Heat dissipation device, leak detection method, and electronic device

Abstract

The application discloses a heat dissipation device, a leakage detection method and electronic equipment, and belongs to the technical field of heat dissipation. The heat dissipation device comprises an immersion heat dissipation assembly, a cold plate heat dissipation assembly and a leakage detection assembly. The liquid cooling tank of the immersion heat dissipation assembly has a mounting cavity for mounting a heat generating component. The mounting cavity is filled with phase change medium for immersing the heat generating component. The cold plate heat dissipation assembly comprises a cold plate and a second heat dissipation component. The cold plate is arranged in the mounting cavity and is attached to a part of the heat generating component. The cold plate and the second heat dissipation component form a liquid cooling loop for circulating and flowing cooling liquid. The leakage detection assembly can collect a liquid level image in the mounting cavity and determine whether the cold plate heat dissipation assembly leaks in the mounting cavity according to the liquid level image. The leakage of the cooling liquid is determined based on the liquid level image. Therefore, it is not necessary to arrange a detection element in the phase change medium, so that the reliability and service life of the leakage detection assembly are improved, and the risk of failure of the leakage detection assembly is reduced.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling technology, and more specifically, to a heat dissipation device, a leakage detection method, and an electronic device. Background Technology

[0002] With the rapid development of large-scale artificial intelligence model training, high-performance computing, and other related businesses, the power consumption of heat-generating components in electronic devices continues to rise, and the heat dissipation system needs to dissipate more and more heat, placing higher demands on heat dissipation capabilities.

[0003] Air cooling has limited heat dissipation capacity and cannot meet the heat dissipation needs of high-power heat-generating components. Liquid cooling technology, with its strong heat dissipation capacity, is increasingly widely used in electronic devices. In liquid cooling, the heat-generating component is immersed in the cooling medium and exchanges heat directly with the cooling medium. The heat-generating component can also be attached to the cold plate and exchange heat indirectly through the coolant circulating in the cold plate.

[0004] In related technologies, heat dissipation devices that combine immersion cooling and cold plate cooling have emerged. However, the coolant in the cold plate may leak into the cooling medium of the immersion cooling. Cold plate leakage is not easy to detect in time, which affects the operational reliability of the heat dissipation device. Summary of the Invention

[0005] This invention provides a heat dissipation device to at least solve the problem that cold plate leakage cannot be detected in a timely manner in related technologies.

[0006] A heat dissipation device according to an embodiment of the present invention includes: an immersion heat dissipation assembly, a cold plate heat dissipation assembly, and a leak detection assembly. The immersion heat dissipation assembly includes a liquid cooling tank and a first heat dissipation component. The liquid cooling tank has a mounting cavity for mounting a heat-generating component, and the mounting cavity is filled with a phase change medium that immerses the heat-generating component. The first heat dissipation component is located outside the liquid cooling tank and communicates with the mounting cavity. The cold plate heat dissipation assembly includes a cold plate and a second heat dissipation component. The cold plate is located inside the mounting cavity and is in contact with a portion of the heat-generating component. The second heat dissipation component is located outside the liquid cooling tank and communicates with the cold plate. The cold plate and the second heat dissipation component form a liquid cooling loop for circulating coolant. The leak detection assembly includes a data acquisition module and a judgment module connected in communication. The data acquisition module is used to acquire liquid level images in the mounting cavity, and the judgment module is used to determine whether a leak has occurred in the mounting cavity of the cold plate heat dissipation assembly based on the liquid level images.

[0007] The present invention also provides a leak detection method, comprising: acquiring a liquid level image of a heat dissipation medium immersed in a heat-generating component; determining the change in liquid level height and the liquid stratification of the heat dissipation medium based on the liquid level image; and determining that there is a coolant leak source in the heat dissipation medium when the duration of liquid level rise and the duration of liquid stratification are both greater than or equal to a first preset time.

[0008] The present invention also provides an electronic device including the above-described heat dissipation device.

[0009] This invention allows for direct liquid cooling of the heat-generating component via a phase change medium in the immersion heat dissipation assembly, and indirect liquid cooling of the heat-generating component via a cold plate heat dissipation assembly. This improves the cooling efficiency of the heat-generating component, enabling it to operate at higher frequencies. Furthermore, when the cold plate is damaged or its seal fails, coolant enters the phase change medium within the mounting cavity, altering the liquid level. The acquisition module captures images of the liquid level, recording its condition. The judgment module analyzes these images to determine if a leak has occurred in the mounting cavity of the cold plate heat dissipation assembly. This timely detection of coolant leaks improves the reliability of the heat dissipation device. Additionally, since leak detection is based on liquid level images, there is no need to install detection elements within the phase change medium, thus enhancing the reliability and lifespan of the leak detection assembly and reducing the risk of its failure. Attached Figure Description

[0010] To more clearly illustrate the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a front view of the heat dissipation device with the lid closed, as provided in an embodiment of the present invention. Figure 2 This is a top view of the heat dissipation device with the lid open, as provided in an embodiment of the present invention. Figure 3 A perspective view of the cold plate heat dissipation assembly, mounting plate, and support column provided in an embodiment of the present invention; Figure 4 for Figure 3 The main view; Figure 5 for Figure 4 Cross-sectional view at point AA; Figure 6 A schematic diagram of the structure of the cold plate, heating element, first fastener, second fastener and limiting bolt provided in an embodiment of the present invention; Figure 7 A flowchart of a leakage detection method provided in an embodiment of the present invention.

[0012] The above figures include the following reference numerals: Liquid cooling box 11; mounting cavity 111; box body 112; box cover 113; latch 114; pressure relief valve 115; First heat sink 12; liquid storage tank 13; first circulation pump 14; connecting pipe 15; return pipe 16; Cold plate 21; Second heat sink 22; Second circulation pump 23; Liquid supply pipe 24; Liquid return pipe 25; Guide pipe 26; Acquisition module 31; Mounting plate 41; mounting through hole 411; support column 42; First fastener 5; First bolt 51; First washer 52; Second fastener 6; Limit bolt 7; Heating element 8; Heat dissipation device 10. Detailed Implementation

[0013] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present invention.

[0014] It should be noted that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The term "parallel" includes the described situation and situations similar to the described situation, where the range of similarity is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range for approximate parallelism can be, for example, within 5°. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0015] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0016] According to a first aspect of the present invention, a heat dissipation device 10 includes: an immersion heat dissipation component, a cold plate heat dissipation component, and a leak detection component.

