Intelligent control device and method for self-checking and early warning of vacuum state of mechanical arm

Abstract

The application discloses an intelligent control device and method for self-checking and early warning of a mechanical arm vacuum state, and belongs to the technical field of semiconductor manufacturing equipment. The device comprises: a carrying mechanism, a vacuum adsorption circuit integrated on the mechanical arm of the carrying mechanism, the vacuum adsorption circuit comprising a vacuum adsorption end, a vacuum generator and a vacuum pressure sensor; a vacuum self-checking unit platform, the platform being used for positioning and placing a standard wafer and providing a constant physical reference surface for the vacuum adsorption end when the mechanical arm moves to the platform to perform an adsorption action; and a controller, which is in communication connection with a motor servo driver, the vacuum generator and the vacuum pressure sensor, and is configured to dynamically update a vacuum alarm threshold value in a normal production process based on a load vacuum self-checking value acquired at the self-checking platform, and to give an early warning when a real-time value does not reach the threshold value. The device excludes the interference of external production variables, solves the false alarm problem caused by a fixed threshold value by dynamically updating the threshold value, and realizes accurate and adaptive preventive diagnosis of the real sealing state of the vacuum circuit.

Description

Technical Field

[0001] This invention relates to the technical field of semiconductor manufacturing equipment, and in particular to an intelligent control device and method for self-inspection and early warning of vacuum status of a robotic arm. Background Technology

[0002] In semiconductor manufacturing processes, robotic arms often utilize vacuum suction to move wafers between various process units such as Heat Plate, Cooling Plate, Coat, Develop, and Cassette. The stability of the vacuum suction directly determines the safety of wafer transfer and the continuity of production. If the vacuum suction is unstable, the wafer cannot be stably and securely fixed on the robotic arm. During high-speed movement and start-up / stop of the device, the wafer is prone to displacement, and there is even a serious risk of it falling and breaking. At the same time, inaccurate wafer transfer to the unit position will seriously affect the uniformity of subsequent coating and the accuracy of edge washing, thus adversely affecting the wafer processing quality and ultimately reducing the performance and yield of semiconductor devices.

[0003] Currently, existing vacuum status monitoring and alarm mechanisms for robotic arms are typically implemented passively during the actual wafer handling or placement process, and often use fixed vacuum alarm thresholds. This existing technology has the following significant drawbacks: First, the pneumatic hardware of robotic arms (such as vacuum suction cups and tubing) will naturally age and experience micro-wear during long-term, high-frequency operation. Existing detection methods use manually set fixed thresholds, which cannot adapt to the physical decay of the hardware. This can easily lead to overly strict thresholds, causing frequent false alarms of vacuum anomalies, or overly broad thresholds, resulting in missed alarms.

[0004] Secondly, directly monitoring vacuum levels during the actual production cycle is susceptible to interference from numerous uncontrollable external production variables (such as minor deformations and surface contamination of wafers produced in different batches). When the system triggers a vacuum anomaly alarm due to a fixed threshold, it is difficult to accurately distinguish whether the problem is due to air leakage in the robotic arm's own piping, hardware aging, or simply poor bonding caused by uneven wafers. The combination of a fixed threshold and external interference makes it highly prone to misjudgments and false alarms regarding vacuum faults, severely impacting equipment uptime (OEE) and making it impossible to perform accurate, adaptive, preventative diagnosis of the robotic arm's vacuum health status before a fatal failure occurs. Summary of the Invention

[0005] To address the technical problem that existing technologies for monitoring the vacuum status of robotic arms use fixed alarm thresholds, which cannot adapt to the aging of pneumatic hardware and are easily affected by external production variables, thus frequently triggering false alarms of vacuum anomalies and making it impossible to accurately diagnose the true sealing status of the vacuum adsorption circuit of the robotic arm, this invention provides an intelligent control device and method for self-inspection and early warning of the vacuum status of a robotic arm.

