A dot matrix infrared temperature measurement and 3D camera fusion three-dimensional temperature measurement device

Abstract

The application relates to the technical field of infrared temperature measurement and three-dimensional measurement, in particular to a dot-matrix infrared temperature measurement and 3D camera fusion three-dimensional temperature measurement device. The device comprises a shell and integrated dot-matrix infrared temperature measurement module, three-dimensional acquisition module, synchronous control module, data processing module and communication interface module in the shell, the dot-matrix infrared temperature measurement module outputs two-dimensional pixel coordinates and temperature values of each temperature measurement point; the three-dimensional acquisition module outputs three-dimensional coordinates of feature points; the two modules are rigidly fixed, the fields of view are coincident, and the baselines are fixed; the synchronous control module controls synchronous exposure and data acquisition of the two modules; the data processing module establishes one-to-one correspondence between the temperature measurement points and the three-dimensional feature points through calibration parameters, and generates three-dimensional point cloud data with temperature labels.

Description

Technical Field

[0001] This application relates to the field of infrared temperature measurement and three-dimensional measurement technology, and more specifically, to a three-dimensional temperature measurement device that integrates dot matrix infrared temperature measurement with a 3D camera. Background Technology

[0002] As a non-contact temperature measurement method, matrix infrared thermometry has advantages such as fast response speed, strong real-time performance, and the ability to acquire temperature information from multiple points simultaneously. It has been widely used in industrial equipment monitoring, power line inspection, medical diagnosis, and security monitoring. Compared with single-point infrared thermometers, matrix infrared thermometry devices can provide area temperature distribution information. Compared with infrared thermal imagers, it has lower cost, smaller data volume, and lower power consumption, and has unique application value in temperature measurement scenarios with medium spatial resolution. As a major manufacturing country and energy consumer, my country has a huge demand for efficient and accurate temperature measurement tools for industrial equipment condition monitoring and power facility safety operation and maintenance. The market prospects for matrix infrared thermometry devices are broad.

[0003] However, existing dot matrix infrared temperature measurement devices have long faced the prominent problems of "temperature measurement without location and difficulty in tracing anomalies" in engineering applications. Dot matrix infrared temperature measurement devices can only output the two-dimensional pixel coordinates and corresponding temperature values ​​of each temperature measurement point, and cannot determine the specific location of each temperature measurement point in three-dimensional space. When the surface of the measured target has curvature changes, the measurement angle changes, or the temperature measurement target is a complex three-dimensional structure, the correspondence between the two-dimensional pixel coordinates and the actual spatial position is distorted, making it impossible to accurately locate and trace the temperature anomaly point in three-dimensional space. This defect seriously restricts the promotion of dot matrix infrared temperature measurement technology in high-end application scenarios such as precision industrial inspection, three-dimensional temperature field reconstruction, and equipment fault spatial diagnosis.

[0004] In recent years, the integration of infrared thermometry with 3D sensing technology has become an important development direction in this field. Some solutions have attempted to use infrared thermal imagers in a discrete combination with 3D scanners or depth cameras, achieving data fusion of temperature data and 3D point clouds through software algorithms. However, in such discrete combination solutions, the infrared thermometry module and the 3D acquisition module lack rigid connection and precise field-of-view alignment design. The coordinate transformation relationship between the two is unstable as the relative positions of the devices change, requiring cumbersome on-site calibration before each use. This fails to meet the requirements of convenience and reliability for industrial applications. Furthermore, existing fusion technologies... The solution lacks a high-precision synchronization control mechanism between the infrared temperature measurement module and the 3D acquisition module. There is a time deviation of milliseconds or even seconds between the two acquisition times, resulting in misalignment between temperature data and 3D spatial data in time. For dynamic or quasi-dynamic targets such as moving parts on conveyor belts and rotating equipment, the time deviation will introduce significant spatial position errors, which will seriously affect the accuracy of the measurement results. In addition, there is no solution in the existing technology that integrates the dot matrix infrared temperature measurement module with various types of 3D acquisition modules into a unified architecture design. Different application scenarios require the development of different hardware platforms, resulting in high product iteration and scenario adaptation costs and long cycles.

[0005] Therefore, there is an urgent need for a device that can deeply integrate dot matrix infrared temperature measurement with three-dimensional sensing technology. Through an integrated, rigidly connected, spatiotemporally synchronized, and unified architecture hardware design, it can achieve precise correspondence between each infrared temperature measurement point and three-dimensional coordinates, improve the dual accuracy of temperature measurement and spatial positioning, and expand the application scenarios of dot matrix infrared temperature measurement technology. Summary of the Invention

[0006] In view of this, in order to solve the above-mentioned problems in the prior art, this application provides a three-dimensional temperature measurement device that integrates dot matrix infrared thermometry with a 3D camera.

[0007] The embodiments of this application are implemented as follows: This application provides a three-dimensional temperature measurement device that integrates dot matrix infrared temperature measurement with a 3D camera, including a housing, a dot matrix infrared temperature measurement module, a three-dimensional acquisition module, a synchronization control module, a data processing module, and a communication interface module: The dot matrix infrared temperature measurement module is disposed inside the housing and is used to collect the dot matrix temperature information of the target being measured and output the two-dimensional pixel coordinates and corresponding temperature value of each temperature measurement point. The three-dimensional acquisition module is installed inside the housing and is used to acquire the three-dimensional depth information of the target under test and output the three-dimensional coordinates of the feature points. The synchronization control module is electrically connected to the dot matrix infrared temperature measurement module and the three-dimensional acquisition module respectively, and is used to control the dot matrix infrared temperature measurement module and the three-dimensional acquisition module to synchronously expose and synchronously acquire data. The data processing module is electrically connected to the dot matrix infrared temperature measurement module, the three-dimensional acquisition module and the synchronization control module respectively. It is used to receive temperature data and three-dimensional depth data, establish a one-to-one correspondence between each infrared temperature measurement point and three-dimensional feature points through preset calibration parameters, and generate three-dimensional point cloud data with temperature labels. The communication interface module is electrically connected to the data processing module and is used to output the processed data to an external device. The dot matrix infrared temperature measurement module and the three-dimensional acquisition module are rigidly connected, with their fields of view overlapping and baseline distances fixed.

[0008] In one possible implementation, the three-dimensional acquisition module is a 3D structured light module, which includes a VCSEL infrared dot matrix emitter, an infrared CMOS camera, and a depth calculation chip. The VCSEL infrared dot matrix emitter operates in the 940nm band and is used to project coded speckle or regular dot matrix onto the surface of the target under test. The infrared CMOS camera is used to capture images of light spot deformation. The depth calculation chip is used to calculate three-dimensional coordinates using triangulation.

