BT resin carrier plate laser processing method containing quartz glass cloth and carrier plate
Patent Information
- Application Number
- CN202611216953.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-08-12
- Publication Date
- 2026-11-03
AI Technical Summary
In existing laser blind hole processing, the low absorption rate of quartz fiberglass cloth for ultraviolet lasers leads to the quartz fiberglass bundles easily clumping together and remaining at the bottom of the blind hole when the heat input is insufficient or the energy distribution is improper. This results in black spot defects, which seriously affect the contact between the bottom of the hole and the underlying copper pad, or cause micro-open circuits, which are serious quality risks.
A three-stage progressive laser processing method is adopted. First, the copper foil is browned and thinned to control the copper thickness within a range that is easy for the laser to penetrate in one go. Then, the surface copper foil is peeled off by the first stage of high-energy wide pulse scanning, the resin substrate is decomposed by the second stage of low-energy narrow pulse multiple scanning, and the quartz glass fiber is removed by the third stage of low-energy multiple scanning. The progressive energy release mode ensures the uniformity of the hole wall.
It effectively avoids quartz fiberglass residue, ensures the processing quality of blind holes, guarantees hole wall quality and conductivity reliability, improves processing repeatability and hole shape accuracy, and meets the signal transmission requirements of high-density interconnects.
Smart Images
Figure CN123035611A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of printed circuit board technology, and more specifically, to a laser processing method for a BT resin substrate containing quartz fiberglass cloth and the substrate itself. Background Technology
[0002] With the development trend of high-speed signal transmission and high-density interconnection in AI servers, high Tg (glass transition temperature) BT resin substrates are widely used as the core layer material for buried vias in high-end HDI boards due to their high glass transition temperature, low coefficient of thermal expansion, and high rigidity. To provide sufficient mechanical strength and dimensional stability, these BT resin substrates typically contain quartz fiberglass cloth. However, in existing laser blind via processing, quartz fiberglass has a low absorption rate for ultraviolet lasers and mainly relies on the decomposition of the resin matrix for passive peeling. If the heat input is insufficient or the energy distribution is improper, the resin decomposition is incomplete, and the quartz fiberglass bundles easily clump together and remain at the bottom of the blind via, forming black spot defects that are difficult to clean. This leads to serious quality risks such as poor contact between the bottom of the via and the underlying copper pad or micro-open circuits. Summary of the Invention
[0003] The purpose of this invention is to provide a laser processing method and carrier plate for BT resin carrier plates containing quartz fiberglass cloth, which can eliminate quartz fiberglass residue and avoid carbonization of hole walls caused by excessive energy or concentrated scanning, thus ensuring the processing quality of blind holes.
[0004] A method for laser processing of BT resin carrier plates containing quartz fiberglass cloth includes the following steps: A carrier board to be processed is provided, the carrier board comprising a BT resin substrate containing quartz fiberglass cloth and a surface copper foil located on the surface of the BT resin substrate; The copper foil is subjected to a browning and thinning treatment to ensure that the copper thickness is within a preset range; The first stage of laser processing is performed, using the first laser parameters to vaporize and peel off the surface copper foil in a single scan, forming a blind hole opening that exposes the BT resin substrate; The second stage of laser processing is performed, and the exposed BT resin substrate is scanned multiple times using the second laser parameter to decompose the BT resin substrate layer by layer and remove the surface quartz fiberglass cloth fibers. The energy of the second laser parameter is less than the energy of the first laser parameter. The third stage of laser processing is performed, using a third laser parameter for multiple scans to remove residual resin and quartz glass fiber from the BT resin substrate. The energy of the third laser parameter is less than that of the first laser parameter.