[0017] Figure 1This is a front view of the heat dissipation device 10 with the lid 113 closed, according to an embodiment of the present invention. Figure 2 This is a top view of the heat dissipation device 10 with the lid 113 open, as provided in an embodiment of the present invention. Figure 1 and Figure 2 As shown, the immersion heat dissipation assembly includes a liquid cooling box 11 and a first heat dissipation component 12. The liquid cooling box 11 has a mounting cavity 111 for mounting the heat-generating component 8. The mounting cavity 111 is filled with a phase change medium that immerses the heat-generating component 8. The first heat dissipation component 12 is located outside the liquid cooling box 11 and communicates with the mounting cavity 111.

[0018] Figure 3 This is a perspective view of the cold plate heat dissipation assembly, mounting plate 41, and support column 42 provided in an embodiment of the present invention. Figure 4 for Figure 3 The main view, Figure 5 for Figure 4 Cross-sectional view at point AA Figure 6 This is a schematic diagram of the structure of the cold plate 21, heating element 8, first fastener 5, second fastener 6, and limiting bolt 7 provided in an embodiment of the present invention, with reference to... Figures 3-6 As shown, the cold plate heat dissipation assembly includes a cold plate 21 and a second heat dissipation component 22. The cold plate 21 is disposed in the mounting cavity 111 and is in contact with a part of the heat-generating component 8. The second heat dissipation component 22 is disposed outside the liquid cooling box 11 and communicates with the cold plate 21. The cold plate 21 and the second heat dissipation component 22 form a liquid cooling loop for the circulation of coolant.

[0019] Reference Figure 2 As shown, the leak detection component includes a data acquisition module 31 and a judgment module connected by communication. The data acquisition module 31 is used to acquire liquid level images in the mounting cavity 111, and the judgment module is used to determine whether the cold plate heat dissipation component has leaked in the mounting cavity 111 based on the liquid level images.

[0020] Specifically, the heat dissipation device 10 can dissipate heat from the heat-generating component 8. The heat dissipation device 10 can be applied to electronic devices such as servers, switches, storage devices, and personal computers. The heat-generating component 8 can be an electronic device in the electronic device, for example, a circuit board with high-power chips such as CPU (Central Processing Unit) and GPU (Graphics Processing Unit). The immersion heat dissipation assembly can cool the heat-generating component 8 by immersing it in a phase change medium and absorbing heat through the evaporation of the phase change medium. The cold plate heat dissipation assembly can cool the heat-generating component 8 by circulating coolant. In other words, the immersion heat dissipation assembly can directly liquid cool the heat-generating component 8 through the phase change medium, while the coolant in the cold plate heat dissipation assembly can indirectly liquid cool the heat-generating component 8 through the cold plate 21.

[0021] Reference Figure 1 and Figure 2As shown, in the immersion heat dissipation assembly, the liquid cooling box 11 is a hollow box structure with a mounting cavity 111. The heating element 8 can be fixed inside the mounting cavity 111, and the phase change medium is filled inside the mounting cavity 111. The phase change medium can absorb the heat generated by the heating element 8 and undergo a liquid-gas phase change. The first heat dissipation element 12 is a heat exchange structure located outside the liquid cooling box 11 and communicating with the mounting cavity 111. The first heat dissipation element 12 can exchange heat with the air in the atmosphere to cool the phase change medium, causing the vaporized phase change medium to condense back into a liquid state.

[0022] Reference Figures 2-5 As shown, in the cold plate heat dissipation assembly, the cold plate 21 can be disposed in the mounting cavity 111. The cold plate 21 is provided with a water channel for the flow of coolant. The second heat dissipation component 22 is a heat exchange structure disposed outside the liquid cooling box 11 and connected to the cold plate 21. The cold plate 21 and the second heat dissipation component 22 form a liquid cooling loop. The coolant can circulate in the liquid cooling loop. The cold plate 21 is in contact with a part of the heat-generating component 8. The part of the heat-generating component 8 that is not in contact with the cold plate 21 can be cooled by a phase change medium. The cold plate 21 can be in contact with the part of the heat-generating component 8 that generates a large amount of heat. For example, the cold plate 21 can be in contact with the surface of high-power chips such as CPU and GPU in the heat-generating component 8. When the coolant flows through the cold plate 21, the coolant cools the heat-generating component 8 through the cold plate 21. When the coolant flows through the second heat dissipation component 22, it transfers the heat to the atmospheric environment.

[0023] Understandably, the heating element 8 is installed inside the mounting cavity 111 and immersed in the phase change medium. The heat generated by the heating element 8 is directly transferred to the phase change medium. After absorbing the heat, the phase change medium flows to the first heat sink 12, which is connected to the mounting cavity 111. The heat is dissipated at the first heat sink 12 outside the liquid cooling box 11, forming immersion heat dissipation for the heating element 8. At the same time, the cold plate 21 is in contact with a part of the heating element 8. The heat generated in this part is conducted to the coolant flowing inside the cold plate 21. The coolant flows along the liquid cooling loop to the second heat sink 22 outside the liquid cooling box 11 for heat dissipation. After cooling down, it returns to the cold plate 21, forming cold plate 21 heat dissipation for the heating element 8. Immersion heat dissipation can act on the entire heating element 8, while the cold plate 21 heat dissipation strengthens the part in contact with the cold plate 21. The two heat dissipation paths are parallel and complementary, and the heat dissipation device 10 can meet the high heat dissipation requirements of the heating element 8.

[0024] Reference Figure 2 As shown, the leak detection component can detect whether a leak has occurred in the mounting cavity 111 of the cold plate heat dissipation component. The leak detection component includes a data acquisition module 31 and a judgment module. The data acquisition module 31 is a module for acquiring liquid level images, and the judgment module is a module for analyzing the liquid level images and making a leak judgment. The data acquisition module 31 and the judgment module are communicatively connected, and the liquid level images are transmitted between the two. The liquid level images are images reflecting the liquid level conditions in the mounting cavity 111.

