A method for laser cutting a circuit board

Abstract

The present application relates to a kind of circuit board laser cutting methods, applied to circuit board laser board splitter, by being placed on board fixture and being fixed, board track drives circuit board movement and displacement through between first cutting mechanism and second cutting mechanism, in the process of circuit board movement, first cutting mechanism and second cutting mechanism are synchronously cut to the upper and lower surfaces of circuit board respectively, in this way, the upper and lower surfaces of circuit board located on board fixture can be simultaneously laser cut, not only can increase the thickness of single laser cutting, improve the processing efficiency of laser cutting, but also be favorable to reduce heat affected zone, so that stable high-quality section can be maintained in the whole cutting depth range, thereby greatly improve the laser board splitting efficiency and finished product quality of circuit board.

Description

Technical Field

[0001] This invention relates to the field of circuit board depaneling technology, and more specifically to a method for laser cutting circuit boards. Background Technology

[0002] Against the backdrop of the rapid evolution of electronic manufacturing towards miniaturization, high density, and high integration, circuit boards, as an indispensable and important component of electronic products, are also gradually developing towards miniaturization, densification, and integration. In the production process of circuit boards, the separation of circuit boards is a core process link, and its processing quality directly affects the yield of the entire circuit board product.

[0003] With the continuous upgrading of requirements for the processing precision, efficiency, and yield of circuit board depaneling, the industry has gradually adopted laser depaneling machines for circuit board laser cutting because mechanical milling can generate physical stress on the circuit board, which can easily lead to quality problems such as damage to electronic components and chipping of the board edges. However, when existing laser depaneling machines depanel circuit boards, the single laser beam emitted by the laser head has limited energy density. For circuit boards with thicker and harder substrates, multiple reciprocating cuts are required. The long cutting time not only reduces the cutting efficiency, but also expands the heat-affected zone due to the accumulation of heat effects, resulting in quality problems such as rough cut surfaces and excessively thick carbonized layers, which greatly affects the depaneling efficiency and finished product quality of circuit boards. Summary of the Invention

[0004] Therefore, it is necessary to provide a method for laser cutting circuit boards.

[0005] The technical solution of this invention to solve the above-mentioned technical problems is as follows: A circuit board laser cutting method, applied to a circuit board laser depaneling machine, the circuit board laser depaneling machine comprising: a work frame, a depaneling track, a first cutting mechanism, a second cutting mechanism, and a depaneling fixture, wherein the depaneling track, the first cutting mechanism, the second cutting mechanism, and the depaneling fixture are respectively disposed on the work frame, and includes the following steps:

[0006] The circuit board is placed on the board separation fixture and fixed in place;

[0007] The circuit board is moved by the partition track and displaced between the first cutting mechanism and the second cutting mechanism;

[0008] During the movement of the circuit board, the first cutting mechanism and the second cutting mechanism simultaneously cut the upper and lower surfaces of the circuit board.

[0009] In one embodiment, the plate-splitting track includes: a motor, a first lead screw, and two plate-splitting guide rails. The two plate-splitting guide rails are spaced apart on the work frame. The plate-splitting fixture is slidably disposed on the two plate-splitting guide rails, and the plate-splitting fixture is movably aligned with the first cutting mechanism and the second cutting mechanism. The first lead screw is rotatably disposed on the work frame, and a first lead screw nut is disposed on the first lead screw. The first lead screw nut is connected to the plate-splitting fixture, and the motor is drivenly connected to the first lead screw.

[0010] In one embodiment, the first cutting mechanism includes a first laser generator and a first laser head, wherein the first laser generator is disposed on the work frame, the first laser head is connected to the first laser generator, and the first laser head is located on the first side of the plate separating track.

[0011] In one embodiment, the second cutting mechanism includes a second laser generator and a second laser head. The second laser generator is disposed on the work frame, and the second laser head is connected to the second laser generator. The second laser head is located on the second side of the plate separating track, and the second laser head is aligned with the first laser head.

[0012] In one embodiment, the circuit board laser depaneling machine further includes: a plate-mounting mechanism, which includes: two guide rails, the two guide rails being spaced apart on the work frame, and the two guide rails moving towards or away from each other, each guide rail being rotatably provided with two pulleys at intervals, and a conveyor belt rotatably wound around the two pulleys.

