Optical connector assembly
By designing a detachable optical amplifier device connection method, the problems of low chip yield and poor transmission quality caused by optical signal amplifier and integrated circuit packaging are solved, achieving efficient optical signal transmission and quality assurance.
Patent Information
- Application Number
- CN202610223220.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2026-01-23
- Filing Date
- 2026-02-25
- Publication Date
- 2026-08-25
AI Technical Summary
In existing technologies, optical signal amplifiers are packaged together with integrated circuits such as switches and processors, resulting in low overall chip yield and poor transmission quality.
Design an optical connector assembly, in which an optical amplifier device is detachably connected to an optoelectronic integrated circuit via the optical connector assembly, instead of being directly mounted near the light-emitting device. Optical signal transmission is achieved using first and second transmission components, and the signal is amplified by the optical amplifier device.
It improved the yield of processor chips, enhanced the transmission quality between multiple processor units, reduced the difficulty of assembling optical amplifiers and optoelectronic devices, and ensured reliable signal transmission quality.
Smart Images
Figure CN122632403A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of optical connector technology, and more particularly to an optical connector assembly. Background Technology
[0002] Photonic integrated circuits (PICs) utilize photons instead of electrons for computation and data transmission within integrated circuits, bringing significant benefits to industries requiring high-performance data exchange, long-distance interconnection, 5G infrastructure, and computing devices, and are widely used in data centers. Data center equipment (such as switches or servers) typically includes multiple processor units. These processor units can be interconnected via optical fibers to achieve optical signal transmission. However, significant signal attenuation occurs with increasing transmission distance. Optical signal amplifiers are typically placed near light sources (such as lasers) to amplify the signal and improve transmission quality. However, current optical signal amplifiers are packaged together with integrated circuits such as switches and processors, resulting in extremely low overall chip yield. Therefore, improving processor chip yield and enhancing transmission quality between multiple processor units are urgent issues that need to be addressed. Summary of the Invention
[0003] The purpose of this application is to provide an optical connector assembly that enables optical signal transmission between data processing devices, ensures reliable signal transmission quality, and improves the yield of processor chips.
[0004] To achieve the above objectives, this application provides an optical connector assembly for optical transmission between an optoelectronic integrated circuit and an application device, and includes a first transmission component, a second transmission component, and an optical amplifier device. The first transmission component includes a first optical cable unit, a first connection module disposed at one end of the first optical cable unit for connection to the optoelectronic integrated circuit, and a second connection module disposed at the other end of the first optical cable unit. The second transmission component includes a second optical cable unit, a third connection module disposed at one end of the second optical cable unit near the second connection module, and a cable end connector disposed at the other end of the second optical cable unit for connection to the application device. The optical amplifier device includes a first end portion disposed on the side of the second connection module and optically aligned with the first optical cable unit, and a second end portion disposed on the side of the third connection module and optically aligned with the second optical cable unit.
[0005] Optionally, the second connection module includes a detachably connected intermediate connector and an intermediate connection base, and the intermediate connection base is configured to support the optical amplifier device. Specifically, a first end of the optical amplifier device is disposed on the intermediate connection base and includes a first coupling surface exposed and located near the intermediate connector.
[0006] Optionally, the second end of the optical amplifier device includes a second coupling surface, and the third connection module of the second transmission component is disposed near the intermediate connection base and connected to the second coupling surface of the optical amplifier device.
[0007] Optionally, the first connection module includes a first connector and a first connection base that are detachably connected. The first connector is disposed at the end of the first optical cable unit, and the first connection base is connected to the optoelectronic integrated circuit.
[0008] Optionally, the optoelectronic integrated circuit includes an optoelectronic substrate and a waveguide substrate extending from the edge of the optoelectronic substrate, the first connection base is configured to support the waveguide substrate, and the first optical cable unit is optically aligned with the waveguide substrate.
[0009] Optionally, the optoelectronic integrated circuit includes an optoelectronic substrate and a waveguide substrate disposed at the edge of the optoelectronic substrate, the first connection base is configured to support the waveguide substrate, and the first optical cable unit is optically aligned with the waveguide substrate.
[0010] Optionally, the third connection module includes a third connector and a third connection base that are detachably connected, and the third connection base is configured to support the optical amplifier device. Specifically, a second end of the optical amplifier device is disposed on the third connection base and includes a second coupling surface exposed to and adjacent to the third connector.
[0011] Optionally, the first connection module includes a first connector and a first connection base that are detachably connected. The first connector is disposed at the end of the first optical cable unit, and the first connection base is connected to the optoelectronic integrated circuit.
[0012] Optionally, the optoelectronic integrated circuit includes an optoelectronic substrate and a waveguide substrate extending from the edge of the optoelectronic substrate, the first connection base is configured to support the waveguide substrate, and the first optical cable unit is optically aligned with the waveguide substrate.
