Heat dissipating package structure and method of manufacturing the same

Abstract

A method for manufacturing a heat dissipation package structure includes providing a plurality of heat dissipation layers, each of the heat dissipation layers including a body portion having an outer surface and an inner surface, and a carrier portion protruding from the inner surface, the carrier portion having a carrier surface, then forming an uncured thermally conductive material on the carrier surface such that a flow area of the uncured thermally conductive material is limited to the carrier surface, and then bonding a plurality of electronic components to the uncured thermally conductive material, respectively, such that each of the electronic components is integrated with each of the heat dissipation layers, and the flow area of the uncured thermally conductive material is limited by the carrier surface to avoid a material cohesion of the uncured thermally conductive material from causing a shift of the plurality of electronic components.

Description

Technical Field

[0001] This invention relates to a heat dissipation packaging structure and its manufacturing method, particularly a manufacturing method and heat dissipation packaging structure that avoids the misalignment of electronic components when bonded to a heat dissipation layer caused by the material cohesion of uncured thermally conductive material. Background Technology

[0002] As the instruction cycle of integrated circuits increases and their size shrinks, electronic components (such as chips) generate high temperatures, which can affect the instruction cycle or damage the components. To reduce the temperature of these components, heat dissipation structures (such as heat sinks) are usually glued to the package or the component. However, since these heat dissipation structures are attached to the package or component after the packaging process, there are alignment issues, which can affect production efficiency. Summary of the Invention

[0003] The main objective of this invention is to provide a heat dissipation packaging structure and manufacturing method thereof, which restricts the flow area of ​​the uncured thermal conductive material by the bearing surface of the bearing portion of the heat dissipation layer, so as to avoid the electronic component from shifting due to the material cohesion of the uncured thermal conductive material when the electronic component is bonded to the heat dissipation layer with the uncured thermal conductive material. A method for manufacturing a heat dissipation packaging structure according to the present invention includes providing a plurality of heat dissipation layers, each heat dissipation layer including a body portion and a support portion, the body portion having an outer surface and an inner surface, the inner surface having a first region and a second region, the support portion protruding from the first region and exposing the second region, the support portion having a support surface; forming an uncured thermally conductive material on the support surface to restrict the flow area of ​​the uncured thermally conductive material within the support surface; bonding a plurality of electronic components to the uncured thermally conductive material, such that each electronic component is integrated with each heat dissipation layer; forming a sealing body covering the plurality of heat dissipation layers and the plurality of electronic components to form a plurality of interconnected heat dissipation packaging structures, each heat dissipation packaging structure including at least the heat dissipation layer and the electronic components; and cutting the sealing body to separate the plurality of heat dissipation packaging structures into individual units.

[0004] In one embodiment of the present invention, the second region is located outside the first region.

[0005] In one embodiment of the invention, the second region surrounds the first region.

[0006] In one embodiment of the present invention, the body portion has a first thickness, the support portion has a second thickness, and the second thickness is not greater than the first thickness.

[0007] In one embodiment of the present invention, the difference between the first thickness and the second thickness is not less than 0 μm and not greater than 35 μm.

[0008] In one embodiment of the present invention, the first thickness is not less than 5 μm and not more than 40 μm, and the second thickness is not less than 5 μm and not more than 10 μm.

[0009] In one embodiment of the present invention, each electronic component includes a back metal layer formed on the back side of the electronic component, and each electronic component is bonded to the uncured thermally conductive material via the back metal layer.

[0010] In one embodiment of the invention, it further includes forming a plurality of trenches on the exposed surface of the seal after forming the seal, the plurality of trenches being located between adjacent plurality of heat dissipation packaging structures.

[0011] In one embodiment of the invention, it further includes a redistribution circuit layer forming an electrical connection between the exposed surface and the plurality of trenches for the plurality of electronic components, and a protective layer forming on the redistribution circuit layer. The redistribution circuit layer includes a plurality of conductive pads located on the exposed surface and side pads located in the plurality of trenches. The protective layer exposes the plurality of conductive pads and the side pads.

