Wafer bonding device and wafer fixing module

Abstract

The present invention provides a wafer bonding apparatus and a wafer fixing module, comprising: a frame; a first fixing module formed on a part of the frame and fixing a first wafer; and a second fixing module for fixing the second wafer by means of bonding the second wafer to the first wafer, and formed in a manner corresponding to the first fixing module; the first fixing module is formed to be spaced apart from the frame as a whole, and can be supported on the frame in a multi-point support manner.

Description

Technical Field

[0001] This invention relates to wafer bonding apparatus and wafer fixing module, and more specifically to wafer bonding apparatus and wafer fixing module capable of preventing deformation of adjacent structures such as frames from propagating toward the wafer. Background Technology

[0002] Semiconductor manufacturing processes are processes used to manufacture semiconductor devices on a substrate (such as a wafer), and may include processes such as exposure, deposition, etching, ion implantation, and cleaning.

[0003] In order to carry out each manufacturing process, semiconductor manufacturing equipment is installed in the cleanroom of the semiconductor manufacturing plant to carry out each process, and the substrates that are put into the semiconductor manufacturing equipment can be processed.

[0004] Furthermore, wafer-to-wafer (W2W) bonding processes are being developed to produce semiconductor products with multiple substrates stacked together, such as high-bandwidth memory (HBM). Such existing wafer bonding processes involve joining multiple wafers together, and may include processes such as aligning multiple wafers and bonding multiple wafers together. Summary of the Invention

[0005] The problem to be solved However, existing wafer bonding devices use an upper chuck that is bolted to a frame structure such as an upper stage to fix the upper wafer. This has many problems, such as the frame sagging due to its own weight, which causes the upper chuck in contact with the frame surface to also be affected by the change, resulting in twisting deformation of the upper chuck or minor dents or damage at the bolt area.

[0006] This invention addresses several problems, including those described above, and aims to provide a wafer bonding apparatus and wafer fixing module capable of preventing the propagation of deformation from adjacent structures such as frames. However, such problems are merely illustrative and do not limit the scope of the invention.

[0007] Problem-solving methods The wafer bonding apparatus based on the present invention and used to solve the above problems may include: a frame; a first fixing module formed on a part of the frame and fixing a first wafer; and a second fixing module for fixing the second wafer in such a way that the second wafer is bonded to the first wafer, and formed in a manner corresponding to the first fixing module; the first fixing module is formed to be spaced apart from the frame as a whole and supported on the frame in a multi-point support manner.

[0008] Additionally, a wafer fixing module based on the present invention and used to solve the above-mentioned problems may include: a planar retainer, formed to be spaced apart from the frame by a predetermined distance, having a planar surface formed on at least a portion thereof, and made of a material with strong deformation resistance to prevent deformation; a first connecting member, formed between the frame and a first portion of the planar retainer; a second connecting member, formed between the frame and a second portion of the planar retainer; a third connecting member, formed between the frame and a third portion of the planar retainer; and a first chuck portion, vacuum-adsorbed onto the planar retainer for fixing a first wafer.

[0009] Additionally, a wafer bonding apparatus based on the present invention and used to solve the above-mentioned problems may include: a frame; a first fixing module formed on a portion of the frame and fixing a first wafer; and a second fixing module fixed to the second wafer in such a way that the second wafer is bonded to the first wafer, formed in a manner corresponding to the first fixing module; the first fixing module is formed to be integrally spaced from the frame by a predetermined distance and supported on the frame in a multi-point support manner; the first fixing module includes: a planar retainer formed to be spaced from the frame by a predetermined distance and having a planar surface formed on at least a portion thereof, made of a material with strong deformation resistance to prevent deformation; a first connecting member formed between the frame and a first portion of the planar retainer; a second connecting member formed between the frame and a second portion of the planar retainer; and a third connecting member formed between the frame and a third portion of the planar retainer; the first... A first connecting member, a second connecting member, and a third connecting member are arranged at equal angles relative to the shape center or weight center of the planar retainer at a first angle. The first connecting member includes: a height-adjusting threaded portion that is threadedly engaged with the frame to achieve threaded advance and retraction; a ball joint portion that is connected to the height-adjusting threaded portion and formed into a spherical structure to achieve joint movement; a ball seat portion formed in the first part of the planar retainer to support the ball joint portion in a manner that allows the ball joint portion to perform joint movement; and a spherical outer shell formed to surround the ball joint portion to protect the ball joint portion and fixed to the planar retainer by fasteners. The spherical outer shell is threadedly engaged with the planar retainer by three fasteners that penetrate the planar retainer and are arranged at equal angles with the ball joint portion at a third angle. A spring is provided between the fasteners and the planar retainer to prevent gaps between the fasteners.

