A detachable container semiconductor refrigeration device with high heat dissipation efficiency

Abstract

The application relates to the technical field of semiconductor refrigeration, in particular to a separable container semiconductor refrigeration device with a heat pipe high-efficiency heat dissipation, which comprises a refrigeration adhering structure and a downward pressure compensation structure; the refrigeration adhering structure comprises a heat-conducting aluminum plate and a concentric supporting structure, the heat-conducting aluminum plate is adhered to a refrigeration assembly, the concentric supporting structure comprises a plurality of heat-conducting supporting rings and a plurality of guiding supporting structures, the heat-conducting supporting rings are suspended through the guiding supporting structures, the guiding supporting structures are connected with the heat-conducting supporting rings and the heat-conducting aluminum plate, and the guiding supporting structures are used for axial support and heat conduction; the downward pressure compensation structure is used for applying downward pressure to a container; the refrigeration adhering structure and the downward pressure compensation structure are arranged, a plurality of container bottom profiles can be adaptively matched, reliable limiting can be automatically formed, the container vibration deviation problem is effectively solved, and the refrigeration adhering and placement stability are improved.

Description

Technical Field

[0001] This invention application relates to the field of semiconductor refrigeration technology, specifically to a detachable container semiconductor refrigeration device with efficient heat pipe heat dissipation. Background Technology

[0002] Semiconductor refrigeration devices achieve refrigeration based on the Peltier effect. They generate a temperature difference between hot and cold by using a semiconductor refrigeration chip, and then use a heat dissipation structure to remove heat from the hot end and transfer the cold end to the container to achieve rapid cooling. They are widely used in scenarios such as small beverage refrigeration and portable low-temperature preservation, and are characterized by compact structure, no mechanical transmission, and convenient temperature control.

[0003] This semiconductor refrigeration device uses a semiconductor refrigeration chip as the core refrigeration component. After being powered on, it utilizes the Peltier effect to absorb heat at the cold end and release heat at the hot end. The cold end transfers the cold energy to the heat-conducting aluminum plate, and the hot end dissipates heat quickly through the heat pipe heat dissipation component. The temperature control component uses a fixed frequency start-stop method to maintain the target temperature. The overheat protection mechanism automatically cuts off the power when the temperature exceeds the standard. The container is placed on the heat-conducting support structure to achieve cold energy transfer and refrigeration.

[0004] The cooling support surface of existing semiconductor cooling devices is mostly a fixed planar structure, which cannot adaptively match containers with different bottom contours such as flat bottoms and annular raised bottoms. Lightweight containers are easily vibrated and shift horizontally during placement and use, resulting in unstable support and poor limiting, which affects the cooling fit and safety of use. Summary of the Invention

[0005] To address the aforementioned issues, a detachable container semiconductor cooling device with efficient heat pipe heat dissipation is provided. By setting a cooling bonding structure and a pressure compensation structure, it can adaptively match the bottom contours of various containers and automatically form reliable limits, thereby effectively solving the problem of container vibration and displacement and improving the stability of cooling bonding and placement.

[0006] To address the problems of existing technologies, this invention provides a detachable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation, including a refrigeration component, a heat pipe heat dissipation component, a temperature control component, an overheat protection mechanism, and a top support plate. It also includes a refrigeration bonding structure and a downward pressure compensation structure. The refrigeration bonding structure comprises a thermally conductive aluminum plate and a concentric support structure. The thermally conductive aluminum plate is bonded to the refrigeration component. The concentric support structure includes multiple concentrically arranged thermally conductive support rings with progressively increasing diameters and multiple guide support structures. Each guide support structure corresponds to one of the thermally conductive support rings. The thermally conductive support rings are suspended via the guide support structures, which connect the thermally conductive support rings and the thermally conductive aluminum plate. The guide support structures provide axial support and heat conduction. The downward pressure compensation structure applies downward pressure to the container.

[0007] Preferably, the thermally conductive support ring is provided with a plurality of fins, and the fins are inserted into the thermally conductive aluminum plate.

