Transformer assembly, circuit assembly, and method of manufacturing a transformer assembly

Abstract

Transformer assemblies, circuit assemblies, and methods of manufacturing transformer assemblies are provided. The present disclosure includes one or more novel transformer assemblies that include: a preform component and a first material. The preform component includes: i) a stack of a plurality of transformer windings, and ii) a plurality of conductive paths connected to the plurality of transformer windings in the stack. The first material is disposed (e.g., via injection) in a void of the preform component. The first material encapsulates the stack of the plurality of transformer windings to provide magnetic coupling between the plurality of transformer windings. Additionally, the injected first material provides structural support for the conductive paths and the preform component disposed in the transformer assembly.

Description

Technical Field

[0001] This disclosure relates to transformer components and power converters. Background Technology

[0002] Traditional printed circuit boards (PCBs) are laminated structures that separate conductive layers with insulating layers. Generally, PCBs serve two functions. The first is to mount electronic components to designated locations on the outer layers via soldering. The electronic circuitry instantiated from the filled circuit board is designed to provide one or more specific functions. After manufacturing is complete, the electronic circuitry is powered to perform the desired function.

[0003] Typically, printed circuit boards are planar devices on which multiple components are interconnected via traces to provide the functions described above. This method of fabricating circuitry on planar circuit board assemblies is size-limited.

[0004] Currently, power converter designs typically utilize VRD circuitry, which draws a 12V intermediate voltage from a 48V input rail and mounts it to the motherboard / baseboard. These existing solutions offer higher density and efficiency based on the 12V intermediate voltage rail; however, these solutions combine the 48V input rail to the 12V rail with the 12V to the core voltage using VR modules, resulting in a total loss equal to the sum of the losses from both components.

[0005] Currently, traditional 48V-to-core power converter solutions use a lateral mounting configuration to power the processor. Due to the high additional trace resistance of the PDN circuitry, lateral losses are high when power is supplied from the motherboard to the processor core substrate. Lateral support for the power supply also involves a much higher inductance connected in series with the processor. The high di / dt of current transients that must pass through this series inductor leads to higher transients for the processor. This results in lower efficiency and worsened transients due to the series resistance and inductance. Modern 48V-to-core voltage converters use a lossy series connection for lateral connection. Due to the higher series inductance relative to the load, higher density cannot be achieved, and transient currents require larger capacitors to meet specifications. Summary of the Invention

[0006] Implementing clean energy (or green technologies) is crucial for reducing our human impact on the environment. Generally speaking, clean energy includes any evolving methods and materials used to reduce the overall environmental toxicity of energy consumption.

[0007] This disclosure includes the observation that raw energy, whether from green or non-green sources, typically needs to be converted into a suitable form (such as desired AC or DC voltage) before it can be used to power terminal devices such as servers, computers, and mobile communication devices. Regardless of whether the energy comes from green or non-green sources, the aim is to utilize the raw energy provided by such systems most efficiently to reduce our environmental impact. This disclosure contributes to reducing our carbon footprint (and green energy) through more efficient energy conversion and the circuitry that supports such energy conversion.

[0008] As discussed herein, a manufacturing apparatus produces novel transformer assemblies via prefabricated components and a first material. The prefabricated components include: i) a stack of multiple transformer windings, and ii) connections between the multiple windings in the stack and conductive paths. The first material can be placed (e.g., via injection or other techniques) into the voids of the prefabricated components. The injected first material can be configured to encapsulate the stack of multiple transformer windings to provide magnetic coupling between the multiple transformer windings. Additionally, it is advantageous that the injected first material provides (physical) structural support for the prefabricated components disposed within the transformer assembly.

[0009] In one example, after multiple transformer windings in a stack are directly coupled to multiple conductive paths via a manufacturing apparatus, a first material is injected into the voids of a prefabricated component. The first material injected into the voids of the prefabricated component may include a magnetically conductive material. In this case, the magnetically conductive material provides magnetic coupling between the multiple transformer windings. It should also be noted that the injected first material provides structural support, securing the stack of multiple transformer windings and / or the multiple conductive paths together.

[0010] As needed, the transformer assembly can be configured to include a second material, such as an insulating material that at least partially encapsulates the injected first magnetic material. The second material can be injected into the transformer assembly to provide additional structural support associated with multiple transformer windings and / or multiple conductive paths.

[0011] In yet another example, as previously described, a first material can be injected into the voids of a prefabricated component. In this case, after curing or solidification, the injected first material can be a monolithic block of magnetically conductive material that structurally supports the physical connection between the conductive path and multiple transformer windings.

[0012] Furthermore, the multiple conductive paths of the transformer assembly may be at least partially embedded in the first material. The transformer assembly may also include at least one peripheral surface (such as one or more side surfaces), wherein one or more of the multiple conductive paths are disposed on the at least one peripheral surface.

[0013] According to another example, the transformer assembly may include a top surface and a bottom surface. A first conductive path of a plurality of conductive paths may be configured to extend to the top surface. A second conductive path of a plurality of conductive paths may be configured to extend to the bottom surface. Furthermore, as needed, the first conductive path may be configured to extend axially from the bottom surface to the top surface; the second conductive path may also be configured to extend axially from the bottom surface to the top surface, wherein the second conductive path is arranged in parallel with the first conductive path.

