A cooling system and a first device

Abstract

The application provides a cooling system and a first device, relates to refrigeration technology, and the cooling system comprises a first device, a first system, a second system and a third system; the first device is used for indirectly evaporative cooling of a second device in a data center; the first system comprises a system for cooling using a cooling liquid, and the first system is used for cooling of a third device in the data center; the first device and the first system are connected in parallel to the second system, the second system provides the cooling liquid for the first device and the first system; the third system is used for controlling flow, and the flow comprises first flow of the cooling liquid distributed to the first device and second flow of the first system. The application solves the problem of poor flexibility of an existing refrigeration system, the cooling system integrates the first device and the first system, the third system is used for controlling flow of the cooling liquid in the first device and the first system, and the flexibility of refrigeration is improved.

Description

Technical Field

[0001] This article relates to refrigeration technology, and more particularly to a cooling system and a first device. Background Technology

[0002] In the design and construction of data centers, the cooling system is a crucial element. Traditional cooling methods mainly include air cooling and liquid cooling. Air cooling systems use air conditioning to cool high-temperature return air before delivering it to the data center, carrying away the heat generated by the equipment. Liquid cooling systems, on the other hand, use chilled water or other cooling liquids to directly cool the equipment, offering higher cooling efficiency.

[0003] As data centers continue to expand in scale and increase in equipment density, liquid cooling technology is being used and popularized more and more widely in the industry. Compared with traditional air cooling, liquid cooling systems can provide more precise and efficient cooling, thereby reducing overall energy consumption. However, the two cooling modes differ significantly in actual deployment, requiring data center designers to make trade-offs during the initial design phase. Summary of the Invention

[0004] This article provides a cooling system and a first device to improve the flexibility of refrigeration.

[0005] Firstly, this paper provides a cooling system, including: First equipment, first system, second system, and third system; The first device is used to indirectly evaporatively cool the second device in the data center, the first system includes a system that uses cooling liquid for cooling, and the first system is used to cool the third device in the data center. The first device and the first system are connected in parallel to the second system, and the second system provides the cooling liquid to the first device and the first system; The third system is used to control the flow rate, which includes a first flow rate of the cooling liquid distributed to the first device and a second flow rate of the first system.

[0006] Secondly, this document also provides a first device, the first device comprising: A heat exchanger and a fourth system, wherein the heat exchanger is used to cool the return air in the data center to obtain first air; the fourth system is used to provide auxiliary cooling using a cooling liquid, and the fourth system is used to deliver the first air after cooling.

[0007] This paper describes a cooling system that integrates a first device and a first system. The first device implements indirect evaporative cooling, while the first system implements liquid cooling. The first device and the first system share a second system that provides the cooling liquid, and a third system controls the distribution of the cooling liquid between the first system and the first device. This allows for flexible adjustment of the cooling liquid flow rate in both the first device and the first system, solving the problem of poor flexibility in existing refrigeration systems and improving the flexibility of refrigeration.

[0008] It should be understood that the descriptions in this section are not intended to identify key or important features of this document, nor are they intended to limit its scope. Other features of this document will become readily apparent from the following description. Attached Figure Description

[0009] The above and other features, advantages, and aspects of this document will become more apparent when taken in conjunction with the accompanying drawings and with reference to the following specific manner. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and the originals and elements are not necessarily drawn to scale.

[0010] Figure 1 A schematic diagram of the cooling system scenario presented in this article is shown; Figure 2 A schematic diagram of the structure of a cooling system provided in this paper is shown; Figure 3 A schematic diagram of the deployment of a cooling system provided in this paper is shown. Detailed Implementation

[0011] The various implementations of this document will now be described in more detail with reference to the accompanying drawings. While some implementations of this document are shown in the drawings, it should be understood that this document can be implemented in various forms and should not be construed as limited to the implementations described herein. Rather, these implementations are provided to provide a more thorough and complete understanding of this document. It should be understood that the accompanying drawings and implementations are for illustrative purposes only and are not intended to limit the scope of this document.

