A eutectic machine

Abstract

The application relates to the field of chip packaging, in particular to a eutectic machine which comprises an operation table, a first rack is fixed on the right side of the operation table along the X axis, and a second rack is fixed on the left side of the operation table; a pickup module which moves along the front-back direction of the Y axis is arranged on the first rack, and a binding head module which moves along the front-back direction of the Y axis is arranged on the second rack; a first transfer eutectic module and a second transfer eutectic module are arranged between the first rack and the second rack; a chip feeding module is arranged on the rear side of the second transfer eutectic module along the Y axis; in the scheme, the number of the transfer eutectic modules is set to two, when one of the transfer eutectic modules is in a left-position chip eutectic waiting state, the other transfer eutectic module is in a right-position state and carries out chip feeding by the pickup module or chip unloading after eutectic completion; under the condition that the chip eutectic time does not change, the eutectic efficiency of the chip module is improved.

Description

Technical Field

[0001] This invention relates to the field of chip packaging, and in particular to a eutectic reactor. Background Technology

[0002] The eutectic bonding machine is a core piece of equipment in the semiconductor packaging process. Its core working principle is to accurately pick up the chip module and stably and precisely bond it to a preset position. The operating accuracy and efficiency of the equipment directly determine the yield, precision, and production efficiency of the semiconductor packaged product. It is a core piece of equipment for controlling the quality of semiconductor products and ensuring the stable operation of the packaging process, and it occupies an indispensable position in the back-end packaging manufacturing of semiconductors.

[0003] In the patent publication number CN120184063B, entitled "Eutectic Machine and Eutectic Process Method", a first robotic arm transports the substrate to the eutectic stage, a second robotic arm transports the chip to the transfer component, and the transfer component and the binding head module cooperate to perform eutectic bonding of the chip and the substrate.

[0004] However, the chip eutectic process is time-consuming. During this time, the first robotic arm, the second robotic arm, the transfer platform and other transfer components need to wait for the chip to complete the eutectic process and form a chip module before they can perform subsequent operations, resulting in low eutectic efficiency.

[0005] In summary, without changing the chip eutectic time, improving the eutectic efficiency of chip modules has become an urgent problem for researchers in this field. Summary of the Invention

[0006] The technical problem to be solved by this invention is: how to improve the co-crystallization efficiency of chip modules without changing the chip co-crystallization time.

[0007] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: This invention is a eutectic machine, including an operating table, on which a first frame is fixed to the right side of the X-axis and a second frame is fixed to the left side of the X-axis; The first frame is equipped with a pickup module that moves along the Y-axis in the front-back direction, and the second frame is equipped with a head-binding module that moves along the Y-axis in the front-back direction. A first transfer eutectic module and a second transfer eutectic module are provided between the first rack and the second rack. Both the first transfer eutectic module and the second transfer eutectic module can move linearly along the X-axis. A chip loading module is provided on the rear side of the second transfer eutectic module in the Y-axis direction; The picking module picks up the chip module (chip or substrate) from the chip loading module and transfers it to the first transit eutectic module located on the right. The first transit eutectic module moves to the left. The binding module picks up the chip module on the first transit eutectic module for eutectic bonding. At the same time, the second transit eutectic module moves the eutectic bonded chip module from the left to the right. The picking module then picks up and unloads the eutectic bonded chip module from the second transit eutectic module.

[0008] Furthermore, the process of picking up and unloading the eutectic chip module specifically involves the picking module picking up the eutectic chip module and placing it into a collection box outside the operating table or picking it up again and placing it onto the chip loading module.

[0009] Furthermore, both the first and second transit eutectic modules include a fixed base on the operating table. The top surface of the fixed base is provided with a slide rail, and a sliding plate that can move along the X-axis is provided on the slide rail. The sliding plate is provided with a eutectic stage and a transit stage.

[0010] Furthermore, the eutectic stage and the transfer stage are arranged in a front-to-back direction along the Y-axis on the slide plate.

[0011] Furthermore, a negative pressure platform is provided protruding from the transfer platform, and negative pressure holes for adsorbing chip modules are opened on the negative pressure platform.