[0013] Optionally, the optoelectronic integrated circuit includes an optoelectronic substrate and a waveguide substrate extending from the edge of the optoelectronic substrate, the first connection base is configured to support the waveguide substrate, and the first optical cable unit is optically aligned with the waveguide substrate.
[0014] Optionally, the first end and the second end of the optical amplifier device respectively include a first coupling surface and a second coupling surface, the second connection module is connected to the first coupling surface, and the third connection module is connected to the second coupling surface.
[0015] Optionally, the first end and the second end of the optical amplifier device each include a first coupling surface and a second coupling surface, the second connection module is connected to the first coupling surface, and the third connection module includes a third connector and a third connection base that are detachably connected, and the third connection base is configured to support the optical amplifier device. Specifically, the second end of the optical amplifier device is disposed on the third connection base, and the second coupling surface is exposed to and adjacent to the third connector.
[0016] Optionally, the first optical cable unit and the second optical cable unit each include an upper alignment fiber component, a lower alignment fiber component, and multiple optical fibers disposed between the upper alignment fiber component and the lower alignment fiber component. Specifically, the optoelectronic integrated circuit includes an upper return channel and a lower return channel, and the optical amplifier device includes an upper channel component and a lower channel component. The upper alignment fiber component, the upper return channel, and the upper channel component together constitute an upper optical signal circuit, and the lower alignment fiber component, the lower return channel, and the lower channel component together constitute a lower optical signal circuit.
[0017] This application also provides an optical connector assembly for realizing optical connection between an optoelectronic integrated circuit and an application device, and includes an optical amplifier device and a second transmission component. The optical amplifier device includes a first end optically connected to the optoelectronic integrated circuit and a second end opposite to the first end. The second transmission component includes a second optical cable unit, a third connection module disposed at one end of the second optical cable unit and connected to the second end, such that the second optical cable unit is optically aligned with the optical amplifier device, and a cable end connector disposed at the other end of the second optical cable unit for connection to the application device.
[0018] Optionally, the first end and the second end of the optical amplifier device respectively include a first coupling surface and a second coupling surface, and the third connection module is connected to the second coupling surface.
[0019] Optionally, the third connection module includes a third connector and a third connection base that are detachably connected, and the third connection base is configured to support the optical amplifier device. Specifically, a second end of the optical amplifier device is disposed on the third connection base, and the second coupling surface is exposed and located near the third connector.
[0020] Optionally, the optoelectronic integrated circuit includes an upper return channel and a lower return channel, and the optical amplifier device includes an upper channel component and a lower channel component. The upper return channel and the upper channel component together constitute an upper optical signal circuit, and the lower return channel and the lower channel component together constitute a lower optical signal circuit.
[0021] In this application, the optical amplifier device (i.e., SOA) is detachably connected to the optoelectronic integrated circuit via the optical connector assembly, rather than being directly mounted near the light-emitting device (e.g., laser diode) on the optoelectronic integrated circuit. This prevents a significant degradation in the performance of the optoelectronic integrated circuit, improves the quality of optical signal transmission, reduces the difficulty of assembling the optical amplifier and optoelectronic device, and improves the overall yield of the optoelectronic integrated circuit. Attached Figure Description
[0022] To describe the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments are briefly introduced below. The drawings in the following description only show some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without creative effort.
[0023] Figure 1 This is a top view schematic diagram of an optical connector assembly according to the first embodiment of this application.
[0024] Figure 2 yes Figure 1 The enlarged schematic diagram shows the upper and lower signal loops of the optical connector assembly.
[0025] Figure 3 yes Figure 1 An exploded perspective view of the second connection module of the optical connector assembly shown.
[0026] Figure 4 yes Figure 3 The diagram shows a three-dimensional assembly of the second connecting module.
[0027] Figure 5 This is a top view schematic diagram of an optical connector assembly according to a second embodiment of this application.
[0028] Figure 6 This is a top view schematic diagram of an optical connector assembly according to a third embodiment of this application.
[0029] Figure 7 This is a top view schematic diagram of an optical connector assembly according to the fourth embodiment of this application.
[0030] Figure 8 This is a top view schematic diagram of an optical connector assembly according to the fifth embodiment of this application.
[0031] Figure 9 This is a top view schematic diagram of an optical connector assembly according to the sixth embodiment of this application.
[0032] Figure 10 is a top view of an optical connector assembly according to a seventh embodiment of this application.
[0033] Figure 11This is a top view schematic diagram of an optical connector assembly according to the eighth embodiment of this application.
[0034] Figure 12A This is a top view schematic diagram of an optical connector assembly according to the ninth embodiment of this application.
[0035] Figure 12B yes Figure 12A A partially enlarged 3D view of the optical connector assembly shown.
[0036] Figure 12C yes Figure 12A The enlarged schematic diagram shows the upper and lower signal loops of the optical connector assembly.