[0009] In one possible implementation, the three-dimensional acquisition module is a TOF three-dimensional depth module, which includes a near-infrared floodlight emitter, a TOF depth sensor, and a depth calculation chip. The near-infrared floodlight emitter operates in the 850nm or 940nm band and is used to project near-infrared floodlight onto the surface of the target under test. The array-type TOF depth sensor is used to detect the time difference of light flight. The depth calculation chip is used to calculate three-dimensional coordinates using a time-of-flight ranging algorithm.

[0010] In one possible implementation, the 3D acquisition module is a passive binocular stereo camera, which includes a left infrared camera, a right infrared camera and a binocular stereo matching chip, and has no infrared projection source. The left infrared camera and the right infrared camera are used to simultaneously acquire left and right views of the target under test; The binocular stereo matching chip is used to calculate the left and right parallax and combine it with triangulation to solve the three-dimensional coordinates. The baseline distance between the left infrared camera and the right infrared camera is 50mm to 100mm.

[0011] In one possible implementation, the 3D acquisition module is an active binocular module, which includes a left infrared camera, a right infrared camera, a VCSEL infrared speckle projector, and a depth calculation chip. The VCSEL infrared speckle projector is used to project coded speckle to supplement the target texture; The left infrared camera and the right infrared camera are used to simultaneously acquire left and right views; The depth calculation chip is used to calculate three-dimensional coordinates by combining parallax calculation and pattern distortion analysis.

[0012] In one possible implementation, the synchronization control module controls the dot matrix infrared temperature measurement module and the three-dimensional acquisition module to have a synchronization error of less than 1 μs for synchronous exposure and synchronous data acquisition.

[0013] In one possible implementation, a visible light RGB camera is also included, integrated inside the housing and electrically connected to the data processing module, for acquiring visible light images of the target under test; The data processing module is also used to overlay the temperature information with the visible light image for display.

[0014] In one possible implementation, the housing is provided with a heat dissipation structure, a protective glass, and a filter; The protective glass is set at the acquisition end of the dot matrix infrared temperature measurement module and the three-dimensional acquisition module to protect the internal modules and ensure normal light transmission. The filter is positioned in front of the acquisition end of the dot matrix infrared temperature measurement module to filter out interference from external light on the infrared temperature measurement.

[0015] In one possible implementation, the communication interface module includes a USB-C interface, a Wi-Fi module, and a Bluetooth module.

[0016] In one possible implementation, the data processing module is further configured to perform noise reduction and temperature field reconstruction processing on the temperature-labeled 3D point cloud data.

[0017] The technical solution provided in this application can achieve at least the following beneficial effects: This application provides a three-dimensional temperature measurement device that integrates a dot-matrix infrared temperature measurement module and a 3D camera. By rigidly connecting the dot-matrix infrared temperature measurement module and the 3D acquisition module within the same housing and ensuring overlapping fields of view, the coordinate transformation relationship between the two remains stable throughout the device's lifespan. Only one calibration at the factory is required to meet the full lifespan needs, completely solving the problems of unstable coordinate transformation and repeated on-site calibration required in discrete combination schemes. This achieves a long-term, stable, and accurate correspondence between each infrared temperature measurement point and the 3D coordinates. Simultaneously, a synchronization control module uses hardware triggering to control the synchronous exposure and data acquisition of the dot-matrix infrared temperature measurement module and the 3D acquisition module, controlling the synchronization error within 1μs. This ensures precise alignment of temperature data and 3D depth data in the time dimension, avoiding spatial deviations introduced by data misalignment, making it particularly suitable for high-precision measurement of dynamic or quasi-dynamic targets. Furthermore, the data processing module calls preset calibration parameters to map the two-dimensional pixel coordinates of each infrared temperature measurement point to 3D space, generating 3D point cloud data with temperature labels, ensuring that each temperature measurement point... Each point possesses precise three-dimensional spatial coordinates, enabling accurate three-dimensional spatial tracing of temperature anomalies. This fundamentally solves the technical challenge of dot-matrix infrared thermometry, which "measuring temperature but not accurately pinpointing location." Furthermore, by calculating the normal vector and curvature of each temperature measurement point based on three-dimensional coordinates, and automatically correcting the emissivity of each point according to a preset normal / curvature-emissivity correspondence, the temperature value is compensated and calibrated point-by-point. This achieves adaptive emissivity compensation, eliminating the need for manual emissivity setting and completely removing temperature deviations caused by emissivity setting errors in traditional infrared thermometry methods, significantly improving measurement accuracy. During this process, a three-dimensional reconstruction algorithm is used to process the compensated and calibrated three-dimensional point cloud data with temperature labels, generating a three-dimensional temperature field model of the target. This model allows for interactive operations such as rotation, scaling, and sectioning, intuitively displaying the spatial temperature distribution of the target. It enables three-dimensional spatial tracing and visual analysis of hot / cold points, expanding the application boundaries of dot-matrix infrared thermometry technology in multiple fields such as industrial precision inspection, power equipment inspection, medical precision temperature measurement, and complex outdoor scenarios.

[0018] Furthermore, this application is compatible with four types of 3D acquisition modules: 3D structured light, area array TOF, passive binoculars, and active binoculars. The calibration and data processing procedures are independent of the module type and highly universal. Only the depth calculation logic of the corresponding module needs to be adapted. A single hardware architecture and algorithm can cover a variety of application scenarios, such as short-range high precision, medium-to-long-range, outdoor strong light, and indoor weak texture. This significantly reduces the R&D costs and cycle of product iteration and scenario adaptation. At the same time, the passive binoculars and TOF solutions reduce hardware costs, while the active binoculars solution takes into account the adaptability to strong light and weak texture. This forms a product matrix that covers different working conditions and can flexibly respond to diverse market demands. It has significant industrial practical value and industrialization prospects. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of a three-dimensional temperature measurement device that integrates dot matrix infrared thermometry with a 3D camera, as shown in an exemplary embodiment of this application. Figure 2 This is a schematic diagram of signal processing of a three-dimensional temperature measurement device that integrates dot matrix infrared thermometry with a 3D camera, as shown in an exemplary embodiment of this application.

[0021] Figure label: 1. Housing; 2. Dot matrix infrared temperature measurement module; 3. 3D acquisition module; 4. Synchronization control module; 5. Data processing module; 6. Communication interface module; 7. Visible light RGB camera; 8. Heat dissipation structure; 9. Protective glass; 10. Filter; 11. Mounting bracket; 12. Acquisition window; 13. Front face; 14. Rear face; 15. Side surface. Detailed Implementation

[0022] To make the objectives, implementation methods and advantages of this application clearer, the exemplary implementation methods of this application will be clearly and completely described below with reference to the accompanying drawings of the exemplary embodiments of this application. Obviously, the exemplary embodiments described are only some embodiments of this application, and not all embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0023] It should be noted that the brief descriptions of terms in this application are only for the convenience of understanding the embodiments described below, and are not intended to limit the embodiments of this application. Unless otherwise stated, these terms should be understood in their ordinary and common meaning.

