Electronic module and electronic device

Abstract

The embodiment of the application provides an electronic module and an electronic device, and belongs to the technical field of electronics. The circuit board of the electronic module comprises a first surface and a second surface opposite to each other, an electronic device is arranged on the first surface, a top wall and a side wall of a shielding member enclose a cavity and an opening, the shielding member is arranged outside the circuit board and the electronic device, and the shielding member has an electromagnetic shielding effect. The circuit board further comprises a grounding layer which is arranged between the first surface and the second surface, and in a first direction, the first grounding layer is opposite to the top wall of the shielding member. The first grounding layer has a first cutting region which penetrates the first grounding layer in the first direction. By dividing the first grounding layer, the area of the first grounding layer can be reduced, the parasitic capacitance between the first grounding layer and the top wall can be reduced, the amount of stored electrostatic charge can be reduced, the discharge current can be reduced, the damage caused by the electrostatic discharge phenomenon to the pins, the electronic device and the like can be avoided, and the electrostatic discharge capacity can be improved under the condition of ensuring the electromagnetic shielding performance of the electronic module.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and in particular to an electronic module and electronic device. Background Technology

[0002] An electronic module is a functional unit that integrates electronic devices and circuits. It can be designed to achieve specific electronic functions. With the continuous development of electronic technology, electronic modules such as radio frequency modules have been widely used in electronic devices such as mobile phones and tablets.

[0003] Electronic modules typically consist of individual electronic components packaged into a single module, with pins extending from the outside to enable electrical connections between internal and external components. During manufacturing, transportation, and installation, static electricity can accumulate within the module due to friction and induction. If these pins come into contact with ground or other conductive structures during transport or assembly, the static electricity inside the module will flow out through the pins, causing electrostatic discharge (ESD). A large discharge current flowing from the module through the pins can burn out the pins and other ESD-sensitive electronic components, affecting the module's performance and functionality. Summary of the Invention

[0004] This application provides an electronic module and an electronic device that improves the electrostatic discharge capability of the electronic module without affecting its performance and while maintaining good electromagnetic shielding performance.

[0005] A first aspect of this application provides an electronic module, including a circuit board, electronic devices, and a shielding component. The circuit board includes a first surface and a second surface that are opposite to each other in a first direction. The circuit board also includes a plurality of ground layers stacked between the first surface and the second surface. The electronic devices are disposed on the first surface.

[0006] The shielding component includes a top wall and side walls. The side walls are arranged around one side of the top wall, forming a cavity. The end of the side wall away from the top wall forms an opening. The shielding component covers the circuit board and electronic components, allowing them to be housed within the cavity. The second surface of the circuit board is exposed through the opening. The shielding component provides electromagnetic shielding, reducing electromagnetic interference and improving the electromagnetic compatibility of the electronic module. It protects the electronic components and circuit boards located within the cavity, preventing external electromagnetic interference and signal leakage within the electronic module.

[0007] The system includes at least one grounding layer adjacent to the first surface. In the first direction, the first grounding layer faces the top wall, and a parasitic capacitance is formed between the first grounding layer and the top wall of the shielding component. The first grounding layer has a first interrupted region that penetrates the first grounding layer in the first direction; that is, the first grounding layer has a through-slit interval. By dividing the first grounding layer and creating the first interrupted region, the area of ​​the first grounding layer can be reduced, thereby reducing the parasitic capacitance between the first grounding layer and the top wall, reducing the equivalent capacitance of the electronic module, reducing the amount of electrostatic charge that the electronic module can store, and thus reducing the discharge current of the electronic module. This reduces or avoids damage to pins, electronic components, etc., caused by electrostatic discharge. Without affecting the performance of the electronic module, this system provides good electromagnetic shielding performance while also improving the electrostatic discharge capability (or ESD capability, i.e., the ability of the electronic module to withstand electrostatic discharge without damage).

[0008] In one possible implementation, the grounding layers further include a second grounding layer located on the side of the first grounding layer facing away from the first surface. In the first direction, the second grounding layer is also disposed opposite to the top wall of the shielding member, and in some examples, a parasitic capacitance may also be formed between the second grounding layer and the shielding member.

[0009] The second grounding layer has a second interrupted region that penetrates the second grounding layer in a first direction, meaning that the second grounding layer has a gap that penetrates it. By dividing the second grounding layer to create the second interrupted region, the area of ​​the second grounding layer can be reduced, which helps to further reduce the equivalent capacitance of the electronic module and improve the electrostatic discharge capability of the electronic module.

[0010] In one possible implementation, the first grounding layer includes a first part and a second part, with a first cutting region between the first part and the second part, the first cutting region surrounding the first part. That is, the first grounding layer is divided into a first part and a second part by the first cutting region, and the first part and the second part are separated by the first cutting region. The interval between the first part and the second part is the first cutting region. The first part can be surrounded by a ring of the first cutting region, thus dividing the first grounding layer and reducing its area.

[0011] Along the first direction, the vertical projection of an electronic device corresponds to a first part. This electronic device can be one with low electrostatic discharge (ESD) tolerance, and it can be electrically connected to the first part. By allowing a first part to be connected to a corresponding electronic device, when the pins contact ground or metal, the area of ​​the first part connected to the electronic device is smaller, resulting in a smaller discharge current flowing through the electronic device and the first part. This reduces or prevents damage to the electronic device, and also reduces the current flowing through the electronic device with low ESD tolerance. Furthermore, it also reduces the impact of the first grounding layer's segmentation on the wiring layout of other electronic devices.

[0012] In one possible implementation, the first grounding layer includes a first main body portion, and a first cutting area is provided between the first main body portion and the sidewall of the shielding member. The first cutting area is arranged around the first main body portion. It can be understood that the first grounding layer is divided and recessed into the first main body portion, so that the first main body portion and the sidewall are separated by the first cutting area. The interval between the first main body portion and the sidewall is the first cutting area. The first cutting area can be surrounded by the first main body portion, thereby reducing the area of ​​the first grounding layer.

[0013] Along the first direction, the vertical projections of multiple electronic devices are located on the first main body, and the electronic devices can be electrically connected to the first main body. The area of ​​the first main body is small, resulting in a small discharge current flowing through the electronic devices and the first main body, thus reducing or avoiding damage to the electronic devices. Furthermore, by dividing and shrinking the first grounding layer to form a smaller first main body, multiple electronic devices correspond to the first main body, which helps reduce the difficulty of wiring layout for connecting multiple devices and also helps reduce the impact of the division of the first grounding layer on the wiring layout of the electronic devices. In addition, the first division area is located between the first main body and the sidewall of the shielding member, which facilitates the division and forming on the first grounding layer, making it highly feasible.

[0014] In one possible implementation, the second grounding layer includes a third part and a fourth part, with a second cutting region between the third part and the fourth part. The second cutting region surrounds the third part, that is, the second grounding layer is divided into the third part and the fourth part by the second cutting region, and the third part and the fourth part are separated by the second cutting region. The third part can be surrounded by a second cutting region to achieve the division of the second grounding layer and reduce the area of ​​the second grounding layer.

[0015] In one possible implementation, in the first direction, the vertical projection of the first part overlaps the vertical projection of the third part, and the vertical projection of the second part overlaps the vertical projection of the fourth part. This ensures that the first and second cut-off regions are aligned in the first direction, and the width of the first cut-off region can be less than or equal to the width of the second cut-off region. This allows the top wall of the first grounding layer and the shielding component to primarily form the parasitic capacitance of the electronic module. The first cut-off region formed on the first grounding layer effectively reduces parasitic capacitance, thereby improving the electrostatic discharge capability of the electronic module. Furthermore, it reduces the impact of the second grounding layer's segmentation on the wiring layout of other electronic components.

[0016] In one possible implementation, the second grounding layer includes at least a bottom grounding layer disposed adjacent to the second surface, and at least a fourth portion of the bottom grounding layer is in contact with the inner surface of the sidewall.

[0017] The electronic module also includes multiple pins disposed on the second surface. Along the first direction, at least a portion of the pins are projected onto the fourth portion of the bottom ground layer; that is, pins are present at corresponding positions on the fourth portion of the bottom ground layer along the first direction. These pins can be connected to a shielding component via the bottom ground layer, and are located outside the second cut-off region. When the electronic module is assembled with a motherboard, the pins of the electronic module are fixedly connected to the motherboard. The pins located on the fourth portion and connected to the shielding component enhance the shielding effect. Furthermore, the fourth portion and pins located outside the second cut-off region reduce or prevent interference signals such as electromagnetic waves from entering the electronic module through the second cut-off region, thus improving the performance of the electronic module.

[0018] In one possible implementation, at least a portion of the second grounding layer adjacent to the first grounding layer includes a second main body. A second interruption region is formed between the second main body and the sidewall of the shielding member, and the second interruption region surrounds the second main body. This can be understood as dividing at least a portion of the second grounding layer adjacent to the first grounding layer into a second main body, such that the second main body and the shielding member are separated by the second interruption region. The interval between the second main body and the sidewall is the second interruption region. The second interruption region can surround the periphery of the second main body, thereby reducing the area of ​​the second grounding layer.

[0019] In one possible implementation, in a first direction, the vertical projection of the first main body overlaps the vertical projection of the second main body. In this first direction, the first cut-off region and at least a portion of the second cut-off region of the second grounding layer adjacent to the first grounding layer are aligned, and the width of the first cut-off region can be less than or equal to the width of the second cut-off region. This allows the first grounding layer and the top wall of the shielding member to primarily form the parasitic capacitance of the electronic module. The first cut-off region formed on the first grounding layer effectively reduces parasitic capacitance, thereby improving the electrostatic discharge capability of the electronic module. Furthermore, it also reduces the impact of the segmentation of the second grounding layer on the wiring layout of other electronic components.

[0020] In one possible implementation, the second ground layer includes at least a bottom ground layer disposed adjacent to the second surface. The bottom ground layer comprises a fifth portion and a sixth portion, with a second cutting region between the fifth and sixth portions. The second cutting region surrounds the fifth portion, and the sixth portion is in contact with the inner surface of the sidewall. That is, the bottom ground layer is divided into a fifth and sixth portion by the second cutting region, and the fifth and sixth portions are separated by the second cutting region. The outer periphery of the fifth portion a can be surrounded by a second cutting region b, thereby dividing the bottom ground layer and reducing its area.

