Edge polishing device for chip production and processing

Abstract

This invention discloses an edge polishing device for chip manufacturing, relating to the field of chip manufacturing technology. It includes a U-shaped support frame and two side plates located on its inner side. A rotating mechanism is located on the inner side of the U-shaped support frame, positioned at the front of the side plates. Four clamping mechanisms, driven by the rotating mechanism, are positioned between the two side plates. A second polishing mechanism, a first polishing mechanism, and a drying mechanism are also positioned between the two side plates. A notch is provided on the left side of each side plate, and the notch, the second polishing mechanism, the first polishing mechanism, and the drying mechanism are evenly distributed clockwise. This edge polishing device for chip manufacturing, through the rotating mechanism driving the clamping components to rotate, allows the wafer to switch between the first polishing mechanism, the second polishing mechanism, the loading / unloading position, and the drying mechanism. Simultaneously, the multiple clamping mechanisms improve the polishing efficiency of the wafer chip.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing and processing technology, and in particular to an edge polishing device for chip manufacturing and processing. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seed, then slowly pulled out to form a cylindrical single-crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod is formed into a silicon wafer. After slicing, the edges of the wafer need to be polished to make it regular, so that it can be accurately positioned when manufacturing chips later.

[0003] Chinese patent document CN222199938U discloses a novel edge polishing device for wafer production, belonging to the technical field of wafer processing. It includes a worktable, a polishing mechanism mounted on the worktable, and a clamping mechanism for holding and driving the wafer to rotate. The polishing mechanism includes a first servo linear guide slide fixed to the worktable, with a polishing plate fixed on the slide. This application uses adsorption and fixation at the four corners of the wafer, which does not affect the effective working surface of the wafer and does not affect subsequent chip manufacturing, greatly reducing the scrap rate of chip products and thus improving production efficiency. Simultaneously, the clamping mechanism provides stable clamping and, in conjunction with the bottom support balancing component, ensures smooth wafer rotation, resulting in a rounded and neatly processed wafer.

[0004] The existing technology has the following problems: The existing wafer manufacturing process involves multiple steps, such as edge polishing, notch polishing, and drying. These steps are often performed by independent equipment, which results in a significant waste of time and reduced production efficiency when wafers are transferred between different devices. Summary of the Invention

[0005] The main objective of this invention is to provide an edge polishing device for chip manufacturing, which can effectively solve the problem of reduced production efficiency caused by wafer transfer between devices.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: An edge polishing device for chip manufacturing includes a U-shaped support frame and two front and rear side plates disposed on its inner side. The inner side of the U-shaped support frame is provided with a rotating mechanism located on the front side of the side plates. Four clamping mechanisms driven to revolve by the rotating mechanism are provided between the two side plates. A second polishing mechanism, a first polishing mechanism, and a drying mechanism are provided between the two side plates. A notch is opened on the left side of the two side plates, and the notch, the second polishing mechanism, the first polishing mechanism, and the drying mechanism are evenly distributed clockwise. The clamping mechanism includes a clamping component that adheres to the wafer by means of its bottom. During the revolution, the lower adsorption position of the clamping component always faces downward. A conveyor belt is set at the notch to transport the wafer. The clamping component picks up and puts the wafer from the notch. The rotating mechanism drives it to rotate clockwise in sequence through the second polishing mechanism, the first polishing mechanism and the drying mechanism, and then back to the notch.

[0007] Preferably, the clamping mechanism further includes a moving rod directly driven by the rotating mechanism. The rotating mechanism is equipped with an electric cylinder component for controlling the forward and backward movement of the moving rod. A rotating platform is rotatably connected to the rear side of the moving rod. The upper side of the clamping assembly is located below the rotating platform. A retaining ring is fixedly connected to the left side of the rotating platform. A guide rod is fixedly connected to the rear side of the front side plate near the left side. When the moving rod rotates clockwise, the guide rod is movably sleeved into the retaining ring. When the moving rod rotates from the bottom to the left side, the rotating platform rotates to the left.

