A double swing head type five-axis machining ion beam polishing device and a working method thereof

Abstract

The application discloses a double-swing-head five-axis machining ion beam polishing equipment and a working method thereof. The polishing equipment comprises an equipment cavity, a vacuum system, an ion source, a first rotating module, a second rotating module, a three-axis moving mechanism and a control system. The first rotating module is used for driving the ion source to rotate around a first rotating axis. The second rotating module is used for driving the first rotating module to rotate around a second rotating axis. The three-axis moving mechanism is used for driving the second rotating module, the first rotating module and the ion source to move along three mutually perpendicular directions. The control system is connected with the three-axis moving mechanism, the second rotating module and the first rotating module respectively. Through five-axis linkage, the spatial position and the beam incidence angle of the ion source can be adjusted in real time, the machining blind area of the traditional three-axis equipment is eliminated, and the polishing requirements of various plane, spherical, aspherical, concave-convex and special-shaped optical elements can be met.

Description

Technical Field

[0001] This invention belongs to the field of precision machining technology for optical components, specifically relating to a dual-swivel-head five-axis machining ion beam polishing device and its working method. Background Technology

[0002] Ion beam polishing (IBF) is an ultra-precision machining technology that uses high-energy particle beams to bombard the surface of materials and remove materials through physical sputtering effects. It is widely used for deterministic shaping and polishing of optical components and has outstanding advantages such as no contact stress, stable material removal rate, and sub-nanometer surface accuracy.

[0003] However, traditional ion beam processing equipment typically only has the ability to move along three axes: X, Y, and Z, and has the following main technical defects: (1) Limited processing freedom: The three-axis structure can only realize the linear position movement of the ion source in three-dimensional space. It cannot actively adjust the incident angle of the ion beam. The ion beam always bombards the workpiece surface in a fixed direction, which is difficult to adapt to the processing requirements of convex mirrors, concave mirrors and complex irregular optical components with large curvature.

[0004] (2) The problem of processing blind zone is prominent: For workpieces with deep concave surface or large curvature, the fixed angle of the ion beam is prone to producing processing blind zone, which makes it impossible to eliminate local surface errors and seriously restricts the surface convergence accuracy.

[0005] (3) The processing distance is difficult to keep constant: The material removal function (TIF) of the ion beam is highly sensitive to the processing distance. During the surface scanning process of the three-axis equipment, the normal processing distance changes with the curvature of the workpiece, causing fluctuations in the removal rate and affecting the final surface accuracy.

[0006] Therefore, there is an urgent need for an ion beam polishing device with five-axis linkage capability and the ability to adjust the ion beam incident angle and processing distance in real time to meet the polishing requirements of high-precision optical components. Summary of the Invention

[0007] The purpose of this invention is to provide a dual-swivel-head five-axis machining ion beam polishing device and its working method, in order to solve the above-mentioned problems existing in the prior art.

[0008] To achieve the above objectives, in one respect, the present invention adopts the following technical solution: a dual-swivel head type five-axis machining ion beam polishing device, comprising: Equipment cavity; A vacuum system, connected to the equipment cavity, is used to evacuate the equipment cavity to provide the vacuum environment required for processing; An ion source, located inside the equipment cavity, is used to emit an ion beam to polish the workpiece. The first rotating module has its output end connected to the ion source and is used to drive the ion source to rotate around the first rotating axis. The second rotating module has its output end connected to the first rotating module and is used to drive the first rotating module and the ion source to rotate together around the second rotating axis. The first rotating axis and the second rotating axis are not parallel. A three-axis moving mechanism, the output of which is connected to the second rotating module, is used to drive the second rotating module, the first rotating module, and the ion source to move together in three mutually perpendicular directions; and The control system is connected to the three-axis moving mechanism, the second rotating module and the first rotating module respectively. The control system is used to coordinate and control the movement of the three-axis moving mechanism, the second rotating module and the first rotating module to adjust the spatial position of the ion source and the incident angle of the ion beam.

