Automatic hot air separation and de-soldering device and process for electronic components

Abstract

This invention discloses an automated hot air separation and desoldering device and process for electronic components, relating to the field of electronic component recycling and repair technology. It includes a frame, a control system, a conveying mechanism, a vision positioning system, a multi-axis motion mechanism, a hot air desoldering head assembly, and a component pickup mechanism. The conveying mechanism, located on the frame, transports the circuit board to be processed to the target station. The vision positioning system, located above the conveying mechanism and electrically connected to the control system, identifies the location and package type of the target component. The multi-axis motion platform is on the frame and above the conveying mechanism. The hot air desoldering head assembly is mounted on the output end of the multi-axis motion mechanism, which moves it to the corresponding position of the target component to be desoldered, heating the solder joint to melt the solder and complete the desoldering. The component pickup mechanism, mounted on the output end of the multi-axis motion mechanism and linked to the hot air desoldering head assembly, separates and picks up the desoldered target component, improving desoldering efficiency, recycling yield, and enhancing the automation of the desoldering process.

Description

Technical Field

[0001] This invention relates to the field of electronic component recycling and repair technology, and in particular to an automated hot air separation and desoldering device and process for electronic components. Background Technology

[0002] With the rapid pace of technological advancements in electronic products, the disposal of waste circuit boards has become a crucial research topic in environmental protection and resource recycling. Circuit boards integrate a large number of recyclable electronic components, such as chips, capacitors, and connectors. Currently, common methods for disassembling components from circuit boards include manual hot air heating, infrared heating, and integrated heating furnace heating.

[0003] There are many drawbacks to using hot air guns manually. First, it is inefficient, as manual operation is slow and cannot meet the needs of large-scale recycling. Second, temperature control is unstable, and it is difficult to accurately control the heating temperature manually, which can easily lead to excessively high or low temperatures. Third, this method can easily damage components and substrates, thereby reducing the yield of recycled components.

[0004] While integrated heating furnaces can process large numbers of circuit boards at once, their energy consumption is too high, resulting in high costs from both an economic and environmental perspective. Furthermore, integrated heating furnaces heat all components indiscriminately, failing to selectively recycle high-value components, which contributes to resource waste.

[0005] Therefore, there is an urgent need to develop a desoldering device and process that can achieve automation, precise positioning, high efficiency, and minimal damage to components, in order to solve the problems existing in the current technology and meet the demand for efficient and high-quality recycling of electronic components in the process of waste circuit board processing. Summary of the Invention

[0006] The purpose of this invention is to provide an automated hot air separation and desoldering device and process for electronic components, so as to solve the problems existing in the prior art, effectively improve desoldering efficiency, effectively increase the recycling yield, and effectively enhance the automation of the entire desoldering process.

[0007] To achieve the above objectives, the present invention provides the following solution: This invention provides an automated hot air separation and desoldering device for electronic components, including a frame, a control system, a conveying mechanism, a vision positioning system, a multi-axis motion mechanism, a hot air desoldering head assembly, and a component pickup mechanism. The conveying mechanism is mounted on the frame and is used to transport the circuit board to be processed to the target station. The vision positioning system is located above the conveying mechanism and is electrically connected to the control system, used to identify the position and package type of the target component. The multi-axis motion platform is mounted on the frame and located above the conveying mechanism. The hot air desoldering head assembly is mounted at the output end of the multi-axis motion mechanism and is driven by the multi-axis motion mechanism to move to the corresponding position of the target component to be desoldered, and heats the solder joint at a fixed point to fully melt the solder and complete the desoldering. The component pickup mechanism is mounted at the output end of the multi-axis motion mechanism and is linked to the hot air desoldering head assembly, used to separate and remove the desoldered target component.

