Multilayer electronic component

Abstract

This disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body comprising a dielectric layer and inner electrodes alternately arranged with respect to the dielectric layer; and an outer electrode disposed on the body, comprising an electrode layer containing a conductive metal and a conductive resin layer disposed on the electrode layer. The outer electrode includes a connecting portion disposed on one surface of the body and a strip portion disposed on another surface of the body. The conductive resin layer comprises: a first conductive resin layer disposed in the strip portion and comprising Cu and a first resin; and a second conductive resin layer disposed in the connecting portion and comprising an intermetallic compound and a second resin.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2025-0003021, filed on January 8, 2025, with the Korean Intellectual Property Office, and Korean Patent Application No. 10-2025-0038935, filed on March 26, 2025, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are chip capacitors mounted on printed circuit boards of various types of electronic products, such as image display devices (including liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, cellular phones, on-board chargers (OBCs) for electric vehicles, or DC-DC converters, to allow them to be charged and discharged.

[0004] With the latest advancements in miniaturization and higher capacitance of multilayer ceramic capacitors (MLCCs), ensuring high reliability of MLCCs has become increasingly important.

[0005] To improve the reliability of MLCCs, a method has been proposed to apply a conductive resin layer to the external electrode to absorb mechanical and thermal stresses. The conductive resin layer can be formed with a structure comprising copper (Cu) and a matrix resin, or with a structure comprising an intermetallic compound (IMC) and a matrix resin.

[0006] Furthermore, the matrix resin included in the conductive resin layer improves the flexural strength of MLCCs. However, as a non-conductive material, the matrix resin may increase the equivalent series resistance (ESR) of MLCCs. Therefore, intermetallic compounds (IMCs) have been used as the conductive metal material in the conductive resin layer to reduce the ESR of MLCCs. However, since IMCs tend to form fine bridges between metal particles, they may be less effective in improving the flexural strength of MLCCs compared to using Cu particles as the conductive metal in the conductive resin layer.

[0007] Therefore, even when applying a conductive resin layer to the external electrode to improve the flexural strength of MLCCs, it is necessary to improve the structure of the external electrode to suppress the increase of ESR. Summary of the Invention

[0008] One aspect of this disclosure is to suppress the increase in equivalent series resistance (ESR) that may occur when a conductive resin layer is applied to an external electrode.

[0009] However, the purpose of this disclosure is not limited to the foregoing, and the purpose of this disclosure will be more readily understood when describing specific embodiments thereof.

[0010] According to one aspect of this disclosure, a multilayer electronic component includes: a body comprising a dielectric layer and inner electrodes alternately arranged with respect to the dielectric layer in a first direction; the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; and an outer electrode disposed on at least one of the third surface and the fourth surface, and comprising an electrode layer comprising a conductive metal and a conductive resin layer disposed on the electrode layer. The outer electrode includes a connecting portion disposed on at least one of the third surface and the fourth surface and a strip portion disposed on the first surface and / or the second surface. The conductive resin layer includes: a first conductive resin layer disposed in the strip portion and comprising Cu and a first resin; and a second conductive resin layer disposed in the connecting portion and comprising an intermetallic compound and a second resin.

[0011] According to one aspect of this disclosure, a multilayer electronic component includes: a body comprising a dielectric layer and inner electrodes alternately arranged with respect to the dielectric layer in a first direction; the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface, and the fourth surface and opposite to each other in a third direction; and an outer electrode disposed on at least one of the third surface and the fourth surface, and comprising an electrode layer comprising a conductive metal and a conductive resin layer disposed on the electrode layer. The outer electrode includes a connecting portion disposed on at least one of the third surface and the fourth surface and a strip portion disposed on the first surface and / or the second surface. An intermetallic compound and Cu are dispersed in the resin of the conductive resin layer. The content of the intermetallic compound relative to the resin in the connecting portion is greater than the content of the intermetallic compound relative to the resin in the strip portion, and the content of Cu relative to the resin in the connecting portion is less than the content of Cu relative to the resin in the strip portion. Attached Figure Description

[0012] The above and other aspects, features, and advantages of this disclosure will be more clearly understood from the following specific embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1This is a schematic perspective view of a multilayer electronic assembly according to one embodiment and another embodiment of the present disclosure; Figure 2 It is a multilayer electronic assembly according to an embodiment of the present disclosure along Figure 1 A cross-sectional view taken from line I-I'; Figure 3 It is along another embodiment of the multilayer electronic assembly according to this disclosure. Figure 1 A cross-sectional view taken from line I-I'; Figure 4 It is along Figure 1 A cross-sectional view taken from line II-II'; Figure 5 This is a schematic exploded perspective view of the main body according to an embodiment; Figure 6 yes Figure 2 A magnified view of the PA region; Figure 7 yes Figure 2 A magnified view of the PB region; and Figure 8 This is a graph showing the results of measuring the equivalent series resistance (ESR) in a multilayer electronic assembly according to the comparison example and the example. Detailed Implementation

[0013] In the following, embodiments of the inventive concept will be described in detail with reference to the accompanying drawings. However, the inventive concept can be exemplified in many different forms and should not be construed as being limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. In the drawings, the shape and size of elements may be exaggerated for clarity, and the same reference numerals will always be used to denote the same or similar elements.

[0014] To clarify this disclosure, parts irrelevant to the description have been omitted, and the same reference numerals denote the same elements throughout the specification. Furthermore, for clarity, the thickness of layers, films, panels, regions, etc., has been exaggerated in the drawings. Additionally, even if the same reference numerals are shown in different drawings, they denote the same elements. Throughout the specification, unless explicitly stated otherwise, the words "comprising" and variations thereof (such as "including" or "containing") are to be understood as implying inclusion of the stated elements but not exclusion of any other elements.

