A laser weakening system and method for a cortical material
Patent Information
- Application Number
- CN202610599514.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-04-30
- Publication Date
- 2026-08-28
AI Technical Summary
[0004]1、由于皮质材料厚度存在天然不均匀性，激光烧蚀中受热积累影响，打孔深度难以精确预测；
[0024] This application achieves online detection of the material ablation state by real-time acquisition of laser energy signals transmitted through the cortex material during laser weakening processing and converting them into real-time voltage signals as a characterization of the material's remaining thickness. Simultaneously, the control module acquires real-time voltage signals during blind hole processing and monitors the remaining thickness at the blind holes based on the voltage signals, providing a reliable basis for subsequent blind hole finishing steps. This improves the consistency of the weakening line processing depth and avoids the uncontrollable depth problem caused by relying solely on preset laser drilling process parameters, thereby ensuring the weakening effect of the cortex material.
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Figure CN122644862A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of laser processing technology, and in particular to a laser weakening processing system and method for cortical materials. Background Technology
[0002] The leather covering in the airbag deployment area of a car needs to be pre-processed with weakening lines so that it can tear along a designated path in the event of a collision. As the aesthetic requirements for automotive interiors continue to increase, the weakening lines need to ensure consistent tear strength while avoiding visible marks on the surface of the leather. Therefore, extremely high demands are placed on the depth and uniformity of the weakening process.
[0003] In the existing technology, there is a technical solution that uses laser equipment to ablate and drill holes in the aforementioned leather material to form weakening lines, but this solution has the following problems:
[0004] 1. Due to the inherent unevenness in the thickness of the leather material and the influence of heat accumulation during laser ablation, the drilling depth is difficult to predict accurately.
[0005] 2. Existing laser drilling solutions mostly rely on preset fixed laser process parameters, lacking real-time detection and feedback of the actual ablation depth. This can easily lead to over-ablation in some areas, affecting the front appearance, or insufficient ablation, affecting tear performance.
[0006] 3. When drilling holes in different leather materials, the laser process parameters need to be adjusted repeatedly, making it difficult to achieve adaptive processing of materials, which restricts the consistency, reliability and production efficiency of weakened line processing. Summary of the Invention
[0007] To address the aforementioned issues, this invention proposes a laser weakening processing system and method for cortical materials. By converting the laser energy signal transmitted through the cortical material into a real-time voltage signal as a characterization of the material's remaining thickness, the system enables online detection of the material's ablation state when weakening lines are formed on the cortical material. This provides a reliable basis for subsequent blind hole finishing steps, thereby improving the consistency of the weakening line processing depth and ensuring the weakening effect on the cortical material.
[0008] To achieve the above objectives, the technical solution adopted by the present invention is as follows:
[0009] On the one hand, a laser weakening processing system for cortical materials is provided, comprising:
[0010] A laser output module, which is used to output a laser beam that acts on the weakening line formation area on the surface of the corrosive material;
[0011] A processing platform having an upper panel, wherein the upper panel has a platform cutout area;
[0012] A clamp is mounted on the upper panel for fixing the leather material. The clamp has a clamp cutout area that communicates with the platform cutout area and is located above the platform cutout area. The weakening line area of the leather material fixed by the clamp corresponds to the position of the platform cutout area and the clamp cutout area.
[0013] The excess thickness detection module is located below the hollow area of the platform. It is used to receive the laser energy output through the remaining leather material during the entire process of the laser beam drilling a hole in the weakening line formation area of the leather material and forming the current blind hole, and convert the laser energy into a real-time voltage signal V corresponding to the current excess thickness of the material at the current blind hole.
[0014] And a control module, which is connected to the laser output module and the excess thickness detection module, is used to control the operation of the laser output module according to the preset laser drilling program for each blind hole, so as to drill holes sequentially in the weakening line formation area of the leather material through the laser beam, so as to form a number of blind holes in sequence.