[0008] Preferably, the hot air desoldering head assembly includes a heating component, a hot air nozzle, a temperature sensor, and a distance sensor. The heating component is fixedly connected to the output end of the multi-axis motion mechanism and electrically connected to the control system. One end of the heating component is connected to and communicates with a compressed air source to heat the incoming compressed air, forming hot air that meets the desoldering temperature requirements. The hot air nozzle is connected to and communicates with the end of the heating component away from the compressed air source, delivering the hot air that meets the desoldering temperature requirements to the target component. The temperature sensor is installed at the outlet end of the hot air nozzle and electrically connected to the control system to detect the hot air temperature in real time and provide feedback to the control system to adjust the heating power, ensuring that the hot air temperature remains stable within a preset range. The distance sensor is located on the side of the hot air nozzle and electrically connected to the control system to detect the distance between the outlet end of the hot air nozzle and the surface of the target component to be desoldered, and provide feedback to the control system to adjust the position, ensuring that the hot air action distance meets the process requirements. The shape of the outlet end of the hot air nozzle matches the package shape of the target component.

[0009] Preferably, the hot air nozzle has a quick-change structure and is equipped with corresponding conformal nozzles for different package types such as SOP, QFP, and BGA.

[0010] Preferably, the hot air desoldering head assembly further includes a local preheating ring, which is arranged around the hot air nozzle and electrically connected to the control system for preheating the area around the target component on the circuit board.

[0011] Preferably, the component picking mechanism is a vacuum nozzle or a miniature gripper, and has a built-in temperature detection module or force sensor to confirm the melting of solder and the detachment of the target component.

[0012] Preferably, the conveying mechanism is a high-temperature resistant conveyor belt driven by a stepper motor.

[0013] Preferably, the multi-axis motion platform is an XYZ Cartesian coordinate robot structure.

[0014] The present invention also provides an automated hot air separation and desoldering process based on the automated hot air separation and desoldering device for electronic components as described in any of the preceding claims, comprising the following steps: S1. Loading and Positioning: Obtain circuit board images through a vision positioning system to identify the location and package type of target components; S2. Nozzle matching: Select a hot air nozzle of the corresponding shape based on the recognition result; S3. Moving Alignment: The multi-axis motion mechanism drives the hot air desoldering head assembly to move above the target component, and the distance sensor controls the heating spacing; S4. Segmented heating: Preheating, heating up to melt, and holding the temperature are carried out sequentially according to the preset temperature curve; S5. Solder joint status detection: Real-time determination of whether the solder has completely melted through a vision system or sensor of the pickup mechanism; S6. Component Separation: After confirming that the solder has melted, the picking mechanism separates the target component from the circuit board.

[0015] Preferably, in step S4, the preset temperature curve is dynamically adjusted according to the solder composition and the heat sensitivity of the target component. During the segmented heating process in step S4, the hot air desoldering head assembly and the circuit board maintain relative horizontal micro-movement to promote uniform heating of the solder joints.

[0016] Preferably, in step S5, the method for determining that the solder is completely melted includes: the vision system continuously observing the gloss change of the solder joint, and the temperature detection module or force sensor built into the pickup mechanism providing real-time feedback information to comprehensively determine the solder melting state.

[0017] The present invention achieves the following technical effects compared to the prior art: This invention provides an automated hot air separation and desoldering device and process for electronic components. By automatically identifying the location and package type of the target component through a visual positioning system, it achieves precise point-to-point heating and desoldering, avoiding additional thermal damage to non-target areas and components caused by traditional methods, effectively improving the yield of recycled components. Simultaneously, the automated structural design and process flow replace manual operation, significantly improving the processing efficiency of desoldering and disassembling waste circuit board components, adapting to the needs of large-scale recycling. Furthermore, by equipping components with matching contoured hot air nozzles for different packages, combined with real-time temperature control, distance adjustment, and solder joint melting status detection, it ensures precise temperature and stable operation during the desoldering process. While achieving selective desoldering and recycling of high-value components, it effectively reduces energy consumption compared to a general heating furnace, balancing economic benefits and environmental requirements. It solves the pain points of low efficiency, high damage rate, and high energy consumption in existing desoldering technologies, and can well meet the practical needs of the electronic component recycling and repair field. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of the structure of the automated hot air separation and desoldering device and process for electronic components provided by the present invention; Figure 2 This is a schematic diagram of the hot air desoldering head assembly in the automated hot air separation and desoldering device for electronic components provided by the present invention. Figure 3 A flowchart of the automated hot air separation and desoldering process for electronic components provided by the present invention; In the diagram: 1. Frame; 2. Control system; 3. Conveying mechanism; 4. Vision positioning system; 5. Multi-axis motion mechanism; 6. Hot air desoldering head assembly; 61. Hot air nozzle; 62. Heating assembly; 63. Local preheating ring; 7. Component picking mechanism; 8. Circuit board. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] The purpose of this invention is to provide an automated hot air separation and desoldering device and process for electronic components, so as to solve the problems existing in the prior art, effectively improve desoldering efficiency, effectively increase the recycling yield, and effectively enhance the automation of the entire desoldering process.

