Electric vehicle controller circuit board automatic soldering machine

Abstract

The application discloses an automatic soldering machine for electric vehicle controller circuit boards and relates to the technical field of soldering machines.The technical scheme is as follows: the automatic soldering machine comprises a workbench, a moving table, a placing frame, a pressing plate, a pushing mechanism and a mounting rack, the top end of the placing frame is provided with a placing groove for placing circuit boards, the bottom end of the pressing plate is provided with a plurality of sleeves, each sleeve is slidably connected with a supporting column, the pushing mechanism is used for pushing each supporting column to extend downward until abutting against elements on the circuit board, and the mounting rack can be turned over and placed on the moving table, so that the turned-over supporting columns support each element from below, thereby supporting the elements on the circuit board during soldering and reducing displacement or falling of the elements during soldering.

Description

Technical Field

[0001] This invention relates to the field of soldering machine technology, specifically to an automatic soldering machine for electric vehicle controller circuit boards. Background Technology

[0002] With the continued expansion of the new energy vehicle and electric two-wheeler market, the production capacity and quality requirements for electric vehicle controllers are constantly increasing. In the assembly process of controller circuit boards, fixing through-hole components (such as electrolytic capacitors, power MOSFETs, and terminals) onto the circuit board via soldering is one of the key steps determining the electrical reliability of the product. Through-hole components' pins pass through corresponding solder holes on the circuit board, and electrical connections are achieved through soldering. Currently, soldering machines are widely used in the industry for this purpose. When using a soldering machine, the circuit board needs to be clamped and positioned using fixtures.

[0003] Currently, the widely used fixtures in the industry can hold circuit boards and support the components on them, reducing the possibility of components shifting or falling off the circuit board during soldering. However, current fixtures can only accommodate the component distribution on one type of circuit board. When the component layout of the same circuit board changes due to design optimization or different batch requirements (even if it is only a minor adjustment to the position of a few components), the original fixtures can no longer be used and must be redesigned and manufactured, which is inconvenient. Therefore, there is an urgent need for a fixture for automatic soldering machines for electric vehicle controller circuit boards that can accommodate components with different positions on the circuit board. Summary of the Invention

[0004] The purpose of this invention is to provide an automatic soldering machine for electric vehicle controller circuit boards, whose fixtures can be adaptively adjusted according to the actual distribution of components on the circuit board, thereby being compatible with the clamping requirements of different layout versions of the same circuit board.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] This invention provides an automatic soldering machine for electric vehicle controller circuit boards, comprising: A workbench, on which a soldering mechanism and a moving module for driving the soldering mechanism to move are provided; A movable stage is horizontally slidably connected to the worktable via a linear module, which is used to drive the movable stage to reciprocate horizontally in the direction of approaching or moving away from the soldering mechanism. A placement frame is placed on the workbench. The top of the placement frame is provided with a placement slot for horizontal placement of the circuit board. The placement slot is connected to the interior of the placement frame, and the pins of the components on the circuit board are located inside the placement frame. A pressure plate is horizontally positioned directly above the placement frame. Several sleeves are evenly distributed at the bottom of the pressure plate, and each sleeve is vertically and slidably connected to a support column. A pushing mechanism, disposed on the pressure plate, is used to push each of the support columns vertically downwards to extend into the corresponding sleeve until the bottom end of each support column abuts against the corresponding component on the circuit board. After the pushing mechanism stops pushing, it can keep each support column in its current extended position. The mounting frame is placed on the workbench. The placement frame and the pressure plate are both horizontally arranged in the mounting frame. The placement frame is fixedly connected to the mounting frame. The mounting frame is provided with a power source for driving the pressure plate to move vertically back and forth. The mounting bracket can be flipped and placed on the movable platform so that the flipped support column supports the components on the circuit board from below.