[0015] In the accompanying drawings, the X direction can refer to a first direction or the thickness direction, the Y direction can refer to a second direction or the length direction, and the Z direction can refer to a third direction or the width direction. The stacking direction of the internal electrodes or dielectric layers can be the thickness direction or the width direction.

[0016] Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to one embodiment and another embodiment of the present disclosure.

[0017] Figure 2 It is a multilayer electronic assembly according to an embodiment of the present disclosure along Figure 1 The cross-sectional view taken from line I-I'.

[0018] Figure 3 It is along another embodiment of the multilayer electronic assembly according to this disclosure. Figure 1 The cross-sectional view taken from line I-I'.

[0019] Figure 4 It is along Figure 1 The cross-sectional view taken from line II-II'.

[0020] Figure 5 This is a schematic exploded perspective view of the main body according to an embodiment.

[0021] Figure 6 yes Figure 2 A magnified view of the PA region.

[0022] Figure 7 yes Figure 2 A magnified view of the PB region.

[0023] In the following text, reference will be made to Figures 1 to 7 A detailed description is provided of a multilayer electronic component 100 according to an embodiment of the present disclosure, a multilayer electronic component 100' according to another embodiment of the present disclosure, and various variations thereof.

[0024] The difference between the multilayer electronic assembly 100 according to an embodiment of the present disclosure and the multilayer electronic assembly 100' according to another embodiment of the present disclosure may lie in the structure of the external electrodes 130, 140, 130', and 140'. Other components besides the external electrodes 130, 140, 130', and 140' may be substantially the same; therefore, redundant descriptions may be omitted.

[0025] A multilayer electronic component 100 according to an embodiment of the present disclosure may include: a body 110 including a dielectric layer 111 and inner electrodes 121 and 122 alternately arranged with the dielectric layer 111 in a first direction, and including a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and opposite to each other in a third direction; and outer electrodes 130 and 140, the outer electrode 130 including a disposed The third surface 3 includes an electrode layer 131 with conductive metal and a conductive resin layer 132 disposed on the electrode layer 131. The outer electrode 140 includes an electrode layer 141 with conductive metal disposed on the fourth surface 4 and a conductive resin layer 142 disposed on the electrode layer 141. In the outer electrodes 130 and 140, when the area disposed on the third surface 3 and / or the fourth surface 4 is the connecting portion A and the area disposed on the first surface 1 and / or the second surface 2 is the strip portion B, the conductive resin layers 132 and 142 may include: first conductive resin layers 132a and 142a, disposed on the strip portion B and including Cu 21 and first resin 22; and second conductive resin layers 132b and 142b, disposed on the connecting portion A and including intermetallic compound 31 and second resin 32. In this disclosure, the first conductive resin layer being disposed on or in the strip portion of the outer electrode indicates that the first conductive resin layer constitutes part of the strip portion of the outer electrode, and the second conductive resin layer being disposed on or in the connection portion of the outer electrode indicates that the second conductive resin layer constitutes part of the connection portion of the outer electrode.

[0026] Reference Figure 2 The main body 110 may include a dielectric layer 111 and internal electrodes 121 and 122 alternately disposed with the dielectric layer 111 in a first direction.

[0027] Although there are no particular restrictions on the specific shape of the main body 110, such as Figures 1 to 5 As shown, the body 110 can be formed in a hexahedral shape or a similar shape. Due to the shrinkage of the ceramic powder included in the body 110 during the sintering process, the body 110 may not have a perfectly straight hexahedral shape, but may have a generally hexahedral shape.

[0028] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4 and are opposite to each other in a third direction.

[0029] The plurality of dielectric layers 111 forming the body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated such that it may not be easy to identify the boundary between adjacent dielectric layers 111 without using a scanning electron microscope (SEM).

[0030] According to an embodiment of the present disclosure, there is no particular limitation on the raw material for forming the dielectric layer 111 as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a calcium zirconate-based material, or a strontium titanate-based material may be used.

[0031] When a barium titanate-based material is used as the raw material for forming the dielectric layer 111, the dielectric layer 111 may include a BaTiO3-based ceramic material. Examples of the BaTiO3-based ceramic material include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) obtained by partially solid-soluting Ca (calcium), Zr (zirconium), etc. in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1). In addition, when a calcium zirconate-based material is used as the raw material for forming the dielectric layer 111, the dielectric layer 111 may include a CaZrO3-based ceramic material.

[0032] In addition, the dielectric layer may include a BaTiO3-based ceramic material and a CaZrO3-based ceramic material alone or in combination.

[0033] In addition, for the purpose of the present disclosure, the dielectric layer 111 may include various ceramic additives such as an organic solvent, a binder, a dispersant, etc.

[0034] In addition, since the dielectric layer 111 is in a sintered state, the ceramic powder used as the material for the dielectric layer 111 may form dielectric grains and grain boundaries.

[0035] In addition, the average thickness td of the dielectric layer 111 may not be particularly limited. For example, in order to achieve miniaturization of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 may be less than or equal to 0.35 μm. In order to ensure the reliability of the multilayer electronic component 100 in a high-temperature and high-voltage environment, the average thickness td of the dielectric layer 111 may be greater than or equal to 1 μm.

[0036] In addition, the average thickness td of the dielectric layer 111 may refer to the average thickness of one or more of the plurality of dielectric layers 111.