[0008] Preferably, the drying mechanism includes a rotating frame, several first sleeves fixedly connected to its lower side, and an upper and lower sealing shell that are fastened together. The front and rear sides of the upper sealing shell are fixedly connected between two side plates. Several evenly distributed second sleeves are fixedly connected to the upper side of the upper sealing shell. The outer side of the second sleeves is sleeved on the inner side of the first sleeves. The clamping assembly located at the bottom is placed inside the upper and lower sealing shells. A slot for accommodating a moving rod is opened on the front side of the upper sealing shell. A push plate for sealing the slot is fixedly connected to the outer side of the moving rod.

[0009] Preferably, the drying mechanism further includes a rotating rod directly driven by the rotating mechanism and four levers fixedly connected to its outer side. The upper side of the rotating frame is rotatably connected to the outer side of the rotating rod. Push shafts are slidably connected to the front and rear sides of the rotating frame. A first guide plate is fixedly connected to the bottom of the two side plates on the side that are close to each other. Rollers driven by the first guide plates are provided on the front and rear sides of the upper side of the lower cover. When the rotating frame rotates from the lower right side to the lower left side, the lower cover moves away from the center of rotation and then resets.

[0010] Preferably, a second guide plate is fixedly connected between the two side plates. The second guide plate has a first guide groove for driving the push shaft away from the center of rotation. A reset structure is provided between the rotating position of the rotating frame and the side plate. When the push shaft is located at the farthest point away from the center of rotation, the lever can no longer push the push shaft, so that the rotating frame is reset. The rotation range of the rotating frame is less than ninety degrees.

[0011] Preferably, a positioning assembly is fixedly connected to the upper middle part of the lower cover. The positioning assembly includes a limiting tube, a first spring placed inside it, and a push rod. The first spring is located on the upper side of the push rod. The lower end of the push rod passes through the upper wall of the lower cover and is fixedly connected to an electromagnetic adsorption seat. The lower side of the electromagnetic adsorption seat is electromagnetically adsorbed on the upper side of the rotating table.

[0012] Preferably, a plurality of second sleeves are rotatably connected to the inner side of each of them, the blower assembly including a telescopic transmission rod and a rotating plate fixedly connected to its upper side, a fan is rotatably connected to the top inner side of the lower cover, the lower end of the telescopic transmission rod is connected to the rotating position of the fan by a universal joint coupling, a first spiral groove is provided on the inner side of the first sleeve, the outer side of the rotating plate is slidably connected to the inner side of the first spiral groove by a sliding shaft, and a second spring is sleeved on the inner side of the first sleeve, and the second spring is located between the second sleeve and the rotating plate.

[0013] Preferably, the rear side of the rear side plate is provided with a transfer mechanism for controlling the forward and backward movement of the first grinding mechanism and the second grinding mechanism. Two water-blocking mechanisms are rotatably connected between the two side plates. The water-blocking mechanism includes a drive rod driven to move forward and backward by the transfer mechanism, a rotating tube rotatably connected between the two side plates, and a water-blocking arc plate placed under the grinding equipment. The water-blocking arc plate and the drive rod are connected by a plate. The inner side of the rotating tube is provided with a second spiral groove. The outer side of the drive rod is movably sleeved on the inner side of the rotating tube, and is slidably connected to the second spiral groove by a sliding shaft.

[0014] Preferably, the front side of the side plate located on the front side is provided with an annular groove for the movable rod to move. A follower ring placed in the annular groove is rotatably connected to the outer side of the movable rod. A plurality of evenly distributed first airbags are fixedly connected to the rear side of the movable rod, and the first airbags are located around the movable rod. A plurality of evenly distributed second airbags are fixedly connected to the rear side of the movable rod, and the second airbags are located at the position where the water-blocking arc plate contacts the follower ring. The first airbags and the second airbags are interconnected.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. This invention provides an edge polishing device for chip manufacturing and processing. Based on the cooperation of a rotating mechanism, a clamping mechanism, a moving rod, a rotating table, a clamping assembly, a push plate, a retaining ring, a transfer mechanism, a first polishing mechanism, a second polishing mechanism, a guide rod, and a drying mechanism, the rotating mechanism drives the clamping assembly to revolve, so that the wafer can be transferred between the first polishing mechanism, the second polishing mechanism, the loading and unloading position, and the drying mechanism. At the same time, multiple clamping mechanisms are set up to improve the polishing efficiency of the wafer chip.