[0013] In one embodiment, the circuit board laser depaneling machine further includes a board picking mechanism, which includes a horizontal guide rail, a vertical guide rail, a first mounting frame, and a plurality of vacuum suction cups. The horizontal guide rail is disposed on the work frame, the vertical guide rail is slidably disposed on the horizontal guide rail, the first mounting frame is slidably disposed on the vertical guide rail, and the vacuum suction cups are spaced apart on the first mounting frame.

[0014] In one embodiment, the circuit board laser depaneling machine further includes a depaneling mechanism, which includes two drive rollers, which are rotatably mounted on the work frame at intervals, and a conveyor belt is rotatably wound around the two drive rollers.

[0015] In one embodiment, the first cutting mechanism further includes: a second mounting frame, which is lifted and lowered on the work frame and moves toward or away from the plate separating track; the first laser generator is mounted on the second mounting frame; and a first positioning camera is provided on the second mounting frame.

[0016] In one embodiment, the second cutting mechanism further includes: a third mounting frame, which is lifted and lowered on the work frame and moves toward or away from the plate separating track; the second laser generator is mounted on the third mounting frame; and a second positioning camera is provided on the third mounting frame.

[0017] In one embodiment, the second mounting bracket is provided with a first dust removal pipe, and the third mounting bracket is provided with a second dust removal pipe.

[0018] The beneficial effects of this invention are as follows: The circuit board laser cutting method provided by this invention involves placing the circuit board on a separating fixture for fixation, and a separating track driving the circuit board to move and displace between a first cutting mechanism and a second cutting mechanism. During the movement of the circuit board, the first cutting mechanism and the second cutting mechanism simultaneously cut the upper and lower surfaces of the circuit board. In this way, the upper and lower surfaces of the circuit board located on the separating fixture can be laser cut simultaneously. This not only increases the thickness of a single laser cut and improves the processing efficiency of laser cutting, but also helps to reduce the heat-affected zone, so that a stable high-quality cut surface can be maintained throughout the entire cutting depth range, thereby greatly improving the laser separation efficiency and finished product quality of the circuit board. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic flowchart of a circuit board laser cutting method according to an embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of a circuit board laser depaneling machine according to an embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of the structure of the plate-splitting track, the first cutting mechanism, the second cutting mechanism, and the plate-splitting fixture according to an embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the structure of the plate-splitting track and plate-splitting fixture according to an embodiment of the present invention;

[0024] Figure 5 This is a schematic diagram of the structure of the first cutting mechanism and the second cutting mechanism according to an embodiment of the present invention;

[0025] Figure 6 This is a schematic diagram of the structure of the first cutting mechanism according to an embodiment of the present invention;

[0026] Figure 7 This is a schematic diagram of the upper plate mechanism according to an embodiment of the present invention;

[0027] Figure 8 This is a schematic diagram of the plate-retrieving mechanism according to an embodiment of the present invention;

[0028] Figure 9 This is a schematic diagram of the lower plate mechanism according to an embodiment of the present invention.