[0012] The term "comprising" and its variations as used herein are open-ended inclusions, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "in one case" means "at least one case"; the term "in another case" means "at least one additional case"; the term "in some cases" means "at least some cases". Definitions of other terms will be given in the following description.

[0013] It should be noted that the concepts of "first" and "second" mentioned in this article are only used to distinguish different devices, modules or units, and are not used to limit the order of the functions performed by these devices, modules or units or their interdependencies.

[0014] It should be noted that the terms "one" and "more" used in this document are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0015] Existing data centers face a thorny issue during the design and construction phase: how to balance the demands of air cooling and liquid cooling while considering the flexibility required for future equipment migration. Current solutions allocate sufficient space and piping for both air and liquid cooling during the data center design phase to ensure support for equipment using both modes. However, this approach results in high initial investment costs. Therefore, a completely new system architecture is needed that can effectively reduce the upfront investment in compatible data centers while providing sufficient flexibility to adapt to equipment migration, thereby meeting the long-term development needs of data centers.

[0016] Therefore, this paper provides a cooling system. Figure 1 A schematic diagram of the cooling system scenario presented in this article is shown. See also Figure 1 Data center 1 includes multiple server racks 2, which can house terminal devices. These terminal devices can include various types of computer equipment, such as portable handheld devices, general-purpose computers (e.g., personal computers and laptops), workstations, wearable devices, touchscreen devices, self-service terminals, service robots, gaming systems, various messaging devices, sensors, or other sensing devices. These computer devices can run various types and versions of software applications and operating systems; or include various mobile operating systems. Portable handheld devices can include cellular phones, smartphones, tablets, personal digital assistants, etc. Wearable devices can include head-mounted displays and other devices. Gaming systems can include various handheld gaming devices, internet-enabled gaming devices, etc. The terminal devices are capable of executing various applications.

[0017] Cooling system 3 can provide cooling for data center 1. Cooling system 3 may include parts located outside data center 1 and parts located inside data center 1. For example, the air-cooled part of cooling system 3 can be placed outside data center 1, while the liquid-cooled part of cooling system 3 that cools the equipment can be located inside data center 1.

[0018] In this article, cooling system 3 can be considered a refrigeration system that is compatible with both air and liquid cooling. Figure 2 A schematic diagram of a cooling system provided in this paper is shown. This system can be applied to spaces requiring cooling, such as data centers. See also... Figure 2 The cooling system provided in this article includes: First equipment 21, first system 22, second system 23 and third system 24; The first device 21 is used to indirectly evaporatively cool the second device in the data center, and the first system 22 includes a system that uses cooling liquid for cooling. The first system 22 is used to cool the third device in the data center. The first device 21 and the first system 22 are connected in parallel to the second system 23 (the first device 21 and the first system 22 share the second system 23), and the second system 23 provides cooling liquid for the first device 21 and the first system 22. The third system 24 is used to control the flow rate, which includes a first flow rate of cooling liquid distributed to the first device 21 and a second flow rate of the first system 22.

[0019] The first device 21 can be an indirect evaporative cooling device. Indirect evaporative cooling can be considered a highly efficient and energy-saving refrigeration technology that can be applied to data center cooling systems. Indirect evaporative cooling utilizes the principle of water evaporation to achieve air cooling through indirect heat exchange, eliminating the need for compressors and water pumps found in traditional refrigeration units, thus significantly reducing energy consumption.

[0020] In this context, a data center can be considered a physical facility used to house terminal devices. A data center may include multiple server racks, on which terminal devices can be placed. A cooling system provides cooling for the data center. Terminal devices can be categorized into second and third devices based on their cooling methods. A second device can be a device corresponding to a first device, such as a second device being cooled by a first device 21. Alternatively, a second device can be a device corresponding to a first system 22, such as a second device being cooled by a first system.

[0021] There can be multiple third and second devices. That is, the first device 21 can serve multiple second devices. The first system 22 can serve multiple third devices. The second and third devices can also be the same device, that is, the device is cooled by both the first device 21 and the first system 22.