[0010] Invention Effects The various embodiments of the present invention configured as described above have the following effects: By employing a planar retainer fixed using a three-point support method with non-surface contact, deformation of adjacent structures such as the frame can be prevented from propagating towards the wafer. Furthermore, various joint movements and angle adjustments can be achieved using ball joints and actuators. By using springs or elastic members of various forms or positions that can achieve pre-stress between components, the robust fixing force between components and the precision, driveability, and durability of the device can be significantly improved. The planar retainer can vacuum-pressure hold the chuck, which not only prevents the propagation of deformation or allows for easy identification of deformation through changes in vacuum pressure, but also facilitates the replacement of chucks of various specifications, thereby maximizing productivity. The planar retainer can also replace the function of the chuck, thus reducing the number of components. Of course, these effects do not limit the scope of protection of this invention. Attached Figure Description

[0011] Figure 1 This is a schematic cross-sectional view illustrating a wafer bonding apparatus and a wafer fixing module according to some embodiments of the present invention; Figure 2 It is shown Figure 1 A perspective view of an example of the first fixing module of the wafer bonding apparatus shown; Figure 3 It is shown Figure 1 A top view of the first fixing module of the wafer bonding device shown; Figure 4 It is shown Figure 3 A top view of another example of the first fixed module shown; Figure 5 It is shown Figure 1 An exploded perspective view of the first connecting member of the first fixed module in its assembled state. Figure 6 It is shown Figure 1 A perspective view of yet another example of the first fixing module of the wafer bonding apparatus shown; Figure 7 It is shown Figure 1 A perspective view of yet another example of the first fixing module of the wafer bonding apparatus shown; Figure 8 It is shown Figure 7 Top view of the first fixed module shown; Figure 9 It is shown Figure 7 A perspective view of yet another example of the first fixing module of the wafer bonding apparatus shown; Figure 10 It is shown Figure 9 Top view of the first fixed module shown; Figure 11 It is shown Figure 2A bottom view of an example of the first fixing module of the wafer bonding apparatus shown; Figure 12 This is a schematic cross-sectional view illustrating a wafer bonding apparatus according to another partial embodiment of the present invention; Figure label: I. First axis direction; II. Second axis direction; III. Third axis direction; F frame; W1 is the first wafer; W2 is the second wafer; C1 First chuck section; C2 Second chuck section; 10 First fixing module; 10M wafer fixing module; 11. Planar cage; L. Spacing; V1 Vacuum line for chuck adsorption; V11 Radial branch line; V12 arc-shaped branch pipeline; V2 vacuum pipeline for wafer adsorption; J1 First connecting component; J11 Height adjusting threaded part; J12 ball joint; J13 ball seat; J14 spherical shell; B fastener; SP spring; J2 second connecting component; J3 is the third connecting member; J4 is the fourth connecting member; CP shape center; EC center elastic member; E1 is the first elastic member; E2 is the second elastic member; E3 Third elastic component; 20 Second fixing module; 21 Workbench; A1 First Actuator; A2 Second Actuator; 30 Control Unit; 31 Angle information input device; 32 Angle measuring sensor; 100 and 200 wafer bonding devices. Detailed Implementation

[0012] Hereinafter, some preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0013] The embodiments of this invention are intended to describe the invention more fully to those skilled in the art. The following embodiments can be modified into several different forms, and the scope of the invention is not limited to these embodiments. Rather, these embodiments are intended to make this disclosure more thorough and complete, fully conveying the spirit of the invention to those skilled in the art. Furthermore, for ease of explanation and clarity, the thickness or size of the layers in the drawings has been exaggerated.

[0014] The terminology used in this specification is for describing particular embodiments and is not intended to limit the invention. As used herein, the singular form may include the plural form unless the context clearly indicates otherwise. Furthermore, the word "comprising" as used herein specifically designates the presence of shapes, numbers, steps, operations, components, elements, and / or combinations thereof, but does not exclude the presence or addition of more than one other shape, number, operation, component, element, and / or combination thereof.

