Space computing cabin active thermal management system and method

Abstract

The application discloses a space computing cabin active heat management system and method. The system comprises a micro-channel cold plate, a chip, an active pump-driven circulation loop, a heat pump temperature increasing subsystem, a radiation heat dissipation terminal and a pressure cooperative control module. The chip surface is close to the micro-channel cold plate. The micro-channel cold plate is connected with the active pump-driven circulation loop through the pressure cooperative control module. The active pump-driven circulation loop is connected with the heat pump temperature increasing subsystem. The heat pump temperature increasing subsystem is connected with the pressure cooperative control module and the radiation heat dissipation terminal respectively. The application has the advantages of high heat transfer efficiency, small radiation area, high heat flow impact resistance and stable operation, significantly reduces the weight and volume of the radiator, breaks through the high heat flow density dissipation bottleneck of the space computing cabin, and is especially suitable for the heat management of the high power density space data center.

Description

Technical Field

[0001] This invention relates to the field of spacecraft thermal control technology, and more specifically to an active thermal management system and method for a space computing module. Background Technology

[0002] With the rapid development of space-based edge computing, orbital data centers, and high-throughput communication satellites, the power density of onboard high-performance processors has increased dramatically, with local heat flux density exceeding 500 W / cm². 2 and towards 1000W / cm 2 A step forward. Traditional aerospace thermal control technology mainly relies on loop heat pipes or capillary pump loops. While these passive two-phase flow systems have high reliability at conventional power densities, they face insurmountable physical bottlenecks when dealing with extremely high heat flux densities. Heat transfer temperature difference and thermal resistance limitations: Heat pipes rely on the phase change of the working fluid for heat transfer, and a saturation temperature difference inevitably exists between the evaporation and condensation sections. During long-distance transmission (such as from an internal chip to an external radiator), to maintain the circulating pressure drop, the operating temperature of the radiator is often significantly lower than the chip temperature. According to the Stefan-Boltzmann law (P=εσAT),... 4 This directly leads to a significant decrease in radiative heat dissipation efficiency.

[0003] Capillary Limits and the Risk of Dry Burning: In microgravity environments, the traditional mechanism of liquid wicks relying on capillary force to drive liquid reflux is challenged. Capillary suction power is limited, and there is no buoyancy assistance. Furthermore, it faces the challenge of high heat flux (>300W / cm²). 2 The evaporation end is highly susceptible to "drying up" of the working fluid, leading to heat transfer failure or even chip burnout. Furthermore, two-phase flow is prone to instability issues such as uneven gas-liquid distribution and flow oscillations under microgravity.

[0004] The contradiction between radiator area and weight: Because traditional heat pipe systems have relatively low heat dissipation temperatures (typically 40℃ to 60℃), dissipating the heat from hundreds to thousands of watts of computing power requires a huge radiator area, leading to an exponential increase in launch weight and cost. For future megawatt-level space data centers, the radiator area alone could reach hundreds of square meters, which is difficult to achieve in engineering.

[0005] The shortcomings of existing active cooling solutions: Although some existing technologies employ pump-driven single-phase liquid cooling circuits, the specific heat capacity of conventional liquid working fluids (such as water, ammonia, and ethylene glycol) is limited (typically 3–5 kJ / (kg·K)), making it difficult to remove large amounts of heat under small temperature differences. More importantly, existing solutions have not effectively resolved a core contradiction: the matching problem between the upper limit of chip temperature (typically 85°C) and the optimal operating temperature of the radiator (which needs to be higher than the ambient temperature)—the chip needs to operate at a low temperature, but the radiator needs a high temperature for efficient heat dissipation.

[0006] In recent years, some studies have proposed applying transcritical CO2 heat pumps to spacecraft thermal control. However, this research remains at the theoretical analysis stage, with the following unresolved technical challenges: ① Existing thermodynamic models cannot meet the high-temperature heat dissipation requirements of space; ② Heat pumps exhibit low oil-gas separation efficiency under low / microgravity conditions, easily leading to compressor performance degradation. Furthermore, existing solutions do not address how to organically integrate microchannel enhanced heat transfer, heat pump heating, and microgravity adaptive control into a complete engineering system.

