Antenna device and method of processing thereof

Abstract

The present disclosure relates to the technical field of electronic equipment, and particularly relates to an antenna device and a processing method thereof. The antenna device provided by the present disclosure comprises a substrate layer, a metal layer and a dielectric layer, the metal layer is located on a first surface of the substrate layer and serves as a radiator to emit or receive wireless signals; the dielectric layer is arranged on the metal layer; wherein the dielectric layer is a composite protective paint layer, the composite protective paint layer is formed by mixing an oxidation-resistant paint base and high-dielectric ceramic powder, and the relative dielectric constant epsilon of the high-dielectric ceramic powder satisfies: 7 <= epsilon <= 40. The present disclosure can reduce the equivalent wavelength of electromagnetic waves, thereby miniaturizing the antenna device.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and in particular to an antenna device and its fabrication method. Background Technology

[0002] With the rapid development of mobile computing technology, the design of current laptops has evolved towards thinner, lighter, and smaller designs. The thickness of the device casing continues to decrease, and the layout of internal components is becoming increasingly compact, resulting in a further compression of the physical space available for antenna configuration. At the same time, wireless communication technology continues to iterate and upgrade, and the number of wireless communication protocols and operating frequency bands that terminal devices need to support has increased significantly, leading to a corresponding increase in the number, size, and space requirements of antennas.

[0003] Against this backdrop, the area inside laptops available for effective antenna radiation continues to shrink, creating a core contradiction between the increasing demand for antennas and the shrinking available space: on the one hand, multi-band, multi-antenna systems require larger radiation areas and isolation spaces to ensure communication performance of different frequency bands and the isolation between antennas; on the other hand, the thinner and lighter design significantly compresses the antenna clearance area, and the interference and shielding effects of the internal metal structure on antenna signals are aggravated, making it difficult to meet design specifications for key performance indicators such as antenna radiation efficiency, gain, and impedance matching. Summary of the Invention

[0004] This disclosure provides an antenna device and its fabrication method to at least solve the above-mentioned technical problems existing in the prior art.

[0005] The first aspect of this disclosure provides an antenna device, comprising: Substrate layer; A metal layer, located on the first side of the substrate layer, acts as a radiator to emit or receive wireless signals. A dielectric layer is deposited over the metal layer; The dielectric layer is a composite protective coating layer, which is composed of an antioxidant coating base and high-dielectric ceramic powder. The high-dielectric ceramic powder has a relative permittivity ε. Satisfy: 7≤ε ≤40.

[0006] Furthermore, the high-dielectric ceramic powder includes at least one of titanium oxide, aluminum oxide, hafnium oxide, zirconium oxide, silicon nitride, yttrium oxide, and tantalum oxide.

[0007] Furthermore, the dielectric layer includes a second side facing the substrate layer and a third side facing away from the substrate layer, the second side and the third side being disposed opposite to each other, and the thickness D1 between the second side and the third side satisfies: 0.05mm≤D1≤1mm.

[0008] Furthermore, the substrate layer includes a fourth side facing away from the metal layer, and the dielectric layer is disposed on the fourth side; And / or, the substrate layer includes a first end face and a second end face located at both ends of the substrate layer, and the dielectric layer is disposed on at least one of the first end face and the second end face.

[0009] Furthermore, the dielectric layer covers a local area of ​​the metal layer, and the local area is the radiation region corresponding to the mid-to-high frequency band operation of the antenna; The area of ​​the local region accounts for 5% to 100% of the total area of ​​the metal layer.

[0010] Furthermore, the substrate layer includes one of a PCB substrate, an FPC substrate, an LDS bracket substrate, and a PC bracket substrate.

[0011] Furthermore, the metal layer is formed of copper or a copper-nickel-gold alloy, and the thickness D2 of the metal layer satisfies: 0.01mm≤D2≤0.03mm.

[0012] Furthermore, the shape of the metal layer includes PIFA type, monopole type, dipole type or loop type.

[0013] The second aspect of this disclosure provides a method for fabricating an antenna device as described in the first aspect, characterized by comprising the following steps: A substrate layer is provided, wherein the substrate layer is an LDS bracket substrate or a PC bracket substrate; An antenna pattern is engraved on the first side of the substrate layer using a laser direct forming process, and a metal layer is formed by a chemical plating process, with the metal layer serving as a radiator. A dielectric layer is applied to at least a portion of the surface of the metal layer using a spray coating process. The dielectric layer is formed of a high-dielectric material with a relative permittivity ε. ≥10, the thickness D1 of the dielectric layer is controlled to satisfy 0.05mm≤D1≤1mm; The antenna device is electrically connected to the motherboard of the electronic device.