[0014] In another example, the transformer assembly includes a top surface and a bottom surface. The transformer assembly also includes a first surface mount footprint disposed on the top surface and a second surface mount footprint disposed on the bottom surface. The pattern of the first surface mount footprint may be substantially similar to the pattern of the second surface mount footprint, depending on the requirements.

[0015] As further discussed herein, the transformer assembly can be configured to include at least a first side surface disposed between the top and bottom surfaces of the transformer assembly. Multiple conductive paths can be partially or completely embedded in a first material encapsulating the prefabricated component. In this case, the first material injected into the voids and openings in the prefabricated component provides structural support for the connections between the multiple conductive paths in the multiple windings.

[0016] In one example, the transformer assembly includes a first conductive path exposed on a first side surface. The first conductive path can be configured to extend on the first side surface between the top and bottom surfaces of the transformer assembly, if desired. Alternatively, the first conductive path can extend only partially between the top and bottom surfaces.

[0017] Other examples discussed in this paper include implementing transformer assemblies as physical interconnections of multiple conductive paths, such that a stack of multiple transformer windings is an autotransformer.

[0018] In yet another example as discussed herein, the stacked multiple transformer windings may include a first transformer winding fabricated in a first plane and a second transformer winding fabricated in a second plane, the first plane being parallel to the second plane. Multiple conductive paths may be configured to extend orthogonally relative to the first and second planes within the transformer assembly. Prefabricated components may be configured to include multiple insulating layers, such as at least a first insulating material layer, that separate the first and second transformer windings.

[0019] In another example, the first material placed in the gaps of the prefabricated component includes a ferromagnetic material for transmitting magnetic flux associated with multiple transformer windings.

[0020] Another example discussed herein includes a circuit assembly comprising a transformer assembly as previously discussed. The transformer assembly may be configured to include a top surface and a bottom surface. The circuit assembly may also include a first circuit board and a second circuit board, wherein the first circuit board is attached to the top surface of the transformer assembly and the second circuit board is attached to the bottom surface of the transformer assembly.

[0021] In another example, the circuit assembly may be configured to include: a first conductive path extending from the second circuit board to the first circuit board, wherein the first conductive path is used to transmit an input voltage to the first circuit board; and a second conductive path extending from the top surface of the transformer assembly to a first winding of a plurality of windings. The circuit assembly may also include a switching circuit disposed on the first circuit board, wherein the switching circuit is operable to control the transmission of current received from the input voltage through the second conductive path to the first winding.

[0022] Further examples herein include one or more methods of manufacturing a transformer assembly. The method may include a manufacturing apparatus performing the following operations: receiving a prefabricated component comprising gaps and / or openings, the prefabricated component including: i) a stack of multiple transformer windings, and ii) multiple conductive paths connected to the multiple windings in the stack; and placing a first material into the gaps of the prefabricated component, the injected first material encapsulating the stack of multiple transformer windings to provide magnetic coupling between the multiple transformer windings.

[0023] It should be noted that any resources discussed herein may include one or more computerized devices, apparatuses, hardware, etc., that perform and / or support any or all of the methods disclosed herein. In other words, one or more computerized devices or processors may be programmed and / or configured to operate as illustrated herein to perform the different techniques described herein.

[0024] Other aspects of this disclosure include software programs and / or corresponding hardware used to perform any operations outlined above and disclosed in detail below.

[0025] Furthermore, it should be noted that although various features, techniques, configurations, etc., may be discussed in different places within this disclosure, it is intended to indicate that each concept may optionally be implemented independently or in combination with each other, where appropriate. Therefore, one or more of the inventions described herein can be practiced and viewed in many different ways.

[0026] Furthermore, it should be noted that this preliminary discussion of the technology (Summary of the Invention) in this document is intentionally not intended to specifically describe every novel aspect of this disclosure or the claimed invention. Instead, this brief description only presents general aspects and corresponding novel points compared to conventional technology. For further details and / or possible perspectives (permutations and combinations) of the invention, please refer to the Detailed Description section (which is an overview) and corresponding drawings discussed further below in this disclosure. Attached Figure Description

[0027] Figure 1 This is an example diagram illustrating a transformer assembly as discussed herein.

[0028] Figure 2 This is an example three-dimensional diagram illustrating the fabrication of a stack of multiple transformer windings and the connection of these multiple transformer windings with conductive paths to form a prefabricated component as discussed herein.

[0029] Figure 3 This is an example three-dimensional diagram illustrating the manufacture of a transformer assembly as discussed herein.

[0030] Figure 4A This is an example three-dimensional drawing showing a cross-sectional view of a transformer assembly as discussed herein.

[0031] Figure 4B This is an example side view showing a cross-sectional view of a transformer assembly as discussed herein.

[0032] Figure 5A This is an example three-dimensional drawing showing a cross-sectional view of a transformer assembly as discussed herein.

[0033] Figure 5B This is an example side view showing a cross-sectional view of a transformer assembly as discussed herein.

[0034] Figure 6A This is an example three-dimensional drawing showing a cross-sectional view of a transformer assembly as discussed herein.

[0035] Figure 6B This is an example top view showing a cross-sectional view of a transformer assembly as discussed herein.

[0036] Figure 7 This is an example three-dimensional exploded view of the circuit components discussed in this article.

[0037] Figure 8 This is an example side view of the circuit components discussed in this article.

[0038] Figure 9 This is an example diagram illustrating a power converter circuit that implements a transformer assembly to convert an input voltage into an output voltage as discussed herein.