[0015] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings, which schematically illustrate preferred embodiments of the invention. In the drawings, variations in the illustrated shapes can be anticipated, for example, based on manufacturing techniques and / or tolerances. Therefore, embodiments of the inventive concept should not be construed as limited to the specific shapes illustrated herein, but should include, for example, shape variations resulting from manufacturing processes.

[0016] Figure 1 This is a schematic cross-sectional view of a wafer bonding apparatus 100 and a wafer fixing module 10M according to a partial embodiment of the present invention; Figure 2 It is shown Figure 1 A perspective view of an example of the first fixing module 10 of the wafer bonding apparatus 100 shown; Figure 3 It is shown Figure 1 A top view of the first fixing module 10 of the wafer bonding apparatus 100 shown.

[0017] like Figures 1 to 3 As shown, the wafer bonding apparatus 100 according to some embodiments of the present invention may generally include a frame F, a first fixing module 10 and a second fixing module 20.

[0018] The frame F may be, for example, a support structure having sufficient strength and durability to support the first fixed module 10 and the first chuck portion C1, or more specifically, a structure such as a platform formed on the upper side of the device.

[0019] However, such a frame F is not limited to the example shown in the figure. It can be formed on the lower side of the device or set on the side wall, etc. It can be set in a variety of locations, and a wide variety of structural forms are applicable.

[0020] The first fixing module 10 may be, for example, an auxiliary structure formed as part of the frame F and to which the first wafer W1 is fixed.

[0021] More specifically, the first fixing module 10 may be, for example, an upper fixing module formed on the upper side of the second fixing module 20.

[0022] However, such a first fixing module 10 is not limited to the example shown in the figure. In addition to the upper fixing module, it can also be applied to the lower fixing module or the side fixing module.

[0023] The first fixing module 10 may include, for example, a first chuck portion C1 for vacuum adsorption of the first wafer W1. Such a first chuck portion C1 can be vacuum adsorbed with the planar retainer 11 described below, or fixed by fasteners such as screws or bolts, or it can be fixed by magnetic or electrostatic force.

[0024] The first fixed module 10 can, for example, be formed to be spaced apart from the frame F as a whole, and can be supported on the frame F in a multi-point support manner.

[0025] More specifically, such as Figures 1 to 3 As shown, the first fixing module 10 may include, for example, a planar retainer 11, a first connecting member J1, a second connecting member J2, and a third connecting member J3.

[0026] The planar retainer 11 can be, for example, an auxiliary structure made of a rigid body or other material sufficient to resist deformation, thereby preventing deformation, and is formed to be spaced apart from the frame F by a predetermined distance L, and has a planar surface formed on at least a portion of it, thereby preventing the propagation of deformation of the frame F.

[0027] Such a planar retainer 11 is not limited to the structure shown in the figure, and can be formed into a shape with sufficient thickness and strong resistance to deformation to meet the required precision.

[0028] The first connecting member J1 may be a connecting member formed between the frame F and the first part of the planar retainer 11; the second connecting member J2 may be a connecting member formed between the frame F and the second part of the planar retainer 11; and the third connecting member J3 may be a connecting member formed between the frame F and the third part of the planar retainer 11.

[0029] like Figure 2 and Figure 3 As shown, the first connecting member J1, the second connecting member J2, and the third connecting member J3 can be arranged at an equal angle of a first angle K1 relative to the shape center CP or weight center of the planar retainer 11.

[0030] Here, in order to distribute the deformation force evenly, the first angle K1 can be 120 degrees, which divides the 360 ​​degrees into three equal parts. However, such a first angle K1 is not limited to 120 degrees, and can also be configured with a wide variety of angles.

[0031] Therefore, the planar retainer 11 can be formed to have strong resistance to deformation. At the same time, the planar retainer 11 can be supported on the frame F in a three-point support manner while being separated from the frame F which may deform as a whole. When the three connecting members J1, J2, and J3 that can perform joint movements are used, the deformation can be sufficiently alleviated or gently dealt with, thereby preventing the deformation from propagating in the direction of the first chuck portion C1 and the first wafer W1.