[0008] Preferably, the thermally conductive aluminum plate includes a substrate and a cover plate; the bottom of the substrate is attached to the cooling component, and a recessed groove is formed in the middle of the substrate; a sealed chamber filled with a thermally conductive medium is formed between the cover plate and the substrate, and the fins extend into the sealed chamber.

[0009] Preferably, the guide support structure includes a guide sleeve, a telescopic rod, and an elastic support member; the guide sleeve is integrally formed with the substrate; the telescopic rod is slidably connected to the guide sleeve, and the telescopic rod is connected to a heat-conducting support ring; the elastic support member is used to provide an upward thrust to the telescopic rod.

[0010] Preferably, the guide support structure further includes a limiting rod, and a limiting groove is formed on the telescopic rod. The limiting rod passes through the limiting groove to limit the axial travel of the telescopic rod.

[0011] Preferably, the upper end of the guide sleeve is integrally formed with a support step, which is used to limit and support the cover plate.

[0012] Preferably, the pressure compensation structure includes a pressure arm and a pressure adjustment assembly, wherein the pressure adjustment assembly is used to adjust the movement of the pressure arm in the vertical direction.

[0013] Preferably, the pressure adjustment assembly includes a screw sleeve and an adjusting screw; the screw sleeve has an internal thread; the adjusting screw is threadedly connected to the screw sleeve.

[0014] Preferably, a placement groove is provided on the top support plate, and a magnetic positioning component is provided in the placement groove. The magnetic positioning component fixes the downward pressure compensation structure in the placement groove.

[0015] Preferably, the top support plate is provided with a threaded interface, and the end of the threaded sleeve is integrally formed with a connecting stud, which is threadedly engaged with the threaded interface.

[0016] The advantages of this invention application compared to the prior art are:

[0017] 1. This invention application includes a refrigeration component, a heat pipe heat dissipation component, a temperature control component, an overheat protection mechanism, a top support plate, a refrigeration bonding structure, and a downward pressure compensation structure. The refrigeration component generates cooling energy and transfers it to the heat-conducting aluminum plate. The cooling energy is conducted to each heat-conducting support ring via the guide support structure. After the container is placed, only the bottom-conducting support rings sink, while the non-contacting rings remain suspended to form a height difference. Flat-bottomed containers are limited by annular baffles formed by the outer heat-conducting support rings, while annularly raised-bottomed containers are limited by bidirectional clamping formed by the inner and outer heat-conducting support rings. The guide support structure provides support and heat conduction, and the downward pressure compensation structure provides pressure compensation for lightweight containers, ensuring stable positioning and bonding. This invention application can adaptively match the bottom contours of various containers and automatically form reliable positioning, thereby effectively solving the problem of container vibration and displacement, and improving the stability of refrigeration bonding and placement.

[0018] 2. This invention application provides a plurality of fins on a thermally conductive support ring. The fins are inserted into a thermally conductive aluminum plate to form a connected thermally conductive path. After the container is placed, the thermally conductive support ring drives the fins to move up and down axially in sync. The fins always maintain the insertion and engagement with the thermally conductive aluminum plate, without affecting the adaptive movement of the thermally conductive support ring. Through the direct insertion of the fins into the thermally conductive aluminum plate, the cold energy can be directly transferred from the thermally conductive aluminum plate to the thermally conductive support ring via the fins, shortening the cold energy transfer path, reducing the thermal resistance of the contact interface, thereby improving the heat conduction efficiency and effectively accelerating the cooling speed of the thermally conductive aluminum plate.

[0019] 3. This invention application provides a substrate and a cover plate. The fins extend through the cover plate into the sealed chamber and are immersed in the heat-conducting medium. The fins remain in contact with the heat-conducting medium as they move axially with the heat-conducting support ring, eliminating the air gap between the fins and the heat-conducting aluminum plate. Stable heat conduction is achieved throughout the process by relying on the heat-conducting medium. Continuous heat conduction is achieved through the heat-conducting medium in the sealed chamber, thereby ensuring the efficiency of cold energy transfer between the fins and the heat-conducting aluminum plate and making the cold energy transfer more stable. Attached Figure Description

[0020] Figure 1 This invention relates to a three-dimensional detachable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation. Figure 1 .