[0025] When the cold plate 21 is damaged or the seal fails, the coolant enters the phase change medium in the mounting cavity 111, and the liquid level in the mounting cavity 111 changes accordingly. The liquid level image collected by the acquisition module 31 records the liquid level condition. The judgment module analyzes the liquid level image to determine whether the cold plate heat dissipation assembly has leaked in the mounting cavity 111. This allows for timely detection of coolant leakage in the mounting cavity 111, thereby improving the reliability of the heat dissipation device 10. At the same time, the coolant leakage judgment is based on the liquid level image, eliminating the need to set up detection elements in the phase change medium, thus improving the reliability and service life of the leak detection component and reducing the risk of leak detection component failure.

[0026] In some embodiments, refer to Figure 1 and Figure 2 As shown, the liquid cooling box 11 includes a box body 112 and a box cover 113. The box cover 113 is sealed and fastened to the box body 112 by a latch 114. The vapor formed by the phase change medium in the mounting cavity 111 due to heating is not easy to leak out. The box cover 113 is provided with a pressure relief valve 115. The pressure relief valve 115 automatically opens to relieve pressure when the pressure in the mounting cavity 111 rises to a set value.

[0027] In some embodiments, refer to Figure 1 and Figure 2 As shown, the acquisition module 31 includes a camera located on top of the liquid cooling tank 11. The lens of the camera faces the liquid surface inside the mounting cavity 111, and the field of view covers the entire liquid surface area inside the mounting cavity 111. The camera adopts a corrosion-resistant sealing structure and can work stably for a long time in the steam environment above the mounting cavity 111. The camera transmits the liquid surface image to the judgment module through a sealed cable passing through the liquid cooling tank 11.

[0028] In some embodiments, the judgment module may be an edge computing module deployed outside the liquid cooling box 11. The edge computing module is integrated into the server's management board or is an independent computing device installed in the rack. The camera is connected to the local area network of the computer room via a wired Ethernet. The liquid surface image is transmitted to the edge computing module, which performs the analysis locally. The analysis results are transmitted to the data center management platform via the local area network of the computer room.

[0029] In some embodiments of the present invention, reference is made to... Figure 1 and Figure 2 As shown, the immersion heat dissipation assembly also includes: a liquid storage tank 13 and a first circulation pump 14. The liquid storage tank 13 is connected to the mounting cavity 111. The liquid storage tank 13 stores a phase change medium. The first circulation pump 14, the mounting cavity 111, the first heat sink 12, and the liquid storage tank 13 are connected end to end to form a medium loop. The first circulation pump 14 is used to drive the phase change medium to circulate in the medium loop.

[0030] Specifically, the liquid storage tank 13 is a container for storing phase change medium. The phase change medium in the liquid storage tank 13 is connected to the phase change medium in the mounting cavity 111. The first circulation pump 14 is a power component that drives the flow of the phase change medium. The medium loop is a closed loop formed by connecting the first circulation pump 14, the mounting cavity 111, the first heat sink 12 and the liquid storage tank 13 in series from beginning to end along the flow direction of the phase change medium. Connecting from beginning to end means that in the direction of circulation flow, the outlet of the first component is connected to the inlet of the second component, and the outlet of the last component is connected to the inlet of the first component.

[0031] When the first circulation pump 14 is running, it drives the phase change medium to circulate along the medium loop. That is, the flow path of the phase change medium is: first circulation pump 14 → mounting cavity 111 → first heat sink 12 → liquid storage tank 13 → first circulation pump 14. The phase change medium that absorbs heat from the heat-generating element 8 flows from the mounting cavity 111 to the first heat sink 12. Heat is dissipated at the first heat sink 12 outside the liquid cooling box 11. The cooled phase change medium flows back to the mounting cavity 111 through the liquid storage tank 13 and continues to absorb heat from the heat-generating element 8. The circulation of the phase change medium continues. During this process, most of the phase change medium is liquid and a small part is gaseous. The gaseous phase change medium can circulate together with the liquid phase change medium in the form of bubbles. The liquid phase change medium can dissipate heat through the first heat sink 12 to increase the temperature difference between the liquid phase change medium and the heat-generating element 8, thereby improving the cooling efficiency of the heat-generating element 8. At the same time, the gaseous phase change medium can condense into liquid at the first heat sink 12. The first circulation pump 14 provides power for the flow of the phase change medium, which is forced to circulate between the mounting cavity 111 and the outside of the liquid cooling box 11. The heat exchange in the mounting cavity 111 is enhanced, which is conducive to the timely dissipation of heat from the heat-generating element 8.

[0032] Meanwhile, the liquid storage tank 13 stores a phase change medium. After the liquid storage tank 13 is connected to the installation cavity 111, the liquid volume of the phase change medium in the installation cavity 111 is buffered, the fluctuation of the liquid surface is absorbed by the liquid storage tank 13, and the liquid surface in the installation cavity 111 tends to be stable. This provides a stable liquid surface basis for the acquisition module 31 to acquire liquid surface images, which is conducive to the judgment module making an accurate leak judgment based on the liquid surface images.

[0033] In some embodiments, when the heating element 8 is working, it vaporizes the phase change medium in the mounting cavity 111. The vaporized steam rises to the top of the mounting cavity 111. The communication position between the first heat sink 12 and the liquid cooling box 11 can be slightly higher than the liquid surface of the phase change medium in the mounting cavity 111. The steam and the bubbles flowing with the liquid phase change medium enter the first heat sink 12 and condense and release heat on the surface of the condensing coil of the first heat sink 12. The condensed liquid phase change medium flows back to the mounting cavity 111 through the storage tank 13 and the first circulation pump 14. In addition, when a lot of steam escapes above the liquid surface of the phase change medium, it can be discharged through the pressure relief valve 115 to avoid excessive pressure in the mounting cavity 111.

[0034] In some embodiments, refer to Figure 1 As shown, the liquid storage tank 13 is connected to the first circulation pump 14 through the connecting pipe 15. The connecting pipe 15 can be located at the lower part of the outside of the liquid cooling box 11. The liquid storage tank 13 and the first circulation pump 14 can be located on both sides of the length direction of the liquid cooling box 11. The first circulation pump 14 is connected to the lower end of the mounting cavity 111 of the liquid cooling box 11 through the return pipe 16.

[0035] In some embodiments of the present invention, reference is made to... Figures 2-4 As shown, there are multiple cold plates 21, which are connected in parallel at both ends of the second heat sink 22.