[0009] As an optional implementation of the above technical solution, the first rotation axis and the second rotation axis are perpendicular to each other, the first rotation axis is set along the Y-axis, and the second rotation axis is set along the X-axis; the rotation angle range of the first rotation module is greater than 90°, and the rotation angle range of the second rotation module is greater than 90°; the first rotation module and the second rotation module cooperate with each other to make the beam of the ion source point to cover the hemispherical space.

[0010] As an optional implementation of the above technical solution, it also includes a beam detection device, which is used to collect the beam parameters of the ion beam and transmit them to the control system.

[0011] As an optional implementation of the above technical solution, the beam detection device is a Faraday cup.

[0012] As an optional implementation of the above technical solution, it also includes a probe, which is used to acquire the position and shape information of the workpiece and feed the position and shape information of the workpiece back to the control system in real time; the control system generates a five-axis linkage machining trajectory based on the position and shape information of the workpiece, and uses the machining trajectory to control the movement of the ion source, so that the ion beam is incident along the normal direction of the workpiece surface and maintains a constant machining distance to perform scanning and polishing processing on the workpiece; the machining trajectory includes the displacement of the three-axis moving mechanism corresponding to each machining point and the rotation angle of the second rotating module and the first rotating module.

[0013] As an optional implementation of the above technical solution, the three-axis moving mechanism includes an X-axis linear motion module, a Y-axis linear motion module, and a Z-axis linear motion module, which are stacked sequentially.

[0014] As an optional implementation of the above technical solution, the X-axis linear motion module, Y-axis linear motion module and Z-axis linear motion module all adopt linear guide rails and lead screw transmission mechanisms in conjunction with servo motors to achieve linear motion.

[0015] As an optional implementation of the above technical solution, both the first rotating module and the second rotating module use direct drive motors to achieve rotational motion.

[0016] On the other hand, the present invention adopts the following technical solution: a working method of a dual-swivel-head five-axis machining ion beam polishing device, comprising the following steps: The workpiece is clamped in the processing position inside the equipment cavity, and the vacuum system is activated to bring the equipment cavity to the preset vacuum level. Scan the workpiece surface, establish the workpiece coordinate system, calibrate the installation error, and obtain the workpiece's position and shape information; Based on the position and shape information of the workpiece, a five-axis linkage machining trajectory is generated. The machining trajectory includes the displacement of the three-axis moving mechanism corresponding to each machining point and the rotation angle of the second rotating module and the first rotating module. The ion source is activated, and the three-axis moving mechanism, the second rotating module and the first rotating module are controlled to operate in conjunction with each other according to the processing trajectory, so that the ion beam is incident along the normal direction of the workpiece surface and the processing distance is kept constant to perform scanning and polishing of the workpiece. After polishing, the workpiece is removed for surface shape inspection, and the result determines whether to proceed to the next round of iterative processing.

[0017] As an optional implementation of the above technical solution, during the scanning polishing process, the beam current parameters of the ion beam are collected in real time. When the beam current parameters deviate from the preset range, the working parameters of the ion source are adjusted or an alarm signal is issued. The position and morphology information of the workpiece are periodically detected, and the workpiece coordinate system is corrected in real time according to the detection results to compensate for the position drift caused by thermal deformation or vibration.

[0018] The beneficial effects of this invention are as follows: 1. By setting up a first rotating module and a second rotating module, and installing the ion source at the output end of the first rotating module, the first rotating module at the output end of the second rotating module, and the second rotating module at the output end of the three-axis moving mechanism, a double-swinging-head rotational motion of the ion source based on three-dimensional spatial translation is achieved. The control system, through five-axis linkage, can adjust the spatial position of the ion source and the beam injection angle in real time, eliminating the processing blind spots of traditional three-axis equipment and meeting the polishing requirements of various planar, spherical, aspherical, concave-convex, and irregularly shaped optical components.

