Phase change heat spreader for artificial intelligence

Abstract

This invention provides a phase-change heat sink for artificial intelligence, comprising: a substrate, vertically arranged with a phase-change chamber formed therein, capable of containing a phase-change medium that can transform between a gaseous and a liquid state, and an artificial intelligence chip mounted on a side of the substrate; a phase-change conduit, a first end of which is connected to the top of the substrate and communicates with the phase-change chamber; and a condenser, disposed above the substrate, with a condensation chamber formed inside, connected to the second end of the phase-change conduit and communicating with the condensation chamber. The phase-change heat sink of this invention can efficiently dissipate heat from the artificial intelligence chip through a phase-change mechanism.

Description

Technical Field

[0001] This invention relates to the field of artificial intelligence, and in particular to a phase change heat sink for use in artificial intelligence. Background Technology

[0002] With the rapid development of artificial intelligence technology, the computing power demand of AI chips continues to rise, and the power consumption and heat generation of these chips are also increasing dramatically. AI chips generate a large amount of heat during operation. If this heat cannot be dissipated effectively and in a timely manner, the chip temperature will rise rapidly, affecting not only the chip's computing performance and operational stability, but in severe cases, even burning out the chip and paralyzing the entire AI system.

[0003] Currently, both traditional air-cooled and liquid-cooled heat sinks have limitations when used for cooling artificial intelligence chips. Traditional air-cooled heat sinks typically use heat sink fins in conjunction with fans for heat dissipation, but their cooling efficiency is limited and cannot meet the cooling requirements of high-power-density artificial intelligence chips. While traditional liquid-cooled heat sinks offer higher cooling efficiency, their system structure is complex, requiring components such as water pumps, water tanks, and radiators, posing a risk of leakage, and consuming more energy. Summary of the Invention

[0004] To address the aforementioned problems in the prior art, the present invention aims to provide a phase-change heat sink for artificial intelligence, which can efficiently dissipate heat from artificial intelligence chips through phase change.

[0005] To address the above problems, the present invention provides a phase change heat sink for artificial intelligence, the phase change heat sink comprising:

[0006] A substrate, which is vertically arranged and has a phase change chamber formed inside it, is capable of accommodating a phase change medium that can transform between a gaseous and a liquid state, and the side of the substrate is used to mount an artificial intelligence chip.

[0007] A phase change pipeline, wherein the first end of the phase change pipeline is connected to the top end of the substrate and communicates with the phase change chamber;

[0008] A condenser is disposed above the substrate, and a condensation chamber is formed inside the condenser. The condenser is connected to the second end of the phase change pipeline and communicates with the condensation chamber.

[0009] Furthermore, the condenser is a microchannel radiator, which includes a first manifold, multiple flat tubes, and a second manifold. The two ends of the flat tubes are respectively connected to the first manifold and the second manifold. The phase change pipeline includes multiple phase change pipelines, which are spaced apart. Some of the phase change pipelines are connected to the first manifold, and some of the phase change pipelines are connected to the second manifold.

[0010] Furthermore, the first manifold and the second manifold are arranged laterally and vertically spaced apart, and the flat tube is arranged at an angle.

[0011] Furthermore, the condenser includes multiple microchannel heat sinks, which are vertically stacked together. The two first manifolds of adjacent microchannel heat sinks are connected, and the two second manifolds of adjacent microchannel heat sinks are connected.

[0012] Furthermore, the first manifold is higher than the second manifold, and the phase change heat sink further includes:

[0013] An axial flow fan is installed inside the first manifold and along the length of the first manifold. The axial flow fan enables the gaseous phase change medium to flow towards the second manifold.

[0014] Furthermore, the first manifold is higher than the second manifold, and the phase change pipeline includes:

[0015] Multiple first pipelines, the first end of the first pipeline is connected to the first manifold, and the second end of the first pipeline is connected to the transverse middle region of the phase change chamber;

[0016] Multiple second pipes, the first end of which is connected to the second manifold, and the second end of which is connected to the lateral edge region of the phase change chamber.

[0017] Furthermore, the phase change heat sink further includes a flow boosting device disposed between the substrate and a portion of the first conduit, the first conduit being connected to the phase change chamber via the flow boosting device, the flow boosting device comprising:

[0018] The first adapter tube has its bottom end connected to the substrate, and its top end is provided with a first rotating plate and a first abutting member. The first rotating plate can only rotate upward from the first reference position, and the first abutting member can abut against the edge area of ​​the first rotating plate at the first reference position.

[0019] An airbag, the bottom end of which is connected to the top end of the first adapter tube, is capable of compressing and deforming.

[0020] The second adapter tube has its bottom end connected to the top end of the airbag. The bottom end of the second adapter tube is provided with a second rotating plate and a second abutting member. The second rotating plate can only rotate upward from the second reference position, and the second abutting member can abut against the edge area of ​​the second rotating plate at the second reference position.