[0021] Figure 2 This invention relates to a three-dimensional detachable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation. Figure 2 .

[0022] Figure 3 This is a top view of the top support plate, concentric support structure, and magnetic positioning assembly in a detachable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation according to the present invention.

[0023] Figure 4 yes Figure 3 A three-dimensional sectional view at point AA.

[0024] Figure 5 yes Figure 4 A magnified view of a portion of point B in the middle.

[0025] Figure 6 This is a perspective view of the thermally conductive support ring, fins, and guide support structure in a separable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation according to the present invention.

[0026] Figure 7 This is a perspective view of the guide support structure in a detachable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation according to the present invention.

[0027] Figure 8 This is an exploded view of the guide support structure in a separable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation, as described in this invention application.

[0028] Figure 9 This is a perspective view of the top support plate, lower pressure arm, lower pressure adjustment component, and magnetic positioning component in a detachable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation according to the present invention.

[0029] Figure 10 yes Figure 9 A magnified view of a portion of point C.

[0030] Figure 11 This is a perspective view of the top support plate, lower pressure arm, screw sleeve, and adjusting screw in a detachable container semiconductor refrigeration device for high-efficiency heat pipe heat dissipation according to the present invention.

[0031] The following are the labels in the diagram: 1. Top support plate; 11. Placement slot; 12. Threaded interface; 2. Heat-conducting aluminum plate; 21. Base plate; 22. Cover plate; 3. Concentric support structure; 31. Heat-conducting support ring; 311. Fin; 32. Guide support structure; 321. Guide sleeve; 3211. Support step; 322. Telescopic rod; 3221. Limiting groove; 323. Elastic support component; 324. Limiting rod; 4. Downward pressure compensation structure; 41. Downward pressure arm; 42. Downward pressure adjustment assembly; 421. Screw sleeve; 4211. Connecting stud; 422. Adjusting screw; 43. Magnetic positioning assembly; 431. Positioning post; 432. Magnetic block. Detailed Implementation

[0032] To further understand the features, technical means, and specific objectives and functions achieved by this invention application, the invention application will be described in further detail below with reference to the accompanying drawings and specific embodiments.

[0033] Reference Figures 1 to 11The image shows a detachable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation, comprising a refrigeration component, a heat pipe heat dissipation component, a temperature control component, an overheat protection mechanism, and a top support plate 1. It also includes a refrigeration bonding structure and a downward pressure compensation structure 4. The refrigeration bonding structure comprises a thermally conductive aluminum plate 2 and a concentric support structure 3. The thermally conductive aluminum plate 2 is bonded to the refrigeration component. The concentric support structure 3 includes multiple concentrically arranged thermally conductive support rings 31 with progressively increasing diameters and multiple guide support structures 32. Each guide support structure 32 corresponds to a different thermally conductive support ring 31. The thermally conductive support rings 31 are suspended via the guide support structures 32. The guide support structures 32 connect the thermally conductive support rings 31 and the thermally conductive aluminum plate 2, and are used for axial support and heat conduction. The downward pressure compensation structure 4 applies downward pressure to the container.