[0022] For example, a data center may include air-cooled racks, liquid-cooled racks, and compatible racks. Air-cooled racks may house second devices cooled by a first device 21. Liquid-cooled racks may house third devices cooled by a first system 22. Compatible racks may house devices cooled by both air and liquid cooling methods; that is, compatible racks are compatible with both air and liquid cooling.

[0023] The first system 22 can be considered a liquid cooling system, which uses a cooling liquid for cooling. The cooling liquid can be a fluid medium that absorbs and removes heat from the equipment being cooled through heat exchange to maintain or reduce its temperature.

[0024] The cooling system 3 achieves air-liquid compatibility by integrating the first device 21 and the first system 22.

[0025] The second system 23 may be a system that provides cooling liquid. The second system 23 is shared by the first device 21 and the first system 22, and the first device 21 may be a device that achieves cooling through the evaporation of water.

[0026] The third system 24 can be a system for controlling the flow rate of cooling liquid. The third system 24 can control the flow rate of cooling liquid flowing through the first device 21 and the first system 22.

[0027] The first flow rate can be the flow rate of the cooling liquid flowing to the first device 21. The second flow rate can be the flow rate of the cooling liquid flowing to the first system 22.

[0028] The second system 23 can be equipped with valves to control the first flow rate and valves to control the second flow rate. The third system 24 controls the valves, thereby achieving flow rate control.

[0029] In this paper, the first device 21 in cooling system 3 can cool the return air from the data center before sending it to the first device. The first system 22 can cool the second device using cooling liquid. This solves the problem of poor flexibility in existing refrigeration systems and improves the flexibility of refrigeration.

[0030] Figure 3 A schematic diagram of the deployment of a cooling system provided in this paper is shown. See [link / reference] Figure 3 In the cooling system, the first device 21 is connected in parallel with the first system 22 to the second system 23. The first system 22 may include a Cooling Distribution Unit (CDU) for liquid cooling. The second system 23 includes at least a pump and a cooling tower to provide cooling liquid. The first system 22 cools the third device in the liquid-cooled cabinet and compatible cabinet via liquid cooling. The first device 21 cools the second device in the air-cooled cabinet and compatible cabinet. Optionally, the cold air from the first device 21 can also be sent into the liquid-cooled cabinet to cool the third device.

[0031] See Figure 3 The second system 23 includes a first branch pipe 231 and a second branch pipe 232. The second system 23 can supply cooling fluid to the first device 21 through the first branch pipe 231 and supply cooling fluid to the first system 22 through the second branch pipe 232. The first branch pipe can be a branch pipe in the second system 23 that is connected to the first device 21. The second branch pipe can be a branch pipe in the second system 23 that is connected to the first system 22.

[0032] To control the first flow rate and the second flow rate, the second system 23 includes a first valve 233 and a second valve 234. The third system 24 controls the opening degree of the first valve 233 and the second valve 234 to realize the first flow rate flowing through the first valve 233 and the second flow rate flowing through the second valve 234.

[0033] Optionally, the first valve 233 can be located on the return water side of the first branch pipe 231, and the second valve can be located on the return water side of the second branch pipe 232. The third system 24 adjusts the first flow rate through the first valve 233 and adjusts the second flow rate through the second valve 234. When adjusting the flow rate, the third system 24 can adjust it based on the load situation in the data center.

[0034] The opening degree of the first valve 233 is related to the load of the second device, and the opening degree of the second valve 234 is related to the load of the third device.

[0035] The second and third devices can be information technology (IT) devices, such as servers, routers, switches, storage devices, printers, computers, etc.

[0036] In one example, the opening of the first valve 233 can be controlled by the heat generated by the second device. The opening of the second valve 234 can be controlled by the heat generated by the third device. The larger the opening, the greater the flow rate. The air-liquid ratio is adjusted through the first valve 233 and the second valve 234, improving the system's adaptability.

