Flat wire on-line polishing processing technology

Abstract

The application discloses a kind of flat wire online polishing processing technology, be set before flat wire annealing procedure.First, the two wide faces are polished simultaneously by the first pair of wide face grinding wheels adjusted along the thickness direction, and then the two side faces are polished simultaneously by the second pair of side face grinding wheels adjusted along the width direction.The grit size of grinding wheel is 320-1200 mesh, the rotational speed is 600-1400 r / min, the normal contact force of single grinding wheel is 5-40 N, and the Ra after polishing is 0.10-0.40 μm.After completing the polishing of four sides, the flat wire is blown and / or vacuumed and continuously enters the annealing process.The application can adapt to different width and thickness specifications, reduce the deviation and one-sided overgrinding, and reduce the influence of surface impurities on the adhesion of subsequent coating.

Description

Technical Field

[0001] This invention relates to the field of metal wire surface treatment and enameled flat wire manufacturing technology, and particularly to an online polishing process for sequentially cleaning the wide surface and side surface of the flat wire in a continuous conveying state before the flat wire annealing process, as well as polishing equipment for implementing the process. Background Technology

[0002] Flat wire is typically obtained from round wire through rolling, drawing, or die forming. During the forming and conveying process, drawing lubricant, metal dust, oxides, and other impurities can easily remain on the surface of the flat wire. If these deposits enter the subsequent annealing and coating processes with the flat wire, they may not only cause uneven surface conditions after annealing, but also reduce the adhesion between the insulating varnish or other coatings and the metal substrate, resulting in pinholes, blistering, cracking, or localized peeling of the varnish film.

[0003] Existing surface treatment methods include water washing, chemical cleaning, single-sided grinding, or grinding after twisting the wire. Water washing or chemical cleaning requires liquid circulation, drying, and waste liquid treatment facilities; single-sided grinding is difficult to simultaneously treat both wide and two side surfaces of a rectangular cross-section flat wire; twisting the wire may change the wire routing on the in-line equipment and increase tension fluctuations. For flat wires with different widths and thicknesses, if the polishing wheel position cannot be adjusted in the corresponding direction, insufficient contact, over-grinding, or centerline misalignment may occur.

[0004] Therefore, there is a need for an online mechanical cleaning process and equipment that can sequentially complete the cleaning of two wide faces and two side faces along the production line without twisting the flat wire, and can adjust the position of the grinding wheel according to the thickness and width of the flat wire to maintain the stability of the wire center before annealing.

[0005] The information disclosed in this background section is intended only to enhance the understanding of the overall background of the invention and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0006] The purpose of this invention is to provide an online polishing process and equipment for flat wires, in order to solve the problems of insufficient cleaning of the four sides of flat wires of different specifications before annealing, difficulty in adjusting the contact position of the grinding wheel separately, easy deviation of the wire center during polishing, and the possibility of grinding debris entering the annealing process with the wire.

[0007] To achieve the above objectives, the present invention provides an online polishing process for flat wires, the steps of which are as follows: S1. Obtain the width a and thickness b of the flat wire to be processed; adjust the guiding conveying mechanism so that the two wide faces of the flat wire maintain the predetermined direction and the center of the flat wire corresponds to the center of the annealing device inlet; set the linear speed in the range of 5-45m / min according to the material and specifications, and select the grinding wheel grit in the range of 320-1200 mesh. S2. Using the first adjustment mechanism, bring the first wide-face grinding wheel and the second wide-face grinding wheel close to the two wide faces of the flat wire along the thickness direction; adjust the normal contact force of a single grinding wheel to 5-40N; S3. Start the two wide-face grinding wheels and continuously feed the flat wire so that the two wide faces are mechanically polished at the same time; the working speed of the two grinding wheels is 600-1400 r / min; S4. The first and second side grinding wheels are moved toward each other along the width direction by the second adjustment mechanism, so that they respectively contact the two sides of the flat wire; the normal contact force of a single side grinding wheel is adjusted to 5-40N. S5. The flat wire goes directly from the first wide surface polishing station to the second side surface polishing station. The two sides are cleaned simultaneously by the two side grinding wheels without twisting the flat wire. S6. Inspect or sample the surface roughness after polishing on all four sides, and control Ra within 0.10-0.40μm; S7. Remove the abrasive debris adhering to the surface of the flat wire by blowing and / or negative pressure suction, and allow the flat wire that has been polished on all four sides to enter the annealing device in a continuous conveying state.