[0034] When the device is in operation, the cooling components continuously generate cooling energy and transfer it to the heat-conducting aluminum plate 2. The cooling energy is then conducted to each heat-conducting support ring 31 through the guide support structure 32. When the container is placed on the concentric support structure 3, only the heat-conducting support ring 31 that is in direct contact with the bottom of the container moves axially downward under the gravity of the container, while the heat-conducting support ring 31 that is not in contact with the bottom of the container remains in its initial suspended position, naturally creating a height difference between the two. If the bottom of the container is a complete plane, the heat-conducting support rings 31 within the plane coverage area sink synchronously, and the heat-conducting support rings 31 that are not in contact with the outer edge form an annular limiting edge to prevent the container from shifting horizontally. If the bottom of the container has an annular protrusion, only the heat-conducting support ring 31 that is in contact with the protrusion sinks, while the heat-conducting support rings 31 on both the inner and outer sides of the protrusion remain stationary, forming a bidirectional clamping and limiting effect on the protrusion. At the same time, the inner ring area of ​​the protrusion can contact the corresponding heat-conducting support ring 31. The guide support structure 32 provides axial support and continuous heat conduction for the heat-conducting support ring 31. The downward pressure compensation structure 4 actively applies downward pressure when the lightweight container's self-weight is insufficient, making up for the downward pressure stroke and ensuring the stable formation of the height difference and limiting structure, so that the heat-conducting support ring 31 always maintains maximum contact area with the bottom of the container. This application can adaptively match various container bottom contours such as flat bottoms and annular raised bottoms, automatically forming height difference limiting and bidirectional clamping limiting, thereby solving the problem of container displacement due to vibration.

[0035] Reference Figure 6 As shown: The thermally conductive support ring 31 is provided with a plurality of fins 311, and the fins 311 are inserted into the thermally conductive aluminum plate 2.

[0036] Multiple fins 311 on the thermally conductive support ring 31 are inserted into the thermally conductive aluminum plate 2, forming a directly connected heat conduction path. When the container is placed on the thermally conductive support ring 31, under the influence of the container's gravity, the thermally conductive support ring 31 undergoes adaptive up-and-down movement along the axial direction. The fins 311 move up and down synchronously with the thermally conductive support ring 31, maintaining their insertion connection with the thermally conductive aluminum plate 2 throughout the movement. This ensures that the normal axial movement of the thermally conductive support ring 31 is not interfered with, while continuously building a stable heat conduction channel. The cold energy generated by the cooling component is first transferred to the thermally conductive aluminum plate 2, then rapidly conducted to the thermally conductive support ring 31 through the fins 311, and finally transferred to the bottom of the container by the thermally conductive support ring 31. Through the direct insertion of the fins 311 into the thermally conductive aluminum plate 2, the cold energy can directly originate from the thermally conductive aluminum plate 2, be transferred directly to the thermally conductive support ring 31 via the fins 311, shorten the cold energy transfer path, reduce the thermal resistance at the contact interface, thereby improving the heat conduction efficiency and effectively accelerating the cooling speed of the thermally conductive aluminum plate 2.

[0037] Reference Figure 5 As shown: The thermally conductive aluminum plate 2 includes a substrate 21 and a cover plate 22; the bottom of the substrate 21 is attached to the cooling component, and a recessed groove is formed in the middle of the substrate 21; a sealed chamber filled with a thermally conductive medium is formed between the cover plate 22 and the substrate 21, and the fins 311 extend into the sealed chamber.

[0038] Fins 311 extend through the cover plate 22 into the sealed chamber and are immersed in the heat-conducting medium. As the fins 311 move axially upwards or downwards with the heat-conducting support ring 31, they remain in constant contact with the heat-conducting medium, eliminating the air gap between the fins 311 and the heat-conducting aluminum plate 2, achieving heat conduction entirely through the heat-conducting medium. Continuous heat conduction through the heat-conducting medium within the sealed chamber ensures efficient cold air transfer between the fins 311 and the heat-conducting aluminum plate 2, resulting in more stable cold air transmission.

[0039] Reference Figure 5 , Figure 7 and Figure 8 As shown: The guide support structure 32 includes a guide sleeve 321, a telescopic rod 322, and an elastic support member 323; the guide sleeve 321 is integrally formed with the base plate 21; the telescopic rod 322 is slidably connected to the guide sleeve 321, and the telescopic rod 322 is connected to the heat-conducting support ring 31; the elastic support member 323 is used to provide an upward thrust to the telescopic rod 322.