[0005] In the above technical solution, the copper foil is first thinned by browning to control the copper thickness within a preset range that is easily penetrated by the laser in one go. Then, a three-stage laser processing with progressively higher parameters is used. The first stage of laser processing uses high laser energy combined with a wide pulse single scan to directly vaporize and peel off the surface copper foil. This avoids the enlargement of the aperture and the accumulation of heat in the medium caused by repeated heating of the copper layer through multiple scans. At the same time, the high-energy pulse instantly burns the interface between the copper and the resin, breaking the bonding layer and providing a clean starting surface for subsequent processing. The second stage of laser processing switches to lower energy and narrower pulses, performing multiple scans on the exposed BT resin substrate. Because the heat input in each scan is limited, it only decomposes a very thin layer of resin on the surface, resulting in a shallow heat-affected zone and preventing the hole walls from reaching carbonization temperatures. Multiple scans allow heat to accumulate gently and progressively deeper, layer by layer, vaporizing the resin and gradually exposing and loosening the quartz fiber bundles. Under the repeated action of subsequent pulses, these bundles are peeled off bit by bit, preventing the large-scale instantaneous detachment of fiber bundles under a single high-energy impact, which would then clump together and become stuck at the bottom of the hole. The third stage of laser processing continues with multiple low-energy scans to further remove the loosened bottom fiber and trace amounts of residual resin. The progressive energy release mode ensures that the hole walls are heated evenly and gently, preventing localized overheating and the formation of carbonization pits, while ensuring the complete removal of quartz fiber from the bottom of the hole. This avoids laser residue on high-Tg BT resin containing quartz fiber, while simultaneously ensuring hole wall quality and the reliability of blind hole conductivity.
[0006] Furthermore, the second laser processing segment includes at least two scans, and the third laser processing segment includes at least two scans.
[0007] In the above technical solution, by setting both the second and third laser processing stages to at least two scans, the ablation process of the BT resin substrate is layered and progressive, and the heat accumulation is gradual and uniform. This not only fully decomposes the resin matrix but also gradually peels off the loose quartz glass fibers, preventing glass fiber jamming or hole wall damage caused by insufficient energy or overheating in a single scan. This further ensures the cleanliness of the hole bottom and the flatness of the hole wall.
[0008] Furthermore, the number of scans in the second laser processing segment is equal to the number of scans in the third laser processing segment.
[0009] In the above technical solution, by setting the number of scans for the second and third laser processing stages to be equal, the ablation depth and heat input of the upper and lower parts of the dielectric layer are kept balanced, which helps to form a symmetrical and uniform blind hole profile and consistent hole wall roughness, and avoids local over-ablation or residue caused by the difference in the number of scans, thereby improving the reproducibility of the overall processing and the hole shape accuracy.
[0010] Furthermore, the same optical mask is used in all three stages of laser processing—the first, second, and third—to lock the laser spot diameter.
[0011] In the above technical solution, by using the same optical mask to lock the laser spot diameter in all three laser processing stages, the energy distribution and processing spot size of each scan are kept highly consistent, effectively stabilizing the aperture and taper of the blind hole opening, improving the consistency of blind holes in different batches and different positions, and meeting the requirements of high-density interconnects for micro-hole size accuracy.
[0012] Furthermore, the aperture of the blind hole opening is formed to be 114 μm using the optical mask.
[0013] In the above technical solution, the aperture of the blind hole is stably controlled at 114μm by using an optical mask, which realizes the precise quantification of the aperture size. This is beneficial for unifying the hole parameters in ultra-high density wiring design, enhancing the compatibility with subsequent electroplating hole filling and layering processes, and ensuring the stability and consistency of signal transmission performance.
[0014] Furthermore, the laser pulse width used in the first laser processing segment is greater than the laser pulse width used in the second and third laser processing segments.
[0015] In the above technical solution, by making the laser pulse width of the first laser processing segment greater than that of the second and third segments, the wider pulse can concentrate energy to enhance the absorption of laser by the metallic copper, and completely peel off the surface copper foil in one go. The subsequent dielectric processing uses a narrower pulse, and the energy release is more gentle, avoiding excessive thermal shock to the deep BT resin and the hole wall. Thus, while ensuring the copper opening efficiency, the risk of hole wall carbonization and microcracks is reduced.
[0016] Furthermore, the second laser processing segment and the third laser processing segment both use the same laser pulse width and laser energy.
[0017] In the above technical solution, by using the same laser pulse width and energy for the second and third laser processing, the thermal impact characteristics of the two-layer ablation process are unified, and the energy progression is uniform and stable. This is conducive to completely vaporizing and removing the loosened glass fiber bundles in the early stage, avoiding residual glass fiber or local ablation pits caused by parameter abrupt changes, and further consolidating the effect of no glass fiber residue at the bottom of the hole.
[0018] Furthermore, after the copper foil undergoes browning and thinning treatment, the preset range for copper thickness is 10±1μm.