[0036] Specifically, the number of cold plates 21 can be two or more, the number of cold plates 21 can correspond to the number of heating elements 8, or the number of cold plates 21 can be more than the number of heating elements 8, and each heating element 8 can be attached to at least one cold plate 21.

[0037] Multiple cold plates 21 are connected in parallel at both ends of the second heat sink 22. That is, the inlet of each cold plate 21 is connected to one end of the second heat sink 22, and the outlet of each cold plate 21 is connected to the other end of the second heat sink 22. The multiple cold plates 21 are connected in parallel to each other in the flow path of the coolant. The two ends of the second heat sink 22 are the end that supplies coolant and the end that recovers coolant.

[0038] Understandably, the coolant supplied from the second heat sink 22 is diverted to each of the parallel cold plates 21. After the coolant flows through each cold plate 21 and absorbs heat, it converges and returns to the second heat sink 22. The multiple cold plates 21 are connected in parallel along the flow path, and the coolant flows through each cold plate 21 simultaneously. Each cold plate 21 can receive a supply of coolant, and the flow rate at each cold plate 21 has little mutual influence. The areas of the heat-generating element 8 that are in contact with each cold plate 21 are all cooled, and the heat exchange in different areas of the heat-generating element 8 is relatively uniform, which is beneficial to the temperature consistency of the heat-generating element 8.

[0039] In some embodiments of the present invention, reference is made to... Figures 2-5As shown, the cold plate heat dissipation assembly also includes: a second circulation pump 23, and the second heat sink 22 is connected to the cold plate 21 through the second circulation pump 23.

[0040] Specifically, the cold plate 21 is located inside the mounting cavity 111, and the second heat sink 22 is located outside the liquid cooling box 11. The liquid cooling loop spans the inside and outside of the mounting cavity 111. The coolant flowing in the liquid cooling loop must overcome the flow resistance of the flow channel and pipe inside the cold plate 21. The second circulation pump 23 can drive the coolant to circulate. The coolant, after being cooled by the second heat sink 22, is sent into the cold plate 21 inside the mounting cavity 111. After absorbing heat at the cold plate 21, the coolant returns to the second heat sink 22 to dissipate heat. The coolant continues to circulate, and the cold plate 21 continuously cools the heat-generating component 8. The heat from the heat-generating component 8 is continuously carried out of the liquid cooling box 11.

[0041] In some embodiments, the second heat sink 22 is a heat exchanger. The inlet of the second heat sink 22 is connected to the outlet of the cold plate 21, the outlet of the second heat sink 22 is connected to the inlet of the second circulation pump 23, and the outlet of the second circulation pump 23 is connected to the inlet of the cold plate 21. The second circulation pump 23 pumps the coolant after it has been cooled by the second heat sink 22 into the cold plate 21, and the coolant circulates between the cold plate 21 and the second heat sink 22.

[0042] In some embodiments, refer to Figure 3 As shown, the cold plate heat dissipation assembly also includes a liquid supply pipe 24, a liquid return pipe 25, and multiple guide pipes 26. The liquid supply pipe 24 and the liquid return pipe 25 can be arranged in parallel within the mounting cavity 111. Each cold plate 21 is connected to the liquid supply pipe 24 through a corresponding guide pipe 26, and each cold plate 21 is also connected to the liquid return pipe 25 through another corresponding guide pipe 26. The outlet of the second heat sink 22 is connected to the liquid supply pipe 24 through the second circulation pump 23, and the inlet of the second heat sink 22 is connected to the liquid return pipe 25. The coolant flowing out of the second heat sink 22 is distributed to the corresponding cold plate 21 in sequence through the second circulation pump 23, the liquid supply pipe 24, and multiple guide pipes 26. The coolant flowing through each cold plate 21 then flows to the liquid return pipe 25 through another guide pipe 26, and then flows back to the inlet of the second heat sink 22. Multiple cold plates 21 are connected in parallel to both ends of the second heat sink 22 via a liquid supply pipe 24 and a liquid return pipe 25, so that the coolant flow rate obtained by each cold plate 21 is more uniform.

[0043] In some embodiments of the present invention, reference is made to... Figures 3-6 As shown, the immersion heat dissipation assembly further includes: a mounting plate 41, which is disposed in the mounting cavity 111 and spaced apart from the inner wall of the mounting cavity 111. The mounting plate 41 has a plurality of spaced mounting through holes 411. At least one mounting through hole 411 is connected to the heating element 8 through a corresponding first fastener 5. At least one mounting through hole 411 is opposite to the heating element 8 and is used to connect the phase change medium on both sides of the mounting plate 41.

[0044] Specifically, the mounting plate 41 can be a porous plate-shaped structure. The mounting plate 41 can be fixed inside the mounting cavity 111. In the thickness direction of the mounting plate 41, there can be a gap between the mounting plate 41 and the inner wall of the mounting cavity 111, and the phase change medium can flow in the gap area between the two.

[0045] The mounting through-hole 411 penetrates the mounting plate 41 in the thickness direction. Multiple mounting through-holes 411 are arranged at intervals on the mounting plate 41, providing mounting positions for heating elements 8 of different sizes and quantities. The first fastener 5 is a fastening part that passes through the mounting through-hole 411 and connects and fixes the heating element 8 to the mounting plate 41. It can be a screw, bolt, or snap-fit ​​pin. At least one mounting through-hole 411 is opposite to the heating element 8 and is not fitted with the first fastener 5. This mounting through-hole 411 can conduct the phase change medium to increase the contact area between the phase change medium and the heating element 8.

[0046] Understandably, the heating element 8 is fixed to the mounting through hole 411 of the mounting plate 41 by the first fastener 5. The mounting plate 41 provides support for the heating element 8, and the position of the heating element 8 within the mounting cavity 111 is fixed. The mounting plate 41 is spaced apart from the inner wall of the mounting cavity 111. The phase change medium flows on both sides of the mounting plate 41 through the gap between the mounting plate 41 and the inner wall. The mounting plate 41 does not obstruct the overall flow of the phase change medium within the mounting cavity 111. The mounting through hole 411 opposite to the heating element 8 connects the phase change medium on both sides of the mounting plate 41. After being heated, the phase change medium near the heating element 8 flows and replenishes itself through the mounting through hole 411 and the gap between the mounting plate 41 and the inner wall. All parts of the heating element 8 can contact the phase change medium for heat exchange. The mounting plate 41 ensures normal immersion heat dissipation while fixing the heating element 8.