[0006] According to a first aspect of the present invention, an intelligent control device for self-checking and early warning of vacuum status of a robotic arm is provided, comprising: The conveying mechanism includes a motor servo driver and a robotic arm driven by the motor servo driver; the robotic arm integrates a vacuum adsorption circuit, which includes a vacuum adsorption end located at the end of the robotic arm, a vacuum generator connected to the vacuum adsorption end, and a vacuum pressure sensor connected to the vacuum adsorption circuit and used to acquire vacuum detection values. The vacuum self-test unit platform has a standard wafer positioned on it. The standard wafer is used to provide a constant physical reference surface for the vacuum adsorption end when the robotic arm moves to the vacuum self-test unit platform to perform the adsorption action, so as to cooperate with the vacuum pressure sensor to obtain the load vacuum self-test value reflecting the sealing status of the vacuum adsorption circuit. The controller is communicatively connected to the motor servo driver, vacuum generator, and vacuum pressure sensor. The controller is configured to dynamically update the vacuum alarm threshold for the robotic arm during normal wafer handling based on the load vacuum self-test value obtained at the vacuum self-test unit platform. If the real-time vacuum detection value obtained during normal wafer handling by the robotic arm does not reach the vacuum alarm threshold, a vacuum abnormality warning signal is triggered.

[0007] In some specific embodiments, the robotic arm includes a multi-axis motion mechanism, specifically comprising: a horizontal telescopic shaft with a vacuum adsorption end fixed to the front end of the horizontal telescopic shaft; a lifting shaft, which is drivenly connected to the horizontal telescopic shaft and is used to drive the horizontal telescopic shaft to lift; and a rotating shaft, which is drivenly connected to the lifting shaft and is used to drive the lifting shaft and the horizontal telescopic shaft to rotate as a whole. The multi-axis motion mechanism also includes servo motors that correspond one-to-one with and are drivenly connected to the horizontal telescopic shaft, the lifting shaft, and the rotating shaft, respectively. The motor servo drivers include a horizontal servo driver, a lifting servo driver, and a rotating servo driver that are electrically connected to each servo motor, respectively.

[0008] In some specific embodiments, the vacuum self-test unit platform includes a bottom base and a support component protruding from the top surface of the bottom base; The top of the support component is used to support the standard wafer, so that a clearance space is formed between the bottom surface of the standard wafer and the top surface of the bottom base, allowing the vacuum adsorption end to extend directly under the standard wafer in the unadsorbed state.

[0009] In some specific embodiments, the controller is configured to control the handling mechanism to move the robotic arm to the vacuum self-test unit platform and turn on the vacuum generator; and to collect the first vacuum detection value of the vacuum adsorption end in the state of not adsorbing the standard wafer, and the second vacuum detection value in the state of adsorbing the standard wafer.

[0010] In some specific embodiments, the controller is further configured to compare a first vacuum detection value with a preset no-load vacuum threshold range and a second vacuum detection value with a preset loaded vacuum threshold range. If either vacuum detection value exceeds the corresponding preset threshold range, a vacuum anomaly warning signal is triggered. If both the first and second vacuum detection values ​​are within their respective preset threshold ranges, the first and second vacuum detection values ​​are averaged, and the calculated average value is sent to the vacuum pressure sensor as a dynamically updated vacuum alarm threshold. Furthermore, during the normal handling of production wafers by the robotic arm, real-time vacuum detection values ​​are acquired and compared with the vacuum alarm threshold. If the real-time vacuum detection value does not reach the vacuum alarm threshold, a vacuum anomaly warning signal is triggered. Through real-time monitoring and intelligent control algorithms, the complex operation of manually adjusting the vacuum pressure gauge is avoided, making the control more intelligent.