[0007] Therefore, there is an urgent need for a new heat dissipation architecture that can eliminate the limitations of heat transfer temperature difference, actively increase radiation temperature, and adapt to extreme heat flow and microgravity environments. Summary of the Invention

[0008] In view of this, the present invention provides an active thermal management system and method for a space computing cabin. It adopts a three-level coupling architecture of "supercritical working fluid microchannel heat absorption + heat pump active heating + efficient radiation dissipation" and a pressure-coordinated control module specifically designed for microgravity environment to solve the heat dissipation problem under high heat flux density and the microgravity adaptability problem.

[0009] To achieve the above objectives, the present invention adopts the following technical solution: An active thermal management system for a space computing module includes: a microchannel cold plate, a chip, an active pump-driven circulation loop, a heat pump heating subsystem, a radiative heat dissipation terminal, and a pressure-coordinated control module; The chip surface is closely attached to a microchannel cold plate, which is connected to an active pump drive circulation loop via a pressure-coordinated control module. The active pump drive circulation loop is connected to a heat pump heating subsystem, which is connected to both the pressure-coordinated control module and a radiant heat dissipation terminal.

[0010] Preferably, the active pump-driven circulation loop is used to drive supercritical carbon dioxide working fluid to perform forced convection heat transfer within the microchannel cold plate; it includes a magnetic pump, a liquid storage regulator, and liquid pipelines.

[0011] Preferably, the heat pump heating subsystem is connected in series to the active pump drive circulation loop, and is used to mechanically compress the low-temperature working fluid after absorbing heat from the chip to a high-temperature heat dissipation state; it includes a regenerator and a magnetic levitation oil-free centrifugal compressor.

[0012] Preferably, the pressure coordination control module includes a high-frequency pressure sensor, a controller, a throttle valve, and a buffer tank; the controller is configured to coordinately adjust the speed of the magnetic pump and the speed of the magnetically levitated oil-free centrifugal compressor according to the pressure change rate, in order to suppress fluid density wave oscillations in a microgravity environment.

[0013] Preferably, the radiative heat dissipation terminal is connected to the output end of the heat pump heating subsystem and is used to discharge the heat carried by the high-temperature working fluid into deep space in the form of infrared radiation.

[0014] Preferably, the high-frequency pressure sensor is respectively installed at the outlet of the microchannel cold plate and the inlet of the magnetic levitation oil-free centrifugal compressor, for real-time acquisition of pressure values ​​and transmission of pressure values ​​to the controller; the inlet of the microchannel cold plate is connected in sequence to a buffer tank and a throttle valve, the buffer tank is located at the outlet of the throttle valve, and the inlet of the throttle valve is connected to the fluid pipeline.

[0015] Preferably, the microchannel cold plate includes: a heated wall surface, a micro-needle fin array, a jet nozzle, a biomimetic fractal microchannel network, an outer wall surface of the cold plate, a working fluid inlet, and a working fluid outlet; The chip is attached to the heating wall; above the heating wall is a micro-needle array; above the micro-needle array is a jet cavity, and the jet nozzle is located between the jet cavity and the biomimetic fractal microchannel network above it. The outer wall of the cold plate forms the boundary of the flow channel. The working fluid inlet is connected to the biomimetic fractal microchannel network, and the working fluid outlet is located on one side of the micro-needle layer. Supercritical CO2 enters the biomimetic fractal microchannel network from the working fluid inlet, impacts the heating wall vertically through the jet nozzle, and flows laterally to the working fluid outlet after passing through the micro-needle array.