[0047] In some embodiments, refer to Figures 2-4 As shown, the mounting plate 41 is fixed to the bottom of the mounting cavity 111 by the support column 42, and a gap is formed between the mounting plate 41 and the bottom wall of the mounting cavity 111 to allow the phase change medium to flow.

[0048] In some embodiments, refer to Figure 5 and Figure 6 As shown, the first fastener 5 includes a first bolt 51 and a first washer 52. The first washer 52 is sandwiched between the heating element 8 and the mounting plate 41. The first bolt 51 passes through the heating element 8 and the first washer 52 and is threadedly engaged with the corresponding mounting through hole 411. The first washer 52 can separate the heating element 8 from the mounting plate 41 so that the phase change medium can flow in the gap between the heating element 8 and the mounting plate 41, thereby increasing the contact area between the phase change medium and the heating element 8.

[0049] In some embodiments of the present invention, reference is made to... Figures 3-6As shown, the cold plate 21 is attached to the side of the heating element 8 away from the mounting plate 41, and at least one mounting through hole 411 is connected to the cold plate 21 through a corresponding second fastener 6.

[0050] Specifically, one side of the heating element 8 faces the mounting plate 41 and is cooled by the phase change medium. The side of the heating element 8 away from the mounting plate 41 is in contact with the cold plate 21. The cold plate 21 is connected to the mounting plate 41 by a second fastener 6, which can be a screw, bolt, or snap pin. The cold plate 21 is fixed to the mounting plate 41 and presses against the heating element 8. The fastening force of the second fastener 6 maintains the contact pressure between the cold plate 21 and the heating element 8, and the contact surface between the cold plate 21 and the heating element 8 is not prone to gaps. The heat from the side of the heating element 8 away from the mounting plate 41 is stably conducted to the cold plate 21 through the contact surface and carried away by the coolant flowing inside the cold plate 21. The heating element 8 is located between the mounting plate 41 and the cold plate 21. Both sides of the heating element 8 are constrained by the mounting plate 41 and the cold plate 21, respectively. The installation structure of the heating element 8 in the mounting cavity 111 is stable, and the heating element 8 is not prone to positional displacement even after long-term immersion in the phase change medium.

[0051] In some embodiments, the cold plate 21 is internally processed with microchannels, in which coolant can flow. Thermal grease is applied between the contact surfaces of the cold plate 21 and the heating element 8 on the side away from the mounting plate 41 to reduce the contact thermal resistance between the cold plate 21 and the heating element 8.

[0052] In some embodiments, refer to Figure 6 As shown, the second fastener 6 is a mounting bolt, which passes through the cold plate 21 and is threaded into the corresponding mounting through hole 411. Additionally, a limiting bolt 7 can be provided on the cold plate 21. The limiting bolt 7 can pass through the corresponding mounting through hole 411. In the axial direction of the mounting through hole 411, the limiting bolt 7 is guided into the corresponding mounting through hole 411; in the radial direction of the mounting through hole 411, the limiting bolt 7 is limited into the corresponding mounting through hole 411. The limiting bolt 7 can be used to assist in positioning and assembly, and to improve the stability of the cold plate 21.

[0053] In some embodiments, the density of the coolant is less than that of the phase change medium, and the two are immiscible. When the coolant leaks, it can float above the liquid surface of the phase change medium and form a layer, thereby changing the liquid surface image and making it easier to identify.

[0054] Specifically, the phase change medium and the coolant are two immiscible media. When both the phase change medium and the coolant are in a liquid state, the density of the coolant is less than that of the phase change medium. After the coolant leaks in the mounting cavity 111 of the cold plate heat dissipation assembly, the coolant will float on the upper surface of the phase change medium and form a liquid surface that is layered with the phase change medium, so as to quickly form a change in the liquid surface image. After the acquisition module 31 above the liquid surface acquires the corresponding liquid surface image, the judgment module judges in a timely manner that the cold plate heat dissipation assembly has leaked in the mounting cavity 111 based on the liquid surface image, thereby improving the timeliness of the coolant leak judgment.

[0055] In some embodiments of the present invention, the phase change medium is a fluorinated liquid and the coolant is deionized water.

[0056] Specifically, the fluorinated liquid is an insulating fluorinated compound. The liquid fluorinated liquid fills the mounting cavity 111 and immerses the heating element 8. After absorbing the heat from the heating element 8, the fluorinated liquid boils and vaporizes. The vapor formed by vaporization condenses and flows back to the liquid state. The deionized water is water with ionic impurities removed and circulates in the liquid cooling loop as a coolant.

[0057] Understandably, fluorinated liquid is an insulating medium, and the heating element 8 can operate normally while immersed in it, carrying an electrical charge. After absorbing heat, the fluorinated liquid undergoes a liquid-to-gas phase change, absorbing a large amount of heat during this process. Immersion cooling has strong heat exchange capacity and can accommodate the high heat flux density of the heating element 8. Deionized water has a low content of ionic impurities. Long-term circulation of deionized water in the liquid cooling loop results in less corrosion and scaling on the inner wall of the loop, which is beneficial for the long-term stable operation of the liquid cooling loop.

[0058] In some embodiments, the boiling point of the fluorinated liquid is 40°C to 60°C, the density of the fluorinated liquid is 1.6 g / cm³ to 1.8 g / cm³, the density of the deionized water is 1.0 g / cm³, and the deionized water and the fluorinated liquid are immiscible. When the cold plate heat dissipation assembly leaks, the deionized water that seeps into the mounting cavity 111 floats above the surface of the fluorinated liquid, and a layering interface appears on the liquid surface in the mounting cavity 111, and the liquid level rises accordingly. The appearance of the layering interface and the rise in the liquid level are reflected in the liquid surface image, and the judgment module determines that the cold plate heat dissipation assembly has leaked in the mounting cavity 111.

[0059] In other embodiments of the present invention, the phase change medium is a hydrofluoroether or a perfluoroketone liquid, and the coolant is an aqueous solution of ethylene glycol or silicone oil.

[0060] Figure 7 The flowchart of the leakage detection method provided in the embodiment of the present invention is shown below. Figure 7 As shown, a leakage detection method according to a second aspect embodiment of the present invention includes: Step S1: Acquire an image of the liquid level of the heat dissipation medium submerged in the heat-generating component.