[0029] In the attached diagram, 10 is a laser PCB separator; 100 is a work frame; 200 is a separator track; 210 is a motor; 220 is a first lead screw; 230 is a separator guide rail; 240 is a first lead screw nut; 250 is an adjusting plate; 300 is a first cutting mechanism; 310 is a first laser generator; 320 is a first laser head; 330 is a second mounting bracket; 340 is a first positioning camera; 350 is a first dust removal duct; 360 is a second lead screw; 361 is a first adjusting handle; 400 is a second cutting mechanism; 410 is a first cutting plate; 220 is a second cutting mechanism; 230 is a first laser nut; 240 is a first lead screw nut; 250 is an adjusting plate; 300 is a first cutting mechanism; 310 is a second cutting mechanism; 420 is a second cutting mechanism; 430 is a second cutting mechanism; 240 is a first cutting mechanism; 250 is a first cutting mechanism; 260 is a second laser generator; 361 is a first cutting mechanism; 400 is a second cutting mechanism; 410 is a first cutting mechanism; 250 is a second cutting mechanism; 260 is a first cutting mechanism; 270 is a second cutting mechanism; 280 is a second cutting mechanism; 290 is a second cutting mechanism; 200 is a second cutting mechanism; 210 is a second cutting mechanism; 220 is a first cutting mechanism; 230 is a first cutting mechanism; 240 is a first cutting mechanism; 250 is a second cutting mechanism; 261 is a second cutting mechanism; 270 is a second cutting mechanism; 280 is a second cutting mechanism; 290 is a second cutting mechanism; 200 is a second cutting mechanism; 210 is a second cutting mechanism; 220 is a first cutting mechanism; 230 is 420 Second laser generator; 430 Third mounting bracket; 440 Second positioning camera; 450 Second dust removal duct; 500 Separating fixture; 600 Upper plate mechanism; 610 Guide rail plate; 620 Pulley; 630 Conveyor belt; 640 Limit rod; 650 Driver; 700 Plate picking mechanism; 710 Horizontal guide rail; 720 Vertical guide rail; 730 First mounting bracket; 740 Vacuum suction cup; 800 Lower plate mechanism; 810 Drive roller; 820 Conveyor belt. Detailed Implementation

[0030] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0031] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0033] In one embodiment, such as Figure 1 As shown, a circuit board laser cutting method is applied to a circuit board laser depaneling machine. The circuit board laser depaneling machine includes: a work frame, a depaneling track, a first cutting mechanism, a second cutting mechanism, and a depaneling fixture. The depaneling track, the first cutting mechanism, the second cutting mechanism, and the depaneling fixture are respectively disposed on the work frame, and the method includes the following steps:

[0034] Step 110: Place the circuit board on the board separation fixture and fix it in place;

[0035] Step 120: The circuit board is moved by the partition track and displaced between the first cutting mechanism and the second cutting mechanism;

[0036] Step 130: During the movement of the circuit board, the first cutting mechanism and the second cutting mechanism simultaneously cut the upper and lower surfaces of the circuit board.

[0037] In this embodiment, the circuit board is fixed on the separation fixture, and the separation track drives the circuit board to move and displace between the first cutting mechanism and the second cutting mechanism. During the movement of the circuit board, the first cutting mechanism and the second cutting mechanism simultaneously cut the upper and lower surfaces of the circuit board. In this way, the upper and lower surfaces of the circuit board located on the separation fixture can be laser cut at the same time. This not only increases the thickness of a single laser cut and improves the processing efficiency of laser cutting, but also helps to reduce the heat-affected zone, so that a stable high-quality cut surface can be maintained throughout the entire cutting depth range, thereby greatly improving the laser separation efficiency and finished product quality of the circuit board.

[0038] In one embodiment, such as Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, the circuit board laser depaneling machine 10 includes: a work frame 100, a depaneling track 200, a first cutting mechanism 300, a second cutting mechanism 400, and a depaneling fixture 500. The depaneling track 200 is disposed on the work frame 100. The first cutting mechanism 300 includes: a first laser generator 310 and a first laser head 320. The first laser generator 310 is disposed on the work frame 100, and the first laser head 320 is connected to the first laser generator 310. The first laser head 320 is located on a first side of the depaneling track 200. The second cutting mechanism 400 includes: a second laser generator 410 and a second laser head 420. The second laser generator 410 is disposed on the work frame 100. The second laser head 420 is connected to the second laser generator 410. The second laser head 420 is located on the second side of the plate separating track 200 and is aligned with the first laser head 320. The plate separating fixture 500 is slidably disposed on the plate separating track 200 and is movably aligned with the first laser head 320 and the second laser head 420.

[0039] In this embodiment, the board-separating track 200 is mounted on the work frame 100. The first laser head 320 of the first cutting mechanism 300 and the second laser head 420 of the second cutting mechanism 400 are located on opposite sides of the board-separating track 200, i.e., the first laser head 320 is located above the board-separating track 200, and the second laser head 420 is located below the board-separating track 200. The board-separating fixture 500 is slidably mounted on the board-separating track 200, and the board-separating fixture 500 is movably aligned with the first laser head 320 and the second laser head 420. The board-separating fixture 500 can drive the circuit board to be positioned on the first laser head 320. Between the first laser head 320 and the second laser head 420, the upper and lower surfaces of the circuit board located on the separation fixture 500 can be laser-cut simultaneously by the first laser head 320 and the second laser head 420. The collaborative work of the two laser heads can not only increase the thickness of a single laser cut, with a maximum cutting thickness of up to 20mm, thus significantly shortening the laser cutting time and improving the processing efficiency of laser cutting, but also help to reduce the heat-affected zone, so as to maintain a stable high-quality cut surface throughout the entire cutting depth range, thereby greatly improving the laser separation efficiency of the circuit board and the quality of the finished product.