[0011] According to a second aspect of the present invention, an intelligent control method for self-checking and early warning of vacuum status of a robotic arm based on the above-described device is proposed, comprising: S1. The controller moves the robotic arm to the vacuum self-test unit platform and positions it at the first position directly below the standard wafer. S2. The controller turns on the vacuum generator and obtains the first vacuum detection value through the vacuum pressure sensor; compares the first vacuum detection value with the preset no-load vacuum threshold range. If it exceeds the no-load vacuum threshold range, a vacuum abnormality warning signal is triggered. S3. If the first vacuum detection value is within the no-load vacuum threshold range, the controller controls the robotic arm to lift to the second position to adsorb the standard wafer, and obtains the second vacuum detection value through the vacuum pressure sensor; compare the second vacuum detection value with the preset loaded vacuum threshold range, and if it exceeds the loaded vacuum threshold range, trigger a vacuum abnormality warning signal. S4. If the first vacuum detection value and the second vacuum detection value are both within the corresponding preset threshold range, the controller calculates a new vacuum alarm threshold based on the first vacuum detection value and the second vacuum detection value. This new threshold is then used by the controller to obtain the real-time vacuum detection value and compare it with the new vacuum alarm threshold during the subsequent process of controlling the robotic arm to pick up and put away production wafers. If the real-time vacuum detection value does not reach the new vacuum alarm threshold, a vacuum abnormality warning signal is triggered. S5. The controller controls the robotic arm to descend to the first position, releases the standard wafer to the vacuum self-test unit platform, shuts down the vacuum generator, and controls the robotic arm to return to the standby position.

[0012] In some specific embodiments, before executing step S1, the current number of pick-up and place operations or the current running time of the robotic arm's normal pick-up and place of production wafers are recorded in real time. When the current number of pick-up and place operations reaches the set number, or the current running time reaches the set running time value, the robotic arm is controlled to move to the standby position after completing the current normal pick-up and place operation, triggering the execution of step S1. By intelligently checking the vacuum status of the robotic arm at fixed intervals or periods and providing intelligent early warnings, troubleshooting and repair can be carried out during equipment maintenance or idle time, reducing the failure rate of the equipment during normal operation, while also improving production efficiency and product yield, which has significant practical value and market prospects.

[0013] In some specific embodiments, steps S2 and S3 further include: if a vacuum anomaly warning signal is triggered, shutting down the vacuum generator, generating corresponding warning information, and entering a pause state. Sending warning information through a cloud platform further improves the safety of the semiconductor manufacturing process.

[0014] In some specific embodiments, the calculation method for the new vacuum alarm threshold in step S4 is as follows: ; in, This indicates the new vacuum alarm threshold. This indicates the first vacuum detection value. This indicates the second vacuum detection value.

[0015] In some specific embodiments, after step S5 is executed, the current number of pick-up and drop-off operations or the current running time recorded in real time is cleared to zero.

[0016] This invention provides an intelligent control device and method for self-checking and early warning of vacuum status in robotic arms, which has the following significant advantages: The controller directs the robotic arm of the handling mechanism to move to a dedicated vacuum self-testing unit platform for adsorption. A standard wafer positioned on this platform provides a constant, contamination-free physical reference surface for the vacuum adsorption end. This eliminates interference from external variables such as wafer deformation or surface contamination during the handling of production wafers. Furthermore, based on the load vacuum self-test value obtained at this independent vacuum self-testing unit platform, the controller dynamically updates the vacuum alarm threshold used by the robotic arm during subsequent normal wafer handling. This adapts to the natural aging and physical degradation of the vacuum chuck and tubing during long-term, high-frequency operation, solving the technical problem of traditional fixed thresholds failing to adapt to hardware aging and frequently causing false alarms. The combined effect of these two mechanisms eliminates external interference and adapts to internal aging, achieving accurate self-testing and diagnosis of the true sealing state of the robotic arm's vacuum adsorption circuit, thus improving the safety and stability of the semiconductor manufacturing process. Attached Figure Description

[0017] The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and, together with the description, serve to explain the principles of the invention. Other embodiments and many anticipated advantages of the embodiments will be readily recognized as they become better understood through reference to the following detailed description. Other features, objects, and advantages of this application will become more apparent from reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a framework diagram of an intelligent control device for self-checking and early warning of vacuum status of a robotic arm, according to an embodiment of the present invention. Figure 2 This is a schematic diagram of the structure of a conveying mechanism according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of a vacuum self-testing unit platform according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the state of a robotic arm extending into the clearance space below the vacuum self-testing unit platform according to an embodiment of the present invention; Figure 5 This is a schematic diagram of a robotic arm lifting and adsorbing a standard wafer to enter a load self-test state, according to an embodiment of the present invention. Figure 6 This is a flowchart of an intelligent control method for self-checking and early warning of vacuum status of a robotic arm, according to an embodiment of the present invention.