[0037] Figure 13A This is a top view schematic diagram of the application state of the optical connector assembly of the first embodiment.
[0038] Figure 13B This is a top view schematic diagram of the application state of the optical connector assembly of the second embodiment.
[0039] Figure 14A This is a top view schematic diagram of the application state of the optical connector assembly of the third embodiment.
[0040] Figure 14B This is a top view schematic diagram of the application state of the optical connector assembly of the fourth embodiment.
[0041] Figure 15A This is a top view schematic diagram of the application state of the optical connector assembly of the fifth embodiment.
[0042] Figure 15B This is a top view schematic diagram of the application state of the optical connector assembly of the sixth embodiment.
[0043] Figure 16A This is a top view schematic diagram of the application state of the optical connector assembly of the seventh embodiment.
[0044] Figure 16B This is a top view schematic diagram of the application state of the optical connector assembly of the eighth embodiment.
[0045] Figure 17 This is a top view schematic diagram of the application state of the optical connector assembly of the ninth embodiment. Detailed Implementation
[0046] The following embodiments will be used to illustrate specific embodiments of this application with reference to the accompanying drawings. The directional terms described in this application, such as up, down, front, back, left, right, inside, outside, and side, are merely directional terms used with reference to the accompanying drawings. Therefore, the directional terms used are intended to describe and understand this application, but this application is not limited thereto.
[0047] It should be understood that although the terms first, second, etc., may be used herein to describe various components, these components should not be limited by these terms. Unless otherwise stated, these terms are used only to distinguish one component from another. Thus, for example, a first component, first part, or first portion discussed below may be referred to as a second component, second part, or second portion without departing from the teachings of this application. Furthermore, reference numerals and / or letters may be repeated in various examples within this application. Such repetition is for simplicity and clarity and does not in itself determine the relationship between the various embodiments and / or configurations discussed.
[0048] This application provides an optical connector assembly suitable for connecting data processing devices equipped with optoelectronic integrated circuits (including photonic integrated circuits PIC, electronic integrated circuits EIC, or optoelectronic integrated circuits OEIC), such as switches or servers. Figure 1 The diagram shown is a top view of the optical connector assembly 100A in the first embodiment of this application. The optical connector assembly 100A is configured to enable optical transmission between the optoelectronic integrated circuit 7 and the application device 8, and includes a first transmission component 101, a second transmission component 102, and an optical amplifier device 2 connected between the first transmission component 101 and the second transmission component 102. Specifically, the first transmission component 101 includes a first connection module 1A, a second connection module 2A, and a first optical cable unit 4A. The first connection module 1A and the second connection module 2A are respectively disposed at both ends of the first optical cable unit 4A. In some embodiments, the structure of the first connection module 1A may involve connecting the first optical cable unit 4A to the optoelectronic integrated circuit 7 via a locking, snap-fit, or adhesive connection, but is not limited thereto.
[0049] like Figure 1 As shown, the second transmission component 102 includes a second optical cable unit 4B, a third connection module 3A disposed at one end of the second optical cable unit 4B near the second connection module 2A, and a cable end connector 6 disposed at the other end of the second optical cable unit 4B for connection with the application device 8. In some embodiments, the optoelectronic integrated circuit 7 is installed in a data processing device or a data sharing device (e.g., a switch), and includes at least an electronic integrated circuit (not shown) and a photonic integrated circuit (not shown) for electro-optical signal conversion and photoelectric signal conversion.
[0050] The first optical cable unit 4A includes an upper alignment fiber component 43, a lower alignment fiber component 45, and multiple optical fibers 41 disposed between the upper alignment fiber component 43 and the lower alignment fiber component 45. The optical fibers 41, the upper alignment fiber component 43, and the lower alignment fiber component 45 extend to the first connection module 1A. The structure of the second optical cable unit 4B is basically the same as that of the first optical cable unit 4A. Specifically, the second optical cable unit 4B includes an upper alignment fiber component 43, a lower alignment fiber component 45, and multiple optical fibers 41 disposed between the upper alignment fiber component 43 and the lower alignment fiber component 45. The structure of the second optical cable unit 4B is not described in detail herein.
[0051] like Figure 1 As shown, the second connection module 2A includes a detachably connected intermediate connector 3 and an intermediate connection base 5. Details of the intermediate connector 3 and the intermediate connection base 5 will be described later. In this embodiment, the intermediate connection base 5 is configured to support the optical amplifier device 2. Specifically, the optical amplifier device 2 includes a first end 21 disposed on one side of the second connection module 2A and a second end 22 disposed on one side of the third connection module 3A. The first end 21 is disposed on the intermediate connection base 5 and includes a first coupling surface 211 exposed to and adjacent to the intermediate connector 3. The second end 22 includes a second coupling surface 221, and the third connection module 3A of the second transmission assembly 102 is located near the intermediate connection base 5 and connected to the second coupling surface 221 of the optical amplifier device 2. In some embodiments, both the first connection module 1A and the third connection module 3A are implemented as fiber array units (FAUs), including ferrules (not shown) for receiving and securing the ends of optical fibers 41.