[0022] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] Example 1 This embodiment provides an automated hot air separation and desoldering device for electronic components, such as... Figures 1-2 As shown, the system includes a frame 1, a control system 2, a conveying mechanism 3, a vision positioning system 4, a multi-axis motion mechanism 5, a hot air desoldering head assembly 6, and a component pickup mechanism 7. The conveying mechanism 3 is mounted on the frame 1 and is used to transport the circuit board 8 to be processed to the target station. The vision positioning system 4 is located above the conveying mechanism 3 and is electrically connected to the control system 2. It is used to identify the position and package type of the target component. The multi-axis motion platform is mounted on the frame 1 and is located above the conveying mechanism 3. The hot air desoldering head assembly 6 is mounted at the output end of the multi-axis motion mechanism 5 and is moved by the multi-axis motion mechanism 5 to the corresponding position of the target component to be desoldered. It heats the solder joint at a fixed point to fully melt the solder and complete the desoldering. The component pickup mechanism 7 is mounted at the output end of the multi-axis motion mechanism 5 and is linked with the hot air desoldering head assembly 6. It is used to separate and remove the desoldered target component. Through the coordinated setting of each mechanism, the desoldering process of electronic components is automated. The conveying mechanism 3 ensures stable transport of the circuit board 8, the vision positioning system 4 provides accurate position information, the multi-axis motion mechanism 5 achieves precise positioning of the hot air desoldering head assembly 6 and the component picking mechanism 7, the hot air desoldering head assembly 6 completes fixed-point heating and desoldering, and the component picking mechanism 7 realizes the separation and removal of desoldered components. The entire device can efficiently and accurately complete the separation of electronic components from the circuit board 8, improving the efficiency and quality of the desoldering work.

[0024] In a preferred embodiment, the hot air desoldering head assembly 6 includes a heating assembly 62, a hot air nozzle 61, a temperature sensor, and a distance sensor. The heating assembly 62 is fixedly connected to the output end of the multi-axis motion mechanism 5 and electrically connected to the control system 2. One end of the heating assembly 62 is connected to and communicates with a compressed air source to heat the incoming compressed air, forming hot air that meets the desoldering temperature requirements. The hot air nozzle 61 is connected to and communicates with the end of the heating assembly 62 away from the compressed air source, and delivers the hot air that meets the desoldering temperature requirements to the target component. The temperature sensor is installed at the outlet end of the hot air nozzle 61 and communicates with the control system 2. System 2 is electrically connected to monitor the hot air temperature in real time and feeds it back to control system 2 to adjust the heating power, ensuring the hot air temperature remains stable within a preset range. A distance sensor, located on the side of the hot air nozzle 61 and electrically connected to control system 2, monitors the distance between the outlet of the hot air nozzle 61 and the surface of the target component to be desoldered, and feeds it back to control system 2 to adjust its position, ensuring the hot air contact distance meets process requirements. The shape of the outlet of the hot air nozzle 61 matches the package shape of the target component. The cooperation of the heating assembly 62, temperature sensor, and distance sensor with the hot air nozzle 61 achieves precise control of the hot air temperature and contact distance. The temperature sensor monitors and feeds back the temperature in real time, enabling control system 2 to adjust the heating power promptly, ensuring stable hot air temperature and preventing damage to the component due to excessively high or low temperatures. The distance sensor ensures that the hot air nozzle 61 maintains a suitable distance from the component, improving heating efficiency and enhancing the stability and reliability of desoldering. The matching of the outlet of the hot air nozzle 61 with the component package shape allows for precise heating of the solder joints, reducing the thermal impact on surrounding areas.