[0024] The terms "first," "second," "third," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar or related objects or entities, and do not necessarily imply a specific order or sequence, unless otherwise specified. It should be understood that such terms are interchangeable where appropriate.

[0025] The terms “comprising” and “having”, and any variations thereof, are intended to cover but not exclude inclusion, for example, a product or device that includes a range of components is not necessarily limited to all of the components that are clearly listed, but may include other components that are not clearly listed or that are inherent to such product or device.

[0026] Next, the technical solutions of this application and how they solve the aforementioned technical problems will be described in detail through embodiments and in conjunction with the accompanying drawings. The embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this application.

[0027] In one exemplary embodiment, such as Figure 1 and Figure 2 As shown, a three-dimensional temperature measurement device integrating dot matrix infrared temperature measurement and a 3D camera is provided. In this embodiment, the device may include a housing 1, a dot matrix infrared temperature measurement module 2, a three-dimensional acquisition module 3, a synchronization control module 4, a data processing module 5, and a communication interface module 6. The dot matrix infrared temperature measurement module 2 is disposed inside the housing 1 and is used to collect the dot matrix temperature information of the target being measured and output the two-dimensional pixel coordinates and corresponding temperature value of each temperature measurement point. The three-dimensional acquisition module 3 is disposed inside the housing 1 and is used to acquire the three-dimensional depth information of the target under test and output the three-dimensional coordinates of the feature points. The synchronization control module 4 is electrically connected to the dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3 respectively, and is used to control the dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3 to synchronously expose and synchronously acquire data. The data processing module 5 is electrically connected to the dot matrix infrared temperature measurement module 2, the three-dimensional acquisition module 3 and the synchronization control module 4 respectively. It is used to receive temperature data and three-dimensional depth data, establish a one-to-one correspondence between each infrared temperature measurement point and three-dimensional feature points through preset calibration parameters, and generate three-dimensional point cloud data with temperature labels. The communication interface module 6 is electrically connected to the data processing module 5 and is used to output the processed data to an external device. The dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3 are rigidly connected, with their fields of view overlapping and their baseline distance fixed.

[0028] In one embodiment, the three-dimensional temperature measurement device that integrates dot matrix infrared temperature measurement with a 3D camera includes a housing 1, a dot matrix infrared temperature measurement module 2, a three-dimensional acquisition module 3, a synchronous control module 4, a data processing module 5, and a communication interface module 6.

[0029] The housing 1 is made of aluminum alloy or magnesium alloy by CNC machining or die casting, which has good structural strength and heat dissipation performance. The housing 1 is rectangular or cylindrical in shape, with the preferred size of 120mm×80mm×60mm, which is convenient for hand-held or fixed installation. The front face 13 of the housing 1 has multiple acquisition windows 12, which are respectively set to the acquisition end of the dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3. The interior of the housing 1 has multiple mounting cavities and fixing brackets for accommodating and fixing the various functional modules.

[0030] The dot matrix infrared temperature measurement module 2 is housed inside the housing 1. Its acquisition end is exposed through the acquisition window 12 on the front face 13 of the housing 1 or optically connected to the outside through the protective glass 9. The dot matrix infrared temperature measurement module 2 is used to acquire the dot matrix temperature information of the target being measured and outputs the two-dimensional pixel coordinates (u_ir, v_ir) and the corresponding temperature value T_i for each temperature measurement point.

[0031] The core component of the dot matrix infrared temperature measurement module 2 is a thermopile sensor array or a microbolometer array. As a preferred embodiment, the dot matrix infrared temperature measurement module 2 uses a 16×16 thermopile sensor array with a total of 256 temperature measurement points, a field of view of 60°×60°, an operating wavelength of 8μm to 14μm, a temperature measurement range of -20℃ to 300℃, and a temperature measurement accuracy of ±2℃. As other optional embodiments, the dot matrix size of the dot matrix infrared temperature measurement module 2 can also be selected as 8×8, 32×32, or other specifications according to actual application requirements. This invention does not limit this.

[0032] The dot matrix infrared temperature measurement module 2 also integrates a signal conditioning circuit and an analog-to-digital conversion circuit. The signal conditioning circuit is used to amplify and filter the weak analog signal output by the thermopile sensor array. The analog-to-digital conversion circuit is used to convert the conditioned analog signal into a digital signal and output it to the data processing module 5 through the internal bus. The data format output by the dot matrix infrared temperature measurement module 2 is: the two-dimensional pixel coordinates (u_ir, v_ir) of each temperature measurement point and its corresponding temperature value T_i, where u_ir and v_ir represent the row coordinates and column coordinates of the temperature measurement point in the infrared image, respectively, and T_i represents the temperature value of the point.

[0033] The three-dimensional acquisition module 3 is located inside the housing 1. Its acquisition end is exposed through the acquisition window 12 on the front face 13 of the housing 1 or optically connected to the outside through the protective glass 9. The three-dimensional acquisition module 3 is used to acquire the three-dimensional depth information of the target under test and output the three-dimensional coordinates (X,Y,Z) of the feature points.

[0034] The 3D acquisition module 3 can be implemented using a variety of different technical approaches, including but not limited to 3D structured light modules, area array TOF 3D depth modules, passive binocular stereo cameras, and active binocular modules. The 3D acquisition modules 3 using different technical approaches may differ in their specific structures, but their core function is to acquire the coordinate information of the surface feature points of the target being measured in 3D space.

[0035] The three-dimensional coordinates (X, Y, Z) output by the three-dimensional acquisition module 3 are defined in a three-dimensional spatial coordinate system with the device itself as the origin. The X-axis and Y-axis form a plane parallel to the imaging plane of the device, and the Z-axis extends along the optical axis of the device.

[0036] The dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3 are rigidly connected, with their fields of view overlapping and baseline distances fixed.

[0037] The term "rigid connection" refers to the fact that the dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3 are fixedly connected inside the same housing 1 by means of an integrated bracket, screw fixing, or optical bonding. During use, the relative position and orientation of the two remain unchanged. As a preferred embodiment, the dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3 are fixed inside the housing 1 by an integrated aluminum alloy bracket. The bracket is precision machined to ensure that the parallelism error of the optical axes of the two is less than 0.1°, and the baseline distance between the optical centers of the two is 50mm. The rigid connection design ensures that the spatial coordinate transformation relationship between the dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3 remains stable for a long time after the device is manufactured. Only one collaborative calibration needs to be completed at the factory to meet the subsequent use requirements, and no recalibration is required before use.