[0012] Furthermore, the eutectic stage includes a stage body, and a eutectic cavity is recessed on the upper surface of the stage body. A heating element and a cover plate adsorbed on the upper surface of the stage body are disposed in the eutectic cavity. An opening is provided on the cover plate, and the opening is connected to the eutectic cavity.

[0013] Furthermore, pressure strips are provided on both sides of the platform body. The pressure strips are located in the eutectic cavity and their bottoms act on the heating element to press the heating element into the eutectic cavity.

[0014] Furthermore, the portion of the bottom of the eutectic cavity not covered by the heating element has a stepped portion protruding outwards, and a first nitrogen pore with an upward opening is formed on the horizontal surface of the stepped portion.

[0015] Furthermore, a fixing block is provided on one side of the platform body, and a second nitrogen gas hole with a horizontal opening is provided on the fixing block. The second nitrogen gas hole is higher than the top surface of the cover plate.

[0016] Furthermore, a chip attitude adjustment module is provided on the rear side of the second transfer eutectic module in the Y-axis direction, and near the first rack.

[0017] Furthermore, a chip calibration module is provided on the rear side of the second transfer eutectic module in the Y-axis direction, and near the second rack.

[0018] Furthermore, the chip loading module has an X-axis linear module and a turntable disposed at the movable end of the X-axis linear module.

[0019] The beneficial effects of this invention are as follows: This invention is a eutectic reflow machine. Because this solution uses two intermediate eutectic reflow modules, one of which is in the left-hand position while the chip module is waiting for eutectic reflow, the other is in the right-hand position where the pick-up module picks up the chip module for loading or unloading after picking up the eutectic. This improves the eutectic efficiency of the chip module without changing the chip eutectic reflow time. Furthermore, the chip loading module, intermediate eutectic reflow module, pick-up module, and binding head module all move along two axes in a linear motion. The reasonable layout of these modules further improves the chip module picking accuracy and eutectic efficiency. Attached Figure Description

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0021] Figure 1 This is a layout diagram of this embodiment; Figure 2 This is a schematic diagram of the structure of the first and second transfer eutectic modules; Figure 3 This is a structural diagram of the transfer station; Figure 4 This is a schematic diagram of the eutectic stage; Figure 5 This is a schematic diagram of the eutectic stage without the cover plate; Figure 6 This is a schematic diagram of the chip calibration module.

[0022] In the diagram: 1-First frame, 2-Second frame, 3-Pickup module, 4-Tied head module, 5-First transit eutectic module, 51-Fixed base, 52-Slide rail, 53-Slide plate, 54-Eutectic stage, 541-Stage body, 542-Eutectic cavity, 543-Heating element, 544-Cover plate, 545-Opening, 546-Pressure strip, 547-Step section, 548-First nitrogen port, 549-Fixed block, 510-Second nitrogen port, 55-Transfer stage, 551-Negative pressure stage, 552-Negative pressure hole, 6-Second transit eutectic module, 7-Chip loading module, 8-Attitude adjustment module, 9-Chip calibration module, 91-Origin calibration stage, 92-Calibration stage, 93-Pressure and tensile testing stage, 94-Vision inspection stage, 10-Operating table. Detailed Implementation

[0023] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the invention, and therefore only show the components relevant to the invention.

[0024] See Figure 1 This embodiment is a eutectic reactor, including an operating table 10. A first frame 1 is fixed to the right side of the X-axis on the operating table 10, and a second frame 2 is fixed to the left side of the X-axis. A pickup module 3 that moves along the Y-axis is provided on the first frame 1, and a binding head module 4 that moves along the Y-axis is provided on the second frame 2. A first transfer eutectic module 5 and a second transfer eutectic module 6 are arranged between the first frame 1 and the second frame 2, and are arranged in parallel front to back. Both the first transfer eutectic module 5 and the second transfer eutectic module 6 can move linearly along the X-axis. A chip loading module 7 is provided behind the second transfer eutectic module 6 in the Y-axis direction. 7. Under the action of the X-axis linear module and the turntable, the chip module is moved to a position directly below the pickup module 3. The pickup module 3 moves downward to pick up the chip module (chip or substrate) on the chip loading module 7 and transfer it to the first intermediate eutectic module 5, which is located on the right. The first intermediate eutectic module 5 moves to the left. The binding module 4 picks up the chip on the first intermediate eutectic module 5 and performs eutectic bonding with the substrate. At the same time, the second intermediate eutectic module 6 completes the eutectic bonding of the chip module and moves it from the left to the right. The pickup module 3 picks up the eutectic bonded chip module from the second intermediate eutectic module 6 and unloads it. The positions of the first intermediate eutectic module 5 and the second intermediate eutectic module 6 on the operating table 10 can be interchanged.