[0025] In a preferred embodiment, the hot air nozzle 61 is a quick-changeable structure, and corresponding contour nozzles are provided for different package types such as SOP, QFP, and BGA. This quick-change contour nozzle design allows the device to adapt to the desoldering needs of electronic components with various package types. Equipping different package types with corresponding nozzles further optimizes the heating area, ensuring precise heating of components in each package, improving desoldering efficiency and success rate, while reducing thermal damage to adjacent components and the circuit board 8, thus enhancing the versatility and flexibility of the device.

[0026] In a preferred embodiment, the hot air desoldering head assembly 6 further includes a local preheating ring 63. The local preheating ring 63 surrounds the hot air nozzle 61 and is electrically connected to the control system 2. It is used to preheat the area surrounding the target component on the circuit board 8. The local preheating ring 63 preheats the surrounding area before heating and desoldering the target component. This reduces the thermal shock to the surrounding area during heating, lowers the risk of damage to surrounding components or the circuit board 8 due to thermal stress, improves the integrity rate of surrounding components, ensures that the overall performance of the circuit board 8 is not affected, and further enhances the reliability of the desoldering process.

[0027] In a preferred embodiment, the component pickup mechanism 7 is a vacuum nozzle or a miniature gripper, with a built-in temperature detection module or force sensor to confirm solder melting and the detachment status of the target component. The vacuum nozzle or miniature gripper, as the component pickup mechanism 7, can flexibly and effectively pick up detached components. The built-in temperature detection module or force sensor provides real-time feedback to help accurately determine whether the solder has completely melted and whether the component has successfully detached from the circuit board 8. The temperature detection module determines the solder state by sensing temperature changes, while the force sensor confirms whether the component has detached based on the force applied during pickup, ensuring pickup at the appropriate time, improving the accuracy and success rate of component pickup, and reducing component damage caused by premature or delayed pickup.

[0028] In a preferred embodiment, the conveying mechanism 3 is a high-temperature resistant conveyor belt driven by a stepper motor. This high-temperature resistant conveyor belt can precisely control the conveying position and speed of the circuit board 8, meeting the positioning accuracy requirements of the desoldering process. The high-temperature resistance ensures that the conveyor belt will not deform or be damaged due to the hot air temperature during the desoldering process, guaranteeing the stability and reliability of the conveying mechanism 3 and providing a fundamental guarantee for the smooth progress of the entire desoldering process.

[0029] In a preferred embodiment, the multi-axis motion platform is an XYZ Cartesian coordinate robot structure. This multi-axis motion platform possesses high-precision positioning capabilities, enabling precise movement of the hot air desoldering head assembly 6 and the component pickup mechanism 7 in three dimensions. This allows for accurate positioning and manipulation of target components at different locations and heights. This structure offers simple motion control and high positioning accuracy, effectively improving the working efficiency and accuracy of the desoldering device and meeting the stringent positional accuracy requirements for automated desoldering of electronic components.

[0030] In a preferred embodiment, the visual positioning system 4 includes a CCD camera and a matching light source. The CCD camera can clearly capture images of the circuit board 8 to be processed, and the matching light source can provide stable and uniform illumination, eliminate ambient light interference, and ensure the clarity of the captured images. This improves the accuracy of target component location identification and package type judgment, providing a precise position information basis for subsequent desoldering operations and ensuring accurate positioning throughout the desoldering process.