[0021] The electronic module also includes multiple pins disposed on the second surface. Along the first direction, at least a portion of the pins are projected onto the sixth portion of the bottom ground layer. That is, along the first direction, pins are present at positions corresponding to the sixth portion of the bottom ground layer. These pins can be connected to the shielding component via the bottom ground layer, and are located outside the second cut-off region. With enhanced shielding, the sixth portion and pins located outside the second cut-off region can further reduce or prevent interference signals such as electromagnetic waves from entering the electronic module through the second cut-off region, thus improving the performance of the electronic module.

[0022] In one possible implementation, the electronic module also includes an impedance device, which can be an electronic component or assembly capable of impedance adjustment. The impedance device is connected to the ground plane. The added impedance device can increase the impedance of the electronic module in the discharge circuit during discharge scenarios, reduce or suppress the discharge current on the electronic module, and further improve the CDM capability and electrostatic discharge capability of the electronic module.

[0023] In one possible implementation, the impedance device includes at least one or more combinations of resistors and inductors. It has broad applicability, good impedance performance, and is easy to fabricate on a circuit board.

[0024] In one possible implementation, the shielding material includes anisotropic materials.

[0025] In the direction intersecting with the sidewall, such as the direction perpendicular to the sidewall, the sidewall has shielding properties, providing electromagnetic shielding and reducing electromagnetic interference. In the direction parallel to the sidewall, the sidewall acts as an impedance device, connecting to the ground plane, increasing the impedance on the discharge circuit, and reducing the discharge current on the electronic module.

[0026] In the direction intersecting with the top wall, such as in the direction perpendicular to the top wall, the top wall has shielding properties and can achieve electromagnetic shielding. In the direction parallel to the top wall, the top wall acts as an impedance device. The top wall can be connected to the shielding component through the side walls to increase the impedance on the discharge circuit and reduce the discharge current.

[0027] In one possible implementation, the widths of the first and second cutting regions range from 100 μm to 200 μm. This effectively reduces the area of ​​the first grounding layer, thereby reducing the discharge current. It also reduces or avoids the mutual influence between the discharge currents on the first and second parts, which helps to reduce the discharge current flowing through the electronic devices connected to the first part, thus minimizing damage to those devices.

[0028] A second aspect of this application provides an electronic device, including a motherboard and any of the above-described electronic modules, wherein the electronic modules are disposed on the motherboard and electrically connected to the motherboard.

[0029] It should be understood that the second aspect of this application corresponds to the technical solution of the first aspect of this application, and the beneficial effects achieved by each aspect and the corresponding feasible implementation are similar, and will not be repeated here. Attached Figure Description

[0030] Figure 1 A cross-sectional structural diagram of an electronic device provided in an embodiment of this application;

[0031] Figure 2 This is a cross-sectional schematic diagram of an electronic module provided in an embodiment of this application;

[0032] Figure 3 for Figure 2 A top view of the assembly of electronic components and the first grounding layer;

[0033] Figure 4 A cross-sectional schematic diagram of another electronic module provided in an embodiment of this application;

[0034] Figure 5 for Figure 4 A top view of the assembly of electronic components, the first grounding layer, and the insulating layer;

[0035] Figure 5a A cross-sectional schematic diagram of another electronic module provided in the embodiments of this application;

[0036] Figure 6 A schematic diagram illustrating another CDM testing scenario for an electronic module provided in an embodiment of this application;

[0037] Figure 7 for Figure 6 A schematic diagram of the equivalent circuit of the electronic module in a CDM testing scenario;

[0038] Figure 8 for Figure 2 and Figure 4 A schematic diagram of the equivalent circuit of the electronic module in a CDM testing scenario;

[0039] Figure 9 This is a schematic diagram showing the current detected by each electronic module in a real discharge scenario;

[0040] Figure 10 A schematic diagram of the current of each electronic module during CDM detection;

[0041] Figure 11 for Figure 6 A schematic diagram of a discharge current detection result for a central electronic module;

[0042] Figure 12 for Figure 4 A schematic diagram of a discharge current detection result for a central electronic module;

[0043] Figure 13 for Figure 6 Another schematic diagram of the discharge current detection result of the electronic module;

[0044] Figure 14 for Figure 4 Another schematic diagram of the discharge current detection result of the electronic module;

[0045] Figure 15 A cross-sectional schematic diagram of another electronic module provided in the embodiments of this application;

[0046] Figure 16 A cross-sectional schematic diagram of another electronic module provided in the embodiments of this application;

[0047] Figure 17 A cross-sectional schematic diagram of another electronic module provided in the embodiments of this application;

[0048] Figure 18 A cross-sectional schematic diagram of another electronic module provided in the embodiments of this application;

[0049] Figure 19 for Figure 17 and Figure 18 A schematic diagram of the equivalent circuit of the electronic module in a CDM testing scenario;

[0050] Figure 20 An equivalent circuit diagram showing the shielding effect of a shielding component in another electronic module provided in this application embodiment;

[0051] Figure 21 This is a schematic diagram of the equivalent circuit of another electronic module in a CDM testing scenario provided in the embodiments of this application.

[0052] Explanation of reference numerals in the attached figures:

[0053] 100 - Electronic device; 101 - Housing; 102 - Display screen; 103 - Antenna; 104 - Motherboard;

[0054] 105 - Electronic Module;

[0055] 10 - Circuit board;

[0056] 11-Grounding layer;

[0057] 111-First grounding layer; 111a-First cutting area; 1111-First part; 1112-Second part; 1113-First main body;

[0058] 112-Second grounding layer; 1121-Third part; 1122-Fourth part; 1123-Second main body;

[0059] 1120c - First intermediate layer; 1120d - Second intermediate layer;

[0060] 12-Insulation layer;

[0061] 20 - Electronic components; 30 - Shielding components; 31 - Top wall; 32 - Side wall; 40 - Pins; 50 - Impedance components; 51 - Resistors; 52 - Inductors. Detailed Implementation

[0062] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0063] This application provides an electronic device, which may include, but is not limited to, mobile phones, tablet personal computers, laptops, ultra-mobile personal computers (UMPCs), desktop computers, walkie-talkies, netbooks, personal digital assistants (PDAs), wearable devices, virtual reality (VR) devices (such as VR glasses, VR headsets, etc.), augmented reality (AR) devices (such as AR glasses, AR headsets, etc.), in-vehicle devices, surveillance camera equipment, and other electronic devices.

[0064] In this embodiment of the application, a mobile phone is used as an example for illustration.

[0065] Figure 1 This is a cross-sectional structural diagram of an electronic device provided in an embodiment of this application.

[0066] See Figure 1 As shown, the electronic device 100 may include a housing 101 and a display screen 102. The housing 101 may include a back cover 101b and a side frame 101a. The back cover 101b and the display screen 102 may be located on opposite sides of the side frame 101a. The back cover 101b, the side frame 101a and the display screen 102 may form an accommodating space for accommodating the various structural components of the electronic device 100.

[0067] The electronic device 100 may also include an antenna 103. For example, in some examples, a portion of the side frame 101a may be used to form the antenna 103.

[0068] The electronic device 100 may also include a motherboard 104, which can be mounted within a receiving space. The motherboard 104 may include a processor, a controller, a memory, etc., and the electronic device 100 can be controlled through the motherboard 104.

[0069] The electronic device 100 may also include an electronic module 105, which may integrate electronic devices and circuits to realize specific electronic functions, thereby improving or enhancing the functions of the electronic device 100.

[0070] For example, the electronic module 105 can be a radio frequency (RF) module. The RF module can be used to modulate the frequency of the received electrical signal (such as the electrical signal sent by the processor of the electronic device 100) and amplify the power. For example, in the process of transmitting an electrical signal to the outside of the electronic device 100, the RF module can modulate the electrical signal, modulate the electrical signal from a low frequency to a specified high frequency band, so that it becomes an RF signal that can be transmitted in the air, and amplify the power of the RF signal to meet the communication requirements.

[0071] The electronic module 105 is located within the housing space of the electronic device 100. For example, the electronic module 105 can be mounted on the motherboard 104. The electronic module 105 is electrically connected to the motherboard 104 to realize the transmission of signals between the electronic module 105 and the motherboard 104.

[0072] The motherboard 104 can be electrically connected to the antenna 103 to realize the electrical connection between the electronic module 105 and the antenna 103.

[0073] Electronic module 105 can transmit radio frequency (RF) signals and transmit these signals to antenna 103 via motherboard 104. Antenna 103 can then transmit the RF signals. Antenna 103 can also receive external electromagnetic wave signals and transmit them to electronic module 105.

[0074] Of course, in some other examples, the electronic module 105 can also be other modules that integrate electronic devices.

[0075] The electronic device 100 may also include a battery, a charging management module, and a power management module (not shown in the figure), which may also be assembled and housed within the accommodating cavity of the housing 101.

[0076] The charging management module receives charging input from the charger. The charger can be a wireless charger or a wired charger. In some wired charging examples, the housing 101 may have an interface for connecting the charger, through which the charging management module receives the charging input from the wired charger.

[0077] In some wireless charging embodiments, the charging management module can receive wireless charging input via the wireless charging coil of the electronic device 100. The charging management module can charge the battery and also supply power to the electronic device 100 via the power management module.

[0078] The interface on housing 101 can also be used to realize data transmission between electronic device 100 and external devices. For example, it can also be used to connect headphones, projection devices, etc., so that external devices can be electrically connected to processors on the main circuit board through the interface.

[0079] The power management module connects the battery, charging management module, and processor. It receives input from the battery and / or charging management module to power the electronic modules, processor, display, etc. The power management module can also monitor parameters such as battery capacity, battery cycle count, and battery health status (leakage current, impedance).

[0080] In some examples, the power management module may be located within the processor on the main board. In other examples, the power management module and the charging management module may be located in the same device.