[0016] Preferably, an active thermal management method for a space computing module includes: Monitor the heat load of the chip and the pressure and temperature of the working fluid at the outlet of the microchannel cold plate; Calculate the pressure change rate based on the monitored data to determine whether it exceeds the threshold. When the threshold is exceeded, the speed of the magnetic pump and the speed of the magnetic levitation oilless centrifugal compressor are adjusted in a coordinated manner through a feedforward control algorithm to suppress fluid oscillation. During transient peak heat loads, depending on the configuration, excess heat is absorbed by a phase change energy storage device integrated into the circulation loop or the chip temperature is maintained stable through active overload regulation of the heat pump. The working fluid temperature is increased by a heat pump heating subsystem and then dissipated into deep space via a radiative heat dissipation terminal. To meet the wide temperature range requirements of deep space exploration missions, the electric heating blanket on the back of the radiant heat dissipation terminal is activated when the working fluid temperature is lower than the set value to prevent the working fluid from liquefying.

[0017] As can be seen from the above technical solution, compared with the prior art, the present invention discloses an active thermal management system and method for a space computing module, which has the following advantages: Extremely low thermal resistance: Utilizing the "pseudo-boiling" phenomenon of supercritical carbon dioxide near the pseudo-critical point, its specific heat capacity can reach 4 to 6 times that of conventional liquids. Combined with the "micro-needle fin + jet" composite microchannel structure, the temperature difference between the chip junction temperature and the working fluid temperature is controlled within 5℃, which is far superior to the 10℃ to 20℃ temperature difference of traditional heat pipes.

[0018] Effective reduction in radiant area: By using a heat pump, the heat dissipation temperature is increased from approximately 45°C (318.15K) in conventional loop heat pipes to a maximum of 120°C (393.15K) in this invention. According to the Stefan-Boltzmann law, the radiative heat dissipation power can be increased to (393.15 / 318.15) of the conventional solution. 4 ≈2.32 times. This means that, to dissipate the same amount of heat, the radiator area required by this invention can be reduced by approximately 57%. Compared to the 105°C scheme (50% reduction in area), further increasing to 120°C can reduce the radiation area by an additional 7%, which has significant engineering value in space missions with extremely high launch costs.

[0019] Completely eliminates two-phase flow instability: The system always operates in the supercritical single-phase region, with no gas-liquid interface, fundamentally eliminating difficulties in gas-liquid separation, flow oscillations, and the risk of dry burning under microgravity, resulting in extremely high reliability. Combined with a pressure coordination control module, pressure fluctuations during startup and variable operating conditions can be further suppressed.

[0020] Resistance to high heat flux shocks: Active forced convection eliminates the capillary limit problem of heat pipes, enabling stable heat removal of over 1000 W / cm². 2 Transient heat flow. An optional phase-change energy storage cavity can absorb short-term power spikes, preventing instantaneous overheating of the chip.

[0021] Microgravity environment optimization: In response to the special characteristics of space applications, a magnetic levitation oil-free centrifugal compressor is used to solve the oil-gas separation problem, and a pressure coordination control module is used to solve the fluid oscillation problem under microgravity, making the system feasible for real space engineering applications.

[0022] Flexible thermal buffering configuration: The phase-change energy storage module is designed as an optional rather than a necessary component. For typical orbital data center scenarios, the chip's own thermal capacity is sufficient to absorb most short-term fluctuations; it is only recommended when the mission requires withstanding extreme power spikes exceeding 5 seconds. Calculations show that for a 10-second, 20 kW thermal shock, the liquid gallium solution requires approximately 250 grams, impacting the overall satellite weight by less than 0.1%, demonstrating clear engineering economics. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the overall system architecture provided by the present invention.

[0025] Figure 2 Detailed cross-sectional view of the micro-needle fins and jet impact structure inside the microchannel cold plate provided by the present invention.

[0026] Figure 3 The temperature entropy diagram (Ts diagram) and pressure-enthalpy diagram (ph diagram) of the heat pump heating cycle provided by the present invention.

[0027] Figure 4 The logic flowchart of the pressure coordination control module provided by the present invention.

[0028] Figure 5 The overall system framework diagram provided by the present invention.