[0032] exist Figure 1 The figure appears to show two connecting members disposed on the left and right sides, but this is merely an illustrative representation to illustrate the technical concept of the invention. The invention is not limited to the example shown in the figure, and a wide variety of connecting members can be applied.

[0033] In addition, such as Figure 1 As shown, the second fixing module 20 can be, for example, a support body in which the second wafer W2 is fixed by means of bonding the second wafer W2 to the first wafer W1 and is formed in a shape corresponding to the first fixing module 10.

[0034] The second fixing module 20 may have a second chuck portion C2, which vacuum adsorbs the second wafer W2 and places it on the worktable 21.

[0035] Therefore, when using the first fixing module 10 and the second fixing module 20, the first wafer W1 can be fixed to the first fixing module 10 and the second wafer W2 can be fixed to the second fixing module 20. Then, pressure is applied to the first fixing module 10 and the second fixing module 20 to bond the first wafer W1 and the second wafer W2.

[0036] In addition, such as Figure 1 As shown, the wafer fixing module 10M according to a partial embodiment of the present invention may include: a planar retainer 11, formed to be spaced apart from the frame F by a predetermined distance L, having a planar surface formed on at least a portion thereof, and made of a material with strong resistance to deformation to prevent deformation; a first connecting member J1, formed between the frame F and a first portion of the planar retainer 11; a second connecting member J2, formed between the frame F and a second portion of the planar retainer 11; a third connecting member J3, formed between the frame F and a third portion of the planar retainer 11; and a first chuck portion C1, vacuum-adsorbed onto the planar retainer 11 for fixing a first wafer W1.

[0037] Here, the constituent units of the planar retainer 11, the first connecting member J1, the second connecting member J2, the third connecting member J3, and the first chuck portion C1, as well as their functions and roles, can be the same as the wafer bonding device 100 in the above-described embodiments of the present invention, and their detailed descriptions are omitted here.

[0038] Figure 4 It is shown Figure 3 A top view of another example of the first fixed module 10.

[0039] like Figure 4 As shown, in addition to the three connecting members J1, J2, and J3 mentioned above, the first fixing module 10 may also include a fourth connecting member J4 formed between the fourth part of the frame F and the planar retainer 11, that is, a total of four connecting members can be used.

[0040] Such first connecting member J1, second connecting member J2, third connecting member J3 and fourth connecting member J4 can be arranged at an equal angle of a second angle K2 relative to the shape center CP or weight center of the planar retainer 11.

[0041] Here, in order to distribute the deformation force evenly, the second angle K2 can be 90 degrees, which divides the 360 ​​degrees into four equal parts. However, such a second angle K2 is not limited to 90 degrees, and can also be configured with a wide variety of angles.

[0042] Therefore, the planar retainer 11 can be formed to have strong resistance to deformation. At the same time, the planar retainer 11 can be supported on the frame F at four points while being separated from the frame F which may deform. When the four connecting members J1, J2, J3, and J4 that can perform joint movements are used, the deformation can be adequately mitigated or handled gently, thereby preventing the deformation from propagating to the first chuck part C1.

[0043] The number of such connecting components is not limited to the number shown in the attached diagram, except for the three mentioned above (see reference). Figure 3 ) or four (refer to) Figure 4 In addition to the above, a wide variety of connecting components can be used, such as two, five, six, eight, etc.

[0044] Figure 5 It is shown Figure 1 An exploded perspective view of the first connecting member J1 of the first fixed module 10 in its assembled state.

[0045] like Figure 1 and Figure 5 As shown, the first connecting member J1 of the first fixing module 10 used in the wafer bonding apparatus 100 of some embodiments of the present invention may include a ball joint to realize the joint movement of the first part of the planar retainer 11.

[0046] Such a ball joint can be used for both the second connecting member J2 and the third connecting member J3; for example, it can be like... Figure 2Like the first connecting member J1 and the second connecting member J2, it is a spherical joint that moves in and out via a threaded mechanism, simultaneously achieving height adjustment and joint movement. It can also be like... Figure 2 Like the third connecting member J3, it is a spherical joint that only realizes joint movement.

[0047] However, such connecting components are not limited to the example shown in the attached figure. They can replace ball joints to set universal joints, and a wide variety of connecting components of various shapes are applicable.