[0021] Furthermore, the phase change heat sink also includes:

[0022] A housing that contains the flow booster and whose sidewalls abut against the airbag;

[0023] A compression device is disposed inside the box and has a telescopic arm. When the telescopic arm is extended, it can push the airbag to compress the side wall of the box and generate compression deformation.

[0024] Furthermore, the phase change heat sink also includes:

[0025] A housing that covers the condenser, wherein a first opening is formed at one lateral end of the housing and a second opening is formed at its top.

[0026] Furthermore, the phase change heat sink also includes:

[0027] A fan is located above the housing and faces the second opening.

[0028] Due to the above technical solution, the present invention has the following beneficial effects:

[0029] According to the phase change heat sink for artificial intelligence of the present invention, the phase change medium absorbs heat transferred from the artificial intelligence chip in the phase change chamber of the substrate and evaporates from a liquid state to a gaseous state. The gaseous phase change medium's temperature rises and its density decreases, and driven by buoyancy, it rises through the phase change pipe to the condenser chamber located above the substrate. In the condenser chamber, the gaseous phase change medium exchanges heat with the condenser, releasing heat to the external environment or cooling medium, and condenses into a liquid state after its temperature decreases. The liquid phase change medium flows back to the phase change chamber of the substrate along the phase change pipe under its own gravity, thus completing the phase change cycle heat dissipation process. By vertically arranging the substrate and placing the condenser above it, both the upward direction of the gaseous phase change medium and the return direction of the liquid phase change medium are vertical, fully utilizing the buoyancy of the gaseous phase change medium and the gravity of the liquid phase change medium to drive the circulation of the phase change medium, eliminating the need for an additional pumping device and achieving unpowered natural circulation heat dissipation. Meanwhile, phase change media can absorb and transfer a large amount of latent heat during the phase change process, and the heat dissipation efficiency is much higher than that of traditional single-phase heat dissipation methods, which can effectively solve the heat dissipation problem of high power density artificial intelligence chips. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the present invention, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0031] Figure 1 This is a structural diagram of a phase change heat sink for artificial intelligence according to an embodiment of the present invention;

[0032] Figure 2 This is a structural diagram of a phase-change heat sink for artificial intelligence according to another embodiment of the present invention;

[0033] Figure 3 This is a partial structural diagram of a phase-change heat sink for artificial intelligence according to an embodiment of the present invention.

[0034] Figure label:

[0035] 100, Substrate; 200, Phase change pipeline; 210, First pipeline; 220, Second pipeline; 300, Microchannel heat sink; 310, First manifold; 320, Second manifold; 330, Flat tube; 400, Housing; 410, First opening; 420, Second opening; 500, Connecting plate; 610, Box body; 620, Extrusion device; 630, Second adapter pipe; 640, Airbag; 650, First adapter pipe. Detailed Implementation

[0036] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0038] The following describes a phase-change heat sink for artificial intelligence according to an embodiment of the present invention.

[0039] like Figures 1 to 3 As shown, an embodiment of the present invention provides a phase change heat sink for artificial intelligence, the phase change heat sink including a substrate 100, a phase change pipeline 200 and a condenser.

[0040] The substrate 100 is vertically oriented and contains a phase-change chamber. The substrate 100 can accommodate a phase-change medium that can transform between a gaseous and liquid state. The sides of the substrate 100 are used to mount an artificial intelligence chip. Specifically, the substrate 100 is the basic supporting component of the phase-change heat sink. The substrate 100 can be made of a metal material with good thermal conductivity, such as copper, aluminum, aluminum alloy, or copper alloy. The substrate 100 has a plate-like structure. The vertical orientation of the substrate 100 means that its surface is approximately perpendicular to the horizontal plane. The thickness of the substrate 100 extends horizontally, its height extends vertically, and its width extends horizontally. The phase-change chamber within the substrate 100 allows the phase-change medium to transform between a gaseous and liquid state; that is, the phase-change medium exhibits the physical property of evaporating from a liquid to a gaseous state after absorbing heat and condensing from a gaseous state to a liquid state after releasing heat. The sides of the substrate 100 are used to mount artificial intelligence chips. The artificial intelligence chips are attached to one or both sides of the substrate 100 in the thickness direction. A thermal interface material (such as thermal grease, thermal pads, etc.) can be coated between the artificial intelligence chips and the sides of the substrate 100 to reduce contact thermal resistance.

[0041] The first end (bottom end) of the phase change pipeline 200 is connected to the top end of the substrate 100 and communicates with the phase change chamber. The phase change pipeline 200 is a channel structure used to connect the phase change chamber of the substrate 100 and the condenser. The phase change pipeline 200 can be a tubular structure such as a round tube, square tube, or irregularly shaped tube. The bottom end of the phase change pipeline 200 is connected to the top end of the substrate 100, and the internal channel of the phase change pipeline 200 is connected to the phase change chamber of the substrate 100, so that the gaseous phase change medium generated in the phase change chamber can enter the phase change pipeline 200, and at the same time, the liquid phase change medium formed by condensation in the condenser can flow back to the phase change chamber through the phase change pipeline 200.