[0015] On the other hand, a laser weakening processing method for leather materials is also provided, which includes the following steps:
[0016] Preset laser drilling program for each blind hole that forms the weakening line;
[0017] The control module controls the laser output module to emit light, and controls the laser output module to operate according to the preset laser drilling program for the current blind hole, so as to drill a hole in the weakening line formation area of the leather material through the laser beam to form the current blind hole;
[0018] Furthermore, during the entire process of forming the current blind hole, the excess thickness detection module receives the laser energy output by the laser beam through the remaining cortical material in real time, and converts the laser energy into a real-time voltage signal V corresponding to the current excess material thickness at the current blind hole.
[0019] When the laser drilling process for the current blind hole is completed and the current blind hole is formed, the control module determines the current material thickness h at the current blind hole based on the real-time voltage signal V at the time of the current blind hole formation, and compares the current material thickness h with the finishing start thickness h1 and the target thickness h2.
[0020] Furthermore, if at the moment the current blind hole is formed, the current material thickness h at the current blind hole is greater than the finishing start thickness h1, then the control module generates processing compensation parameters based on the current material thickness h and historical processing data, and feeds the processing compensation parameters back to the laser output module, so that the laser output module processes the current blind hole again according to the processing compensation parameters until the target thickness h2 < the current material thickness h at the moment the current blind hole H is finished and ≤ the finishing start thickness h1, then the blind hole finishing step is executed until the current material thickness at the current blind hole is the target thickness h2 and the finishing stops.
[0021] If the target thickness h2 is less than the current material thickness h at the current blind hole H at the time of its formation, and the finishing start thickness h1 is less than the finishing start thickness, then the blind hole finishing step is executed until the current material thickness at the current blind hole is the target thickness h2 and the finishing is stopped.
[0022] Repeat the above steps to complete the laser weakening process on the leather material and form weakening lines.
[0023] The beneficial effects of using this invention are:
[0024] This application achieves online detection of the material ablation state by real-time acquisition of laser energy signals transmitted through the cortex material during laser weakening processing and converting them into real-time voltage signals as a characterization of the material's remaining thickness. Simultaneously, the control module acquires real-time voltage signals during blind hole processing and monitors the remaining thickness at the blind holes based on the voltage signals, providing a reliable basis for subsequent blind hole finishing steps. This improves the consistency of the weakening line processing depth and avoids the uncontrollable depth problem caused by relying solely on preset laser drilling process parameters, thereby ensuring the weakening effect of the cortex material. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of the overall structure of the laser weakening processing system in this invention;
[0026] Figure 2 This is a structural diagram of the processing platform, fixture, and excess thickness detection module in this invention;
[0027] Figure 3 This is an overall structural diagram of the processing platform in this invention;
[0028] Figure 4 This is a schematic diagram of the weakening line formation region and the weakening line formed by the blind hole in this invention.
[0029] Figure 5 This is a schematic diagram showing the positional relationship between the blind hole, the material thickness, and the thickness detection module in this invention;
[0030] Figure 6This is a schematic diagram of the laser weakening processing method in this invention. Detailed Implementation
[0031] To make the objectives, technical solutions, and advantages of this technical solution clearer, the following detailed description, in conjunction with specific embodiments, further illustrates this technical solution. It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this technical solution.
[0032] Example 1:
[0033] like Figure 1-4 As shown, this embodiment provides a laser weakening processing system for cortical materials, which includes:
[0034] Laser output module 1, which is used to output a laser beam that acts on the weakening line forming region p1 on the surface of the cortical material P;
[0035] The processing platform 2 has an upper panel 21, and the upper panel 21 has a platform cutout area 22.
[0036] The clamp 6 is mounted on the upper panel 21 for fixing the leather material P. The clamp 6 has a clamp cutout area 61 that matches the shape of the platform cutout area 22, communicates with the platform cutout area 22, and is located above the platform cutout area 22. The weakening line forming area p1 of the leather material P fixed by the clamp 6 corresponds to the platform cutout area 22 and the clamp cutout area 61.