[0037] See Figure 3 The first device 21 includes a heat exchanger 210, which achieves cooling through air-to-air heat exchange. Outdoor intake air and indoor return air enter the heat exchanger 210 respectively, where heat exchange cools the return air and exhausts it outdoors. The first device 21 can be installed on the exterior wall or roof of the data center; no specific location is limited here. Indoor return air can be delivered to the heat exchanger 210 through ductwork. The indoor return air can be air collected from inside the data center and heated by the second and third devices; this air is at a higher temperature and carries the heat generated by the operation of the second and third devices.

[0038] Under certain climatic conditions, such as extreme heat and dryness, heat exchanger 210 alone may not be sufficient to meet the cooling needs of the computer room, requiring an auxiliary cooling source to supplement the cooling capacity. This supplemental cooling can be achieved using air-cooled direct expansion air conditioning units or water-cooled chiller units. However, air-cooled direct expansion air conditioning units have lower energy efficiency and lower refrigeration cycle efficiency, resulting in higher energy consumption. Furthermore, each unit requires a separate high-power power supply line, increasing initial investment costs. While water-cooled chiller units have higher energy efficiency, the system is more complex, typically requiring independent chilled water circulation systems, cooling water circulation systems, and corresponding auxiliary facilities such as water pumps. This high system complexity makes seamless integration with existing systems difficult, leading to challenges in system control.

[0039] Therefore, in order to improve the energy efficiency of the auxiliary cooling source and reduce operating energy consumption, and to achieve efficient integration with the system and coordinated integrated control, this paper proposes a fourth system as an auxiliary cooling source for auxiliary refrigeration. This fourth system can be considered a water-cooled direct expansion unit.

[0040] See Figure 3 The first device 21 includes a heat exchanger 210 and a fourth system 211. The heat exchanger 210 is used to cool the return air in the data center to obtain first air, which may be the air output after being cooled by the heat exchanger 210. The fourth system 211 is used for auxiliary cooling using the cooling liquid, and is used to cool the first air before delivering it to the second device. The air outlet of the heat exchanger 210 may face the fourth system 211 to deliver the first air to the fourth system 211 for further cooling. The side of the heat exchanger 210 facing the fourth system 211 may be vented with louvers for air delivery.

[0041] The fourth system 211 can condense the cooling liquid, and the heat released during the condensation process is carried away by the cooling liquid. The generated cold air is then sent into the second device.

[0042] In one embodiment, the fourth system 211 includes an evaporator 2110, a compressor (not shown), a pump 2111, and a condenser 2112. The condenser 2112 can be a water-cooled condenser, using a cooling liquid as the cooling medium. The compressor can be located between the evaporator 2110 and the pump 2111. The evaporator 2110, compressor, pump 2111, and condenser 2112 can be connected in series. The second system 23 delivers the cooling liquid to the condenser 2112 for condensation, and the evaporator 2110 is used to cool the first air before delivering it to the second device. The first air can also be referred to as indoor supply air, which can be cooled air supplied into the data center.

[0043] In the first device 21, the condenser 2112 is connected to the second system 23, and the cooling liquid from the cooling tower is sent to the condenser 2112 for condensation. The evaporator 2110 absorbs heat from the internally circulating hot air, and the resulting cold air is sent to the data center.

[0044] The working principle of the first device 21 can be summarized as follows: when environmental conditions cause the evaporator 2110 to be unable to meet the cooling demand on its own, the fourth system 211 is turned on to provide additional cooling capacity to the system.

[0045] The fourth system 211, connected in parallel with the first system 22 to the second system 23, achieves efficient utilization of the cold source. Based on the first system 22, the fourth system 211 is integrated with the second system 23 of the first system 22. This eliminates the need for complex independent chilled water / cooling water systems, simplifying system integration and control. The fourth system 211 can employ water-cooled condensation, with a cooling tower providing a medium-temperature cooling liquid, such as cooling water. The medium temperature can be a set temperature range or a set temperature, such as 33 / 39°C, avoiding the inefficient heat dissipation problem of conventional air-cooled equipment, significantly improving the system's overall energy efficiency ratio and condensation efficiency.