[0008] In this design, the width of the flat wire cross-section is denoted as 'a', and the thickness as 'b'. The two wide faces are the opposing surfaces on the cross-section corresponding to width 'a', extending along the length of the flat wire. The two side faces are the opposing surfaces on the cross-section corresponding to thickness 'b', extending along the length of the flat wire. The adjustment direction of the first pair of wide face grinding wheels is consistent with the thickness direction, and the adjustment direction of the second pair of side face grinding wheels is consistent with the width direction.

[0009] Preferably, in the technical solution, both pairs of grinding wheels are symmetrically adjusted relative to the same conveying center line, so that the entry center of the subsequent annealing device does not need to be changed when changing specifications; the same pair of grinding wheels simultaneously contacts the opposite surfaces, so that the lateral forces are balanced.

[0010] Preferably, in the technical solution, the spacing between the first pair of wide-face grinding wheels and the spacing between the second pair of side grinding wheels are adjusted separately so that the contact amount of the two pairs of grinding wheels is independent of each other; grinding debris is removed by at least one of airflow blowing and negative pressure dust collection, and collected by a chip collection port located below the grinding wheels; the rotational speed of each grinding wheel is adjusted according to at least two of the following: flat wire material, grinding wheel diameter, grinding wheel grit size, linear velocity, normal contact force, and measured Ra; each grinding wheel is driven by an independent drive mechanism.

[0011] Preferably, in the technical solution, the flat wire linear velocity is 10-40 m / min, the grinding wheel grit size is 600-800 mesh, the grinding wheel rotation speed is 900-1200 r / min, the normal contact force of a single grinding wheel is 10-25 N, and the Ra after polishing is 0.15-0.30 μm. The above parameters together control the number of abrasive actions received per unit length of flat wire, the amount of material removed per unit contact area, and the polishing heat, so that surface impurities are removed without forming obvious grooves, burns, or dimensional deviations.

[0012] A flat wire online polishing device includes a frame, a first wide-face polishing unit, a second side-face polishing unit, a grinding wheel drive mechanism, a first adjustment mechanism, a second adjustment mechanism, and a chip removal mechanism; the first wide-face polishing unit includes a pair of wide-face grinding wheels respectively disposed on the two wide-face sides of the flat wire and a first adjustment mechanism, the first adjustment mechanism driving the corresponding wide-face grinding wheels to move along the thickness direction; the second side-face polishing unit includes a pair of side-face grinding wheels respectively disposed on the two side-face sides of the flat wire and a second adjustment mechanism, the second adjustment mechanism driving the corresponding side-face grinding wheels to move towards or away from each other along the width direction.

[0013] Preferably, in the technical solution, the first adjustment mechanism includes a first guide rail arranged along the thickness direction, a first slide mounting a wide-face grinding wheel and its drive mechanism, and a first lead screw driving the first slide to move; the second adjustment mechanism includes a second guide rail arranged along the width direction, a second slide mounting a side grinding wheel and its drive mechanism, and a second lead screw driving the second slide to move; the two wide-face grinding wheels and the two side grinding wheels are respectively symmetrically arranged with respect to the conveying center line; each grinding wheel is respectively connected to an independent variable speed drive motor with a rotation speed of 600-1400 r / min; the first adjustment mechanism and the second adjustment mechanism are respectively provided with elastic loading elements and / or force detection elements to adjust the normal contact force of a single wheel to 5-40N.

[0014] Preferably, in the technical solution, a protective cover is provided on the outside of the two polishing units, and a chip collection port is provided at the bottom of the protective cover; the chip removal mechanism includes a blowing port facing the flat wire surface and / or a negative pressure dust suction port communicating with the protective cover; the first adjustment mechanism and the second adjustment mechanism may also be provided with a scale, position indicator or displacement detection element for displaying the position of the grinding wheel or the spacing between the grinding wheels.