[0052] The optical amplifier device 2 is configured to amplify the incident light signal through stimulated emission. Preferably, the optical amplifier device 2 is a semiconductor optical amplifier (SOA). The optical amplifier device 2 employs an anti-reflective coating structure to prevent light from being reflected back, and amplifies the optical signal by applying a current to it, thereby achieving high-speed data transmission and reducing signal loss. It should be noted that the operating principle of the semiconductor optical amplifier device is known in the art, and therefore will not be described in detail herein.
[0053] Continue to refer to Figure 1The upper alignment fiber component 43 of the first optical cable unit 4A includes a first alignment fiber 431 and a second alignment fiber 432 spaced apart from the first alignment fiber 431. The lower alignment fiber component 45 of the first optical cable unit 4A includes a first alignment fiber 451 and a second alignment fiber 452 spaced apart from each other. In this embodiment, eight optical fibers 41 are disposed between the second alignment fibers 432 and 452. The optoelectronic integrated circuit 7 includes an upper return channel 701 and a lower return channel 702. Specifically, the upper return channel 701 starts at the edge of the optoelectronic integrated circuit 7 near the first connection module 1A, extends from the first connection module 1A, and then loops back to the same edge, such that the upper return channel 701 terminates at the edge of the optoelectronic integrated circuit 7, and the two ends of the upper return channel 701 are optically aligned with the first alignment fiber 431 and the second alignment fiber 432, respectively. The lower return channel 702 is symmetrically arranged with the upper return channel 701. Similarly, the lower return channel 702 terminates at the edge of the optoelectronic integrated circuit 7, and the two ends of the lower return channel 702 are optically aligned with the first alignment fiber 451 and the second alignment fiber 452, respectively.
[0054] refer to Figure 2 and cooperate Figure 1 , Figure 2 yes Figure 1 A partially enlarged schematic diagram. The optical amplifier device 2 includes an upper channel component 23 and a lower channel component 24, which are symmetrically arranged with respect to the middle of the optical amplifier device 2. Specifically, the upper alignment fiber component 43, the upper return channel 701, and the upper channel component 23 together constitute the upper optical signal loop, as shown below. Figure 2 As indicated by the arrow (dashed line) A1 in the diagram. Figure 2 As shown, an external light source (not shown) is connected to the EL1 position of the upper channel component 23 to provide the required test light through the upper light signal loop. Figure 2 As shown, the lower alignment fiber component 45, the lower return channel 702, and the lower channel component 24 together constitute the lower optical signal loop, as indicated by arrow (dashed line) B1 in the figure. Similarly, another external light source (not shown in the figure) is connected to the lower channel component 24 to provide the required test light for the lower optical signal loop. The upper and lower optical signal loops are configured to detect whether the optical signal can be transmitted between the optoelectronic integrated circuit 7 and the optical amplifier device 2 through the first alignment fibers 431 and 451 and the second alignment fibers 432 and 452, thereby ensuring the optical path optical alignment of fiber 41 with the optoelectronic integrated circuit 7 and the optical amplifier device 2. Similarly, the upper alignment fiber component 43 and the lower alignment fiber component 45 of the second optical cable unit 4B also form upper and lower optical signal loops in the same manner as described above.
[0055] like Figure 3 As shown, Figure 3 is Figure 1An exploded perspective view of the second connection module 2A of the optical connector assembly 100A shown, wherein the intermediate connector 3 is detachably connected to the intermediate connection base 5. Figure 3 As shown, the intermediate connector 3 includes a body 31, two supports 32, two positioning members 33, two limiting members 34, and a movable fastener 35. In one embodiment, the supports 32 extend upward from the upper surface of the body 31. Specifically, each support 32 includes a first step portion 321 and a second step portion 322 located above the first step portion 321. The positioning members 33 are spaced apart from each other and extend forward from the front surface of the body 31. In this embodiment, the positioning members 33 are pin-shaped. The end 410 of the optical fiber 41 is exposed on the front surface of the body 31.
[0056] like Figure 3 As shown, the movable fastener 35 is generally L-shaped and includes a cover portion 351 located above the main body 31, a connecting portion 353 movably connected to the main body 31, and a bent portion 352 connecting the cover portion 351 and the connecting portion 353. A fastening groove 350 is formed on the cover portion 351. The connecting portion 353 is detachably mounted on the limiting member 34 and can move from the end of the limiting member 34 to the rear side of the main body 31. In this embodiment, each limiting member 34 includes a limiting rod 341 and an elastic member 342. One end of the limiting rod 341 is connected to the back of the main body 31, and the elastic member 342 is disposed around the limiting rod 341. Preferably, the elastic member 342 is a compression spring and can deform longitudinally along the limiting rod 341 due to the pressure applied by the movable fastener 35.