[0040] In this embodiment, compared to the traditional method of cutting a fixed circuit board with a moving laser head, the first laser head 320 of the first cutting mechanism 300 and the second laser head 420 of the second cutting mechanism 400 are fixed on the upper and lower sides of the separating track 200. The separating fixture 500 slides on the separating track 200 to move the circuit board between the first laser head 320 and the second laser head 420 for simultaneous cutting on both sides. By changing the moving object, the inertial and vibration errors caused by the high-speed movement of the laser head can be eliminated. This can eliminate dynamic errors and improve cutting accuracy at the mechanical structure level, and further improve the processing accuracy and long-term operational stability of the circuit board laser separating machine 10.

[0041] In one embodiment, such as Figure 2 and Figure 7 As shown, the circuit board laser depaneling machine 10 further includes a loading mechanism 600, which includes two guide rails 610. The two guide rails 610 are spaced apart on the work frame 100 and can move towards or away from each other. Each guide rail 610 is rotatably equipped with two pulleys 620, and a conveyor belt 630 is rotatably wound around the two pulleys 620. Specifically, the two guide rails 610 are arranged opposite to each other on the work frame 100, and a conveyor belt 630 is rotatably mounted on the opposite side of each guide rail 610. That is, the conveyor belt 630 is wound around the two rotatably mounted pulleys 620. A motor 210 drives one pulley 620 to rotate, thereby driving the conveyor belt 630 to move. Thus, the loading mechanism 600 can transport and load circuit boards by belt conveying.

[0042] In one embodiment, such as Figure 2 and Figure 8As shown, the circuit board laser depaneling machine 10 further includes a board picking mechanism 700, which includes a horizontal guide rail 710, a vertical guide rail 720, a first mounting frame 730, and multiple vacuum suction cups 740. The horizontal guide rail 710 is disposed on the work frame 100, the vertical guide rail 720 is slidably disposed on the horizontal guide rail 710, the first mounting frame 730 is slidably disposed on the vertical guide rail 720, and the vacuum suction cups 740 are spaced apart on the first mounting frame 730. Specifically, the vertical guide rail 720 moves along the X-axis direction on the horizontal guide rail 710, the first mounting frame 730 moves along the Y-axis direction on the vertical guide rail 720, and the vacuum suction cups 740 are spaced apart on the first mounting frame 730, enabling the vacuum suction cups 740 to move in the X-axis and Y-axis directions. Each vacuum suction cup 740 is used to pick up and move the circuit board, thereby realizing automated movement of the circuit board on the loading mechanism 600 onto the depaneling fixture 500. It is worth noting that the method of driving the vertical guide rail 720 to slide on the horizontal guide rail 710 and the first mounting bracket 730 to slide on the vertical guide rail 720 is a technique that can be known to those skilled in the art and is achievable. In this embodiment, it will not be described in detail. For example, it can be achieved by the cooperation of the motor 210, the lead screw and the lead screw nut.

[0043] In one embodiment, such as Figure 7 As shown, each guide rail plate 610 is provided with a limit rod 640. Both limit rods 640 move towards or away from the conveyor belt 630. Each guide rail plate 610 is provided with a driver 650, and each driver 650 is drivenly connected to one of the limit rods 640. Specifically, the two limit rods 640 are arranged opposite to each other on the two guide rail plates 610 to limit movement. The driver 650 is a cylinder. The driver 650 drives the limit rod 640 forward to the conveyor belt 630, which can stop the circuit board on the conveyor belt 630, so that the circuit board can be positioned on the upper plate mechanism 600, making it easier for the board picking mechanism 700 to move the circuit board on the upper plate mechanism 600 to the separating fixture 500.