[0015] Compared with the prior art, the present invention has the following beneficial effects: Without 90° twisting of the flat wire, four-sided cleaning of two wide faces and two side faces is completed sequentially along the production line, making it suitable for connection with continuous annealing production lines. The wide face grinding wheel is adjusted along the thickness direction according to the thickness of the flat wire, and the side grinding wheels are adjusted towards each other along the width direction according to the width of the flat wire, which can accommodate different width-to-thickness ratio specifications. The two grinding wheels are symmetrically close to the conveyor center line, which can make the forces on the relative surfaces tend to be balanced, reducing the risk of deviation, wire overturning and one-sided over-grinding. After mechanical polishing, chip removal is carried out immediately and annealing is performed, which helps to reduce the impact of wire drawing lubricant, metal powder and surface impurities on the adhesion of subsequent coatings. By combining and controlling the linear speed, grinding wheel grit size, rotation speed, normal contact force and target Ra, a repeatable process window is established between cleaning efficiency, surface micro-roughening, material removal amount and polishing heat. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall process of the flat wire online polishing process of the present invention; Figure 2 This is a schematic diagram showing the first wide-face polishing station and its thickness direction adjustment relationship; Figure 3 This is a schematic diagram showing the second side polishing station and its width-direction adjustment relationship. Figure 4 This is a schematic diagram of the flat wire online polishing equipment of the present invention; Figure 5 This is a front view of the flat wire online polishing device of the present invention.

[0017] Explanation of reference numerals in the attached drawings: 1-Frame; 2-Flat wire; 4-First wide-surface polishing unit; 41-First wide-surface grinding wheel; 42-Second wide-surface grinding wheel; 43-First adjusting mechanism; 5-Second side polishing unit; 51-First side grinding wheel; 52-Second side grinding wheel; 53-Second adjusting mechanism; 6-Grinding wheel drive mechanism; 61-First variable frequency motor; 62-Second variable frequency motor; 63-Third variable frequency motor; 64-Fourth variable frequency motor; 7-Protective cover; 8-Chip collection port. Detailed Implementation

[0018] The specific embodiments of the present invention will be described in detail below, but it should be understood that the scope of protection of the present invention is not limited to the specific embodiments.

[0019] Unless otherwise expressly stated, throughout the specification and claims, the term "comprising" or its variations such as "including" or "comprises" shall be understood to include the stated elements or components without excluding other elements or other components.

[0020] like Figure 2-5As shown in the figure, this embodiment provides an online polishing device for flat wires, which is set between a flat wire forming device and an annealing device. A first wide-face polishing unit 4, a second side-face polishing unit 5, and a blowing / dust-collecting mechanism are sequentially arranged on the frame 1 according to the conveying direction of the flat wire 2. Protective covers 7 are provided on the outer sides of the first wide-face polishing unit 4 and the second side-face polishing unit 5, and a chip collection port 8 is provided at the lower part of the protective cover 7.

[0021] The first wide-face polishing unit 4 includes a first wide-face grinding wheel 41 located above the flat wire 2, a second wide-face grinding wheel 42 located below the flat wire 2, a grinding wheel drive mechanism 6 connected to the two grinding wheels respectively, and a first adjustment mechanism 43. The first adjustment mechanism 43 includes a guide rail arranged along the thickness direction, a slide for mounting the grinding wheel drive mechanism 6, and a lead screw and handwheel for driving the slide to move. When the handwheel is turned, the two wide-face grinding wheels move closer to or further away from the flat wire along the thickness direction, thereby setting the grinding wheel spacing and contact amount according to the thickness b. The two slides preferably move symmetrically with respect to the conveying center line.

[0022] The second side polishing unit 5 includes a first side grinding wheel 51 and a second side grinding wheel 52 located on both sides of the width direction of the flat wire 2, a corresponding grinding wheel drive mechanism 6, and a second adjustment mechanism 53. The second adjustment mechanism 53 includes a guide rail, a slide, a lead screw, and a handwheel arranged along the width direction. The two side grinding wheels move towards or away from each other along the width direction, thereby setting the distance and contact amount between the two sides according to the width a.

[0023] The grinding wheel drive mechanism 6 includes a first variable frequency motor 61, a second variable frequency motor 62, a third variable frequency motor 63, and a fourth variable frequency motor 64, each connected to a corresponding grinding wheel, allowing the rotational speed of each grinding wheel to be adjusted within the range of 600-1400 r / min; the flat wire linear velocity is set to 5-45 m / min. The grinding wheels are 320-1200 grit abrasive wheels, flap wheels, or elastic polishing wheels with corresponding abrasive grit. Each grinding wheel applies a normal contact force of 5-40 N to the flat wire through position adjustment, elastic loading, or force detection. The actual settings are determined based on the flat wire material, grinding wheel diameter, target material removal amount, and target Ra. An intermediate guide is provided between the first wide-face polishing unit 4 and the second side polishing unit 5 to suppress the transmission of disturbances generated at the first station to the second station.