[0025] In this embodiment, by setting a first transfer eutectic module 5 and a second transfer eutectic module 6, when the first transfer eutectic module 5 is in the left position, the binding head module 4 picks up the chip on it and performs eutectic bonding with the substrate. At the same time, the second transfer eutectic module 6 is in the right position, and the picking module 3 is used to pick up the chip and substrate sequentially onto the second transfer eutectic module 6 or to pick up the chip module in the second transfer eutectic module 6 after eutectic bonding is completed.

[0026] In other words, since the number of intermediate eutectic modules is set to two in this embodiment, when one intermediate eutectic module is in the left position waiting for eutectic bonding, the other intermediate eutectic module is in the right position and the chip and substrate are loaded by the picking module 3 or the chip module (chip and substrate are bonded after eutectic bonding) is unloaded. The eutectic bonding efficiency of the chip module is improved without changing the chip eutectic bonding time.

[0027] Specifically, the chip loading module 7 first moves the substrate or chip directly below the pickup module 3 through the adjustment of the X-axis linear module and the turntable. The pickup module 3 then picks up the substrate and chip and places them on the right-hand intermediate eutectic module. The intermediate eutectic module moves to the left, and the bonding module 4 picks up the chip and places it in the eutectic stage 54 of the intermediate eutectic module, completing the bonding of the chip and the substrate. Finally, the intermediate eutectic module moves to the right, and the pickup module 3 picks up the eutectic chip module. It should be noted that the first intermediate eutectic module 5 and the second intermediate eutectic module 6 are single-axis linear motion (X-axis motion). Compared with the traditional two-axis linear eutectic stage, this embodiment can meet the high-precision chip picking and eutectic requirements. It should be added that both the pickup module 3 and the binding head module 4 can achieve Y-axis movement and lifting movement. The lifting movement of the binding head module 4 can not only pick up the chip, but also press the upper surface of the chip during chip eutectic bonding, apply a certain downward pressure to the chip, and press the chip firmly onto the substrate.

[0028] In some possible embodiments, the chip module after eutectic bonding is picked up and unloaded specifically by the picking module 3 picking up the chip module and placing it into a collection box outside the operating table 10 or picking it up again onto the chip loading module 7; In this embodiment, the chip module after eutectic bonding is picked up by the picking module 3 and placed into the collection box, or picked up again and placed onto the chip loading module 7.

[0029] See Figure 2 In some possible embodiments, the first transfer eutectic module 5 and the second transfer eutectic module 6 both include a fixed base 51 fixed on the operating table 10. The top surface of the fixed base 51 is provided with a slide rail 52. The slide rail 52 is provided with a sliding plate 53 that can move along the X-axis direction. The sliding plate 53 is provided with a eutectic stage 54 and a transfer stage 55. In this embodiment, the first transfer eutectic module 5 and the second transfer eutectic module 6 have the same structure. The slide plate 53 can be slidably mounted on the fixed base 51 along the X-axis direction through the slide rail 52 and the slider. The slide plate 53 is provided with a eutectic stage 54 and a transfer stage 55. The pick-up module 3 places the chip and substrate on the transfer stage 55 or picks up the chip module after eutectic bonding from the transfer stage 55. The bonding module 4 places the chip on the transfer stage 55 into the eutectic stage 54 for eutectic bonding and then bonds it to the substrate.