[0081] It is understood that the structures illustrated in the embodiments of this application do not constitute a specific limitation on the electronic device 100. In other embodiments of this application, the electronic device 100 may include more or fewer structural components than illustrated, or combine some structural components, or split some structural components, or arrange different structural components. For example, the electronic device 100 may also include structural components such as cameras (e.g., front-facing cameras and rear-facing cameras), sensors, memory, batteries, and flash.

[0082] As described in the background section, during the manufacturing process of electronic modules, static electricity inevitably accumulates within the module due to friction, induction, and other factors. When the pins of the electronic module come into contact with the ground or other metals, the stored static electricity flows out from inside the module through the pins, causing electrostatic discharge (ESD). The high voltage and current generated by ESD may exceed the withstand capability of some electronic components, potentially damaging or degrading the performance of pins and some electronic components with low electrostatic withstand capability (e.g., integrated circuits, RF switches) within the electronic module, thus reducing the performance and functionality of the electronic module.

[0083] Based on this, this application provides an electronic module comprising a circuit board, electronic components, and a shielding component. The circuit board includes a first surface and a second surface facing away from each other. The electronic components are disposed on the first surface of the circuit board. The top wall and side walls of the shielding component can form a cavity and an opening. The shielding component covers the circuit board and electronic components, allowing the circuit board and electronic components to be housed within the cavity. The second surface of the circuit board is exposed through the opening. The shielding component provides electromagnetic shielding, improving the electromagnetic compatibility of the electronic module. The circuit board also includes several grounding layers stacked between the first and second surfaces. In a first direction, the first grounding layer is opposite to the top wall of the shielding component, and a parasitic capacitance is formed between the first grounding layer and the top wall of the shielding component. The first grounding layer is given a first interrupted region that penetrates the first grounding layer in the first direction. By dividing the first grounding layer and creating the first interrupted region, the area of ​​the first grounding layer can be reduced, thereby reducing the parasitic capacitance between the first grounding layer and the top wall, reducing the equivalent capacitance of the electronic module, reducing the amount of electrostatic charge that the electronic module can store, thereby reducing the discharge current of the electronic module and reducing or avoiding damage to pins, electronic components, etc., caused by electrostatic discharge. Without affecting the performance of the electronic module, it is possible to give the electronic module good electromagnetic shielding performance while also improving the electrostatic discharge capability (or ESD capability, i.e. the ability of the electronic module to be undamaged in electrostatic discharge).

[0084] Figure 2 This is a cross-sectional schematic diagram of an electronic module provided in an embodiment of this application.

[0085] For example, see Figure 2 As shown, the electronic module 105 includes a circuit board 10. The circuit board 10 may include a first surface (not shown) and a second surface (not shown) that are opposite to each other, such as the first surface and the second surface being opposite to each other in a first direction. This first direction may be a direction perpendicular to the circuit board 10, for example, the first direction may be parallel to the thickness direction of the electronic device, such as the z-direction shown in the figure. Along the first direction (such as the z-direction), the first surface and the second surface are located on opposite sides of the circuit board 10.

[0086] The circuit board 10 may further include a signal layer (not shown), a ground layer 11, and an insulating layer 12, wherein the signal layer is used to arrange traces for transmitting signals in the circuit, and the ground layer 11 is used to provide a grounding path. In some embodiments, along a first direction (such as the z-direction), the signal layer and the ground layer 11 may be sequentially and alternately stacked between the first surface and the second surface, both the signal layer and the ground layer 11 being conductive layers, and an insulating layer 12 may be present between adjacent signal layers and ground layers 11.

[0087] It should be noted that the circuit board 10 can be a single-layer circuit board. For example, the signal layer can be a single layer, and the ground layer 11 can also be a single layer. Alternatively, the circuit board 10 can also be a multi-layer circuit board. For example, the signal layer can be multiple layers, and the ground layer 11 can also be multiple layers. For example, the multiple signal layers and ground layers 11 can be stacked alternately along the first direction (such as the z direction), and there is an insulating layer 12 between adjacent signal layers and ground layers 11.

[0088] The electronic module 105 also includes an electronic device 20, which is disposed on the first surface of the circuit board 10. The electronic device 20 is electrically connected to the signal layer and ground layer 11 of the circuit board 10 to meet the signal connection and grounding requirements of the electronic device 20. There may be one electronic device 20, or there may be multiple electronic devices 20.

[0089] For example, taking electronic module 105 as an example of a radio frequency module, the electronic device 20 may include, but is not limited to, radio frequency switches, radio frequency transistors and amplifiers, oscillators, filters, mixers, duplexers, etc.

[0090] The electronic module 105 may also include a package (not shown in the figure), which can cover the first surface of the circuit board 10 and the electronic device 20 to achieve encapsulation protection for the electronic device 20 and the circuit board 10.

[0091] The electronic module 105 may also include a plurality of pins 40 disposed on the second surface of the circuit board 10, with the pins 40 protruding from the second surface of the circuit board 10. For example, the pins 40 may protrude from the second surface of the circuit board 10, each pin 40 having a certain protrusion height on the second surface. For example, in a first direction (e.g., the z-direction), one end of the pin 40 may be fixed to the second surface, and the other end of the pin 40 may protrude and extend to a certain height, such that the distance between the other end of the pin 40 and the first surface of the circuit board 10 is greater than the distance between the second surface and the first surface, and the pin 40 protrudes above the second surface.

[0092] Pin 40 can be electrically connected to the signal layer and ground layer 11 of the circuit board 10. Through pin 40, the circuit board 10 can be electrically connected to other electronic devices located outside the electronic module 105, thereby realizing the electrical connection between the electronic device 20 and the electronic module 105 and other electronic devices.

[0093] The electronic module 105 also includes a shielding component 30, which includes a top wall 31 and a side wall 32. The outer contour of the side wall 32 can be annular. The side wall 32 is arranged around one side of the top wall 31. For example, in a first direction (such as the z-direction), one end of the side wall 32 is fixed to one side of the top wall 31. The side wall 32 and the bottom wall can together form a cavity. The end of the side wall 32 away from the top wall 31 can form an opening, so that the entire shielding component 30 can be a cover-shaped structure with an internal cavity and an opening at one end.

[0094] A shielding member 30 covers the circuit board 10 and the electronic device 20 (and its package), allowing the circuit board 10 and the electronic device 20 to be housed within the cavity of the shielding member 30. Specifically, in a first direction (e.g., the z-direction), the top wall 31 of the shielding member 30 may face the first surface of the circuit board 10, and the side walls 32 of the shielding member 30 may surround the outer periphery of the side surface of the circuit board 10 (located between the first and second surfaces), allowing the shielding member 30 to cover the circuit board 10 and the electronic device 20 on the first surface side and the outer periphery of the circuit board 10. The second surface of the circuit board 10 may be exposed through an opening at one end of the shielding member 30, allowing the pins 40 on the second surface to be exposed, facilitating electrical connections between the electronic module 105 and other electronic devices.

[0095] The shielding component 30 has an electromagnetic shielding function, which can reduce electromagnetic interference (EMI) and improve the electromagnetic compatibility (EMC) of the electronic module 105. The shielding component 30 can protect the electronic devices 20, circuit boards 10, etc. located in the cavity of the shielding component 30, prevent the electronic devices 20, etc. from being subjected to external electromagnetic interference, and prevent signal leakage inside the electronic module 105.

[0096] See also Figure 2 As shown, taking a circuit board 10 with multiple stacked ground layers 11 as an example, the ground layer 11 closest to the first surface is designated as the first ground layer 111. It can be understood that in the example where the circuit board 10 is a single-layer circuit board, the ground layer 11 included in the circuit board 10 is the first ground layer 111.

[0097] In a first direction (e.g., the z-direction), the first ground layer 111 is disposed opposite to the top wall 31 of the shield 30, and a parasitic capacitance is formed between the first ground layer 111 and the top wall 31 of the shield 30. The first ground layer 111 may have a first interrupted region 111a, which penetrates the first ground layer 111 in the first direction (e.g., the z-direction), meaning the first ground layer 111 has a through-slit. By dividing the first ground layer 111 and creating the first interrupted region 111a, the area of ​​the first ground layer 111 can be reduced, thereby reducing the parasitic capacitance between the first ground layer 111 and the top wall 31, reducing the equivalent capacitance of the electronic module 105, reducing the amount of electrostatic charge that the electronic module 105 can store, and thus reducing the discharge current of the electronic module 105, thereby reducing or avoiding damage to the pins 40, electronic devices 20, etc., caused by electrostatic discharge. Without affecting the performance of the electronic module 105, the electronic module 105 can have good electromagnetic shielding performance, while also improving the electrostatic discharge capability (or ESD capability, i.e. the ability of the electronic module 105 to be undamaged in electrostatic discharge).

[0098] In an example where grounding layer 11 is multi-layered, grounding layer 11 may further include a second grounding layer 112. The second grounding layer 112 may be located on the side of the first grounding layer 111 facing away from the first surface. In a first direction (e.g., the z-direction), the second grounding layer 112 is also disposed opposite to the top wall 31 of the shield 30. In some examples, a parasitic capacitance may also be formed between the second grounding layer 112 and the shield 30. It is understood that the second grounding layer 112 is located on the side of the first grounding layer 111 facing away from the first surface. In the first grounding layer 111 and the second grounding layer 112, the first grounding layer 111 is disposed closer to the top wall 31 of the shield 30, and the second grounding layer 112 is disposed farther away from the top wall 31 of the shield 30.

[0099] The second grounding layer 112 can be a single layer, such as along the first direction (e.g., the z-direction). The second grounding layer 112 is located on the side of the first grounding layer 111 facing away from the first surface. That is, the first surface, the first grounding layer 111, the second grounding layer 112, and the second surface are stacked in sequence. There may also be a signal layer, an insulating layer 12, etc. between any two grounding layers 11.

[0100] The second grounding layer 112 can also be multi-layered. Along the first direction (such as the z direction), multiple layers of second grounding layers 112 are stacked sequentially on the side of the first grounding layer 111 facing away from the first surface. That is, the first surface, the first grounding layer 111, multiple layers of second grounding layers 112, and the second surface are stacked sequentially. There can also be a signal layer, an insulating layer 12, etc. between any two grounding layers 11.