[0037] The average thickness td of dielectric layer 111 can be obtained by: based on a dielectric layer adjacent to the point where the center line of the capacitor formation in the length direction intersects with the center line of the capacitor formation in the thickness direction from an image obtained by scanning the cross section of the body 110 in the first and second directions using a scanning electron microscope (SEM) to the central portion of the body 110 in the third direction, dividing the dielectric layer in the length direction into four equal parts, measuring the thickness at 1 / 4, 2 / 4, and 3 / 4 points of the dielectric layer, and averaging the measured thicknesses. The average thickness of the dielectric layer can be further generalized by: extending the measurement based on the dielectric layer adjacent to the point where the center line of the capacitor formation in the length direction intersects with the center line of the capacitor formation in the thickness direction to two dielectric layers equidistant from each of the dielectric layers located above and below the dielectric layer.

[0038] Reference Figure 2 The inner electrodes 121 and 122 may be arranged alternately in the first direction and the dielectric layer 111 is between them.

[0039] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 may be alternately arranged facing each other with a dielectric layer 111 between them, and the first inner electrode 121 and the second inner electrode 122 may be connected to the third surface 3 and the fourth surface 4 of the body 110, respectively. Specifically, one end of the first inner electrode 121 may be connected to the third surface 3, and one end of the second inner electrode 122 may be connected to the fourth surface 4. That is, in an embodiment, the inner electrodes 121 and 122 may contact either the third surface 3 or the fourth surface 4.

[0040] like Figure 2 As shown, the first inner electrode 121 may be spaced apart from the fourth surface 4 and exposed through (or extend from) the third surface 3, while the second inner electrode 122 may be spaced apart from the third surface 3 and exposed through (or extend from) the fourth surface 4. The first outer electrode 130 may be disposed on the third surface 3 of the body and connected to the first inner electrode 121, and the second outer electrode 140 may be disposed on the fourth surface 4 of the body and connected to the second inner electrode 122.

[0041] That is, the first inner electrode 121 can be connected to the first outer electrode 130 but not to the second outer electrode 140, and the second inner electrode 122 can be connected to the second outer electrode 140 but not to the first outer electrode 130. Therefore, the first inner electrode 121 can be formed at a predetermined distance from the fourth surface 4, and the second inner electrode 122 can be formed at a predetermined distance from the third surface 3. Here, the first inner electrode 121 and the second inner electrode 122 can be electrically separated from each other by a dielectric layer 111 disposed between them.

[0042] The conductive metal included in the inner electrodes 121 and 122 can be a metallic element with excellent conductivity. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys.

[0043] Alternatively, the internal electrodes 121 and 122 can be formed by printing a conductive paste, including one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, onto a ceramic green sheet. The printing method for the conductive paste for the internal electrodes can be screen printing or gravure printing, but this disclosure is not limited thereto.

[0044] Furthermore, the average thickness te of the inner electrodes 121 and 122 is not particularly limited. For example, to achieve miniaturization of the multilayer electronic component 100, the average thickness te of the inner electrodes 121 and 122 can be less than or equal to 0.35 μm. To ensure the reliability of the multilayer electronic component 100 in high-temperature and high-voltage environments, the average thickness te of the inner electrodes 121 and 122 can be greater than or equal to 1 μm.

[0045] Furthermore, the average thickness te of the inner electrodes 121 and 122 may refer to the average thickness of one or more of the plurality of inner electrodes 121 and 122.

[0046] The average thickness te of the inner electrodes 121 and 122 can be obtained by: based on an image obtained by scanning a cross-section of the body 110, polished to the central portion of the body 110 in the third direction, in a first and second direction, from an inner electrode adjacent to the point where the center line of the capacitor forming portion in the length direction intersects with the center line of the capacitor forming portion in the thickness direction, the inner electrode is divided into four equal parts in the length direction, and the thickness at 1 / 4, 2 / 4, and 3 / 4 points of the inner electrode is measured, and the measured thicknesses are averaged. The average thickness of the inner electrodes can be further generalized by: extending the measurement based on the inner electrode adjacent to the point where the center line of the capacitor forming portion in the length direction intersects with the center line of the capacitor forming portion in the thickness direction to two inner electrodes equidistant from each of the inner electrodes located above and below the inner electrode.

[0047] Reference Figure 2 The main body 110 may include a capacitor forming portion Ac and cover portions 112 and 113. The capacitor forming portion Ac forms a capacitor by including an alternately arranged first inner electrode 121 and a second inner electrode 122 with a dielectric layer 111 located between them. The cover portions 112 and 113 are disposed on one surface and another surface of the capacitor forming portion Ac in a first direction.

[0048] The capacitor forming section Ac contributes to the capacitance of the multilayer electronic assembly. For example... Figure 5 As shown, the capacitor forming section Ac can be formed by repeatedly stacking a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 and placing a dielectric layer 111 between the first internal electrodes 121 and the second internal electrodes 122.

[0049] Reference Figure 5 The covers 112 and 113 can be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitor forming portion Ac in the thickness direction, respectively, and are mainly used to prevent damage to the inner electrode due to physical stress and / or chemical stress.

[0050] Cover portions 112 and 113 do not include internal electrodes and may include the same material as the dielectric layer 111. That is, cover portions 112 and 113 may include ceramic materials, such as barium titanate (BaTiO3) based ceramic materials.

[0051] Furthermore, the average thickness tc of the covers 112 and 113 is not particularly limited. However, in order to promote the miniaturization and high capacitance of multilayer electronic components, the average thickness tc of the covers 112 and 113 may be less than or equal to 15 μm.

[0052] The average thickness of the covers 112 and 113 may refer to the average dimension in the first direction, and may be a value obtained by averaging the dimensions of the covers in the first direction measured at five equidistant points above or below the capacitor forming portion Ac.

[0053] In an embodiment, edge portions 114 and 115 may be disposed on one surface and another surface of the capacitor forming portion Ac in the third direction.

[0054] Reference Figure 4 Edge portions 114 and 115 may include an edge portion 114 disposed between the capacitor forming portion Ac and the fifth surface 5 of the body 110 and an edge portion 115 disposed between the capacitor forming portion Ac and the sixth surface 6. That is, edge portions 114 and 115 may be disposed on two side surfaces of the capacitor forming portion Ac in the third direction (width direction).