[0030] See Figure 2 In some possible embodiments, the eutectic stage 54 and the transfer stage 55 are arranged in a front-to-back direction along the Y-axis on the slide plate 53; In this embodiment, since the pickup module 3 and the binding module 4 move along the Y-axis, the eutectic stage 54 and the transfer stage 55 are set in the Y-axis forward and backward direction.

[0031] See Figure 3 In some possible embodiments, the transfer station 55 is provided with a plurality of negative pressure platforms 551 protruding from it, and the negative pressure platforms 551 are provided with negative pressure holes 552 for adsorbing chip modules. In this embodiment, when the chip module is placed on the transfer platform 55, the chip module is adsorbed onto the top of the corresponding negative pressure platform 551 through the negative pressure hole 552.

[0032] See Figure 4 , 5 In some possible embodiments, the eutectic stage 54 includes a stage body 541, a eutectic cavity 542 is recessed on the upper surface of the stage body 541, a heating element 543 is disposed in the eutectic cavity 542 and a cover plate 544 is adsorbed on the upper surface of the stage body 541, and an opening 545 is provided on the cover plate 544, the opening 545 is connected to the eutectic cavity 542; In this embodiment, the heating element 543 is used to heat the temperature inside the eutectic cavity 542. The cover plate 544 is connected to the stage body 541 by magnetic attraction. The size of the opening 545 on the cover plate 544 is smaller than the cross-sectional size of the eutectic cavity 542. This arrangement of the cover plate 544 can prevent the loss of heat inside the eutectic cavity 542.

[0033] See Figure 4 , 5 In some possible embodiments, pressure strips 546 are provided on both sides of the platform body 541. The pressure strips 546 are partially located in the eutectic cavity 542, and their bottoms act on the heating element 543 to press the heating element 543 into the eutectic cavity 542. In this embodiment, the top end of the pressure strip 546 is fixed to the upper surface of the stage body 541, and the bottom end of the pressure strip 546 contacts the heating element 543. The heating element 543 is pressed tightly onto the bottom of the eutectic cavity 542 by setting the pressure strip 546.

[0034] See Figure 4 , 5 In some possible embodiments, the bottom of the eutectic cavity 542, which is not covered by the heating plate 543, is provided with a stepped portion 547, and a first nitrogen gas hole 548 with an upward opening is provided on the horizontal surface of the stepped portion 547. In this embodiment, the stepped portion 547 is located on the left and right sides inside the eutectic cavity 542. A plurality of first nitrogen holes 548 are opened on the horizontal surface of the top of the stepped portion 547. The height of the first nitrogen holes 548 is higher than or flush with the upper surface of the heating element 543. Nitrogen gas is discharged from the first nitrogen holes 548. The nitrogen gas impacts the inner top surface of the cover plate 544 upward and then flows horizontally to form an air curtain, which enables the chip to solidify quickly and prevents oxygen from entering the eutectic cavity 542 from the opening 545, thus preventing the chip from oxidizing during the heating process.

[0035] See Figure 4 , 5 In some possible embodiments, a fixing block 549 is provided on one side of the platform body 541, and a second nitrogen hole 510 with a horizontal opening is provided on the fixing block 549. The second nitrogen hole 510 is higher than the top surface of the cover plate 544. In this embodiment, the purpose of providing the second nitrogen vent 510 is the same as that of providing the first nitrogen vent 548, forming an air curtain at the opening 545 of the cover plate 544 to prevent oxygen from entering the eutectic cavity 542.

[0036] See Figure 1 , 6 In some possible embodiments, a chip attitude adjustment module 8 is provided on the rear side of the second transfer eutectic module 6 in the Y-axis direction and near the first rack 1; a chip calibration module 9 is provided on the rear side of the second transfer eutectic module 6 in the Y-axis direction and near the second rack 2. In this embodiment, after the picking module 3 picks up the chip, it can place the chip on the chip attitude adjustment module 8 to flip the chip or adjust its position, and then accurately transfer the chip to the transfer station 55. After the binding module 4 picks up the chip, it can place the chip on the chip calibration module 9 to calibrate the chip. The chip calibration module 9 includes an origin calibration stage 91, a calibration stage 92, a pressure and tension detection stage 93, and a vision inspection stage 94. The chip calibration module 9 can accurately adjust the position of the chip, and the adjusted chip can be accurately picked up by the binding module 4 to participate in the eutectic process.