[0007] By adopting the above technical solution, the present invention sets up several independently extendable support columns. Each support column is pushed downward by a pushing mechanism until it abuts against the top of the corresponding component on the circuit board. After the pushing mechanism stops pushing, it can keep each support column in its current extended position. Since the extension length of each support column is determined by the actual height of the corresponding component, it can adapt to the differences in component positions of different layout versions on the same circuit board. When the support column abuts against the component, the mounting frame is rotated 180° and placed on the moving platform. At this time, each support column supports the component from below, and the circuit board is still located in the placement slot through the component, thus realizing the positioning of the circuit board and the component. The moving platform drives the mounting frame to move below the soldering mechanism, and the soldering operation can be performed. After welding is completed, the mounting bracket is removed from the moving table and flipped back to its original position. The welded circuit board is then removed, and the next circuit board to be welded is placed horizontally in the placement slot. Since the circuit boards in the same batch have the same component layout and height, each support column has been adjusted to the corresponding protrusion position according to the component distribution of the circuit board in the previous round of welding, and this position is maintained by the friction between the sealing column and the inner wall of the sleeve. Therefore, when welding subsequent circuit boards in the same batch, there is no need to repeat the protrusion adjustment operation of the support columns. This feature makes it possible for the present invention to eliminate the need to repeatedly adjust the position of the support columns for each circuit board in mass production, thereby improving the efficiency of batch welding operations.

[0008] Preferably, the pushing mechanism includes an air pipe connected to one side of the pressure plate. The interior of the pressure plate is a hollow structure and is connected to each of the sleeves. The top of each of the support columns is provided with a sealing column that seals against the inner wall of the corresponding sleeve. The air pipe is used to inject gas into the interior of the pressure plate to push each of the sealing columns to move the corresponding support columns downward.

[0009] Preferably, the outer wall of the sealing column is provided with an O-ring, and the O-ring is interference-fitted with the inner wall of the sleeve.

[0010] Preferably, each of the sleeves can be detachably connected to an annular limiting boss at the bottom end of the sleeve. The limiting boss is used to abut against the bottom end of the sealing column to limit the maximum extension stroke of the support column. The end of the support column away from the sealing column passes through the limiting boss.

[0011] Preferably, each of the sleeves is threadedly connected to a threaded cylinder, and the threaded cylinder is close to the bottom opening of the sleeve. The limiting boss is coaxially disposed in the threaded cylinder and located at the bottom opening of the sleeve.

[0012] Preferably, the pressure plate is provided with a sealing mechanism. When the support column contacts the component and the pressure plate is at atmospheric pressure, the sealing mechanism is used to seal the opening of each sleeve, so that a sealed space is formed above the sealing column in each sleeve.

[0013] Preferably, the sealing mechanism includes a partition plate, which is horizontally located inside the pressure plate. The pressure plate is provided with a pusher for pushing the partition plate to move vertically back and forth inside the pressure plate. The partition plate is provided with a plurality of hemispherical sealing blocks on the side near the sleeve. The number of each sealing block is the same as that of each sleeve and they correspond one-to-one. When the partition plate is close to the sleeve, the sealing block is used to close the opening of the sleeve that communicates with the inside of the pressure plate.

[0014] Preferably, the pushing component includes a lead screw rotatably connected to the middle of the side of the partition away from the sleeve, with one end of the lead screw passing through the pressure plate and having a rotating disk located above the pressure plate. A threaded cylinder II is threadedly connected to the lead screw, and the threaded cylinder II is fixedly connected to the side of the pressure plate away from the placement frame. The pressure plate has a communicating groove that communicates with the threaded cylinder II and allows one end of the lead screw to pass through. The partition has a sealing mechanism II, which is used to close the groove opening that communicates with the pressure plate. When the partition approaches the sleeve, causing the sealing block to close the corresponding sleeve opening, the sealing mechanism II releases the closure of the communicating groove.

[0015] Preferably, the second sealing mechanism includes a vertical cylinder disposed on the partition plate, one end of the screw rotatably connected to the partition plate is located in the vertical cylinder, and a second sealing ring is provided at the cylinder opening away from the partition plate, which abuts against the inner wall of the pressure plate, and the groove of the connecting groove communicating with the pressure plate is correspondingly connected to the vertical cylinder.

