134] Method for manufacturing multilayer electronic components In the following text, reference will be made to Figures 12 to 17 A method for manufacturing a multilayer electronic component is described in detail below. The method for manufacturing a multilayer electronic component described below is an example of manufacturing the multilayer electronic component 100 described above, and the multilayer electronic component 100 need not be manufactured solely by the manufacturing method described later.

[0135] Operations for forming stacked strips Reference Figure 12 The stacked strip 200 can be obtained by stacking ceramic green sheets 201 and 202, on which internal electrode patterns 221 and 222 are printed, along a first direction. At least a portion of the stacked strip 200 can become part of the body 110 of this disclosure after sintering.

[0136] In the manufacturing operation of the stacked strip 200, first, a plurality of green ceramic sheets 201 and 202 having inner electrode patterns 221 and 222 are stacked on a support film 310.

[0137] The support film 310 can serve to support the stacked strip 200 in which a plurality of green ceramic sheets 201 and 202 (having inner electrode patterns 221 and 222) are stacked. In this case, the support film 310 may include an adhesive material such as latex, starch, cellulose, protein, isoprene rubber (IR), nitrile rubber (NBR), styrene-butadiene rubber (SBR), chloroprene rubber (CR), silicone rubber, silicone-based material, polyurethane-based material, acrylic-based material, and mixtures thereof to effectively support and attach the stacked strip 200.

[0138] The plurality of green ceramic sheets 201 and 202 can be formed from a ceramic paste containing ceramic powder, organic solvent, dispersant, and binder. The ceramic powder is a raw material for forming the dielectric layer 111 of the multilayer electronic component 100, and a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material can be used. The barium titanate-based material may include BaTiO3-based ceramic powder, and the BaTiO3-based ceramic powder may be, for example, BaTiO3, (Ba 1- x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y [[ID=​​​​​​​​​​​​​​​​​​​​Internal electrode patterns 221 and 222 can be formed on ceramic green sheets 201 and 202 using a paste containing a conductive metal for the internal electrodes. There are no particular limitations on the conductive metal included in the internal electrode patterns 221 and 222, and materials with excellent conductivity can be used. For example, the conductive metal may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. There are no particular limitations on the method used to form the internal electrode patterns 221 and 222 on the ceramic green sheets 201 and 202. For example, the conductive paste containing a conductive metal for the internal electrodes can be formed on the ceramic green sheets 201 and 202 by screen printing or gravure printing.

[0141] The inner electrode patterns 221 and 222 can be stripe-shaped. Specifically, the inner electrode patterns can be formed to contact the ceramic green sheets 201 and 202 at both ends in a third direction and spaced apart from each other at a constant interval in a second direction.

[0142] The internal electrode patterns 221 and 222 may include a first internal electrode pattern 221 formed on the ceramic green sheet 201 and a second internal electrode pattern 222 formed on another ceramic green sheet 202.

[0143] Operations for obtaining a unit stack Reference Figure 13 Stacked strips 200 can be cut along mutually orthogonal cutting lines C1-C1 and C2-C2. Cutting lines C1-C1 are parallel to the second direction and are spaced substantially equidistant from each other in the third direction. Cutting lines C2-C2 are parallel to the third direction and are also spaced substantially equidistant from each other in the second direction. Therefore, as... Figure 14 As shown, multiple unit stacks 210 can be obtained.

[0144] Operations used to form the side edges Next, as Figure 15 As shown, the side edge portion can be attached to the side surface of the unit laminate 210, where the ends of the first inner electrode pattern and the ends of the second inner electrode pattern are exposed, using a ceramic green sheet 241.

[0145] The first side edge portion can be formed by attaching the side edge portion to the fifth surface 5 of the unit laminate 210 with a ceramic green sheet 241. Thereafter, the second side edge portion can be formed by attaching the side edge portion to the sixth surface 6 of the unit laminate 210 with a ceramic green sheet.