[0101] For example, Figure 2The image shows an example where the second ground layer 112 is multi-layered, such as... Figure 2 As shown, the second ground layer 112 may have a second interrupted region 112a, which penetrates the second ground layer 112 in a first direction (such as the z-direction), i.e., the second ground layer 112 has a gap that penetrates the second ground layer 112. By dividing the second ground layer 112 and making it have the second interrupted region 112a, the area of ​​the second ground layer 112 can be reduced, which is beneficial to further reduce the equivalent capacitance of the electronic module 105 and improve the electrostatic discharge capability of the electronic module 105.

[0102] The following example illustrates the distribution of the first cut-off region 111a and the second cut-off region 112a, using an electronic module 105 comprising a first ground layer 111 and multiple second ground layers 112 as an example.

[0103] Figure 3 for Figure 2 A top view of the assembly of electronic components and the first grounding layer.

[0104] In some embodiments, combined with Figure 2 and Figure 3 As shown, the first grounding layer 111 may include a first part 1111 and a second part 1112. A first cutting region 111a is provided between the first part 1111 and the second part 1112. The outer contour of the first cutting region 111a may be annular, and the first cutting region 111a may surround the first part 1111. That is, the first grounding layer 111 is divided into the first part 1111 and the second part 1112 by the first cutting region 111a, and the first part 1111 and the second part 1112 are separated by the first cutting region 111a. The interval between the first part 1111 and the second part 1112 is the first cutting region 111a. The first part 1111 may be surrounded by the first cutting region 111a, thereby dividing the first grounding layer 111 and reducing the area of ​​the first grounding layer 111.

[0105] Electronic device 20 can be located at the corresponding position in the first part 1111, and electronic device 20 can be electrically connected to the corresponding first part 1111. (Continue to the previous section) Figure 2 As shown, along the first direction (e.g., the z-direction), the vertical projection of the electronic device 20 onto the first ground layer 111 is located on the first portion 1111. The electronic device 20 can be one with low electrostatic discharge tolerance, as described above; for example, it can be a radio frequency switch.

[0106] For example, a first portion 1111 can correspond to an electronic device 20, that is, along a first direction (such as the z-direction), the vertical projection of an electronic device 20 corresponds to a first portion 1111. When the pin 40 contacts ground or metal, the area of ​​the first portion 1111 connected to the electronic device 20 is small, resulting in a smaller discharge current flowing through the electronic device 20 and the first portion 1111, which can reduce or avoid damage to the electronic device 20, and thus reduce the current flowing through the electronic device 20 with lower electrostatic withstand capability. Furthermore, it can also reduce the impact of the segmentation of the first ground layer 111 on the connection routing layout of other electronic devices.

[0107] In some embodiments, the area of ​​the first portion 1111 can be slightly larger than or equal to the vertical projection area of ​​the electronic device 20 on the first ground layer 111. For example, the ratio between the area of ​​the first portion 1111 and the projection area of ​​the electronic device 20 can be less than 2 / 1, which ensures that the electronic module 105 has a smaller discharge current and is more conducive to reducing the impact on the wiring layout of other electronic devices.

[0108] In one example where the electronic module 105 includes an electronic device 20, the first ground layer 111 may include the first part 1111 and the second part 1112 described above. The first part 1111, which is divided by the first cutting region 111a, may be a single part.

[0109] In the example where the electronic module 105 includes multiple electronic devices 20, the first ground layer 111 may also include the first part 1111 and the second part 1112 described above. The number of first parts 1111 can be multiple, and the vertical projections of the multiple electronic devices 20 are respectively located on the multiple first parts 1111. That is, the first ground layer 111 can be divided into multiple first parts 1111 by the first cutting area 111a.

[0110] Of course, in some other embodiments, a first portion 1111 may also correspond to multiple electronic devices 20, that is, along a first direction (such as the z direction), the vertical projections of multiple electronic devices 20 may be located on a first portion 1111.

[0111] It should be noted that the outer contour shape of the first cut region 111a is roughly annular. However, in this embodiment, the specific annular shape of the first cut region 111a is not limited. For example, in some embodiments, see... Figure 3 As shown, the outer contour shape of the first cut area 111a can be a ring shape with rounded corners, which facilitates the forming of the first cut area 111a on the first ground layer 111.

[0112] Alternatively, in some other embodiments, the outer contour shape of the first cut-off region 111a may be other regular or irregular shapes, such as a ring shape that is similar to a rectangle, a circle, an ellipse, etc.

[0113] In some embodiments, the width of the first cut region 111a can range from 100 μm to 200 μm. The width of the first cut region 111a can be the width of the first cut region 111a in a direction perpendicular to the first direction (such as the z-direction), for example, see [reference needed]. Figure 3 In the x and y directions shown, the width of the first cut-off region 111a is the width it has in either the x or y direction, that is, the spacing between the first part 1111 and the second part 1112 in either the x or y direction. By keeping the width of the first cut-off region 111a within the aforementioned range, the area of ​​the first ground layer 111 can be effectively reduced, thereby reducing the discharge current. It also reduces or avoids the mutual influence between the discharge current on the first part 1111 and the discharge current on the second part 1112, which helps to reduce the discharge current flowing through the electronic device 20 connected to the first part 1111, thus reducing damage to the electronic device 20.

[0114] In some embodiments, the distribution of the second cutting region 112a of the second ground layer 112 may be similar to the distribution of the first cutting region 111a of the first ground layer 111. For example, see below. Figure 2 As shown, taking one of the second ground layers 112 as an example, such as the bottom ground layer 1120a closest to the second surface of the circuit board, the second ground layer 112 may include a third part 1121 and a fourth part 1122. A second cutting region 112a may be present between the third part 1121 and the fourth part 1122. The outer contour shape of the second cutting region 112a may be ring-shaped, and the second cutting region 112a may surround the third part 1121. That is, the second ground layer 112 is divided into the third part 1121 and the fourth part 1122 by the second cutting region 112a, and the third part 1121 and the fourth part 1122 are separated by the second cutting region 112a. The outer periphery of the third part 1121 may surround the second cutting region 112a, thereby dividing the second ground layer 112 and reducing its area.

[0115] In the first direction (such as the z direction), the positions of the first cut region 111a and the second cut region 112a correspond to each other, and the width of the first cut region 111a can be less than or equal to the width of the second cut region 112a.

[0116] For example Figure 2As shown, along the first direction (e.g., the z-direction), the vertical projection of the first portion 1111 can cover the vertical projection of the third portion 1121, and the vertical projection of the second portion 1112 can cover the vertical projection of the fourth portion 1122. The positions of the first cut-off region 111a and the second cut-off region 112a are aligned along the first direction (e.g., the z-direction), and the width of the first cut-off region 111a (e.g., the width along the x-direction or y-direction) can be less than or equal to the width of the second cut-off region 112a (e.g., the width along the x-direction or y-direction). This allows the first grounding layer 111 and the top wall 31 of the shield 30 to primarily form the parasitic capacitance of the electronic module 105. The first cut-off region 111a formed on the first grounding layer 111 effectively reduces the parasitic capacitance, thereby improving the electrostatic discharge capability of the electronic module 105. Furthermore, it also reduces the impact of the division of the second grounding layer 112 on the wiring layout of other electronic components.

[0117] The portions of the first grounding layer 111 and the second grounding layer 112 corresponding to the electronic device 20 can be electrically connected sequentially. For example, the electronic device can be electrically connected to the first portion 1111, the first portion 1111 can be electrically connected to the third portion 1121 adjacent to the first portion 1111, and multiple third portions 1121 can be electrically connected sequentially. The third portion 1121 closest to the second surface can be electrically connected to the pin 40. When the pin 40 contacts the ground or metal, part of the discharge current can flow through the electronic device 20, the first portion 1111, and the third portion 1121 as shown by the dashed arrow in the figure, and then flow out from the pin 40. The first portion 1111 and the third portion 1121 corresponding to the electronic device 20 have smaller areas, store less discharge charge, and have smaller discharge current, which can reduce or avoid damage to the electronic device 20.

[0118] Of course, in some embodiments, the positions of the first cut-off region 111a and the second cut-off region 112a can be directly opposite each other in the first direction (e.g., the z-direction), but the width of the first cut-off region 111a can be greater than the width of the second cut-off region 112a. Alternatively, the positions of the first cut-off region 111a and the second cut-off region 112a can not be directly opposite each other. For example, in the first direction (e.g., the z-direction), the vertical projection of a portion of the third portion 1121 and / or the vertical projection of a portion of the fourth portion 1122 can be located within the first cut-off region 111a. In this way, the top wall 31 of the second grounding layer 112 and the shield 30 can also be used to form the parasitic capacitance of the electronic module 105. Through the second cut-off region 112a on the second grounding layer 112, the purpose of reducing the parasitic capacitance can also be achieved, which is beneficial to improving the electrostatic discharge capability of the electronic module 105. The second grounding layer 112 is located further away from the top wall 31, and the distance between the second grounding layer 112 and the top wall 31 is larger, which makes the parasitic capacitance between the second grounding layer 112 and the top wall 31 smaller, which also helps to reduce the parasitic capacitance of the electronic module 105 and improve the electrostatic discharge capability of the electronic module 105.

[0119] In the example where the positions of the first cut region 111a and the second cut region 112a are not directly aligned, the correspondence between electronic device 20 and the third part 1121 can be the same as the correspondence between electronic device 20 and the first part 1111. For example, one third part 1121 can correspond to one electronic device 20, which helps to reduce the discharge current flowing through electronic device 20, reduce or avoid damage to electronic device 20, and also helps to reduce the impact on the wiring layout of other electronic devices.

[0120] In some embodiments, the area of ​​the third part 1121 may be slightly larger than or equal to the vertical projection area of ​​the electronic device 20 on the second ground layer 112. For example, the ratio between the area of ​​the third part 1121 and the projection area of ​​the electronic device 20 may be less than 2 / 1. This reduces the impact on the wiring layout of other electronic devices while reducing the discharge current of the electronic module 105.