[0029] In the diagram, 1 – microchannel cold plate; 2 – chip; 3 – magnetic pump; 4 – regenerator; 5 – magnetic levitation oil-free centrifugal compressor; 6 – radiant heat dissipation terminal; 7 – throttling valve; 8 – liquid storage regulator; 9 – buffer tank; 10 – fluid pipeline; 11 – high-frequency pressure sensor; 12 – heating wall; 13 – micro-needle fin array; 14 – jet nozzle; 15 – biomimetic fractal microchannel network; 16 – outer wall of cold plate; 17 – working fluid inlet; 18 – working fluid outlet; 19 – controller. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] The system of this invention includes a high heat flux density microchannel cold plate 1, an active pump-driven circulation loop, a heat pump heating subsystem, a radiative heat dissipation terminal 6, and a pressure-coordinated control module. The cold plate adopts a "micro-needle fin + jet" composite enhanced heat transfer structure adapted to supercritical CO2 working fluid, with a heat transfer coefficient exceeding 20,000 W / (m²·K). The heat pump heating subsystem uses a magnetically levitated oil-free centrifugal compressor 5 to raise the low-temperature waste heat to 80℃~120℃. Based on the Stefan-Boltzmann law, raising the exhaust temperature from 45℃ to 120℃ can increase the radiative heat dissipation power by approximately 2.32 times, and the required radiator area is reduced by more than 57% compared to traditional low-temperature radiation schemes. The pressure-coordinated control module monitors the pressure change rate in real time through a high-frequency pressure sensor 11 and a controller 19, and adopts a pump-machine coordinated feedforward control strategy to quickly suppress fluid oscillations.

[0032] The working fluid is supercritical carbon dioxide, and the system operating pressure is maintained between 7.5 MPa and 10 MPa. The geometry of the micro-needle array 13 and the jet impact nozzle is configured to utilize the high specific heat capacity of supercritical carbon dioxide near the quasi-critical point to achieve a heat transfer coefficient greater than 20,000 W / (m²). 2 ·K).

[0033] like Figure 5 As shown, this embodiment of the invention discloses an active thermal management system for a space computing module, including: a microchannel cold plate 1, a chip 2, an active pump-driven circulation loop, a heat pump heating subsystem, a radiative heat dissipation terminal 6, and a pressure-coordinated control module; Chip 2 is attached to microchannel cold plate 1. Microchannel cold plate 1 is connected to active pump drive circulation loop through pressure coordination control module. Active pump drive circulation loop is connected to heat pump heating subsystem. Heat pump heating subsystem is connected to pressure coordination control module and radiation heat dissipation terminal 6 respectively.

[0034] Furthermore, the system also includes a working fluid management unit, which is used to maintain the working fluid in a supercritical state during the launch phase or long standby state to prevent difficulty in starting due to liquefaction of the working fluid caused by excessively low temperature.

[0035] Specifically, the active pump-driven circulation loop is used to drive supercritical carbon dioxide working fluid to perform forced convection heat exchange within the microchannel cold plate 1; it includes a magnetic pump 3, a liquid storage regulator 8, and liquid pipelines.

[0036] Specifically, the heat pump heating subsystem is connected in series to the active pump drive circulation loop, and is used to mechanically compress the low-temperature working fluid after absorbing heat from the chip 2 to a high-temperature heat dissipation state; it includes a regenerator 4 and a magnetic levitation oil-free centrifugal compressor 5.

[0037] In a specific embodiment of the present invention, the heat pump heating subsystem includes a magnetically levitated oil-free centrifugal compressor 5. The compressor adopts an oil-free lubrication design to eliminate the problem of reduced oil-gas separation efficiency under microgravity conditions. The compressor is configured to raise the heat absorption temperature of the working fluid from 30°C to 50°C to the heat discharge temperature from 80°C to 120°C.

[0038] Specifically, the pressure coordination control module includes a high-frequency pressure sensor 11, a controller 19, a throttle valve 7, and a buffer tank 9; the controller 19 is configured to coordinately adjust the speed of the magnetic pump 3 and the speed of the magnetically levitated oilless centrifugal compressor 5 according to the pressure change rate, in order to suppress fluid density wave oscillations in a microgravity environment.