[0018] Reference numerals: 1. Handling mechanism; 11. Robotic arm; 12. Horizontal telescopic axis; 13. Lifting axis; 14. Rotating axis; 15. Vacuum adsorption end; 2. Vacuum self-testing unit platform; 21. Bottom base; 22. Supporting component; 3. Standard wafer; 4. Controller; 5. Motor servo driver; 6. Servo motor; 7. Vacuum generator; 8. Vacuum pressure sensor; 9. HMI (Human-Machine Interface); 10. Cloud platform. Detailed Implementation

[0019] In the description of this invention, it should be noted that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0020] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "installation," "connection," and "fixation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0021] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0022] Figure 1 A framework diagram of an intelligent control device for self-checking and early warning of vacuum status in a robotic arm, according to an embodiment of the present invention, is shown. Figure 1As shown, the control topology of this device is centered around controller 4. Controller 4 connects to three servo drivers 5 that control the movement of each axis via high-speed communication protocols such as ETHERCAT bus, thereby precisely driving the three servo motors 6 to achieve complex spatial displacement of the conveying mechanism 1 (i.e., the PSR device). In terms of the gas path architecture, external positive pressure air is introduced into the vacuum generator 7 to generate a vacuum negative pressure. This vacuum adsorption circuit extends through pipelines and connects to the front end of the robotic arm 11 of the conveying mechanism 1. Simultaneously, a vacuum pressure sensor 8 with high-temperature and corrosion-resistant properties is connected in the vacuum adsorption circuit. The vacuum pressure sensor 8 is connected to controller 4 in real time via RS485 communication protocol to continuously provide feedback on the vacuum detection value reflecting the true sealing state of the gas path.

[0023] Furthermore, the controller 4 is connected to the HMI (Human Machine Interface) 9 via the EIP communication protocol. The HMI 9 is further wirelessly connected to the cloud platform 10, namely the M-IoT Cloud data platform, thereby constructing an interconnected channel for early warning information from the underlying pneumatic hardware to the mobile terminal of the enterprise equipment manager. In this embodiment, the HMI 9 has a built-in control page, which includes a jog speed setting module for the three axes of the conveying mechanism, jog buttons, a running speed setting module, and a manual control switch for the vacuum generator. It also includes a current pick-and-place count and time monitoring module, a count and time setting and clearing module, and a function switch module. In addition, it includes a coordinate setting module for the standby position and the upper and lower positions of the self-test unit, as well as a vacuum current value display, no-load and load vacuum upper and lower limit setting, and vacuum alarm threshold update display module, supplemented by system status indicators and reset, start, and stop buttons.

[0024] Figure 2 A schematic diagram of the conveying mechanism according to a specific embodiment of the present invention is shown. Figure 2As shown, the conveying mechanism 1 includes a multi-axis motion mechanism. The fixed connections and spatial transmission relationships between its components are as follows: A rotating shaft 13 is located at the bottom of the conveying mechanism 1, forming a cylindrical base structure, used to drive all mechanisms above it to perform overall circumferential rotation and positioning; the external vertical frame of the lifting shaft 14 is fixedly connected to the top of the rotating shaft 13, and the lifting shaft 14 is internally equipped with a vertical guide rail and a servo motor at its bottom; a horizontal telescopic shaft 12 is mounted on a vertical slide inside the lifting shaft 14, and the servo motor at the bottom of the lifting shaft 14 drives the vertical slide to move up and down, thereby driving the horizontal telescopic shaft 12 to perform vertical up and down movements; the tail end of the robotic arm 11 is securely connected to the guide rail slider of the horizontal telescopic shaft 12, and the internal transmission mechanism of the horizontal telescopic shaft 12 drives the robotic arm 11 to perform forward and backward horizontal linear extension and retraction movements. The front end of the robotic arm 11 has a hollow structure and is fixedly equipped with a vacuum adsorption end 15 for directly adsorbing wafers. Thus, each axis is respectively... Figure 1 The corresponding servo motor 6 is driven independently, realizing the three-dimensional spatial linkage of the robotic arm 11 in rotation, lifting, and extension.