[0024] like Figure 1 As shown, an online polishing process for flat wires includes the following steps: S1. Specifications and parameter settings: Obtain the width a and thickness b of the flat wire to be processed; adjust the guiding conveyor mechanism to keep the two wide faces of the flat wire in the predetermined direction and make the center of the flat wire correspond to the center of the annealing device inlet; set the linear speed in the range of 5-45 m / min according to the material and specifications, and select the grinding wheel grit in the range of 320-1200 mesh.

[0025] S2. Wide face grinding wheel adjustment: The first adjustment mechanism is used to bring the first wide face grinding wheel and the second wide face grinding wheel closer to the two wide faces of the flat line along the thickness direction; preferably, the two grinding wheels are adjusted symmetrically relative to the conveying center line, and the normal contact force of a single grinding wheel is adjusted to 5-40N.

[0026] S3. Wide-face online polishing: Start the two wide-face grinding wheels and continuously feed the flat wire so that the two wide faces are mechanically polished simultaneously. The working speed of the two grinding wheels is 600-1400 r / min, preferably 900-1200 r / min.

[0027] S4. Side grinding wheel adjustment: The first and second side grinding wheels are moved towards each other along the width direction by the second adjustment mechanism, so that they respectively contact the two sides of the flat wire; preferably, the two grinding wheels are adjusted symmetrically relative to the conveying center line, and the normal contact force of a single side grinding wheel is adjusted to 5-40N.

[0028] S5. Side online polishing: The flat wire goes directly from the first wide surface polishing station to the second side polishing station. The two sides are cleaned simultaneously by the two side grinding wheels without twisting the flat wire.

[0029] S6. Roughness control: Inspect or sample the surface roughness after polishing on all four sides, and control Ra within 0.10-0.40μm; S7. Chip removal output: Removes the abrasive chips adhering to the surface of the flat wire by blowing and / or negative pressure dust collection, and allows the flat wire that has been polished on all four sides to enter the annealing device in a continuous conveying state.

[0030] When the thickness b of the flat wire changes, the positions of the two grinding wheels in the first wide-face polishing unit 4 are adjusted only along the thickness direction; when the width a of the flat wire changes, the positions of the two grinding wheels in the second side polishing unit 5 are adjusted only along the width direction. By setting the grinding wheel spacing in both directions separately, contact deviations caused by simultaneously adapting to width and thickness with a single lifting action can be avoided. After changing specifications, the four grinding wheels are re-established in symmetrical positions relative to the same conveyor center line, and the surface contact state is checked during a low-speed trial run before being increased to the corresponding production speed.

[0031] Verification Experiment T2 bare copper flat wire from the same batch was selected as the verification object, with a width of a=3.00mm and a thickness of b=1.00mm. Both the wide-face grinding wheel and the side grinding wheel used 150mm diameter elastic abrasive wheels. For each group, the flat wire linear velocity, grinding wheel grit size, grinding wheel speed, and single-wheel normal contact force were set according to Table 1. Each group underwent continuous processing for 1000m and was repeated 3 times. Except for group D0, which did not undergo polishing, all other groups underwent wide-face polishing, side polishing, and negative pressure dust extraction in sequence. After surface treatment, all groups used the same annealing, cooling, painting, and baking conditions to eliminate the influence of subsequent process differences on paint film adhesion.

[0032] Table 1 Parameter Validation Groups

[0033] Surface roughness: Using a calibrated stylus roughness tester, five locations are randomly selected on the two wide faces and two side faces of each group of flat lines to measure Ra. The average value of the 20 measurements is taken as the four-face average Ra, and the difference between the maximum and minimum values ​​of the four surface Ra averages is taken as the four-face roughness difference ΔRa.

[0034] Impurity removal rate: Samples of equal length were taken and the same volume of cleaning solvent was used to extract the residues on the sample surface. After evaporating the solvent, the mass of the residues was weighed. Using the mass of residue per unit area M0 of group D0 as the baseline, the impurity removal rate was calculated according to η=(M0-M...). i ) / M0×100% to calculate the impurity removal rate of each test group.

[0035] Material removal amount and temperature rise: Measure the width and thickness before and after polishing at the same marked position, and calculate the average removal amount per side; use an infrared thermometer to measure the highest temperature of the flat wire surface at the exit of the polishing station on the second side.

[0036] Coating adhesion effect: After the same annealing and coating process, each group underwent a 180° coating peel test on samples of the same length, and the average peel force P per unit width was recorded; according to (P i The adhesion improvement rate relative to group D0 is calculated as (P0) / P0×100%. At least 10 samples are tested for each group. At the same time, a visual inspection is performed on 1000 m of continuous products, and the proportion of pinholes, bubbles, exposed copper, scratches and local paint peeling length to the total inspection length is counted as the surface defect rate.