[0014] Furthermore, different local regions of the metal layer correspond to different operating frequency bands of the antenna, wherein: A first high-dielectric material is applied to a first local region of the first frequency band, with a relative permittivity ε. 1≥15; A second high-dielectric material is applied to a second local region of the second frequency band, with a relative permittivity ε. 2 satisfies 10≤ε 2<15, or no dielectric material is applied.

[0015] The technical solution provided in this disclosure has the following advantages compared with the prior art: This embodiment places a dielectric layer between the metal layer and the metal conductor of the electronic device system. Utilizing the dielectric isolation properties of the dielectric layer, it alters the equivalent dielectric environment between the antenna device and the system's metal conductor, weakening the shielding and coupling effects of the system's metal conductor on the antenna's radiation field. By loading the dielectric layer, this embodiment can increase the antenna's equivalent dielectric constant without increasing its physical size, enabling miniaturized antenna design and adapting to the space constraints of thinner and lighter devices. By using a composite protective coating layer composed of an anti-oxidation varnish base and high-dielectric ceramic powder as the dielectric layer, both anti-oxidation protection and high-dielectric tuning functions can be integrated.

[0016] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0017] The above and other objects, features, and advantages of this disclosure will become readily apparent from the following detailed description of exemplary embodiments, taken in conjunction with the accompanying drawings. Several embodiments of this disclosure are illustrated in the drawings by way of example and not limitation, in which: In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0018] Figure 1 A schematic diagram of the antenna device provided in an embodiment of this disclosure is shown; Figure 2 Another structural schematic diagram of the antenna device provided in this disclosure embodiment is shown; Figure 3 A schematic diagram of another structure of the antenna device provided in the embodiments of this disclosure is shown; Figure 4 A schematic diagram of another structure of the antenna device provided in the embodiments of this disclosure is shown; Figure 5 The diagram shows the variation in antenna efficiency for the same antenna under different dielectric constants.

[0019] The labels in the diagram are as follows: 1. Substrate layer; 2. Metal layer; 3. Dielectric layer. Detailed Implementation

[0020] To make the objectives, features, and advantages of this disclosure more apparent and understandable, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0021] The narrow bezel design of screens has led to the placement of antennas on hinges, hinge covers, and the system itself, continuously compressing the antenna design area. This is one of the main design approaches in high-end projects today. Due to limited internal system space, the space required for antenna design is further compressed. Currently, the most commonly used miniaturized antenna designs are printed circuit boards (PCBs), laser direct-formed antennas (LDS), and metal loop antennas. However, the gap between the metal loop and the system conductors is often reduced due to system space or appearance design limitations, thus affecting antenna performance.

[0022] In this embodiment of the disclosure, when the space between the antenna and the system is compressed, a layer of high-dielectric sprayed structural material (such as composite high-dielectric material) is sprayed onto the antenna. Without changing the existing environment and size, the design goal of reducing the antenna wavelength and improving antenna performance is achieved by changing the dielectric constant of the antenna radiating material, thereby avoiding the adverse effects of environmental design structure problems on the antenna.

[0023] During propagation, electromagnetic waves (light waves are a type of electromagnetic wave) produce different refractive indices when they penetrate different media at different frequencies.

[0024] This invention is based on the antenna wavelength formula, the relevant formulas are as follows: , Where f represents frequency and c represents the speed of light (3×10⁸ m / s). Indicates the wavelength in a vacuum. Indicates the actual wavelength. This represents the dielectric constant. Taking a frequency of 2.4 GHz in a vacuum environment as an example, the wavelength can be calculated as follows: = Substituting the dielectric constants of general plastics and ceramics into the formula, the following wavelengths can be calculated: ; .

[0025] As can be seen from the antenna wavelength formula above, the antenna wavelength changes inversely when the dielectric constant of the antenna material changes. The core idea of ​​this patent is to significantly affect the antenna wavelength by changing the dielectric parameters of different materials in the environment, thus transforming environmental parameters that are originally unfavorable to antenna operation into favorable factors.

[0026] Calculations using antenna formulas for materials with different dielectric parameters reveal that the required antenna wavelength changes with the dielectric constant of the material. Combining high-dielectric coatings with standard plastic casing materials can effectively shorten the required antenna wavelength, thereby mitigating the adverse effects of the conductor environment on the antenna.

[0027] When the distance between the antenna and the system conductor is less than 5 mm, the high dielectric coating can effectively reduce the adverse effects of the system metal conductor on the antenna.