[0046] The above implementation solves the problems of low efficiency or complex systems of existing auxiliary cooling sources, and provides an efficient and energy-saving cooling method for data center scenarios.

[0047] In this paper, the overall power distribution requirement of the first device 21 is much lower than that of the scheme using an air-cooled direct expansion unit. Due to the reduced power demand, the use of related infrastructure such as power distribution lines, uninterruptible power supplies, and backup batteries can be significantly reduced, thereby effectively lowering the initial investment cost of the entire system.

[0048] In one case, the first device 21 further includes a controller for controlling the power-on state of the fourth system based on environmental parameters, including parameters of the environment in which the second device is located.

[0049] Environmental parameters can include ambient temperature. Operating status includes both on and off. When the ambient temperature is high (e.g., above the set temperature), the fourth system can be activated via the controller to provide auxiliary cooling. When the ambient temperature is low (e.g., below the set temperature), the fourth system can be shut down and will not provide auxiliary cooling.

[0050] In one case, the second device includes at least one of the following: Equipment located in the first rack; Equipment located in the second rack; The first cabinet and the second cabinet are different cabinets in the data center. For example, the first cabinet can be an air-cooled cabinet, and the second cabinet can be a compatible cabinet.

[0051] In one case, the third device includes at least one of the following: Equipment located in the second rack; Equipment located in the third rack.

[0052] The third rack can be a liquid-cooled rack. The first, second, and third racks can be different racks.

[0053] The equipment in the second rack can be cooled simultaneously by the first equipment 21 and the first system 22.

[0054] This paper addresses the issue of idle cooling equipment due to compatibility with both air and liquid cooling, thereby reducing the overall system's equipment investment.

[0055] The cooling system described in this paper achieves dynamic combination and on-demand allocation of air-cooled and liquid-cooled equipment. It eliminates the need to completely separate the capacity of air cooling and liquid cooling during the initial data center design phase; instead, it dynamically adjusts the activation ratio of the two modes based on actual load conditions. This flexible cooling strategy avoids equipment idleness and waste due to forecasting errors, and also enables the system to adapt to future changes in equipment type and load, improving the overall adaptability of the data center.

[0056] The cooling system described in this paper integrates an indirect evaporative cooling air-cooled system (i.e., the first device) and a cold plate liquid cooling system (i.e., the first system). In the first device, the compressor's heat dissipation shares a cooling water circulation system with the cold plate liquid cooling system (i.e., the second system). The entire cooling system can be cooled by an open cooling tower. The capacity of the fourth system and the liquid-cooled cold plate is dynamically adjusted according to the actual load, achieving seamless switching and improving adaptability to different load conditions, thus enhancing system adaptability. This effectively avoids the redundancy and waste of traditional subsystem layouts and improves overall resource utilization efficiency.

[0057] The first unit eliminates the need for an air-cooled condenser, saving space and cost, and achieves cooling simply by adding a first branch pipe. The compressor uses water-cooled condensation, which is more efficient than traditional air-cooling. Simultaneously, sharing a common cold source reduces the energy consumption of the outdoor circulating fan, improving the overall system energy efficiency and saving operating costs.

[0058] This document provides a first device comprising: a heat exchanger and a fourth system; the heat exchanger is used to cool return air in a data center to obtain first air; the fourth system is used for auxiliary cooling using a cooling liquid, and the first air is cooled and then delivered to a second device.

[0059] The fourth system in the first device includes an evaporator, a compressor, a pump, and a condenser.

[0060] The first device can be applied to scenarios that require an auxiliary cold source, without limitation. For example, it can be applied to a cooling system, which further includes a first system and a second system. The first device is used to perform indirect evaporative cooling on a second device in the data center, and the first system is used to cool a third device in the data center. The first device and the first system are connected in parallel to the second system, and the second system provides the cooling liquid to the first device and the first system.