[0016] Preferably, the top of the mounting frame has four positioning slots, which are opposite each other in pairs. The top of the moving platform has four positioning posts that cooperate with the four positioning slots. When the mounting frame is flipped and placed on the moving platform, the tops of the four positioning posts pass through the four positioning slots and position the mounting frame.

[0017] The beneficial effects of this invention are as follows: 1. Each support column of the present invention is driven by a pushing mechanism and can automatically adjust its extension length according to the actual distribution position of the components on the circuit board. There is no need to redesign and manufacture special fixtures for different component layout versions. One set of tooling can be compatible with multiple layout changes of the same circuit board, thus improving the versatility of the fixture.

[0018] 2. This invention uses air pressure to drive the sealing column to move the support column, and after the pushing stops, the position of the support column is maintained by the friction between the sealing column and the inner wall of the sleeve. No continuous air supply is required, and the structure is simple and highly reliable.

[0019] 3. By setting up a sealing mechanism, the present invention seals the openings of each sleeve when the support column is in place and the pressure plate is at atmospheric pressure, thereby forming a sealed space above the sealing column, further reducing the displacement of the support column caused by factors such as vibration, and improving the support stability during the welding process.

[0020] 4. This invention achieves the alignment and installation of the tooling with the moving stage after the mounting bracket is flipped over, by cooperating with the positioning column and positioning groove on the moving stage, thereby improving the alignment accuracy of the component pins and the soldering mechanism during welding.

[0021] 5. The outer wall of the sealing column of the present invention is embedded with an O-ring seal, which is interference-fitted with the inner wall of the sleeve to ensure airtightness when driven by air pressure, and at the same time provide the friction force required to maintain the position of the support column after the push stops.

[0022] 6. After the first circuit board in the same batch is adjusted, subsequent circuit boards do not need to have their support column positions adjusted repeatedly. They can be directly flipped over for welding, which improves the efficiency of batch welding operations. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention.

[0025] Figure 2 This is a schematic diagram illustrating the positional distribution of the four positioning slots on the mounting bracket according to an embodiment of the present invention.

[0026] Figure 3 This is a schematic diagram illustrating the structure of the pressure plate in an embodiment of the present invention.

[0027] Figure 4 This is a schematic diagram illustrating the structure of the placement slot according to an embodiment of the present invention.

[0028] Figure 5 This is a structural schematic diagram illustrating the vertical tube in an embodiment of the present invention.

[0029] Figure 6 for Figure 5 A magnified structural diagram of part A in the middle.

[0030] Figure 7 This is a schematic diagram illustrating the structure of the sealing block according to an embodiment of the present invention.

[0031] Explanation of reference numerals in the attached figures: In the diagram: 1. Workbench; 2. Moving module; 21. Soldering mechanism; 3. Linear module; 31. Moving stage; 32. Positioning post; 4. Mounting bracket; 41. Placement frame; 411. Placement slot; 42. Pressure plate; 421. Sleeve; 4211. Threaded cylinder one; 4212. Limiting boss; 422. Support post; 4221. Sealing post; 4222. Sealing ring one; 423. Air pipe; 424. Connecting slot; 43. Power source; 44. Positioning slot; 5. Partition plate; 51. Sealing block; 52. Lead screw; 53. Turning plate; 54. Threaded cylinder two; 55. Vertical cylinder; 56. Sealing ring two. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] Furthermore, the terms "installation," "setup," "equipped with," "connection," "linking," and "socketing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0034] Example 1 An automatic soldering machine for electric vehicle controller circuit boards, such as Figures 1 to 6As shown, the system includes a workbench 1, a moving stage 31, a placement frame 41, a pressure plate 42, a pushing mechanism, and a mounting bracket 4. The workbench 1 is equipped with a soldering mechanism 21 and a moving module 2 for driving the soldering mechanism 21. The moving stage 31 is horizontally slidably connected to the workbench 1 via a linear module 3. The linear module 3 drives the moving stage 31 to reciprocate horizontally towards or away from the soldering mechanism 21. The placement frame 41 is placed on the workbench 1. The top of the placement frame 41 has a placement slot 411 for horizontally placing the circuit board. The placement slot 411 and the placement frame 41 are connected... The internal components of the circuit board are connected. The pins of the components on the circuit board are located inside the placement frame 41. The pressure plate 42 is horizontally positioned directly above the placement frame 41. Several sleeves 421 are evenly distributed at the bottom of the pressure plate 42. Each sleeve 421 is vertically slidably connected to a support column 422. The mounting frame 4 is placed on the workbench 1. The placement frame 41 and the pressure plate 42 are both horizontally positioned inside the mounting frame 4. The placement frame 41 and the mounting frame 4 are fixedly connected. The mounting frame 4 is provided with a power source 43 for driving the pressure plate 42 to move vertically back and forth (in this embodiment, the power source 43 is preferably an electric push rod). The pushing mechanism is set on the pressure plate 42 and is used to push each support column 422 vertically downward to extend the corresponding sleeve 421 until the bottom end of each support column 422 abuts against the corresponding component on the circuit board. After the pushing mechanism stops pushing, it can keep each support column 422 in the current extended position. The mounting bracket 4 can be flipped and placed on the moving table 31 so that the flipped support column 422 supports the component on the circuit board from below.