[0061] Step S2: Determine the change in liquid level and the liquid stratification of the heat dissipation medium based on the liquid level image.

[0062] Step S3: When the duration of the rise in the heat dissipation medium level and the duration of the liquid stratification are both greater than or equal to the first preset time, it is determined that there is a coolant leakage source in the heat dissipation medium.

[0063] The leakage detection method can be used in the heat dissipation device of the above embodiment. The heat dissipation device includes an immersion heat dissipation component and a cold plate heat dissipation component. The mounting cavity of the immersion heat dissipation component is filled with a phase change medium that immerses the heat-generating element. The cold plate heat dissipation component is partially disposed in the mounting cavity and is in contact with the heat-generating element. The cold plate heat dissipation component forms a liquid cooling loop for the circulation of coolant.

[0064] In step S1, the liquid level image of the heat dissipation medium immersed in the heat-generating element is acquired, that is, the liquid level image in the mounting cavity is acquired. When the coolant does not leak into the mounting cavity, the heat dissipation medium immersed in the heat-generating element can be a phase change medium. When the coolant leaks into the mounting cavity, the heat dissipation medium immersed in the heat-generating element can be a mixture of phase change medium and coolant.

[0065] In steps S2 and S3, the judgment module can determine the change in liquid level and the liquid stratification based on the liquid level image. When the duration of liquid level rise and the duration of liquid stratification are both greater than or equal to the first preset time, it is determined that there is a source of coolant leakage in the heat dissipation medium, that is, the cold plate heat dissipation assembly is leaking in the mounting cavity.

[0066] The system can capture images of the liquid level in the mounting cavity by taking pictures at the top of the cavity using a data acquisition module. The change in liquid level height is the amplitude of the change in liquid level height within the mounting cavity, determined based on the liquid level images. Liquid stratification is determined by identifying whether stratification occurs at the liquid level based on the liquid level images. When a leak occurs in the mounting cavity of the cold plate heat dissipation assembly, the coolant entering the cavity separates from the phase change medium, resulting in a stratification interface at the liquid level. The duration of liquid level rise is the length of time the liquid level continues to rise, and the duration of liquid stratification is the length of time the stratified state continues. The first preset time is a pre-set time threshold, which can be 1 minute, 10 minutes, or 30 minutes.

[0067] Understandably, liquid surface images contain both information about the liquid level height and the liquid surface state. By determining the change in liquid level height and the liquid stratification based on the liquid surface images, changes in the liquid surface can be determined from both the height and stratification dimensions, providing a dual basis for leak detection.

[0068] When the heating element is working, the phase change medium is heated and vaporized, and there are bubbles disturbing the liquid surface. The liquid level may fluctuate briefly. The fluctuation caused by the bubble disturbance is short-lived, and no stratification interface will appear at the liquid surface.

[0069] When the cold plate heat dissipation component leaks, the coolant continues to enter the phase change medium in the mounting cavity, and the increase in liquid level and the stratification of the liquid surface persist.

[0070] When both the duration of liquid level rise and the duration of liquid stratification are greater than or equal to the first preset time, a leak is determined to be a leak. This eliminates short-term liquid level fluctuations caused by boiling disturbances, making the leak determination less susceptible to the influence of normal boiling fluctuations. The change in liquid level height and the stratification state of the liquid surface corroborate each other, and a short-term anomaly under a single condition will not cause a misjudgment of a leak, thereby improving the accuracy of the leak determination.

[0071] In some embodiments, the liquid surface stratification is determined by identifying the texture features of the liquid surface image. The liquid surface state is identified as normal boiling state and abnormal stratification state. In the normal boiling state, the liquid surface has a uniform bubble disturbance pattern. In the abnormal stratification state, the liquid surface has a stratification interface and reflective textures that are different from bubble disturbances. The identification of texture features is completed by a convolutional neural network model.

[0072] In some embodiments of the present invention, when the duration of at least one of the conditions of liquid level rise and liquid level stratification is less than a first preset time, the acquisition frequency of the liquid level image is increased.

[0073] Specifically, the acquisition frequency is the number of times a liquid surface image is acquired per unit time. Increasing the acquisition frequency shortens the acquisition interval between two adjacent liquid surface images. If the duration of at least one of the conditions, liquid level rise or liquid level stratification, is less than a first preset time, it means that the duration of either liquid level rise or liquid level stratification has not yet reached the first preset time, and the durations of both conditions have not simultaneously met the judgment requirements.

[0074] When the duration of at least one of the conditions, namely liquid level rise and liquid stratification, is less than a first preset time, the duration alone is insufficient to distinguish whether the liquid level change originates from leakage or from short-term fluctuations in the boiling of the phase change medium. In this case, the acquisition frequency of liquid level images can be increased, resulting in more liquid level images obtained per unit time, and the evolution of liquid level height changes and liquid stratification states can be recorded more intensively.

[0075] If a leak occurs in the cold plate heat dissipation assembly, more frequent data collection and confirmation of the duration of liquid level rise and liquid stratification can improve the timeliness of leak detection. If the liquid level change is a short-term fluctuation caused by boiling, intensively collected liquid level images can also help confirm that the liquid level has returned to normal as quickly as possible.

[0076] In some embodiments, when the duration of at least one of the conditions of liquid level rise and liquid level stratification is less than a first preset time, the heat dissipation device enters the observation state. In the observation state, the liquid level image is continuously acquired at the increased acquisition frequency, and the liquid level height change and liquid level stratification are continuously updated accordingly.

[0077] In some embodiments, in step S1, the liquid surface image is acquired once every 30 seconds. When the duration of at least one of the conditions, liquid level rise and liquid surface stratification, is less than a first preset time, the acquisition frequency of the liquid surface image is increased to once every 10 seconds.

[0078] In some embodiments of the present invention, after determining that there is a coolant leak source in the heat dissipation medium, the leak detection method further includes at least one of the following steps: controlling the alarm to issue an alarm, pushing a leak notification to the communication equipment of the maintenance personnel, controlling the liquid cooling loop where the coolant leak source is located to stop working, and controlling the heat-generating components to operate at reduced frequency.