[0012] In one embodiment of the present invention, the sealing body is cut along the plurality of grooves to form a plurality of sealing elements covering each of the heat dissipation layer and each of the electronic components, and the plurality of grooves are respectively formed as grooves located on the side of each of the sealing elements, and the side gasket is retained in the groove.

[0013] In one embodiment of the invention, the electronic component includes a plurality of conductors, the exposed surface exposes the plurality of conductors, and the redistribution line layer is electrically connected to the plurality of conductors.

[0014] In one embodiment of the invention, it further includes grinding the seal body to expose the plurality of conductors on the exposed surface before forming the plurality of grooves.

[0015] In one embodiment of the present invention, the plurality of heat dissipation layers are disposed on the carrier with the outer surface thereon, and the carrier is removed before the sealing body is cut to separate the plurality of heat dissipation encapsulation structures into individual units.

[0016] The present invention provides a heat dissipation packaging structure comprising a heat dissipation layer, a thermally conductive material, an electronic component, and a seal. The heat dissipation layer comprises a body portion and a support portion. The body portion has an outer surface and an inner surface. The inner surface has a first region and a second region. The support portion protrudes from the first region and has a support surface. The thermally conductive material is disposed on the support surface, and the flow region of the thermally conductive material before curing is restricted on the support surface. The electronic component is bonded to the thermally conductive material. The seal covers the heat dissipation layer and the electronic component and exposes the outer surface.

[0017] In one embodiment of the present invention, the second region is located outside the first region.

[0018] In one embodiment of the invention, the second region surrounds the first region.

[0019] In one embodiment of the present invention, the body portion has a first thickness, the support portion has a second thickness, and the second thickness is not greater than the first thickness.

[0020] In one embodiment of the present invention, the difference between the first thickness and the second thickness is not less than 0 μm and not greater than 35 μm.

[0021] In one embodiment of the present invention, the first thickness is not less than 5 μm and not more than 40 μm, and the second thickness is not less than 5 μm and not more than 10 μm.

[0022] In one embodiment of the invention, it further includes a redistribution circuit layer electrically connected to the electronic component and a protective layer covering the redistribution circuit layer. Each of the seals has a groove on its side. The redistribution circuit layer includes a plurality of conductive pads located on the exposed surface and side pads located in the groove. The protective layer exposes the plurality of conductive pads and the side pads.

[0023] The present invention restricts the flow area of ​​the uncured thermal conductive material by the support portion disposed in the first region, so as to avoid the material cohesion of the uncured thermal conductive material causing the multiple electronic components to shift when they are attached to the heat dissipation layer. Attached Figure Description

[0024] Figures 1 to 8 This is a schematic diagram of the manufacturing method of the heat dissipation packaging structure of the present invention;

[0025] Figure 9 This is a cross-sectional view of the heat dissipation packaging structure of the present invention.

[0026] Figure label:

[0027] 100: Thermal packaging structure; 110: Thermal layer

[0028] 111: Body part 111a: Outer surface

[0029] 111b: Inner surface; 111c: First zone

[0030] 111d: Second Zone 112: Bearing Section

[0031] 112a: Bearing surface; 120: Thermal conductive material

[0032] 130: Electronic Components 130a: Active Surface

[0033] 130b: Back side; 131: Connector

[0034] 132: Back metal layer 140: Sealing body

[0035] 140a: Seal 140b: Side

[0036] 141: Exposed surface 142: Groove

[0037] 142a: Groove; 150: Redistribution layer

[0038] 151: Conductor pad; 152: Side pad

[0039] 160: Protective layer; 200: Carrier

[0040] 210: Release film; 300: Circuit board

[0041] 400: Joint D1: First thickness

[0042] D2: Second thickness Detailed Implementation

[0043] Please see Figures 1 to 9 The present invention discloses a method for manufacturing a heat dissipation package structure, which is used to form a plurality of heat dissipation package structures 100.