[0057] like Figure 3 As shown, the cover portion 351 includes two wings 355, which are respectively disposed on opposite sides of the cover portion 351 and bend downward toward the main body 31. The wings 355 are supported by support members 32 and are not securely fastened to the intermediate connecting base 5. Specifically, the rear end of the wing portion 355 abuts against the second step portion 322, causing the cover portion 351 to be inclined relative to the main body 31, thereby expanding the space between the cover portion 351 and the main body 31 to facilitate the assembly between the intermediate connecting head 3 and the intermediate connecting base 5.
[0058] Continue to refer to Figure 3 The intermediate connecting base 5 includes a body 51 and a retainer 52. The retainer 52 is tongue-shaped and extends from the body 51. A positioning protrusion 521 is disposed on the retainer 52 and spaced apart from the body 51, thereby forming a retaining space 530 between the positioning protrusion 521 and the body 51. Preferably, a recess 510 is formed in the body 51, and the optical amplifier device 2 is located in the recess 510 of the body 51. A plurality of groove-shaped positioning portions 53 are formed in the body 51, and these positioning portions 53 correspond to the positioning members 33.
[0059] refer to Figure 4 and cooperate Figure 3 When assembling the intermediate connector 3 and the intermediate connecting base 5, the cover 351 is pushed forward to the intermediate connecting base 5, and the pin-shaped positioning member 33 is tightly inserted into the positioning part 53. Simultaneously, the cover 351 is guided by the positioning protrusion 521. As the cover 351 is continuously pushed forward to the holding space 530, the cover 351 is simultaneously pressed downward, causing the fastening groove 350 to engage with the positioning protrusion 521, thereby positioning the front part of the cover 351 in the holding space 530. When the positioning protrusion 521 engages with the fastening groove 350 in the cover 351, each wing 355 is held on the main body 31 in front of the first step 321, and the elastic member 342 applies a pushing force to the connecting part 353 to properly tighten the engagement between the cover 351 and the positioning protrusion 521. In this way, the intermediate connector 3 can be easily and securely connected to the intermediate connecting base 5.
[0060] refer to Figure 5 This is a top view schematic diagram of the optical connector assembly 100B according to the second embodiment of this application. The main difference from the first embodiment is that the second transmission component 102' of the optical connector assembly 100B includes a third connection module 3A', and the third connection module 3A' includes a third connector head 3' and a third connection base 5'. The other structures of the optical connector assembly 100B are the same as those of the optical connector assembly 100A. Therefore, detailed descriptions of these structures are omitted herein. Figure 5 As shown, the third connecting module 3A' and the second connecting module 2A are symmetrically arranged on opposite sides of the optical amplifier device 2. It should be noted that the third connector 3' and the third connecting base 5' are... Figure 1 The intermediate connector 3 and intermediate connector base 5 shown have the same structure. Therefore, a detailed description of them is omitted.
[0061] like Figure 5 As shown, the third connecting base 5' is configured to support the optical amplifier device 2. The second end 22 of the optical amplifier device 2 is disposed on the third connecting base 5' and includes a second coupling surface 221 exposed to and adjacent to the third connector 3'. Similar to the optical connector assembly 100A, the first transmission component 101' and the second transmission component 102' of the optical connector assembly 100B respectively form an upper optical signal loop and a lower optical signal loop; a detailed description of their formation process is omitted here. With the above structure, optical signal transmission between the optoelectronic integrated circuit 7 and the application device 8 is achieved through the first transmission component 101', the optical amplifier device 2, and the second transmission component 102'.
[0062] refer to Figure 6This is a top view schematic diagram of the optical connector assembly 200A according to the third embodiment of this application. The main difference from the first embodiment is that the first transmission component 201 of the optical connector assembly 200A includes a second connection module 2A' instead of the second connection module 2A, such that the first end 21 of the optical amplifier device 2 is connected to the second connection module 2A', and the second end 2 is connected to the third connection module 3A of the second transmission component 202. The other structures of the optical connector assembly 200A are the same as those of the optical connector assembly 100A. Therefore, detailed descriptions of these structures are omitted herein.
[0063] refer to Figure 7 This is a top view of the optical connector assembly 200B according to the fourth embodiment of this application. The main difference from the second embodiment shown in FIG. 5 is that the first transmission component 201' of the optical connector assembly 200B includes a second connection module 2A' instead of the second connection module 2A, such that the first end 21 of the optical amplifier device 2 is connected to the second connection module 2A', and the second end 22 is connected to the third connection base 5' of the third connection module 3A'. The other structures of the optical connector assembly 200B are the same as those of the optical connector assembly 100B. Therefore, detailed descriptions of these structures are omitted herein.