[0055] In addition, such as Figure 4 As shown, based on the cross-section of the body 110 in the first direction and the third direction, the edges 114 and 115 may refer to the regions between the two ends of the first inner electrode 121 and the two ends of the second inner electrode 122 and the outer surface of the body 110.

[0056] Edges 114 and 115 are primarily used to prevent damage to the internal electrodes due to physical and / or chemical stress.

[0057] Edges 114 and 115 can be formed by applying conductive paste to the area of ​​the ceramic green sheet excluding the area where the edge is to be formed, thereby forming an internal electrode.

[0058] In addition, in order to suppress the step difference caused by the inner electrodes 121 and 122, after stacking the ceramic green sheet, a cutting can be performed to expose the inner electrodes on both sides of the capacitor forming portion Ac in the third direction (width direction). Then, a single dielectric layer or two or more dielectric layers can be stacked on both sides of the capacitor forming portion Ac in the third direction (width direction) to form the edge portions 114 and 115.

[0059] The average width wm of the edges 114 and 115 is not particularly limited. However, in order to facilitate the miniaturization and high capacitance of multilayer electronic components, the average width wm of the edges 114 and 115 may be less than or equal to 15 μm.

[0060] The average width wm of the edges 114 and 115 can refer to the average dimension of the edges 114 and 115 in the third direction, and can be obtained by averaging the dimensions of the edges in the third direction measured at five equidistant points on the side surface of the capacitor forming part Ac.

[0061] Reference Figure 1 External electrodes 130 and 140 are arranged on the main body 110.

[0062] Reference Figure 1 and Figure 2 The external electrodes 130 and 140 may include: a first external electrode 130 disposed on the body 110 and connected to the first internal electrode 121; and a second external electrode 140 disposed on the body 110, connected to the second internal electrode 122, and spaced apart from the first external electrode 130.

[0063] Here, the direction along which the first external electrode 130 and the second external electrode 140 are spaced apart from each other can be considered as the second direction.

[0064] In this disclosure, a multilayer electronic assembly 100 is described having a structure with two external electrodes 130 and 140, but the number and shape of the external electrodes may vary depending on the shape of the internal electrodes and / or other purposes.

[0065] External electrodes 130 and 140 may be disposed on the third surface 3 and the fourth surface 4, and may include electrode layers 131 and 141 containing conductive metal.

[0066] Electrode layers 131 and 141 may contact a portion of inner electrodes 121 and 122 to ensure electrical connectivity between outer electrodes 130 and 140 and inner electrodes 121 and 122.

[0067] Reference Figure 6 and Figure 7 Electrode layers 131 and 141 may be sintered electrodes comprising conductive metal 11 and glass 12, or although not in... Figure 6 and Figure 7 As shown, electrode layers 131 and 141 may be coatings that include conductive metal 11 but not glass 12. That is, electrode layers 131 and 141 may include conductive metal 11, and in some cases may also include glass 12.

[0068] Electrode layers 131 and 141 can be formed by immersing the body 110 in a conductive paste comprising conductive metal and glass, transferring a sheet comprising conductive metal onto the body 110, or electroless plating onto the body 110. However, this disclosure is not limited thereto.

[0069] The conductive metal included in electrode layers 131 and 141 can be any material with excellent conductivity, and there are no particular limitations. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), and their alloys.

[0070] Reference Figure 2Conductive resin layers 132 and 142 may be disposed on electrode layers 131 and 141. Conductive resin layers 132 and 142 may include metal materials and resin, and may have a structure in which the metal material is dispersed within the resin.

[0071] Since the conductive resin layers 132 and 142 comprise metallic materials (e.g., Cu 21 and intermetallic compound 31), they can be electrically connected to the electrode layers 131 and 141. Furthermore, since the conductive resin layers 132 and 142 comprise resins 22 and 32, the flexural strength of the multilayer electronic assembly 100 can be improved.

[0072] Furthermore, the resins 22 and 32 included in the conductive resin layers 132 and 142 may be non-conductive materials or their conductivity may be lower than that of metallic materials, which may increase the equivalent series resistance (ESR) of the multilayer electronic component 100. Therefore, it has been attempted to form the entire conductive resin layers 132 and 142 as IMC resin layers comprising intermetallic compounds (IMCs) and resin. However, since IMCs tend to form fine bridges between metal particles, they may be less effective in improving the flexural strength of the multilayer electronic component 100 compared to the case where the entire conductive resin layers 132 and 142 are formed as Cu resin layers comprising copper and resin.

[0073] Therefore, in the embodiments of this disclosure, the IMC resin layer which is beneficial to reducing the equivalent series resistance (ESR) of the multilayer electronic component 100 and the Cu resin layer which is beneficial to improving the bending strength are organically arranged to simultaneously achieve both the effect of reducing the equivalent series resistance (ESR) of the multilayer electronic component 100 and the effect of improving the bending strength of the multilayer electronic component 100.

[0074] According to embodiments of the present disclosure, the external electrodes 130 and 140 can be divided into several regions based on their arrangement on the body 110. Specifically, refer to... Figure 2 The external electrodes 130 and 140 can be divided into a connecting portion A disposed on the third surface 3 and / or the fourth surface 4, and a strip portion B disposed on the first surface 1 and / or the second surface 2.

[0075] The connecting portion A may be a region having a portion directly connected to the internal electrode and may have low resistance, thus helping to reduce the ESR of the multilayer electronic assembly 100. The strip portion B is provided on the first surface 1 and / or the second surface 2 (or the fifth surface 5 and / or the sixth surface 6) of the body 110 and has excellent mechanical strength or ductility, thus helping to improve the bending strength of the multilayer electronic assembly 100.