[0028] like Figure 1 As shown, the antenna device provided in this embodiment includes a substrate layer 1, a metal layer 2, and a dielectric layer 3. The metal layer 2 is located on the first surface of the substrate layer 1 and acts as a radiator to transmit or receive wireless signals. The dielectric layer 3 is deposited on the metal layer 2. The dielectric layer 3 is a composite protective coating layer, which is composed of an antioxidant paint base and high-dielectric ceramic powder. The relative permittivity ε of the high-dielectric ceramic powder is... Satisfy: 7≤ε ≤40. In scenarios where the distance between the antenna and the metal conductors of the electronic device system is insufficient, traditional antennas are prone to impedance mismatch and reduced radiation efficiency due to near-field interference from the metal conductors. The dielectric layer 3 in this embodiment can be equivalently used to form a dielectric isolation layer between the antenna and the interfering conductor, changing the electric field distribution path and reducing the disturbance of the antenna's resonant mode by the metal conductors, thereby effectively improving the antenna's radiation stability and impedance matching performance in harsh electromagnetic environments. In other words, this embodiment, by setting a dielectric layer 3 between the metal layer 2 and the metal conductors of the electronic device system, utilizes the dielectric isolation characteristics of the dielectric layer 3 to change the equivalent dielectric environment between the antenna device and the system's metal conductors, weakening the shielding and coupling effects of the system's metal conductors on the antenna's radiation field. This embodiment, through the loading of the dielectric layer 3, can increase the antenna's equivalent dielectric constant without increasing the antenna's physical size, achieving miniaturized antenna design and adapting to the space constraints of thinner and lighter devices.

[0029] Specifically, by employing a composite protective coating layer composed of an antioxidant paint base and high-dielectric ceramic powder as the dielectric layer 3, the dielectric layer 3 simultaneously possesses dual functions: on the one hand, the antioxidant paint base can effectively protect the metal layer (radiator), isolating it from environmental factors such as air and moisture, preventing oxidation and corrosion of the metal layer, and improving the antenna's service life and reliability; on the other hand, the high-dielectric ceramic powder provides high dielectric properties (ε... =7~40), which can effectively increase the dielectric constant around the antenna, realize antenna miniaturization and performance optimization, and eliminate the need for additional independent protective layer and dielectric layer 3, simplifying the structure and process.

[0030] The composite protective coating layer, as dielectric layer 3, is formed by the composite protective coating. It can form a dielectric barrier between the metal layer and the internal metal conductors of the system (such as the motherboard, battery, and heat dissipation module), weakening the coupling interference and shielding effect of the metal conductor on the antenna radiation field. In scenarios where the distance between the antenna and the system conductor is insufficient, it can effectively improve the impedance matching and radiation efficiency of the antenna and enhance the working stability of the antenna in complex electromagnetic environments.

[0031] Optionally, the composite protective coating forming the composite protective coating layer comprises, by weight percentage: 10%~30% high-dielectric ceramic powder and 70%~90% anti-oxidation paint; in this preferred embodiment, the content of high-dielectric ceramic powder is 10%, 15%, 20%, 25% or 30%, etc., and the content of anti-oxidation paint is 70%, 75%, 80%, 85% or 90%, etc.

[0032] Optionally, the composite protective coating forming the composite protective coating layer comprises, by weight percentage: 18%~25% high-dielectric ceramic powder and 75%~82% anti-oxidation paint; the high-dielectric ceramic powder includes, but is not limited to, titanium oxide, aluminum oxide, hafnium oxide, zirconium oxide, silicon nitride, yttrium oxide, or tantalum oxide. In this preferred embodiment, the content of high-dielectric ceramic powder is 18%, 19%, 20%, 21%, 22%, 23%, 24%, or 25%, etc., and the content of anti-oxidation paint is 75%, 76%, 77%, 78%, 79%, 80%, 81%, or 82%, etc. Preferably, taking titanium dioxide as the high-dielectric ceramic powder as an example, the titanium dioxide content is 20.75%, and the anti-oxidation paint content is 79.25%.

[0033] Based on this composite protective coating, a local spraying process can be further adopted, where the dielectric layer 3 is only applied to the key radiation area of ​​the antenna, or composite coatings with different dielectric constants are sprayed in different areas. This not only allows for precise control of the performance of key frequency bands, but also avoids the use of high dielectric materials over a large area, further reducing material costs. At the same time, it enables independent tuning of multi-band antennas, improving design flexibility.

[0034] The physical dimensions of the antenna, its operating frequency, and its equivalent dielectric constant satisfy the relationship L≈ ,in For free space wavelengths, It is the equivalent dielectric constant; high dielectric coatings can improve... This significantly shortens the physical length of the antenna radiator at the same operating frequency, thereby alleviating the limitation on antenna size imposed by design space compression. It also allows for multi-band communication requirements to be met in thin and light laptops and other devices. In other words, this embodiment, through the loading of dielectric layer 3, can increase the equivalent dielectric constant of the antenna without increasing its physical size, achieving miniaturized antenna design and adapting to the space constraints of thin and light devices.