[0016] 2. This invention provides an edge polishing device for chip manufacturing and processing. Based on the cooperation of a drying mechanism, a rotating frame, a first sleeve, a second sleeve, an upper cover, a lower cover, a positioning component, a limiting tube, a first spring, a push rod, an electromagnetic adsorption seat, a blowing component, a telescopic transmission rod, a rotating plate, a second spring, a fan, a rotating rod, a lever, a push shaft, a first guide plate, and a second guide plate, the rotating frame is driven by the rotating mechanism. This achieves sealing, auxiliary drying, and equipment positioning of the wafer in the drying area without additional power, thereby improving drying efficiency. It also avoids the direct fastening of electrically driven components, which would otherwise require additional power and additional coordination procedures between power sources. Attached Figure Description

[0017] Figure 1 This is a front-view stereoscopic structural diagram of the present invention; Figure 2 This is a rear-view three-dimensional structural diagram of the present invention; Figure 3 This is a partial cross-sectional three-dimensional structural schematic diagram of the present invention; Figure 4 This is a three-dimensional structural diagram of the rotating mechanism part of the present invention; Figure 5 This is a three-dimensional structural diagram of the guide rod portion of the present invention; Figure 6 This is a three-dimensional structural diagram of the drying mechanism of the present invention; Figure 7 This is a three-dimensional structural diagram of the rotating frame part of the present invention; Figure 8 This is a three-dimensional structural diagram of the second guide plate portion of the present invention; Figure 9 This is a partial cross-sectional three-dimensional structural diagram of the upper sealing shell portion of the present invention; Figure 10 This is a partial cross-sectional three-dimensional structural diagram of the blower assembly of the present invention; Figure 11 This is a partial cross-sectional three-dimensional structural schematic diagram of the water-blocking mechanism of the present invention; Figure 12 For the present invention Figure 11Enlarged structural diagram of part A in the middle.

[0018] In the diagram: 1. U-shaped support frame; 2. Side plate; 3. Rotating mechanism; 4. Clamping mechanism; 41. Moving rod; 42. Rotating table; 43. Clamping assembly; 44. Push plate; 45. Snap ring; 5. Transfer mechanism; 6. First grinding mechanism; 7. Second grinding mechanism; 8. Drying mechanism; 81. Rotating frame; 82. First sleeve; 83. Second sleeve; 84. Upper cover; 85. Lower cover; 86. Positioning assembly; 861. Limiting tube; 862. First spring ; 863, push rod; 864, electromagnetic adsorption seat; 87, blower assembly; 871, telescopic transmission rod; 872, rotating plate; 873, second spring; 874, fan; 88, rotating rod; 89, lever; 810, push shaft; 811, first guide plate; 812, second guide plate; 9, water-blocking mechanism; 91, water-blocking arc plate; 92, drive rod; 93, rotating tube; 10, guide rod; 11, follower ring; 12, first airbag; 13, second airbag. Detailed Implementation

[0019] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0020] Example 1, as Figures 1-4 As shown, an edge grinding device for chip manufacturing includes a U-shaped support frame 1 and two side plates 2 located on its inner side. The inner side of the U-shaped support frame 1 is provided with a rotating mechanism 3 located on the front side of the side plate 2. The rotating mechanism 3 drives the clamping mechanism 4 to revolve in the form of a motor-driven ring frame. Four clamping mechanisms 4 driven by the rotating mechanism 3 are provided between the two side plates 2. A second polishing mechanism 7, a first polishing mechanism 6, and a drying mechanism 8 are provided between the two side plates 2. The second polishing mechanism 7 and the first polishing mechanism 6 are used to polish the edge of the wafer and the notch, respectively. A notch is provided on the left side of the two side plates 2, and the notch, the second polishing mechanism 7, the first polishing mechanism 6, and the drying mechanism 8 are evenly distributed clockwise. The clamping mechanism 4 includes a clamping component 43 that adsorbs the wafer by relying on the bottom. The clamping component 43 uses a suction cup to adsorb the upper edge of the wafer. At the same time, the clamping component 43 has the function of rotating and lifting the wafer, which is the prior art. During its revolution, the lower adsorption position of the clamping component 43 always faces downward. This downward orientation prevents the water sprayed for cooling during the polishing process from flowing onto the clamping component 43. A conveyor belt is installed at the notch to transport the wafer. The clamping component 43 picks up and puts the wafer from the notch, and the rotating mechanism 3 drives it to rotate clockwise, passing through the second polishing mechanism 7, the first polishing mechanism 6, and the drying mechanism 8 in sequence before returning to the notch.