[0076] According to embodiments of the present disclosure, conductive resin layers 132 and 142 may include: first conductive resin layers 132a and 142a, disposed on the strip portion B and including Cu 21 and first resin 22; and second conductive resin layers 132b and 142b, disposed on the connecting portion A and including intermetallic compound 31 and second resin 32.

[0077] The first conductive resin layers 132a and 142a include Cu 21 and a first resin 22, and therefore have better ductility and mechanical strength than the second conductive resin layers 132b and 142b, which include an intermetallic compound 31 and a second resin 32. The second conductive resin layers 132b and 142b include a second resin 32 and an intermetallic compound 31 that has a high tendency to form bridges between particles, and therefore have lower resistance than the first conductive resin layers 132a and 142a.

[0078] According to embodiments of the present disclosure, first conductive resin layers 132a and 142a, having excellent mechanical strength and ductility, are formed on the strip portion B, which requires excellent mechanical strength and ductility, and second conductive resin layers 132b and 142b, having low resistance, are formed on the connection portion A, which requires low resistance, thereby improving the bending strength of the multilayer electronic component 100 while suppressing the increase of equivalent series resistance (ESR).

[0079] In addition, such as Figure 1 As shown, the external electrodes 130 and 140 according to the embodiment may include side strips (regions disposed on the fifth surface 5 and the sixth surface 6).

[0080] There is no particular limitation on the type of intermetallic compound 31 included in the second conductive resin layer. For example, the intermetallic compound 31 may include one or more of Ni-Sn intermetallic compounds, Ag-Sn intermetallic compounds, and Cu-Sn intermetallic compounds.

[0081] Furthermore, examples of Ni-Sn intermetallic compounds may include Ni3Sn and Ni3Sn4, examples of Ag-Sn intermetallic compounds may include Ag3Sn, and examples of Cu-Sn intermetallic compounds may include Cu6Sn5 and Cu3Sn, but this disclosure is not limited thereto.

[0082] The first resin 22 and the second resin 32 may include, for example, thermosetting resins. Thermosetting resins may include, for example, epoxy resins, but this disclosure is not limited thereto. For example, thermosetting resins may be resins having a low molecular weight and being liquid at room temperature, such as bisphenol A resin, ethylene glycol epoxy resin, phenolic epoxy resin, or derivatives thereof.

[0083] Since the second conductive resin layers 132b and 142b are disposed in the connection portion A of the external electrodes 130 and 140, and the first conductive resin layers 132a and 142a are disposed in the strip portion B of the external electrodes 130 and 140, even if the proportion of intermetallic compound 31 in the second conductive resin layers 132b and 142b increases, the reduction in bending strength of the multilayer electronic component 100 can be suppressed, and the equivalent series resistance (ESR) of the multilayer electronic component 100 can be further reduced.

[0084] Furthermore, the proportion of intermetallic compounds 31 in the second conductive resin layers 132b and 142b can be expressed as the area fraction of intermetallic compounds 31 in the second conductive resin layers 132b and 142b. In an embodiment, the area fraction of intermetallic compounds 31 in the second conductive resin layers 132b and 142b can be greater than or equal to the area fraction of Cu 21 in the first conductive resin layers 132a and 142a.

[0085] In the embodiments, the area fraction of Cu 21 in the first conductive resin layers 132a and 142a may be greater than or equal to 0.50, more preferably greater than or equal to 0.80. Furthermore, there is no particular upper limit to the area fraction of Cu 21 in the first conductive resin layers 132a and 142a, and the area fraction of Cu 21 in the first conductive resin layers 132a and 142a may, for example, be less than or equal to 0.95.

[0086] In the embodiments, the area fraction of the intermetallic compound 31 in the second conductive resin layers 132b and 142b can be greater than or equal to 0.50, more preferably greater than or equal to 0.80. Therefore, the effect of reducing the equivalent series resistance (ESR) of the multilayer electronic component 100 can become more significant. Furthermore, when the second conductive resin layers 132b and 142b are formed in both the connecting portion A and the strip portion B, if the area fraction of the intermetallic compound 31 is greater than or equal to 0.50 or greater than or equal to 0.80, the bending strength of the multilayer electronic component 100 may be reduced due to excessive bonding between the particles of the intermetallic compound 31. However, according to the embodiments of this disclosure, since the second conductive resin layers 132b and 142b are formed in the connecting portion A and the first conductive resin layers 132a and 142a are formed in the strip portion B, even if excessive bonding between the particles of the intermetallic compound 31 is formed, the reduction in the bending strength of the multilayer electronic component 100 can be suppressed.

[0087] Furthermore, there is no particular upper limit to the area fraction of the intermetallic compound 31 in the second conductive resin layers 132b and 142b. For example, the area fraction of the intermetallic compound 31 in the second conductive resin layers 132b and 142b may be less than or equal to 0.95.

[0088] The area fractions of Cu 21 in the first conductive resin layers 132a and 142a and the area fractions of intermetallic compound 31 in the second conductive resin layers 132b and 142b can be obtained by: based on a cross-section of the multilayer electronic assembly 100 polished to a third-direction half-point in the first and second directions, performing positionally non-overlapping imaging of multiple points in a 60μm × 60μm region around the center point of the first conductive resin layers 132a and 142a in the second direction and multiple points in a 60μm × 60μm region around the center point of the second conductive resin layers 132b and 142b in the first direction; then measuring the contrast using a computer program such as ImageJ to determine the area fractions of Cu 21 and intermetallic compound 31 at each point, thereby obtaining an average value. However, this disclosure is not limited thereto.