[0035] like Figures 1 to 6 As shown, in use, the circuit board is placed horizontally in the placement slot 411. At this time, the pins of the components on the circuit board pass through the solder holes on the circuit board and extend into the interior of the placement frame 41. Then, the power source 43 drives the pressure plate 42 to move vertically downward, bringing the pressure plate 42 closer to the placement frame 41. When the pressure plate 42 moves to a preset height, the power source 43 stops. Then, the pushing mechanism pushes each support column 422 downward until the bottom end of each support column 422 abuts against the top of the corresponding component on the circuit board. The extension of each support column 422... The length is automatically adapted to the actual position of the corresponding component. After the pushing mechanism stops pushing, each support column 422 maintains its current extended position. Then, the mounting bracket 4 is flipped and placed on the moving stage 31. At this time, each support column 422 supports the component from below, and the circuit board is still located in the placement slot 411 through the component. Then, the moving stage 31 is driven to move towards the soldering mechanism 21 through the linear module 3. When the moving stage 31 and the mounting bracket 4 move to the bottom of the soldering mechanism 21, the pins of the component are soldered to the circuit board through the soldering mechanism 21. After welding is completed, remove the mounting bracket 4 from the moving table 31 and flip it back to its original position. Take out the welded circuit board. For subsequent circuit boards in the same batch, since each support column 422 is already in the adjusted extended position, simply place the next circuit board horizontally in the placement slot 411, flip the mounting bracket 4 and place it on the moving table 31, and you can directly weld it without having to adjust the support column 422 again.

[0036] like Figure 1 and Figure 2 As shown, the top of the mounting frame 4 has four positioning slots 44, and the four positioning slots 44 are opposite each other. The top of the moving table 31 has four positioning posts 32 that cooperate with the four positioning slots 44 respectively. When the mounting frame 4 is flipped and placed on the moving table 31, the tops of the four positioning posts 32 pass through the four positioning slots 44 respectively and position the mounting frame 4. Through the cooperation of the positioning posts 32 and the positioning slots 44, the mounting frame 4 is aligned and installed on the moving table 31 after flipping, which improves the welding accuracy.