[0061] In one scenario, the first device is integrated into a cooling system, which further includes a first system and a second system. The first device is used for indirect evaporative cooling of a second device in the data center, and the first system is used for cooling a third device in the data center. The first device and the first system are connected in parallel to the second system, which provides the cooling liquid to both the first device and the first system. The first device includes: A heat exchanger and a fourth system, wherein the heat exchanger is used to cool the return air in the data center to obtain first air; the fourth system is used to perform auxiliary refrigeration using the cooling liquid, and the fourth system is used to cool the first air and then deliver it to the second device.

[0062] In one embodiment, the fourth system includes an evaporator, a compressor, a pump, and a condenser, wherein the second system delivers the cooling liquid to the condenser for condensation, and the evaporator is used to cool the first air before delivering it to the second device.

[0063] In one embodiment, the first device further includes a controller for controlling the power-on state of the fourth system based on environmental parameters, including parameters of the environment in which the second device is located.

[0064] Based on one or more scenarios described herein, Example 1 provides a cooling system comprising: First equipment, first system, second system, and third system; The first device is used to indirectly evaporatively cool the second device in the data center, the first system includes a system that uses cooling liquid for cooling, and the first system is used to cool the third device in the data center. The first device and the first system are connected in parallel to the second system, and the second system provides the cooling liquid to the first device and the first system; The third system is used to control the flow rate, which includes a first flow rate of the cooling liquid distributed to the first device and a second flow rate of the first system.

[0065] According to one or more scenarios described herein, Example 2 provides the system described in Example 1, wherein the second system includes a first branch pipe and a second branch pipe; The second system provides the cooling liquid to the first device through the first branch pipe, and the second system provides the cooling liquid to the first system through the second branch pipe.

[0066] According to one or more scenarios described herein, Example 3 provides the system described in Example 2, the second system including a first valve and a second valve, the first valve being located on the return side of the first branch pipe and the second valve being located on the return side of the second branch pipe; The third system adjusts the first flow rate through the first valve; The third system adjusts the second flow rate through the second valve.

[0067] According to one or more scenarios described herein, Example 4 provides the system described in Example 3, wherein the opening degree of the first valve is related to the load of the second device, and the opening degree of the second valve is related to the load of the third device.

[0068] According to one or more scenarios described herein, Example 5 provides a system as described in Example 1, wherein the first device includes a heat exchanger and a fourth system, the heat exchanger being used to cool return air in the data center to obtain first air, the fourth system being used to perform auxiliary cooling using the cooling liquid, and the fourth system being used to cool the first air and then deliver it to the second device.

[0069] According to one or more scenarios described herein, Example 6 provides a system as described in Example 5, the fourth system comprising: an evaporator, a compressor, a pump, and a condenser, wherein the second system delivers the cooling liquid to the condenser for condensation, and the evaporator is used to cool the first air before delivering it to the second device.

[0070] According to one or more scenarios described herein, Example 7 provides the system described in Example 5, wherein the first device further includes a controller for controlling the power-on state of the fourth system based on environmental parameters; The environmental parameters include parameters of the environment in which the second device is located.

[0071] According to one or more scenarios described herein, Example 8 provides the system described in Example 1, wherein the second device includes at least one of the following: Equipment located in the first rack; Equipment located in the second rack; The first cabinet and the second cabinet are different cabinets in the data center.

[0072] According to one or more scenarios described herein, Example 9 provides the system described in Example 8, wherein the third device includes at least one of the following: Equipment located in the second rack; Equipment located in the third rack.

[0073] According to one or more scenarios described herein, Example 10 provides a first device comprising: A heat exchanger and a fourth system, wherein the heat exchanger is used to cool the return air in the data center to obtain first air; the fourth system is used to provide auxiliary cooling using a cooling liquid, and the fourth system is used to deliver the first air after cooling.

[0074] According to one or more scenarios described herein, Example 11 provides the first device described in Example 10, wherein the fourth system includes an evaporator, a compressor, a pump, and a condenser.