[0031] Example 2 This embodiment also provides an automated hot air separation and desoldering process for an automated hot air separation and desoldering device for electronic components based on any one of Embodiment 1, such as... Figure 3 As shown, it includes the following steps: 1. Equipment preparation: Installation and Connection: Ensure that the frame 1 is placed stably. Install the conveyor mechanism 3, multi-axis motion platform, and other components on the frame 1 according to the design requirements, and ensure that the connections between the components are secure. Connect the control system 2 to the vision positioning system 4, hot air desoldering head assembly 6, component pickup mechanism 7, and other equipment, ensuring that the electrical connections are correct and secure, without any looseness or short circuits.

[0032] Check component status: Conveying Mechanism 3: Check whether the high-temperature resistant conveyor belt driven by the stepper motor can operate normally, and whether there are any damages or foreign objects on the surface of the conveyor belt that may affect the conveying of circuit board 8. Test the control accuracy of the stepper motor to ensure that it can accurately deliver circuit board 8 to the target station.

[0033] Visual Positioning System 4: Turn on the visual positioning system 4 and check whether the CCD camera and its matching light source are working properly. By taking images of a standard circuit board 8, test the accuracy and stability of the visual positioning system 4 in identifying the location and package type of target components.

[0034] Hot air desoldering head assembly 6: Confirm that the hot air nozzle 61 is securely installed and that a suitable conformal nozzle has been installed for the package type of the component to be processed. Check that the heating assembly 62, temperature sensor, distance sensor, and local preheating ring 63 are functioning properly. Heating can be manually controlled by the heating assembly 62 to observe the accuracy of the temperature sensor feedback data and the accuracy of the distance sensor's detection of the distance between the hot air nozzle 61 and the simulated target. Simultaneously, test the preheating function of the local preheating ring 63.

[0035] Component Pickup Mechanism 7: If it is a vacuum nozzle, check if the vacuum generator is working properly, if the nozzle is clogged, and if the built-in temperature detection module can accurately sense temperature changes. If it is a miniature gripper, check if the gripper's opening and closing action is flexible, if the force is appropriate, and if the force sensor can accurately report the gripping force.

[0036] Multi-axis motion platform: For the multi-axis motion platform of the XYZ Cartesian coordinate robot structure, test its motion accuracy and speed in the X, Y and Z directions to ensure that it can accurately drive the hot air desoldering head assembly 6 and the component picking mechanism 7 to move to the target position.

[0037] 2. Feeding: Place the circuit board 8 to be processed smoothly on the high-temperature resistant conveyor belt of the conveying mechanism 3, ensuring that the circuit board 8 is placed upright without tilting or shifting. Start the conveying mechanism 3, and the stepper motor drives the conveyor belt to transport the circuit board 8 at a constant speed to the target station below the vision positioning system 4.

[0038] 3. Visual positioning: The CCD camera of the vision positioning system 4, in conjunction with a light source, acquires images of the circuit board 8 located at the target workstation. The acquired image data is transmitted to the control system 2, which uses a specific algorithm to identify information such as the location, package type, and solder joint distribution of the target components. This information will serve as the basis for the subsequent actions of the multi-axis motion platform and the hot air desoldering head assembly 6.

[0039] 4. Nozzle matching and installation: Based on the target component package type identified by the vision positioning system 4, the control system 2 prompts the operator to replace the hot air nozzle 61 with the corresponding contour nozzle if the currently installed hot air nozzle 61 does not match the target component. The operator can easily replace the appropriate nozzle using the quick-change mechanism of the hot air nozzle 61, ensuring that the hot air is precisely applied to the solder joints of the target component.

[0040] 5. Move and align: The multi-axis motion platform moves precisely in the X, Y, and Z directions according to the commands issued by the control system 2. This moves the hot air desoldering head assembly 6, installed at its output end, directly above the target component to be desoldered. During the movement, a distance sensor on the side of the hot air desoldering head assembly 6 continuously monitors the distance between the outlet of the hot air nozzle 61 and the surface of the target component, feeding this distance information back to the multi-axis motion platform. The multi-axis motion platform then fine-tunes its position based on the feedback information, ensuring that the distance between the outlet of the hot air nozzle 61 and the surface of the target component meets the preset process requirements, guaranteeing precise hot air application distance.