[0037] The results obtained using the above method are shown in Tables 2 and 3. The data in the tables are expressed as the average of three independent runs, and the ± values ​​after Ra, temperature, and peel force represent the standard deviation.

[0038] Table 2 Results of surface cleaning and dimensional effects

[0039] Table 3 Results of coating adhesion and product appearance

[0040] Group D1 uses fine-grained, low-speed, low-contact-force, and high-linear-speed grinding. The effective grinding action received per unit length of flat wire is insufficient, the impurity removal rate is only 58.2%, and the Ra after polishing is 0.09μm, which is still lower than the lower limit of 0.10μm set in this application. The improvement of coating peel strength is limited.

[0041] Groups D2 and D3 are within the optimal parameter window, achieving impurity removal rates of 90.6% and 95.3%, respectively. Their average Ra values ​​on all four sides are 0.19 μm and 0.26 μm, respectively, with a surface roughness difference of no more than 0.05 μm. Their coating peel strength is 70.9% and 84.8% higher than the unpolished control group, respectively, and their surface defect rates are reduced to 0.9% and 0.5%. This indicates that achieving a uniform micro-rough morphology while appropriately removing contaminants is beneficial for improving the mechanical bonding between the coating and the conductor surface after annealing.

[0042] Group D4 is located at the high intensity boundary of the total parameter range. Although the impurity removal rate reaches 97.1%, the single-sided removal amount increases to 9.5μm and the highest outlet temperature increases to 59℃. The degree of coating adhesion improvement is lower than that of Group D3, indicating that further increasing the grinding intensity will not produce a proportional gain in adhesion.

[0043] The grinding wheel grit size, rotational speed, and contact force of group D5 exceed the range of this application. Ra increases to 0.61 μm, the four-sided roughness difference increases to 0.17 μm, the single-sided removal amount reaches 15.8 μm, and the highest outlet temperature reaches 78°C. Deep scratches, localized over-wearing, and temperature rise cause the surface defect rate to rebound to 4.6%, indicating that the upper limits of grit size, rotational speed, contact force, and Ra set in this application have the effect of suppressing over-wearing and maintaining adhesion stability.

[0044] The results above show that linear velocity, wheel grit size, wheel speed, and normal contact force are not isolated factors: too low an intensity cannot adequately remove impurities, while too high an intensity can cause dimensional loss, temperature rise, and deep scratches. Controlling the linear velocity to 10-40 m / min, the wheel grit size to 600-800 mesh, the wheel speed to 900-1200 r / min, and the single-wheel normal contact force to 10-25 N, while maintaining the Ra value after four-sided polishing at 0.15-0.30 μm, achieves a better balance between cleanliness, dimensional retention, four-sided consistency, and subsequent coating adhesion.

[0045] The above embodiments are illustrative of the present invention and not intended to limit the invention. For those skilled in the art, equivalent substitutions made to the grinding wheel drive method, slide drive method, guide mechanism form, and chip removal method without departing from the technical concept defined in the claims may fall within the protection scope of the present invention.

Claims

1. An online polishing process for flat wires, set before the flat wire annealing process, characterized in that, The steps are as follows: S1. Obtain the width a and thickness b of the flat wire to be processed; adjust the guiding conveying mechanism so that the two wide faces of the flat wire maintain the predetermined direction and the center of the flat wire corresponds to the center of the annealing device inlet; set the linear speed in the range of 5-45m / min according to the material and specifications, and select the grinding wheel grit in the range of 320-1200 mesh. S2. Using the first adjustment mechanism, bring the first wide-face grinding wheel and the second wide-face grinding wheel close to the two wide faces of the flat wire along the thickness direction; adjust the normal contact force of a single grinding wheel to 5-40N; S3. Start the two wide-face grinding wheels and continuously feed the flat wire so that the two wide faces are mechanically polished at the same time; the working speed of the two grinding wheels is 600-1400 r / min; S4. The first and second side grinding wheels are moved toward each other along the width direction by the second adjustment mechanism, so that they respectively contact the two sides of the flat wire; the normal contact force of a single side grinding wheel is adjusted to 5-40N. S5. The flat wire goes directly from the first wide surface polishing station to the second side surface polishing station. The two sides are cleaned simultaneously by the two side grinding wheels without twisting the flat wire. S6. Inspect or sample the surface roughness after polishing on all four sides, and control Ra within 0.10-0.40μm; S7. Remove the abrasive debris adhering to the surface of the flat wire by blowing and / or negative pressure suction, and allow the flat wire that has been polished on all four sides to enter the annealing device in a continuous conveying state.