[0044] Please see Figure 1 Multiple heat dissipation layers 110 are provided on the carrier 200. In this embodiment, a release film 210 is formed on the carrier 200 by means of coating or the like. The multiple heat dissipation layers 110 are attached to the carrier 200 by the release film 210. The carrier 200 can be selected from a carrier such as glass or ceramic. The heat dissipation layer 110 can be selected from a heat dissipation material such as copper. The method of forming each heat dissipation layer 110 can be selected from a method such as electroplating; or, it can be selected from a method such as etching, in which the heat dissipation plate is pre-etched into the heat dissipation layer 110 including the body part 111 and the support part 112, so that the support part 112 protrudes from the inner surface 111b of the body part 111.

[0045] Please see Figure 1 Each heat dissipation layer 110 includes a body portion 111 and a support portion 112. The body portion 111 has an outer surface 111a and an inner surface 111b. The inner surface 111b has a first region 111c and a second region 111d. The second region 111d is located outside the first region 111c. Preferably, the second region 111d surrounds the first region 111c.

[0046] Please see Figure 1The support portion 112 protrudes from the first region 111c and exposes the second region 111d. The support portion 112 has a support surface 112a. Each heat dissipation layer 110 is disposed on the carrier 200 with its outer surface 111a. In this embodiment, each heat dissipation layer 110 is attached to the release film 210 with its outer surface 111a. The body portion 111 has a first thickness D1, and the support portion 112 has a second thickness D2. The second thickness D2 is not greater than the first thickness D1, and the difference between the first thickness D1 and the second thickness D2 is not less than 0 μm and not greater than 35 μm. Preferably, the first thickness is not less than 5 μm and not greater than 40 μm, and the second thickness is not less than 5 μm and not greater than 10 μm, so as to avoid the heat dissipation layer 110 from warping.

[0047] Please see Figure 2 Next, an uncured thermally conductive material 120 is formed on the bearing surface 112a. The thermally conductive material 120 can be selected from thermally conductive materials such as tin. The thermally conductive material 120 can be transformed from a fluid into a solid. The uncured thermally conductive material 120 is confined to the bearing surface 112a by the bearing portion 112 protruding from the first region 111c.

[0048] Please see Figure 3 Next, multiple electronic components 130 are respectively bonded to the uncured thermal conductive material 120, so that each electronic component 130 is integrated with each heat dissipation layer 110. The uncured thermal conductive material 120 is restricted by the bearing surface 112a to prevent the material cohesion of the uncured thermal conductive material 120 from causing the multiple electronic components 130 to shift when bonded to each heat dissipation layer 110 by the thermal conductive material 120.

[0049] Please see Figure 3 In this embodiment, each electronic component 130 includes a plurality of conductive members 131 formed on the active surface 130a of the electronic component 130. The plurality of conductive members 131 may be selected from conductive posts or conductive pads. Preferably, each electronic component 130 includes a back-side metallization (BSM) 132 formed on the back side 130b of the electronic component 130. Each electronic component 130 is bonded to the uncured thermally conductive material 112a via the back-side metallization 132.

[0050] Please see Figure 4 Next, a sealing body 140 is formed on the carrier 200, which covers the plurality of heat dissipation layers 110 and the plurality of electronic components 130 to form the plurality of interconnected heat dissipation packaging structures 100, each of the heat dissipation packaging structures 100 including at least the heat dissipation layer 110 and the electronic component 130.

[0051] Please see Figure 5 Next, the seal 140 is ground so that the exposed surface 141 of the seal 140 exposes the plurality of conductors 131. Alternatively, in different embodiments, the exposed surface 141 already exposes the plurality of conductors 131 when the seal 140 is formed, so the seal 140 does not need to be ground again. Then, the seal 140 is cleaned to remove contaminants or oxide layers on the plurality of conductors 131.

[0052] Please see Figure 6 Next, a plurality of trenches 142 are formed on the exposed surface 141, the plurality of trenches 142 being located between adjacent plurality of heat dissipation packaging structures 100.