[0039] Specifically, the radiative heat dissipation terminal 6 is connected to the output end of the heat pump heating subsystem and is used to discharge the heat carried by the high-temperature working fluid into deep space in the form of infrared radiation.

[0040] In one specific embodiment of the present invention, the surface of the radiative heat dissipation terminal 6 is coated with a spectrally selective photonic crystal coating, wherein the emissivity of the coating is not less than 0.95 in the 8μm to 13μm infrared band and the reflectivity is greater than 0.9 in the visible light band.

[0041] Specifically, such as Figure 1 As shown, the high-frequency pressure sensor 11 is respectively installed at the outlet of the microchannel cold plate 1 and the inlet of the magnetic levitation oil-free centrifugal compressor 5, for real-time acquisition of pressure values ​​and transmission of pressure values ​​to the controller 19; the inlet of the microchannel cold plate 1 is connected in sequence to the buffer tank 9 and the throttle valve 7, the buffer tank 9 is located at the outlet of the throttle valve 7, and the inlet of the throttle valve 7 is connected to the fluid pipeline 10.

[0042] In a specific embodiment of the present invention, the sampling frequency of the high-frequency pressure sensor 11 is not less than 100 Hz; the controller 19 is configured to calculate the pressure change rate δP / δt in real time, and when δP / δt exceeds the threshold of 0.5 kPa / s, the pump speed and compressor speed are adjusted in a coordinated manner through a feedforward control algorithm.

[0043] Specifically, the microchannel cold plate 1 includes: a heated wall surface 12, a micro-needle fin array 13, a jet nozzle 14, a biomimetic fractal microchannel network 15, an outer wall surface of the cold plate 16, a working fluid inlet 17, and a working fluid outlet 18; Chip 2 is attached to the heating wall 12; above the heating wall 12 is a micro-needle fin array 13; above the micro-needle fin array 13 is a jet cavity, and the jet nozzle 14 is located between the jet cavity and the biomimetic fractal microchannel network 15 above it. The outer wall 16 of the cold plate forms the boundary of the flow channel. The working fluid inlet 17 is connected to the biomimetic fractal microchannel network 15, and the working fluid outlet 18 is located on one side of the micro-needle fin layer. Supercritical CO2 enters the biomimetic fractal microchannel network 15 from the working fluid inlet 17, is vertically impacted by the jet nozzle 14 to the heating wall 12, and flows laterally to the working fluid outlet 18 after passing through the micro-needle fin array 13.

[0044] In a specific embodiment of the present invention, the height of the microneedle fins is 50μm to 200μm, and the spacing between adjacent microneedle fins is 100μm to 300μm; the diameter of the jet nozzle 14 is 50μm to 150μm, and the axial spacing between adjacent nozzles is 3 mm to 8 mm.

[0045] Specifically, an active thermal management method for a space computing module includes: Monitor the heat load of chip 2 and the pressure and temperature of the working fluid at the outlet of microchannel cold plate 1; Calculate the pressure change rate based on the monitored data to determine whether it exceeds the threshold. When the threshold is exceeded, the speed of the magnetic pump 3 and the speed of the magnetic levitation oilless centrifugal compressor 5 are adjusted in a coordinated manner through a feedforward control algorithm to suppress fluid oscillation. During transient peak heat loads, depending on the configuration, excess heat is absorbed by the phase change energy storage device integrated into the circulation loop or the temperature of chip 2 is maintained stable by active overload regulation of the heat pump. The working fluid temperature is increased by a heat pump heating subsystem and then dissipated into deep space via radiant heat dissipation terminal 6. Based on the wide temperature range requirements of deep space exploration missions, the electric heating blanket on the back of the radiant heat dissipation terminal 6 is activated when the working fluid temperature is lower than the set value to prevent the working fluid from liquefying.

[0046] In one specific embodiment of the present invention, the microchannel cold plate 1 assembly optionally integrates a micro phase change energy storage cavity; when configured, the energy storage cavity is filled with liquid gallium metal or paraffin / copper foam composite phase change material to provide thermal buffering during short-term (≤10 s) transient heat load spikes; when not configured, transient spikes are handled by active overload regulation of the heat pump heating subsystem.