[0035] Materials with different dielectric constants can be flexibly selected according to frequency band requirements. High dielectric constant materials (εr≥7) can further increase the equivalent dielectric constant, corresponding to a further reduction in the physical size of the antenna radiator. For example, when εr increases from 4 to 20, the length of the antenna radiator can be shortened by about 55%, thereby realizing the layout of multi-band antennas in a limited space while ensuring radiation performance. This embodiment can be combined with high dielectric ceramic powder materials with different dielectric constants. By selecting high dielectric ceramic powder materials with high dielectric constants, the equivalent dielectric constant can be further improved, achieving miniaturization of the antenna radiator.

[0036] Optionally, the composite protective coating, which is a mixture of antioxidant paint base and high dielectric ceramic powder, contains the following components by weight percentage: 40%~50% epoxy resin, 30%~40% alumina, 10%~12% dipropylene glycol methyl ether, 5%~7% hardener, 0.8%~1.2% defoamer, and 1.8%~2.2% fumed silica.

[0037] The components of the antioxidant paint base may include, by weight percentage, some or all of the following: epoxy resin 40%~50%, alumina 30%~40%, dipropylene glycol methyl ether 10%~12%, hardener 5%~7%, defoamer 0.8%~1.2% and fumed silica 1.8%~2.2%.

[0038] Preferably, the composite protective paint, which is a mixture of antioxidant paint base and high dielectric ceramic powder, comprises the following components by weight percentage: 45% epoxy resin, 35% alumina, 11% dipropylene glycol methyl ether, 6% hardener, 1% defoamer, and 2% fumed silica.

[0039] In some specific embodiments, the high-dielectric ceramic powder includes titanium oxide, aluminum oxide, hafnium oxide, zirconium oxide, silicon nitride, yttrium oxide, or tantalum oxide. The dielectric constants of these materials cover a wide range of 7-80 (titanium oxide 80, aluminum oxide 9, hafnium oxide 25, zirconium oxide 25), allowing for targeted adaptation to different frequency band requirements. Specifically, titanium oxide (high dielectric constant) is suitable for high-frequency antennas with extremely high miniaturization requirements (such as 5G millimeter wave), reducing the antenna's physical size to 1 / 5-1 / 3 of traditional designs; aluminum oxide (low dielectric constant) is suitable for mid-to-low frequency bands (such as 2G / 3G), reducing energy loss (loss tangent <0.001) while ensuring signal stability; hafnium oxide and zirconium oxide (medium-to-high dielectric constant) balance miniaturization and loss control, making them suitable for Sub-6GHz 5G or Wi-Fi 6 / 7 antennas, balancing radiation efficiency and frequency band coverage.

[0040] In some specific implementation methods, such as Figure 2 , Figure 3 and Figure 4 As shown, the dielectric layer 3 includes a second side facing the substrate layer 1 and a third side away from the substrate layer. The second side and the third side are disposed opposite to each other, and the thickness D1 between the second side and the third side satisfies: 0.05mm≤D1≤1mm.

[0041] When the thickness of dielectric layer 3 is too small (<0.05mm), the resonant frequency will be too high, exceeding the target frequency range, and the signal gain will be attenuated (e.g., the gain will decrease by more than 3dB). When the thickness of dielectric layer 3 is too large (>1mm), the resonant frequency will be too low, mismatched with the target frequency band, and the signal transmission path will be longer, the dielectric loss (tanδ) will increase, affecting the signal transmission distance and anti-interference ability.

[0042] By limiting the thickness D1 of dielectric layer 3 to within the range of 0.05-1mm, the antenna input impedance (e.g., 50Ω) can be precisely matched with the RF front-end circuit, reducing signal reflection loss (reflection coefficient |S11|≤-10dB across the entire operating frequency band), avoiding signal energy waste due to impedance mismatch, and improving the antenna's radiation efficiency and communication stability.

[0043] This embodiment can effectively reduce the adverse environmental impact of the system's metal conductor on the antenna when the distance between the antenna and the system conductor is insufficient; it can improve the impact and limitations on the antenna caused by the compression of the antenna design space; and it can be used with materials of different dielectric constants to effectively reduce the space required for the antenna radiator.

[0044] In some specific embodiments, the thickness D1 of dielectric layer 3 is related to the relative permittivity ε of the high-dielectric material. Satisfy the following relationship: D1= Where k is a coefficient ranging from 0.1 to 0.9, The free-space wavelength corresponding to the target operating frequency of the antenna device is used to achieve impedance matching and precise tuning of the resonant frequency of the antenna device.