[0040] The guide sleeve 321 is integrally formed with the base plate 21, providing a guiding foundation for the overall lifting and lowering movement. The telescopic rod 322 forms a sliding fit with the guide sleeve 321 and is fixedly connected to the heat-conducting support ring 31, allowing for smooth reciprocating movement along the axial direction. The elastic support member 323 continuously applies an upward thrust to the telescopic rod 322, keeping the heat-conducting support ring 31 in a stable initial suspended state when no container is placed. When a container is placed and pressure is applied, the telescopic rod 322 overcomes the thrust of the elastic support member 323 and slides smoothly down along the guide sleeve 321, causing the heat-conducting support ring 31 to sink synchronously to fit the bottom of the container. When the container is removed, the upward thrust of the elastic support member 323 again drives the telescopic rod 322 and the heat-conducting support ring 31 to automatically rise back to their initial positions. The integral forming of the guide sleeve 321 and the base plate 21 enhances structural strength, and the sliding connection effectively avoids jamming and offset, thereby ensuring that the heat-conducting support ring 31 achieves adaptive lifting and lowering movement.

[0041] Reference Figure 8 As shown: The guide support structure 32 also includes a limiting rod 324. The telescopic rod 322 has a limiting groove 3221. The limiting rod 324 passes through the limiting groove 3221 and is used to limit the axial travel of the telescopic rod 322.

[0042] During the adaptive lifting and lowering process of the heat-conducting support ring 31 via the guide support structure 32, the telescopic rod 322 is prone to excessive upward movement, causing it to detach from the guide sleeve 321, or excessive downward movement, impacting the substrate 21 or the cavity structure. Therefore, the guide support structure 32 is also provided with a limiting rod 324, and a corresponding limiting groove 3221 is formed on the telescopic rod 322. The limiting rod 324 passes through the limiting groove 3221 and remains fixed. When the telescopic rod 322 moves upward under the thrust of the elastic support member 323, the lower boundary of the limiting groove 3221 is blocked by the limiting rod 324, limiting the maximum upward stroke of the telescopic rod 322. When the telescopic rod 322 moves downward under the pressure of the container, the upper boundary of the limiting groove 3221 is blocked by the limiting rod 324, limiting the maximum downward stroke of the telescopic rod 322. By cooperating with the limiting rod 324 and the limiting groove 3221, the telescopic rod 322 and the heat-conducting support ring 31 connected to the telescopic rod 322 are limited to move within a reasonable axial displacement range, thereby ensuring that the adaptive lifting action of the heat-conducting support ring 31 will not exceed the safe movement range, so that the entire cooling bonding structure can complete the lifting action stably and safely.

[0043] Reference Figure 5 and Figure 7 As shown: The upper end of the guide sleeve 321 is integrally formed with a support step 3211, which is used to limit and support the cover plate 22.

[0044] When assembling and using the sealed chamber structure of the heat-conducting aluminum plate 2, the cover plate 22 is prone to positioning deviation and unstable support, which in turn leads to uneven shape of the sealed chamber and misalignment of the fins 311. To solve the above problems, this device has an integrally formed support step 3211 at the upper end of the guide sleeve 321. During assembly, the holes on the cover plate 22 are aligned with the guide sleeve 321 one by one, so that the guide sleeve 321 passes through the holes of the cover plate 22 to achieve initial positioning. Then, the cover plate 22 is placed stably on the support step 3211. The support step 3211 provides uniform and stable support for the cover plate 22, keeping the cover plate 22 strictly parallel to the substrate 21. This ensures that the sealed chamber formed between the cover plate 22 and the substrate 21 has a regular, uniform, and undeformed shape, thereby ensuring that the fins 311 can accurately extend into the sealed chamber and maintain the stability and reliability of the heat conduction path.

[0045] Reference Figure 2 and Figure 9 As shown: The pressure compensation structure 4 includes a pressure arm 41 and a pressure adjustment component 42. The pressure adjustment component 42 is used to adjust the movement of the pressure arm 41 in the vertical direction.