[0042] A condenser is positioned above the substrate 100, and a condensation chamber is formed inside the condenser. The condenser is connected to the second end of the phase change pipeline 200 and communicates with the condensation chamber. Specifically, the condenser is positioned higher than the phase change chamber of the substrate 100. The condenser can be an air-cooled condenser or a water-cooled condenser. An air-cooled condenser removes heat from the gaseous phase change medium through air convection, while a water-cooled condenser removes heat through cooling water. The condensation chamber is the space where the gaseous phase change medium is cooled and condensed after entering the condenser. The condenser is connected to the second end (or top end) of the phase change pipeline 200, and the internal channel of the phase change pipeline 200 communicates with the condensation chamber of the condenser. This allows the gaseous phase change medium to enter the condensation chamber from the phase change chamber via the phase change pipeline 200, and also allows the condensed liquid phase change medium to flow back from the condensation chamber to the phase change chamber via the phase change pipeline 200.

[0043] After absorbing heat from the AI ​​chip within the phase change chamber of the substrate 100, the phase change medium evaporates from a liquid state to a gaseous state. The gaseous phase change medium's temperature rises and its density decreases, rising through the phase change pipe 200 under buoyancy to the condenser chamber located above the substrate 100. In the condenser chamber, the gaseous phase change medium exchanges heat with the condenser, releasing heat to the external environment or cooling medium, and condenses back into a liquid state as its temperature decreases. The liquid phase change medium then flows back into the phase change chamber of the substrate 100 along the phase change pipe 200 under its own gravity, thus completing the phase change cycle cooling process. By vertically positioning the substrate 100 and placing the condenser above it, both the upward direction of the gaseous phase change medium and the return direction of the liquid phase change medium are vertical. This fully utilizes the buoyancy of the gaseous phase change medium and the gravity of the liquid phase change medium to drive its circulation, eliminating the need for additional pumping devices and achieving unpowered natural circulation cooling. Meanwhile, phase change media can absorb and transfer a large amount of latent heat during the phase change process, and the heat dissipation efficiency is much higher than that of traditional single-phase heat dissipation methods, which can effectively solve the heat dissipation problem of high power density artificial intelligence chips.

[0044] In some embodiments of the present invention, such as Figure 1 As shown, the condenser is a microchannel radiator 300. The microchannel radiator 300 includes a first manifold 310, multiple flat tubes 330, and a second manifold 320. The two ends of the flat tubes 330 are connected to the first manifold 310 and the second manifold 320, respectively. Multiple phase change pipelines 200 are included, spaced apart. Some of the phase change pipelines 200 are connected to the first manifold 310, and some are connected to the second manifold 320.

[0045] Specifically, the condenser adopts the form of a microchannel radiator 300, which is a high-efficiency and compact heat exchanger. Both the first manifold 310 and the second manifold 320 are hollow tubular structures, and both can be round or square tubes. Multiple flat tubes 330 are arranged at intervals along the length of the first manifold 310 and the second manifold 320. Each flat tube 330 has a flat tubular structure, and its interior forms multiple microchannels extending along its length. These microchannels are also arranged at intervals along the width of the flat tube 330. The two ends of each flat tube 330 are connected to the inner cavities of the first manifold 310 and the second manifold 320, respectively. Specifically, the first end of each flat tube 330 is connected to the first manifold 310 and communicates with its inner cavity, while the second end of each flat tube 330 is connected to the second manifold 320 and communicates with its inner cavity. The phase change pipelines 200 include multiple phase change pipelines 200, which are spaced apart in the width or length direction of the substrate 100. A portion of the phase change pipelines 200 are connected to the first manifold 310, meaning the upper end of one portion of the phase change pipelines 200 is connected to the first manifold 310 and communicates with its inner cavity. A portion of the phase change pipelines 200 are connected to the second manifold 320, meaning the upper end of another portion of the phase change pipelines 200 is connected to the second manifold 320 and communicates with its inner cavity. Both the phase change pipelines 200 connected to the first manifold 310 and the phase change pipelines 200 connected to the second manifold 320 are connected to the phase change chamber of the substrate 100 at their bottom.

[0046] Optionally, the first manifold 310 can serve as an inlet manifold for collecting gaseous phase change medium from the phase change pipeline 200 and distributing it to each flat pipe 330; the second manifold 320 can serve as an outlet manifold for collecting liquid phase change medium condensed within each flat pipe 330 and converging it for output to the phase change pipeline 200. Alternatively, the configuration can be reversed, with the second manifold 320 serving as the inlet manifold and the first manifold 310 serving as the outlet manifold.