[0041] 6. Heating to remove solder: Preheating Phase: Control system 2 activates the local preheating ring 63 of the hot air desoldering head assembly 6 to preheat the area surrounding the target components on the circuit board 8. Simultaneously, heating assembly 62 begins heating the incoming compressed air, and a temperature sensor monitors the hot air temperature in real time, feeding the temperature data back to control system 2. Control system 2 adjusts the heating power of heating assembly 62 based on the feedback temperature, gradually raising the hot air temperature to the preheating temperature and maintaining it stable.

[0042] During the heating and soldering stage: After preheating, the control system 2 increases the heating power of the heating component 62 according to the preset heating rate, so that the hot air temperature rises rapidly to a temperature that allows the solder to melt fully. During this process, the temperature sensor continuously monitors the hot air temperature to ensure that the temperature remains stable within the preset soldering temperature range, ensuring that the solder melts smoothly.

[0043] Heat preservation stage: When the solder reaches the melting state, the control system 2 controls the heating component 62 to maintain the current heating power, so that the hot air temperature is maintained at the melting temperature for a certain period of time, ensuring that the solder at the solder joint is fully melted, and preparing for the separation of components.

[0044] 7. Solder joint condition inspection and component separation: Detection: During the heating process, on one hand, the vision positioning system 4 continuously observes the state of the solder joints, such as changes in gloss, to determine the degree of solder melting. On the other hand, the temperature detection module or force sensor built into the component pickup mechanism 7 also works in real time. If it is a temperature detection module, when the temperature of the target component reaches a certain value and remains stable, it indicates that the solder has melted; if it is a force sensor, when the pickup mechanism contacts the target component, it determines whether the component has detached from the circuit board 8 by sensing the change in resistance during pickup.

[0045] Separation: When the solder is confirmed to be completely melted and the component can be separated through the above-mentioned detection methods, the control system 2 drives the component pickup mechanism 7, which is linked to the hot air desoldering head assembly 6, to operate. If it is a vacuum nozzle, the vacuum generator is activated, and the nozzle descends to a suitable position above the target component to pick up the component; if it is a miniature gripper, the gripper descends and accurately clamps the target component. Then, the pickup mechanism separates the component from the circuit board 8 in a vertical direction or with slight rotation, avoiding damage to the component and the circuit board 8.

[0046] 8. Transfer and Cooling: The component pickup mechanism 7 transfers the separated target components to a recycling tray or a designated cooling area. If in a cooling area, the components can be locally cooled using air cooling or other cooling methods to ensure that the component performance is not affected by high temperatures.

[0047] 9. Looping operation: After the desoldering, picking and transferring of one target component is completed, the conveying mechanism 3 moves the circuit board 8 to the visual positioning position of the next target component, and repeats steps 3 to 8 until the desoldering and separation of all target components on the circuit board 8 is completed.

[0048] 10. Equipment maintenance and cleaning: After work is completed, turn off the equipment power. Clean debris and dust from the conveyor belt, and check the hot air nozzles 61 for blockages or damage; clean or replace them promptly if necessary. Perform regular maintenance on all equipment components, such as lubricating the guide rails of the multi-axis motion platform and checking the accuracy of each sensor, to ensure the equipment can operate normally the next time it is used.

[0049] Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this invention. Furthermore, those skilled in the art will recognize that, based on the ideas of this invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this invention.

Claims

1. An automated hot air separation and desoldering device for electronic components, characterized in that: The system includes a frame, a control system, a conveying mechanism, a vision positioning system, a multi-axis motion mechanism, a hot air desoldering head assembly, and a component pickup mechanism. The conveying mechanism, mounted on the frame, transports the circuit board to be processed to the target workstation. The vision positioning system, positioned above the conveying mechanism and electrically connected to the control system, identifies the position and package type of the target component. The multi-axis motion platform is mounted on the frame and positioned above the conveying mechanism. The hot air desoldering head assembly is mounted at the output end of the multi-axis motion mechanism, moving to the corresponding position of the target component to be desoldered, and heating the solder joint to fully melt the solder and complete the desoldering process. The component pickup mechanism, mounted at the output end of the multi-axis motion mechanism and linked to the hot air desoldering head assembly, separates and removes the desoldered target component.