[0019] 2. The rotation angle range of both the first and second rotating modules is greater than 90°, and their cooperation allows the beam direction of the ion source to cover the hemispherical space, providing ample freedom for adjusting the ion beam incident angle. For the bottom or sidewall areas of deeply concave workpieces, the ion beam can be irradiated at a suitable angle through the coordinated adjustment of the two rotating modules, ensuring uniform polishing of the entire surface of the workpiece.

[0020] 3. By setting up a beam detection device, real-time acquisition and monitoring of beam parameters are realized. The control system can adjust the ion source working parameters or issue an alarm in a timely manner based on the real-time feedback of beam parameters, ensuring the stability of the ion beam state and the repeatability of the processing results during the polishing process, and avoiding changes in removal rate and surface shape errors caused by beam fluctuations.

[0021] 4. The probe can acquire the position and shape information of the workpiece before processing, and data acquisition can be completed without removing the workpiece from the equipment cavity, avoiding multiple clamping errors and efficiency losses caused by offline detection. The control system automatically generates a five-axis linkage machining trajectory based on the scan data, including the three-axis displacement and dual rotary axis angles at each machining point, realizing fully automated machining and greatly improving machining efficiency and accuracy controllability.

[0022] 5. By scanning to establish the workpiece coordinate system, calibrating installation errors, generating a five-axis linkage machining trajectory, performing constant-distance polishing along the trajectory in the normal direction, and iterative processing, a complete closed loop of ion beam processing technology is formed, enabling the equipment to polish various optical components and fully leveraging the advantages of non-contact and high-precision ion beam polishing technology. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of a dual-swivel-head five-axis machining ion beam polishing device from one perspective in one embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of a dual-swivel-head five-axis machining ion beam polishing device from another perspective in one embodiment of the present invention; Figure 3 This is a schematic diagram of the internal structure of a dual-swivel-head five-axis machining ion beam polishing device according to one embodiment of the present invention; Figure 4 This is a schematic diagram of the internal structure of a three-axis moving mechanism in one embodiment of the present invention.

[0024] In the diagram: 1-Equipment cavity; 2-Vacuum system; 3-Ion source; 4-First rotating module; 5-Second rotating module; 6-Three-axis moving mechanism; 7-Faraday cup; 8-Probe; 61-X-axis linear motion module; 62-Y-axis linear motion module; 63-Z-axis linear motion module. Detailed Implementation

[0025] like Figures 1-4 As shown, this embodiment provides a dual-swivel type five-axis machining ion beam polishing device, including a device cavity 1, a vacuum system 2, an ion source 3, a first rotating module 4, a second rotating module 5, a three-axis moving mechanism 6, and a control system.

[0026] like Figure 1 and Figure 2 As shown, the equipment cavity 1 is a sealed container used to provide the enclosed space required for ion beam processing. The vacuum system 2 is connected to the equipment cavity 1 and is used to evacuate the equipment cavity 1 to provide the vacuum environment required for ion beam processing, preventing energy loss due to collisions and scattering of the ion beam with gas molecules during transmission. Specifically, the vacuum system 2 includes components such as a mechanical pump, a molecular pump, and a vacuum gauge. The vacuum system 2 maintains the internal gas pressure of the equipment cavity 1 at 10... -3 The vacuum level is below Pa to meet the vacuum conditions required for the normal operation of the ion beam.

[0027] An ion source 3 is located inside the equipment cavity 1 and is used to emit an ion beam to polish the workpiece. The output end of the first rotating module 4 is connected to the ion source 3, meaning the ion source 3 is fixedly mounted on the rotating output end of the first rotating module 4. The first rotating module 4 drives the ion source 3 to rotate around a first rotating axis. The output end of the second rotating module 5 is connected to the first rotating module 4, meaning the first rotating module 4 is entirely fixedly mounted on the rotating output end of the second rotating module 5. The second rotating module 5 drives the first rotating module 4 and the ion source 3 mounted on it to rotate together around a second rotating axis. The first and second rotating axes are not parallel, forming a double-swivel head structure.