[0146] Specifically, the method of forming the first side edge portion includes setting the side edge portion on the upper part of the elastic stamping member 320 formed of rubber using a ceramic green sheet 241.

[0147] Next, the unit stack 210 is positioned such that its fifth surface 5 faces the side edge ceramic sheet 241, and then the unit stack 210 is pressed against the side edge ceramic sheet 241.

[0148] When the unit laminate 210 is pressed against the side edge ceramic green sheet 241 to transfer the side edge ceramic green sheet 241 onto the unit laminate 210, as Figure 16 As shown, due to the use of the elastic stamping member 320 formed of rubber, the side edge portion is attached with ceramic green sheet 241 to the fifth surface 5 of the covering unit laminate 210, and the remaining portion can be cut.

[0149] Subsequently, the unit stack 210 is rotated 180 degrees and the above process is repeated to form a second side edge on the sixth surface 6 of the unit stack 210.

[0150] Operations for forming glass layers Next, glass layers GL1 and GL2 can be formed.

[0151] Reference Figure 17 After the paste GP (including the first glass powder) for forming the glass layer is applied in two lines onto the platen 330, the unit laminate 210 having side edges 241 and 242 attached thereto can be transferred or impregnated into the paste GP for forming the glass layer, and then dried. Thereafter, the unit laminate 210 having the side edges 241 and 242 attached thereto can be rotated 180 degrees, and the above process can be repeated.

[0152] Subsequently, glass layers GL1 and GL2 can be formed by sintering at a first temperature of 500°C to 900°C.

[0153] Subsequently, external electrodes 131 and 132 can be formed. For example, when the substrate electrode layers 131a and 132a include sintered electrode layers, conductive paste for the external electrodes, comprising metal powder, second glass powder, binder, organic solvent, etc., can be sintered at a second temperature of 500°C to 900°C to form substrate electrode layers 131a and 132a. Substrate electrode layers 131a and 132a can be formed by coating the conductive paste for the external electrodes onto glass layers GL1 and GL2 and then sintering them, but this disclosure is not limited thereto.

[0154] To prevent the first glass from softening during the process of forming the substrate electrode layers 131a and 132a, the first temperature may preferably be higher than the second temperature. For example, the first temperature may be higher than the softening temperature of the first glass, and the second temperature may be lower than the softening temperature of the first glass but higher than the softening temperature of the second glass.

[0155] Alternatively, when the substrate electrode layers 131a and 132a include a resin electrode layer, a conductive resin composition including metal powder, resin, binder and organic solvent can be coated onto the sintered electrode layer and then cured at a temperature of 250°C to 550°C to form the resin electrode layer.

[0156] In addition, electroplating and / or electroless plating can be performed to form plating layers 131b and 132b on the substrate electrode layers 131a and 132a.

[0157] The present disclosure will be described in more detail below with reference to examples, but this is intended to help in a concrete understanding of the disclosure, and the scope of the disclosure is not limited to the examples below.

[0158] [Example] Samples numbered 1 to 7 were prepared using the method described above for manufacturing multilayer electronic components.

[0159] However, in test number 1, the external electrode was formed without forming a glass layer.

[0160] In the case of test number 2, the glass layers are formed such that the first glass layer is disposed on the first side edge and the second side edge but spaced apart from the third surface of the body, and the second glass layer is disposed on the first side edge and the second side edge but spaced apart from the fourth surface of the body.

[0161] In the case of test number 3, the difference from test number 2 is that the glass layer is formed such that it is further disposed at the boundary between the third and fourth surfaces and the other surfaces of the body, and the glass layer is formed such that it does not extend to the third and fourth surfaces.

[0162] In the cases of test numbers 1 to 3, since the width Wb of the first inner electrode in the third direction is the same as the width Wa of the portion of the first inner electrode not covered by the first glass layer in the third direction, Wa / Wb is defined as 1.0.