[0025] Figure 3 A schematic diagram of the structure of a vacuum self-testing unit platform according to a specific embodiment of the present invention is shown. Figure 3 As shown, to completely eliminate interference from warping or contamination of the production wafers on vacuum testing, this invention independently sets up a vacuum self-testing unit platform 2 that is not involved in the daily production process. A bottom base 21 is horizontally fixed to the top of the frame of this vacuum self-testing unit platform 2. A support component 22, which serves to elevate the wafer, is protruding from the top surface of the bottom base 21. The top of the support component 22 is used to support the standard wafer 3, which is placed stably and continuously on it, acting solely as an absolutely flat, deformation-free, and constant physical testing reference surface. Because the support component 22 has a certain vertical protrusion height, a natural clearance space is formed between the bottom surface of the standard wafer 3 and the top surface of the bottom base 21, allowing the vacuum adsorption end 15 to extend unobstructed directly beneath the standard wafer 3 in an unadsorbed state.

[0026] To achieve intelligent self-inspection and control of the vacuum status of the robotic arm, the controller 4 is configured to dynamically update the vacuum alarm threshold for the robotic arm during normal wafer handling based on the load vacuum self-inspection value acquired at the vacuum self-inspection unit platform. If the acquired real-time vacuum detection value does not reach the vacuum alarm threshold during normal wafer handling, a vacuum anomaly warning signal is triggered. Specifically, the controller is configured to control the robotic arm 11 of the handling mechanism 1 to move to the vacuum self-inspection unit platform 2 and activate the vacuum generator 7; to collect the first vacuum detection value of the vacuum adsorption end 15 in the state of not adsorbing the standard wafer 3, and the second vacuum detection value in the state of adsorbing the standard wafer 3. Further, the controller 4 is also configured to compare the first vacuum detection value with a preset no-load vacuum threshold range and compare the second vacuum detection value with a preset loaded vacuum threshold range; if either vacuum detection value exceeds the corresponding preset threshold range, a vacuum anomaly warning signal is triggered. If both the first vacuum detection value and the second vacuum detection value are within the corresponding preset threshold range, the first vacuum detection value and the second vacuum detection value are extracted and averaged, and the average value is used as the dynamically updated vacuum alarm threshold and sent to the vacuum pressure sensor 8; and, during the normal picking and placing of production wafers by the robotic arm 11, the real-time vacuum detection value is acquired and compared with the updated vacuum alarm threshold. If the real-time vacuum detection value does not reach the vacuum alarm threshold, a vacuum abnormality warning signal is triggered.

[0027] Figure 4 This diagram shows the unloaded avoidance state of the robotic arm extending into the avoidance space of the self-test unit in this embodiment; Figure 5 The diagram shows the load self-test status of a robotic arm lifting and adsorbing a standard wafer. (Example) Figure 4 and Figure 5 As shown, in Figure 4 In this state, the robotic arm 11 is positioned directly below the standard wafer 3, with a noticeable physical gap between them, defined as the first position; Figure 5 In this state, the lifting shaft 14 drives the robotic arm 11 to rise, so that the vacuum adsorption end 15 at its front end is completely in contact with the bottom surface of the standard wafer 3. The standard wafer 3 is lifted and detached from the support component 22, which is defined as the second position.

[0028] Based on the above hardware architecture, the intelligent control device of the present invention also incorporates a vacuum state early warning method for the robotic arm. Combining the above hardware architecture and... Figure 6 The flowchart shown illustrates the specific execution logic and steps of the robotic arm vacuum state early warning method of the present invention: S101, PSR Reset: After the equipment is powered on, press the preset reset button on the HMI (Human Machine Interface) 9 to initiate the overall reset process for the handling mechanism 1 (i.e., PSR). All control flow timings are restored to their initial state. The robotic arm 11 of the handling mechanism 1 first performs a homing motion in the horizontal direction. After the robotic arm 11 finds its homing point, the lifting axis 14 and the rotating axis 13 simultaneously perform homing motions. Once all axes have found their homing points, the vacuum generator 7 is turned off, and the reset process ends.

[0029] S102. Real-time acquisition of vacuum value: After the reset is completed, the controller 4 starts to read the vacuum detection value of the vacuum pressure sensor 8 in real time through RS485 communication.