[0075] According to one or more scenarios described herein, Example 12 provides a first device as described in Example 10, the first device being integrated into a cooling system that further includes a first system and a second system, the first device being used for indirect evaporative cooling of a second device in a data center, the first system being used for cooling a third device in the data center, the first device and the first system being connected in parallel to the second system, the second system providing the cooling liquid to the first device and the first system.

[0076] The above description is merely a preferred embodiment and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of disclosure herein is not limited to technical solutions formed by specific combinations of the above-described technical features, but also includes other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-disclosed concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features disclosed herein that have similar functions.

[0077] Furthermore, while several specific implementation details are included in the above discussion, these should not be construed as limiting the scope of this paper. Certain features described in the context of a single scheme can also be implemented in combination within a single scheme. Conversely, various features described in the context of a single scheme can also be implemented individually or in any suitable sub-combination in multiple schemes.

[0078] Although the subject matter has been described using language specific to structural features and / or methodological logic, it should be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or actions described above. Rather, the specific features and actions described above are merely illustrative examples of implementing the claims.

Claims

1. A cooling system, comprising: First equipment, first system, second system, and third system; The first device is used to indirectly evaporatively cool the second device in the data center, the first system includes a system that uses cooling liquid for cooling, and the first system is used to cool the third device in the data center. The first device and the first system are connected in parallel to the second system, and the second system provides the cooling liquid to the first device and the first system; The third system is used to control the flow rate, which includes a first flow rate of the cooling liquid distributed to the first device and a second flow rate of the first system.

2. The system according to claim 1, wherein the second system includes a first branch pipe and a second branch pipe; The second system provides the cooling liquid to the first device through the first branch pipe, and the second system provides the cooling liquid to the first system through the second branch pipe.

3. The system according to claim 2, wherein the second system includes a first valve and a second valve, the first valve being located on the return water side of the first branch pipe and the second valve being located on the return water side of the second branch pipe; The third system adjusts the first flow rate through the first valve; The third system adjusts the second flow rate through the second valve.

4. The system according to claim 3, wherein the opening degree of the first valve is related to the load of the second device, and the opening degree of the second valve is related to the load of the third device.

5. The system according to claim 1, wherein the first device includes a heat exchanger and a fourth system, the heat exchanger is used to cool the return air in the data center to obtain first air, the fourth system is used to use the cooling liquid for auxiliary refrigeration, and the fourth system is used to cool the first air and then deliver it to the second device.

6. The system according to claim 5, wherein the fourth system comprises: The system includes an evaporator, a compressor, a pump, and a condenser. The second system delivers the cooling liquid to the condenser for condensation, and the evaporator is used to cool the first air before delivering it to the second device.

7. The system according to claim 5, wherein the first device further comprises a controller, the controller being configured to control the power-on state of the fourth system based on environmental parameters; The environmental parameters include parameters of the environment in which the second device is located.

8. The system according to claim 1, wherein the second device comprises at least one of the following: Equipment located in the first rack; Equipment located in the second rack; in, The first cabinet and the second cabinet are different cabinets in the data center.

9. The system according to claim 8, wherein the third device comprises at least one of the following: Equipment located in the second rack; Equipment located in the third rack.

10. A first device, the first device comprising: A heat exchanger and a fourth system, wherein the heat exchanger is used to cool the return air in the data center to obtain the first air; The fourth system is used for auxiliary refrigeration using cooling liquid, and the fourth system is used to cool the first air before delivery.

11. The apparatus of claim 10, wherein the fourth system comprises an evaporator, a compressor, a pump, and a condenser.

12. The device according to claim 10, wherein the first device is integrated in a cooling system, the cooling system further comprising a first system and a second system, the first device being used for indirect evaporative cooling of a second device in a data center, the first system being used for cooling a third device in the data center, the first device and the first system being connected in parallel to the second system, and the second system providing the cooling liquid to the first device and the first system.

Images