[0039] Figure 10 This illustrates what is discussed in this article. Figure 9 An example timing diagram of the control states of multiple switches in a power converter circuit.

[0040] Figure 11 This is an example method for manufacturing transformer components as discussed in this article.

[0041] The foregoing and other objects, features, and advantages of the subject matter disclosed herein will become apparent from the more specific description herein as illustrated in the accompanying drawings, in which the same reference numerals denote the same parts in different views. The drawings are not necessarily drawn to scale, but rather focus on illustrating principles, concepts, aspects, techniques, etc. Detailed Implementation

[0042] The novel transformer assembly discussed herein comprises a combination of a prefabricated component and at least a first material. The prefabricated component includes: i) a stack of multiple transformer windings, and ii) multiple conductive paths connected to the multiple transformer windings in the stack. The first material is placed (e.g., via injection or other suitable techniques) into the voids of the prefabricated component. The first material encapsulates the stack of multiple transformer windings to provide magnetic coupling between the multiple transformer windings. Additionally, the first material (when cured or after solidification) may also provide structural support to the stack of multiple transformer windings and the multiple conductive paths in the prefabricated component. If necessary, a second material may be injected to encapsulate the injected first material. The presence of the second material encapsulating the first material can protect the first material encapsulating the prefabricated component (the stack of transformer windings).

[0043] Now, more specifically, Figure 1 This is an example diagram illustrating a transformer assembly used in power converters or other types of circuits as discussed herein.

[0044] In this example, manufacturing apparatus 150 produces transformer assembly 110, which includes multiple elements or circuit components, such as a stack 141 of multiple transformer windings, vertically oriented conductive paths (ECPs) 121 (such as conductive paths 121-1, 121-7, etc.), and filler or structural materials, such as one or more of a first magnetic material 131, a second material 132, etc., which provide structural support to keep the components in proper orientation relative to each other.

[0045] As previously described, conductive path 121 may include conductive path 121-1, conductive path 121-7, etc. The conductive path can be made using any suitable conductive material (such as metal or metal alloy) that supports the transmission of current through a low impedance / resistance path.

[0046] It should be noted that each of the conductive paths 121 can be configured to extend between the bottom surface 161 and the top surface 162 of the transformer assembly 110.

[0047] Alternatively, it should be noted that the vertically oriented conductive path provided in the transformer assembly 110 may extend from only one surface of the transformer assembly 110 (such as surface 161, surface 162, etc.) to the middle of the transformer assembly 110, without extending to the opposite surface.

[0048] In another example, material 132 may be the same magnetic material as magnetically conductive material (MPM) 131. Alternatively, material 132 encapsulating magnetically conductive material 131 may be epoxy resin or other suitable material providing encapsulation around material 131, and may provide additional structural support associated with components in transformer assembly 110. Thus, structural support associated with transformer assembly 110 may be provided by one or more of materials 131, materials 132, etc.

[0049] It should also be noted that the transformer assembly 110 can be manufactured in any suitable manner. In one example, combinations of internal elements associated with the transformer assembly 110, such as conductive paths 121 and the stack of transformer windings 141, can be interconnected to produce a prefabricated component 210, after which a manufacturing apparatus 150 places magnetically conductive material into the corresponding gaps and openings in the prefabricated component. Figure 2 Further details of the prefabricated components used to manufacture the transformer assembly 110 are shown in the figure.

[0050] Therefore, further reference Figure 1 The magnetic material 131 (such as ferromagnetic material) and / or the second material 132 (such as insulating or non-conductive material) in the transformer assembly 110 can be configured to structurally prevent movement of internal components of the transformer assembly (such as conductive path 121, stack of transformer windings 141, corresponding connections, etc.).

[0051] Therefore, the magnetic material 131 can be a mesh or molded body of one or more materials (such as magnetic material 131, material 132, etc.) that hold the entire mechanical assembly of the element together.

[0052] In another example, one or more elements associated with the transformer assembly (such as conductive path 121, stack of multiple transformer windings 141, etc.) may be embedded or at least partially embedded in the transformer assembly 110. Specific portions of conductive path 121 may be provided / exposed on the top surface 162, bottom surface 161, and any side surface of the transformer assembly 110.

[0053] As previously discussed, stack 141 can be configured to include insulating material or insulating material (non-conductive material) separating each winding in stack 141. The presence of insulating material between the windings of stack 141 prevents magnetic material 131 or insulating material 132 from being injected into the gaps between the windings in stack 141. This will be discussed in more detail in the following figures.

[0054] Figure 2 This is an example three-dimensional diagram illustrating the fabrication of a stack of multiple transformer windings as discussed herein, and the connection of the multiple transformer windings to the conductive path.

[0055] In one example, manufacturing device 150 or other suitable entity produces, for example... Figure 2 The prefabricated component 210 is shown. In this example, the prefabricated component 210 includes: i) a stack 141 of multiple transformer windings, and ii) multiple conductive paths 121 connected to the multiple windings in the stack 141.

[0056] like Figure 2 As further shown, the prefabricated component 210 can be configured to include a plurality of windings disposed in the stack 141. More specifically, the transformer windings in the stack 141 may include: a first transformer winding W1 manufactured substantially in a first plane (such as a plane parallel to the XZ plane), a second transformer winding W3 manufactured in a second plane (such as a first plane parallel to the XZ plane), a third transformer winding W4 manufactured in a third plane (such as a first plane parallel to the XZ plane), and so on.