[0030] S103, PSR wafer handling between various units: After pressing the start button, the equipment enters the normal handling state, and the handling mechanism 1 uses the robotic arm 11 to normally handle production wafers (i.e., wafers) between various process units. If the stop button is triggered, the equipment enters the stop state and waits for the next start.

[0031] S104. Self-test Trigger Judgment: During normal production, if the count or time function on the HMI (Human Machine Interface) 9 is enabled, the device background will continuously accumulate the current pick-up / placement count or the current pick-up / placement time, and determine whether the current pick-up / placement count is greater than or equal to the set pick-up / placement count, or whether the current pick-up / placement time is greater than or equal to the set pick-up / placement time. If neither is met, the device will cycle back to the normal pick-up / placement state. In a preferred embodiment, the set pick-up / placement count is 500 times, and the set pick-up / placement time is 5000 minutes.

[0032] S105, PSR to standby position: If any condition in S104 is met, counting and timing will stop after the current handling is completed, the handling mechanism 1 will stop normal picking and placing, and the internal axes will move in linkage to the preset standby position. In a specific embodiment, the spatial coordinates of the standby position are set to 1.00mm, 366.00mm, and 125.000°.

[0033] S106, PSR to the lower position of the self-test unit: The controller 4 controls the overall movement of the conveying mechanism 1, and causes the robotic arm 11 of the conveying mechanism 1 to extend into the clearance space of the vacuum self-test unit platform 2, and be positioned at the first position, namely the lower position of the self-test unit. In a specific embodiment, the coordinates of this lower position are set to 232.00mm, 366.00mm, and 125.000°.

[0034] S107. Turn on the vacuum generator: Turn on the output terminal of the vacuum generator 7 to put the vacuum adsorption circuit into a negative pressure state.

[0035] S108. Waste Vacuum Value Processing: The first vacuum detection value is obtained through the vacuum pressure sensor 8. The system compares whether this value is between the lower and upper limits of the no-load vacuum setting. In a specific embodiment, the lower limit of the no-load vacuum is set to -35.00 kPa, and the upper limit is set to -15.00 kPa. If the first vacuum detection value is within this range, the value is extracted, and then the process jumps to step S111; if it exceeds the limit (NG), the process proceeds to step S109.

[0036] S109. Sending warning information to the cloud platform: When the first vacuum detection value is less than the lower limit setting value, a warning message for low no-load vacuum value is generated; when it is greater than the upper limit setting value, a warning message for high no-load vacuum value is generated. The warning information is transmitted to the HMI human-machine interface 9 via EIP communication and sent to the administrator's mobile phone by the cloud platform 10. The device then enters a pause state, requiring manual inspection and confirmation before resuming self-testing.

[0037] S110. Turn off the vacuum generator: After manually confirming the no-load abnormality, turn off the vacuum generator 7, directly stop this self-test and jump to step S116.

[0038] S111, PSR to the self-test unit position: If the no-load test is qualified, the controller 4 controls the lifting shaft 14 to drive the horizontal telescopic shaft 12 and the robotic arm 11 to the second position, i.e., the self-test unit position, so that the vacuum adsorption end 15 adheres to and picks up the standard wafer 3. In a specific embodiment, the coordinates of this upper position are set to 232.00mm, 375.00mm, and 125.000°.

[0039] S112. Waste Vacuum Value Processing: The second vacuum detection value is obtained again through the vacuum pressure sensor 8. The device compares whether this value is between the lower and upper load vacuum setting values. In a specific embodiment, the lower load vacuum setting value is set to -65.00 kPa, and the upper load setting value is set to -55.00 kPa. If the second vacuum detection value is within this range, the value is extracted, and the process proceeds to step S114; if it exceeds the limit (NG), the process proceeds to step S113.

[0040] S113. Send warning information to the cloud platform: When the second vacuum detection value is less than the lower limit setting value, a warning message for low load vacuum value is generated; when it is greater than the upper limit setting value, a warning message for high load vacuum value is generated. The alarm signal is also pushed to the administrator's mobile phone, the equipment enters a pause state, and after manual confirmation, the execution of step S114 is resumed.