[0046] When placing lightweight containers, there are technical problems such as insufficient weight to drive the thermally conductive support ring 31 to sink and form a sufficient height difference, weak limiting effect, and easy horizontal slippage of the container due to vibration. To solve this problem, a downward pressure compensation structure 4 is needed. In use, the downward pressure arm 41 contacts the top of the container, and the downward pressure adjustment component 42 drives the downward pressure arm 41 to move stably in the vertical direction, applying continuous and uniform downward pressure to the top of the container. This pressure is then transmitted to the thermally conductive support ring 31 at the bottom of the container, compensating for the insufficient downward pressure of the lightweight container. This allows the thermally conductive support ring 31 to sink to a reasonable working position, forming a stable and effective limiting height difference, ensuring that the container is reliably limited and no longer slips horizontally, and ensuring that the thermally conductive support ring 31 is always in close contact with the bottom of the container. By applying stable downward pressure compensation to the lightweight container, the thermally conductive support ring 31 is effectively limited, improving the stability of the container and preventing vibration-induced displacement.

[0047] Reference Figure 2 , Figure 9 and Figure 11 As shown: The pressure adjustment assembly 42 includes a screw sleeve 421 and an adjusting screw 422; the screw sleeve 421 has an internal thread; the adjusting screw 422 is threadedly connected to the screw sleeve 421.

[0048] In the process of applying downward pressure to the container using the downward pressure compensation structure 4, there is a technical problem that the magnitude of the downward pressure cannot be precisely controlled, which can easily lead to excessive pressure damaging the container or insufficient pressure failing to achieve the limiting and fitting compensation effect. Therefore, this device adopts a downward pressure adjustment component 42 consisting of a screw sleeve 421 and an adjusting screw 422. The screw sleeve 421 has an internal thread, and the adjusting screw 422 is connected to the screw sleeve 421 through a threaded connection. When it is necessary to adjust the downward pressure, the adjusting screw 422 is rotated, and the adjusting screw 422 makes a vertical linear displacement along the internal thread of the screw sleeve 421, thereby driving the connected downward pressure arm 41 to move synchronously. By rotating the number of revolutions and the angle, the position adjustment of the downward pressure arm 41 can be achieved smoothly, accurately, and steplessly, thereby controlling the magnitude of the downward pressure applied to the container, so that the pressure is always within a suitable range, and adapting to containers of different weights and materials.

[0049] Reference Figure 3 , Figure 9 and Figure 10 As shown: A placement groove 11 is provided on the top support plate, and a magnetic positioning component 43 is provided in the placement groove 11. The magnetic positioning component 43 fixes the downward pressure compensation structure 4 in the placement groove 11.

[0050] Specifically, the magnetic positioning assembly 43 includes a positioning post 431 and a magnetic block 432. The positioning post 431 is vertically installed in the placement groove 11, and the magnetic block 432 is fixed on the side wall of the threaded sleeve 421.

[0051] This device has a placement slot 11 on the top support plate 1, and a magnetic positioning component 43 is installed inside the placement slot 11. The magnetic positioning component 43 consists of a positioning post 431 and a magnetic block 432. The positioning post 431 is vertically installed in the placement slot 11, and the magnetic block 432 is fixedly installed on the side wall of the screw sleeve 421. When storing, the pressure compensation structure 4 is placed in the placement slot 11. The positioning post 431 defines the position of the pressure compensation structure 4 to prevent it from shaking or shifting. The magnetic block 432 attracts and cooperates with the positioning post 431 by magnetic force, fixing the pressure compensation structure 4 inside the placement slot 11. This ensures that the pressure compensation structure 4 is neatly stored, not loose, and does not fall off. The operation is simple and quick, does not occupy extra space outside the device, and keeps the overall appearance and structure of the device neat and intact.

[0052] Reference Figure 11 As shown: The top support plate 1 is provided with a threaded interface 12, and the end of the threaded sleeve 421 is integrally formed with a connecting stud 4211, which is threadedly engaged with the threaded interface 12.