[0057] Therefore, the first plane containing the first winding W1 is parallel to the second plane containing the second winding W3, and so on.

[0058] As previously described, the stack 141 in the prefabricated component 210 also includes an insulating layer between the different windings of the stack 141. For example, the stack 141 of windings includes an insulating layer L1 disposed between a first winding W1 and a second winding W3. The insulating layer L1 is any suitable non-conductive material. Therefore, the insulating layer L1 provides isolation between the first transformer winding W1 and the second transformer winding W3.

[0059] Furthermore, it is worth noting that the plurality of conductive paths 121 can be configured to extend orthogonally in the prefabricated component 210 relative to the first plane and the second plane.

[0060] More specifically, each of the conductive paths 121 can be configured to extend axially (parallel to) the Y-axis. For example, as Figure 2 As shown, conductive path 121-1 extends along or parallel to the Y-axis, which is orthogonal to the XZ plane and the corresponding transformer winding.

[0061] Furthermore, it should be noted that each of the multiple windings in stack 141 is electrically connected to multiple conductive paths in prefabricated component 210. For example, winding W1 is connected between conductive path 121-4 and conductive path 121-6; winding W3 is connected between conductive path 121-2 and conductive path 121-4; and so on.

[0062] Further details regarding the connections associated with prefabricated component 210 are discussed below.

[0063] It should also be noted that the prefabricated component 210 includes an opening 220 through the individual windings in the stack 141. The opening 220 may be filled with air. The prefabricated component 210 also includes a void 230 around the stack 141 of windings (such as initially communicating with air).

[0064] The fabrication of the transformer assembly 110, which is further discussed in this paper, provides magnetic coupling between the windings in the stack 141.

[0065] Figure 3 This is an example three-dimensional diagram illustrating the manufacture of a transformer assembly as discussed herein.

[0066] In addition, in this example, the manufacturing apparatus 150 receives the prefabricated component 210 and at least encapsulates the stack 141 of multiple windings, and fills the gaps 230 and the corresponding openings 220 with material 310 (one or more materials).

[0067] In one example, after multiple conductive paths 121 are directly coupled to multiple transformer windings in stack 141, manufacturing apparatus 150 injects a first flowable material (such as material 310) into the voids 230 of prefabricated component 210.

[0068] Alternatively, it should be noted that the manufacturing apparatus 150 or other suitable entity may be configured to encapsulate the windings in the stack 141 before connecting the windings to the corresponding conductive paths 121 disposed on or embedded in the outer periphery of the transformer assembly 110.

[0069] Material 310 can be injected to encapsulate (surround) the stack 141 of windings and fill the opening 220, wherein material 310 is a magnetically conductive material that can be used to provide magnetic coupling between multiple transformer windings in the stack 141.

[0070] Therefore, the manufacturing apparatus 150 can be configured to inject material 310, such as a flowable solid and / or liquid material, into the voids 230 and the openings 220.

[0071] Ultimately, the injected flowable solid-liquid material becomes a solid material, allowing material 310 to provide structural support, fixing the stack of multiple transformer windings relative to the multiple conductive paths (keeping them in place). In this case, the connection of the multiple windings in the stack 141 to the conductive path 121 provides initial structural support. Additionally, injecting or placing material 310 into the voids 230 and openings 220 of the prefabricated component 210 provides further structural support for the final transformer assembly 110.

[0072] The injection of material 310 into the voids and openings of the prefabricated component 210 can be a multi-step process, wherein the manufacturing apparatus 150 first injects a first magnetically conductive material to fill the opening 220 and the void 230 to encapsulate the stack 141. The manufacturing apparatus 150 can be configured to further inject a second material 132 around the injected first material to produce, as required, Figure 3 The transformer assembly 110 is shown. The second material can at least partially encapsulate the first material 131 already injected into the transformer assembly 110.

[0073] Alternatively, the transformer assembly 110 is manufactured by injecting a single magnetically conductive material 310 to fill the voids 230 and openings 220.

[0074] Therefore, transformer assembly 110 can be configured to include one or more materials that provide structural support. In one example, the injected material 310, after curing, becomes or transforms into a monolithic block of magnetically conductive material that structurally supports the physical connection between conductive path 121 and multiple transformer windings in stack 141.

[0075] Furthermore, it should be noted that multiple conductive paths 121 may be at least partially or completely embedded in the material 310, wherein the conductive paths 121 potentially extend between the top surface 162 and the bottom surface 161 of the transformer assembly 110. Additionally, the conductive paths may extend only partially between one surface 161 and the other surface 162 of the transformer assembly 110.

[0076] As previously described, one or more of the conductive paths 121 may include corresponding surfaces exposed relative to the transformer assembly 110. More specifically, the transformer assembly 110 may be configured to include peripheral surfaces 361, 362, 363, etc. At least a portion of conductive path 121-1 may be exposed on surface 362; at least a portion of conductive path 121-2 may be exposed on surface 362; at least a portion of conductive path 121-3 may be exposed on surface 361; at least a portion of conductive path 121-4 may be exposed on surface 361; at least a portion of conductive path 121-5 may be exposed on surface 361; at least a portion of conductive path 121-6 may be exposed on surface 364; at least a portion of conductive path 121-7 may be exposed on surface 364; at least a portion of conductive path 121-8 may be exposed on surface 364; at least a portion of conductive path 121-9 may be exposed on surface 363; and so on.