[0041] S114. Vacuum Alarm Threshold Update and Vacuum Shutdown: First, shut down the vacuum generator 7. If no warning is generated in the preceding steps, the controller 4 will calculate the average of the extracted first and second vacuum detection values ​​as the new vacuum alarm threshold (i.e., corresponding to updating the vacuum pressure gauge threshold). The calculation method is as follows: ; in, This indicates the new vacuum alarm threshold. This indicates the first vacuum detection value. This represents the second vacuum detection value. After calculation, controller 4 intelligently updates the new vacuum alarm threshold to vacuum pressure sensor 8 in real time via RS485 communication. During the normal wafer handling process in the next batch, this updated vacuum alarm threshold serves as the real-time alarm judgment basis for preventing wafer drop. Using the average of the first vacuum detection value (no-load reference) and the second vacuum detection value (standard load reference) as the dynamic alarm threshold ensures that the alarm trigger line is centered between the two extreme states of fully open and fully sealed pipelines. This dynamic calculation method avoids false alarms caused by small fluctuations due to fixed thresholds, while ensuring high sensitivity to chuck wear or minor wafer leaks, making the wafer drop prevention warning more accurate and reliable, and adapting to the actual health status of the current pneumatic hardware. If a warning has occurred in the aforementioned steps, the threshold update action is skipped.

[0042] S115, PSR returns to the lower position of the self-test unit: control the lifting shaft 14 to drive the robotic arm 11 to descend vertically and return to the first position, so as to safely release the standard wafer 3 back onto the self-test unit platform 2.

[0043] S116, PSR returns to standby position and resets the current pick-and-place count / current pick-and-place time to zero: The robotic arm 11, controlled by the linkage of each axis, retracts to the standby position. At this time, if the current pick-and-place count reaches the set value, the count is reset to zero; if the current pick-and-place time reaches the set value, the time is reset to zero. The device ends the self-test state and automatically jumps back to the normal pick-and-place process in step S103, repeating this cycle. All the above coordinate and air pressure settings can be adaptively adjusted according to actual processing requirements.

[0044] In this specification, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, those skilled in the art can combine and integrate different embodiments or examples and features of different embodiments or examples described in this specification without contradiction. Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention. The specific embodiments of the present invention described above do not constitute a limitation on the scope of protection of the present invention. Any other corresponding changes and modifications made according to the technical concept of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. An intelligent control device for robot vacuum state self-checking and early warning, characterized in that, include: The conveying mechanism includes a motor servo driver and a robotic arm driven by the motor servo driver; the robotic arm integrates a vacuum adsorption circuit, the vacuum adsorption circuit including a vacuum adsorption end disposed at the end of the robotic arm, a vacuum generator connected to the vacuum adsorption end, and a vacuum pressure sensor connected to the vacuum adsorption circuit and used to acquire vacuum detection values. A vacuum self-test unit platform, on which a standard wafer is positioned, is used to provide a constant physical reference surface for the vacuum adsorption end when the robotic arm moves to the vacuum self-test unit platform to perform the adsorption action, so as to cooperate with the vacuum pressure sensor to obtain the load vacuum self-test value reflecting the sealing state of the vacuum adsorption circuit; The controller is communicatively connected to the motor servo driver, the vacuum generator, and the vacuum pressure sensor, respectively. The controller is configured to dynamically update the vacuum alarm threshold for the robotic arm during normal wafer handling based on the load vacuum self-test value obtained at the vacuum self-test unit platform. If the real-time vacuum detection value obtained during normal wafer handling by the robotic arm does not reach the vacuum alarm threshold, a vacuum abnormality warning signal is triggered.

2. The apparatus of claim 1, wherein, The robotic arm includes a multi-axis motion mechanism, specifically comprising: A horizontal telescopic shaft, wherein the vacuum adsorption end is fixed to the front end of the horizontal telescopic shaft; A lifting shaft is connected to the horizontal telescopic shaft for driving the horizontal telescopic shaft to move up and down; A rotating shaft is connected to the lifting shaft for driving the lifting shaft and the horizontal telescopic shaft to rotate as a whole. The multi-axis motion mechanism further includes servo motors that correspond one-to-one with and are connected to the horizontal telescopic axis, the lifting axis and the rotary axis respectively; the motor servo driver includes a horizontal servo driver, a lifting servo driver and a rotary servo driver that are electrically connected to each of the servo motors respectively.