[0037] Example 2 Based on Example 1, such as Figures 4 to 6 As shown, the pushing mechanism includes an air pipe 423 connected to one side of the pressure plate 42. The interior of the pressure plate 42 is a hollow structure and is connected to each sleeve 421. The top of each support column 422 is provided with a sealing column 4221 that seals against the inner wall of the corresponding sleeve 421. The air pipe 423 is used to inject gas into the interior of the pressure plate 42 to push each sealing column 4221 to drive the corresponding support column 422 to move downward. An O-ring 4222 is provided on the outer wall of the sealing column 4221. The sealing ring 4222 is interference-fitted with the inner wall of the sleeve 421. Compressed air is injected into the pressure plate 42 through the air pipe 423, the air pressure inside the pressure plate 42 increases, pushing each sealing column 4221 to move the support column 422 downward until the bottom end of each support column 422 abuts against the top of the corresponding component on the circuit board. Since the height of each component may be different, the extension length of each support column 422 automatically adapts to the actual height of the corresponding component. After abutting, the air supply stops, and the friction between the sealing ring 4222 and the inner wall of the sleeve 421 keeps each support column 422 in its current position, without the need for continuous air supply. The sealing ring 4222 ensures that the pressure plate 42 and the sleeve 421 are airtight when the air is driven by air pressure. After the air supply stops, the support column 422 is kept in its current extended position by the friction between the sealing ring 422 and the inner wall of the sleeve 421. It is simple and convenient to use.

[0038] like Figure 6As shown, each sleeve 421 has a detachable annular limiting boss 4212 at its bottom end. The limiting boss 4212 abuts against the bottom end of the sealing column 4221 to limit the maximum extension stroke of the support column 422 and reduce the occurrence of the support column 422 coming out of the sleeve 421. The end of the support column 422 away from the sealing column 4221 passes through the limiting boss 4212. Each sleeve 421 has a threaded cylinder 4211 threadedly connected to its outer wall, and the threaded cylinder 4211 is close to the bottom end of the sleeve 421. The limiting boss 4212 is coaxially fixed in the threaded cylinder 4211 and located at the bottom end of the sleeve 421. By rotating the threaded cylinder 4211, the limiting boss 4212 can be removed, and then the support column 422 can be pulled out from the sleeve 421. The support column 422 with the sealing column 4221 can be replaced, making disassembly and assembly simple.

[0039] Example 3 Based on Example 2, such as Figure 5 As shown, the pressure plate 42 is equipped with a sealing mechanism. When the support column 422 contacts the component and the pressure plate 42 returns to atmospheric pressure (i.e., the air pipe 423 stops supplying air and connects to the outside atmosphere), the sealing mechanism is used to seal the opening of each sleeve 421, so that a sealed space is formed above the sealing column 4221 in each sleeve 421, thereby reducing the displacement of the support column 422 caused by vibration during subsequent flipping, moving and welding processes.

[0040] like Figures 5 to 7 As shown, the sealing mechanism includes a partition 5, which is horizontally located inside the pressure plate 42. The pressure plate 42 is provided with a pusher for pushing the partition 5 to move vertically back and forth inside the pressure plate 42. The partition 5 is provided with a number of hemispherical sealing blocks 51 on the side near the sleeve 421. The number of each sealing block 51 is the same as that of each sleeve 421 and they correspond one-to-one. When the partition 5 is close to the sleeve 421, the sealing block 51 is used to close the opening of the sleeve 421 and the inside of the pressure plate 42, so that a sealed space is formed above the sealing column 4221 inside each sleeve 421.