[0077] As needed, one or more or all of the multiple conductive paths can be configured to extend between the bottom surface 161 and the top surface 162, wherein the axial ends of the conductive paths are exposed for welding.

[0078] For example, the first axial end of conductive path 121-1 is exposed on the bottom surface 161; the second axial end of conductive path 121-1 is exposed on the top surface 162. In this example, conductive path 121-1 represents node PH3.

[0079] The first axial end of conductive path 121-2 (also referred to as node PH2) is exposed on the bottom surface 161; the second axial end of conductive path 121-2 is exposed on the top surface 162. Conductive path 121-2 represents node PH2.

[0080] The first axial end of conductive path 121-3 is exposed on the bottom surface 161; the second axial end of conductive path 121-3 is exposed on the top surface 162. Conductive path 121-3 is configured to carry signal PWM2 (also known as control signal S2).

[0081] The first axial end of conductive path 121-4 is exposed on the bottom surface 161; the second axial end of conductive path 121-4 is exposed on the top surface 162. Conductive path 121-4 is configured to transmit signal Vout.

[0082] The first axial end of conductive path 121-5 is exposed on the bottom surface 161; the second axial end of conductive path 121-5 is exposed on the top surface 162. Conductive path 121-5 is configured to carry signal PWM1 (also known as control signal S1).

[0083] The first axial end of conductive path 121-6 is exposed on the bottom surface 161; the second axial end of conductive path 121-6 is exposed on the top surface 162. Conductive path 121-6 represents node PH1.

[0084] The first axial end of conductive path 121-7 is exposed on the bottom surface 161; the second axial end of conductive path 121-7 is exposed on the top surface 162. Conductive path 121-7 represents node PH4.

[0085] The first axial end of conductive path 121-8 is exposed on the bottom surface 161; the second axial end of conductive path 121-8 is exposed on the top surface 162. Conductive path 121-8 transmits the input voltage Vin from the bottom surface 161 to the top surface 162.

[0086] The first axial end of conductive path 121-9 is exposed on the bottom surface 161; the second axial end of conductive path 121-9 is exposed on the top surface 162. Conductive path 121-9 transmits ground reference 199. In this configuration, current flows from the top surface 162 through conductive path 121-9 to the bottom surface 161.

[0087] In one example, each of the conductive paths 121 is set to be parallel to each other and parallel to the Y-axis. However, the conductive paths 121 can be configured to extend in any suitable one or more directions.

[0088] Figure 4A This is an example three-dimensional drawing showing a cross-sectional view of a transformer assembly as discussed herein.

[0089] In this example, the cross-sectional view of transformer assembly 110 along the X-axis is view 410. Figure 4B The figure shows a cross-sectional view 410 of the transformer assembly 110 along the X-axis.

[0090] Figure 4B This is an example side view showing a cross-sectional view of a transformer assembly as discussed herein.

[0091] As previously mentioned, the windings in stack 141 are separated by corresponding insulating material layers.

[0092] For example, such as Figure 4B As shown in view 410, transformer winding W1 is separated from transformer winding W3 by insulating layer L1; transformer winding W3 is separated from transformer winding W4 by insulating layer L2; and transformer winding W4 is separated from winding W2 by insulating layer L3.

[0093] The corresponding windings in transformer assembly 110 and stack 141 can be configured to include any number of windings and insulation layers.

[0094] Figure 5A This is an example three-dimensional drawing showing a cross-sectional view of a transformer assembly as discussed herein.

[0095] In this example, the cross-sectional view of transformer assembly 110 along the X-axis is view 510. Figure 5B The figure shows a cross-sectional view 510 of the transformer assembly 110 along the X-axis.

[0096] Figure 5B This is an example side view showing a cross-sectional view of a transformer assembly as discussed herein.

[0097] As previously mentioned, the windings in stack 141 are separated by corresponding insulating material layers.

[0098] For example, such as Figure 5B As shown in view 510, transformer winding W1 is separated from transformer winding W3 via insulating layer L1; transformer winding W3 is separated from transformer winding W4 via insulating layer L2; and transformer winding W4 is separated from winding W2 via insulating layer L3.

[0099] The transformer assembly 110 can be configured to include any number of windings and insulation layers in the stack 141.

[0100] As previously mentioned, the axial end W3-1 of winding W3 is directly connected to conductive path 121-1 (PH3). As further discussed in other figures herein, the other axial end W3-2 of winding W3 (see...) Figure 9 It is directly connected to conductive path 121-4.

[0101] The axial end W4-1 of winding W4 is directly connected to conductive path 121-7. As further discussed in other figures herein, the other axial end W4-2 of winding W4 (see...) Figure 9 It is directly connected to conductive path 121-4.

[0102] Figure 6A This is an example three-dimensional drawing showing a cross-sectional view of a transformer assembly as discussed herein.

[0103] In this example, the cross-sectional view of transformer assembly 110 along the Y-axis is view 610. Figure 6B The figure shows a cross-sectional view 610 of the transformer assembly 110 along the Y-axis.

[0104] Figure 6B This is an example top view showing a cross-sectional view of a transformer assembly as discussed herein.

[0105] As shown in the figure, and as previously described, the axial end W1-1 of winding W1 is directly connected to conductive path 121-6 in the prefabricated component 210 of transformer assembly 110. The other axial end W1-2 of winding W1 is directly connected to conductive path 121-4 in the prefabricated component 210 of transformer assembly 110.