[0163] In the cases of test numbers 4 to 7, the glass layers are formed such that Wa and Wb satisfy the following Table 1.

[0164] Moisture-proof reliability evaluation For test numbers 1 through 7, 400 sample pieces were mounted on a printed circuit board (PCB) and a voltage of 6.0V was applied for 15 hours at 85°C and 85% humidity. When the insulation resistance (IR) value decreased to less than 1 / 10 of the initial IR value, the sample was evaluated as defective. The number of defective samples was then measured and is shown in Table 1 below.

[0165] ESR rating ESR was measured using an LCR meter (frequency: 500kHz, SMD clamp-type probe). For test numbers 1 to 7, ESR was measured for 400 sample pieces, and the average values ​​are shown in Table 1 below.

[0166] The final evaluation is determined by considering both moisture resistance reliability and ESR, and is rated as excellent (◎), good (○), average (△) and poor (X).

[0167] [Table 1]

[0168] Referring to Table 1, it can be confirmed that in test number 1, the moisture-proof reliability of the sample sheet is significantly low because it does not include a glass layer. Furthermore, in test number 2, the moisture-proof reliability of the sample sheet is insufficient because the glass layer is spaced apart from the third and fourth surfaces of the body. In the case of test number 3, it can be confirmed that the moisture-proof reliability of the sample sheet is insufficient because the glass layer is further extended to the boundaries between the third and fourth surfaces and the other surfaces of the body.

[0169] On the other hand, for tests 4 to 7, it was confirmed that the moisture resistance was significantly improved because the glass layer covered both ends of the inner electrode and Wa / Wb was less than 1.0. However, in test 7 with Wa / Wb of 0.80, the ESR increased to 2.83 mΩ, thus confirming a significant deterioration in the electrical properties of the sample.

[0170] Although embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above embodiments and drawings, but is defined by the appended claims. Therefore, those skilled in the art can make various substitutions, modifications, or changes without departing from the scope of the present disclosure as defined by the appended claims, and such substitutions, modifications, or changes should be construed as being included within the scope of the present disclosure.

[0171] Furthermore, the expression "one embodiment" as used in this disclosure does not mean the same embodiment, but is provided to emphasize and explain different unique features. However, the embodiments presented above do not preclude implementation in combination with features of another embodiment. For example, although items described in a particular embodiment are not described in another embodiment, these items may be understood to be combinable with features of another embodiment unless there is a description to the contrary or contradictory in another embodiment.

[0172] The terminology used in this disclosure is for describing one embodiment only and is not intended to limit the disclosure. In this context, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0173] While embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component, comprising: The body includes a dielectric layer and internal electrodes that are alternately disposed with the dielectric layer in the thickness direction, and includes a first surface and a second surface that are opposite to each other in the thickness direction, a third surface and a fourth surface that are opposite to each other in the length direction, and a fifth surface and a sixth surface that are opposite to each other in the width direction. The first side edge portion and the second side edge portion are respectively disposed on the fifth surface and the sixth surface; A first glass layer is disposed on the first side edge and the second side edge and extends to a portion of the third surface; A second glass layer is disposed on the first side edge and the second side edge and extends to a portion of the fourth surface; as well as The first external electrode and the second external electrode are respectively disposed on the third surface and the fourth surface. The inner electrode includes: a first inner electrode, the two ends of the first inner electrode located on the third surface in the width direction being covered by the first glass layer; and a second inner electrode, the two ends of the second inner electrode located on the fourth surface in the width direction being covered by the second glass layer.

2. The multilayer electronic component according to claim 1, wherein, The first external electrode is configured to cover at least a portion of the first glass layer. The second external electrode is configured to cover at least a portion of the second glass layer.

3. The multilayer electronic component according to claim 1, wherein, The first internal electrode is exposed to the third, fifth, and sixth surfaces of the body. The second internal electrode is exposed on the fourth, fifth, and sixth surfaces of the body.