[0121] In this embodiment, the specific annular shape of the second cut-off region 112a is not limited. For example, in some embodiments, the outer contour shape of the second cut-off region 112a can be a rounded rectangle-like annular shape, which facilitates the forming of the second cut-off region 112a on the second ground layer 112. Alternatively, in some other embodiments, the outer contour shape of the second cut-off region 112a can also be other regular or irregular shapes, such as a rectangular, circular, or elliptical annular shape. The outer contour shape of the second cut-off region 112a can be the same as or different from the outer contour shape of the first cut-off region 111a.

[0122] In some embodiments, the width of the second cut region 112a can be in the range of 100 μm to 200 μm, and the width of the second cut region 112a can be the spacing between the third part 1121 and the fourth part 1122 in the x-direction or y-direction. By keeping the width of the second cut region 112a within the above range, while reducing the discharge current of the electronic module 105, the mutual influence between the discharge current on the fourth part 1122 and the discharge current on the third part 1121 can be reduced, which is more conducive to reducing damage to the electronic device 20.

[0123] See also Figure 2 As shown, the second ground layer 112 may include a bottom ground layer 1120a, which may be the layer closest to the second surface in the second ground layer 112. It can be understood that in the example where the second ground layer 112 of the circuit board 10 is a single layer, this second ground layer 112 is the bottom ground layer 1120a.

[0124] In an example where the second ground layer 112 of the circuit board 10 is multi-layered, several second ground layers 112 may be stacked between the first ground layer 111 and the bottom ground layer 1120a.

[0125] The bottom grounding layer 1120a may include a third part 1121 and a fourth part 1122. At least the fourth part 1122 of the bottom grounding layer 1120a can be in contact with the inner surface of the side wall 32 of the shielding member 30 (the side facing the cavity of the shielding member 30), which can meet the grounding requirements of the shielding member 30.

[0126] In the first direction (e.g., the z-direction), the vertical projection of at least a portion of the pins 40 can be located on the fourth portion 1122 of the bottom ground layer 1120a. That is, in the first direction (e.g., the z-direction), pins 40 are located at corresponding positions on the fourth portion 1122 of the bottom ground layer 1120a. These pins 40 can be connected to the shielding member 30 through the bottom ground layer 1120a. These pins 40 are located outside the second cut-off region 112a. When the electronic module 105 is assembled with the motherboard of an electronic device, the pins 40 of the electronic module 105 are fixedly connected to the motherboard. The pins 40 located on the fourth portion 1122 and connected to the shielding member 30 can enhance the shielding effect. Furthermore, the fourth portion 1122 and the pins 40 located outside the second cut-off region 112a can reduce or prevent interference signals such as electromagnetic waves from entering the electronic module 105 through the second cut-off region 112a and causing interference to the electronic module 105, thereby improving the performance of the electronic module 105.

[0127] Figure 4 This is a cross-sectional schematic diagram of another electronic module provided in an embodiment of this application.

[0128] Alternatively, in some embodiments, see Figure 4 As shown, the first grounding layer 111 may consist only of a first main body 1113. A first cutting region 111a is provided between the first main body 1113 and the sidewall 32 of the shielding member 30, and the first cutting region 111a surrounds the first main body 1113. Alternatively, the first grounding layer 111 can be completely divided and recessed into the first main body 1113, with the first main body 1113 and the sidewall 32 separated by the first cutting region 111a. The gap between the first main body 1113 and the sidewall 32 is the first cutting region 111a. The first cutting region 111a can surround the periphery of the first main body 1113, thereby reducing the area of ​​the first grounding layer 111.

[0129] The electronic device 20 can be located at a position corresponding to the first main body 1113, and the electronic device 20 can be electrically connected to the first main body 1113. For example, along a first direction (such as the z-direction), the vertical projection of the electronic device 20 on the first ground layer 11 is located on the first main body 1113. The electronic device 20 can also be an electronic device with low electrostatic discharge tolerance as described above.

[0130] Figure 5 for Figure 4 A top view of the assembly of electronic components, the first grounding layer, and the insulating layer.

[0131] For example, in an example where the electronic module 105 includes a plurality of electronic devices 20, see [reference needed]. Figure 5 As shown, the first main body 1113 can correspond to multiple electronic devices 20. That is, along the first direction (such as the z-direction), the vertical projections of multiple electronic devices 20 can be correspondingly located on the first main body 1113. The area of ​​the first main body 1113 is small, and the discharge current flowing through the electronic devices 20 and the first main body 1113 is small, reducing or avoiding damage to the electronic devices 20. Furthermore, in conjunction with Figure 4 As shown, a smaller first main body 1113 is formed by dividing and shrinking the first grounding layer 111 as a whole. Multiple electronic devices 20 correspond to the first main body 1113, which helps to reduce the difficulty of wiring layout for connecting multiple electronic devices 20, and also helps to reduce the impact of the division of the first grounding layer 111 on the wiring layout of the electronic devices 20. In addition, the first cut area 111a is located between the first main body 1113 and the side wall 32 of the shield 30, which facilitates the division and forming on the first grounding layer 111 and has high feasibility.

[0132] It should be noted that in the example where the electronic module 105 includes an electronic device 20, the first ground layer 111 may also include the first main body portion 1113 described above, and the vertical projection of the electronic device 20 is located on the first main body portion 1113 along the first direction (such as the z direction).

[0133] In the example where the first grounding layer 11 includes a first main body portion 1113 and a first cutting region 111a is provided between the first main body portion 1113 and the side wall 32, the shape, width range, etc. of the first cutting region 111a can be found in the example above where the first grounding layer 111 includes a first part 1111 and a second part 1112, and will not be repeated here.

[0134] In some embodiments, the distribution of the second cut-off region 112a on at least a portion of the second ground layer 112 adjacent to the first ground layer 111 can be similar to the distribution of the first cut-off region 111a in the example above where the first ground layer 11 includes the first main body portion 1113.

[0135] For example, at least a portion of the second grounding layer adjacent to the first grounding layer may include a second body portion, for example, see [link to relevant documentation]. Figure 4 As shown, taking the second grounding layer 112, which is closest to the first grounding layer 111, as an example of the first intermediate layer 1120c, the first intermediate layer 1120c may include a second main body 1123. A second cutting region 112a is provided between the second main body 1123 and the sidewall 32 of the shielding member 30. The second cutting region 112a surrounds the second main body 1123. Alternatively, it can be understood that the second grounding layer 112 (such as the first intermediate layer 1120c) is entirely divided and recessed into the second main body 1123, such that the second main body 1123 is separated from the sidewall 32 by the second cutting region 112a. The gap between the second main body 1123 and the sidewall 32 is the second cutting region 112a. The second cutting region 112a can surround the periphery of the second main body 1123, thereby reducing the area of ​​the second grounding layer 11.

[0136] It should be noted that, in the example where the circuit board 10 includes multiple layers of second ground layers 112, only a portion of the second ground layers 112 adjacent to the first ground layer 111 may include the aforementioned second main body 1123, with a second cutting region 112a between the second main body 1123 and the sidewall 32 of the shield 30. Alternatively, all of the second ground layers 112 may include the aforementioned second main body 1123, with a second cutting region 112a between the second main body 1123 and the sidewall 32.

[0137] For example, the following Figure 4 Taking the portion of the second ground layer 112 adjacent to the first ground layer 111 (such as the first intermediate layer 1120c) as an example, which includes the second main body portion 1123, the distribution of the second cut-off region 112a will be further explained. In the example where all the second ground layers 112 include the aforementioned second main body portion 1123, the distribution of the second cut-off region 112a can also be found below.

[0138] For example, in a first direction (such as the z direction), the positions of the first cut-off region 111a and the second cut-off region 112a of the portion of the second ground layer 112 (i.e., the portion of the second ground layer 112 adjacent to the first ground layer 111) correspond to each other, and the width of the first cut-off region 111a may be less than or equal to the width of the second cut-off region 112a.

[0139] For example Figure 4 As shown, along the first direction (e.g., the z-direction), the vertical projection of the first main body portion 1113 of the first ground layer 111 can cover the vertical projection of the second main body portion 1123 of the first intermediate layer 1120c, so that the positions of the first cut-off region 111a and the second cut-off region 112a on the first intermediate layer 1120c are directly opposite each other in the first direction (e.g., the z-direction), and the width of the first cut-off region 111a (e.g., the width along the x-direction or y-direction) can be less than or equal to the width of the second cut-off region 112a (e.g., the width along the x-direction or y-direction). This allows the first ground layer 111 and the top wall 31 of the shield 30 to primarily form the parasitic capacitance of the electronic module 105. Through the first cut-off region 111a formed on the first ground layer 111, the parasitic capacitance can be effectively reduced, thereby improving the electrostatic discharge capability of the electronic module 105. Furthermore, it can also reduce the impact of the division of the second ground layer 112 on the connection and wiring layout of other electronic devices.

[0140] Of course, in some embodiments, the positions of the first cut-off region 111a and the second cut-off region 112a in the first direction (e.g., the z-direction) can be directly opposite each other, but the width of the first cut-off region 111a can be greater than the width of the second cut-off region 112a. Alternatively, the positions of the first cut-off region 111a and the second cut-off region 112a of that portion of the second ground layer 112 can not be directly opposite each other. For example, in the first direction (e.g., the z-direction), the vertical projection of a portion of the second main body portion 1123 can be located within the first cut-off region 111a. In this way, the top wall 31 of the first intermediate layer 1120c and the shield 30 can also be used to form the parasitic capacitance of the electronic module 105, and the parasitic capacitance can also be reduced through the second cut-off region 112a on the first intermediate layer 1120c. Furthermore, the first intermediate layer 1120c is positioned relatively far from the top wall 31, and the distance between the first intermediate layer 1120c and the top wall 31 is relatively large, which reduces the parasitic capacitance between the two and also helps to improve the electrostatic discharge capability of the electronic module 105.

[0141] In the example where the first cut-off region 111a and the second cut-off region 112a are not aligned, the correspondence between the electronic device 20 and the second main body 1123 can be the same as the correspondence between the electronic device 20 and the first main body 1113. For example, one second main body 1123 can correspond to multiple electronic devices 20, which reduces the discharge current flowing through the electronic devices 20 and helps to reduce the difficulty of wiring layout for multiple electronic devices 20.