[0106] In a similar manner, each winding in stack 141 includes a first terminal connected to a first conductive path of transformer assembly 110 and a second terminal connected to a second conductive path of transformer assembly.

[0107] Figure 7 This is an example three-dimensional exploded view of the circuit components discussed in this article.

[0108] In this example, such as Figure 7 The circuit assembly 700 shown includes a substrate 710, a transformer assembly 110, and a substrate 720.

[0109] The substrate 710 can be configured to include a controller 140 that generates corresponding control signals S1 (PWM1) and S2 (PWM2).

[0110] The transformer assembly 110 provides multiple windings to convert the corresponding input voltage Vin provided by the substrate 710 into an output voltage 123.

[0111] The substrate 720 can be configured to include switching circuits (Q11, Q12, Q13, ..., Q21, Q22, Q23, ...) and corresponding capacitors C1, C2, C3, etc. Figure 7 The corresponding connections of the components shown are in Figure 8 and Figure 9 Further discussion is needed.

[0112] Further reference Figure 7 As previously described, transformer assembly 110 can be configured to include any number of conductive paths 121 extending from bottom surface 161 to top surface 162 of transformer assembly 110.

[0113] In another example, transformer assembly 110 includes a first surface-mount package associated with a first axial end of a conductive path terminating on surface 162. Transformer assembly 110 also includes a second surface-mount package associated with a second axial end of a conductive path 121 terminating on surface 161.

[0114] The presence of a conductive path extending between the bottom surface 161 and the top surface 162 provides a good heat dissipation path for transferring heat from substrate 710 to substrate 720 via conductive path 121. In the opposite direction, conductive path 121 provides a good heat dissipation path for transferring heat from substrate 720 to substrate 710 via conductive path 121.

[0115] In one example, the surface mounting pattern of the first axial end of the conductive path 121 on surface 162 substantially matches or is substantially similar to the surface mounting pattern of the second axial end of the conductive path 121 disposed on the bottom surface 161. As previously described, the conductive path 121 can be embedded in the side surface of the transformer assembly 110. In other words, a plurality of conductive paths 121 can be at least partially embedded in the first material 131 encapsulating the prefabricated component 210. Additionally, one or more of the conductive paths 121 can be exposed on the side surface of the transformer assembly 110.

[0116] Figure 8 This is an example side view of the circuit components discussed in this article.

[0117] In this example, the manufacturing apparatus 150 attaches the bottom surface 761 of the substrate 720 to the top surface 162 of the transformer assembly 110. This may include soldering the axial ends of the conductive paths 121 exposed on surface 162 to corresponding surface mount pads disposed on the bottom surface 761 of the substrate 720. The substrate 720 provides connectivity, such as... Figure 9 Further discussion is needed.

[0118] The manufacturing apparatus 150 attaches the top surface 762 of the substrate 710 to the bottom surface 161 of the transformer assembly 110. This may include soldering the axial ends of the conductive paths 121 exposed on the surface 161 to corresponding pads located on the top surface 762 of the substrate 710.

[0119] As previously described, conductive path 121-8 can be configured to transmit the input voltage Vin from substrate 710 through conductive path 121-8 of transformer assembly 110 to substrate 720, which supplies the input voltage Vin to one or more switches Q11 and Q21.

[0120] like Figure 9 As further shown, the switch controls the current to flow through the winding to convert the input voltage Vin into the corresponding output voltage Vout 123. Therefore, the switching circuit (Q11, Q12, ...) controlled by the controller 140 supports the conversion of the input voltage into an output voltage supplied to the load 118 through the conductive paths 121-4.

[0121] Figure 9This is an example diagram illustrating a power converter circuit that implements a transformer assembly as discussed herein for converting an input voltage into an output voltage.

[0122] In this example, transformer assembly 110 is implemented in a corresponding power converter 900. As previously described, transformer assembly 110 includes a stack 141 of windings, such as transformer winding W1, transformer winding W2, transformer winding W3, and transformer winding W4.

[0123] The power converter 900 also includes switches Q11, Q12, Q13, Q14, Q21, Q22, Q23, and Q24. Each switch can be a field-effect transistor or other suitable type of switch.

[0124] For each switch, node D represents the drain node; node G represents the gate node; and node S represents the source node.

[0125] The power converter 900 also includes a controller 140 and capacitors C1, C2 and C3.

[0126] The controller 140 generates control signals S1 to control the operation of switches Q11, Q12, Q13 and Q14.

[0127] The controller generates control signals S2 to control the operation of switches Q21, Q22, Q23 and Q24.

[0128] Figure 10 Example timing diagrams for generating control signals S1 and S2 are shown. Controller 140 transmits control signal S1 to switches Q11, Q12, Q13, and Q14 via conductive path 121-5. Controller 140 transmits control signal S2 to switches Q21, Q22, Q23, and Q24 via conductive path 121-3.

[0129] Refer again Figure 9 A combination of switch Q11, capacitor C1, and switch Q22 is connected in series between conductive paths 121-8 and 121-9. Winding W1 is connected between conductive paths 121-6 and 121-4.

[0130] A combination of switch Q21, capacitor C2, and switch Q12 is connected in series between conductive paths 121-8 and 121-9. Winding W2 is connected between conductive paths 121-2 and 121-4.

[0131] Switches Q11, Q23, and Q14 are connected in series between conductive paths 121-8 and 121-9. Winding W3 is connected between conductive paths 121-1 and 121-4.