[0037] The excess thickness detection module 3 is located below the hollow area 22 of the platform. It is used to receive the laser energy output through the remaining leather material P during the entire process of the laser beam drilling a hole in the weakening line formation area p1 of the leather material P and forming the current blind hole H. It converts the laser energy into a real-time voltage signal V corresponding to the current excess thickness h of the material at the current blind hole H and outputs it.
[0038] The data storage module 4, which is connected to the excess thickness detection module 3, is used to receive the real-time voltage signal V during the entire process of forming the current blind hole H, as historical data for subsequent retrieval.
[0039] And, control module 5, which is connected to laser output module 1 and thickness detection module 3, is used to control the operation of laser output module 1 according to the preset laser drilling program for each blind hole H, so as to drill holes in the weakening line forming area p1 of leather material P in sequence by laser beam, so as to form a number of blind holes H in sequence, so as to form a weakening line by a number of blind holes H.
[0040] Simultaneously, at the moment when the laser drilling program for the current blind hole H is completed and the current blind hole H is formed, the control module 5 determines the current material remaining thickness h at the current blind hole H based on the real-time voltage signal V at the moment the current blind hole H is formed, and compares the current material remaining thickness h with the finishing start remaining thickness h1 and the target remaining thickness h2. The finishing start remaining thickness h1 is greater than the target remaining thickness h2. The finishing start remaining thickness h1 and the target remaining thickness h2 can be determined based on factors such as the material of the leather material P and the actual processing effect. For example, in this embodiment, the finishing start remaining thickness h1 and the target remaining thickness h2 are 0.3-0.5mm and 0.1-0.3mm, respectively. The target remaining thickness h2 is the material remaining thickness threshold at the blind hole H when the laser drilling program for the current blind hole H is completed and the current blind hole H is formed. In the process of forming each blind hole H, the target remaining thickness h2 of the leather material P is the same.
[0041] If, at the moment the current blind hole H is formed, the current material thickness h at the current blind hole H is greater than the finishing start thickness h1, then the control module 5 generates processing compensation parameters based on the current material thickness h and historical processing data, and feeds the processing compensation parameters back to the laser output module 1, so that the laser output module 1 processes the current blind hole H again according to the processing compensation parameters, until the target thickness h2 < the current material thickness h at the moment the current blind hole H finishes processing ≤ the finishing start thickness h1, then the control module 5 controls the laser output module 1 to perform the blind hole finishing step, until the current material thickness at the current blind hole H is the target thickness h2 and the finishing stops.
[0042] The historical processing data refers to the pre-stored correspondence between different historical material thicknesses and different historical laser processing parameters. These historical laser processing parameters include one or more of the following: laser power, repetition frequency, and number of pulses. For example, the control module 5 can search for historical material thicknesses that are the same as or close to the current thickness h at the moment the current blind hole H is formed, compare the historical laser processing parameters corresponding to these historical material thicknesses with the laser processing parameters used to form the current blind hole H, and generate processing compensation parameters based on the comparison results. For example, the difference between the historical laser power of the historical laser processing parameters and the laser power used to form the current blind hole H can be calculated. The value can be used as the power compensation value. Similarly, other laser processing parameters, such as repetition frequency and pulse number, can also obtain corresponding compensation values. Furthermore, the laser output module 1 increases or decreases the power compensation value based on the laser power that forms the current blind hole H to achieve laser power compensation. It also uses a similar compensation method to compensate the repetition frequency and pulse number, and processes the current blind hole H again according to the compensated laser power, repetition frequency and pulse number, so as to ablate the current blind hole H through secondary or multiple compensations until the target remaining thickness h2 < the current material remaining thickness h at the end of the current blind hole H processing ≤ the fine repair start remaining thickness h1.
[0043] If the target thickness h2 is less than the current material thickness h at the current blind hole H at the time of its formation, and the finishing start thickness h1 is less than the finishing start thickness, then the control module 5 controls the laser output module 1 to perform the blind hole finishing step until the current material thickness at the current blind hole H is the target thickness h2, at which point the finishing stops.