3. The apparatus of claim 1, wherein, The vacuum self-testing unit platform includes a bottom base and a support component protruding from the top surface of the bottom base; The top of the support component is used to support the standard wafer, so that a clearance space is formed between the bottom surface of the standard wafer and the top surface of the bottom base, allowing the vacuum adsorption end to extend directly below the standard wafer in the non-adsorption state.

4. The apparatus of claim 1, wherein, The controller is configured to control the transport mechanism to move the robotic arm to the vacuum self-test unit platform and turn on the vacuum generator; and to collect the first vacuum detection value of the vacuum adsorption end when it is not adsorbing the standard wafer, and the second vacuum detection value when it is adsorbing the standard wafer.

5. The apparatus of claim 4, wherein, The controller is also configured to compare the first vacuum detection value with a preset no-load vacuum threshold range and compare the second vacuum detection value with a preset loaded vacuum threshold range; if any of the vacuum detection values ​​exceeds the corresponding preset threshold range, a vacuum anomaly warning signal is triggered. If both the first vacuum detection value and the second vacuum detection value are within the corresponding preset threshold range, then the first vacuum detection value and the second vacuum detection value are extracted and averaged, and the average value is used as a dynamically updated vacuum alarm threshold and sent to the vacuum pressure sensor; and during the normal picking and placing of production wafers by the robotic arm, the real-time vacuum detection value is acquired and compared with the vacuum alarm threshold. If the real-time vacuum detection value does not reach the vacuum alarm threshold, then a vacuum abnormality warning signal is triggered.

6. An intelligent control method for vacuum state self-checking and early warning of a mechanical arm based on the device of any one of claims 1-5, characterized in that, include: S1. The controller controls the robotic arm to move to the vacuum self-test unit platform and position it at the first position directly below the standard wafer; S2. The controller turns on the vacuum generator and obtains a first vacuum detection value through the vacuum pressure sensor; compares the first vacuum detection value with a preset no-load vacuum threshold range. If the value exceeds the no-load vacuum threshold range, a vacuum abnormality warning signal is triggered. S3. If the first vacuum detection value is within the no-load vacuum threshold range, the controller controls the robotic arm to lift to the second position to adsorb the standard wafer, and the second vacuum detection value is obtained through the vacuum pressure sensor; the second vacuum detection value is compared with the preset loaded vacuum threshold range, and if it exceeds the loaded vacuum threshold range, a vacuum abnormality warning signal is triggered. S4. If both the first vacuum detection value and the second vacuum detection value are within the corresponding preset threshold range, the controller calculates a new vacuum alarm threshold based on the first vacuum detection value and the second vacuum detection value. This new threshold is then used by the controller to obtain the real-time vacuum detection value and compare it with the new vacuum alarm threshold during the subsequent process of controlling the robotic arm to normally pick up and place production wafers. If the real-time vacuum detection value does not reach the new vacuum alarm threshold, a vacuum abnormality warning signal is triggered. S5. The controller controls the robotic arm to descend to the first position, releases the standard wafer to the vacuum self-test unit platform, shuts down the vacuum generator, and controls the robotic arm to return to the standby position.

7. The method of claim 6, wherein, Before executing step S1, the current number of times the robotic arm normally picks up and places production wafers or the current running time is recorded in real time. When the current number of times the robotic arm picks up and places wafers reaches the set number of times, or the current running time reaches the set running time value, the robotic arm is controlled to move to the standby position after completing the current normal pick-up and place action, triggering the execution of step S1.

8. The method of claim 6, wherein, Steps S2 and S3 also include: If the vacuum anomaly warning signal is triggered, the vacuum generator will be shut down, a corresponding warning message will be generated, and the system will enter a pause state.

9. The method of claim 6, wherein, In step S4, the calculation method for the new vacuum alarm threshold is as follows: ； wherein represents the new vacuum alarm threshold value, represents the first vacuum detection value, represents the second vacuum detection value.

10. The method of claim 7, wherein, After completing step S5, the current number of pick-up and drop-off operations or the current running time recorded in real time will be cleared to zero.

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