[0048] like Figure 1 and Figure 5 As shown, the first connecting member J1 may be, for example, a spherical joint that simultaneously realizes threaded height adjustment and joint movement, including: a height-adjusting threaded portion J11, which is threadedly engaged with the frame F to achieve threaded advance and retraction by rotation using various screwdrivers, knobs, wrenches, etc.; a ball joint portion J12, which is connected to the height-adjusting threaded portion J11 and formed into a spherical structure to realize joint movement; a ball seat portion J13, which is formed on the first part of the planar retainer 11 to support the ball joint portion J12 in a manner that allows the ball joint portion J12 to perform joint movement; and a spherical outer shell J14, which is formed to surround the ball joint portion J12 to protect the ball joint portion J12, and is fixed to the planar retainer 11 by a fastener B.

[0049] Here, as Figure 5 and Figure 11 As shown, the spherical shell J14, for example, passes through the planar retainer 11 and is centered on the ball joint J12 at a third angle K3 (see reference). Figure 11 The three fasteners B, arranged at equal angles, are threaded into the flat retainer 11.

[0050] Here, in order to distribute the assembly pressure evenly, the third angle K3 can be 120 degrees, dividing the 360 ​​degrees into three equal parts. However, such a third angle K3 is not limited to 120 degrees and can be configured to a wide variety of angles.

[0051] In addition, such as Figure 5 As shown, the first connecting member J1 may, for example, have a spring SP further formed between the fixing member B and the planar retainer 11 to prevent gaps in the fixing member B by utilizing the preload of the spring.

[0052] Here, spring SP can be a helical spring wound into a spiral shape that allows the fixing member B to pass through, but in addition, a wide variety of elastic members of different shapes can be used.

[0053] Therefore, the three connecting components J1, J2, and J3 that are capable of joint movement, and the fasteners B that assemble these connecting components, also utilize a three-point fixing method. This not only effectively alleviates or gently addresses deformation and evenly distributes assembly pressure, but also utilizes the preload formed by the spring SP to ensure that the components always maintain a firm fit, thereby preventing loosening or unnecessary gaps caused by wear between components.

[0054] Figure 6 It is shown Figure 1 A perspective view of yet another embodiment of the first fixing module 10 of the wafer bonding apparatus 100 shown. like Figure 6 As shown, according to a partial embodiment of the wafer bonding apparatus 100, the first connecting member J1 of the first fixing module 10 includes a first actuator A1 capable of telescoping to tilt the planar retainer 11 at a first angle; the second connecting member J2 includes a second actuator A2 capable of telescoping to tilt the planar retainer 11 at a second angle.

[0055] Here, at least a portion of the first connecting member J1 and the second connecting member J2 includes a ball joint to achieve joint movement, and the first actuator A1 and the second actuator A2 can be applied not only to the motor, other hydraulic cylinders, pneumatic cylinders and other cylinders of the height adjustment thread of the rotating connecting member, but also to various retractable power sources or power transmission devices such as ball screws, linear motors, and electric actuators. Like this, such as Figure 6 As shown, the wafer bonding apparatus 100 according to some embodiments of the present invention may further include a control unit 30. After receiving a command signal from the angle information input device 31 or an angle measuring sensor 32 that measures the angle of the plane holder 11, the control unit 30 applies a first control signal to the first actuator A1 and applies a second control signal to the second actuator A2.

[0056] Therefore, by utilizing the control unit 30, even if the frame F deforms and the angle of the flat retainer 11 changes, it can be confirmed by the angle information input device 31 or the angle measuring sensor 32. Then, a first control signal is applied to the first actuator A1 and a second control signal is applied to the second actuator A2, thereby aligning and correcting the angle of the flat retainer 11 to the correct position.

[0057] Figure 7 It is shown Figure 1 A perspective view of yet another example of the first fixing module 10 of the wafer bonding apparatus 100. Figure 8 It is shown Figure 7 Top view of the first fixed module 10.

[0058] like Figure 7 and Figure 8 As shown, the first fixing module 10 of the wafer bonding apparatus 100 according to a partial embodiment of the present invention may further include a central elastic member EC, which is formed between the frame F and the shape center portion CP or weight center portion of the planar retainer 11, and applies an elastic restoring force to the planar retainer 11.

[0059] Here, the central elastic member EC can be a helical spring wound into a spiral shape, thereby applying an elastic restoring force to the frame F and the planar retainer 11 in the form of pre-stress such as compressive or tensile force. However, a wide variety of elastic members in different shapes can also be used.