[0053] Please see Figure 7 Next, a redistribution circuit layer 150 electrically connecting the plurality of electronic components 130 is formed on the exposed surface 141 and the plurality of trenches 142. In this embodiment, the redistribution circuit layer 150 electrically connects the plurality of conductors 131 of the electronic components 130. The redistribution circuit layer 150 includes a plurality of conductive pads 151 located on the exposed surface 141 and side pads 152 located in the plurality of trenches 142. Next, a protective layer 160 is formed on the redistribution circuit layer 150, which exposes the plurality of conductive pads 151 and the side pads 152. In different embodiments, the redistribution circuit layer 150 and the protective layer 160 may be repeatedly and sequentially formed on the exposed surface 141. Preferably, a bonding layer (not shown in the figure, such as a gold layer) may be formed on the plurality of conductive pads 151 and the side pads 152.

[0054] Please see Figure 8 Next, the carrier 200 and the release film 210 are removed to expose the outer surface 111a of the body portion 111, and the sealing body 140 and the redistribution circuit layer 150 are cut along the plurality of grooves 142 to separate the connected plurality of heat dissipation packaging structures 100 into individual units, and the sealing body 140 is formed into a plurality of seals 140a covering each of the heat dissipation layer 110 and each of the electronic components 130, and the plurality of grooves 142 are formed into grooves 142a located on the side surface 140b of each of the seals 140a, and the side pad 152 is retained in the groove 142a.

[0055] Please see Figure 2 , 3 and Figure 9The heat dissipation package structure 100 formed by the above-described manufacturing method includes the heat dissipation layer 110, the thermally conductive material 120, the electronic component 130, and the sealing member 140a. The heat dissipation layer 110 includes the body portion 111 and the support portion 112. The support portion 112 protrudes from the first region 111c of the inner surface 111b and exposes the second region 111d. The flow area of ​​the thermally conductive material 120 before curing is confined to the support surface 112a. The electronic component 130 is bonded to the thermally conductive material 112a. The flow area of ​​the uncured thermally conductive material 120 is restricted by the bearing surface 112a to prevent the material cohesion of the uncured thermally conductive material 120 from causing the multiple electronic components 130 to shift. The seal 140a covers the heat dissipation layer 110 and the electronic component 130 and exposes the outer surface 111a of the body portion 111. The side 140b of the seal 140a has the groove 142a.

[0056] In this embodiment, the heat dissipation package structure 100 further includes a redistribution line layer 150 electrically connected to the electronic component 130 and a protective layer 160 covering the redistribution line layer 150. The redistribution line layer 150 includes a plurality of conductive pads 151 located on the exposed surface 141 and a side pad 152 located in the recess 142a. The protective layer 160 exposes the plurality of conductive pads 151 and the side pad 152.

[0057] Please see Figure 9 When the heat dissipation package 100 is attached to the circuit board 300 with a connector 400 (such as a solder ball), the side pad 152 located in the groove 142a can increase the contact area of ​​the connector 400 with the heat dissipation package 100, so as to prevent the heat dissipation package 100 from detaching from the circuit board 300.

[0058] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A method for manufacturing a heat dissipation package structure, characterized in that, Include: Multiple heat dissipation layers are provided, each heat dissipation layer includes a body portion and a support portion. The body portion has an outer surface and an inner surface. The inner surface has a first region and a second region. The support portion protrudes from the first region and exposes the second region. The support portion has a support surface. An uncured thermally conductive material is formed on the bearing surface so that the flow area of ​​the uncured thermally conductive material is confined to the bearing surface; Multiple electronic components are bonded to the uncured thermally conductive material, so that each electronic component and each heat dissipation layer are integrated into one unit; A sealed body is formed, which covers the plurality of heat dissipation layers and the plurality of electronic components to form a plurality of interconnected heat dissipation package structures, each of the heat dissipation package structures including the heat dissipation layer and the electronic component; and Cut the seal to separate the plurality of heat dissipation packaging structures into individual units.

2. The manufacturing method of the heat dissipation packaging structure as described in claim 1, characterized in that, The second zone is located outside the first zone.

3. The manufacturing method of the heat dissipation packaging structure as described in claim 2, characterized in that, The second zone surrounds the first zone.

4. The manufacturing method of the heat dissipation packaging structure as described in claim 1, characterized in that, The main body has a first thickness, and the supporting part has a second thickness, the second thickness being no greater than the first thickness.