[0041] like Figure 5 As shown, the pushing component includes a lead screw 52 rotatably connected to the middle of the side of the partition plate 5 away from the sleeve 421, and one end of the lead screw 52 passes through the pressure plate 42 and is provided with a rotary disk 53 located above the pressure plate 42. A threaded cylinder 54 is threadedly connected to the lead screw 52. The threaded cylinder 54 is fixedly connected to the side of the pressure plate 42 away from the placement frame 41. The pressure plate 42 is provided with a connecting groove 424 that communicates with the threaded cylinder 54 and allows one end of the lead screw 52 to pass through. By rotating the rotary disk 53 to drive the lead screw 52 to rotate, the partition plate 5 can be pushed to move vertically back and forth inside the pressure plate 42. The partition 5 is provided with a second sealing mechanism. The second sealing mechanism is used to close the slot of the connecting groove 424 and the pressure plate 42, so that the inside of the pressure plate 42 is airtight when gas is injected into the gas pipe 423. When the partition 5 approaches the sleeve 421, the sealing block 51 closes the corresponding sleeve 421 opening, and the second sealing mechanism releases the seal on the connecting groove 424. At this time, the inside of the pressure plate 42 is atmospheric pressure, and the sleeve 421 opening has been closed by the sealing block 51. The space above the sealing column 4221 is isolated from other spaces inside the pressure plate 42. Releasing the seal on the connecting groove 424 will not affect the airtightness above the sealing column 4221. The second sealing mechanism includes a vertical cylinder 55 mounted on the partition 5. One end of the screw 52, ​​which is rotatably connected to the partition 5, is located in the vertical cylinder 55. At the end of the vertical cylinder 55 away from the partition 5, a second sealing ring 56 is provided that abuts against the inner wall of the pressure plate 42. The groove of the connecting groove 424, which is connected to the pressure plate 42, is correspondingly connected to the vertical cylinder 55. The second sealing ring 56 abuts against the inner wall of the pressure plate 42 and seals. During the air injection stage of the air pipe 423, the groove of the connecting groove 424 is closed, making the inside of the pressure plate 42 airtight.

[0042] like Figures 4 to 6 As shown, during the stage where air is injected through the air pipe 423 to push the support column 422 to move, the sealing ring 56 abuts against the inner wall of the pressure plate 42, sealing the opening of the connecting groove 424, making the inside of the pressure plate 42 airtight, so that the injected gas can push the sealing column 4221. After the support column 422 is in place, the air injection stops, the air pipe 423 is connected to the outside atmosphere, and the pressure plate 42 returns to atmospheric pressure. Then, by rotating the rotary disk 53, the screw 52 is driven to rotate, pushing the partition 5 to move downward, so that each sealing block 51 seals the opening of the corresponding sleeve 421 and the inside of the pressure plate 42. During the downward movement of the partition 5, the vertical cylinder 55 moves downward as well, and the sealing ring 56 gradually disengages from the inner wall of the pressure plate 42, releasing the seal on the connecting groove 424 (at this time, the inside of the pressure plate 42 is at atmospheric pressure, which will not affect the airtightness above the sealing column 4221). After the sealing block 51 closes the opening of the sleeve 421, a sealed space is formed inside the sleeve 421 above the sealing column 4221. When the sealing column 4221 tends to move closer to the partition 5, the volume of this space decreases and the internal air pressure increases, generating reverse resistance. When the sealing column 4221 tends to move away from the partition 5, the volume of this space increases and the air pressure decreases, generating reverse resistance from the external atmospheric pressure. Therefore, the sealing column 4221 and the support column 422 can be kept in their current extended positions, reducing the occurrence of displacement of the support column 422 due to vibration during subsequent tooling flipping and movement.

[0043] After the support column 422 is in place, the present invention connects the inside of the pressure plate 42 to the atmosphere to remove the pneumatic force, and lowers the partition 5 so that the sealing block 51 closes the opening of the sleeve 421 to form a sealed space, keeping the support column 422 in the current position. There is no need to continuously apply force between the support column 422 and the component, reducing the risk of component damage.

[0044] The working process of this device is as follows: The first step is to place the circuit board horizontally in the placement slot 411. At this time, the pins of each component on the circuit board pass through the corresponding solder holes on the circuit board and extend into the interior of the placement frame 41.

[0045] The second step is to drive the pressure plate 42 to move vertically downwards through the power source 43, so that the pressure plate 42 is close to the placement frame 41. When the pressure plate 42 moves to the preset height, the power source 43 stops moving.