[0047] By configuring the condenser as a microchannel radiator 300, the multiple microchannels formed within the flat tube 330 divide the gaseous phase change medium into multiple fine airflows as it flows through the flat tube 330. This significantly increases the contact area between the gaseous phase change medium and the wall of the flat tube 330, resulting in a substantial improvement in the heat transfer coefficient. Simultaneously, the microchannel radiator 300 is small in size and lightweight, contributing to the overall miniaturization and weight reduction of the phase change radiator. By setting multiple phase change pipes 200 connected to the first manifold 310 and the second manifold 320 respectively, inlet and outlet channels can be formed, achieving the separation of the gaseous and liquid phase change media. This avoids mutual interference between the gas and liquid phase flows and improves the efficiency and stability of the phase change cycle.

[0048] Furthermore, the first manifold 310 and the second manifold 320 are arranged laterally and vertically spaced apart, and the flat tube 330 is arranged at an angle.

[0049] Specifically, the lateral direction refers to the width or horizontal direction of the substrate 100, and the vertical direction refers to the height or vertical direction of the substrate 100. The first current collector 310 and the second current collector 320 are spaced apart from each other in the lateral direction and also spaced apart from each other in the vertical direction. That is to say, the first current collector 310 and the second current collector 320 are not located at the same horizontal height or on the same vertical line, but are offset in both the lateral and vertical directions. For example, the first current collector 310 can be located at the upper left position, and the second current collector 320 can be located at the lower right position; or the first current collector 310 can be located at the upper right position, and the second current collector 320 can be located at the lower left position. Since the first current collector 310 and the second current collector 320 are spaced apart in both the lateral and vertical directions, the two ends of the flat tube 330 are connected to the first current collector 310 and the second current collector 320 respectively. The flat tube 330 is arranged at an angle relative to the horizontal plane, that is, one end of the flat tube 330 is higher than the other end.

[0050] By offsetting the first manifold 310 and the second manifold 320 laterally and vertically, the flat tube 330 is tilted. In this way, the manifold at the higher position serves as the inlet manifold, and the manifold at the lower position serves as the outlet manifold. The gaseous phase change medium enters the flat tube 330 from the higher manifold and is cooled and condensed into a liquid state during its flow within the flat tube 330. Under its own gravity, the liquid phase change medium flows along the tilted flat tube 330 towards the lower manifold. This achieves natural separation and directional flow of the gaseous and liquid phase change media within the flat tube 330, preventing the accumulation of liquid phase change media within the flat tube 330 and thus avoiding obstruction of the gaseous phase change medium's flow. This improves the heat exchange efficiency and condensation effect of the condenser.

[0051] In some embodiments of the present invention, such as Figure 1 As shown, the condenser includes multiple microchannel radiators 300 (e.g. Figure 1 The two microchannel heat sinks 300 are stacked in the middle. Multiple microchannel heat sinks 300 are vertically stacked. The two first manifolds 310 of adjacent microchannel heat sinks 300 are connected, and the two second manifolds 320 of adjacent microchannel heat sinks 300 are connected.

[0052] Specifically, the condenser is not composed of a single microchannel radiator 300, but rather of multiple microchannel radiators 300. These multiple microchannel radiators 300 are stacked vertically, one after another. Each microchannel radiator 300 includes its own first manifold 310, multiple flat tubes 330, and second manifold 320. In two adjacent microchannel radiators 300, the first manifold 310 of the upper microchannel radiator 300 is connected to the first manifold 310 of the lower microchannel radiator 300 via connecting pipes or direct welding; simultaneously, the second manifold 320 of the upper microchannel radiator 300 is also connected to the second manifold 320 of the lower microchannel radiator 300. Thus, the first manifolds 310 of all microchannel radiators 300 are interconnected to form a unified first manifold channel, and the second manifolds 320 of all microchannel radiators 300 are interconnected to form a unified second manifold channel.

[0053] By employing multiple vertically stacked microchannel heat sinks 300, the overall heat dissipation area and capacity of the condenser can be significantly increased. Each microchannel heat sink 300 can independently condense the gaseous phase change medium. Multiple microchannel heat sinks 300 operating in parallel significantly enhance the total heat exchange, meeting the heat dissipation requirements of higher-power AI chips. Simultaneously, the vertical stacking of multiple microchannel heat sinks 300 does not increase the space occupied on the horizontal plane, facilitating the expansion of heat dissipation capacity within a limited space. The interconnected design between the manifolds of adjacent microchannel heat sinks 300 allows for the even distribution of the gaseous phase change medium to each microchannel heat sink 300, and the smooth collection and return of the liquid phase change medium from each microchannel heat sink 300, ensuring the operational balance of each layer of microchannel heat sinks 300.