[0028] In a preferred implementation, the first rotation axis and the second rotation axis are perpendicular to each other, with the first rotation axis positioned along the Y-axis and the second rotation axis positioned along the X-axis. Both the first rotation module 4 and the second rotation module 5 can be driven precisely by direct-drive motors. The rotation angle range of the first rotation module 4 is greater than 90°, and the rotation angle range of the second rotation module 5 is also greater than 90°. The first rotation module 4 and the second rotation module 5 work together to direct the beam of the ion source 3 to cover the hemispherical space. Through the coordinated movement of the two rotation modules, this invention allows the ion beam to be directed from any direction within the hemispherical area to the workpiece surface, providing a sufficient range of incident angle adjustment for curved surface processing.

[0029] The output end of the three-axis moving mechanism 6 is connected to the second rotating module 5, meaning the second rotating module 5 is fixedly mounted on the moving output end of the three-axis moving mechanism 6. The three-axis moving mechanism 6 is used to drive the second rotating module 5, the first rotating module 4, and the ion source 3 to move together along three mutually perpendicular directions (i.e., the X-axis, Y-axis, and Z-axis directions). Figure 4 As shown, specifically, the three-axis motion mechanism 6 includes an X-axis linear motion module 61, a Y-axis linear motion module 62, and a Z-axis linear motion module 63. These modules are stacked sequentially, with one module mounted on the moving platform of another, forming a serial three-dimensional motion structure. Each linear motion module uses a linear guide rail and a lead screw drive mechanism in conjunction with a servo motor to achieve linear motion. The linear guide rail ensures the straightness and load-bearing capacity of the movement direction, while the lead screw drive mechanism converts the rotational motion of the motor into high-precision linear displacement. Specifically, the lead screw drive mechanism includes a motor, a lead screw, and a lead screw slider. The lead screw and lead screw slider are threadedly connected, and the motor drives the lead screw to rotate, causing the lead screw slider to slide along the linear guide rail.

[0030] The control system is connected to the three-axis moving mechanism 6, the second rotating module 5 and the first rotating module 4 respectively. The control system is used to coordinate and control the movement of the three-axis moving mechanism 6, the second rotating module 5 and the first rotating module 4, so as to realize the five-axis linkage of the ion source 3 in space, so as to adjust the spatial position of the ion source 3 and the incident angle of the ion beam relative to the workpiece surface.

[0031] To enable real-time monitoring of the ion beam state, the polishing equipment also includes a beam current detection device. This device collects beam current parameters (such as beam density and beam uniformity) and transmits them to the control system. As a preferred implementation, the beam current detection device is a Faraday cup 7. The Faraday cup 7 measures beam current intensity by collecting the charge in the ion beam, and it features a simple structure and accurate measurement.

[0032] like Figure 3As shown, to achieve automated scanning and processing trajectory planning of the workpiece, the polishing equipment also includes a probe 8, which is located at the output end of the first rotating module 4 and remains fixed relative to the ion source 3. The probe 8 scans the workpiece surface and obtains its position and shape information. Based on this information, the control system generates a five-axis linkage processing trajectory. This trajectory includes the displacement (X, Y, Z coordinate values) of the three-axis moving mechanism 6 corresponding to each processing point, as well as the rotation angles of the second rotating module 5 and the first rotating module 4. The control system uses this trajectory to control the movement of the ion source 3, thereby causing the ion beam to be incident along the normal direction of the workpiece surface and maintaining a constant processing distance for scanning and polishing. Normal direction incident means that at each processing point, the direction of the ion beam coincides with the normal direction of the workpiece surface at that point, ensuring the consistency of the removal function; a constant processing distance ensures the stability of the material removal rate.

[0033] This embodiment also provides a working method for a dual-swivel-head five-axis machining ion beam polishing device, including the following steps: Step 1: Clamp the workpiece to be processed in the processing position within the equipment cavity 1 (e.g., fix it on a rotatable worktable). Start the vacuum system 2 to evacuate the equipment cavity 1 until the vacuum level inside the cavity meets the requirements for ion beam processing.