2. The automated hot air separation and desoldering device for electronic components according to claim 1, characterized in that: The hot air desoldering head assembly includes a heating component, a hot air nozzle, a temperature sensor, and a distance sensor. The heating component is fixedly connected to the output end of the multi-axis motion mechanism and electrically connected to the control system. One end of the heating component is connected to and communicates with a compressed air source to heat the incoming compressed air, forming hot air that meets the desoldering temperature requirements. The hot air nozzle is connected to and communicates with the end of the heating component away from the compressed air source, delivering the hot air that meets the desoldering temperature requirements to the target component. The temperature sensor is installed at the outlet end of the hot air nozzle and electrically connected to the control system to detect the hot air temperature in real time and provide feedback to the control system to adjust the heating power, ensuring that the hot air temperature remains stable within a preset range. The distance sensor is located on the side of the hot air nozzle and electrically connected to the control system to detect the distance between the outlet end of the hot air nozzle and the surface of the target component to be desoldered, and provide feedback to the control system to adjust the position, ensuring that the hot air action distance meets the process requirements. The shape of the outlet end of the hot air nozzle matches the package shape of the target component.

3. The automated hot air separation and desoldering device for electronic components according to claim 2, characterized in that: The hot air nozzle has a quick-change structure and is equipped with corresponding conformal nozzles for different package types such as SOP, QFP, and BGA.

4. The automated hot air separation and desoldering device for electronic components according to claim 3, characterized in that: The hot air desoldering head assembly also includes a local preheating ring, which surrounds the hot air nozzle and is electrically connected to the control system for preheating the area around the target component on the circuit board.

5. The automated hot air separation and desoldering device for electronic components according to claim 1, characterized in that: The component pickup mechanism is a vacuum nozzle or a miniature gripper, and has a built-in temperature detection module or force sensor to confirm the melting of solder and the detachment of the target component.

6. The automated hot air separation and desoldering device for electronic components according to claim 1, characterized in that: The conveying mechanism is a high-temperature resistant conveyor belt driven by a stepper motor.

7. The automated hot air separation and desoldering device for electronic components according to claim 6, characterized in that: The multi-axis motion platform is an XYZ Cartesian coordinate robot structure.

8. An automated hot air separation and desoldering process based on the automated hot air separation and desoldering device for electronic components according to any one of claims 1 to 7, characterized in that: Includes the following steps: S1. Loading and Positioning: Obtain circuit board images through a vision positioning system to identify the location and package type of target components; S2. Nozzle matching: Select a hot air nozzle of the corresponding shape based on the recognition result; S3. Moving Alignment: The multi-axis motion mechanism drives the hot air desoldering head assembly to move above the target component, and the distance sensor controls the heating spacing; S4. Segmented heating: Preheating, heating up to melt, and holding the temperature are carried out sequentially according to the preset temperature curve; S5. Solder joint status detection: Real-time determination of whether the solder has completely melted through a vision system or sensor of the pickup mechanism; S6. Component Separation: After confirming that the solder has melted, the picking mechanism separates the target component from the circuit board.

9. The automated hot air separation and desoldering device for electronic components according to claim 8, characterized in that: In step S4, the preset temperature curve is dynamically adjusted according to the solder composition and the heat sensitivity of the target component. During the segmented heating process in step S4, the hot air desoldering head assembly and the circuit board maintain relative horizontal micro-movement to promote uniform heating of the solder joints.

10. The automated hot air separation and desoldering device for electronic components according to claim 9, characterized in that: In step S5, the methods for determining that the solder is completely melted include: the vision system continuously observing the changes in the gloss of the solder joint, and the real-time feedback information from the temperature detection module or force sensor built into the pickup mechanism, to comprehensively determine the melting state of the solder.

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