[0054] In some embodiments of the present invention, the first manifold 310 is higher than the second manifold 320. The phase change radiator also includes an axial flow fan, which is disposed inside the first manifold 310 and along the length of the first manifold 310. The axial flow fan enables the gaseous phase change medium to flow toward the second manifold 320.

[0055] Specifically, the first manifold 310 is positioned higher vertically than the second manifold 320. The first manifold 310 serves as the inlet manifold for collecting gaseous phase change media, while the second manifold 320 serves as the outlet manifold for collecting liquid phase change media. An axial flow fan is installed inside the first manifold 310 and extends along its length. An axial flow fan is a type of fan that generates axial thrust through blade rotation; the axial direction of the axial flow fan is approximately parallel to the length of the first manifold 310. When the axial flow fan is operating, its rotating blades generate airflow thrust along the length of the first manifold 310, driving the gaseous phase change media within the first manifold 310 to flow along it and further through the flat tube 330 towards the second manifold 320.

[0056] By installing an axial flow fan inside the first manifold 310, which serves as the air inlet manifold, the flow of the gaseous phase change medium within the condenser can be actively driven. This increases the flow velocity of the gaseous phase change medium through the flat tubes 330, improving the convective heat transfer coefficient of the condenser and thus enhancing its heat dissipation capacity. The axial flow fan, positioned along the length of the first manifold 310, can uniformly push the airflow along its entire length, resulting in a more even airflow distribution within each flat tube 330 and preventing localized airflow stagnation or uneven flow. Furthermore, the axial flow fan's placement within the first manifold 310 does not occupy additional external space, facilitating a compact design for the phase change radiator.

[0057] In some embodiments of the present invention, such as Figure 1 As shown, the first manifold 310 is higher than the second manifold 320. The phase change pipeline 200 includes multiple first pipelines 210 and multiple second pipelines 220.

[0058] The first end of the first conduit 210 is connected to the first manifold 310, and the second end of the first conduit 210 is connected to the middle transverse region of the phase change chamber. Specifically, the upper end of the first conduit 210 is connected to the first manifold 310 and communicates with the inner cavity of the first manifold 310, and the lower end of the first conduit 210 is connected to the middle transverse region of the phase change chamber of the substrate 100. The first conduit 210 is mainly used to transport the gaseous phase change medium generated in the middle region of the phase change chamber to the higher-positioned first manifold 310.

[0059] The first end of the second conduit 220 is connected to the second manifold 320, and the second end of the second conduit 220 is connected to the lateral edge region of the phase change chamber. Specifically, the upper end of the second conduit 220 is connected to the second manifold 320 and communicates with the inner cavity of the second manifold 320, and the lower end of the second conduit 220 is connected to the lateral side region of the phase change chamber of the substrate 100. The second conduit 220 is mainly used to transport the condensed liquid phase change medium from the lower-positioned second manifold 320 back to the edge region of the phase change chamber.

[0060] By setting up the first conduit 210 and the second conduit 220, and ensuring that the first manifold 310 is higher than the second manifold 320, a natural circulation path can be formed where the gaseous phase change medium rises from the center of the phase change chamber and the liquid phase change medium flows back from the edge of the phase change chamber. The central region of the phase change chamber is typically directly opposite the center of the AI ​​chip, where heat is most concentrated. Placing the outlet of the gaseous phase change medium in the central region facilitates priority heat dissipation from the area with the highest heat concentration, improving the targetedness and effectiveness of heat dissipation. After the liquid phase change medium flows back to the edge region of the phase change chamber, it spreads towards the central region within the chamber, absorbs heat from the chip, and then evaporates again, forming a "central rise - edge return" circulation flow pattern. This avoids localized drying or liquid accumulation within the phase change chamber, improving the uniformity and overall efficiency of heat dissipation.

[0061] In some embodiments of the present invention, such as Figure 1 and Figure 3 The phase change heat sink also includes a flow booster. The flow booster is disposed between the substrate 100 and a portion of the first conduit 210, which connects to the phase change chamber. The flow booster includes a first adapter 650, an airbag 640, and a second adapter 630.

[0062] The bottom end of the first adapter tube 650 is connected to the substrate 100, and the top end of the first adapter tube 650 is provided with a first rotating plate and a first abutting member. The first rotating plate can only rotate upward from a first reference position, and the first abutting member can abut against the edge area of ​​the first rotating plate at the first reference position. Specifically, the first adapter tube 650 is a hollow tubular structure. The bottom end of the first adapter tube 650 is connected to the top of the substrate 100 and communicates with the phase change chamber. The top end of the first adapter tube 650 is provided with a first rotating plate and a first abutting member. The first rotating plate can be a thin sheet structure, and the first rotating plate is rotatably mounted on the inner wall of the first adapter tube 650 via a hinge shaft or pivot. The first reference position refers to the initial position of the first rotating plate in an unloaded or natural state. When the first rotating plate is in the first reference position, the first rotating plate is arranged approximately horizontally or slightly inclined, which can block most of the channel cross-section of the first adapter tube 650. The first rotating piece can only rotate upwards from the first reference position, meaning it can only rotate upwards towards the first connecting tube 650 (i.e., towards the airbag 640), and cannot rotate downwards towards the first connecting tube 650 (i.e., towards the substrate 100). A first abutment is disposed on the inner wall of the first connecting tube 650, located below or to the side of the edge region of the first rotating piece. When the first rotating piece is in the first reference position, the first abutment abuts against the bottom surface of the edge region of the first rotating piece, preventing it from rotating downwards further, thus providing a limiting effect.