[0089] Furthermore, there are no particular limitations on the method for measuring the composition of the intermetallic compound 31 in the second conductive resin layers 132b and 142b. For example, in a cross-section of the multilayer electronic assembly 100 polished to half a point in the third direction in the first and second directions, a 60 μm × 60 μm region around the center point of the second conductive resin layers 132b and 142b in the first direction can be imaged using a scanning electron microscope (SEM). Then, each component can be mapped using an EDS mode for quantitative / qualitative analysis. In this case, the content of each element can be expressed, for example, as a mass percentage (wt%), atomic percentage (at%), or molar percentage (mol%), and can also be expressed as the content ratio of another specific component to a specific component.

[0090] The second conductive resin layers 132b and 142b are preferably formed in a specific portion of the connection portion A to enhance the effect of reducing the equivalent series resistance (ESR) of the multilayer electronic assembly 100. Specifically, when the maximum dimension of the body 110 in the first direction is T, the second conductive resin layers 132b and 142b can be disposed in an upper region and a lower region from the central portion of the body 110 in the first direction to a distance greater than or equal to 0.3T from the central portion.

[0091] In this embodiment, the ends of the first conductive resin layers 132a and 142a are in contact with the ends of the second conductive resin layers 132b and 142b. Figure 2 As shown, the ends of the first conductive resin layers 132a and 142a that contact each other with the second conductive resin layers 132b and 142b may be formed in the strip portion B. However, this disclosure is not limited to this, and the ends of the first conductive resin layers 132a and 142a that contact each other with the second conductive resin layers 132b and 142b may also be formed in the corner portion C of the outer electrodes 130 and 140 or in the boundary between the strip portion B and the corner portion C.

[0092] Reference Figure 2 and Figure 3 The external electrodes 130, 140, 130', and 140' may include a corner portion C (the area connecting the connecting portion A and the strip portion B). In this case, as... Figure 2 As shown, the first conductive resin layers 132a and 142a can be disposed in the strip portion B without extending beyond the corner portion C; that is, the second conductive resin layers 132b and 142b can be disposed from the connecting portion A to the corner portion C. Therefore, the effect of reducing the equivalent series resistance (ESR) of the multilayer electronic assembly 100 can be significant.

[0093] Reference Figure 3 According to another embodiment of the present disclosure, the multilayer electronic assembly 100' may include external electrodes 130' and 140' disposed on the body 110. The external electrodes 130' and 140' may be disposed on the third surface 3 and the fourth surface 4, and may include electrode layers 131 and 141 comprising conductive metal and conductive resin layers 132' and 142' disposed on the electrode layers 131 and 141.

[0094] Reference Figure 3 The conductive resin layers 132' and 142' may include: first conductive resin layers 132a' and 142a', disposed in the strip portion B of the external electrodes 130' and 140' and including Cu and the first resin; and second conductive resin layers 132b' and 142b', disposed in the connection portion A of the external electrodes 130' and 140' and including an intermetallic compound and the second resin.

[0095] In addition, refer to Figure 3 The external electrodes 130' and 140' may include a corner portion C (the area where the connecting portion A connects to the strip portion B). In this case, as... Figure 3 As shown, the first conductive resin layers 132a' and 142a' can extend from the strip portion B into the corner portion C. Therefore, the effect of improving the bending strength of the multilayer electronic assembly 100 can become significant.

[0096] In the embodiments, plating layers 133, 134, 143 and 144 may be disposed on conductive resin layers 132, 142, 132' and 142'.

[0097] Coatings 133, 134, 143 and 144 improve the sealing and mounting characteristics of multilayer electronic assemblies 100 and 100'.

[0098] Reference Figure 2 and Figure 3The plating layers 133, 134, 143 and 144 can cover the ends of the conductive resin layers 132, 142, 132' and 142', thereby preventing a decrease in the moisture-proof reliability of the multilayer electronic components 100 and 100'.

[0099] There are no particular limitations on the types of plating layers 133, 134, 143, and 144. Plating layers 133, 134, 143, and 144 may include one or more of Ni, Sn, Pd, and their alloys, and may be formed as multiple layers.

[0100] For a more specific example, plating layers 133, 134, 143, and 144 may be in the form of Ni plating layers 133 and 143 and Sn plating layers 134 and 144 sequentially disposed on conductive resin layers 132, 142, 132', and 142', or in the form of Sn plating layer, Ni plating layer, and Sn plating layer formed sequentially. Furthermore, the plating layers may include multiple Ni plating layers and / or multiple Sn plating layers.

[0101] There are no particular restrictions on the methods for forming coatings 133, 134, 143 and 144. For example, electroless plating, electrolytic plating, etc. can be used.

[0102] Since the second conductive resin layers 132b, 142b, 132b', and 142b' include an intermetallic compound (IMC), some of the metal elements in the IMC can form an alloy with the conductive metals of the electrode layers 131 and 141, thereby improving the interlayer adhesion and electrical connectivity of the external electrodes 130 and 140. Specifically, in reference... Figure 7 In one embodiment, the intermediate layers 131' and 141' may be disposed between the electrode layers 131 and 141 and the second conductive resin layers 132b, 142b, 132b' and 142b'.

[0103] Intermediate layers 131' and 141' can be formed by the migration or diffusion of some metal elements of intermetallic compound (IMC) 31 toward electrode layers 131 and 141 to form an alloy with the conductive metal 11 included in electrode layers 131 and 141. Specifically, in embodiments, intermediate layers 131' and 141' may include one or more of Ni-Sn intermetallic compounds, Ag-Sn intermetallic compounds, and Cu-Sn intermetallic compounds.

[0104] Furthermore, the types of intermetallic compounds 31 included in the intermediate layers 131' and 141' and the second conductive resin layers 132b, 142b, 132b' and 142b' need not be the same and may be different.