[0053] When the pressure compensation structure 4 is needed, first remove it from the placement slot 11, then align the connecting stud 4211 at the end of the threaded sleeve 421 with the threaded interface 12 on the top support plate 1. Rotate the stud 4211 to form a threaded engagement with the threaded interface 12 and tighten it to complete the quick assembly of the pressure compensation structure 4. After assembly, the pressure compensation structure 4 remains stable and does not wobble, ensuring that the pressure arm 41 is in a horizontal position, and the pressure can be applied vertically downwards and stably to the top of the container, thereby avoiding container tilting due to eccentricity.

[0054] The above embodiments only illustrate one or more implementation methods of this invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this invention, and these all fall within the protection scope of this invention. Therefore, the protection scope of this invention should be determined by the appended claims.

Claims

1. A detachable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation, comprising a refrigeration component, a heat pipe heat dissipation component, a temperature control component, an overheat protection mechanism, and a top support plate (1), characterized in that, It also includes a cooling bonding structure and a pressure compensation structure (4); The cooling bonding structure includes a thermally conductive aluminum plate (2) and a concentric support structure (3). The thermally conductive aluminum plate (2) is bonded to the cooling component. The concentric support structure (3) includes multiple concentrically arranged thermally conductive support rings (31) with progressively increasing diameters and multiple guide support structures (32). The multiple guide support structures (32) correspond to the multiple thermally conductive support rings (31). The thermally conductive support rings (31) are suspended through the guide support structures (32). The guide support structures (32) connect the thermally conductive support rings (31) and the thermally conductive aluminum plate (2). The guide support structures (32) are used for axial support and heat conduction. The downward pressure compensation structure (4) is used to apply downward pressure to the container.

2. The detachable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation according to claim 1, characterized in that, The heat-conducting support ring (31) is provided with multiple fins (311), and the fins (311) are inserted into the heat-conducting aluminum plate (2).

3. The detachable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation according to claim 2, characterized in that, The thermally conductive aluminum plate (2) includes a substrate (21) and a cover plate (22); The bottom of the substrate (21) is attached to the cooling component, and a recessed groove is formed in the middle of the substrate (21). A sealed chamber filled with a thermally conductive medium is formed between the cover plate (22) and the substrate (21), and the fins (311) extend into the sealed chamber.

4. A detachable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation according to claim 3, characterized in that, The guide support structure (32) includes a guide sleeve (321), a telescopic rod (322), and an elastic support member (323). The guide sleeve (321) is integrally formed with the substrate (21); The telescopic rod (322) is slidably connected to the guide sleeve (321), and the telescopic rod (322) is connected to the heat-conducting support ring (31); The elastic support (323) is used to provide an upward thrust to the telescopic rod (322).

5. A detachable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation according to claim 4, characterized in that, The guide support structure (32) also includes a limiting rod (324). A limiting groove (3221) is provided on the telescopic rod (322). The limiting rod (324) passes through the limiting groove (3221) and is used to limit the axial travel of the telescopic rod (322).

6. A detachable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation according to claim 4, characterized in that, The upper end of the guide sleeve (321) is integrally formed with a support step (3211), which is used to limit and support the cover plate (22).

7. A detachable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation according to claim 1, characterized in that, The pressure compensation structure (4) includes a pressure arm (41) and a pressure adjustment component (42), the pressure adjustment component (42) being used to adjust the movement of the pressure arm (41) in the vertical direction.

8. A detachable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation according to claim 7, characterized in that, The pressure adjustment assembly (42) includes a screw sleeve (421) and an adjustment screw (422). The sleeve (421) has an internal thread; The adjusting screw (422) is threadedly connected to the sleeve (421).

9. A detachable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation according to claim 8, characterized in that, A placement slot (11) is provided on the top support plate, and a magnetic positioning component (43) is provided in the placement slot (11). The magnetic positioning component (43) fixes the downward pressure compensation structure (4) in the placement slot (11).

10. A detachable container semiconductor refrigeration device with high-efficiency heat pipe heat dissipation according to claim 8, characterized in that, The top support plate (1) is provided with a threaded interface (12), and the end of the threaded sleeve (421) is integrally formed with a connecting stud (4211), which is threadedly engaged with the threaded interface (12).

Images