[0019] In the above technical solution, by controlling the copper thickness after browning and thinning treatment within a preset range of 10±1μm, the thickness of the surface copper foil can be completely vaporized and peeled off by the first laser energy in one go, while avoiding the positioning difficulties that may be caused by the copper layer being too thin or the problems of incomplete copper removal and copper slag residue caused by the copper layer being too thick. This provides ideal basic conditions for the stable opening and uniform ablation of the subsequent BT resin substrate.
[0020] Furthermore, the glass transition temperature of the BT resin substrate is 230°C.
[0021] In the above technical solution, for BT resin substrates with a glass transition temperature as high as 230℃, the combined three-stage laser parameter adjustment and multiple scanning strategy effectively overcome the processing obstacles of high Tg material thermal decomposition threshold and glass fiber difficulty in falling off with resin decomposition, thus expanding the application reliability of BT resin in high-order buried hole core boards.
[0022] A BT resin carrier containing quartz fiberglass cloth includes a BT resin substrate containing quartz fiberglass cloth and a copper foil layer on the surface of the BT resin substrate. An opening is formed on the copper foil layer, and a blind hole communicating with the opening is formed in the BT resin substrate. The blind hole is formed by the laser processing method described above.
[0023] In the above technical solution, the blind vias of the carrier board are formed by the laser processing method described above, which enables the carrier board to achieve clean and low impedance electrical conduction in the buried via interlayer connection, eliminating problems such as micro-open circuits or poor contact that may be caused by glass fiber residue, and improving the signal integrity and long-term working stability of the multilayer high-density interconnect board manufactured based on the carrier board in high temperature and high reliability environments.
[0024] Compared with existing technologies, the advantages of this invention are as follows: By first performing a browning and thinning treatment on the copper foil to control the copper thickness within a preset range that is easily penetrated by the laser in one go, a three-stage progressive laser processing is then employed. The first stage of laser processing uses high laser energy combined with a wide-pulse single scan to directly vaporize and peel off the surface copper foil. This avoids the enlargement of the aperture and the accumulation of heat in the medium caused by repeated heating of the copper layer through multiple scans. Furthermore, the high-energy pulse instantly burns the interface between the copper and the resin, breaking the adhesive layer and providing a clean starting surface for subsequent processing. The second stage of laser processing switches to lower energy and narrower pulses, performing multiple scans on the exposed BT resin substrate. Because the heat input in each scan is limited, it only decomposes a very thin layer of resin on the surface, resulting in a shallow heat-affected zone and preventing the hole walls from reaching carbonization temperatures. Multiple scans allow heat to accumulate gently and progressively deeper, layer by layer, vaporizing the resin and gradually exposing and loosening the quartz fiber bundles. Under the repeated action of subsequent pulses, these bundles are peeled off bit by bit, preventing the large-scale instantaneous detachment of fiber bundles under a single high-energy impact, which would then clump together and become stuck at the bottom of the hole. The third stage of laser processing continues with multiple low-energy scans to further remove the loosened bottom fiber and trace amounts of residual resin. The progressive energy release mode ensures that the hole walls are heated evenly and gently, preventing localized overheating and the formation of carbonization pits, while ensuring the complete removal of quartz fiber from the bottom of the hole. This avoids laser residue on high-Tg BT resin containing quartz fiber, while simultaneously ensuring hole wall quality and the reliability of blind hole conductivity. Attached Figure Description
[0025] Figure 1 This is a schematic flowchart of a laser processing method for a BT resin carrier containing quartz fiberglass cloth, according to an embodiment of the present invention. Detailed Implementation
[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0027] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0028] Please refer to Figure 1 In a preferred embodiment, a laser processing method for a BT resin carrier plate containing quartz fiberglass cloth according to the present invention includes the following steps: A carrier board to be processed is provided, the carrier board including a BT resin substrate containing quartz fiberglass cloth and a surface copper foil on the surface of the BT resin substrate. The copper foil is subjected to a browning and thinning treatment to ensure that the copper thickness is within a preset range; The first stage of laser processing is performed, using the first laser parameters to vaporize and peel off the surface copper foil in a single scan, forming a blind hole opening that exposes the BT resin substrate; The second stage of laser processing is performed, and the exposed BT resin substrate is scanned multiple times using the second laser parameters. The BT resin substrate is decomposed layer by layer and the surface quartz fiberglass cloth fibers are removed. The energy of the second laser parameters is less than that of the first laser parameters. The third stage of laser processing is performed, using the third laser parameter for multiple scans to remove residual resin and quartz glass fiber from the BT resin substrate. The energy of the third laser parameter is less than that of the first laser parameter.