[0047] The specific embodiments provided by this invention are as follows: Example 1: Cooling System for Low Earth Orbit (LEO) Space Data Center This embodiment is applicable to a high-power-density computing cabin in low Earth orbit (altitude 300–2000 km), with a designed heat dissipation power of 20 kW and a heat flux density of approximately 800 W / cm³. 2 .

[0048] like Figure 1 As shown, the system includes: a microchannel cold plate 1, a chip 2, a magnetic pump 3, a regenerator 4, a magnetically levitated oil-free centrifugal compressor 5, a radiant heat dissipation terminal 6, a throttling valve 7, a liquid storage regulator 8, fluid pipelines 10, and a high-frequency pressure sensor 11. The system architecture includes an optional component, a buffer tank 9, but this component is not enabled (or omitted) in this embodiment. The system uses supercritical carbon dioxide (CO2) as the working fluid. The circulation pressure is set to 8.0 MPa, slightly higher than the critical pressure of CO2 (7.38 MPa). At this pressure, the working fluid is in a pseudo-critical state near 35°C, and its peak specific heat capacity can reach over 20 kJ / (kg·K), approximately four times that of conventional liquids. The total working fluid charge of the system is approximately 2.5 kg.

[0049] like Figure 2 As shown, the microchannel cold plate 1 employs a composite structure of "micro-needle fins + jet impact". The chip 2 is in close contact with the heating wall 12; above the heating wall 12 is a micro-needle fin array 13; above the micro-needle fin array 13 is a jet cavity, with jet nozzles 14 positioned between the jet cavity and the biomimetic fractal microchannel network 15 above it; the outer wall 16 of the cold plate forms the boundary of the flow channel; the working fluid inlet 17 connects to the biomimetic fractal microchannel network 15, and the working fluid outlet 18 is located on one side of the micro-needle fin layer. The coupling mechanism is as follows: when supercritical CO2 enters the biomimetic fractal microchannel network 15 from the working fluid inlet 17, it is vertically impacted by the jet nozzles 14 onto the heating wall 12, and after passing through the micro-needle fin array 13, it flows laterally to the working fluid outlet 18. As it flows through the micro-needles, due to the extremely low viscosity of the supercritical fluid (close to that of a gas), the boundary layer is repeatedly disrupted and reorganized, enhancing convective heat transfer. The jet nozzles 14 provide additional momentum impact. Simulation results show that this composite structure stabilizes the local convective heat transfer coefficient at 28,000–35,000 W / (m²). 2 Within the K range, the temperature difference between the junction temperature of chip 2 and the working fluid is controlled within 4.2℃. Specific parameters are as follows: Microneedle fin array 13: height 120μm, top diameter 50μm, bottom diameter 80μm, spacing between adjacent fins 150μm. The fins are staggered to increase turbulence and heat transfer area.

[0050] Jet nozzle 14: A jet nozzle 14 is provided every 5 mm, with a nozzle diameter of 80 μm. The nozzle directly impacts the main fluid onto the heated wall surface 12, utilizing the high momentum of the jet to strip away the thermal boundary layer.

[0051] like Figure 3As shown, in this embodiment, the parameter changes of supercritical CO2 at various state points in the heat pump heating cycle are marked in the temperature-entropy diagram (Ts diagram) and the pressure-enthalpy diagram (ph diagram). Comparative verification: If a traditional loop heat pipe scheme is used, assuming its heat dissipation temperature is 45℃ (318.15K), while the heat dissipation temperature of the scheme of this invention is 120℃ (393.15 K). According to the Stefan-Boltzmann law, under the condition that the radiator surface area and surface emissivity are the same, the ratio of its heat dissipation power is (393.15 / 318.15). 4 ≈2.32. Therefore, to dissipate 20 kW of heat, the radiator area required by the present invention is approximately 1 / 2.32 ≈ 43% of that of the conventional solution, a reduction of about 57%. If the heat dissipation temperature of the conventional solution is even lower (e.g., 40°C), the advantages of the present invention will be even more pronounced.