[0038] The term "field of view overlap" refers to the design matching of the field of view angles of the dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3, ensuring that their acquisition areas basically cover the same spatial range. As a preferred implementation, the field of view angle of the dot matrix infrared temperature measurement module 2 is 60°×60°, and the field of view angle of the three-dimensional acquisition module 3 is 60°×45° (horizontal×vertical). The two have the same field of view angle in the horizontal direction, while the field of view angle of the three-dimensional acquisition module 3 is slightly smaller in the vertical direction. This ensures that the acquisition area of ​​the three-dimensional acquisition module 3 completely falls within the field of view range of the dot matrix infrared temperature measurement module 2, thereby ensuring that each infrared temperature measurement point has corresponding three-dimensional coordinate information.

[0039] The so-called "fixed baseline distance" means that the spatial distance between the optical center of the dot matrix infrared temperature measurement module 2 and the optical center of the three-dimensional acquisition module 3 is fixed after the device is manufactured. The fixed baseline distance ensures the stability of the binocular / multi-view geometric relationship and is the basis for subsequent coordinate mapping and three-dimensional reconstruction accuracy.

[0040] The synchronous control module 4 is electrically connected to the dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3 respectively, and is used to control the synchronous exposure and synchronous data acquisition of the dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3.

[0041] The core of the synchronization control module 4 is a hardware trigger signal generator, which can be implemented using a field-programmable gate array (FPGA) or a complex programmable logic device (CPLD). The synchronization control module 4 triggers the dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3 to start exposure and data acquisition simultaneously through a synchronous trigger signal, ensuring that both acquire the temperature information and three-dimensional depth information of the target at the same time. The synchronization error of the synchronization control module 4 is less than 1μs.

[0042] For implementations that use a passive binocular stereo camera or an active binocular module as the 3D acquisition module 3, the synchronization control module 4 also needs to simultaneously trigger the left infrared camera and the right infrared camera to work synchronously with the dot matrix infrared temperature measurement module 2 to ensure the timing consistency of multiple sensors.

[0043] The data processing module 5 is electrically connected to the dot matrix infrared temperature measurement module 2, the three-dimensional acquisition module 3 and the synchronous control module 4 respectively. It is used to receive temperature data and three-dimensional depth data, establish a one-to-one correspondence between each infrared temperature measurement point and the three-dimensional feature point through preset calibration parameters, and generate three-dimensional point cloud data (T_i,X_i,Y_i,Z_i) with temperature labels.

[0044] The data processing module 5 can be implemented using an embedded processor (such as the ARM Cortex-A series), a digital signal processor (DSP), or a field-programmable gate array (FPGA). As a preferred implementation, the data processing module 5 uses an ARM Cortex-A55 quad-core processor with a main frequency of 1.8GHz, equipped with 2GB DDR4 RAM and 8GB eMMC storage space, which can meet the needs of real-time data processing and storage.

[0045] The data processing module 5 pre-stores the extrinsic parameter matrix (rotation matrix R, translation vector T) and intrinsic parameter parameters (focal length, principal point, distortion coefficient) obtained from factory calibration. During actual measurement, the data processing module 5 receives the two-dimensional pixel coordinates (u_ir, v_ir) and temperature values ​​T_i (i=1,2,…,N) of N temperature measurement points output by the dot matrix infrared temperature measurement module 2, as well as the M three-dimensional coordinate points (X_j,Y_j,Z_j) (j=1,2,…,M, M≥N) output by the three-dimensional acquisition module 3. The data processing module 5 maps the two-dimensional pixel coordinates of each infrared temperature measurement point to three-dimensional space through the extrinsic parameter matrix and intrinsic parameter parameters, and matches the three-dimensional coordinates (X_i,Y_i,Z_i) corresponding to each temperature measurement point from the M three-dimensional coordinate points to generate N three-dimensional point cloud data (T_i,X_i,Y_i,Z_i) with temperature labels. The nearest neighbor algorithm is preferred for coordinate matching to improve matching efficiency and accuracy.

[0046] The data processing module 5 can also perform noise reduction and temperature field reconstruction on 3D point cloud data with temperature labels.

[0047] The communication interface module 6 is electrically connected to the data processing module 5 and is used to output the processed data to an external device. The communication interface module 6 includes a USB-C interface, a Wi-Fi module, and a Bluetooth module.

[0048] The data output by the communication interface module 6 includes three-dimensional temperature point cloud data (such as PCD or PLY format), temperature data (such as CSV format), and visualization images (such as JPG or PNG format). External devices can be personal computers, tablets, smartphones, industrial control systems, or cloud servers, etc.

[0049] In one embodiment, when the 3D acquisition module 3 is a 3D structured light module, it includes a VCSEL infrared dot matrix emitter, an infrared CMOS camera, and a depth calculation chip.

[0050] VCSEL Infrared Dot Array Emitter: The VCSEL (Vertical-Cavity Surface-Emitting Laser) infrared dot array emitter operates in the 940nm band and is used to project coded speckle or regular dot patterns onto the surface of the target. The 940nm band is located in the near-infrared region, near the strong absorption band of the solar spectrum, and has strong resistance to ambient light interference. The VCSEL infrared dot array emitter consists of a VCSEL chip array, a collimating optical system, and diffractive optical elements (DOE). The VCSEL chip array emits an infrared laser beam, which is collimated by the collimating optical system and then formed into a preset coded speckle pattern or regular dot pattern by the diffractive optical elements, and projected onto the surface of the target. The coded speckle pattern has a high degree of randomness and uniqueness, which facilitates subsequent pattern matching and 3D reconstruction.

[0051] Infrared CMOS camera: The infrared CMOS camera is used to capture images of light spot deformation projected onto the surface of the target being measured. The preferred resolution of the infrared CMOS camera is 1280×1024, the frame rate is 30fps, the pixel size is 3.75μm×3.75μm, and the response band covers 940nm. The front end of the infrared CMOS camera is equipped with a narrowband filter 10 with a center wavelength of 940nm and a half width at half maximum (WWHM) of 10nm, which is used to filter out non-940nm band components in the ambient light and improve the signal-to-noise ratio.