[0044] Furthermore, the control module 5 controls the laser output module 1 to perform the blind hole finishing step, including:
[0045] The control module 5 generates a fine-tuning signal and feeds it back to the laser output module 1, causing the laser output module 1 to perform laser drilling on the current blind hole H again according to the fine-tuning processing parameters until the current material thickness at the current blind hole H is the target thickness h2. For example, the current blind hole H can be slightly ablated with a lower laser power and a higher pulse frequency (i.e., fine-tuning processing parameters) than when the current blind hole H was formed, so as to perform drilling again. During the reprocessing, the thickness detection module 3 continuously outputs a real-time voltage signal V corresponding to the thickness of the corrugated material P, and determines the current material thickness according to the real-time voltage signal V. The processing stops when the current material thickness at the current blind hole H is the target thickness h2. This reduces the uncertainty caused by a single energy input, avoids excessive ablation that penetrates the material or causes thermal damage to the appearance of the corrugated material P, and thus improves the appearance quality of the material surface while ensuring the weakening effect.
[0046] During laser drilling, the smaller the remaining thickness h of the leather material P, the greater the laser energy transmitted through the material, and the stronger the real-time voltage signal V obtained by converting the laser energy. Therefore, the remaining thickness h can be determined based on the magnitude of the real-time voltage signal V. For example, in this embodiment, the remaining thickness h can be determined based on the following formula: h = k1 - k2 * V, where k1 is the material thickness before laser drilling of the leather material P, in mm, which can be determined according to the specifications of the leather material P; k2 is the voltage-to-material thickness conversion coefficient, used to characterize the material thickness change corresponding to the real-time voltage change obtained by converting the laser energy transmitted through the leather material P, in mm / V (V is voltage), and its specific value can be obtained in advance through calibration experiments.
[0047] Specifically, such as Figure 2 As shown, the excess thickness detection module 3 includes:
[0048] The filter 31 is disposed below the hollow area 22 of the platform and corresponds to the position of the entire weakening line forming area p1. It is used to adjust the attenuation of the laser energy output through the remaining dermal material when the laser beam punches holes in the weakening line forming area p1 of the leather material P in sequence.
[0049] In addition, a number of thermal sensors 32 are disposed below the filter 31 to convert the laser energy after attenuation adjustment by the filter 31 into a real-time voltage signal V corresponding to the material thickness h of the corrugated material P during the entire process of the laser beam drilling a hole in the weakening line forming region p1 of the corrugated material P and forming the current blind hole H, and output it.
[0050] like Figure 5 As shown, since the laser energy output through the remaining cortical material P may be too large, it is necessary to attenuate the laser energy through the filter 31 so that it is within the response range of the thermal sensor 32, and finally the signal conversion is completed by the thermal sensor 32.
[0051] At the same time, the detection range of at least one thermal sensor 32 covers the laser drilling processing area of multiple blind holes H, so as to output the real-time voltage signal V of several blind holes H throughout the entire process through the same thermal sensor 32.
[0052] like Figure 5As shown, during laser drilling, as the laser ablation depth (i.e., blind hole H) increases, the remaining thickness h of the leather material P gradually decreases, and the energy of the laser beam output through the remaining leather material P increases accordingly. After photoelectric signal conversion by the thermal sensor 32, the output voltage value increases accordingly. That is, the smaller the remaining thickness h of the leather material P at the current blind hole H, the larger the voltage value at the blind hole H, and vice versa. Thus, the current remaining thickness state of the blind hole H can be characterized by the voltage value at the blind hole H.
[0053] As shown above, since the laser beam sequentially forms several blind holes H in the weakening line formation region p1 of the leather material P in chronological order, when processing the previous blind hole H, the laser energy passing through the remaining leather material P is attenuated by the filter 31 and then sensed by the thermal sensor 32, and converted into a real-time voltage signal V corresponding to the remaining thickness h of the leather material P. When processing the next blind hole H, since the laser beam has already shifted to the processing position of the second blind hole H, no laser energy will pass through the previous blind hole H. At this time, when processing the next blind hole H by the same thermal sensor 32 or different thermal sensors 32, the laser energy passing through the remaining leather material P is converted into a real-time voltage signal V corresponding to the remaining thickness h of the leather material P. By analogy, the real-time voltage signal V corresponding to the remaining thickness h of the leather material P can be obtained when processing each blind hole H.