[0034] Step 2: Use probe 8 to scan and measure the surface of the workpiece, establish the workpiece coordinate system, calibrate the installation error, and obtain the position and shape information of the workpiece.

[0035] Step three: The control system generates a five-axis linkage machining trajectory based on the workpiece's position and shape information. In the machining trajectory, for each machining point on the workpiece surface, the control system calculates the spatial coordinates (X, Y, Z values) of that point and the direction vector of the surface normal at that point. Then, based on the normal direction vector, it inversely solves for the required rotation angles of the first rotating module 4 and the second rotating module 5, ensuring that the ion beam's direction coincides with the normal direction at that point, while maintaining a constant distance between the ion source 3 outlet and the workpiece surface. Thus, the machining trajectory includes the displacement of the three-axis moving mechanism 6 at each machining point and the rotation angles of the two rotating modules.

[0036] Step four: The control system activates ion source 3, which emits an ion beam. Following the processing trajectory, the control system synchronously coordinates the X-axis linear motion module 61, Y-axis linear motion module 62, Z-axis linear motion module 63, first rotary module 4, and second rotary module 5 for five-axis linkage. Driven by the three-axis moving mechanism 6, ion source 3 moves point-by-point along the workpiece surface. Simultaneously, driven by the first rotary module 4 and second rotary module 5, the direction of the ion beam is adjusted at each processing point to align with the normal direction of the workpiece surface at that point. The ion beam is incident on the workpiece surface in the normal direction, removing material point-by-point through physical sputtering, achieving surface shaping and polishing. During polishing, the beam current detection device continuously collects the beam current parameters of the ion beam and transmits the detection data to the control system in real time. When the beam current parameters deviate from the preset range, such as a decrease in beam current intensity or an increase in fluctuation, the control system can promptly adjust the operating parameters of ion source 3 (such as accelerating voltage, emission current, etc.) to restore beam current stability or issue an alarm signal to notify the operator. In addition, the probe 8 periodically detects the position and shape information of the workpiece, and corrects the workpiece coordinate system in real time based on the detection results to compensate for position drift caused by thermal deformation or vibration.

[0037] Step 5: After polishing, turn off ion source 3, ventilate equipment cavity 1, and remove the workpiece for surface shape inspection. Based on the inspection results, if the surface shape accuracy does not meet the requirements, the next round of iterative processing can be performed, i.e., re-scanning, generating a new trajectory, and polishing again, until the surface shape meets the index requirements.

[0038] When processing concave mirrors, the control system coordinates the linear motion of the X-axis linear motion module 61, the Y-axis linear motion module 62, and the Z-axis linear motion module 63 to enable the ion source 3 to scan and polish the workpiece surface. At the same time, the rotational motion of the first rotation module 4 and the second rotation module 5 adjusts the incident angle of the ion beam in real time, ensuring that the ion beam is always incident along the normal direction of the workpiece, thus ensuring that the processing distance remains constant and avoiding the TIF variation problem caused by the incident angle deflection of traditional three-axis equipment.

[0039] When machining a convex mirror, since the curvature direction of the workpiece surface is opposite to that of the concave surface, the control system adjusts the rotation strategy of the first rotating module 4 and the second rotating module 5 to deflect the ion beam outward from the top of the workpiece while maintaining normal incidence. Based on the workpiece's position and shape information, the control system calculates the normal vector of each machining point in real time, and obtains the height compensation amount of the Z-axis and the rotation angles of the first rotating module 4 and the second rotating module 5 through inverse kinematics. This drives the corresponding axes to move, thereby maintaining a constant machining distance throughout the scanning process.

[0040] For processing scenarios involving freeform surfaces or other irregularly shaped optical elements, three-axis equipment cannot adapt because the surface normal vector of the irregularly shaped element varies greatly in different places. However, the five-axis equipment of this invention can cover the required incident angle range at all parts of the workpiece surface with the large-range rotation capability of the first rotation module 4 and the second rotation module 5, thus achieving full-range, blind-spot-free processing.