[0029] For example, the substrate to be processed can be a core board containing high Tg BT resin and at least one layer of quartz fiberglass cloth, formed by hot pressing. The initial thickness of the copper foil on its surface can be selected according to design requirements, but it is always greater than the preset thickness after thinning. The browning treatment simultaneously achieves uniform copper layer thinning and surface modification. The browning thinning treatment can, for example, use a browning solution containing oxidants and film-forming additives to form a light-absorbing organometallic conversion film on the copper surface. During the process, by controlling the conveying speed or immersion time, the copper thickness is micro-etched to a preset range, and the film structure is beneficial to improving the absorption efficiency of subsequent laser energy.
[0030] In the first stage of laser processing, an ultraviolet laser can be used as the laser source. After beam expansion, optical masking, and focusing, the beam acts on the surface of the substrate with a defined energy density and spot size. The first laser parameters are selected to have relatively high pulse energy and a wide pulse width. The path of a single scan can be set as a spiral or concentric circle trajectory expanding outward from the center, so that the surface copper foil is completely vaporized in one go and directly forms a blind hole opening, exposing the underlying resin substrate.
[0031] The second stage of laser processing switches to a lower energy and narrower pulse width parameter combination. The laser focal plane gradually moves downward along the depth direction as the scanning progresses, and each scan only peels off an extremely thin layer of material. As the number of scans increases, the BT resin is removed layer by layer, and the quartz glass fiber bundles embedded in the resin are gradually exposed and loosened from top to bottom. Under the continuous tapping of subsequent pulses, they are discharged from the hole in the form of fine debris, preventing the glass fiber bundles from falling off in whole pieces and getting stuck at the bottom of the hole.
[0032] The third stage of laser processing continues with low-energy, multiple scans. For blind vias that are already largely formed, it further cleans away any residual resin and loosened quartz fiber fragments from the bottom and corners of the via walls. This stage of processing allows for localized reciprocating scans in the bottom area of the via, ensuring the solder pads are thoroughly cleaned. At the same time, the gentle, low-energy heat input effectively prevents thermal damage to the underlying copper pads.
[0033] First, the copper foil is thinned by browning, controlling the copper thickness within a preset range that allows for easy laser penetration in a single pass. Then, a three-stage laser processing with progressively higher parameters is employed. The first stage uses high laser energy combined with a wide-pulse single scan to directly vaporize and peel off the surface copper foil. This avoids the enlargement of the aperture and heat accumulation in the medium caused by repeated heating of the copper layer during multiple scans. The high-energy pulse also instantly burns the interface between the copper and resin, breaking the bonding layer and providing a clean starting surface for subsequent processing. The second stage switches to lower energy and a narrower pulse, performing multiple scans on the exposed BT resin substrate. Because the heat input in each scan is limited, it can only decompose a very thin layer of resin, resulting in a shallow heat-affected zone and preventing the aperture wall from reaching carbonization temperature. Multiple scans allow heat to accumulate gently and progressively deeper, layer by layer, vaporizing the resin and gradually exposing and loosening the quartz glass fiber bundles. Under the repeated action of subsequent pulses, these bundles are peeled off bit by bit, preventing the large-scale instantaneous detachment of the glass fiber bundles under a single high-energy impact, which would then become stuck at the bottom of the aperture due to insufficient drainage. The third stage of laser processing continues with multiple low-energy scans to further remove loosened bottom glass fibers and trace amounts of residual resin. The progressively increasing energy release mode ensures that the hole walls are heated evenly and gently, preventing localized overheating and the formation of carbonization pits, while also ensuring the complete removal of quartz glass fibers from the bottom of the hole. This avoids laser residues containing high Tg quartz glass fibers and BT resin, while simultaneously ensuring hole wall quality and the reliability of blind hole conductivity.
[0034] The second laser processing stage involves at least two scans, and the third laser processing stage involves at least two scans.
[0035] For example, the selection of the actual number of scans can be determined based on the thickness of the BT resin substrate and the number and distribution of the quartz fiberglass cloth. For instance, when the substrate contains multiple layers of fiberglass cloth, the number of scans in the second stage of processing can be increased accordingly to ensure that each fiberglass bundle can be fully exposed and gradually peeled off, avoiding the phenomenon of the middle layer fiberglass breaking and remaining in the hole.