[0052] Depth computing chip: The depth computing chip is used to solve three-dimensional coordinates using triangulation. Its working principle is as follows: The coded speckle pattern projected by the VCSEL infrared dot array emitter deforms on the surface of the target being measured. The degree of deformation is related to the depth (i.e., distance) of the target surface. The infrared CMOS camera captures the deformed speckle pattern. The depth computing chip compares and matches the captured speckle pattern with the speckle pattern on the reference plane, calculates the parallax displacement of each speckle, and combines the baseline distance between the emitter and the camera with the triangulation principle to solve the three-dimensional coordinates (X, Y, Z) of each feature point.

[0053] The 3D structured light module is suitable for close-range (0.3m to 2m) and high-precision measurement scenarios, with a depth accuracy of ±1mm@1m, making it suitable for applications such as industrial precision inspection, face recognition, and 3D object modeling.

[0054] In one embodiment, when the 3D acquisition module 3 is a TOF 3D depth module, it includes a near-infrared floodlight emitter, a TOF depth sensor, and a depth calculation chip.

[0055] Near-infrared floodlight emitter: The operating wavelength of the near-infrared floodlight emitter is 850nm or 940nm. It is used to project near-infrared floodlight onto the surface of the target being measured. The near-infrared floodlight emitter is composed of a VCSEL array or a laser diode (LD) in conjunction with a diffuser. It can emit uniform planar near-infrared light, covering the entire field of view. Unlike structured light modules, TOF modules do not need to project specific coded patterns, but instead project uniform floodlight.

[0056] Area-array TOF depth sensor: The area-array TOF depth sensor is used to detect the time-of-flight difference of light. The area-array TOF depth sensor is a CMOS sensor with VGA resolution (640×480) or QVGA resolution (320×240). Each pixel can independently detect the time of flight of the light signal. Its working principle is as follows: a near-infrared floodlight emitter emits a short pulse (nanosecond level) of near-infrared light to the surface of the target being measured. After the light is reflected by the target surface, it returns to the area-array TOF depth sensor. The sensor detects the time difference Δt between the emitted pulse and the received pulse, and calculates the distance value corresponding to each pixel according to the formula d=c×Δt / 2 (where c is the speed of light).

[0057] Depth computing chip: The depth computing chip is used to calculate three-dimensional coordinates through the time-of-flight ranging algorithm. The depth computing chip receives the time-of-flight data of each pixel output by the area array TOF depth sensor. After calibration, noise reduction and coordinate transformation, it outputs the three-dimensional coordinates (X,Y,Z) corresponding to each pixel. The depth measurement range of the TOF module is usually 0.2m to more than 10m, and the depth accuracy is about ±2cm@3m, which is suitable for medium and long distance measurement scenarios.

[0058] The area array TOF 3D depth module has strong anti-interference ability against ambient light, making it suitable for measurement applications under complex lighting conditions such as industrial sites and outdoors. In addition, the module structure is relatively simple and the cost is low, which is conducive to mass production and implementation.

[0059] In one embodiment, when the 3D acquisition module 3 is a passive binocular stereo camera, it includes a left infrared camera, a right infrared camera and a binocular stereo matching chip, and has no infrared projection source.

[0060] Left and right infrared cameras: Both the left and right infrared cameras are infrared CMOS cameras used to simultaneously acquire left and right views of the target being measured. The preferred resolution for both cameras is VGA (640×480) or higher, with a frame rate of 30fps. Each camera has an infrared bandpass filter 10 at its front end, operating at 850nm or 940nm, used to filter out visible light interference. The baseline distance between the left and right infrared cameras is 50mm to 100mm, preferably 80mm, suitable for mid-range measurement scenarios (0.3m to 5m). A larger baseline distance results in higher depth measurement accuracy, but also a larger blind zone; a baseline distance of 50mm to 100mm achieves a good balance between measurement accuracy and measurement range.

[0061] Binocular Stereo Matching Chip: The binocular stereo matching chip is used to calculate the 3D coordinates by combining the left and right disparities with triangulation. Its working principle is as follows: A left infrared camera and a right infrared camera simultaneously acquire left and right views of the target object, respectively. The binocular stereo matching chip performs stereo matching on the two images, finding the corresponding point of each pixel in the left view in the right view, and calculating the horizontal disparity d between them. According to the triangulation principle, the relationship between depth Z and disparity d is Z = f × B / d, where f is the camera focal length and B is the baseline distance. Based on this, the binocular stereo matching chip calculates the 3D coordinates (X, Y, Z) of each feature point.

[0062] Passive binocular stereo cameras do not require active light source emission, have low power consumption, and are suitable for outdoor strong light environments and battery-powered portable applications. Their depth measurement accuracy is greatly affected by the richness of the target surface texture. For targets with sparse texture (such as white walls, smooth surfaces, etc.), the accuracy of stereo matching will decrease.

[0063] In one embodiment, when the 3D acquisition module 3 is an active binocular module, it includes a left infrared camera, a right infrared camera, a VCSEL infrared speckle projector, and a depth calculation chip.

[0064] VCSEL Infrared Speckle Projector: The VCSEL infrared speckle projector is used to project coded speckles to supplement the target texture. The VCSEL infrared speckle projector operates in the 940nm band and consists of a VCSEL chip array and diffractive optical elements. It can project high-density, high-randomness infrared speckle patterns onto the surface of the target being measured. Unlike the 3D structured light module, the VCSEL infrared speckle projector in the active binocular module is only used to "inject" artificial textures into the target surface to improve the accuracy of binocular stereo matching, rather than relying solely on speckle deformation for depth calculation.

[0065] Left and right infrared cameras: The left and right infrared cameras are used to simultaneously acquire left and right views. The structure, parameters and baseline distance of the two infrared cameras are similar to those of a passive binocular stereo camera, and will not be described in detail here.

[0066] Depth computing chip: The depth computing chip is used to solve 3D coordinates by combining parallax calculation and pattern distortion analysis. The depth computing chip of the active binocular module integrates two depth calculation strategies: On the one hand, it performs binocular stereo matching by acquiring left and right views from left and right infrared cameras, calculates parallax, and obtains 3D coordinates based on triangulation (i.e., passive binocular method); on the other hand, it analyzes the deformation of the speckle pattern projected by the VCSEL infrared speckle projector on the target surface to assist in correcting the depth value (i.e., structured light method). The two methods complement and verify each other, which has both the robustness of passive binocular in strong light environment and the adaptability of structured light on weak textured surface, and is suitable for complex indoor and outdoor scenes.

[0067] The active binocular module combines the advantages of passive binoculars in resisting strong light and adapting to weak textures under structured light, further expanding the applicable scenarios of the device.

[0068] In one embodiment, the synchronization control module 4 controls the dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3 to be exposed and acquire data synchronously, with a synchronization error of less than 1μs.