[0044] In one embodiment, such as Figure 2 and Figure 9As shown, the circuit board laser depaneling machine 10 further includes a depaneling mechanism 800, which includes two drive rollers 810. The two drive rollers 810 are rotatably arranged on the work frame 100 at intervals, and a conveyor belt 820 is rotatably wound around the two drive rollers 810. Specifically, the upper plate mechanism 600 and the lower plate mechanism 800 are arranged at intervals at both ends of the work frame 100. The two drive rollers 810 are arranged opposite each other on the work frame 100, and the conveyor belt 820 is wound around the two rotatably arranged drive rollers 810. The motor 210 drives one drive roller 810 to rotate, which can drive the conveyor belt 820 to move. Thus, the lower plate mechanism 800 can transport the circuit board off the board by conveying it with a belt. After the first cutting mechanism 300 and the second cutting mechanism 400 perform laser cutting on the circuit board on the depaneling fixture 500, the board taking mechanism 700 moves the cut circuit board and places it on the lower plate mechanism 800 for unloading.

[0045] In one embodiment, such as Figure 2 , Figure 3 and Figure 4 As shown, the slab separating track 200 includes: a motor 210, a first lead screw 220, and two slab separating guide rails 230. The two slab separating guide rails 230 are spaced apart on the work frame 100. The slab separating fixture 500 is slidably disposed on the two slab separating guide rails 230. The first lead screw 220 is rotatably disposed on the work frame 100. A first lead screw nut 240 is disposed on the first lead screw 220. The first lead screw nut 240 is connected to the slab separating fixture 500. The motor 210 is drivenly connected to the first lead screw 220. Specifically, the board separation fixture 500 is slidably mounted on two board separation guide rails 230 via a slider. The first lead screw 220 is rotatably mounted on one side of one board separation guide rail 230. The first lead screw 220 is driven to rotate by the motor 210, which can drive the board separation fixture 500 connected to the lead screw nut to move on the two board separation guide rails 230. The motor 210 is a servo motor 210, and the first lead screw 220 is a ball screw, which can drive the board separation fixture 500 to perform micron-level linear motion, thereby ensuring that the circuit board moves precisely during the processing.

[0046] In one embodiment, such as Figure 3 and Figure 4As shown, the slab separation track 200 further includes an adjustment plate 250, which is slidably mounted on the work frame 100. Two slab separation guide rails 230 are spaced apart on the adjustment plate 250. Specifically, the sliding direction of the adjustment plate 250 on the work frame 100 is perpendicular to the sliding direction of the slab separation fixture 500 on the two slab separation guide rails 230. That is, the sliding of the adjustment plate 250 on the work frame 100 can drive the slab separation fixture 500 to move horizontally, thereby adjusting the horizontal position of the slab separation fixture 500 on the work frame 100. This allows for adjustment of the laser cutting position of the circuit board on the slab separation fixture 500, enabling better adaptation to circuit boards of different specifications.

[0047] In one embodiment, such as Figure 3 , Figure 5 and Figure 6 As shown, the first cutting mechanism 300 further includes a second mounting bracket 330, which is disposed on the work frame 100. The first laser generator 310 is mounted on the second mounting bracket 330, and a first positioning camera 340 is disposed on the second mounting bracket 330. Specifically, the first laser generator 310 is mounted on the work frame 100 via the second mounting bracket 330, and the first positioning camera 340 is disposed on the second mounting bracket 330. The first positioning camera 340 is a CCD camera, which can accurately locate the laser cutting position through signal communication, playing the role of automatic visual positioning. In this way, after the circuit board on the separating fixture 500 enters the laser cutting area, the first positioning camera 340 can quickly capture the image and transmit it to the control system. After the control system analyzes the image through the image processing algorithm, it can quickly confirm the laser cutting position on the upper surface of the circuit board, thereby accurately performing laser cutting at the corresponding position on the circuit board.