[0105] In this disclosure, there are no particular limitations on the methods for controlling the formation areas of the first conductive resin layers 132a, 142a, 132a' and 142a' and the second conductive resin layers 132b, 142b, 132b' and 142b'. For example, methods for controlling the printing or impregnation areas of the first conductive resin layers 132a, 142a, 132a' and 142a' and the second conductive resin layers 132b, 142b, 132b' and 142b' can be used.

[0106] For example, after forming electrode layers 131 and 141 on the body 110, a paste for forming the second conductive resin layers 132b, 142b, 132b', and 142b' is applied to the design area by wheel-type application and cured to form the second conductive resin layers 132b, 142b, 132b', and 142b'. Subsequently, the body 110 on which the electrode layers 131 and 141 and the second conductive resin layers 132b, 142b, 132b', and 142b' are formed can be impregnated to form a first conductive resin layer precursor. Then, the portion of the first conductive resin layer precursor formed in the connection portion can be wiped or removed to form the first conductive resin layers 132a, 142a, 132a', and 142a'. The formation areas of the first conductive resin layers 132a, 142a, 132a' and 142a', and the second conductive resin layers 132b, 142b, 132b' and 142b' can be controlled by the above methods.

[0107] Furthermore, when the first conductive resin layers 132a, 142a, 132a' and 142a' are configured not to extend beyond the corner portion of the outer electrode, the following method can be used: forming the second conductive resin layer precursor by impregnation, wiping or removing the portion of the second conductive resin layer precursor located in the strip portion, and then forming the first conductive resin layers 132a, 142a, 132a' and 142a' by impregnation.

[0108] (Experimental Example 1) Figure 8 This is a graph showing the results of measuring the equivalent series resistance (ESR) in a multilayer electronic assembly according to the comparison example and the example.

[0109] exist Figure 8 In the comparison example, the case where the area fraction of intermetallic compound 31 is the smallest is represented; Example 1 represents the case where the area fraction of intermetallic compound 31 is higher than that of the comparison example; and Example 2 represents the case where the area fraction of intermetallic compound 31 is higher than that of Example 1.

[0110] Reference Figure 8It can be seen that the equivalent series resistance (ESR) of the multilayer electronic components decreases as the area fraction of the intermetallic compound 31 increases.

[0111] (Experimental Example 2) Table 1 shows the capacitance values ​​of a sample of a multilayer electronic component with an IMC resin layer formed on the entire electrode layer, measured from the distance based on bending strength. Table 2 shows the capacitance values ​​of a sample of a multilayer electronic component with an IMC resin layer formed in the connector and a Cu resin layer formed in the strip, measured from the distance based on bending strength.

[0112] Bending strength was evaluated by measuring capacitance based on the measurement distance (deformation) under AEC-Q200 measurement conditions. A constant load (1 mm / min) was applied to the center using a three-point bending tester at 25°C. The distances in Tables 1 and 2 refer to the amount of deformation at the center.

[0113] In Tables 1 and 2, the case where the capacitance value is reduced to 1 / 10 of the initial capacitance value is evaluated as NG.

[0114] For the samples in Tables 1 and 2, copper, glass and binder were mixed and dispersed using a three-roll mill to prepare Cu paste, which was then sintered at 650°C to 850°C to produce primary electrode sintered sheets.

[0115] Subsequently, the samples in Table 1 were manufactured as follows: Cu powder, Sn powder and epoxy resin were mixed, the mixture was dispersed using a three-roll mill to prepare a low-melting-point paste, the prepared paste was applied to the head surface of the primary electrode sintering sheet and a portion of the surface of the body 110 by impregnation, the temperature was raised to 280°C at a heating rate of 4.6°C / min, curing was performed while maintaining the raised temperature, and then Ni and Sn plating were formed.

[0116] For each sample in Table 2, Cu powder, Sn powder, and epoxy resin were mixed and dispersed using a three-roll mill to prepare a low-melting-point paste. This paste was then applied to the head surface of the same primary electrode sintered sheet using a wheel coating method, and curing was performed by raising the temperature to 280°C at a heating rate of 4.6°C / min and maintaining the elevated temperature. Subsequently, Cu powder and epoxy resin were mixed and dispersed using a three-roll mill to prepare a paste, which was then applied to the head surface of the primary electrode sintered sheet and a portion of the surface of the body 110 by impregnation. The Cu-epoxy resin paste formed on the head surface was removed, and curing was performed by raising the temperature to 280°C at a heating rate of 4.6°C / min and maintaining the elevated temperature.

[0117] In addition, Sn powder may include Sn, Sn 96.5 Ag 3.0 Cu0.5 Sn 42 Bi 58 and Sn 72 Bi 28 One or more of the following. The average particle size of Cu powder and Sn powder can range from 0.3 μm to 10 μm, but according to Tables 1 and 2, powders with the same particle size are used in all samples.

[0118] [Table 1]

[0119] [Table 2]

[0120] Referring to Table 1, it can be seen that when the IMC resin layer is formed in the entire belt and connecting part, during the flexural strength test, three out of ten samples failed (NG) with a deformation of 4 mm, and all samples failed (NG) with a deformation of 7 mm.

[0121] Referring to Table 2, it can be seen that when a Cu resin layer is formed in the strip and an IMC resin layer is formed in the connector, no sample fails (NG) at a deformation of 4 mm, and the deformation at which the sample fails (NG) first corresponds to 6 mm. Furthermore, it can be seen that even at a deformation of 10 mm, samples 2 and 5 do not fail (NG).

[0122] In other words, it can be seen that, as in the embodiments of this disclosure, when the Cu resin layer is formed in the strip portion of the external electrode and the IMC resin layer is formed in the connection portion of the external electrode, the deterioration of the bending strength can be suppressed.