[0060] Therefore, by utilizing the pre-pressure generated by the central elastic member EC, the components can always be kept firmly in contact, thereby preventing loosening or unnecessary gaps caused by component wear. Figure 9 It is shown Figure 7 A perspective view of yet another example of the first fixing module 10 of the wafer bonding apparatus 100 shown. Figure 10 It is shown Figure 9 The top view of the first fixed module 10 shown.

[0061] like Figure 9 and Figure 10 As shown, according to some embodiments of the present invention, the first fixing module 10 of the wafer bonding apparatus 100 may further include: a first elastic member E1, formed between the frame F and the fourth portion of the planar retainer 11 and applying an elastic restoring force to the planar retainer 11; a second elastic member E2, formed between the frame F and the fifth portion of the planar retainer 11 and applying an elastic restoring force to the planar retainer 11; and a third elastic member E3, formed between the frame F and the sixth portion of the planar retainer 11 and applying an elastic restoring force to the planar retainer 11.

[0062] More specifically, such as Figure 9 and Figure 10 As shown, the first elastic member E1 is disposed between the first connecting member J1 and the second connecting member J2; the second elastic member E2 is disposed between the second connecting member J2 and the third connecting member J3; the third elastic member E3 is disposed between the third connecting member J3 and the first connecting member J1; the first elastic member E1, the second elastic member E2 and the third elastic member E3 can be disposed at an angle such as a first angle K1 relative to the shape center portion CP or weight center portion of the planar retainer 11.

[0063] Here, in order to achieve a uniform distribution of prepressure, the first angle K1 can be 120 degrees, which divides 360 degrees into three equal parts. However, such a first angle K1 is not limited to 120 degrees and can be configured with a variety of different angles.

[0064] In addition, the first elastic member E1, the second elastic member E2 and the third elastic member E3 can be helical springs wound into a spiral shape so that elastic restoring force can be applied to the frame F and the planar retainer 11 in the form of pre-stress such as compressive force or tensile force. However, various forms of elastic members can also be used.

[0065] Therefore, by utilizing the pre-pressure generated by the first elastic member E1, the second elastic member E2, and the third elastic member E3, it can be ensured that the components always maintain a firm fit, thereby preventing loosening or unnecessary gaps due to component wear.

[0066] Figure 11 It is shown Figure 2 A bottom view of an example of the first fixing module 10 of the wafer bonding apparatus 100 shown.

[0067] like Figure 11 As shown, the lower surface of the planar holder 11 of the wafer bonding apparatus 100 according to a partial embodiment of the present invention may be formed with a vacuum line V1 for chuck adsorption in the form of a vacuum groove, so as to perform vacuum adsorption on the first chuck portion C1 on which the first wafer W1 is fixed.

[0068] Figure 11 As shown, the vacuum line V1 for chuck adsorption can, for example, be branched into a tree-like shape to apply vacuum pressure evenly, thereby preventing load concentration when the first chuck section C1 is vacuum adsorbed.

[0069] More specifically, such as Figure 11 As shown, the vacuum line V1 for chuck adsorption may include: a plurality of radial branch lines V11, which are formed radially with reference to the central part of the planar retainer 11; and an arc-shaped branch line V12, which branches off from the radial branch lines V11 and is formed in an arc shape.

[0070] Therefore, by using the vacuum line V1 for chuck adsorption, various sizes of first chuck parts C1 can be vacuum adsorbed without the need for bolt fixing, thus making it easy to replace chuck parts of various sizes. Furthermore, by using the radial branch lines V11 and the arc-shaped branch lines V12, the vacuum pressure is evenly distributed across the entire surface of the first chuck part C1, ensuring a safe and secure component fixing force.

[0071] However, the present invention may also fix the first chuck portion C1 to the flat retainer 11 without utilizing the vacuum pressure of the vacuum line V1 for chuck adsorption. Instead, the first chuck portion C1 may be fixed to the flat retainer 11 using fasteners such as bolts or screws, or the first chuck portion C1 may be fixed to the flat retainer 11 using magnetic force, electrostatic force, etc. In other words, various different assembly methods are applicable.

[0072] Figure 12 This is a schematic cross-sectional view of a wafer bonding apparatus 200 according to another embodiment of the present invention.