[0048] In one embodiment, such as Figure 3 and Figure 5As shown, the second cutting mechanism 400 further includes a third mounting bracket 430, which is disposed on the work frame 100. The second laser generator 410 is mounted on the third mounting bracket 430, and a second positioning camera 440 is disposed on the third mounting bracket 430. Specifically, the second laser generator 410 is mounted on the work frame 100 via the third mounting bracket 430, and the second positioning camera 440, which is a CCD camera, is disposed on the third mounting bracket 430. It can accurately locate the laser cutting position through signal communication, thus playing the role of automatic visual positioning. In this way, after the circuit board on the separating fixture 500 enters the laser cutting area, the second positioning camera 440 can quickly capture the image and transmit it to the control system. After the control system analyzes the image through the image processing algorithm, it can quickly confirm the laser cutting position on the lower surface of the circuit board, thereby accurately performing laser cutting at the corresponding position on the circuit board. It is worth noting that the method of visual positioning using a CCD camera is a technology known to those skilled in the art and is achievable, and will not be described in detail in this embodiment.

[0049] In one embodiment, such as Figure 6 As shown, the second mounting bracket 330 is raised and lowered on the work frame 100, and the second mounting bracket 330 moves towards or away from the partition track 200. A second lead screw 360 is rotatably mounted on the work frame 100, and a second lead screw nut is provided on the second lead screw 360. The second lead screw nut is connected to the second mounting bracket 330, and a first adjusting handle 361 is provided on the second lead screw 360. Specifically, the second mounting bracket 330 is slidably mounted on the work frame 100 via a slide rail and a slider, and moves along the Z-axis on the work frame 100, which can drive the first laser head 320 to move closer to or further away from the separating track 200. The second lead screw 360 is rotatably mounted on the work frame 100, and the second lead screw nut on the second lead screw 360 is connected to the second mounting bracket 330. The second lead screw 360 is equipped with a first adjusting handle 361. The operator can rotate the first adjusting handle 361 to drive the second lead screw 360 to rotate, so that the second mounting bracket 330 can move up and down on the work frame 100. This allows for adjustment of the distance between the first laser head 320 and the circuit board on the separating track 200, and flexible adjustment of the focal length of the first laser head 320 to adapt to circuit boards of different thicknesses, thereby ensuring that the laser focus emitted by the first laser head 320 is always on the optimal cutting plane.

[0050] In one embodiment, the third mounting bracket 430 is raised and lowered on the work frame 100, and the third mounting bracket 430 moves towards or away from the partition track 200. A third lead screw is rotatably mounted on the work frame 100, and a third lead screw nut is mounted on the third lead screw. The third lead screw nut is connected to the third mounting bracket 430, and a second adjusting handle is mounted on the third lead screw. Specifically, the third mounting bracket 430 is slidably mounted on the work frame 100 via a slide rail and a slider, and moves along the Z-axis on the work frame 100, which can drive the second laser head 420 to move closer to or further away from the separating track 200. The third lead screw is rotatably mounted on the work frame 100, and the third lead screw nut on the third lead screw is connected to the third mounting bracket 430. A second adjustment handle is provided on the third lead screw, which the operator can rotate to drive the third lead screw to rotate, so that the third mounting bracket 430 can move up and down on the work frame 100. This allows adjustment of the distance between the second laser head 420 and the circuit board on the separating track 200, and flexible adjustment of the focal length of the second laser head 420 to adapt to circuit boards of different thicknesses, thereby ensuring that the laser focus emitted by the second laser head 420 is always on the optimal cutting plane.

[0051] In one embodiment, such as Figure 5 and Figure 6 As shown, a first dust removal pipe 350 is provided on the second mounting bracket 330, and a second dust removal pipe 450 is provided on the third mounting bracket 430. Specifically, by providing the first dust removal pipe 350 and the second dust removal pipe 450 on the second mounting bracket 330 and the third mounting bracket 430 respectively, with the inlets of the first dust removal pipe 350 and the second dust removal pipe 450 facing the laser cutting area respectively, and with the help of an external fan, a negative pressure environment can be formed inside the first dust removal pipe 350 and the second dust removal pipe 450. The first dust removal pipe 350 and the second dust removal pipe 450 have sufficient suction power to promptly remove the smoke and dust generated during laser cutting, keeping the working environment clean and the circuit board surface clean.