[0052] like Figure 4 As shown, the logic flow of the pressure coordination control module includes pressure sampling, rate of change calculation, threshold judgment, and pump-machine coordination control steps. The specific control logic is as follows: High-frequency pressure sensor 11 collects the pressure values ​​at the cold plate outlet and compressor inlet in real time; Controller 19 calculates the pressure change rate δP / δt, and initiates feedforward control when it exceeds 0.5 kPa / s; Fine-tune the compressor speed (in ±2% increments) to change the system back pressure; Simultaneously adjust the flow rate of magnetic pump 3 (step ±3%) to change the circulation speed; By using "pump-machine coordinated" control, pressure fluctuations can be smoothed out within 0.5 seconds, ensuring stable system operation.

[0053] This solution adds zero weight and is suitable for most orbital data center scenarios. To address sudden spikes in computing load, the system also features multiple contingency mechanisms: Active heat pump regulation: By increasing the speed of the magnetic levitation oil-free centrifugal compressor (10-15% overload capacity), the circulation flow rate is increased within 1-2 seconds; Cold plate heat capacity buffer: The cold plate substrate (oxygen-free copper) itself has a heat capacity of about 0.5 kJ / K, which can absorb the temperature rise caused by second-level power spikes; Control algorithm feedforward: Based on chip power prediction, the pump speed and compressor speed are adjusted in advance.

[0054] Example 2: Wide-temperature-range heat dissipation system for deep space exploration missions (including phase change energy storage configuration)

[0055] This embodiment is designed for lunar base or Mars exploration missions, which need to cope with extremely low temperature backgrounds (lunar night temperatures can reach -180°C) and drastic fluctuations in thermal load. Simultaneously, the mission requires the ability to withstand transient jumps from standby to full load (response time <1s), therefore a phase change energy storage module is selected.

[0056] Still Figure 1 As shown, the system architecture is basically the same as in Example 1, but a micro phase-change energy storage cavity (not shown separately in the figure) is integrated inside the cold plate. Calculations show that for a 10-second, 20 kW thermal shock, approximately 250 grams of gallium and a volume of approximately 35 cm³ are required. 3 The impact on the overall satellite weight is less than 0.1%, demonstrating clear engineering economic viability. The specific configuration is as follows: Active heat preservation measures: An electric heating blanket is installed on the back of the radiator, which automatically starts when the working fluid temperature is below 20℃ to prevent CO2 liquefaction (critical temperature 31℃).

[0057] Phase change energy storage buffer: A miniature phase change energy storage cavity (1.5 mm thick, area comparable to the chip) is integrated inside the cold plate, filled with liquid gallium as the sensible heat storage medium. Gallium has a melting point of 29.8℃ and a thermal conductivity of approximately 30 W / (m·K) in its liquid state, far exceeding that of paraffin wax, achieving rapid thermal response without the need for a foamed metal framework. Within a temperature rise range of 30℃ to 60℃, gallium's sensible heat storage density is approximately 80 kJ / kg, and its volumetric heat storage density is approximately 400 MJ / m³. 3 .

[0058] In the microgravity environment of deep space, fluid density wave oscillation is a major risk. This system adopts the pressure-coordinated control module from Example 1. Figure 4 ), and the following optimizations were added: A buffer tank 99 with a volume of about 0.5 L is installed at the outlet of the throttle valve 77 to absorb pressure pulsations; Fuzzy logic is introduced into the control algorithm to dynamically adjust the PID parameters based on the magnitude and duration of the pressure change rate, thereby improving adaptability.

[0059] To address the high-temperature heat dissipation requirements of deep space environments, this embodiment is based on Figure 3 The marked state points adopted the improved Peng-Robinson state equation, and the physical property correlation was refitted for the high-temperature operating condition of 80℃~120℃ at the outlet temperature of the air cooler to ensure the accuracy of the system design.

[0060] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to the method section.