[0063] The bottom end of the airbag 640 is connected to the top end of the first adapter tube 650, and the airbag 640 is capable of compression deformation. Specifically, the airbag 640 is a deformable sac-like structure made of a flexible material (such as rubber, silicone, or polymer membrane), and the interior of the airbag 640 forms a space to contain gas. The bottom end of the airbag 640 is sealed to the top end of the first adapter tube 650, allowing gas in the first adapter tube 650 to enter the airbag 640 and gas in the airbag 640 to flow back to the first adapter tube 650. The airbag 640 is elastic and can undergo compression deformation when subjected to external pressure, shrinking in volume and increasing internal air pressure; after the external pressure is removed, the airbag 640 can return to its original shape due to its elasticity, increasing in volume and decreasing internal air pressure.

[0064] The bottom end of the second adapter tube 630 is connected to the top end of the airbag 640. The bottom end of the second adapter tube 630 is provided with a second rotating plate and a second abutting member. The second rotating plate can only rotate upwards from the second reference position, and the second abutting member can abut against the edge area of ​​the second rotating plate at the second reference position. Specifically, the second adapter tube 630 is a hollow tubular structure. The bottom end of the second adapter tube 630 is sealed to the top end of the airbag 640, and the top end of the second adapter tube 630 is connected to the first pipe 210. The bottom end of the second adapter tube 630 contains the second rotating plate and the second abutting member. The second rotating plate has a similar structure and function to the first rotating plate and is rotatably mounted on the inner wall of the second adapter tube 630. The second reference position is the initial position of the second rotating plate in an unloaded or natural state, and the second rotating plate is approximately horizontally positioned in the second reference position. The second rotating plate can only rotate upwards from the second reference position, that is, the second rotating plate can only rotate upwards towards the top of the second adapter tube 630 (i.e., towards the first pipe 210), and cannot rotate downwards. The second abutment is disposed on the inner wall of the second adapter tube 630. The second abutment is located below or to the side below the edge area of ​​the second rotating plate. When the second rotating plate is in the second reference position, the second abutment abuts against the edge area of ​​the second rotating plate to prevent the second rotating plate from rotating downward.

[0065] The working principle of the flow booster device is as follows: When the airbag 640 is compressed, the internal air pressure of the airbag 640 increases. The gas inside the airbag 640 pushes the second rotating plate to rotate upward and open. The gas enters the first pipeline 210 from the airbag 640 through the second adapter 630. At the same time, the first rotating plate remains closed under the limiting action of the first abutment member, preventing the gas from flowing back into the phase change chamber of the substrate 100. When the compression force of the airbag 640 is released, the airbag 640 returns to its original shape due to elasticity. The internal air pressure of the airbag 640 decreases, generating a suction effect. The first rotating plate is sucked upward and open. The gaseous phase change medium generated in the phase change chamber is sucked into the airbag 640 through the first adapter 650. At the same time, the second rotating plate remains closed under the limiting action of the second abutment member, preventing the gas from flowing back from the first pipeline 210 to the airbag 640. This cycle repeats, and the repeated compression and expansion of the airbag 640 achieves the pumping and flow boosting effect of the gaseous phase change medium.

[0066] By incorporating a flow booster, the flow rate and velocity of the gaseous phase change medium transported from the phase change chamber to the condenser can be effectively increased. Especially when the natural circulation driving force is insufficient or the chip's heat generation surges, the flow booster can provide additional transport power, ensuring that the gaseous phase change medium can be discharged from the phase change chamber in a timely manner. This prevents excessively high gas pressure or heat accumulation within the phase change chamber, improving the response speed and heat dissipation capacity of the phase change radiator under transient high heat flux density conditions. The unidirectional opening design of the first and second rotating plates ensures the consistency of gas flow direction, prevents gas backflow, and improves pumping efficiency.

[0067] Moreover, the structure of the airbag 640 is relatively simple, with good sealing performance, and it is easy to maintain.

[0068] Furthermore, such as Figure 3 As shown, the phase change radiator also includes a housing 610 and a pressing device 620.