[0037] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A eutectic machine, characterized in that, Includes an operating table (10), on which a first frame (1) is fixed to the right side of the X-axis and a second frame (2) is fixed to the left side of the X-axis; The first frame (1) is provided with a picking module (3) that moves along the Y-axis in the front-back direction, and the second frame (2) is provided with a head-binding module (4) that moves along the Y-axis in the front-back direction. A first transfer eutectic module (5) and a second transfer eutectic module (6) are provided between the first frame (1) and the second frame (2). Both the first transfer eutectic module (5) and the second transfer eutectic module (6) can move linearly along the X-axis. A chip loading module (7) is provided on the rear side of the second transfer eutectic module (6) in the Y-axis direction; The picking module (3) picks up the chip module on the chip loading module (7) and transfers it to the first transit eutectic module (5) which is located on the right. The first transit eutectic module (5) moves to the left. The binding module (4) picks up the chip module on the first transit eutectic module (5) for eutectic crystallization. At the same time, the second transit eutectic module (6) moves the chip module after eutectic crystallization from the left to the right. The picking module (3) picks up the chip module after eutectic crystallization from the second transit eutectic module (6) and places it into the collection box outside the operating table (10) or picks it up again onto the chip loading module (7).

2. The eutectic machine according to claim 1, characterized in that, The first transit eutectic module (5) and the second transit eutectic module (6) both include a fixed base (51) fixed on the operating table. The top surface of the fixed base (51) is provided with a slide rail (52). The slide rail (52) is provided with a sliding plate (53) that can move along the X-axis. The sliding plate (53) is provided with a eutectic stage (54) and a transit stage (55).

3. The eutectic machine according to claim 2, characterized in that, The eutectic stage (54) and the transfer stage (55) are arranged in the Y-axis front-back direction on the slide plate (53).

4. The eutectic machine according to claim 2, characterized in that, The transfer station (55) is provided with a negative pressure platform (551) protruding from it, and the negative pressure platform (551) is provided with a negative pressure hole (552) for adsorbing the chip module.

5. The eutectic machine according to claim 2, characterized in that, The eutectic stage (54) includes a stage body (541), a eutectic cavity (542) is recessed on the upper surface of the stage body (541), a heating element (543) and a cover plate (544) adsorbed on the upper surface of the stage body (541) are disposed in the eutectic cavity (542), and an opening (545) is provided on the cover plate (544), which is connected to the eutectic cavity (542).

6. The eutectic machine according to claim 5, characterized in that, Pressure strips (546) are provided on both sides of the platform body (541). The pressure strips (546) are partially located in the eutectic cavity (542), and their bottoms are applied to the heating element (543) to press the heating element (543) into the eutectic cavity (542).

7. The eutectic machine according to claim 5, characterized in that, The bottom of the eutectic cavity (542) not covered by the heating plate (543) is provided with a stepped portion (547), and a first nitrogen gas hole (548) with an upward opening is provided on the horizontal surface of the stepped portion (547).

8. The eutectic machine according to claim 5, characterized in that, A fixing block (549) is provided on one side of the platform body (541), and a second nitrogen hole (510) with a horizontal opening is provided on the fixing block (549). The second nitrogen hole (510) is higher than the top surface of the cover plate (544).

9. The eutectic machine according to claim 1, characterized in that, A chip attitude adjustment module (8) is provided on the rear side of the second transfer eutectic module (6) in the Y-axis direction and near the first rack (1); a chip calibration module (9) is provided on the rear side of the second transfer eutectic module (6) in the Y-axis direction and near the second rack (2).

10. The eutectic machine according to claim 1, characterized in that, The chip loading module (7) has an X-axis linear module and a turntable disposed at the movable end of the X-axis linear module.

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