[0052] Compared with the prior art, the present invention has at least the following advantages:

[0053] This invention provides a method for laser cutting circuit boards. The circuit board is placed and fixed on a separating fixture. A separating track moves the circuit board, displacing it between a first cutting mechanism and a second cutting mechanism. During the movement of the circuit board, the first and second cutting mechanisms simultaneously cut the upper and lower surfaces of the circuit board. This allows for simultaneous laser cutting of the upper and lower surfaces of the circuit board on the separating fixture, increasing the thickness of a single laser cut and improving processing efficiency. It also helps reduce the heat-affected zone, maintaining a stable, high-quality cut surface throughout the entire cutting depth range. This significantly improves the efficiency of laser board separation and the quality of the finished product.

[0054] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0055] The embodiments described above are merely illustrative of several implementations of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for laser cutting circuit boards, characterized in that, A laser PCB depaneling machine is used, comprising: a work frame, a depaneling track, a first cutting mechanism, a second cutting mechanism, and a depaneling fixture. The depaneling track, the first cutting mechanism, the second cutting mechanism, and the depaneling fixture are respectively mounted on the work frame. The process includes the following steps: The circuit board is placed on the board separation fixture and fixed in place; The circuit board is moved by the partition track and displaced between the first cutting mechanism and the second cutting mechanism; During the movement of the circuit board, the first cutting mechanism and the second cutting mechanism simultaneously cut the upper and lower surfaces of the circuit board.

2. The circuit board laser cutting method according to claim 1, characterized in that, The slitting track includes a motor, a first lead screw, and two slitting guide rails. The two slitting guide rails are spaced apart on the work frame. The slitting fixture is slidably mounted on the two slitting guide rails and is movably aligned with the first cutting mechanism and the second cutting mechanism. The first lead screw is rotatably mounted on the work frame and is provided with a first lead screw nut. The first lead screw nut is connected to the slitting fixture. The motor is driven by the first lead screw.

3. The circuit board laser cutting method according to claim 2, characterized in that, The first cutting mechanism includes a first laser generator and a first laser head. The first laser generator is mounted on the work frame, and the first laser head is connected to the first laser generator. The first laser head is located on the first side of the plate separating track.

4. The circuit board laser cutting method according to claim 3, characterized in that, The second cutting mechanism includes a second laser generator and a second laser head. The second laser generator is mounted on the work frame, and the second laser head is connected to the second laser generator. The second laser head is located on the second side of the plate separating track, and the second laser head is aligned with the first laser head.

5. The circuit board laser cutting method according to claim 1, characterized in that, The circuit board laser separation machine further includes: a plate-up mechanism, which includes: two guide rails, which are spaced apart on the work frame and move towards or away from each other. Each guide rail is rotatably equipped with two pulleys, and a conveyor belt is rotatably wound around the two pulleys.

6. The circuit board laser cutting method according to claim 5, characterized in that, The circuit board laser separation machine further includes a board picking mechanism, which includes a horizontal guide rail, a vertical guide rail, a first mounting frame, and multiple vacuum suction cups. The horizontal guide rail is disposed on the work frame, the vertical guide rail is slidably disposed on the horizontal guide rail, the first mounting frame is slidably disposed on the vertical guide rail, and each of the vacuum suction cups is spaced apart on the first mounting frame.

7. The circuit board laser cutting method according to claim 6, characterized in that, The circuit board laser depaneling machine further includes a depaneling mechanism, which includes two drive rollers. The two drive rollers are rotatably mounted on the work frame at intervals, and a conveyor belt is rotatably wound around the two drive rollers.

8. The circuit board laser cutting method according to claim 4, characterized in that, The first cutting mechanism further includes: a second mounting frame, which is lifted and lowered on the work frame and moves towards or away from the plate separating track; the first laser generator is mounted on the second mounting frame; and a first positioning camera is mounted on the second mounting frame.

9. The circuit board laser cutting method according to claim 8, characterized in that, The second cutting mechanism further includes: a third mounting frame, which is lifted and lowered on the work frame and moves towards or away from the dividing plate track; the second laser generator is mounted on the third mounting frame; and a second positioning camera is mounted on the third mounting frame.

10. The circuit board laser cutting method according to claim 9, characterized in that, The second mounting bracket is provided with a first dust removal pipe, and the third mounting bracket is provided with a second dust removal pipe.

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