[0021] It should be noted that the rotating mechanism 3 drives the four clamping mechanisms 4 to revolve. Subsequently, the four clamping mechanisms 4 perform notch grinding, edge grinding, drying, and loading / unloading respectively, so that the wafer can be quickly switched between the four stations, shortening the time consumed by the wafer during equipment switching.

[0022] Example 2, as Figures 3-5 As shown, the clamping mechanism 4 also includes a moving rod 41 that is directly driven by the rotating mechanism 3. The rotating mechanism 3 is provided with an electric cylinder component that controls the forward and backward movement of the moving rod 41. The rear side of the moving rod 41 is rotatably connected to a rotating table 42. The rotation structure between the moving rod 41 and the rotating table 42 is provided with a self-locking function. When relative rotation between the moving rod 41 and the rotating table 42 is not required, self-locking is performed to avoid affecting the grinding. The upper side of the clamping assembly 43 is located on the lower side of the rotating platform 42. A retaining ring 45 is fixedly connected to the left side of the rotating platform 42. The retaining ring 45 is provided with a notch, which is used for the connection position between the guide rod 10 and the side plate 2 to pass through. The guide rod 10 is fixedly connected to the rear side of the side plate 2 located on the front side near the left side. The moving rod 41 rotates clockwise so that the guide rod 10 is movably sleeved into the retaining ring 45. When the moving rod 41 rotates from the bottom to the left side, the rotating platform 42 rotates to the left.

[0023] It should be noted that the rotating mechanism 3 drives the rotating platform 42 to rotate clockwise, so that the lowermost rotating platform 42 moves towards the notch when it rotates. When the guide rod 10 is inserted into the retaining ring 45, the rotating platform 42 and the moving rod 41 rotate relative to each other as the rotating mechanism 3 rotates, so that the wafer is disengaged from the rear side of the moving rod 41, which facilitates the placement of the conveyor belt for transporting the wafer. When the rotating mechanism 3 continues to drive the rotating platform 42 to rotate, so that the guide rod 10 is disengaged from the retaining ring 45, the rotating platform 42 is exactly reset relative to the moving rod 41.

[0024] Example 3, as Figures 9-10 As shown, the drying mechanism 8 includes a rotating frame 81, several first sleeves 82 fixedly connected to its lower side, and an upper cover 84 and a lower cover 85 that are fastened together. A sealing measure is provided between the second sleeve 83 and the upper cover 84. The upper cover 84 is provided with a nozzle for injecting DI water, a valve for injecting IPA vapor, a valve for injecting nitrogen, and a discharge port for discharging water and gas. The front and rear sides of the upper cover 84 are fixedly connected between two side plates 2. Several evenly distributed second sleeves 83 are fixedly connected to the upper side of the upper cover 84. The outer side of the second sleeve 83 is sleeved on the inner side of the first sleeve 82. The first sleeve 82 and the second sleeve 83 can slide relative to each other to act as telescopic rods. The clamping assembly 43 located at the bottom is placed inside the upper cover 84 and the lower cover 85. The front side of the upper cover 84 is provided with a slot for accommodating the moving rod 41. A push plate 44 for blocking the slot is fixedly connected to the outer side of the moving rod 41.

[0025] It should be noted that after the rotating mechanism 3 drives the clamping assembly 43 to rotate from the right side to the lower side, it moves between the upper cover 84 and the lower cover 85. The relative locking of the upper cover 84 and the lower cover 85 achieves Marangoni drying of the wafer.