[0123] One of the various effects of this disclosure is that by providing a first conductive resin layer comprising Cu and a first resin in the strip portion of the external electrode and providing a second conductive resin layer comprising an intermetallic compound and a second resin in the connection portion of the external electrode, the bending strength of the multilayer electronic assembly is ensured and the increase of ESR is suppressed.

[0124] However, the various advantages and effects of this disclosure are not limited to those described above, and are more readily understood in the description of specific embodiments of this disclosure.

[0125] Although embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above embodiments and drawings, but is intended to be limited by the appended claims. Therefore, those skilled in the art can make various substitutions, modifications and alterations without departing from the technical concept of the present disclosure described in the claims, and such substitutions, modifications and alterations will also be considered to fall within the scope of the present disclosure.

[0126] The expression "embodiment or example" as used in this disclosure does not refer to the same example, but is provided to emphasize the distinct features between the various examples. However, the examples provided in the above description do not preclude the association of features with other examples and their subsequent implementation. For example, even if a matter described in a particular example is not described in another example, such matter may be understood to be related to the other example unless otherwise mentioned in the description of the other example.

[0127] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the embodiments. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well.

Claims

1. A multilayer electronic component, comprising: The body includes a dielectric layer and internal electrodes arranged alternately with the dielectric layer in a first direction. The body includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction. as well as An external electrode is disposed on at least one of the third and fourth surfaces, and includes an electrode layer comprising a conductive metal and a conductive resin layer disposed on the electrode layer. The external electrode includes a connecting portion disposed on at least one of the third and fourth surfaces, and a strip portion disposed on the first and / or second surfaces. The conductive resin layer includes: a first conductive resin layer disposed in the strip portion and comprising Cu and a first resin; and a second conductive resin layer disposed in the connecting portion and comprising an intermetallic compound and a second resin.

2. The multilayer electronic component according to claim 1, wherein, The intermetallic compound includes at least one of Ni-Sn intermetallic compound, Ag-Sn intermetallic compound, and Cu-Sn intermetallic compound.

3. The multilayer electronic component according to claim 1, wherein, The area fraction of the intermetallic compound in the second conductive resin layer is greater than or equal to the area fraction of Cu in the first conductive resin layer.

4. The multilayer electronic assembly according to claim 1, wherein, The area fraction of the intermetallic compound in the second conductive resin layer is greater than or equal to 0.50 and less than or equal to 0.

95.

5. The multilayer electronic component according to claim 1, wherein, The area fraction of Cu in the first conductive resin layer is greater than or equal to 0.50 and less than or equal to 0.

95.

6. The multilayer electronic assembly according to claim 1, wherein, The ends of the first conductive resin layer and the ends of the second conductive resin layer are in contact with each other.

7. The multilayer electronic assembly according to claim 1, wherein, The external electrode also includes a corner portion that connects the connecting portion to the strip portion, and The first conductive resin layer is configured to extend from the strip portion into the corner portion.

8. The multilayer electronic component according to claim 1, wherein, The external electrode also includes a corner portion that connects the connecting portion to the strip portion, and The second conductive resin layer is configured to extend from the connecting portion into the corner portion.

9. The multilayer electronic component according to claim 1, wherein, The maximum dimension of the main body in the first direction is T, and the second conductive resin layer is disposed in the upper and lower regions from the central portion of the main body in the first direction to a distance of greater than or equal to 0.3T from the central portion.

10. The multilayer electronic assembly according to claim 1, wherein, The external electrode also includes a plating layer disposed on the conductive resin layer.

11. The multilayer electronic assembly according to claim 10, wherein, The coating covers the end of the conductive resin layer.

12. The multilayer electronic assembly according to claim 1, wherein, The electrode layer also includes glass.

13. The multilayer electronic assembly according to claim 1, wherein, The external electrode also includes an intermediate layer disposed between the second conductive resin layer and the electrode layer.

14. The multilayer electronic assembly according to claim 13, wherein, The intermediate layer includes one or more of Ni-Sn intermetallic compounds, Ag-Sn intermetallic compounds, and Cu-Sn intermetallic compounds.

15. The multilayer electronic assembly according to claim 1, wherein, The first resin and the second resin include thermosetting resins.

16. A multilayer electronic component, comprising: The body includes a dielectric layer and internal electrodes arranged alternately with the dielectric layer in a first direction. The body includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction. as well as An external electrode is disposed on at least one of the third and fourth surfaces, and includes an electrode layer comprising a conductive metal and a conductive resin layer disposed on the electrode layer. The external electrode includes a connecting portion disposed on at least one of the third surface and the fourth surface, and a strip portion disposed on the first surface and / or the second surface. Intermetallic compounds and Cu are dispersed in the resin of the conductive resin layer, and The content of the intermetallic compound in the connecting portion relative to the resin is greater than the content of the intermetallic compound in the strip portion relative to the resin, and the content of Cu in the connecting portion relative to the resin is less than the content of Cu in the strip portion relative to the resin.

17. The multilayer electronic assembly according to claim 16, wherein, The intermetallic compound includes at least one of Ni-Sn intermetallic compound, Ag-Sn intermetallic compound, and Cu-Sn intermetallic compound.

18. The multilayer electronic assembly according to claim 16, wherein, The area fraction of the intermetallic compound in the connecting portion is greater than or equal to the area fraction of Cu in the strip portion.

19. The multilayer electronic assembly according to claim 16, wherein, The area fraction of the intermetallic compound in the connecting portion is greater than or equal to 0.50 and less than or equal to 0.95, and The area fraction of Cu in the strip is greater than or equal to 0.50 and less than or equal to 0.

95.

20. The multilayer electronic assembly according to claim 16, wherein, The external electrode also includes a plating layer disposed on the conductive resin layer.

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