[0054] Therefore, this embodiment acquires the laser energy signal transmitted through the leather material P in real time during the laser weakening process and converts it into a real-time voltage signal as a material thickness characterization quantity. This enables online detection of the material ablation state when a weakening line is formed on the leather material. Furthermore, the control module acquires the real-time voltage signal when processing blind holes and monitors the thickness state at the blind holes based on the voltage signal. This provides a reliable basis for subsequent blind hole finishing steps, thereby improving the consistency of the weakening line processing depth and avoiding the uncontrollable depth problem caused by relying solely on preset laser drilling process parameters. This ensures the weakening effect of the leather material while protecting its front appearance.
[0055] Example 2:
[0056] The only difference between this embodiment and Embodiment 1 is that the laser weakening processing system further includes:
[0057] The excess thickness prediction module generates laser drilling compensation parameters for the next blind hole H based on the current excess thickness h and target excess thickness h2 at the time the previous blind hole H was formed, and sends them to the laser output module 1, so that the laser output module 1 performs laser drilling of the next blind hole H according to the laser drilling compensation parameters.
[0058] For example, if the remaining material thickness h at the time of formation of the previous blind hole H is less than the target remaining thickness h2, it indicates that the laser has over-ablated. In this case, laser drilling compensation parameters are generated by reducing the laser power or the number of laser pulses. Conversely, if the remaining material thickness h at the time of formation of the previous blind hole H is greater than the target remaining thickness h2, it indicates that the laser ablation is insufficient. In this case, laser drilling compensation parameters are generated by increasing the laser power or the number of laser pulses. Finally, the laser output module 1 performs laser drilling of the next blind hole H according to the laser drilling compensation parameters.
[0059] Therefore, in this embodiment, the laser drilling parameters of the next blind hole H can be offset and corrected as a whole by using laser drilling compensation parameters, so as to realize the linkage adjustment between the processing programs of adjacent blind holes H, thereby suppressing the point-to-point accumulation of processing errors along the path direction and ensuring the continuous consistency of the weakening line depth distribution.
[0060] Example 3:
[0061] This embodiment provides a laser weakening processing method for corrosive materials, which can be implemented using the laser weakening processing system described in Embodiment 1 or 2, such as... Figure 6 As shown, the laser weakening processing method includes the following steps:
[0062] S1. A laser drilling program is preset for each blind hole H that constitutes the weakening line. The laser drilling program includes laser power, scanning speed, pulse width, and number of laser pulses during laser drilling.
[0063] S2. The control module 5 controls the laser output module 1 to emit light, and controls the laser output module 1 to operate according to the preset laser drilling program of the current blind hole H, so as to drill a hole in the weakening line forming region p1 of the leather material P through the laser beam, so as to form the current blind hole H.
[0064] Furthermore, during the entire process of forming the current blind hole H, the excess thickness detection module 3 receives the laser energy output by the laser beam through the remaining cortical material P in real time, and converts the laser energy into a real-time voltage signal V corresponding to the current excess material thickness h at the current blind hole H.
[0065] S3. When the laser drilling program of the current blind hole H is completed and the current blind hole H is formed, the control module 5 determines the current material thickness h at the current blind hole H according to the real-time voltage signal V at the time of formation of the current blind hole H, and compares the current material thickness h with the finishing start thickness h1 and the target thickness h2.
[0066] Furthermore, if at the moment the current blind hole H is formed, the current material thickness h at the current blind hole H is greater than the finishing start thickness h1, then the control module 5 generates processing compensation parameters based on the current material thickness h and historical processing data, and feeds the processing compensation parameters back to the laser output module 1, so that the laser output module 1 processes the current blind hole H again according to the processing compensation parameters, until the target thickness h2 < the current material thickness h at the moment the current blind hole H finishes processing ≤ the finishing start thickness h1, then the control module 5 controls the laser output module 1 to perform the blind hole finishing step, until the current material thickness at the current blind hole H is the target thickness h2 and the finishing stops.