[0026] Preferably, the drying mechanism 8 also includes a rotating rod 88 directly driven by the rotating mechanism 3 and four levers 89 fixedly connected to its outer side. When the rotating mechanism 3 drives the clamping assembly 43 to rotate, it drives the rotating rod 88 to rotate. When the rotating rod 88 rotates, it drives the levers 89 to rotate. The upper side of the rotating frame 81 is rotatably connected to the outer side of the rotating rod 88. Push shafts 810 are slidably connected to the front and rear sides of the rotating frame 81. When the levers 89 rotate, they push the push shafts 810, causing the push shafts 810 to drive the rotating frame 81 to rotate. The bottom of each of the two side plates 2, which are close to each other, is fixedly connected to a first guide plate 811. The first guide plate 811 is provided with a second guide groove. The upper front and rear sides of the lower cover 85 are provided with rollers driven by the first guide plate 811. The rollers are slidably connected in the second guide groove. When the rotating frame 81 rotates from the lower right side to the lower left side, the lower cover 85 moves away from the center of rotation and then resets.

[0027] Preferably, a second guide plate 812 is fixedly connected between the two side plates 2. The second guide plate 812 has a first guide groove on which the drive shaft 810 is far away from the center of rotation. A reset structure is provided between the rotating position of the rotating frame 81 and the side plate 2. This reset structure can be a torsion spring. When the rotating frame 81 rotates to the lower left side, the rotating frame 81 resets. When the drive shaft 810 is at the farthest side away from the center of rotation, the lever 89 can no longer push the drive shaft 810, so that the rotating frame 81 resets. The rotation amplitude of the rotating frame 81 is less than ninety degrees.

[0028] It should be noted that the rotation of the rotating frame 81 drives the rotation of the lower cover 85, avoiding the lower cover 85 being directly placed on the upper cover 84. This would require the use of an active up-and-down moving device, resulting in an increase in the power structure. The rotation of the rotating mechanism 3 is used to move the lower cover 85 closer to or away from the upper cover 84.

[0029] Preferably, a positioning component 86 is fixedly connected to the upper middle part of the lower cover 85. The positioning component 86 includes a limiting tube 861, a first spring 862 placed inside it, and a push rod 863. The first spring 862 is located above the push rod 863. When the rotating frame 81 is at both ends of the rotation amplitude, the lower cover 85 is driven by the first guide plate 811 and moves closer to the rotation center of the rotating frame 81. The lower end of the push rod 863 passes through the upper wall of the lower cover 85 and is fixedly connected to an electromagnetic adsorption seat 864. The lower side of the electromagnetic adsorption seat 864 is electromagnetically adsorbed on the upper side of the rotating table 42.

[0030] It should be noted that when the rotating frame 81 is located on the lower right side, the first spring 862 pushes the push rod 863, causing the electromagnetic adsorption seat 864 to move out of the lower cover 85. As a result, when the clamping assembly 43 approaches the lower cover 85, the rotating table 42 first contacts the electromagnetic adsorption seat 864. Relying on the electromagnetic adsorption between the rotating table 42 and the electromagnetic adsorption seat 864, it is determined whether there is misalignment between the two, and thus whether there is misalignment between the clamping assembly 43 and the lower cover 85. This avoids the gap between the upper cover 84 and the lower cover 85 caused by misalignment due to wear of components or other reasons, which could lead to IPA vapor leakage. At the same time, by detecting the position of the electromagnetic adsorption seat 864, the position of the lower cover 85 in multiple directions, such as front, back, left, right, up, and down, can be determined, which facilitates subsequent maintenance.

[0031] Preferably, a blower assembly 87 is rotatably connected to the inner side of several second sleeves 83. The blower assembly 87 includes a telescopic transmission rod 871 and a rotating plate 872 fixedly connected to its upper side. A fan 874 is rotatably connected to the top inner side of the lower cover 85. The rotation of the fan 874 will drive the gas flow in the lower cover 85, accelerating the evaporation of the IPA liquid film. The lower end of the telescopic transmission rod 871 is connected to the rotating position of the fan 874 through a universal joint coupling. The inner side of the first sleeve 82 is provided with a first spiral groove. The outer side of the rotating plate 872 is slidably connected to the inner side of the first spiral groove through a sliding shaft. When the rotating plate 872 moves up and down in the second sleeve 83, the rotating plate 872 is driven to rotate by the first spiral groove. The rotation of the rotating plate 872 drives the fan 874 to rotate. The inner side of the first sleeve 82 is fitted with a second spring 873. The second spring 873 is a tension spring that pulls the rotating plate 872 down. The second spring 873 is located between the second sleeve 83 and the rotating plate 872. An electromagnetic adsorption structure is provided between the upper side of the rotating plate 872 and the top of the inner side of the first sleeve 82.