[0069] To achieve high-precision synchronization at the microsecond level, the synchronization control module 4 adopts a hardware triggering method instead of a software triggering method. Specifically, the core of the synchronization control module 4 is an FPGA or CPLD, which integrates a high-precision clock source (temperature-compensated crystal oscillator TCXO with frequency stability better than ±1ppm) and a pulse generator. The synchronization control module 4 simultaneously triggers the exposure start time of the dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3 through a hardware synchronization signal (such as a TTL level pulse). The rising or falling edge of the hardware synchronization signal arrives at the trigger input terminals of the two modules at the same time, with a transmission delay difference of less than 100ns.

[0070] For the dot matrix infrared temperature measurement module 2, the synchronous trigger signal starts the signal integration and readout process of the thermopile sensor array; for the three-dimensional acquisition module 3, the synchronous trigger signal starts the exposure and readout process of the infrared CMOS camera (or area array TOF depth sensor). Since the acquisition actions of all modules are started by the same hardware trigger signal, the data acquisition times of each module are highly aligned in time, and the synchronization error is less than 1μs.

[0071] The high-precision synchronization mechanism ensures accurate temporal alignment between temperature data and 3D depth data. For static targets, the impact of time alignment error is relatively small; however, for dynamic or quasi-dynamic targets (such as moving parts on conveyor belts, rotating machinery, mobile robots, etc.), time deviation will directly lead to spatial misalignment between temperature data and 3D spatial data. A synchronization error within 1μs can control this spatial misalignment within the sub-millimeter level, meeting the accuracy requirements of most industrial application scenarios.

[0072] In one embodiment, the three-dimensional temperature measurement device that integrates dot matrix infrared thermometry with a 3D camera also includes a visible light RGB camera 7, which is integrated inside the housing 1 and electrically connected to the data processing module 5 for acquiring visible light images of the target being measured.

[0073] The visible light RGB camera 7 uses a color CMOS image sensor with a preferred resolution of 1920×1080 (full HD) or higher and a frame rate of 30fps. The acquisition end of the visible light RGB camera 7 is exposed through the acquisition window 12 on the front face 13 of the housing 1 or through the protective glass 9 to be optically connected to the outside world. The optical axis of the visible light RGB camera 7 is parallel to the optical axis of the dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3 to ensure that the field of view of each module is basically consistent.

[0074] The visible light image acquired by the visible light RGB camera 7 is transmitted to the data processing module 5. The data processing module 5 is also used to overlay the temperature information with the visible light image for display. Specifically, the data processing module 5 maps the two-dimensional pixel coordinates of the infrared temperature measurement point to the image coordinate system of the visible light RGB camera 7 through calibration parameters. The temperature value is marked at the corresponding position of each temperature measurement point in the form of pseudo-color, digital label or contour line, etc., to form a fused image of temperature information and visible light image. The fused image not only retains the high-resolution texture details of the visible light image (facilitating scene recognition and target positioning), but also intuitively displays the temperature distribution of the measured target (facilitating temperature anomaly detection), making it easy for operators to quickly understand the measurement results.

[0075] The introduction of the visible light RGB camera 7 also helps to overlay texture information on the three-dimensional temperature field model, generate a colored three-dimensional temperature field model, and further improve the visualization effect.

[0076] In one embodiment, the housing 1 is provided with a heat dissipation structure 8, a protective glass 9, and a filter 10.

[0077] Heat dissipation structure 8: Heat dissipation structure 8 is disposed on the outer surface or inside the housing 1 to conduct the heat generated by the operation of the various modules and components inside the device to the external environment, preventing the device from affecting the measurement accuracy or shortening its service life due to overheating. As a preferred embodiment, heat dissipation structure 8 consists of multiple heat dissipation fins (heat dissipation fins) disposed on the rear end face 14 of the housing 1. The heat dissipation fins are integrally formed with the housing 1 or bonded by thermally conductive adhesive. The material is aluminum alloy, with a large heat dissipation area and high thermal conductivity. As another preferred embodiment, heat dissipation structure 8 may also include thermally conductive pads or heat pipes disposed inside the housing 1 to conduct the heat of devices with high heat generation (such as the processor of the data processing module 5, depth computing chip, etc.) to the surface of the housing 1, and then dissipate it into the air through the heat dissipation fins. For embodiments with high power consumption, heat dissipation structure 8 may also include a micro fan to further improve heat dissipation efficiency through forced convection.

[0078] Protective glass 9: Protective glass 9 is set at the acquisition end of the dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3. It is used to protect the internal modules and ensure normal light transmission. The protective glass 9 is made of high-transmittance infrared optical glass or crystal material (such as silicon wafer, germanium wafer, zinc sulfide, etc.). It has high light transmittance (>90%) in the working wavelength band of the dot matrix infrared temperature measurement module 2 (8μm to 14μm) and the working wavelength band of the three-dimensional acquisition module 3 (850nm or 940nm). The protective glass 9 is fixed to the acquisition window 12 of the front end face 13 of the housing 1 by sealing ring or glue. It has the functions of dustproof, waterproof and scratch-proof, and the protection level can reach IP65 or higher.

[0079] Filter 10: Filter 10 is disposed in front of the acquisition end of the dot matrix infrared temperature measurement module 2 to filter the interference of external light on infrared temperature measurement. Specifically, filter 10 is a long-pass filter 10 or a band-pass filter 10, which only allows infrared radiation of the working wavelength band (8μm to 14μm) of the dot matrix infrared temperature measurement module 2 to pass through, while blocking visible light, near-infrared light and other wavelengths of light from entering the temperature measurement module. Filter 10 can be disposed independently in front of the acquisition end of the dot matrix infrared temperature measurement module 2, or it can be integrated with the protective glass 9 (i.e., an infrared filter film layer is deposited on the surface of the protective glass 9). The setting of filter 10 effectively reduces the interference of ambient light (especially the infrared component in sunlight) on infrared temperature measurement, and improves the temperature measurement accuracy and environmental adaptability.

[0080] In one embodiment, the communication interface module 6 includes a USB-C interface, a Wi-Fi module, and a Bluetooth module to meet the data transmission needs of different application scenarios.

[0081] USB-C Interface: The USB-C interface is a wired communication interface that supports USB 3.0 or higher protocols, with data transfer rates up to 5Gbps or higher. The USB-C interface features a reversible design for easy use and supports plug-and-play functionality. Through the USB-C interface, devices can be directly connected to personal computers, tablets, or industrial control terminals to achieve high-speed data transfer and real-time data streaming. The USB-C interface also supports the PowerDelivery (PD) fast charging protocol, allowing devices to be powered and charged through the same interface, simplifying power management.