[0142] See also Figure 4 As shown, in an example in which only the portion of the second ground layer 112 adjacent to the first ground layer 111 (such as the first intermediate layer 1120c) includes the second body portion 1123, the second ground layer 112 may also include a bottom ground layer 1120b, which may be the layer closest to the second surface among a plurality of second ground layers 112.

[0143] The bottom ground layer 1120b may include a fifth portion 1124a and a sixth portion 1125a. A second cutting region 112b is provided between the fifth portion 1124a and the sixth portion 1125a. The outer contour shape of the second cutting region 112b may be ring-shaped, and the second cutting region 112b may surround the fifth portion 1124a. That is, the bottom ground layer 1120b is divided into the fifth portion 1124a and the sixth portion 1125a by the second cutting region 112b, and the fifth portion 1124a and the sixth portion 1125a are separated by the second cutting region 112b. The outer perimeter of the fifth portion 1124a may surround the second cutting region 112b, thereby dividing the bottom ground layer 1120b and reducing the area of ​​the bottom ground layer 1120b.

[0144] At least the sixth portion 1125a of the bottom grounding layer 1120b can be in contact with the inner surface of the sidewall 32 of the shield 30 to meet the grounding requirements of the shield 30.

[0145] In the first direction (e.g., the z-direction), the vertical projection of at least a portion of the pins 40 can be located on the sixth portion 1125a of the bottom ground layer 1120b. That is, along the first direction (e.g., the z-direction), pins 40 are present at corresponding positions on the sixth portion 1125a of the bottom ground layer 1120b. These pins 40 can be connected to the shielding member 30 through the bottom ground layer 1120b. These pins 40 are located outside the second cut-off region 112b. Under the condition of enhanced shielding effect, the sixth portion 1125a and pins 40 located outside the second cut-off region 112b can also reduce or prevent interference signals such as electromagnetic waves from entering the electronic module 105 through the second cut-off region 112b, which is beneficial to improving the performance of the electronic module 105.

[0146] In some embodiments, the second ground layer 112 may further include a second intermediate layer 1120d, which may be the layer closest to the bottom ground layer 1120b among a plurality of second ground layers 112. That is, in a first direction (such as the z direction), the first ground layer 111, the first intermediate layer 1120c, the second intermediate layer 1120d, and the bottom ground layer 1120b are stacked sequentially.

[0147] It should be noted that in some other embodiments, a plurality of second ground layers 112 may be stacked between the first intermediate layer 1120c and the second intermediate layer 1120d.

[0148] The distribution of the second cut-off region 112c on the second intermediate layer 1120d can be the same as the distribution of the second cut-off region 112b on the bottom ground layer 1120b. For example, the second intermediate layer 1120d may include a fifth part 1124b and a sixth part 1125b. The specific layout of the fifth part 1124b and the sixth part 1125b can be found in the fifth part 1124a and the sixth part 1125b of the bottom ground layer 1120b, and will not be repeated here. This facilitates the forming and connection routing of the pins 40 on the bottom ground layer 1120b, making manufacturing easier.

[0149] Understandably, in the first direction (e.g., the z-direction), the second intermediate layer 1120d is disposed closer to the top wall 31 of the shield 30 than the bottom ground layer 1120b. The sixth portion 1125b of the second intermediate layer 1120d is attached to the inner surface of the side wall 32 of the shield 30. The first cut-off region 111a of the first ground layer 111 is located between the first main body 1113 and the side wall 32, and the second cut-off region 112a of the first intermediate layer 1120c is located between the second main body 1123 and the side wall 32. Along the first direction (e.g., the z-direction), at least a portion of the vertical projection of the sixth portion 1125b lies within the first cut-off region 111a and the second cut-off region 112a. The space between the sixth portion 1125b of the second intermediate layer 1120d and the top wall 31 can also be used to form the parasitic capacitance of the electronic module 105. The area of ​​the sixth part 1125b is small, and the distance between the sixth part 1125b and the top wall 31 is large, which makes the parasitic capacitance between the two smaller, which also helps to reduce the parasitic capacitance of the electronic module 105 and improve the electrostatic discharge capability of the electronic module 105.

[0150] The portions of the first grounding layer 111 corresponding to the electronic device 20 and the portions of the second grounding layer 112 corresponding to the electronic device 20 can be electrically connected sequentially. For example... Figure 4As shown, electronic device 20 can be electrically connected to the first main body 1113. The first main body 1113 and the second main body 1123 adjacent to the first main body 1113 can be electrically connected. The second main body 1123 can be electrically connected to the fifth part 1124b. The fifth part 1124b can be electrically connected to the fifth part 1124a. The fifth part 1124a can be electrically connected to the pin 40. When the pin 40 contacts the ground or metal, part of the discharge current can flow through electronic device 20, the first main body 1113, the second main body 1123, the fifth part 1124b, and the fifth part 1124a in the manner shown by the dashed arrow in the figure, and then flow out from the pin 40. The areas of the first main body 1113, the second main body 1123, etc., are small, so the stored discharge charge is small and the discharge current is small, reducing or avoiding damage to electronic device 20.

[0151] It should be noted that in some embodiments, the distribution of the second cut-off region 112c on the second intermediate layer 1120d may differ from the distribution of the second cut-off region 112b on the bottom ground layer 1120b. For example, the distribution of the second cut-off region 112c on the second intermediate layer 1120d may be the same as the distribution of the second cut-off region 112a on the first intermediate layer 1120c. The second intermediate layer 1120d may include a second main body portion. Then, along the first direction (e.g., the z-direction), at least a portion of the vertical projection of the sixth portion 1125a is located within the first cut-off region 111a and the second cut-off region (including the second cut-off region of the first intermediate layer 1120c and the second intermediate layer 1120d). The sixth portion 1125a of the bottom ground layer 1120b and the top wall 31 can be used to form the parasitic capacitance of the electronic module 105. Similarly, the area of ​​the sixth part 1125a is smaller, and the distance between the sixth part 1125a and the top wall 31 is larger, which also helps to reduce the parasitic capacitance of the electronic module 105 and improve the electrostatic discharge capability of the electronic module 105.

[0152] In the example above, the first grounding layer 111 includes a first main body 1113, and there is a first cutting region 111a between the first main body 1113 and the side wall 32 of the shield 30. The shape, width, etc. of the first cutting region 111a can be found in the example above, where the first grounding layer 111 includes a first part 1111 and a second part 1112, and there is a first cutting region 111a between the first part 1111 and the second part 1112. This will not be repeated here.

[0153] In the example where the second grounding layer 112 at least adjacent to the first grounding layer 111 may include a second main body portion 1123 and a second cutting region 112a between the second main body portion 1123 and the side wall 32 of the shield 30, the shape, width, etc. of the second cutting region 112a (i.e., the second cutting region 112b and the second cutting region 112c) can refer to the example above where the second grounding layer 112 includes a third part 1121 and a fourth part 1122, and a second cutting region 112a is between the third part 1121 and the fourth part 1122, which will not be repeated here.

[0154] It should be noted that, in the example where the first grounding layer of the electronic module includes a first portion and a second portion, and the first cut-off region is located between the first portion and the second portion, the second grounding layer of the electronic module can be any of the second grounding layers described above. For example, the second grounding layer may include a third portion and a fourth portion, with the second cut-off region located between the third portion and the fourth portion. Alternatively, at least a portion of the second grounding layer adjacent to the first grounding layer may include a second main body portion, with the second cut-off region located between the second main body portion and the sidewall of the shielding member.

[0155] Accordingly, in the example where the first grounding layer of the electronic module includes a first main body portion and the first cut-off region is located between the first main body portion and the sidewall of the shielding member, the second grounding layer of the electronic module can also be any of the second grounding layers described above. For example, the second grounding layer may include a third portion and a fourth portion, with the second cut-off region located between the third portion and the fourth portion. Alternatively, at least a portion of the second grounding layer adjacent to the first grounding layer may include a second main body portion, with the second cut-off region located between the second main body portion and the sidewall of the shielding member.

[0156] In any of the above-mentioned electronic modules 105, the shielding component 30 can be made of metal and covers the circuit board 10 and electronic devices 20. The sidewalls 32 and topwalls 31 of the shielding component 30 can be integral planar structures, so that the topwalls 31 and sidewalls 32 of the shielding component 30 can completely cover the first surface (and package) and peripheral sides of the circuit board 10.

[0157] Figure 5a This is a cross-sectional schematic diagram of another electronic module provided in an embodiment of this application.

[0158] Alternatively, in some embodiments, see Figure 5aAs shown, the sidewalls 32 and top wall 31 of the shielding component 30 can also be mesh-like, with perforated mesh structures 30a on the sidewalls 32 and top wall 31, so that the top wall 31 and sidewalls 32 of the shielding component 30 partially cover the first surface (and package) and peripheral side surfaces of the circuit board 10. The perforated mesh structure 30a on the top wall 31 can reduce the area of ​​the top wall 31, which helps to reduce the parasitic capacitance formed between the top wall 31 and the first ground layer 111 (and / or the second ground layer 112), thus reducing the discharge current of the electronic module 105 and improving the electrostatic discharge capability of the electronic module 105.

[0159] In the embodiments of this application, the specific outline shape of the mesh structure 30a of the shielding member 30 is not limited. For example, the outer outline shape of the mesh structure can be a square shape, a rhombus shape, etc.

[0160] For example, to better illustrate the impact of the first cut-off region formed on the first grounding layer on the discharge current, a charged device model (CDM) can be used to simulate the electrostatic discharge phenomenon that the electronic module may encounter during production, assembly and use.

[0161] Figure 6 This is a schematic diagram illustrating a CDM testing scenario for another electronic module provided in an embodiment of this application. Figure 6 The electronic module 200 shown does not have a first cut-off region (and a second cut-off region). The remaining structures of the electronic module 200, such as the shield 201, pins 202, and electronic components 203, can be compared with the electronic module 105 with a first cut-off region 111a exemplified in the embodiments of this application above (e.g., Figure 2 and Figure 4 The shielding component 30, pins 40, and electronic components 20 in the electronic module 105 can be the same.