2. The flat wire online polishing process according to claim 1, characterized in that: The flat wire has a linear velocity of 10-40 m / min, a grinding wheel grit size of 600-800 mesh, a working speed of 900-1200 r / min for each grinding wheel, a normal contact force of 10-25 N for a single grinding wheel, and a Ra of 0.15-0.30 μm after four-sided polishing.

3. The flat wire online polishing process according to claim 1, characterized in that: The first pair of wide-face grinding wheels are adjusted symmetrically along the thickness direction relative to the center of the flat wire, and the second pair of side grinding wheels are adjusted symmetrically along the width direction relative to the center of the flat wire, so as to keep the center of the flat wire corresponding to the inlet center of the annealing device when changing the flat wire specification.

4. The flat wire online polishing process according to claim 3, characterized in that: Adjust the spacing between the first pair of wide-face grinding wheels and the second pair of side grinding wheels respectively, so that the contact amount of the two pairs of grinding wheels is independent of each other.

5. The flat wire online polishing process according to claim 3, characterized in that: The same pair of grinding wheels simultaneously contact the two opposite surfaces of the flat wire so that the forces acting on the flat wire in the corresponding adjustment direction at least partially cancel each other out.

6. The flat wire online polishing process according to claim 1, characterized in that: The grinding debris is removed by at least one of airflow purging and negative pressure dust collection, and collected by a chip collection port located below the grinding wheel.

7. The flat wire in-line polishing process according to claim 1, characterized in that: The rotational speed of each grinding wheel is adjusted according to at least two of the following: flat wire material, grinding wheel diameter, grinding wheel grit size, wire feed speed, normal contact force, and measured Ra. Each grinding wheel is driven by an independent drive mechanism.

8. An online polishing device for flat wires, comprising a frame, a guiding conveying mechanism for running the flat wires along a conveying centerline, and a grinding wheel drive mechanism, characterized in that: The frame is provided with a first wide-face polishing unit and a second side-face polishing unit in sequence along the flat wire conveying direction; the first wide-face polishing unit includes a first pair of wide-face grinding wheels located on the two wide-face sides of the flat wire and a first adjusting mechanism, the first adjusting mechanism being configured to drive the first pair of wide-face grinding wheels to move closer to or further away from the flat wire along the thickness direction of the flat wire; the second side-face polishing unit includes a second pair of side-face grinding wheels located on the two side sides of the flat wire and a second adjusting mechanism, the second adjusting mechanism being configured to drive the second pair of side-face grinding wheels to move towards or away from each other along the width direction of the flat wire; a chip removal mechanism is provided downstream of the second side-face polishing unit, the downstream of the chip removal mechanism being connected to the inlet of the annealing device.

9. The flat wire online polishing equipment according to claim 8, characterized in that: The first adjustment mechanism includes a first guide rail arranged along the thickness direction of the flat wire, a first slide mounting a corresponding wide-face grinding wheel and a grinding wheel drive mechanism, and a first lead screw driving the first slide to move; the second adjustment mechanism includes a second guide rail arranged along the width direction of the flat wire, a second slide mounting a corresponding side grinding wheel and a grinding wheel drive mechanism, and a second lead screw driving the second slide to move.

10. The flat wire online polishing equipment according to claim 8, characterized in that: The first pair of wide-face grinding wheels are symmetrically arranged with respect to the conveying center line, and the second pair of side-face grinding wheels are symmetrically arranged with respect to the conveying center line.

11. The flat wire online polishing equipment according to claim 8, characterized in that: Each grinding wheel is connected to an independent variable speed drive motor, and each variable speed drive motor is configured to rotate the corresponding grinding wheel at a speed of 600-1400 r / min.

12. The flat wire online polishing equipment according to claim 8, characterized in that: The first adjustment mechanism and the second adjustment mechanism respectively include an elastic loading element or a force detection element to adjust the normal contact force applied by a single grinding wheel to the corresponding surface of the flat wire to 5-40N.

13. The flat wire in-line polishing process according to claim 8, characterized in that: The first wide-surface polishing unit and the second side polishing unit are provided with protective covers on their outer sides. The lower part of the protective cover is provided with a chip collection port. The chip removal mechanism includes a blow port facing the flat wire surface and / or a negative pressure suction port communicating with the protective cover.

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