[0082] Wi-Fi Module: The Wi-Fi module is a wireless communication interface that supports IEEE 802.11ac or 802.11ax (Wi-Fi 5 or Wi-Fi 6) protocols. It operates on the 2.4GHz and 5GHz frequency bands. The Wi-Fi module can be used to connect the device to a local area network or the Internet, enabling wireless data transmission with remote servers, cloud platforms, or mobile terminals. Through the Wi-Fi module, the device can upload three-dimensional temperature point cloud data, temperature data, and visualization images to the cloud in real time for storage and analysis, facilitating remote monitoring and centralized management.

[0083] Bluetooth Module: The Bluetooth module is a short-range wireless communication interface that supports Bluetooth 5.0 or higher protocols, including Bluetooth Low Energy (BLE) functionality. The Bluetooth module is mainly used for short-range wireless communication with mobile terminals such as smartphones and tablets, making it convenient for operators to view measurement data and control device operation in real time through mobile terminal APP. The Bluetooth module has low power consumption and is suitable for realizing data interaction between the device and the mobile terminal in portable application scenarios.

[0084] The data formats output by the communication interface module 6 include, but are not limited to: 3D point cloud data (PCD or PLY format), temperature data (CSV format), 3D temperature field visualization image (JPG or PNG format), and fused image of temperature and visible light superimposed. Users can choose the appropriate data format and transmission method according to their actual needs.

[0085] In one embodiment, the data processing module 5 is further used to perform noise reduction and temperature field reconstruction processing on the temperature-labeled 3D point cloud data (T_i,X_i,Y_i,Z_i).

[0086] Noise Reduction: During the acquisition process, 3D point cloud data is inevitably affected by various noises, including sensor noise, ambient light noise, and quantization noise. The purpose of noise reduction is to filter out these noises and improve the quality and accuracy of the point cloud data. As a preferred implementation, data processing module 5 uses a statistical outlier removal algorithm for noise reduction: For each point in the point cloud, the average distance between it and its K neighboring points (K = 50) is calculated. If this average distance exceeds the global average distance plus n times the standard deviation (n = 1.0 to 2.0), the point is identified as an outlier and removed. Alternatively, data processing module 5 can also use a radius outlier removal algorithm: For each point, if the number of neighboring points within its radius R (R = 2mm to 5mm) is less than a preset threshold (e.g., 3), the point is identified as a noise point and removed. The noise-reduced point cloud data is smoother and more accurate, which is beneficial for subsequent temperature field reconstruction and visualization analysis.

[0087] Temperature field reconstruction processing: Temperature field reconstruction processing refers to processing temperature-labeled 3D point cloud data using 3D reconstruction algorithms to generate a 3D temperature field model of the target object. 3D reconstruction algorithms can be implemented using various methods, including but not limited to: (1) Poisson Reconstruction: Based on the normal vector information of the point cloud, the implicit surface is reconstructed by solving the Poisson equation. Then, the isosurface mesh is extracted by the Moving Cubes algorithm to generate a three-dimensional surface model of the target. The temperature label is then mapped onto the model surface to form a three-dimensional temperature field model.

[0088] (2) Delaunay triangulation: Delaunay triangulation is performed on the 3D point cloud to generate a triangular mesh model. The temperature value is then assigned as a vertex attribute to each vertex of the triangular mesh. The temperature distribution of the entire mesh surface is obtained by interpolation between vertices.

[0089] (3) Moving Least Squares (MLS) surface reconstruction: Smooth surfaces are generated by local weighted least squares fitting, which is suitable for targets with high point cloud density and relatively smooth surfaces.

[0090] The generated three-dimensional temperature field model can perform interactive operations such as rotation, scaling, and sectioning, and intuitively display the spatial temperature distribution of the measured target. This allows operators to observe and analyze the temperature distribution characteristics from any angle, enabling precise spatial tracing of hot / cold spots. The data from the three-dimensional temperature field model can be output to external devices through the communication interface module 6 for further analysis and visualization.

[0091] In one embodiment, the three-dimensional temperature measurement device that integrates dot matrix infrared temperature measurement with a 3D camera needs to be calibrated at the factory to establish a pixel-level mapping relationship between the dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3. The basic process of factory calibration is briefly described below.

[0092] Prepare a standard blackbody and a high-precision 3D calibration board. Place the standard blackbody at the preset position on the 3D calibration board. The temperature of the standard blackbody is known and adjustable, with a temperature adjustment range of 0℃ to 100℃ and an adjustment interval of 10℃. This is used to provide an accurate temperature reference for the dot matrix infrared temperature measurement module 2. The 3D calibration board has multiple feature points with known three-dimensional coordinates, which are used to provide a spatial reference for the three-dimensional acquisition module 3.

[0093] Fix the measuring device on the bracket and adjust the distance between the device and the 3D calibration plate (select the appropriate distance according to the type of 3D acquisition module 3: 0.3m to 2m for 3D structured light module, 0.2m to 10m or more for TOF module, and 0.3m to 5m for passive binocular and active binocular modules) so that the 3D calibration plate is completely within the field of view of the device.

[0094] The control module 2 collects temperature data of a standard blackbody and infrared dot matrix data of a 3D calibration board, and outputs the two-dimensional pixel coordinates (u_ir, v_ir) of each infrared temperature measurement point; the control module 3 collects depth data of the 3D calibration board and outputs the three-dimensional coordinates (X, Y, Z) of each feature point. The angle between the device and the 3D calibration board is changed (0° to 90°), and the above acquisition operation is repeated to obtain infrared two-dimensional coordinate data and three-dimensional coordinate data under multiple postures.

[0095] The data processing module 5 performs fitting calculations on the dataset under multiple postures, solves the extrinsic parameter matrix (rotation matrix R, translation vector T) and intrinsic parameter (focal length, principal point, distortion coefficient) between the dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3, establishes a one-to-one correspondence between each infrared temperature measurement point (u_ir, v_ir) and the feature points (X, Y, Z) of the three-dimensional acquisition module 3, and stores the calibration parameters in the flash memory of the data processing module 5 for use in actual measurements.

[0096] Since the dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3 are rigidly connected, the calibration parameters remain stable during use and do not need to be recalibrated before use, which greatly improves the convenience of use and the consistency of measurement.

[0097] Working principle: When in use, the operator aligns the device with the target being measured, connects it to an external control terminal (such as a smartphone or PC) via the communication interface module 6, and starts the measurement program.

[0098] The synchronization control module 4 sends a hardware synchronization trigger signal, simultaneously activating the dot matrix infrared temperature measurement module 2 and the three-dimensional acquisition module 3 for synchronous exposure and data acquisition (synchronization error <1μs). The dot matrix infrared temperature measurement module 2 acquires the dot matrix temperature information of the target under test and outputs the two-dimensional pixel coordinates (u_ir, v_ir) and temperature value T_i of N temperature measurement points. The three-dimensional acquisition module 3 acquires the three-dimensional depth information of the target under test and outputs M three-dimensional coordinate points (X_j, Y_j, Z_j) (M≥N).