[0041] Compared with the prior art, the present invention has the following advantages: 1. By setting up a first rotating module 4 and a second rotating module 5, and installing the ion source 3 at the output end of the first rotating module 4, the first rotating module 4 at the output end of the second rotating module 5, and the second rotating module 5 at the output end of the three-axis moving mechanism 6, a double-swinging-head rotational motion of the ion source 3 based on three-dimensional spatial translation is achieved. The control system, through five-axis linkage, can adjust the spatial position and beam injection angle of the ion source 3 in real time, eliminating the processing blind spots of traditional three-axis equipment and meeting the polishing requirements of various planar, spherical, aspherical, concave-convex, and irregularly shaped optical components.

[0042] 2. The rotation angle range of both the first rotating module 4 and the second rotating module 5 is greater than 90°, and their cooperation allows the beam direction of the ion source 3 to cover the hemispherical space, providing sufficient freedom for adjusting the incident angle of the ion beam. For the bottom or side wall areas of deeply concave workpieces, the ion beam can be irradiated at a suitable angle through the coordinated adjustment of the two rotating modules, so that the entire surface of the workpiece can be uniformly polished.

[0043] 3. By setting up a beam detection device, real-time acquisition and monitoring of beam parameters are realized. The control system can adjust the working parameters of ion source 3 or issue an alarm in a timely manner based on the real-time feedback of beam parameters, ensuring the stability of the ion beam state and the repeatability of the processing results during the polishing process, and avoiding changes in removal rate and surface shape errors caused by beam fluctuations.

[0044] 4. The probe 8 can acquire the position and shape information of the workpiece before processing, and data acquisition can be completed without removing the workpiece from the equipment cavity 1, avoiding multiple clamping errors and efficiency losses caused by offline detection. The control system automatically generates a five-axis linkage machining trajectory based on the scan data, which includes the three-axis displacement and dual rotation axis angles at each machining point, realizing fully automated machining and greatly improving machining efficiency and accuracy controllability.

[0045] 5. By scanning to establish the workpiece coordinate system, calibrating installation errors, generating a five-axis linkage machining trajectory, performing constant-distance polishing along the trajectory in the normal direction, and iterative processing, a complete closed loop of ion beam processing technology is formed, enabling the equipment to polish various optical components and fully leveraging the advantages of non-contact and high-precision ion beam polishing technology.

[0046] In the description of this invention, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. They can refer to fixed connections, detachable connections, or integral connections; they can be mechanical or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this invention. Furthermore, the specific features and structures described in the embodiments are included in at least one implementation method. Those skilled in the art can combine features from different implementation methods without contradiction. The scope of protection of this invention is not limited to the specific implementation methods described above. Based on the basic technical concept of this invention, implementation methods that can be conceived by those skilled in the art without creative effort are all within the scope of protection of this invention.

Claims

1. A dual-swivel-head five-axis machining ion beam polishing device, characterized in that, include: Equipment cavity (1); Vacuum system (2), connected to equipment cavity (1), is used to evacuate equipment cavity (1) to provide the vacuum environment required for processing; An ion source (3) is set inside the equipment cavity (1) and is used to emit an ion beam to polish the workpiece. The first rotating module (4) has its output end connected to the ion source (3) and is used to drive the ion source (3) to rotate around the first rotating axis. The second rotating module (5) has its output end connected to the first rotating module (4) and is used to drive the first rotating module (4) and the ion source (3) to rotate together around the second rotating axis. The first rotating axis and the second rotating axis are not parallel. The three-axis moving mechanism (6) has its output end connected to the second rotating module (5) and is used to drive the second rotating module (5), the first rotating module (4), and the ion source (3) to move together in three mutually perpendicular directions; and The control system is connected to the three-axis moving mechanism (6), the second rotating module (5) and the first rotating module (4) respectively. The control system is used to coordinate and control the movement of the three-axis moving mechanism (6), the second rotating module (5) and the first rotating module (4) to adjust the spatial position of the ion source (3) and the incident angle of the ion beam.