[0064] refer to Figure 8 This is a top view schematic diagram of the optical connector assembly 300A according to the fifth embodiment of this application, and... Figure 1 The main difference in the first embodiment shown is that the first transmission component 101 is omitted in the optical connector assembly 300A, while the second transmission component 302 is retained. For example... Figure 8 As shown, the third connection module 3A and the cable end connector 6 are located at opposite ends of the second optical cable unit 4B. The first end 21 of the optical amplifier device 2 of the optical connector assembly 300A is directly optically coupled to the optoelectronic integrated circuit 7, and the second end 22 is connected to the third connection module 3A of the second transmission component 302. The other structures of the optical connector assembly 300A are the same as those of the optical connector assembly 100A, therefore, detailed descriptions of these structures are omitted herein.
[0065] like Figure 8 As shown, since the first transmission component 101 is omitted in the optical connector assembly 300A, the optical signal path between the optical / electric integrated circuit 7 and the application device 8 is shortened, thereby improving the optical signal transmission efficiency.
[0066] refer to Figure 9 This is a top view schematic diagram of the optical connector assembly 300 according to the sixth embodiment of this application, and... Figure 5 The main difference in the second embodiment shown is that the first transmission component 101' is omitted from the optical connector assembly 300B, while the second transmission component 302' is retained. For example... Figure 9 As shown, the third connection module 3A' and the cable end connector 6 are located at opposite ends of the second optical cable unit 4B. The first end 21 of the optical amplifier device 2 of the optical connector assembly 300B is directly optically coupled to the optoelectronic integrated circuit 7, and the second end 22 is connected to the third connection base 5' of the third connection module 3A'. The other structures of the optical connector assembly 300B are the same as those of the optical connector assembly 100B, therefore, detailed descriptions of these structures are omitted herein. Similarly, since the first transmission component 101' is omitted in the optical connector assembly 300B, the optical signal path between the optoelectronic integrated circuit 7 and the application device 8 can be shortened, thereby improving the optical signal transmission efficiency.
[0067] refer to Figure 10 The figure shows an optical connector assembly 400A according to a seventh embodiment of this application, and... Figure 1 The main difference in the first embodiment shown is that the first transmission component 401 of the optical connector assembly 400A includes a first connection module 1A” instead of a first connection module 1A, and the optoelectronic integrated circuit 7 includes an optoelectronic substrate 71 and a waveguide substrate 73. Specifically, the first connection module 1A” includes a first connector 3” and a first connection base 5” detachably connected to the first connector 3”. The waveguide substrate 73 protrudes from one side of the optoelectronic substrate 71 and is not part of the optoelectronic substrate 71. Preferably, the waveguide substrate 73 is a silicon photonic integrated circuit configured to couple optical signals to the optical fiber 41. In this embodiment, the waveguide substrate 73 is supported in the first connection base 5. The other structures of the optical connector assembly 400A are the same as those of the optical connector assembly 100A, therefore detailed descriptions of these structures are omitted herein.
[0068] like Figure 10 As shown, it is important to note that the optical signal is optically coupled to the optoelectronic substrate 71 via the waveguide substrate 73, rather than being directly transmitted to the optoelectronic substrate 71. In other words, using the waveguide substrate 73 can reduce the inherent range limitations caused by the material properties of the optoelectronic substrate 71, thereby achieving a larger range of optical path numerical aperture when coupling the optical signal from the optical fiber 41 to the optoelectronic substrate 71.
[0069] refer to Figure 11 It is the optical connector assembly 400B according to the eighth embodiment of this application, and... Figure 10The main difference in the seventh embodiment shown is that the second transmission component 402' of the optical connector assembly 400B includes a third connection module 3A' instead of a third connection module 3A. Specifically, the first transmission component 401' of the optical connector assembly 400B includes a first connection module 1" and a second connection module 2A, which are respectively disposed at both ends of the first optical cable unit 4A. The other structures of the optical connector assembly 400B are the same as those of the optical connector assembly 400A, therefore detailed descriptions of these structures are omitted herein. Similarly, as Figure 11 As shown, using waveguide substrate 73 can reduce the inherent range limitations caused by the material properties of optoelectronic substrate 71, thereby enabling a larger range of optical path numerical aperture when coupling optical signals from optical fiber 41 to optoelectronic substrate 71.
[0070] refer to Figure 12A This is the optical connector assembly 500A of the ninth embodiment of this application, and... Figure 11 The main difference in the eighth embodiment shown is that the first optical cable unit 4A and the second connection module 2A are omitted from the optical connector assembly 500A. Specifically, as Figure 12A As shown, the second transmission component 502' of the optical connector assembly 500A includes a third connection module 3A' disposed at one end of the second optical cable unit 4B. The first end 21 of the optical amplifier device 2 is connected to the first connector 3" of the first connection module 1A", and the second end 22 is supported on the third connection base 5' of the third connection module 3A of the second transmission assembly 502". The other structures of the optical connector assembly 500A are the same as those of the optical connector assembly 400B, therefore detailed descriptions of these structures are omitted herein.