[0046] Third, gas is injected into the pressure plate 42 through the air pipe 423, increasing the internal air pressure of the pressure plate 42. This pushes each sealing column 4221 to drive the corresponding support column 422 to extend vertically downwards from the corresponding sleeve 421 until the bottom of each support column 422 abuts against the top of the corresponding component on the circuit board. The extension length of each support column 422 is automatically adapted according to the actual height of the corresponding component. Then, the gas supply is stopped and the air pipe 423 is connected to the outside atmosphere. The internal pressure of the pressure plate 42 is restored to atmospheric pressure. Each support column 422 maintains its current extended position by the friction between the sealing column 4221 and the inner wall of the sleeve 421. Then, the rotary disk 53 is rotated to drive the lead screw 52 to rotate, pushing the partition 5 to move downwards. This causes each sealing block 51 to close the opening of the corresponding sleeve 421 that connects to the inside of the pressure plate 42. A sealed space is formed above the sealing column 4221 in each sleeve 421, further keeping each support column 422 in its current extended position.

[0047] Fourth step: After confirming that the support column 422 abuts against the top of the corresponding component on the circuit board, rotate the mounting bracket 4 180° and place it on the moving platform 31. At this time, each support column 422 supports each component from below, and the circuit board is still located in the placement slot 411 through the components.

[0048] The fifth step involves driving the moving stage 31 towards the soldering mechanism 21 via the linear module 3. When the moving stage 31 and the mounting bracket 4 move to the area below the soldering mechanism 21, the soldering mechanism 21 solders the pins of each component onto the circuit board.

[0049] Step 6: After soldering is completed, remove the mounting bracket 4 from the moving table 31 and flip it back to its original position to remove the soldered circuit board.

[0050] For subsequent circuit boards in the same batch, since each support post 422 is already in the adjusted extended position, the soldering operation of the subsequent circuit boards can be completed by repeating the first, fourth, fifth and sixth steps above, without having to repeat the adjustment operations in the second and third steps.

[0051] It should be noted that the moving module 2, the linear module 3, and the soldering mechanism 21 involved in this invention are all conventional existing structures in the art, and those skilled in the art can understand and implement them based on common knowledge in the art. Specifically: The soldering mechanism 21 is an execution component in the soldering machine used to heat and melt the solder wire and deliver it to the soldering point. It can be a conventional soldering iron mechanism, and its specific model and specifications can be selected according to the actual soldering process requirements. The moving module 2 is set on the workbench 1 and connected to the soldering mechanism 21. It is used to drive the soldering mechanism 21 to move in the vertical and left-right directions (i.e., the Z-axis and X-axis directions). The moving module 2 can be a lead screw guide module driven by a servo motor, or a synchronous belt drive module or a linear motor module. Its specific structural form does not affect the implementation of the technical solution of the present invention.

[0052] The linear module 3 is mounted on the worktable 1 and connected to the moving stage 31. It is used to drive the moving stage 31 to move horizontally back and forth in the front-to-back direction (i.e., the Y-axis direction). The linear module 3 can also adopt a servo motor driven lead screw guide structure. Its specific structure and control method are conventional technical means in this field and will not be described in detail here.

[0053] With the three-axis linkage of the aforementioned moving module 2 and linear module 3, the soldering mechanism 21 can perform soldering operations on each soldering point on the circuit board.

[0054] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. An automatic soldering machine for electric vehicle controller circuit boards, characterized in that, include: A workbench, on which a soldering mechanism and a moving module for driving the soldering mechanism to move are provided; A movable stage is horizontally slidably connected to the worktable via a linear module, which is used to drive the movable stage to reciprocate horizontally in the direction of approaching or moving away from the soldering mechanism. A placement frame is placed on the workbench. The top of the placement frame is provided with a placement slot for horizontal placement of the circuit board. The placement slot is connected to the interior of the placement frame, and the pins of the components on the circuit board are located inside the placement frame. A pressure plate is horizontally positioned directly above the placement frame. Several sleeves are evenly distributed at the bottom of the pressure plate, and each sleeve is vertically and slidably connected to a support column. A pushing mechanism, disposed on the pressure plate, is used to push each of the support columns vertically downwards to extend into the corresponding sleeve until the bottom end of each support column abuts against the corresponding component on the circuit board. After the pushing mechanism stops pushing, it can keep each support column in its current extended position. The mounting frame is placed on the workbench. The placement frame and the pressure plate are both horizontally arranged in the mounting frame. The placement frame is fixedly connected to the mounting frame. The mounting frame is provided with a power source for driving the pressure plate to move vertically back and forth. The mounting bracket can be flipped and placed on the movable platform so that the flipped support column supports the components on the circuit board from below.