[0079] Specifically, an alarm is a device that emits an alarm signal, which can be an audible and visual alarm, including a buzzer and a warning light. Maintenance personnel are those who operate and maintain the heat dissipation system. Communication equipment is the communication terminal used by maintenance personnel, which can be a mobile phone or a computer. A leak notification is a notification message carrying information about a leak event. Controlling the liquid cooling loop where the coolant leak source is located stops working, that is, controlling the cold plate heat sink assembly to stop working, thus stopping the circulation of coolant in the cold plate heat sink assembly. Reduced frequency operation involves lowering the operating frequency of the heat-generating components; as the operating frequency of the heat-generating components decreases, the heat generation also decreases.

[0080] When it is determined that a leak has occurred in the mounting cavity of the cold plate heat dissipation assembly, the following four steps can be executed simultaneously: the control alarm issues an alarm, a leak notification is pushed to the communication equipment of the maintenance personnel, the liquid cooling loop where the coolant leak source is located is stopped, and the heat-generating components are controlled to operate at reduced frequency. At least one of these steps can also be executed.

[0081] Once a leak is detected in the cold plate heat sink assembly within the mounting cavity, the leak event is confirmed, and the heat dissipation device responds immediately. Alarms issued by the alarm can be detected by on-site personnel, and leak notifications pushed to communication devices can reach off-site maintenance personnel. On-site alarms and remote notifications complement each other, ensuring that maintenance personnel are promptly informed of the leak event regardless of their location. The liquid cooling loop at the source of the coolant leak stops operating, preventing coolant from circulating into the mounting cavity and reducing the amount of coolant leaking further, thus suppressing the progression of the leak. After the heat-generating components operate at reduced frequency, their heat generation decreases. Even after the cold plate heat sink assembly stops operating, the heat-generating components remain immersed in the phase change medium, and the immersion cooling system continues to cool the reduced-frequency components, mitigating the risk of overheating due to the cessation of cold plate heat dissipation.

[0082] In some embodiments, the leakage notification includes the alarm type, alarm time, historical liquid level curve, and screenshot of the liquid surface image. The leakage notification is sent to the data center management platform via the local area network of the computer room. The data center management platform then pushes the notification to the mobile application, email, or SMS of the operation and maintenance personnel. At the same time, the judgment module sends a trigger command to the audible and visual alarm installed on the outer wall of the liquid cooling tank. Local alarms and remote pushes are issued in parallel.

[0083] In some embodiments, controlling the liquid cooling loop where the coolant leakage source is located to stop working includes shutting off the second circulation pump that drives the coolant circulation, or controlling the electric shut-off valve in the liquid cooling loop to close. Controlling the heat-generating component to operate at a reduced frequency includes sending a power reduction command to the baseboard management controller of the server where the heat-generating component is located, so as to reduce its operating frequency.

[0084] In some embodiments of the present invention, determining the change in liquid level height based on a liquid level image includes: determining a reference liquid level based on historical data of the liquid level image, determining the current liquid level based on the liquid level image at the current moment, and determining the change in liquid level height based on the difference between the current liquid level and the reference liquid level.

[0085] Specifically, historical data refers to the liquid level data determined from liquid level images prior to the current moment, the reference liquid level is the liquid level value determined based on historical data and used as a benchmark for liquid level height comparison, the current liquid level is the liquid level height determined based on the liquid level image at the current moment, and the change in liquid level height is the difference between the current liquid level and the reference liquid level. The magnitude of the difference reflects the magnitude of the liquid level deviation relative to the reference liquid level.

[0086] Understandably, the reference liquid level is determined based on historical data from liquid level images. This historical data comes from the liquid level images of the heat dissipation device itself prior to the current moment, and the reference liquid level matches the actual level of the liquid in the mounting cavity. Since the liquid level levels in the mounting cavities of different heat dissipation devices vary, the reference liquid level is determined using the historical data of the heat dissipation device itself, and the determination of the change in liquid level height is unaffected by the differences between heat dissipation devices. The current liquid level is determined based on the liquid level image at the current moment. The difference between the current liquid level and the reference liquid level quantifies the magnitude of the liquid level deviation relative to the reference liquid level. The change in liquid level height provides a quantitative basis for leak detection; the rise in liquid level caused by a leak is quantified through the change in liquid level height.

[0087] In some embodiments, when determining the liquid level, the Canny edge detection algorithm is used to perform edge detection on the liquid surface image to identify the pixel position of the liquid surface boundary line in the image. Then, the pixel position is converted into the actual liquid level height according to the installation height of the camera and the lens angle parameters. The conversion accuracy can reach the millimeter level.

[0088] In some embodiments of the present invention, determining a reference liquid level based on historical data of liquid surface images includes: when the heat dissipation device is first run, acquiring liquid surface images over a second preset time period as historical data, and calculating the average liquid level height of the historical data to obtain the reference liquid level. When the heat dissipation device has been running for a period of time greater than or equal to a third preset time period, acquiring liquid surface images over a third preset time period prior to the current moment as historical data, and calculating the average liquid level height of the historical data to obtain the reference liquid level. The third preset time period is greater than the second preset time period.

[0089] Specifically, the initial operation refers to the initial operation phase after the heat dissipation device is put into use, the continuous operation time is the cumulative operation time of the heat dissipation device since it has been put into use, the second preset time and the third preset time are both preset time lengths, and the average liquid level height is the average value of the liquid level values ​​determined by each liquid level image in the historical data.

[0090] Understandably, when the cooling device is first put into operation, there are no accumulated liquid level images from a long period of time. By collecting liquid level images within a second preset time period as historical data and calculating the average liquid level height, a reference liquid level required for leak detection can be established. Leak detection can then be carried out from the very beginning of the cooling device's use. After the cooling device has been running continuously for a period greater than or equal to a third preset time period, the reference liquid level is calculated using liquid level images from the third preset time period prior to the current moment. The data used for the reference liquid level is close to the current moment in time. As the operating time increases, the reference liquid level continuously updates with changes in the liquid level, minimizing deviation between the reference liquid level and the actual liquid level. The third preset time period is longer than the second preset time period, resulting in a longer time span for the average calculation during continuous operation, a larger sample size of historical data, less impact of short-term liquid level fluctuations on the average liquid level height, and better stability of the reference liquid level.

[0091] In some embodiments, after the heat dissipation device has been running for a period of time greater than or equal to a third preset time, whenever the change in liquid level is determined, the average liquid level is recalculated using the liquid level image within the third preset time period prior to the current moment to obtain an updated reference liquid level. The reference liquid level is continuously updated as the heat dissipation device operates.