[0045] Using high dielectric materials over a large area can lead to a significant increase in material and manufacturing costs. This embodiment can spray high dielectric materials on key local areas (such as mid-to-high frequency radiation areas), which can optimize the performance of the target frequency band by utilizing its miniaturization effect, while avoiding the consumption of high dielectric materials in non-critical areas. This reduces the amount of high dielectric materials used to 5% to 80% of the traditional solution, greatly reducing material costs and process time.

[0046] In some specific embodiments, the dielectric layer 3 covers a localized area of ​​the metal layer 2, and this localized area corresponds to the radiation region where the antenna operates in the mid-to-high frequency band. Spraying a high-dielectric material onto key localized areas of the antenna can effectively reduce the cost of using high-dielectric materials over large areas.

[0047] In some specific embodiments, the metal layer 2 includes a first part and a second part, a first dielectric layer 3 covers the first part, and a second dielectric layer 3 covers the second part. The first dielectric layer 3 and the second dielectric layer 3 are made of different materials, thereby adjusting the key frequency band of the antenna by spraying different dielectric materials on local areas of the antenna.

[0048] In some specific implementations, the area of ​​a local region accounts for 5% to 100% of the total area of ​​metal layer 2. This achieves an optimal balance between frequency band control precision, cost controllability, process stability, and structural compatibility, avoiding insufficient performance caused by too small a coverage area, and solving problems such as high cost, difficult process, and poor adaptability caused by full-area coverage. To enhance the performance of mid-to-high frequency bands (such as 3.5GHz Sub-6GHz and 5GHz Wi-Fi), the dielectric layer 3 can cover 40%-60% of the metal layer 2 (focusing on areas with dense current). Through the electromagnetic field concentration effect of high-dielectric materials, the efficiency of this frequency band can be improved by 8%-15%, and the frequency band offset can be precisely controlled within 0.1-0.3GHz, avoiding excessive frequency band offset caused by full-area coverage. To ensure the stability of mid-to-low frequency bands (such as 1.8GHz LTE and 2.4GHz Wi-Fi), the coverage area can be reduced to 30%-40% (applying only to key high-frequency nodes). While optimizing high-frequency performance, the original low-frequency radiation path of the metal layer 2 is preserved, ensuring multi-band compatibility (such as simultaneously meeting the requirements of 2G / 3G / 4G / 5G) and avoiding the shielding of low-frequency signals by full-area coverage.

[0049] In some specific implementations, the substrate layer 1 is a PCB substrate, FPC substrate, LDS bracket substrate, or PC bracket substrate. The diverse selection of the substrate layer 1 enables the antenna device to adapt to all scenarios from planar to three-dimensional, from fixed to flexible, and from consumer electronics to industrial equipment, while taking into account performance stability, process feasibility, and cost controllability, providing a reliable carrier support for the stacked design of dielectric layer 3 and metal layer 2.

[0050] In some specific embodiments, the substrate layer includes a fourth side facing away from the metal layer, and the dielectric layer 3 is disposed on the fourth side; the substrate layer includes a first end face and a second end face located at both ends of the substrate layer, and the dielectric layer 3 is disposed on at least one of the first end face and the second end face. The dielectric layer 3 may extend from the surface of the metal layer 2 to the back side or end face of the substrate layer 1, forming a more comprehensive high-dielectric environment, further improving the equivalent dielectric constant around the antenna radiator. According to the antenna size formula L≈ This allows for further reduction in the size of the antenna radiator at the same frequency; at the same time, by covering specific areas such as the end face with a dielectric layer, the edge field distribution of the antenna can be precisely controlled, achieving fine-tuning of the resonant frequency and radiation direction.

[0051] When the dielectric layer 3 (composite protective coating layer) is applied to the fourth and end faces of the substrate layer 1, it can form a more comprehensive protective coating on the substrate layer and the metal layer 2. It can not only protect the metal layer 2 from oxidation and corrosion, but also isolate the substrate layer from environmental factors such as moisture and dust. It is especially suitable for devices that are easily affected by the environment, such as laptops and smart wearables, and significantly improves the mechanical stability and service life of the antenna.

[0052] Optionally, when the feed point, solder point and other structures are integrated on the surface of the metal layer 2, part of the dielectric layer 3 is arranged on the back or end face of the substrate layer 1. This can avoid interference between the dielectric layer 3 and the feed structure and solder area, and ensure the reliability of the antenna electrical connection. At the same time, it reduces the stacking of functional layers on the surface of the metal layer 2, reduces the overall thickness of the antenna, and is more suitable for the appearance requirements of thinner and lighter devices.