[0067] If the target thickness h2 is less than the current material thickness h at the current blind hole H at the time of its formation, and the finishing start thickness h1 is less than the finishing start thickness, then the control module 5 controls the laser output module 1 to perform the blind hole finishing step until the current material thickness at the current blind hole H is the target thickness h2 and the finishing is stopped; wherein, the blind hole finishing step is the same as in Example 1;
[0068] S4. Repeat steps S2-S3 above to complete the laser weakening process of the leather material P and form weakening lines.
[0069] In summary, this application achieves online detection of the ablation state of the material when forming weakening lines on the leather material by real-time acquisition of the laser energy signal passing through the leather material P during the laser weakening process and converting it into a real-time voltage signal as a characterization of the material's remaining thickness. Furthermore, the control module acquires the real-time voltage signal during the processing of blind holes and monitors the remaining thickness state at the blind holes based on the voltage signal, providing a reliable basis for subsequent blind hole finishing steps. This improves the consistency of the weakening line processing depth and avoids the uncontrollable depth problem caused by relying solely on preset laser drilling process parameters, thereby ensuring the weakening effect of the leather material.
[0070] The above content is only a preferred embodiment of the present invention. For those skilled in the art, many changes can be made in the specific implementation and application scope based on the ideas of the present invention. As long as these changes do not depart from the concept of the present invention, they all fall within the protection scope of this patent.
Claims
1. A laser weakening processing system for leather materials, characterized in that, include: A laser output module, which is used to output a laser beam that acts on the weakening line formation area on the surface of the corrosive material; A processing platform having an upper panel, wherein the upper panel has a platform cutout area; A clamp is mounted on the upper panel for fixing the leather material, and the clamp has a clamp cutout area that communicates with the cutout area of the platform and is located above the cutout area of the platform. In addition, the weakening line area of the leather material fixed by the clamp corresponds to the position of the platform cutout area and the clamp cutout area; The excess thickness detection module is located below the hollow area of the platform. It is used to receive the laser energy output through the remaining leather material during the entire process of the laser beam drilling a hole in the weakening line formation area of the leather material and forming the current blind hole, and convert the laser energy into a real-time voltage signal V corresponding to the current excess thickness of the material at the current blind hole. And a control module, which is connected to the laser output module and the excess thickness detection module, is used to control the operation of the laser output module according to the preset laser drilling program for each blind hole, so as to drill holes sequentially in the weakening line forming area of the leather material through the laser beam, so as to form a number of blind holes in sequence. Furthermore, at the moment when the laser drilling program for the current blind hole is completed and the current blind hole is formed, the control module determines the current material thickness h at the current blind hole based on the real-time voltage signal V at the moment the current blind hole is formed, and compares the current material thickness h with the finishing start thickness h1 and the target thickness h2, wherein the finishing start thickness h1 > the target thickness h2. If the target thickness h2 is less than the current material thickness h at the current blind hole H at the time of its formation, and the finishing start thickness h1 is less than the finishing start thickness, then the control module controls the laser output module to perform the blind hole finishing step until the current material thickness at the current blind hole H is equal to the target thickness h2, at which point the finishing stops.
2. The laser weakening processing system as described in claim 1, characterized in that, If, at the moment the current blind hole is formed, the current material thickness h at the current blind hole is greater than the finishing start thickness h1, then the control module generates processing compensation parameters based on the current material thickness h and historical processing data, and feeds the processing compensation parameters back to the laser output module. This causes the laser output module to process the current blind hole again according to the processing compensation parameters until the target thickness h2 < the current material thickness h at the moment the current blind hole H is finished being processed and ≤ the finishing start thickness h1. At this point, the control module controls the laser output module to perform the blind hole finishing step until the current material thickness at the current blind hole is the target thickness h2, at which point the finishing stops.