[0162] by Figure 6 Taking the electronic module 200 as an example, this paper illustrates a scenario for CDM detection using an electronic module. It is understood that the electronic module 105 with the first cut-off region 111a in this embodiment (e.g., Figure 2 and Figure 4 The method of CDM testing for electronic module 105 in the middle is similar to that of... Figure 6 The CDM testing method for the Zhongdian Electronics Module 200 can be the same. For details, please refer to the following text, which will not be repeated here.

[0163] like Figure 6As shown, the charged device model may include a charging plate 301, a metal component 302, and an oscilloscope 303. The electronic module 200 can be placed on the charging plate 301, which charges the electronic module 200 to simulate the storage of static electricity. After charging, the metal component 302 can be moved towards the pins 202 of the electronic module 200, bringing it close to or in contact with them. This allows the stored charge in the electronic module 200 to flow out through the pins 202 to the metal component 302 (as shown by the dashed arrows in the figure, which indicate part of the discharge current path), simulating the discharge of the electronic module 200. The metal component 302 can be connected to the oscilloscope 303, which displays the discharge current for observation.

[0164] Figure 7 for Figure 6 A schematic diagram of the equivalent circuit of the CDM module in a CDM testing scenario. Figure 8 for Figure 2 and Figure 4 The equivalent circuit diagram of the electronic module in the CDM testing scenario.

[0165] Combination Figure 7 and Figure 8 As shown, compared to the electronic module 200 without a first cutting region, the electronic module 105 with a first cutting region exemplified in this application embodiment (e.g., Figure 2 and Figure 4 The equivalent charging capacitance of the electronic module 105 shown can be considered as the equivalent charging capacitance of the electronic module 200 that originally did not have the first cut-off region (such as C). S A capacitor (such as C) is connected in series on the basis. F This makes the equivalent charging capacitor of the electronic module 105 smaller, the discharge current of the electronic module 105 smaller, and improves the CDM capability of the electronic module 105.

[0166] The first grounding layer 111 in the electronic module 105 exemplified by the embodiments of this application includes a first main body 1113, and a first cutting region 111a (e.g., ...) is formed between the first main body 1113 and the sidewall 32 of the shield 30. Figure 4 Taking the electronic module 105 shown in the example as an example, CDM simulation and detection, and discharge current detection in actual discharge scenarios are performed on the electronic module 105 of the embodiment of this application and the electronic module 200 without the first cut-off area mentioned above.

[0167] Figure 9 This is a schematic diagram showing the current detected by each electronic module in a real discharge scenario. Figure 10 This is a schematic diagram of the current of each electronic module during CDM detection.

[0168] Combination Figure 9 and Figure 10 As shown, the peak current detected by electronic modules 200 and 105 in actual discharge scenarios is basically equivalent to the peak current detected in CDM simulation. Compared with electronic module 200, the electronic module 105 with a first cut-off region exemplified in this embodiment of the application shows a reduction of approximately 0.3A in current in both simulation and actual discharge scenario detection. The discharge current of electronic module 105 is smaller, and electronic module 105 has stronger CDM capability and electrostatic discharge capability.

[0169] Figure 11 for Figure 6 A schematic diagram of a discharge current detection result for a central electronic module. Figure 12 for Figure 4 A schematic diagram of a discharge current detection result for a central electronic module. Among them, Figure 11 and Figure 12 The discharge current results of electronic modules 200 and 105 in CDM simulation and actual discharge scenarios are shown respectively. Furthermore, electronic modules 200 and 105 are examples where the distance between the circuit board and the top wall of the shield (i.e., the distance between the first ground layer and the top wall in the first direction (e.g., the z-direction) is relatively small. It can be understood that the distance between the circuit board and the top wall in electronic module 200 is equal to the distance between the circuit board and the top wall in electronic module 105.

[0170] Figure 13 for Figure 6 A schematic diagram of another discharge current detection result for the electronic module. Figure 14 for Figure 4 A schematic diagram showing another discharge current detection result of the electronic module. Among them, Figure 13 and Figure 14 The discharge current results of electronic modules 200 and 105 in CDM simulation and actual discharge scenarios are shown respectively. Furthermore, electronic modules 200 and 105 are examples where the distance between the circuit board and the top wall of the shield (i.e., the distance between the first ground layer and the top wall in the first direction (e.g., the z-direction) is relatively large in the first direction (e.g., the z-direction). The distance between the circuit board and the top wall in electronic module 200 is equal to that in electronic module 105.

[0171] Combination Figure 11 and Figure 12 , Figure 13 and Figure 14It can be seen that, compared with the electronic module 200 without the first cutting region, the electronic module 105 with the first cutting region in the embodiment of this application has a discharge current that is reduced by about 0.3 to 0.4 A, and the CDM capability of the electronic module 105 is improved by more than 10%, such as by about 10% to 15%.

[0172] Combination Figure 11 and Figure 14 It can be seen that, compared with the electronic module 200 which does not have a first cutting area, the electronic module 105 which has a first cutting area and a larger top wall spacing between the circuit board (first ground layer) and the shielding component has a discharge current that is reduced by about 0.3A and the CDM capability of the electronic module 105 is improved by about 10%.

[0173] Taking the electronic module 105 of this application as an example, it has a first cut-off region 111a, which is located between the first main body 1113 and the side wall 32 of the shielding member 30 (e.g.) Figure 4 The electronic module 105 shown is subjected to CDM simulation testing and discharge current testing in actual discharge scenarios. Taking a shield wall thickness of approximately 0.7 mm and widths of the first and second cut-off regions of approximately 100 μm as an example, compared with the electronic module 200 without the first cut-off region, the discharge current decreases by 10% in CDM simulation testing and by approximately 13-15% in actual scenario testing. The reduced discharge current of the electronic module 105 improves its CDM capability by approximately 10%-15%, significantly enhancing its electrostatic discharge capability.

[0174] Taking the electronic module 105 of this application as an example, it has a first cut-off region 111a, which is located between the first portion 1111 and the second portion 1112 (e.g.) Figure 2 The electronic module 105 shown can also be used for CDM simulation testing and discharge current testing in actual discharge scenarios. Taking a shield wall thickness of approximately 0.7 mm and widths of the first and second cut-off regions of approximately 100 μm as an example, compared to the electronic module 200 without the first cut-off region, the discharge current decreases by 10% in CDM simulation testing and by approximately 10% in actual scenario testing. The reduced discharge current of the electronic module 105 improves its CDM capability by approximately 10%, significantly enhancing its electrostatic discharge capability.

[0175] It is understandable that when the width of the first cut area and the second cut area are further increased, the CDM capability of the electronic module 105 can be further improved, such as by about 15% to 20%.

[0176] In some embodiments, to further enhance the CDM capability of the electronic module 105, the electronic module 105 may also include an impedance device, which may be an electronic element or component capable of impedance adjustment.

[0177] Figure 15 This is a cross-sectional schematic diagram of another electronic module provided in an embodiment of this application. Figure 16 This is a cross-sectional schematic diagram of another electronic module provided in an embodiment of this application.

[0178] For example, see Figure 15 and Figure 16 As shown, the electronic module 105 includes an impedance device 50, which can be connected to the ground plane 11, such as by connecting the impedance device 50 in series with the ground plane 11. The added impedance device 50 can increase the impedance of the electronic module 105 in the discharge circuit during a discharge scenario, reduce or suppress the discharge current on the electronic module 105, and further improve the CDM capability and electrostatic discharge capability of the electronic module 105.

[0179] Impedance device 50 can be connected to the first ground layer 111, and also to the bottom ground layer (such as bottom ground layer 1120a) in the second ground layer 112, facilitating the layout of impedance device 50 on the circuit board 10. Of course, in some other embodiments, such as... Figure 15 and Figure 16 As shown, the impedance device 50 can also be connected to other second ground layers 112.

[0180] The number of impedance devices 50 can be one, or the number of impedance devices 50 can be multiple. For example, see Figure 15 As shown, taking the first cut-off region 111a of the first grounding layer 111 located between the first part 1111 and the second part 1112, and the second cut-off region 112a of the second grounding layer 112 located between the third part 1121 and the fourth part 1122 as an example, the impedance device 50 may include two. For example, the two impedance devices 50 may be connected to one of the second grounding layers 112, or the two impedance devices 50 may be located on both sides of the third part 1121 of the second grounding layer 112, and the impedance devices 50 may be connected to the third part 1121 and the fourth part 1122 respectively, so that the two impedance devices 50 are connected in series between the third part 1121 and the fourth part 1122.

[0181] like Figure 15 As shown, the impedance device 50 can be a resistor 51, and the equivalent resistance value of the resistor 51 can be in the range of 10nh to 33nh, which is convenient for processing and implementation while ensuring that the discharge current can be reduced well.

[0182] Or, such as Figure 16 As shown, the impedance device 50 can also be an inductor 52. The equivalent inductance value of the inductor 52 can range from 100 ohms to 1000 ohms, which facilitates fabrication while ensuring a significant reduction in discharge current.

[0183] It is understood that in examples where there are multiple impedance devices 50, all of the multiple impedance devices 50 can be either inductors 52 or resistors 51, or the multiple impedance devices 50 can be partly inductors 52 and partly resistors 51.

[0184] Alternatively, in some other embodiments, the impedance device 50 may be other types of impedance elements or components, such as capacitors, connecting wires, etc.

[0185] It should be noted that any of the electronic modules 105 mentioned above may include an impedance device 50. For example, in the example where the first ground layer of the electronic module 105 includes a first main body and the first cut-off area is located between the first main body and the side wall of the shield, the electronic module 105 may also include the aforementioned impedance device.

[0186] Figure 17 This is a cross-sectional schematic diagram of another electronic module provided in an embodiment of this application. Figure 18 This is a cross-sectional schematic diagram of another electronic module provided in an embodiment of this application.

[0187] For example, see Figure 17 and Figure 18 As shown, in the electronic module 105, the first cut-off region 111a is located between the first main body 1113 and the side wall 32 of the shield 30, and the second cut-off region 112a of the second ground layer 112 adjacent to the first ground layer 111 is located between the second main body 1123 and the side wall 32. Impedance devices 50 can also be connected in series on the first ground layer 111 and / or the second ground layer 112.