[0132] Switches Q21, Q13, and Q24 are connected in series between conductive paths 121-8 and 121-9. Winding W4 is connected between conductive paths 121-7 and 121-4.

[0133] The input voltage Vin supplied to conductive path 121-8 can be a DC voltage. A switch in power converter 900 is used to convert the input voltage Vin into an output voltage Vout 123 from conductive path 121-4 to load 118.

[0134] As previously described, the interconnection provided by the multiple conductive paths 121 allows the transformer assembly 110 to be configured as an autotransformer.

[0135] Therefore, in one example, the main features of the implementation of transformer assembly 110 are as follows: An autotransformer (such as stack 141 in transformer assembly 110) can be implemented as a monolithic block comprising windings and a ferromagnetic core. On the sides of the ferromagnetic core, conductive leads (such as conductive paths 121) are embedded (secured by press fitting, bonding, or some other method) and machined (or designed) to precisely match the core height. This is why the block can be considered a transformer with embedded vertical leads (conductive paths 121) for use in a dual-substrate module. In short, TX. TX (also known as transformer assembly 110) is a mechanical support for the top PCB (also known as surface 162). The TX winding can be configured to be connected on the top PCB without crossing between the top PCB and the bottom PCB (also known as surface 161). TX enables some or all electrical connections between the top and bottom PCBs. The top and bottom PCBs have the footprint for soldering TX in the reflow soldering process.

[0136] Compared to conventional components, the transformer assembly 110 discussed herein offers the following advantages: The top PCB now has more space for power FETs that need to be connected to the heatsink. The top PCB no longer requires any copper to implement the transformer (transformer assembly 110), which is now built as a single, integral component. This provides additional space for parallel FETs and other power connections. Previously, individual block pins of conventional components had to be precisely machined, especially in height, to avoid any "wobbling" effect on the top PCB due to uneven height. This has now been resolved because the pins in the transformer assembly 110 can be ground together with the TX. Previously, individual pins of traditional components needed to be precisely positioned over solder mask openings and could potentially shift during reflow soldering due to the pins' highly asymmetrical form factor (very high but with a small footprint). This also reduced the complexity of the pick-and-place process. Now, placement (TX) can be performed in a single pick-and-place operation, and the precision can be relaxed.

[0137] In summary, the complexity of planar transformers and block pins has now been entirely transferred to the monolithic TX 110. This component 110 can now be manufactured and tested independently of the substrate.

[0138] Figure 10 This illustrates what is discussed in this article. Figure 9 An example timing diagram of the control states of multiple switches in a power converter circuit.

[0139] In this example, controller 140 generates a control signal S1 with a duty cycle of approximately 50% (or lower) to drive a plurality of switches including switch Q11, switch Q12, switch Q13 and switch Q14.

[0140] For example, between time T91 and time T92, controller 140 generates a logic high control signal S1, which enables switches Q11, Q12, Q13, and Q14 to be in the ON state; between time T93 and time T94, controller 140 generates a logic high control signal S1, which enables switches Q11, Q12, Q13, and Q14 to be in the ON state; between time T95 and time T96, controller 140 generates a logic high control signal S1, which enables switches Q11, Q12, Q13, and Q14 to be in the ON state; and so on.

[0141] Between time T92 and time T93, controller 140 generates a logic low control signal S1, causing switches Q11, Q12, Q13, and Q14 to be deactivated and placed in an off state (also known as a short circuit); between time T94 and time T95, controller 140 generates a logic low control signal S1, causing switches Q11, Q12, Q13, and Q14 to be deactivated and placed in an off state; and so on.

[0142] In addition, the controller 140 generates a control signal S2 with a duty cycle of about 50% (or lower) to drive a plurality of switches including switch Q21, switch Q22, switch Q23 and switch Q24.

[0143] For example, between time T91 and time T92, controller 140 generates a logic low control signal S2, causing switches Q21, Q22, Q23, and Q24 to be deactivated and in an off state; between time T93 and time T94, controller 140 generates a logic low control signal S2, causing switches Q21, Q22, Q23, and Q24 to be deactivated and in an off state; between time T95 and time T96, controller 140 generates a logic low control signal S2, causing switches Q21, Q22, Q23, and Q24 to be deactivated and in an off state; and so on.

[0144] Between time T92 and time T93, controller 140 generates a logic high control signal S2, which enables switches Q21, Q22, Q23, and Q24 to be in the ON state; between time T94 and time T95, controller 140 generates a logic high control signal S2, which enables switches Q21, Q22, Q23, and Q24 to be in the ON state; and so on.

[0145] It should also be noted that there is a so-called dead time between turning off the first set of switches and turning on the second set of switches, and vice versa. For example, the falling edge of signal S1 is exactly before time T92, while the rising edge of signal S2 is exactly after time T92; the falling edge of signal S2 is exactly before time T93, and the rising edge of signal S1 is exactly after time T93; and so on. Any number of dead times that prevent the turn-on times of signal S1 and signal S2 from overlapping is appropriate.

[0146] Now will be via Figure 11 The flowcharts below discuss the functions supported by different resources. Note that the operations in the following flowcharts can be performed in any suitable order.

[0147] Figure 11 This is a flowchart illustrating an example method as discussed in this article. Note that there will be some overlap in the concepts described above.

[0148] In processing operation 1110 of flowchart 1100, manufacturing apparatus 150 receives a prefabricated component including gaps, the prefabricated component including: i) a stack of multiple transformer windings, and ii) multiple conductive paths connected to the multiple windings in the stack.