3. The laser weakening processing system as described in claim 1 or 2, characterized in that, The remaining thickness h1 after fine-tuning is greater than the target remaining thickness h2.
4. The laser weakening processing system as described in claim 1 or 2, characterized in that, The control module controls the laser output module to perform blind hole finishing steps, including: The control module generates a finishing signal and feeds it back to the laser output module, so that the laser output module performs laser drilling on the current blind hole again according to the finishing processing parameters until the current material thickness h at the current blind hole is the target thickness h2.
5. The laser weakening processing system as described in claim 1, characterized in that, The remaining material thickness h is determined by the following formula: h = k1 - k2 * V, where k1 is the material thickness before laser drilling of the leather material, in mm; k2 is the voltage-to-material thickness conversion coefficient, used to characterize the material thickness change corresponding to the real-time voltage change obtained by laser energy conversion through the leather material P, in mm / V.
6. The laser weakening processing system as described in claim 1, characterized in that, The excess thickness detection module includes: A filter is disposed below the hollow area of the platform and corresponds to the position of the entire weakening line formation area. It is used to attenuate and adjust the laser energy output through the remaining dermal material when the laser beam punches holes in the weakening line formation area of the leather material in sequence. In addition, several thermal sensors are disposed below the filter to convert the laser energy, after attenuation adjustment by the filter, into a real-time voltage signal V corresponding to the material thickness of the leather material during the entire process of drilling holes in the weakened line formation area of the laser beam in the leather material and forming the current blind hole.
7. The laser weakening processing system as described in claim 6, characterized in that, At least one thermal sensor has a detection range that covers the laser drilling area of multiple blind holes.
8. The laser weakening processing system as described in claim 1, characterized in that, The laser weakening processing system also includes: The excess thickness prediction module generates laser drilling compensation parameters for the next blind hole based on the current excess thickness of the material at the blind hole and the target excess thickness h2 at the time of formation of the previous blind hole, and sends them to the laser output module, so that the laser output module performs laser drilling of the next blind hole according to the laser drilling compensation parameters.
9. The laser weakening processing system as described in claim 1, characterized in that, The laser weakening processing system also includes: The data storage module, which is connected to the excess thickness detection module, is used to receive the real-time voltage signal V throughout the entire process of forming the current blind hole.
10. A laser weakening processing method for leather materials, characterized in that, Includes the following steps: Preset laser drilling program for each blind hole that forms the weakening line; The control module controls the laser output module to emit light, and controls the laser output module to operate according to the preset laser drilling program for the current blind hole, so as to drill a hole in the weakening line formation area of the leather material through the laser beam to form the current blind hole; Furthermore, during the entire process of forming the current blind hole, the excess thickness detection module receives the laser energy output by the laser beam through the remaining cortical material in real time, and converts the laser energy into a real-time voltage signal V corresponding to the current excess material thickness at the current blind hole. When the laser drilling process for the current blind hole is completed and the current blind hole is formed, the control module determines the current material thickness h at the current blind hole based on the real-time voltage signal V at the time of the current blind hole formation, and compares the current material thickness h with the finishing start thickness h1 and the target thickness h2. Furthermore, if at the moment the current blind hole is formed, the current material thickness h at the current blind hole is greater than the finishing start thickness h1, then the control module generates processing compensation parameters based on the current material thickness h and historical processing data, and feeds the processing compensation parameters back to the laser output module, so that the laser output module processes the current blind hole again according to the processing compensation parameters until the target thickness h2 < the current material thickness h at the moment the current blind hole H is finished and ≤ the finishing start thickness h1, then the blind hole finishing step is executed until the current material thickness at the current blind hole is the target thickness h2 and the finishing stops. If the target thickness h2 is less than the current material thickness h at the current blind hole H at the time of its formation, and the finishing start thickness h1 is less than the finishing start thickness, then the blind hole finishing step is executed until the current material thickness at the current blind hole is the target thickness h2 and the finishing is stopped. Repeat the above steps to complete the laser weakening process on the leather material and form weakening lines.