[0036] By setting both the second and third laser processing stages to at least two scans, the ablation process of the BT resin substrate is layered and progressive, with a gradual and uniform heat accumulation. This not only fully decomposes the resin matrix but also gradually peels off loose quartz glass fibers, preventing glass fiber jamming or hole wall damage caused by insufficient energy or overheating in a single scan. This further ensures the cleanliness of the hole bottom and the flatness of the hole wall.
[0037] In this embodiment, the number of scans in the second laser processing stage is equal to the number of scans in the third laser processing stage. By setting the number of scans in the second and third laser processing stages to be equal, the ablation depth and heat input of the upper and lower parts of the dielectric layer are kept balanced. This helps to form a symmetrical and uniform blind hole profile and consistent hole wall roughness, avoiding local over-ablation or residue caused by differences in the number of scans, thereby improving the reproducibility of the overall processing and the hole shape accuracy.
[0038] The same optical mask was used to lock the laser spot diameter during the first, second, and third laser processing stages.
[0039] For example, the optical mask can be a thin metal sheet with a fixed circular aperture, mounted between the beam expander and the focusing lens in the laser optical path. No mask replacement is required during processing, thus ensuring a constant spot size acting on the carrier surface in the three processing stages. This simplifies the process and helps maintain the consistency of the blind hole opening diameter.
[0040] By using the same optical mask to lock the laser spot diameter in all three laser processing stages, the energy distribution and processing spot size of each scan are kept highly consistent. This effectively stabilizes the aperture and taper of the blind hole opening, improves the consistency of blind holes in different batches and positions, and meets the requirements of high-density interconnects for micro-hole size accuracy.
[0041] In this embodiment, the aperture of the blind via is formed to be 114 μm using an optical mask. By using an optical mask to stably control the aperture of the blind via at 114 μm, the aperture size is precisely quantified. This is beneficial for unifying via parameters in ultra-high density wiring designs, enhancing compatibility with subsequent electroplating and overlay processes, and ensuring stable and consistent signal transmission performance.
[0042] It is understandable that, in specific implementation, the aperture value can be selected according to the substrate design and the requirements of subsequent electroplating and filling. The 114μm aperture in this embodiment can match the size of the fine line pads and provide a reasonable depth-to-diameter ratio environment for uniform filling of chemical copper plating and electroplating.
[0043] The laser pulse width used in the first laser processing stage is greater than that used in the second and third laser processing stages.
[0044] For example, the pulse width can be adjusted within the range allowed by the laser. The first stage of processing can use a wider pulse at the nanosecond level to accumulate enough heat to vaporize the copper layer instantly. The second and third stages of processing switch to a narrower pulse width, which shortens the single pulse duration and confines the heat-affected zone to the shallow surface, thereby efficiently removing resin and glass fiber without damaging the hole wall.
[0045] By making the laser pulse width of the first laser processing segment greater than that of the second and third segments, the wider pulse can concentrate energy to enhance the absorption of laser by the metallic copper, completely peeling off the surface copper foil in one go. Subsequent dielectric processing uses a narrower pulse, resulting in a gentler energy release and avoiding excessive thermal shock to the deep BT resin and hole walls. This ensures copper opening efficiency while reducing the risk of hole wall carbonization and microcracks.
[0046] In this embodiment, the second and third laser processing stages use the same laser pulse width and laser energy. By using the same laser pulse width and energy for the second and third laser processing stages, the thermal impact characteristics of the two-layer ablation process are unified, and the energy progression is uniform and stable. This facilitates the complete vaporization and removal of previously loosened glass fiber bundles, avoiding residual glass fibers or localized ablation pits caused by parameter abrupt changes, and further consolidating the effect of no glass fiber residue at the bottom of the hole.
[0047] After the copper foil undergoes browning and thinning treatment, the preset range for copper thickness is 10±1μm. By controlling the copper thickness after browning and thinning treatment within the preset range of 10±1μm, the thickness of the surface copper foil can be completely vaporized and peeled off in one go by the first stage of laser energy. This avoids the positioning difficulties that may be caused by an excessively thin copper layer or the problems of incomplete copper removal and copper slag residue caused by an excessively thick copper layer. This provides ideal basic conditions for the subsequent stable windowing and uniform ablation of the BT resin substrate.