5. The method for manufacturing the heat dissipation packaging structure as described in claim 4, characterized in that, The difference between the first thickness and the second thickness is not less than 0 μm and not greater than 35 μm.

6. The method for manufacturing the heat dissipation packaging structure as described in claim 5, characterized in that, The first thickness is not less than 5 μm and not more than 40 μm, and the second thickness is not less than 5 μm and not more than 10 μm.

7. The method for manufacturing the heat dissipation packaging structure as described in claim 1, characterized in that, Each of the electronic components includes a back metal layer formed on the back side of the electronic component, and each of the electronic components is bonded to the uncured thermally conductive material via the back metal layer.

8. The method for manufacturing the heat dissipation packaging structure as described in claim 1, characterized in that, It further includes forming a plurality of grooves on the exposed surface of the seal after the seal is formed, the plurality of grooves being located between adjacent plurality of heat dissipation packaging structures.

9. The method for manufacturing the heat dissipation packaging structure as described in claim 8, characterized in that, It further includes a redistribution circuit layer that forms an electrical connection between the plurality of electronic components on the exposed surface and the plurality of trenches, and a protective layer formed on the redistribution circuit layer. The redistribution circuit layer includes a plurality of conductive pads located on the exposed surface and side pads located in the plurality of trenches. The protective layer exposes the plurality of conductive pads and the side pads.

10. The method for manufacturing the heat dissipation package structure as described in claim 9, characterized in that, The sealing body is cut along the plurality of grooves to form a plurality of seals covering each of the heat dissipation layer and each of the electronic components, and the plurality of grooves are respectively formed as grooves on the side of each seal, and the side gasket is retained in the groove.

11. The method for manufacturing the heat dissipation packaging structure as described in claim 9, characterized in that, The electronic component includes multiple conductors, the exposed surface exposes the multiple conductors, and the redistribution layer is electrically connected to the multiple conductors.

12. The method for manufacturing the heat dissipation packaging structure as described in claim 11, characterized in that, It further includes grinding the seal body to expose the plurality of conductors on the exposed surface before forming the plurality of grooves.

13. The method for manufacturing the heat dissipation packaging structure as described in claim 1, characterized in that, The multiple heat dissipation layers are disposed on the carrier with the outer surface, and the carrier is removed before the sealing body is cut to separate the multiple heat dissipation encapsulation structures into individual units.

14. A heat dissipation packaging structure, characterized in that, Include: A heat dissipation layer includes a body portion and a support portion. The body portion has an outer surface and an inner surface. The inner surface has a first region and a second region. The support portion protrudes from the first region and exposes the second region. The support portion has a support surface. A thermally conductive material is disposed on the bearing surface, and the flow area of ​​the thermally conductive material before curing is confined to the bearing surface; Electronic components are bonded to the thermally conductive material; and A sealing element that covers the heat dissipation layer and the electronic components, and exposes the outer surface.

15. The heat dissipation packaging structure as described in claim 14, characterized in that, The second zone is located outside the first zone.

16. The heat dissipation packaging structure as described in claim 14, characterized in that, The second zone surrounds the first zone.

17. The heat dissipation packaging structure as described in claim 14, characterized in that, The main body has a first thickness, and the supporting part has a second thickness, the second thickness being no greater than the first thickness.

18. The heat dissipation packaging structure as described in claim 17, characterized in that, The difference between the first thickness and the second thickness is not less than 0 μm and not greater than 35 μm.

19. The heat dissipation packaging structure as described in claim 18, characterized in that, The first thickness is not less than 5 μm and not more than 40 μm, and the second thickness is not less than 5 μm and not more than 10 μm.

20. The heat dissipation packaging structure as described in claim 14, characterized in that, It further includes a redistribution circuit layer electrically connected to the electronic component and a protective layer covering the redistribution circuit layer. Each of the seals has a groove on its side. The redistribution circuit layer includes a plurality of conductive pads on the exposed surface and side pads on the groove. The protective layer exposes the plurality of conductive pads and the side pads.

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