[0032] It should be noted that when the current sealing shell 85 rotates from the lower right side to the bottommost side, the first sleeve 82 and the second sleeve 83 separate from each other. Due to the influence of electromagnetic adsorption, the position of the rotating plate 872 relative to the first sleeve 82 remains unchanged, which stretches the second spring 873. When an IPA liquid film is formed on the outside of the wafer, the electromagnetic adsorption is broken, and the second spring 873 pulls the rotating plate 872 down, which causes the rotating plate 872 to drive the fan 874 to rotate, accelerating evaporation.

[0033] Example 4, as Figure 11 , Figure 12 As shown, a transfer mechanism 5 is provided on the rear side of the rear side plate 2 to control the front and rear movement of the first grinding mechanism 6 and the second grinding mechanism 7. The transfer mechanism 5 is used to drive the first grinding mechanism 6 and the second grinding mechanism 7 to move back and forth, so that the presence of the first grinding mechanism 6 and the second grinding mechanism 7 will not interfere with the clamping assembly 43 during its rotation. Two water-blocking mechanisms 9 are rotatably connected between the two side plates 2. The water-blocking mechanism 9 includes a drive rod 92 that is driven to move back and forth by the transfer mechanism 5, a rotating tube 93 that is rotatably connected between the two side plates 2, and a water-blocking arc plate 91 placed under the grinding equipment. A water inlet is provided on the rear side of the rear side plate 2 near the bottom of the inner side of the rotating tube 93. Water falling during the grinding process will fall onto the rotating tube 93 and then be discharged from the water inlet. The water-blocking arc plate 91 and the drive rod 92 are connected by a plate. The inner side of the rotating tube 93 is provided with a second spiral groove. The outer side of the drive rod 92 is movably sleeved on the inner side of the rotating tube 93, and it is slidably connected to the second spiral groove by a sliding shaft.

[0034] It should be noted that during the process of the transfer mechanism 5 driving the first polishing mechanism 6 and the second polishing mechanism 7 to move to the upper position, the drive rod 92 moves forward and drives the rotating tube 93 to rotate by relying on the second spiral slide groove, so that the water-blocking arc plate 91 moves to the lower side of the wafer to be polished, thus avoiding leakage of cleaning water.

[0035] Preferably, the front side of the front side plate 2 is provided with an annular groove for the movement of the moving rod 41. The outer side of the moving rod 41 is rotatably connected to a follower ring 11 placed in the annular groove. The follower ring 11 is used to prevent cleaning water from splashing out from the annular groove to the front of the equipment during grinding. Several evenly distributed first airbags 12 are fixedly connected to the rear side of the moving rod 41, and the first airbags 12 are located around the moving rod 41. Several evenly distributed second airbags 13 are fixedly connected to the rear side of the moving rod 41, and the second airbags 13 are located at the position where the water-blocking arc plate 91 contacts the follower ring 11. The first airbags 12 and the second airbags 13 are interconnected.

[0036] It should be noted that when the wafer is moved to the first polishing mechanism 6 and the second polishing mechanism 7, the electric cylinder on the rotating mechanism 3 drives the push plate 44 to move forward through the moving rod 41, so that the push plate 44 squeezes the first airbag 12, causing the second airbag 13 to expand and seal the gap between the follower ring 11 and the water-blocking arc plate 91. The gap between the water-blocking arc plate 91 and the side plate 2 can also be sealed in this way, or a sealing strip can be used directly.