[0073] like Figure 12 As shown, according to another embodiment of the wafer bonding apparatus 200, a wafer adsorption vacuum line V2 for vacuum adsorption of the first wafer W1 can be formed on the planar holder 11 to replace the function of the first chuck portion C1.

[0074] Therefore, as Figure 12 As shown, the planar holder 11 can be used, for example, to conveniently vacuum-adsorb wafers of different sizes using a wafer adsorption vacuum line V2. Therefore, according to the present invention, by employing a planar retainer 11 fixed in a non-surface contact manner with three-point support or other point support methods, deformation of adjacent structures such as the frame F can be prevented from propagating to the chuck portion. Furthermore, various forms of joint movement and angle adjustment can be achieved using the first connecting member J1, the second connecting member J2, the third connecting member J3, and actuators A1 and A2. By using springs or elastic members of various forms or positions that can achieve pre-pressure between components, the strong fixing force between components and the precision, driveability, and durability of the device can be significantly improved. The planar retainer can adsorb the chuck portion through vacuum pressure, which not only prevents the propagation of deformation or allows for easy identification of deformation through changes in vacuum pressure, but also facilitates the replacement of chuck portions of various specifications, thereby maximizing productivity. The planar retainer can also replace the function of the chuck portion, thereby reducing the number of components.

[0075] The embodiments shown in the figures are described with reference to the present invention, but are merely examples. It is understood that those skilled in the art can make various modifications and obtain other equivalent embodiments. Therefore, the true scope of protection of the present invention should be determined based on the technical concept of the appended claims.

Claims

1. A wafer bonding apparatus, characterized by comprising: include: frame; A first fixing module, formed in part of the frame, is used to fix the first wafer; as well as The second fixing module is formed in a manner corresponding to the first fixing module to fix the second wafer by bonding the second wafer to the first wafer; The first fixing module is formed to be spaced apart from the frame as a whole, and is supported by the frame in a multi-point support manner.

2. The wafer bonding apparatus according to claim 1, characterized in that, The first fixed module includes: A planar retainer is formed to be spaced apart from the frame by a predetermined distance and has a planar surface formed on at least a portion thereof, and is made of a material with strong resistance to deformation to prevent deformation; A first connecting member is formed between the frame and a first portion of the planar retainer; A second connecting member is formed between the frame and the second portion of the planar retainer; and A third connecting member is formed between the frame and the third part of the planar retainer.

3. The wafer bonding apparatus according to claim 2, characterized in that, The first connecting member, the second connecting member, and the third connecting member are arranged at equal angles with respect to the shape center or weight center of the planar cage at a first angle.

4. The wafer bonding apparatus according to claim 2, characterized in that, The first fixing module further includes a fourth connecting member formed between the frame and the fourth portion of the planar retainer; The first connecting member, the second connecting member, the third connecting member, and the fourth connecting member are arranged at equal angles relative to the shape center or weight center of the planar cage at a second angle.

5. The wafer bonding apparatus according to claim 2, characterized in that, The first connecting member includes a ball joint to enable the first portion of the planar retainer to articulate.

6. The wafer bonding apparatus according to claim 5, characterized in that, The first connecting member includes: The height-adjustable threaded section engages with the frame thread to achieve threaded advance and retraction; The ball joint is connected to the height-adjustable threaded part and is formed into a spherical shape to realize joint movement; A ball seat portion, formed in the first portion of the planar retainer, supports the ball joint portion in a manner that allows the ball joint portion to perform joint movement; and A spherical outer shell is formed to surround the ball joint to protect it, and is fixed to the planar retainer by a fastener.

7. The wafer bonding apparatus according to claim 6, characterized in that, The spherical shell is threadedly engaged with the planar retainer by three fasteners that pass through the planar retainer and are arranged at equal angles to the ball joint at a third angle.

8. The wafer bonding apparatus according to claim 7, characterized in that, A spring is provided between the fixing member and the flat retainer to prevent the fixing member from creating a gap.

9. The wafer bonding apparatus according to claim 5, characterized in that, The second connecting member and the third connecting member each include a ball joint.

10. The wafer bonding apparatus according to claim 5, characterized in that, The first connecting member includes a first actuator capable of telescoping to tilt the planar retainer at a first angle; The second connecting member includes a second actuator capable of telescoping to tilt the planar retainer at a second angle; It also includes a control unit, which, after receiving a command signal from an angle information input device or an angle signal from an angle measuring sensor, applies a first control signal to the first actuator and applies a second control signal to the second actuator.