[0099] Data processing module 5 receives the two sets of data mentioned above, calls the extrinsic and intrinsic parameters obtained from factory calibration, maps the two-dimensional pixel coordinates of each infrared temperature measurement point to three-dimensional space, and matches the three-dimensional coordinates (X_i, Y_i, Z_i) corresponding to each temperature measurement point from M three-dimensional coordinate points to generate three-dimensional point cloud data (T_i, X_i, Y_i, Z_i) with temperature labels. Data processing module 5 also performs noise reduction processing and temperature field reconstruction processing on the point cloud data to generate a three-dimensional temperature field model.

[0100] The visible light RGB camera 7 synchronously acquires visible light images of the target under test, and the data processing module 5 overlays the temperature information with the visible light images to generate a fused image.

[0101] Finally, the data processing module 5 outputs the three-dimensional temperature point cloud data, temperature data, three-dimensional temperature field model and fused image to an external device through the communication interface module 6 (USB-C, Wi-Fi or Bluetooth) to complete the three-dimensional temperature measurement.

[0102] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0103] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A three-dimensional temperature measurement device integrating dot-matrix infrared thermometry and a 3D camera, characterized in that, Includes a housing, a dot matrix infrared temperature measurement module, a 3D acquisition module, a synchronization control module, a data processing module, and a communication interface module: The dot matrix infrared temperature measurement module is disposed inside the housing and is used to collect the dot matrix temperature information of the target being measured and output the two-dimensional pixel coordinates and corresponding temperature value of each temperature measurement point. The three-dimensional acquisition module is installed inside the housing and is used to acquire the three-dimensional depth information of the target under test and output the three-dimensional coordinates of the feature points. The synchronization control module is electrically connected to the dot matrix infrared temperature measurement module and the three-dimensional acquisition module respectively, and is used to control the dot matrix infrared temperature measurement module and the three-dimensional acquisition module to synchronously expose and synchronously acquire data. The data processing module is electrically connected to the dot matrix infrared temperature measurement module, the three-dimensional acquisition module and the synchronization control module respectively. It is used to receive temperature data and three-dimensional depth data, establish a one-to-one correspondence between each infrared temperature measurement point and three-dimensional feature points through preset calibration parameters, and generate three-dimensional point cloud data with temperature labels. The communication interface module is electrically connected to the data processing module and is used to output the processed data to an external device. The dot matrix infrared temperature measurement module and the three-dimensional acquisition module are rigidly connected, with their fields of view overlapping and baseline distances fixed.

2. The three-dimensional temperature measurement device integrating dot-matrix infrared thermometry and a 3D camera as described in claim 1, characterized in that, The three-dimensional acquisition module is a 3D structured light module, which includes a VCSEL infrared dot matrix emitter, an infrared CMOS camera, and a depth calculation chip. The VCSEL infrared dot matrix emitter operates in the 940nm band and is used to project coded speckle or regular dot matrix onto the surface of the target under test. The infrared CMOS camera is used to capture images of light spot deformation. The depth calculation chip is used to calculate three-dimensional coordinates using triangulation.

3. The three-dimensional temperature measurement device integrating dot-matrix infrared thermometry and a 3D camera as described in claim 1, characterized in that, The three-dimensional acquisition module is a planar array TOF three-dimensional depth module, which includes a near-infrared floodlight emitter, a planar array TOF depth sensor, and a depth calculation chip. The near-infrared floodlight emitter operates in the 850nm or 940nm band and is used to project near-infrared floodlight onto the surface of the target under test. The array-type TOF depth sensor is used to detect the time difference of light flight. The depth calculation chip is used to calculate three-dimensional coordinates using a time-of-flight ranging algorithm.

4. The three-dimensional temperature measurement device integrating dot-matrix infrared thermometry and a 3D camera as described in claim 1, characterized in that, The three-dimensional acquisition module is a passive binocular stereo camera, which includes a left infrared camera, a right infrared camera and a binocular stereo matching chip, and has no infrared projection source. The left infrared camera and the right infrared camera are used to simultaneously acquire left and right views of the target under test; The binocular stereo matching chip is used to calculate the left and right parallax and combine it with triangulation to solve the three-dimensional coordinates. The baseline distance between the left infrared camera and the right infrared camera is 50mm to 100mm.

5. The three-dimensional temperature measurement device integrating dot-matrix infrared thermometry and a 3D camera as described in claim 1, characterized in that, The three-dimensional acquisition module is an active binocular module, which includes a left infrared camera, a right infrared camera, a VCSEL infrared speckle projector, and a depth calculation chip. The VCSEL infrared speckle projector is used to project coded speckle to supplement the target texture; The left infrared camera and the right infrared camera are used to simultaneously acquire left and right views; The depth calculation chip is used to calculate three-dimensional coordinates by combining parallax calculation and pattern distortion analysis.

6. The three-dimensional temperature measurement device integrating dot-matrix infrared thermometry and a 3D camera as described in claim 1, characterized in that, The synchronization control module controls the dot matrix infrared temperature measurement module and the three-dimensional acquisition module to have a synchronization error of less than 1μs for synchronous exposure and synchronous data acquisition.

7. The three-dimensional temperature measurement device integrating dot-matrix infrared thermometry and a 3D camera as described in claim 1, characterized in that, It also includes a visible light RGB camera, integrated inside the housing and electrically connected to the data processing module, for acquiring visible light images of the target under test; The data processing module is also used to overlay the temperature information with the visible light image for display.

8. The three-dimensional temperature measurement device integrating dot-matrix infrared thermometry and a 3D camera as described in claim 1, characterized in that, The housing is equipped with a heat dissipation structure, protective glass, and a filter. The protective glass is set at the acquisition end of the dot matrix infrared temperature measurement module and the three-dimensional acquisition module to protect the internal modules and ensure normal light transmission. The filter is positioned in front of the acquisition end of the dot matrix infrared temperature measurement module to filter out interference from external light on the infrared temperature measurement.

9. The three-dimensional temperature measurement device integrating dot-matrix infrared thermometry and a 3D camera as described in claim 1, characterized in that, The communication interface module includes a USB-C interface, a Wi-Fi module, and a Bluetooth module.

10. The three-dimensional temperature measurement device integrating dot-matrix infrared thermometry and a 3D camera as described in claim 1, characterized in that, The data processing module is also used to perform noise reduction and temperature field reconstruction processing on the temperature-labeled 3D point cloud data.

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