[0037] The working principle of this invention is as follows: First, the rotating mechanism 3 drives the four clamping mechanisms 4 to revolve. Then, the four clamping mechanisms 4 respectively perform notch grinding, edge grinding, drying, and loading / unloading, enabling the wafer to be quickly switched between the four stations, shortening the time consumed by the wafer during equipment switching. The rotating mechanism 3 drives the rotating table 42 to rotate clockwise, so that the lowermost rotating table 42 moves towards the notch when rotating. When the guide rod 10 is inserted into the retaining ring 45, with the rotation of the rotating mechanism 3, the rotating table 42 and the moving rod 41 rotate relative to each other, so that the wafer is disengaged from the rear of the moving rod 41, facilitating the placement of the wafer conveyor belt. When the rotating mechanism 3 continues to drive the rotating table 42 to rotate, so that the guide rod 10 is disengaged from the retaining ring 45, the rotating table 42 is exactly reset relative to the moving rod 41. The rotating mechanism 3 drives the clamping assembly 43 to revolve. This allows the wafer to be transferred between the first grinding mechanism 6, the second grinding mechanism 7, the loading / unloading position, and the drying mechanism 8. Multiple clamping mechanisms 4 are also provided to improve the grinding efficiency of the wafer chips. Finally, the rotation of the rotating frame 81 drives the rotation of the lower casing 85, avoiding the need for an active up / down moving device, which would increase the power requirements, as the lower casing 85 is directly positioned on the upper casing 84. The rotation of the rotating mechanism 3 allows the lower casing 85 to move closer to and away from the upper casing 84. By using the rotating mechanism 3 to drive the rotating frame 81, measures such as sealing, auxiliary drying, and equipment positioning of the wafer in the drying section are achieved without additional power, improving drying efficiency. This also avoids the need for direct fastening of electrically driven components, which would require additional power and complex coordination procedures.

[0038] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. An edge grinding device for chip manufacturing, comprising a U-shaped support frame (1) and two side plates (2) disposed on its inner side, wherein the inner side of the U-shaped support frame (1) is provided with a rotating mechanism (3) located on the front side of the side plates (2), characterized in that: Four clamping mechanisms (4) driven to revolve by a rotating mechanism (3) are provided between the two side plates (2). A second polishing mechanism (7), a first polishing mechanism (6) and a drying mechanism (8) are provided between the two side plates (2). A notch is provided on the left side of the two side plates (2), and the notch, the second polishing mechanism (7), the first polishing mechanism (6) and the drying mechanism (8) are evenly distributed clockwise. The clamping mechanism (4) includes a clamping component (43) that adheres to the wafer by means of the bottom. During the revolution, the lower adsorption position of the clamping component (43) is always facing downward. A conveyor belt is set at the notch to transport the wafer. The clamping component (43) picks up and puts the wafer from the notch. The rotating mechanism (3) drives it to rotate clockwise and pass through the second polishing mechanism (7), the first polishing mechanism (6) and the drying mechanism (8) in sequence before returning to the notch.

2. The edge polishing device for chip manufacturing and processing according to claim 1, characterized in that: The clamping mechanism (4) also includes a moving rod (41) directly driven by the rotating mechanism (3). The rotating mechanism (3) is provided with an electric cylinder component that controls the forward and backward movement of the moving rod (41). The rear side of the moving rod (41) is rotatably connected to a rotating platform (42). The upper side of the clamping assembly (43) is located on the lower side of the rotating platform (42). A retaining ring (45) is fixedly connected to the left side of the rotating platform (42). A guide rod (10) is fixedly connected to the rear side of the side plate (2) located on the front side near the left side. When the moving rod (41) rotates clockwise, the guide rod (10) is movably sleeved into the retaining ring (45). When the moving rod (41) rotates from the bottom to the left side, the rotating platform (42) rotates to the left.

3. The edge polishing device for chip manufacturing and processing according to claim 2, characterized in that: The drying mechanism (8) includes a rotating frame (81), several first sleeves (82) fixedly connected to its lower side, and an upper cover (84) and a lower cover (85) that are fastened together. The front and rear sides of the upper cover (84) are fixedly connected between two side plates (2). Several evenly distributed second sleeves (83) are fixedly connected to the upper side of the upper cover (84). The outer side of the second sleeves (83) is sleeved on the inner side of the first sleeves (82). The clamping assembly (43) located at the lowest side is placed inside the upper cover (84) and the lower cover (85). The front side of the upper cover (84) is provided with a slot for accommodating a moving rod (41). A push plate (44) for blocking the slot is fixedly connected to the outer side of the moving rod (41).