11. The wafer bonding apparatus according to claim 2, characterized in that, The first fixing module further includes a central elastic member formed between the shape center or weight center of the frame and the planar retainer, which applies an elastic restoring force to the planar retainer.

12. The wafer bonding apparatus according to claim 2, characterized in that, The first fixing module also includes: A first elastic member is formed between the frame and the fourth part of the planar retainer, and applies an elastic restoring force to the planar retainer; A second elastic member, formed between the frame and the fifth portion of the planar retainer, applies an elastic restoring force to the planar retainer; and A third elastic member is formed between the frame and the sixth part of the planar retainer, applying an elastic restoring force to the planar retainer.

13. The wafer bonding apparatus according to claim 12, characterized in that, The first elastic member is disposed between the first connecting member and the second connecting member; The second elastic member is disposed between the second connecting member and the third connecting member; The third elastic member is disposed between the third connecting member and the first connecting member; The first elastic member, the second elastic member, and the third elastic member are arranged at equal angles with respect to the shape center or weight center of the planar cage at a first angle.

14. The wafer bonding apparatus according to claim 2, characterized in that, A vacuum line for chuck adsorption is formed on the planar holder for vacuum adsorption of the first chuck portion to which the first wafer is fixed.

15. The wafer bonding apparatus according to claim 14, characterized in that, The vacuum pipeline for chuck adsorption is branched into a tree-like shape to apply vacuum pressure evenly, thereby preventing load concentration.

16. The wafer bonding apparatus according to claim 15, characterized in that, The vacuum line for chuck adsorption includes: Multiple radially branched pipelines are formed radially with the center of the planar retainer as a reference; and Arc-shaped branch lines branch off from the radial branch lines, forming an overall arc shape.

17. The wafer bonding apparatus according to claim 14, characterized in that, In order to replace the function of the first chuck, the planar holder is formed with a wafer adsorption vacuum line that can adsorb the first wafer.

18. The wafer bonding apparatus according to claim 1, characterized in that, The first fixing module is an upper fixing module formed above the second fixing module.

19. A wafer holding module, characterized by include: A planar retainer is formed to be spaced apart from the frame by a predetermined distance, and at least a portion of it has a planar surface, and is made of a material with strong resistance to deformation to prevent deformation; A first connecting member is formed between the frame and a first portion of the planar retainer; A second connecting member is formed between the frame and the second part of the planar retainer; A third connecting member is formed between the frame and the third part of the planar retainer; as well as The first chuck portion is vacuum-adsorbed onto the planar holder to fix the first wafer.

20. A wafer bonding apparatus, comprising: include: frame; A first fixing module, formed in part of the frame, is used to fix the first wafer; as well as The second fixing module is formed in a manner corresponding to the first fixing module to fix the second wafer by bonding the second wafer to the first wafer; The first fixing module is formed to be spaced apart from the frame by a predetermined distance and is supported on the frame by multiple points. The first fixed module includes: A planar retainer is formed to be spaced apart from the frame by a predetermined distance and has a planar surface formed on at least a portion thereof, and is made of a material with strong resistance to deformation to prevent deformation; A first connecting member is formed between the frame and a first portion of the planar retainer; A second connecting member is formed between the frame and the second portion of the planar retainer; and A third connecting member is formed between the frame and the third part of the planar retainer; The first connecting member, the second connecting member, and the third connecting member are arranged at equal angles to the shape center or weight center of the planar cage at a first angle. The first connecting member includes: The height-adjustable threaded section engages with the frame thread to achieve threaded advance and retraction; The ball joint is connected to the height-adjustable threaded part and is formed into a spherical shape to realize joint movement; A ball seat portion, formed in the first portion of the planar retainer, supports the ball joint portion in a manner that allows the ball joint portion to perform joint movement; and A spherical outer shell is formed to surround the ball joint portion to protect the ball joint portion and is fixed to the planar retainer by a fastener; The spherical shell is threadedly engaged with the planar retainer by three fasteners that pass through the planar retainer and are arranged at equal angles around the ball joint at a third angle; A spring is provided between the fixing member and the flat retainer to prevent the fixing member from creating a gap.

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