[0053] In some specific embodiments, the metal layer 2 is formed of copper or a copper-nickel-gold alloy, and the thickness D2 of the metal layer 2 satisfies: 0.01mm≤D2≤0.03mm, so as to minimize the impact of the metal layer 2 on the overall size and weight of the antenna while ensuring conductivity.

[0054] In some specific implementations, the pattern of the metal layer 2 is PIFA type, monopole type, dipole type or loop type, which can achieve precise matching of performance, spatial adaptability and functional requirements for different communication scenarios.

[0055] In some specific embodiments, a first adhesive layer and a second adhesive layer are also included; the first adhesive layer is located between the substrate layer 1 and the metal layer 2; the second adhesive layer is located between the metal layer 2 and the dielectric layer 3. The addition of the first and second adhesive layers solves the structural reliability problem of bonding between heterogeneous material layers. Specifically, the first adhesive layer can fill the microscopic gaps between the substrate layer 1 and the metal layer 2, thereby improving their peel strength; the second adhesive layer can adapt to the smooth surface of the metal layer 2 (copper) and the rough surface of the dielectric layer 3 (such as a ceramic powder coating), further improving their peel strength.

[0056] The method for manufacturing an antenna device provided in this disclosure includes the following steps: S1: Provides substrate layer 1, which is either an LDS (Laser Direct Structuring) scaffold substrate or a PC (Polycarbonate) scaffold substrate; S2: An antenna pattern is engraved on the first side of the substrate layer 1 by laser direct forming process, and a metal layer 2 is formed by chemical metal plating process. The metal layer 2 serves as the radiator. S3: A dielectric layer 3 is applied to at least a portion of the surface of the metal layer 2 using a spray coating process. The dielectric layer 3 is formed of a high-dielectric material with a relative permittivity ε. ≥10 or 7≤ε ≤40, after the ceramic powder is mixed with the antioxidant paint base, the relative permittivity of the composite protective paint layer is ≥10, while the permittivity of the ceramic powder before mixing is 7~40.

[0057] The thickness D1 of the dielectric layer 3 is controlled to satisfy 0.05mm≤D1≤1mm; preferably 0.02mm≤D1≤0.5mm is the optimal range for the process.

[0058] S4: Electrically connect the antenna device to the motherboard of the electronic device.

[0059] Using LDS or PC bracket substrates, combined with laser direct forming (LDS) technology, antenna patterns can be engraved on the surface of three-dimensional curved and irregularly shaped substrates. This breaks through the layout limitations of traditional planar PCB antennas, making it particularly suitable for the compact and irregular internal spaces of devices such as laptops and smart wearables, enabling integrated design of the antenna and housing structure. Laser engraving allows for precise control of the linewidth, outline, and position of the antenna pattern. Chemical metal plating can form a uniform and strongly adherent metal layer (such as copper / copper-nickel-gold alloy) in the activated area, avoiding problems such as side etching and poor precision in traditional etching processes. This ensures the geometric accuracy and electrical performance consistency of the antenna radiator, improving the stability of antenna impedance matching and radiation efficiency. The spray coating process allows for precise control of the dielectric layer thickness (0.02mm≤D1≤0.5mm) and coverage area, combined with the relative permittivity ε High dielectric materials with a dielectric constant of ≥10 can effectively improve the equivalent dielectric constant of the antenna, thereby significantly shortening the physical length of the antenna radiator at the same operating frequency and achieving miniaturization. At the same time, the dielectric layer with controllable thickness can precisely tune the resonant frequency, avoiding the increased loss caused by an excessively thick coating or the insufficient tuning caused by an excessively thin coating.

[0060] Typically, different local regions correspond to different resonant frequency bands of an antenna. This embodiment, by coating corresponding regions with materials of different dielectric constants, allows for independent modification of the equivalent dielectric constant of each region, thereby precisely controlling the resonant frequency and radiation performance of the corresponding frequency band. For example, a high-dielectric material (εr≥15) can be coated in the mid-to-high frequency region to reduce size, while a low-dielectric material can be coated or left uncoated in the low-frequency region to avoid performance interference, achieving flexible tuning and performance optimization of multi-band antennas. Therefore, this invention allows for the spraying of materials with different dielectric constants in different local regions of the antenna, enabling independent tuning of each key frequency band.

[0061] In some specific embodiments, different local regions of the metal layer 2 correspond to different operating frequency bands of the antenna. A first high-dielectric material is applied to the first local region of the first frequency band, and its relative permittivity ε 1≥15; A second high-dielectric material is applied to the second local region of the second frequency band, with a relative permittivity ε. 2 satisfies 10≤ε 2<15, or no dielectric material is applied.