[0149] In processing operation 1120, manufacturing apparatus 150 (e.g., via injection or other suitable techniques) places a first material into the voids of the prefabricated component. The first material encapsulates a stack of multiple transformer windings to provide magnetic coupling between the multiple transformer windings. Additionally, the first material provides structural support for the combination of multiple conductive paths and the stack of multiple transformer windings.

[0150] It should be noted again that the techniques described herein are well-suited for use in circuit component applications such as those providing power delivery to one or more loads. However, it should be understood that the disclosure herein is not limited to such applications, and the techniques discussed herein are also well-suited for other applications.

[0151] While the invention has been specifically shown and described with reference to preferred aspects thereof, those skilled in the art will understand that various changes in form and detail may be made to the invention without departing from the spirit and scope of the invention as defined by the appended claims. These variations are intended to be covered by the scope of the invention. Therefore, the foregoing description in this disclosure is not intended to be limiting. Rather, any limitation on the invention is set forth in the appended claims.

Claims

1. A transformer assembly, comprising: A prefabricated component comprising: i) a stack of multiple transformer windings, and ii) multiple conductive paths connected to the multiple transformer windings in the stack; and A first material placed in the gaps of the prefabricated component, the first material encapsulating the stack of the plurality of transformer windings to provide magnetic coupling between the plurality of transformer windings.

2. The transformer assembly according to claim 1, wherein, After the multiple conductive paths are directly coupled to the multiple transformer windings in the stack, the first material is injected into the voids of the prefabricated component.

3. The transformer assembly according to claim 2, wherein, The first material injected into the voids of the prefabricated component comprises a magnetically conductive material; and The first material provides structural support, fixing the stack of the plurality of transformer windings and the plurality of conductive paths.

4. The transformer assembly according to claim 2, further comprising: The second material at least partially encapsulates the injected first material.

5. The transformer assembly according to claim 1, wherein, The first material is injected into the gaps of the prefabricated component. The injected first material is a monolithic block of magnetically conductive material, which structurally supports the physical connection between the multiple conductive paths and the multiple transformer windings.

6. The transformer assembly according to claim 1, wherein, The plurality of conductive paths are at least partially embedded in the first material.

7. The transformer assembly according to claim 6, further comprising: At least one peripheral surface; and At least a portion of the plurality of conductive paths are disposed on the at least one peripheral surface.

8. The transformer assembly according to claim 1, further comprising: Top surface; as well as Bottom surface; The first conductive path of the plurality of conductive paths extends to the top surface; and The second conductive path of the plurality of conductive paths extends to the bottom surface.

9. The transformer assembly according to claim 8, wherein, The first conductive path extends axially from the bottom surface to the top surface; and The second conductive path extends axially from the bottom surface to the top surface, and the second conductive path is arranged parallel to the first conductive path.

10. The transformer assembly according to claim 1, further comprising: Top surface; Bottom surface; A first surface mount package is disposed on the top surface; as well as A second surface mount package is disposed on the bottom surface; The pattern of the first surface mount package is substantially similar to that of the second surface mount package.

11. The transformer assembly according to claim 1, further comprising: A first side surface is disposed between the top and bottom surfaces of the transformer assembly; Wherein, the plurality of conductive paths are at least partially embedded in the first material encapsulating the prefabricated component; and The first conductive path of the plurality of conductive paths is exposed on the first side surface.

12. The transformer assembly according to claim 11, wherein, The first conductive path extends on the first side surface between the top surface and the bottom surface of the transformer assembly.

13. The transformer assembly according to claim 1, wherein, The interconnections provided by the plurality of conductive paths configure the stack of the plurality of transformer windings into an autotransformer.

14. The transformer assembly according to claim 1, wherein, The stacked plurality of transformer windings includes: a first transformer winding manufactured in a first plane and a second transformer winding manufactured in a second plane, the first plane being parallel to the second plane; and The plurality of conductive paths extend orthogonally relative to the first plane and the second plane in the transformer assembly.

15. The transformer assembly according to claim 14, wherein, The prefabricated components include: A first insulating material layer separating the first transformer winding and the second transformer winding.

16. The transformer assembly according to claim 1, wherein, The first material placed in the gap includes a ferromagnetic material for transmitting magnetic flux associated with the plurality of transformer windings.

17. A circuit assembly comprising: The transformer assembly according to claim 1, wherein the transformer assembly includes a top surface and a bottom surface; A first circuit board is attached to the top surface of the transformer assembly; as well as The second circuit board is attached to the bottom surface of the transformer assembly.

18. The circuit assembly of claim 17, further comprising: A first conductive path extends from the second circuit board to the first circuit board, and the first conductive path is used to transmit the input voltage to the first circuit board through the first conductive path. as well as A second conductive path extends from the top surface of the transformer assembly to the first transformer winding among the plurality of transformer windings.

19. The circuit assembly of claim 18, further comprising: A switching circuit, disposed on the first circuit board, is operable to control the transmission of current received from the input voltage through the second conductive path to the first transformer winding.

20. A method for manufacturing a transformer assembly, the method comprising: The receiver includes a prefabricated component comprising: i) a stack of multiple transformer windings, and ii) multiple conductive paths connected to the multiple transformer windings in the stack; and A first material is placed in the gap of the prefabricated component, and the placed first material encapsulates the stack of the plurality of transformer windings to provide magnetic coupling between the plurality of transformer windings.

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