[0048] The glass transition temperature of the BT resin substrate is 230°C. This type of high-Tg BT resin substrate has high crosslinking density, low coefficient of thermal expansion and excellent resistance to high-temperature delamination, making it suitable for multiple lead-free reflow soldering packaging scenarios. Its internal quartz fiberglass cloth serves as a reinforcing skeleton, providing additional rigid constraints in the X-Y direction.
[0049] For BT resin substrates with a glass transition temperature as high as 230℃, a combined three-stage laser parameter adjustment and multiple scanning strategy effectively overcomes the processing obstacles of high Tg material thermal decomposition threshold and glass fiber difficulty in falling off with resin decomposition, thus expanding the reliability of BT resin in high-order buried via core boards.
[0050] This application also provides a BT resin carrier containing quartz fiberglass cloth, including a BT resin substrate containing quartz fiberglass cloth and a copper foil layer on the surface of the BT resin substrate. An opening is formed on the copper foil layer, and a blind hole communicating with the opening is formed in the BT resin substrate. The blind hole is formed by the laser processing method described above.
[0051] The blind vias of the carrier board are formed using the laser processing method described above, which enables the carrier board to achieve clean and low-impedance electrical conduction in the buried via interlayer connection. This eliminates problems such as micro-open circuits or poor contact that may be caused by glass fiber residue, and improves the signal integrity and long-term working stability of the multilayer high-density interconnect board manufactured based on this carrier board in high-temperature and high-reliability environments.
[0052] In the description of this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.
[0053] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A method for laser processing of BT resin carrier plates containing quartz fiberglass cloth, characterized in that, Includes the following steps: A carrier board to be processed is provided, the carrier board comprising a BT resin substrate containing quartz fiberglass cloth and a surface copper foil located on the surface of the BT resin substrate; The copper foil is subjected to a browning and thinning treatment to ensure that the copper thickness is within a preset range; The first stage of laser processing is performed, using the first laser parameters to vaporize and peel off the surface copper foil in a single scan, forming a blind hole opening that exposes the BT resin substrate; The second stage of laser processing is performed, and the exposed BT resin substrate is scanned multiple times using the second laser parameter to decompose the BT resin substrate layer by layer and remove the surface quartz fiberglass cloth fibers. The energy of the second laser parameter is less than the energy of the first laser parameter. The third stage of laser processing is performed, using a third laser parameter for multiple scans to remove residual resin and quartz glass fiber from the BT resin substrate. The energy of the third laser parameter is less than that of the first laser parameter.
2. The laser processing method for BT resin carrier plates containing quartz fiberglass cloth according to claim 1, characterized in that, The second laser processing segment includes at least two scans, and the third laser processing segment includes at least two scans.
3. The laser processing method for BT resin carrier plates containing quartz fiberglass cloth according to claim 2, characterized in that, The number of scans for the second laser processing segment is equal to the number of scans for the third laser processing segment.
4. The laser processing method for BT resin carrier plates containing quartz fiberglass cloth according to claim 1, characterized in that, The same optical mask was used to lock the laser spot diameter during the first, second, and third laser processing stages.
5. The laser processing method for BT resin carrier plates containing quartz fiberglass cloth according to claim 4, characterized in that, The aperture of the blind hole is formed to be 114 μm using the optical mask.
6. The laser processing method for BT resin carrier plates containing quartz fiberglass cloth according to claim 1, characterized in that, The laser pulse width used in the first laser processing segment is greater than that used in the second and third laser processing segments.
7. The laser processing method for BT resin carrier plates containing quartz fiberglass cloth according to claim 6, characterized in that, The second and third laser processing stages use the same laser pulse width and laser energy.
8. The laser processing method for BT resin carrier plates containing quartz fiberglass cloth according to claim 1, characterized in that, After the copper foil is subjected to browning and thinning treatment, the preset range of copper thickness is 10±1μm.
9. The laser processing method for BT resin carrier plates containing quartz fiberglass cloth according to claim 1, characterized in that, The glass transition temperature of the BT resin substrate is 230°C.
10. A BT resin carrier plate containing quartz fiberglass cloth, characterized in that, The invention comprises a BT resin substrate containing quartz fiberglass cloth and a copper foil layer on the surface of the BT resin substrate. An opening is formed on the copper foil layer, and a blind hole communicating with the opening is formed in the BT resin substrate. The blind hole is formed by the laser processing method according to any one of claims 1 to 9.