4. The edge polishing device for chip manufacturing and processing according to claim 3, characterized in that: The drying mechanism (8) also includes a rotating rod (88) directly driven by the rotating mechanism (3) and four levers (89) fixedly connected to its outer side. The upper side of the rotating frame (81) is rotatably connected to the outer side of the rotating rod (88). Push shafts (810) are slidably connected to the front and rear sides of the rotating frame (81). The bottom of the two side plates (2) that are close to each other are fixedly connected to the first guide plate (811). The upper front and rear sides of the lower cover (85) are provided with rollers driven by the first guide plate (811). When the rotating frame (81) rotates from the lower right side to the lower left side, the lower cover (85) moves away from the center of rotation and then resets.

5. The edge polishing device for chip manufacturing and processing according to claim 4, characterized in that: A second guide plate (812) is fixedly connected between the two side plates (2). The second guide plate (812) has a first guide groove on which the drive shaft (810) is far away from the center of rotation. A reset structure is provided between the rotating position of the rotating frame (81) and the side plate (2). When the drive shaft (810) is located at the farthest side away from the center of rotation, the lever (89) can no longer push the drive shaft (810), so that the rotating frame (81) is reset. The rotation amplitude of the rotating frame (81) is less than ninety degrees.

6. The edge polishing device for chip manufacturing and processing according to claim 3, characterized in that: A positioning component (86) is fixedly connected to the upper middle part of the lower cover (85). The positioning component (86) includes a limiting tube (861), a first spring (862) placed inside it, and a push rod (863). The first spring (862) is located on the upper side of the push rod (863). The lower end of the push rod (863) passes through the upper wall of the lower cover (85) and is fixedly connected to an electromagnetic adsorption seat (864). The lower side of the electromagnetic adsorption seat (864) is electromagnetically adsorbed on the upper side of the rotating table (42).

7. The edge polishing device for chip manufacturing and processing according to claim 3, characterized in that: A blower assembly (87) is rotatably connected to the inner side of several second sleeves (83). The blower assembly (87) includes a telescopic transmission rod (871) and a rotating plate (872) fixedly connected to its upper side. A fan (874) is rotatably connected to the top inner side of the lower cover (85). The lower end of the telescopic transmission rod (871) is connected to the rotating position of the fan (874) through a universal joint coupling. A first spiral groove is provided on the inner side of the first sleeve (82). The outer side of the rotating plate (872) is slidably connected to the inner side of the first spiral groove through a sliding shaft. A second spring (873) is sleeved on the inner side of the first sleeve (82), and the second spring (873) is located between the second sleeve (83) and the rotating plate (872).

8. The edge polishing device for chip manufacturing and processing according to claim 2, characterized in that: The rear side of the side plate (2) located on the rear side is provided with a transfer mechanism (5) for controlling the front and rear movement of the first grinding mechanism (6) and the second grinding mechanism (7). Two water-blocking mechanisms (9) are rotatably connected between the two side plates (2). The water-blocking mechanism (9) includes a drive rod (92) driven to move back and forth by the transfer mechanism (5), a rotating tube (93) rotatably connected between the two side plates (2), and a water-blocking arc plate (91) placed on the lower side of the grinding equipment. The water-blocking arc plate (91) and the drive rod (92) are connected by a plate. The inner side of the rotating tube (93) is provided with a second spiral groove. The outer side of the drive rod (92) is movably sleeved on the inner side of the rotating tube (93), and it is slidably connected to the second spiral groove by a sliding shaft.

9. The edge polishing device for chip manufacturing and processing according to claim 2, characterized in that: The front side of the side plate (2) located on the front side is provided with an annular groove for the movement of the moving rod (41). The outer side of the moving rod (41) is rotatably connected to a follower ring (11) placed in the annular groove. The rear side of the moving rod (41) is fixedly connected to a number of evenly distributed first airbags (12), and the first airbags (12) are located around the moving rod (41). The rear side of the moving rod (41) is fixedly connected to a number of evenly distributed second airbags (13), and the second airbags (13) are located at the position where the water-blocking arc plate (91) contacts the follower ring (11). The first airbags (12) and the second airbags (13) are interconnected.

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