2. The automatic soldering machine for electric vehicle controller circuit boards as described in claim 1, characterized in that, The pushing mechanism includes an air pipe connected to one side of the pressure plate. The interior of the pressure plate is a hollow structure and is connected to each of the sleeves. The top of each of the support columns is provided with a sealing column that seals against the inner wall of the corresponding sleeve. The air pipe is used to inject gas into the interior of the pressure plate to push each of the sealing columns to move the corresponding support columns downward.

3. The automatic soldering machine for electric vehicle controller circuit boards as described in claim 2, characterized in that, The outer wall of the sealing column is provided with an O-ring, which is interference-fitted with the inner wall of the sleeve.

4. The automatic soldering machine for electric vehicle controller circuit boards as described in claim 2, characterized in that, Each of the sleeves has a detachable annular limiting boss at its bottom end. The limiting boss abuts against the bottom end of the sealing column to limit the maximum extension stroke of the support column. The end of the support column away from the sealing column passes through the limiting boss.

5. The automatic soldering machine for electric vehicle controller circuit boards as described in claim 4, characterized in that, Each of the sleeves is threadedly connected to a threaded cylinder, which is located near the bottom opening of the sleeve. The limiting boss is coaxially disposed in the threaded cylinder and located at the bottom opening of the sleeve.

6. The automatic soldering machine for electric vehicle controller circuit boards as described in claim 2, characterized in that, The pressure plate is equipped with a sealing mechanism. When the support column contacts the component and the pressure plate is under atmospheric pressure, the sealing mechanism is used to seal the opening of each sleeve, so that a sealed space is formed above the sealing column in each sleeve.

7. The automatic soldering machine for electric vehicle controller circuit boards as described in claim 6, characterized in that, The sealing mechanism includes a partition plate, which is horizontally located inside the pressure plate. The pressure plate is provided with a pusher for pushing the partition plate to move vertically back and forth inside the pressure plate. The partition plate is provided with a number of hemispherical sealing blocks on the side near the sleeve. The number of sealing blocks is the same as that of each sleeve and they correspond one-to-one. When the partition plate is close to the sleeve, the sealing blocks are used to close the opening of the sleeve that communicates with the inside of the pressure plate.

8. The automatic soldering machine for electric vehicle controller circuit boards as described in claim 7, characterized in that, The pushing component includes a lead screw rotatably connected to the middle of the side of the partition away from the sleeve, with one end of the lead screw passing through the pressure plate and having a rotating disk located above the pressure plate. A threaded cylinder II is threadedly connected to the lead screw, and the threaded cylinder II is fixedly connected to the side of the pressure plate away from the placement frame. The pressure plate has a connecting groove that communicates with the threaded cylinder II and allows one end of the lead screw to pass through. The partition has a sealing mechanism II, which is used to close the groove opening that communicates with the pressure plate. When the partition approaches the sleeve, causing the sealing block to close the corresponding sleeve opening, the sealing mechanism II releases the closure of the connecting groove.

9. The automatic soldering machine for electric vehicle controller circuit boards as described in claim 8, characterized in that, The second sealing mechanism includes a vertical cylinder mounted on the partition plate. One end of the screw rod, which is rotatably connected to the partition plate, is located in the vertical cylinder. A second sealing ring is provided at the cylinder opening away from the partition plate, which abuts against the inner wall of the pressure plate. The groove of the connecting groove, which is connected to the pressure plate, is correspondingly connected to the vertical cylinder.

10. The automatic soldering machine for electric vehicle controller circuit boards as described in claim 1, characterized in that, The top of the mounting frame has four positioning slots, which are opposite each other in pairs. The top of the moving platform has four positioning posts that cooperate with the four positioning slots. When the mounting frame is flipped and placed on the moving platform, the tops of the four positioning posts pass through the four positioning slots and position the mounting frame.

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