[0062] The first frequency band corresponds to the mid-to-high frequency band (2GHz-6GHz), and the second frequency band corresponds to the low frequency band (600MHz-2GHz). By using differentiated spraying of different high-dielectric materials, precise tuning of key frequency bands can be achieved, while avoiding performance interference with non-target frequency bands.

[0063] This embodiment employs a differentiated coating design, matching corresponding dielectric materials to the radiation characteristics of different frequency bands. It utilizes high-dielectric materials to achieve miniaturization in the mid-to-high frequency bands, while using relatively low-dielectric or no-dielectric materials to ensure radiation area and signal transmission efficiency in the low-frequency bands. This fundamentally avoids performance interference from non-target frequency bands, significantly improving the overall radiation efficiency, gain, and impedance matching performance of the antenna. The mid-to-high frequency bands have even higher requirements for antenna miniaturization, thus ε... High-dielectric-constant materials with a dielectric constant of 1≥15 can maximize size reduction in this frequency band, meeting the space requirements of thin and light laptops and other devices. In contrast, lower frequency bands have relatively lower miniaturization requirements; using materials with relatively low dielectric constants or omitting dielectric materials reduces the amount of high-cost, high-dielectric-constant materials used and lowers the complexity of the coating process. This differentiated configuration achieves a balance between miniaturization and cost control while ensuring multi-band antenna performance, enhancing the product's market competitiveness and practical value.

[0064] In some specific embodiments, step S3, the preparation of dielectric layer 3 includes: S30: grinding high dielectric ceramic material into powder, the relative permittivity of the high dielectric ceramic powder being 7-40; S31: adding the high dielectric ceramic powder into anti-oxidation paint and stirring evenly to form a composite protective paint; S32: spraying the composite protective paint onto the surface of metal layer 2, and after curing, forming dielectric layer 3 that has both anti-oxidation and high dielectric functions.

[0065] In step S31 above, high dielectric ceramic powder is added to the anti-oxidation paint and mixed by weight percentage to form a composite protective paint containing 45% epoxy resin, 35% alumina, 11% dipropylene glycol methyl ether, 6% hardener, 1% defoamer, and 2% fumed silica, and stirred evenly.

[0066] In some specific embodiments, the composite protective paint is a two-component type, comprising a main agent L45CT10 and a hardener H43b, wherein the mixing ratio of the main agent to the hardener is (90~97):(5~7). Preferably, the mixing ratio of the main agent to the hardener is 94:6.

[0067] In some specific embodiments, high-dielectric ceramic powder is uniformly dispersed in an anti-oxidation varnish base after grinding. The particle size range of the high-dielectric ceramic powder is 100nm-10μm, and the mass percentage of the high-dielectric ceramic powder in the composite protective varnish layer is 10%-60%. The curing temperature is 80℃-120℃, and the curing time is 10min-60min. Using the above preparation steps, the high-dielectric ceramic powder and anti-oxidation varnish are mixed to form a composite protective varnish, which is then sprayed and cured. This results in a dielectric layer that simultaneously possesses the dual functions of high-dielectric tuning and anti-oxidation protection. While achieving antenna miniaturization and precise resonant frequency control, it effectively protects the metal radiator from oxidation and corrosion, improving antenna reliability and lifespan. Furthermore, the process is simple, and the coating is uniform and controllable, which is beneficial for mass production and reduces manufacturing costs.

[0068] In some specific embodiments, the spraying process is pneumatic spraying or electrostatic spraying. During the spraying process, the substrate temperature is controlled at 40℃-80℃, and after spraying, it is dried and cured at 80℃-120℃, so that the dielectric layer 3 and the metal layer 2 are tightly bonded and free of pinholes and bubbles. By using pneumatic spraying or electrostatic spraying and controlling the substrate temperature at 40℃-80℃ and the curing temperature at 80℃-120℃, the dielectric layer coating can be made uniform and dense, free of pinholes and bubbles, and firmly bonded to the metal layer. This ensures stable dielectric performance and good impedance matching consistency of the antenna, while improving the reliability and service life of the antenna structure.

[0069] The electronic device provided in this disclosure includes the antenna device provided in this disclosure. Since the electronic device and the antenna device provided in this disclosure have the same advantages, they will not be described again here.

[0070] The experimental results of the antenna device provided in this embodiment are as follows: Figure 5 As shown. This is a 5G WWAN antenna design, featuring antenna resonant modes in low, mid, and high frequency bands. Figure 5 Analysis reveals a significant change in antenna performance between the original frequency band curve (line a) and the antenna after applying a high-dielectric material to a localized area. The dashed box (line d) shows a clear shift in antenna performance from mid-to-high frequency bands to lower frequencies after applying dielectric layer 3. This result perfectly aligns with the theory that antenna wavelengths differ between those using ordinary and high-dielectric materials.