[0092] In some embodiments, the second preset time is 0.5 hours and the third preset time is 24 hours. In other embodiments, the second preset time is 1 hour and the third preset time is 12 hours.

[0093] In some embodiments, after determining that there is a coolant leak source in the heat dissipation medium, the leak detection method further includes: writing the timestamp, the liquid level history curve, and the liquid surface image screenshot into the management platform database to form a fault record.

[0094] In some embodiments, the liquid surface images acquired by the acquisition module are also used to detect other abnormal states of the liquid surface in the mounting cavity, including liquid level drop caused by evaporation or leakage of phase change medium, local boiling abnormality caused by sudden increase in power consumption of heating element, and changes in liquid surface texture caused by foreign matter mixing into the liquid surface.

[0095] In some embodiments, a flow meter is installed on the coolant circulation pipeline. The flow meter detects the flow rate of coolant flowing through each cold plate. When a cold plate leaks, the flow rate of the branch where the cold plate is located changes. The flow data and the analysis results of the liquid level image are mutually verified to locate the cold plate that is leaking, thus shortening the troubleshooting time.

[0096] An electronic device according to a third aspect of the present invention includes the heat dissipation device of the above embodiments.

[0097] Among them, electronic devices can be servers, switches, storage devices, personal computers, etc. Electronic devices have heat-generating components, and heat dissipation devices can cool the heat-generating components.

[0098] According to the electronic device of the present invention, the immersion heat dissipation assembly can directly liquid cool the heat-generating component through a phase change medium, and the coolant in the cold plate heat dissipation assembly can indirectly liquid cool the heat-generating component through the cold plate, thereby improving the cooling efficiency of the heat-generating component and enabling the heat-generating component to operate at a higher frequency. At the same time, when the cold plate is damaged or the seal fails, the coolant enters the phase change medium in the mounting cavity, and the liquid level in the mounting cavity changes accordingly. The liquid level image acquired by the acquisition module records the liquid level condition, and the judgment module analyzes the liquid level image to determine whether the cold plate heat dissipation assembly has leaked in the mounting cavity, thereby timely detecting coolant leakage in the mounting cavity of the cold plate heat dissipation assembly, thereby improving the reliability of the electronic device. In addition, the coolant leakage judgment is based on the liquid level image, eliminating the need to set detection elements in the phase change medium, thereby improving the reliability and service life of the leak detection assembly and reducing the risk of leak detection assembly failure.

[0099] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0100] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A heat dissipation device, characterized in that, include: An immersion heat dissipation assembly includes a liquid cooling box and a first heat dissipation component. The liquid cooling box has a mounting cavity for mounting the heat dissipation component. The mounting cavity is filled with a phase change medium that immerses the heat dissipation component. The first heat dissipation component is located outside the liquid cooling box and communicates with the mounting cavity. A cold plate heat dissipation assembly includes a cold plate and a second heat dissipation component. The cold plate is disposed in the mounting cavity and is in contact with a part of the heat-generating component. The second heat dissipation component is disposed outside the liquid cooling box and communicates with the cold plate. The cold plate and the second heat dissipation component form a liquid cooling loop for the circulation of coolant. A leak detection component includes a data acquisition module and a judgment module connected by communication. The data acquisition module is used to acquire liquid level images in the mounting cavity, and the judgment module is used to determine whether the cold plate heat dissipation component has leaked in the mounting cavity based on the liquid level images.

2. The heat dissipation device according to claim 1, characterized in that, The immersion heat dissipation assembly also includes: A liquid storage tank, which is connected to the mounting cavity, stores the phase change medium in the liquid storage tank; The first circulation pump, the mounting cavity, the first heat sink, and the liquid storage tank are connected end to end to form a medium loop. The first circulation pump is used to drive the phase change medium to circulate in the medium loop.

3. The heat dissipation device according to claim 1, characterized in that, There are multiple cold plates, which are connected in parallel at both ends of the second heat sink.

4. The heat dissipation device according to claim 1, characterized in that, The cold plate heat dissipation assembly further includes a second circulation pump, and the second heat dissipation component is connected to the cold plate through the second circulation pump.

5. The heat dissipation device according to claim 1, characterized in that, The immersion heat dissipation assembly further includes: a mounting plate, which is disposed in the mounting cavity and spaced apart from the inner wall of the mounting cavity. The mounting plate has a plurality of spaced mounting through holes. At least one of the mounting through holes is connected to the heating element through a corresponding first fastener. At least one of the mounting through holes is opposite to the heating element and is used to connect the phase change medium on both sides of the mounting plate.

6. The heat dissipation device according to claim 5, characterized in that, The cold plate is attached to the side of the heating element opposite to the mounting plate, and at least one of the mounting through holes is connected to the cold plate through a corresponding second fastener.

7. The heat dissipation device according to any one of claims 1-6, characterized in that, The density of the coolant is less than that of the phase change medium, and the two are immiscible.

8. A leak detection method, characterized in that, include: Acquire images of the liquid level of the heat dissipation medium submerged in the heat-generating component; The change in liquid level and the liquid stratification of the heat dissipation medium are determined based on the liquid level image. When the duration of the rise in the heat dissipation medium level and the duration of liquid stratification are both greater than or equal to a first preset time, it is determined that there is a source of coolant leakage in the heat dissipation medium.

9. The leakage detection method according to claim 8, characterized in that, When the duration of at least one of the conditions, namely, liquid level rise and liquid level stratification, is less than a first preset time, the acquisition frequency of the liquid level image is increased.

10. The leakage detection method according to claim 8, characterized in that, After determining that there is a coolant leak source in the heat dissipation medium, the leak detection method further includes at least one of the following steps: Control the alarm to sound an alarm; Push leak notifications to the communication devices of maintenance personnel; The liquid cooling loop containing the coolant leakage source is controlled to stop operating. Control the heating element to operate at a reduced frequency.

11. The leakage detection method according to any one of claims 8-10, characterized in that, Determining the change in liquid level height based on the liquid level image includes: The baseline liquid level is determined based on historical data from the liquid level image. Determine the current liquid level based on the liquid surface image at the current moment; The change in liquid level is determined based on the difference between the current liquid level and the reference liquid level.

12. An electronic device, characterized in that, Includes the heat dissipation device according to any one of claims 1-7.

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