[0069] The housing 610 houses the flow booster device, and the side wall of the housing 610 abuts against the airbag 640. Specifically, the housing 610 has a box-shaped or shell-shaped structure, and an internal space is formed within the housing 610. The flow booster device is entirely housed within the internal space of the housing 610, meaning the housing 610 encloses the flow booster device within it. The side wall (inner wall surface) of the housing 610 abuts against the outer surface of the airbag 640, allowing the outer surface of the airbag 640 to contact the side wall of the housing 610 when it inflates.

[0070] A compression device 620 is disposed inside the housing 610 and has a telescopic arm. When the telescopic arm extends, it pushes the airbag 640 to compress the side wall of the housing 610, thereby generating compression deformation. Specifically, the compression device 620 can be a device capable of linear reciprocating motion, such as an electric push rod, a cylinder, a hydraulic cylinder, or an electromagnetic actuator. The compression device 620 is fixedly installed inside the housing 610, and the telescopic arm of the compression device 620 extends outward from the main body of the compression device 620. The extended end of the telescopic arm is positioned opposite to or in contact with the outer surface of the airbag 640. When the telescopic arm extends, it pushes the outer surface of the airbag 640, causing the airbag 640 to move towards the side wall of the housing 610. The airbag 640 is compressed between the telescopic arm and the side wall of the housing 610, thereby generating compression deformation. When the telescopic arm retracts, the compressive force on the airbag 640 is eliminated, and the airbag 640 returns to its original shape due to its own elasticity.

[0071] By configuring the housing 610 and the compression device 620, the airbag 640 of the flow booster can be automatically and periodically compressed, thereby driving the flow booster to work continuously. The housing 610 not only provides installation and housing space for the flow booster and compression device 620, but also protects them from external dust and debris. When the telescopic arm of the compression device 620 extends, it pushes the airbag 640 to compress the side wall of the housing 610. This compression method utilizes the side wall of the housing 610 as a reaction force support, eliminating the need for an additional support structure on the other side of the airbag 640, thus simplifying the structural design. By controlling the extension frequency and stroke of the compression device 620, the compression frequency and compression amount of the airbag 640 can be adjusted, thereby regulating the pumping flow rate of the gaseous phase change medium and achieving on-demand adjustment of heat dissipation capacity.

[0072] In some embodiments of the present invention, such as Figure 2As shown, the phase change radiator also includes a housing 400. The housing 400 covers the condenser, and a first opening 410 is formed at one lateral end of the housing 400, and a second opening 420 is formed at the top of the housing 400.

[0073] Specifically, the housing 400 has a dome-shaped or box-shaped structure, and its interior forms an accommodating space. The housing 400 covers the exterior of the condenser, meaning the condenser is housed within the internal space of the housing 400. The housing 400 protects the condenser, preventing external dust and debris from entering the microchannel structure of the condenser, and also helps guide the flow direction of the cooling airflow. A first opening 410 is formed at one lateral end of the housing 400 (e.g., the left or right end), penetrating the side wall of the housing 400, allowing the internal space of the housing 400 to communicate with the external environment. A second opening 420 is formed at the top of the housing 400, penetrating the top wall of the housing 400, also allowing the internal space of the housing 400 to communicate with the external environment.

[0074] Optionally, the first opening 410 serves as the air inlet for cooling air, and the second opening 420 serves as the air outlet for cooling air. Cool air from the outside environment enters the housing 400 through the first opening 410, flows over the surfaces of the flat tubes 330 of the condenser, carrying away the heat released by the gaseous phase change medium within the flat tubes 330, and then exits through the second opening 420 at the top of the housing 400. Alternatively, the functions of the first opening 410 and the second opening 420 can be interchanged, i.e., the second opening 420 serves as the air inlet, and the first opening 410 serves as the air outlet; all of these should be understood within the scope of this invention.

[0075] By setting up a housing 400 and enclosing the condenser within it, a flow channel can be formed, allowing cooling air to flow orderly through all parts of the condenser and improving the utilization efficiency of the cooling air. Simultaneously, the housing 400 provides physical protection for the condenser, preventing damage from impacts during transportation, installation, and use. The placement of the first opening 410 and the second opening 420 ensures that the cooling air forms a flow path within the housing 400 that is first horizontal and then vertical, allowing it to fully flow over the surfaces of each flat tube 330 of the condenser, achieving uniform and effective air-cooled heat dissipation.

[0076] Optionally, such as Figure 2 As shown, a connecting plate 500 is provided between the housing 400 and the base plate 100 to increase the stability of the overall structure.

[0077] Furthermore, the phase change heatsink also includes a fan located above the housing 400 and facing the second opening 420.