[0071] Results of this experiment Figure 5 It has been found that the method of locally spraying differentiated high-dielectric composite protective coatings can effectively improve the problems caused by insufficient system space in metal ring antennas. Antenna efficiency can be adjusted according to the required frequency band, significantly improving the success rate of antenna communication system certification, thereby achieving the company's goal of reducing costs through technology.

[0072] The experimental results show that applying coatings filled with ceramic or other high-dielectric materials to the antenna area can effectively change the antenna's frequency band efficiency. With a fixed antenna size, the antenna wavelength can be increased, allowing the same size antenna to be used in a lower frequency band. This is a new type of antenna composite design architecture.

[0073] In the antenna device provided in this embodiment, the dielectric layer 3 coating material can be mixed with ceramic or other high-dielectric materials. One or more ceramic or other high-dielectric materials can be used to form the dielectric layer 3. Coating can be performed in one or more different antenna design areas, and adjustments can be made according to the required frequency band. The antenna device can be designed as a PIFA, monopole, dipole, loop, etc. The antenna device can be applied to WIFI-7, LTE, 5G, millimeter wave, GPS, and other frequency bands.

[0074] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this invention disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this disclosure can be achieved, and this is not limited herein.

[0075] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means two or more, unless otherwise explicitly specified.

[0076] The above are merely specific embodiments of this disclosure, but the scope of protection of this patent is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An antenna device, characterized in that, include: Substrate layer (1); The metal layer (2), located on the first side of the substrate layer (1), serves as a radiator to emit or receive wireless signals; A dielectric layer (3) is disposed on the metal layer (2); The dielectric layer (3) is a composite protective coating layer, which is composed of an antioxidant coating base and a high-dielectric ceramic powder. The high-dielectric ceramic powder has a relative permittivity ε. Satisfy: 7≤ε ≤40.

2. The antenna device according to claim 1, characterized in that, The high-dielectric ceramic powder includes at least one of titanium oxide, aluminum oxide, hafnium oxide, zirconium oxide, silicon nitride, yttrium oxide, and tantalum oxide.

3. The antenna device according to claim 1, characterized in that, The substrate layer includes a fourth side facing away from the metal layer, and the dielectric layer (3) is disposed on the fourth side; And / or, the substrate layer includes a first end face and a second end face located at both ends of the substrate layer, and the dielectric layer (3) is disposed on at least one of the first end face and the second end face.

4. The antenna device according to claim 1, characterized in that, The dielectric layer (3) includes a second side facing the substrate layer (1) and a third side away from the substrate layer. The second side and the third side are disposed opposite to each other, and the thickness D1 between the second side and the third side satisfies: 0.05mm≤D1≤1mm.

5. The antenna device according to claim 1, characterized in that, The dielectric layer (3) covers a local area of ​​the metal layer (2), and the local area is the radiation area corresponding to the mid-to-high frequency band operation of the antenna; The area of ​​the local region accounts for 5% to 100% of the total area of ​​the metal layer (2).

6. The antenna device according to claim 1, characterized in that, The substrate layer (1) includes one of PCB substrate, FPC substrate, LDS bracket substrate and PC bracket substrate.

7. The antenna device according to claim 1, characterized in that, The metal layer (2) is formed of copper or copper-nickel-gold alloy, and the thickness D2 of the metal layer (2) satisfies: 0.01mm≤D2≤0.03mm.

8. The antenna device according to claim 1, characterized in that, The shape of the metal layer (2) includes PIFA type, monopole type, dipole type or loop type.

9. A method for manufacturing an antenna device as described in any one of claims 1 to 8, characterized in that, Includes the following steps: A substrate layer (1) is provided, wherein the substrate layer (1) is an LDS support substrate or a PC support substrate; The antenna pattern is engraved on the first side of the substrate layer (1) by laser direct forming process, and a metal layer (2) is formed by chemical plating process, the metal layer (2) serving as a radiator; A dielectric layer (3) is applied to at least a portion of the surface of the metal layer (2) using a spray coating process. The dielectric layer (3) is formed of a high-dielectric material with a relative permittivity ε. ≥10, the thickness D1 of the dielectric layer (3) is controlled to satisfy 0.05mm≤D1≤1mm; The antenna device is electrically connected to the motherboard of the electronic device.

10. The method for processing the antenna device according to claim 9, characterized in that, Different local regions of the metal layer (2) correspond to different operating frequency bands of the antenna, wherein: A first high-dielectric material is applied to a first local region of the first frequency band, with a relative permittivity ε. 1≥15; A second high-dielectric material is applied to a second local region of the second frequency band, with a relative permittivity ε. 2 satisfies 10≤ε 2<15, or no dielectric material is applied.

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