2. The dual-swivel-head five-axis machining ion beam polishing equipment according to claim 1, characterized in that, The first rotation axis and the second rotation axis are perpendicular to each other. The first rotation axis is set along the Y-axis and the second rotation axis is set along the X-axis. The rotation angle range of the first rotation module (4) is greater than 90° and the rotation angle range of the second rotation module (5) is greater than 90°. The first rotation module (4) and the second rotation module (5) cooperate with each other to make the beam direction of the ion source (3) cover the hemispherical space.

3. The dual-swivel-head five-axis machining ion beam polishing equipment according to claim 1, characterized in that, It also includes a beam detection device, which is used to collect the beam parameters of the ion beam and transmit them to the control system.

4. The dual-swivel-head five-axis machining ion beam polishing equipment according to claim 3, characterized in that, The beam detection device is a Faraday cup (7).

5. The dual-swivel-head five-axis machining ion beam polishing equipment according to claim 1, characterized in that, It also includes a probe (8), which is used to acquire the position and shape information of the workpiece and feed the position and shape information of the workpiece back to the control system in real time. Based on the position and shape information of the workpiece, the control system generates a five-axis linkage machining trajectory and uses the machining trajectory to control the movement of the ion source (3), so that the ion beam is incident along the normal direction of the workpiece surface and maintains a constant machining distance to perform scanning and polishing processing on the workpiece. The machining trajectory includes the displacement of the three-axis moving mechanism (6) corresponding to each machining point and the rotation angle of the second rotating module (5) and the first rotating module (4).

6. The dual-swivel-head five-axis machining ion beam polishing equipment according to claim 1, characterized in that, The three-axis moving mechanism (6) includes an X-axis linear motion module (61), a Y-axis linear motion module (62), and a Z-axis linear motion module (63), which are stacked sequentially.

7. The dual-swivel-head five-axis machining ion beam polishing equipment according to claim 6, characterized in that, The X-axis linear motion module (61), Y-axis linear motion module (62) and Z-axis linear motion module (63) all use linear guide rails and lead screw transmission mechanisms in conjunction with servo motors to achieve linear motion.

8. The dual-swivel-head five-axis machining ion beam polishing equipment according to claim 1, characterized in that, Both the first rotating module (4) and the second rotating module (5) use direct drive motors to achieve rotational motion.

9. A method for operating a dual-swivel-head five-axis machining ion beam polishing apparatus as described in any one of claims 1-8, characterized in that, Includes the following steps: The workpiece is clamped in the processing position inside the equipment cavity (1), and the vacuum system (2) is started to make the equipment cavity (1) reach the preset vacuum level; Scan the workpiece surface, establish the workpiece coordinate system, calibrate the installation error, and obtain the workpiece's position and shape information; Based on the position and shape information of the workpiece, a five-axis linkage machining trajectory is generated. The machining trajectory includes the displacement of the three-axis moving mechanism (6) corresponding to each machining point and the rotation angle of the second rotating module (5) and the first rotating module (4). Start the ion source (3), control the three-axis moving mechanism (6), the second rotating module (5) and the first rotating module (4) to operate in conjunction with the processing trajectory, so that the ion beam is incident along the normal direction of the workpiece surface and the processing distance is kept constant to perform scanning and polishing of the workpiece. After polishing, the workpiece is removed for surface shape inspection, and the result determines whether to proceed to the next round of iterative processing.

10. The working method of the dual-swivel-head five-axis machining ion beam polishing equipment according to claim 9, characterized in that, During the scanning polishing process, the beam current parameters of the ion beam are collected in real time. When the beam current parameters deviate from the preset range, the working parameters of the ion source (3) are adjusted or an alarm signal is issued. The position and morphology information of the workpiece are periodically detected, and the workpiece coordinate system is corrected in real time according to the detection results to compensate for the position drift caused by thermal deformation or vibration.

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