[0071] like Figure 12B As shown, it is Figure 12A A partially enlarged 3D view of the optical connector assembly shown. Figure 12B As shown, the first connector 3” includes a body 31 and a movable fastener 35 movably connected to the body 31. The movable fastener 35 includes a cover 351 and a fastening groove 350 penetrating the cover 351. The first connecting base 5” includes a body 51, a retainer 52 extending from the body 51, and a positioning protrusion 521 formed on the retainer 52. During assembly, a portion of the optical amplifier device 2 is disposed in the body 31, and the positioning protrusion 521 engages with the cover 351 in the fastening groove 350, thereby detachably engaging the first connector 3” with the first connecting base 5”. It should be noted that the structures of the first connector 3” and the first connecting base 5” are similar to those of the first connector 3” and the first connecting base 5”. Figure 3 The intermediate connector 3 and intermediate connecting base 5 shown are basically the same in structure. The assembly method between the first connector 3” and the first connecting base 5” is the same as that shown. Figure 3The assembly method between the intermediate connector 3 and the intermediate connector base 5 is the same. Therefore, the assembly method will not be described again here.
[0072] Figure 12C is a partially enlarged schematic diagram of the optical connector assembly 500A shown in Figure 12A. An optoelectronic integrated circuit 7' includes an optoelectronic substrate 71, and an upper return channel 701 and a lower return channel 702 disposed on the optoelectronic substrate 71. The optical amplifier device 2 includes an upper channel component 23 and a lower channel component 24. (The text repeats itself here.) Figure 12C As shown, the upper return channel 701 and the upper channel component 23 together define the upper optical signal loop, as indicated by arrow (dashed line) A2. The lower return channel 702 and the lower channel component 24 together define the lower optical signal loop, as indicated by arrow (dashed line) B2. Figure 12C The working principle of the upper optical signal circuit and the lower optical signal circuit shown is the same as Figure 2 The upper and lower optical signal circuits shown operate on the same principle. Therefore, their operating principles will not be described in detail here.
[0073] refer to Figures 13A to 17 The diagram shows top views of optical connector assemblies 100A, 100B, 200A, 200B, 300A, 300B, 400A, 400B, and 500A in application states according to the first to ninth embodiments. The optoelectronic integrated circuit 7 in each of the above embodiments is configured to connect to multiple optical connector assemblies. In some embodiments, four first transmission components 101, 101', 201, 201', 401, 401', four optical amplifier devices 2, and four second transmission components 102, 102', 202, 202', 302, 302', 402, 402', 502' are provided for connection to the optoelectronic integrated circuit 7.
[0074] Therefore, in this application, the optical amplifier device (i.e., SOA) is detachably connected to the optoelectronic integrated circuit via an optical connector assembly, rather than being directly mounted near the light emitter (e.g., laser diode) on the optoelectronic integrated circuit. This prevents a significant degradation in the performance of the optoelectronic integrated circuit, improves the quality of optical signal transmission, reduces the difficulty of assembling the optical amplifier and optoelectronic devices, and improves the overall yield of the optoelectronic integrated circuit.
[0075] The above embodiments are used to illustrate the technical concept disclosed herein, and are not intended to limit the technical concept disclosed herein. Therefore, the scope of protection of this disclosure is not limited to these embodiments. The scope of protection of this disclosure should be interpreted by the claims, and should be interpreted as including all technical concepts that are the same as or equivalent to the above scope of protection within the scope of rights of this disclosure.
Claims
1. An optical connector assembly for optical transmission between an optoelectronic integrated circuit and an application device, characterized in that, include: The first transmission component includes a first optical cable unit, a first connection module disposed at one end of the first optical cable unit and used for connection with the optical / electrical integrated circuit, and a second connection module disposed at the other end of the first optical cable unit; The second transmission component includes a second optical fiber unit, a third connection module disposed at one end of the second optical fiber unit near the second connection module, and a cable end connector disposed at the other end of the second optical fiber unit for connection with the application device. An optical amplifier device includes a first end portion disposed on the side of the second connection module and optically aligned with the first optical cable unit, and a second end portion disposed on the side of the third connection module and optically aligned with the second optical cable unit.
2. The optical connector assembly according to claim 1, characterized in that, The second connection module includes a detachably connected intermediate connector and an intermediate connection base, and the intermediate connection base is configured to support the optical amplifier device, wherein a first end of the optical amplifier device is disposed on the intermediate connection base and includes a first coupling surface exposed and located near the intermediate connector.