4. The multilayer electronic component according to claim 1, wherein, The width of the first inner electrode in the width direction is Wb, and the width of the portion of the first inner electrode not covered by the first glass layer in the width direction is Wa. The average Wa / Wb ratio is greater than or equal to 0.90 and less than or equal to 0.

98.

5. The multilayer electronic component according to claim 1, wherein, The average thickness of the first glass layer and the second glass layer is greater than or equal to 5 μm and less than or equal to 15 μm, respectively.

6. The multilayer electronic assembly according to claim 1, wherein, The first glass layer includes a 1-1 glass layer disposed on one surface of the first side edge in the length direction and a 1-2 glass layer disposed on one surface of the second side edge in the length direction. The second glass layer includes a 2-1 glass layer disposed on another surface of the first side edge in the length direction and a 2-2 glass layer disposed on another surface of the second side edge in the length direction.

7. The multilayer electronic component according to claim 6, wherein, Both glass layer 1-1 and glass layer 2-1 include a side surface extension that extends to the outer surface of the first side edge in the width direction. Both the 1-2 glass layer and the 2-2 glass layer include a side surface extension that extends to the outer surface of the second side edge in the width direction.

8. The multilayer electronic component according to claim 7, wherein, The length of the extension line from the outer surface of the first side edge in the width direction to the end of the portion of the 1-1 glass layer disposed on the third surface in the width direction is Le, and the length of the extension line from the third surface to the end of the side surface extension of the 1-1 glass layer in the length direction is Lf, where Le / Lf is greater than or equal to 0.8 and less than or equal to 1.

2.

9. The multilayer electronic component according to claim 1, wherein, Both the first glass layer and the second glass layer include an outer surface extending to the first side edge portion in the width direction and a side surface extension of the outer surface of the second side edge portion in the width direction. The first external electrode and the second external electrode each include a side surface strip extending to the outer surface of the first side edge in the width direction and the outer surface of the second side edge in the width direction.

10. The multilayer electronic component according to claim 9, wherein, The side surface strip is configured to cover the entirety of the corresponding side surface extension.

11. The multilayer electronic assembly according to claim 9, wherein, The side surface strip is configured to cover a portion of the corresponding side surface extension.

12. The multilayer electronic assembly according to claim 1, wherein, Both the first glass layer and the second glass layer include two surfaces extending to the first side edge in the thickness direction, and upper and lower surface extensions of the two surfaces of the second side edge in the thickness direction.

13. The multilayer electronic assembly according to claim 12, wherein, Both the first external electrode and the second external electrode include two surfaces extending to the first side edge in the thickness direction, and an upper surface strip and a lower surface strip of the two surfaces of the second side edge in the thickness direction. The upper surface strip and the lower surface strip are configured to cover the entirety of the corresponding upper surface extension and the entirety of the corresponding lower surface extension.

14. The multilayer electronic assembly according to claim 12, wherein, Both the first external electrode and the second external electrode include two surfaces extending to the first side edge in the thickness direction, and an upper surface strip and a lower surface strip of the two surfaces of the second side edge in the thickness direction. The upper surface strip and the lower surface strip are configured to cover a portion of the corresponding upper surface extension and a portion of the corresponding lower surface extension.

15. The multilayer electronic assembly according to claim 1, wherein, The four vertices located at the edge of the outer surface of the first side edge in the width direction and the four vertices located at the edge of the outer surface of the second side edge in the width direction are covered by the first glass layer and the second glass layer.

16. The multilayer electronic assembly according to claim 1, wherein, The first external electrode and the second external electrode have a convex shape at both ends in the width direction.

17. The multilayer electronic assembly according to claim 16, wherein, The central portion of the first and second external electrodes in the width direction has a convex shape in the length direction.

18. The multilayer electronic assembly according to claim 1, wherein, The area ratio of the first glass layer and the second glass layer in the cross section is greater than or equal to 95%.