[0061] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An active thermal management system for a space computing module, characterized in that, include: Microchannel cold plate, chip, active pump drive circulation loop, heat pump heating subsystem, radiative heat dissipation terminal and pressure coordination control module; The chip surface is closely attached to a microchannel cold plate, which is connected to an active pump drive circulation loop via a pressure-coordinated control module. The active pump drive circulation loop is connected to a heat pump heating subsystem, which is connected to both the pressure-coordinated control module and a radiant heat dissipation terminal.

2. The active thermal management system for a space computing module according to claim 1, characterized in that, The active pump-driven circulation loop is used to drive supercritical carbon dioxide working fluid to perform forced convection heat transfer within the microchannel cold plate; it includes a magnetic pump, a liquid storage regulator, and liquid pipelines.

3. The active thermal management system for a space computing module according to claim 2, characterized in that, The heat pump heating subsystem is connected in series to the active pump drive circulation loop, and is used to mechanically compress the low-temperature working fluid after absorbing heat from the chip to a high-temperature heat dissipation state; it includes a regenerator and a magnetic levitation oil-free centrifugal compressor.

4. The active thermal management system for a space computing module according to claim 3, characterized in that, The pressure coordination control module includes a high-frequency pressure sensor, a controller, a throttle valve, and a buffer tank; the controller is configured to coordinately adjust the speed of the magnetic pump and the speed of the magnetically levitated oilless centrifugal compressor according to the pressure change rate, in order to suppress fluid density wave oscillations in a microgravity environment.

5. The active thermal management system for a space computing module according to claim 3, characterized in that, The radiative heat dissipation terminal is connected to the output end of the heat pump heating subsystem and is used to discharge the heat carried by the high-temperature working fluid into deep space in the form of infrared radiation.

6. The active thermal management system for a space computing module according to claim 4, characterized in that, The high-frequency pressure sensors are respectively installed at the outlet of the microchannel cold plate and the inlet of the magnetic levitation oil-free centrifugal compressor to collect pressure values ​​in real time and transmit the pressure values ​​to the controller; the inlet of the microchannel cold plate is connected in sequence to a buffer tank and a throttle valve, the buffer tank is located at the outlet of the throttle valve, and the inlet of the throttle valve is connected to the fluid pipeline.

7. The active thermal management system for a space computing module according to claim 1, characterized in that, The microchannel cold plate includes: a heated wall surface, a micro-needle array, a jet nozzle, a biomimetic fractal microchannel network, an outer wall surface of the cold plate, a working fluid inlet, and a working fluid outlet; The chip is attached to the heating wall; above the heating wall is a micro-needle array; above the micro-needle array is a jet cavity, and the jet nozzle is located between the jet cavity and the biomimetic fractal microchannel network above it. The outer wall of the cold plate forms the boundary of the flow channel. The working fluid inlet is connected to the biomimetic fractal microchannel network, and the working fluid outlet is located on one side of the micro-needle layer. Supercritical CO2 enters the biomimetic fractal microchannel network from the working fluid inlet, impacts the heating wall vertically through the jet nozzle, and flows laterally to the working fluid outlet after passing through the micro-needle array.

8. A method for active thermal management of a space computing module, implemented by the system described in any one of claims 1-7, characterized in that, include: Monitor the heat load of the chip and the pressure and temperature of the working fluid at the outlet of the microchannel cold plate; Calculate the pressure change rate based on the monitored data to determine whether it exceeds the threshold. When the threshold is exceeded, the speed of the magnetic pump and the speed of the magnetic levitation oilless centrifugal compressor are adjusted in a coordinated manner through a feedforward control algorithm to suppress fluid oscillation. During transient peak heat loads, depending on the configuration, excess heat is absorbed by a phase change energy storage device integrated into the circulation loop or the chip temperature is maintained stable through active overload regulation of the heat pump. The working fluid temperature is increased by a heat pump heating subsystem and then dissipated into deep space via a radiative heat dissipation terminal. To meet the wide temperature range requirements of deep space exploration missions, the electric heating blanket on the back of the radiant heat dissipation terminal is activated when the working fluid temperature is lower than the set value to prevent the working fluid from liquefying.

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