3. The optical connector assembly according to claim 2, characterized in that, The second end of the optical amplifier device includes a second coupling surface, and the third connection module of the second transmission component is disposed near the intermediate connection base and connected to the second coupling surface of the optical amplifier device.
4. The optical connector assembly according to claim 2, characterized in that, The first connection module includes a first connector and a first connection base that are detachably connected. The first connector is disposed at the end of the first optical cable unit, and the first connection base is connected to the optoelectronic integrated circuit.
5. The optical connector assembly according to claim 4, characterized in that, The optoelectronic integrated circuit includes an optoelectronic substrate and a waveguide substrate extending from the edge of the optoelectronic substrate, the first connection base is configured to support the waveguide substrate, and the first optical cable unit is optically aligned with the waveguide substrate.
6. The optical connector assembly according to claim 4, characterized in that, The optoelectronic integrated circuit includes an optoelectronic substrate and a waveguide substrate disposed at the edge of the optoelectronic substrate. The first connection base is configured to support the waveguide substrate, and the first optical cable unit is optically aligned with the waveguide substrate.
7. The optical connector assembly according to claim 2, characterized in that, The third connection module includes a third connector and a third connection base that are detachably connected, and the third connection base is configured to support the optical amplifier device, wherein a second end of the optical amplifier device is disposed on the third connection base and includes a second coupling surface exposed to and adjacent to the third connector.
8. The optical connector assembly according to claim 7, characterized in that, The first connection module includes a first connector and a first connection base that are detachably connected. The first connector is disposed at the end of the first optical cable unit, and the first connection base is connected to the optoelectronic integrated circuit.
9. The optical connector assembly according to claim 8, characterized in that, The optoelectronic integrated circuit includes an optoelectronic substrate and a waveguide substrate extending from the edge of the optoelectronic substrate, the first connection base is configured to support the waveguide substrate, and the first optical cable unit is optically aligned with the waveguide substrate.
10. The optical connector assembly according to claim 8, characterized in that, The optoelectronic integrated circuit includes an optoelectronic substrate and a waveguide substrate disposed at the edge of the optoelectronic substrate. The first connection base is configured to support the waveguide substrate, and the first optical cable unit is optically aligned with the waveguide substrate.
11. The optical connector assembly according to claim 1, characterized in that, The first end and the second end of the optical amplifier device respectively include a first coupling surface and a second coupling surface, the second connection module is connected to the first coupling surface, and the third connection module is connected to the second coupling surface.
12. The optical connector assembly according to claim 1, characterized in that, The first end and the second end of the optical amplifier device each include a first coupling surface and a second coupling surface, the second connection module is connected to the first coupling surface, the third connection module includes a third connector and a third connection base that are detachably connected, and the third connection base is configured to support the optical amplifier device, wherein the second end of the optical amplifier device is disposed on the third connection base, and the second coupling surface is exposed to and adjacent to the third connector.
13. The optical connector assembly according to claim 1, characterized in that, The first optical cable unit and the second optical cable unit respectively include an upper alignment fiber component, a lower alignment fiber component, and multiple optical fibers disposed between the upper alignment fiber component and the lower alignment fiber component. The optical / electrical integrated circuit includes an upper return channel and a lower return channel. The optical amplifier device includes an upper channel component and a lower channel component. The upper alignment fiber component, the upper return channel, and the upper channel component together constitute an upper optical signal circuit. The lower alignment fiber component, the lower return channel, and the lower channel component together constitute a lower optical signal circuit.
14. An optical connector assembly for realizing optical connection between an optoelectronic integrated circuit and an application device, characterized in that, include: An optical amplifier device includes a first end that is optically connected to the optoelectronic integrated circuit and a second end opposite to the first end; The second transmission component includes a second optical cable unit, a third connection module disposed at one end of the second optical cable unit and connected to the second end, such that the second optical cable unit is optically aligned with the optical amplifier device, and a cable end connector disposed at the other end of the second optical cable unit for connecting to the application device.
15. The optical connector assembly according to claim 14, characterized in that, The first end and the second end of the optical amplifier device respectively include a first coupling surface and a second coupling surface, and the third connection module is connected to the second coupling surface.
16. The optical connector assembly according to claim 14, characterized in that, The third connection module includes a third connector and a third connection base that are detachably connected, and the third connection base is configured to support the optical amplifier device, wherein a second end of the optical amplifier device is disposed on the third connection base, and the second coupling surface is exposed and located near the third connector.
17. The optical connector assembly according to claim 14, characterized in that, The optoelectronic integrated circuit includes an upper return channel and a lower return channel, and the optical amplifier device includes an upper channel component and a lower channel component, wherein the upper return channel and the upper channel component together constitute an upper optical signal circuit, and the lower return channel and the lower channel component together constitute a lower optical signal circuit.