Electronic component encapsulating material, electronic encapsulating structure comprising same and method of manufacturing same
By introducing composite powders containing iron and titanium compounds into the packaging materials of electronic components, the problem of insufficient long-wave radiation in existing technologies has been solved, improving the lighting comfort and heat transfer efficiency of electronic components and achieving more stable light field characteristics.
CN122404989APending Publication Date: 2026-07-17GUANGDONG TUOZHAN OPTOELECTRONICS CO LTD +3
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GUANGDONG TUOZHAN OPTOELECTRONICS CO LTD
- Filing Date
- 2026-01-21
- Publication Date
- 2026-07-17
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Figure CN122404989A_ABST
Abstract
本发明提供一种电子元件封装材料，包括：一基质及一复合粉末，该复合粉末分散于该基质中且包括一含铁化合物及一含钛化合物。本发明另提供一种电子封装结构，包含如前所述的电子元件封装材料，另包括：一基材层、一电子元件及一封装层。该电子元件设于该基材层的一表面；该封装层由该电子元件封装材料构成，该封装层设于该基材层的该表面并使该电子元件被包覆于该基材层与该封装层之间。本发明另提供一种电子封装结构的制造方法，用于制造如前所述的电子封装结构。
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