[0188] For example, Figure 17 and Figure 18 The diagram shows an example where the impedance device 50 is a single device, and the impedance device 50 is connected in series with the second ground layer 112 (i.e., the first intermediate layer 1120c) that is closest to the first ground layer 111. The impedance device 50 can be located on one side of the second main body 1123, and the impedance device 50 can be connected to the sidewall 32 of the second main body 1123 and the shield 30 respectively, so that the impedance device 50 is connected in series between the second main body 1123 and the shield 30.

[0189] Of course, in some other embodiments, the impedance device 50 may also be connected to other second ground layers 112, such as the second intermediate layer 1120d, the bottom ground layer 1120b, etc. The impedance device 50 may also be connected to the first ground layer 111. The number of impedance devices 50 may also be multiple.

[0190] like Figure 17 As shown, impedance device 50 can be resistor 51, or, as... Figure 18 As shown, the impedance device 50 can also be an inductor 52. In an example where there are multiple impedance devices 50, each of the multiple impedance devices 50 can be either an inductor 52 or a resistor 51, or the multiple impedance devices 50 can be partially inductors 52 and partially resistors 51.

[0191] Taking the electronic module 105 of this application as an example, which has an impedance device 50 and a first cut-off region 111a located between the first main body 1113 and the side wall 32 of the shield 30, as an example (e.g.) Figure 17 The electronic module 105 shown is used for CDM simulation testing and discharge current testing in actual discharge scenarios.

[0192] Figure 19 for Figure 17 and Figure 18 The equivalent circuit diagram of the electronic module in the CDM testing scenario.

[0193] See Figure 19 As shown, compared to the electronic module 200 which does not have a first cutting region (equivalent circuit can be found in...), Figure 7 As shown), the electronic module 105, which has an impedance device and a first cut-off region, has an equivalent charging capacitance that can be considered as the equivalent charging capacitance of the electronic module 200, which originally did not have the first cut-off region (e.g., C). S A capacitor (such as C) is connected in series on the basis. F ) and impedance (such as C) x This further reduces the equivalent charging capacitance of the electronic module 105, resulting in a smaller discharge current and improved CDM capability of the electronic module 105.

[0194] In the example where the electronic module 105 has an impedance device, taking the width of the first cut-off region and the second cut-off region as approximately 100 μm, compared with the electronic module 200 without the first cut-off region, the discharge current decreases by approximately 0.5 A to 0.6 A in CDM simulation testing. The discharge current of the electronic module 105 is significantly reduced, and the CDM capability of the electronic module 105 can be improved by approximately 20%, significantly enhancing the electrostatic discharge capability of the electronic module 105.

[0195] In the example where the impedance device is an inductor, compared to the electronic module 200 without the first cut-off region, the discharge current in CDM simulation testing can be reduced by approximately 0.86 times. In the example where the impedance device is a resistor, compared to the electronic module 200 without the first cut-off region, the discharge current in CDM simulation testing can be reduced by approximately 0.83 times.

[0196] In some embodiments, the material of the shielding member 30 may also be an anisotropic material. For example, in the direction intersecting with the sidewall 32, such as in the direction perpendicular to the sidewall 32, the sidewall 32 may have shielding characteristics, playing an electromagnetic shielding role and reducing electromagnetic interference.

[0197] In the direction parallel to the sidewall 32, the sidewall 32 may not have shielding characteristics. The sidewall 32 can be used as an impedance device. The sidewall 32 can be connected to the ground layer 11 to increase the impedance on the discharge circuit and reduce the discharge current on the electronic module 105.

[0198] Correspondingly, in the direction intersecting with the top wall 31, such as in the direction perpendicular to the top wall 31 (e.g., the z-direction), the top wall 31 can have shielding characteristics, achieving electromagnetic shielding. In the direction parallel to the top wall 31 (e.g., the xy-direction), the top wall 31 may not have shielding characteristics; instead, it can act as an impedance device. The top wall 31 can be connected to the shielding component 30 through the side wall 32, increasing the impedance in the discharge circuit and reducing the discharge current.

[0199] Using the shielding material 30 of the electronic module 105 in this application as an anisotropic material, CDM simulation testing and discharge current testing in actual discharge scenarios were conducted.

[0200] Figure 20 This is an equivalent circuit diagram illustrating the shielding effect of a shielding component in another electronic module provided in an embodiment of this application. Figure 21 This is a schematic diagram of the equivalent circuit of another electronic module in a CDM testing scenario provided in the embodiments of this application.

[0201] Understandably, when the top and side walls of the shielding component act as impedance devices, the equivalent circuit diagram of the electronic module 105 in the CDM testing scenario can be referenced. Figure 19 As shown. When the top and side walls of the shielding component have shielding properties, the equivalent circuit of the electronic module 105 can be found in [reference needed]. Figure 20 As shown. Combined with Figure 21 As shown, the shielding component is made of anisotropic material, compared to the electronic module 200 which does not have a first cut-off region (the equivalent circuit can be found in [reference]). Figure 7As shown), the equivalent charging capacitor of electronic module 105 can be considered as the equivalent charging capacitor of electronic module 200 (e.g., C) in the original electronic module 200 which did not have the first cut-off region. S Two capacitors (such as C) are connected in series on the basis. F C m ) and impedance (such as C) x This makes the equivalent charging capacitor of the electronic module 105 smaller, significantly reduces the discharge current of the electronic module 105, and improves the CDM capability of the electronic module 105.

[0202] For example, when the top and side walls of the shielding component have shielding characteristics, compared with the electronic module 200 without the first cut-off region, the discharge current in CDM simulation testing can be reduced by about 30%, the discharge current of the electronic module 105 is significantly reduced, and the CDM capability of the electronic module 105 can be improved by more than 30%. When the top and side walls of the shielding component act as impedance devices, compared with the electronic module 200 without the first cut-off region, the discharge current in CDM simulation testing can be reduced by about 30% to 50%, the discharge current of the electronic module 105 is reduced even more significantly, and the CDM capability of the electronic module 105 can be improved by about 30% to 50%.

[0203] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances. The terms "first," "second," "third," "fourth," etc. (if present) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0204] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic module, characterized by include: A circuit board, the circuit board including a first surface and a second surface opposite to each other in a first direction, the circuit board further including a plurality of ground layers stacked between the first surface and the second surface; An electronic device disposed on the first surface; A shielding component, comprising a top wall and a side wall, the side wall being disposed around one side of the top wall, the top wall and the side wall forming a cavity, the end of the side wall away from the top wall forming an opening, the shielding component covering the circuit board and the electronic device, the second surface of the circuit board being exposed through the opening; The plurality of grounding layers includes at least a first grounding layer disposed closest to the first surface, the first grounding layer being opposite to the top wall in the first direction, the first grounding layer having a first cutting region that penetrates the first grounding layer in the first direction.

2. The electronic module of claim 1, wherein, The plurality of grounding layers further includes a second grounding layer, which is located on the side of the first grounding layer that faces away from the first surface; The second grounding layer has a second cut-off region that penetrates the second grounding layer in the first direction.

3. The electronic module of claim 2, wherein, The first grounding layer includes a first part and a second part, with a first cutting region between the first part and the second part, and the first cutting region surrounding the first part; Along the first direction, the vertical projection of one of the electronic devices corresponds to one of the first portions, and the electronic device is electrically connected to the first portion.

4. The electronic module of claim 2, wherein, The first grounding layer includes a first main body portion, and a first cutting area is provided between the first main body portion and the side wall of the shielding member, the first cutting area being disposed around the first main body portion; Along the first direction, the vertical projections of a plurality of electronic devices are located on the first main body, and the electronic devices are electrically connected to the first main body.

5. The electronic module of claim 3, wherein, The second grounding layer includes a third portion and a fourth portion, with a second cutting region between the third portion and the fourth portion, the second cutting region being disposed around the third portion.

6. The electronic module of claim 5, wherein, In the first direction, the vertical projection of the first part overlaps the vertical projection of the third part, and the vertical projection of the second part overlaps the vertical projection of the fourth part.

7. The electronic module according to claim 5 or 6, characterized in that The second grounding layer includes at least a bottom grounding layer disposed adjacent to the second surface, and at least the fourth portion of the bottom grounding layer is in contact with the inner surface of the sidewall; The electronic module also includes multiple pins, which are disposed on the second surface; Along the first direction, at least a portion of the projection of the pin is located on the fourth portion of the bottom ground layer, and the pin is electrically connected to the fourth portion.

8. The electronic module of claim 4, wherein, At least a portion of the second grounding layer adjacent to the first grounding layer includes a second main body portion, and the second main body portion and the shielding member have a second cutting region, the second cutting region being disposed around the second main body portion.

9. The electronic module of claim 8, wherein, In the first direction, the vertical projection of the first main body portion overlaps the vertical projection of the second main body portion.

10. The electronic module according to claim 8 or 9, characterized in that The second grounding layer includes at least a bottom grounding layer disposed adjacent to the second surface; The bottom grounding layer includes a fifth part and a sixth part, with a second cutting area between the fifth part and the sixth part. The second cutting area is disposed around the fifth part, and the sixth part is in contact with the inner surface of the sidewall. The electronic module also includes a plurality of pins, which are disposed on the second surface; Along the first direction, at least a portion of the projection of the pin is located on the sixth portion of the bottom ground layer, and the pin is electrically connected to the sixth portion.

11. The electronic module of any of claims 1-10, wherein, It also includes an impedance device, which is connected to the ground plane.

12. The electronic module of claim 11, wherein, The impedance device includes at least one or more combinations of resistors and inductors.

13. The electronic module of any of claims 1-12, wherein, The material of the shielding component includes anisotropic materials; In the direction intersecting with the sidewall, the sidewall has shielding properties; in the direction parallel to the sidewall, the sidewall acts as an impedance device; and the sidewall is in contact with the ground layer. The top wall has shielding properties in the direction intersecting with it, and acts as an impedance device in the direction parallel to it.

14. The electronic module according to any one of claims 2-8, characterized in that, The widths of the first and second cut regions range from 100 μm to 200 μm.

15. An electronic device, characterized in that, It includes a motherboard and an electronic module as described in any one of claims 1-14, wherein the electronic module is disposed on the motherboard and electrically connected to the motherboard.

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