[0078] Specifically, the fan is positioned on the outer or inner side of the top of the housing 400, directly opposite the second opening 420 of the housing 400. The fan can be an axial fan, centrifugal fan, or crossflow fan. The fan blades face the second opening 420, and the airflow direction generated during operation is aligned with the axis of the second opening 420. The fan generates forced airflow, drawing hot air heated by the condenser inside the housing 400 out through the second opening 420, while simultaneously forcing cool outside air into the housing 400 through the first opening 410, creating forced convection cooling. Alternatively, the fan can be installed in reverse, blowing cool outside air into the housing 400 through the second opening 420, allowing the cool air to flow through the condenser and then exit through the first opening 410.

[0079] By incorporating a fan above the housing 400 to generate suction or blowing force, the airflow velocity within the housing 400 is significantly enhanced, increasing the convective heat transfer coefficient of the condenser and further improving the heat dissipation capacity of the phase change heat sink. When the AI ​​chip is under high load and generating significant heat, the fan operates at high speed to provide forced air cooling, ensuring the chip temperature remains within a safe range. When the chip is under low load, the fan can operate at low speed or stop, relying on natural convection for heat dissipation, reducing energy consumption and noise. The combined use of the fan and housing 400 allows for flexible switching between natural and forced cooling, balancing heat dissipation performance and energy consumption control.

[0080] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A phase-change heat sink for artificial intelligence, characterized in that, The phase change heat sink includes: A substrate, which is vertically arranged and has a phase change chamber formed inside it, is capable of accommodating a phase change medium that can transform between a gaseous and a liquid state, and the side of the substrate is used to mount an artificial intelligence chip. A phase change pipeline, wherein the first end of the phase change pipeline is connected to the top end of the substrate and communicates with the phase change chamber; A condenser is disposed above the substrate, and a condensation chamber is formed inside the condenser. The condenser is connected to the second end of the phase change pipeline and communicates with the condensation chamber.

2. The phase change heat sink for artificial intelligence according to claim 1, characterized in that, The condenser is a microchannel radiator, which includes a first manifold, multiple flat tubes, and a second manifold. The two ends of the flat tubes are respectively connected to the first manifold and the second manifold. The phase change pipeline includes multiple phase change pipelines, which are spaced apart. Some of the phase change pipelines are connected to the first manifold, and some of the phase change pipelines are connected to the second manifold.

3. The phase change heat sink for artificial intelligence according to claim 2, characterized in that, The first manifold and the second manifold are spaced apart laterally and vertically, and the flat tube is inclined.

4. The phase change heat sink for artificial intelligence according to claim 3, characterized in that, The condenser includes multiple microchannel heat sinks, which are vertically stacked together. The two first manifolds of adjacent microchannel heat sinks are connected, and the two second manifolds of adjacent microchannel heat sinks are connected.

5. The phase change heat sink for artificial intelligence according to claim 3, characterized in that, The first manifold is higher than the second manifold, and the phase change heat sink further includes: An axial flow fan is installed inside the first manifold and along the length of the first manifold. The axial flow fan enables the gaseous phase change medium to flow towards the second manifold.

6. The phase change heat sink for artificial intelligence according to claim 3, characterized in that, The first manifold is higher than the second manifold, and the phase change pipeline includes: Multiple first pipelines, the first end of the first pipeline is connected to the first manifold, and the second end of the first pipeline is connected to the transverse middle region of the phase change chamber; Multiple second pipes, the first end of which is connected to the second manifold, and the second end of which is connected to the lateral edge region of the phase change chamber.

7. The phase change heat sink for artificial intelligence according to claim 6, characterized in that, The phase change heat sink further includes a flow boosting device disposed between the substrate and a portion of the first pipeline, the first pipeline being connected to the phase change chamber via the flow boosting device, the flow boosting device comprising: The first adapter tube has its bottom end connected to the substrate, and its top end is provided with a first rotating plate and a first abutting member. The first rotating plate can only rotate upward from the first reference position, and the first abutting member can abut against the edge area of ​​the first rotating plate at the first reference position. An airbag, the bottom end of which is connected to the top end of the first adapter tube, is capable of compressing and deforming. The second adapter tube has its bottom end connected to the top end of the airbag. The bottom end of the second adapter tube is provided with a second rotating plate and a second abutting member. The second rotating plate can only rotate upward from the second reference position, and the second abutting member can abut against the edge area of ​​the second rotating plate at the second reference position.

8. The phase change heat sink for artificial intelligence according to claim 7, characterized in that, The phase change heat sink also includes: A housing that contains the flow booster and whose sidewalls abut against the airbag; A compression device is disposed inside the box and has a telescopic arm. When the telescopic arm is extended, it can push the airbag to compress the side wall of the box and generate compression deformation.

9. The phase change heat sink for artificial intelligence according to claim 1, characterized in that, The phase change heat sink also includes: A housing that covers the condenser, wherein a first opening is formed at one lateral end of the housing and a second opening is formed at its top.

10. The phase-change heat sink for artificial intelligence according to claim 9, characterized in that, The phase change heat sink also includes: A fan is located above the housing and faces the second opening.

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