19. The multilayer electronic assembly according to claim 1, wherein, The first glass layer and the second glass layer comprise a first glass, which comprises one or more of Ba, Si, Zn, Ca, Al and Mg.

20. The multilayer electronic assembly according to claim 19, wherein, The first and second external electrodes each include a substrate electrode layer, which comprises a metal and a second glass. Wherein, the ratio of the sum of the moles of Ba and Si constituting the first glass to the total moles of elements other than oxygen is M1, and the ratio of the sum of the moles of Ba and Si constituting the second glass to the total moles of elements other than oxygen is M2, satisfying M1>M2.

21. A multilayer electronic component, comprising: The main body includes: A first internal electrode, exposed through a first surface of the body and spaced apart in the longitudinal direction from a second surface of the body opposite to the first surface, and The second inner electrode is exposed through the second surface of the body and spaced apart from the first surface. The second inner electrode and the first inner electrode are stacked alternately in the thickness direction and a dielectric layer is disposed between the second inner electrode and the first inner electrode. The first side edge portion and the second side edge portion are respectively disposed on the third surface and the fourth surface of the main body that are opposite to each other in the width direction, and contact the first inner electrode and the second inner electrode at the edge of the corresponding surface of the main body in the width direction. A first glass layer is disposed on the edge of the body formed by the first surface, the third surface, and the fourth surface, and extends to a portion of the first surface; A second glass layer is disposed on the edge of the body formed by the second surface, the third surface, and the fourth surface, and extends to a portion of the second surface; and The first external electrode and the second external electrode are respectively disposed on the first surface and the second surface of the main body, and cover the portions of the first glass layer and the second glass layer that extend to the first surface and the second surface of the main body, respectively.

22. The multilayer electronic assembly according to claim 21, wherein, Both the first glass layer and the second glass layer extend to a portion of both the third surface and the fourth surface.

23. The multilayer electronic assembly according to claim 21, wherein, Both the first glass layer and the second glass layer extend onto a portion of both the fifth and sixth surfaces of the body that are opposite each other in the thickness direction.

24. A multilayer electronic component, comprising: main body; A first inner electrode extends to a first surface of the body and is spaced apart in the length direction from a second surface of the body opposite to the first surface; The second inner electrode extends to the second surface of the body and is spaced apart from the first surface; A dielectric layer is disposed between adjacent first inner electrodes and second inner electrodes in the thickness direction; A first external electrode is disposed on the first surface and in contact with at least a portion of the first internal electrode extending to the first surface; A first glass layer is disposed on opposite edges in the width direction of the first surface and has a first portion extending onto a portion of the first surface, the first portion being disposed between the body and the first external electrode; The second outer electrode is disposed on the second surface and is in contact with at least a portion of the second inner electrode extending to the second surface; A second glass layer is disposed on opposite edges in the width direction of the second surface and has a second portion extending onto a portion of the second surface, the second portion being disposed between the body and the second external electrode.

25. The multilayer electronic assembly according to claim 24, further comprising: A first edge portion and a second edge portion are disposed on opposite surfaces in the width direction of the main body, such that opposite edges in the width direction of the first inner electrode contact the first edge portion and the second edge portion respectively, and opposite edges in the width direction of the second inner electrode contact the first edge portion and the second edge portion respectively.

26. The multilayer electronic component according to claim 25, wherein, The first glass layer extends to the portions of the first edge and the second edge that contact the opposite edges of the first surface of the body in the width direction, and the second glass layer extends to the portions of the first edge and the second edge that contact the opposite edges of the second surface of the body in the width direction.

27. The multilayer electronic assembly according to claim 24, wherein, The average value of the ratio Wa / Wb, which is the distance Wa between the first portions of the first glass layer along the width direction of the first surface to the width Wb of the first inner electrode, is in the range of 0.90 to 0.98.

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