Heat dissipation device and electronic device
By mixing phase change energy storage devices and thermally conductive materials in the liquid cooling channel, the problem of chip heat dissipation lag under high dynamic loads is solved, achieving rapid heat absorption and stable heat dissipation, thus improving the stability and reliability of the system.
Patent Information
- Application Number
- CN202611520272.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-09-29
- Publication Date
- 2026-11-03
AI Technical Summary
In high dynamic load scenarios, the heat dissipation system of high-power chips cannot respond in time to the sudden surge in chip power, resulting in excessively high local temperature, causing performance throttling or system crashes, threatening system stability and security.
A heat dissipation device with phase change energy storage components located in the liquid cooling channel is adopted. The phase change material absorbs a large amount of latent heat during the solid-to-liquid transition, which can quickly respond to thermal shock. Combined with thermally conductive materials, the heat transfer efficiency is improved, forming a highly efficient dual heat exchange mode.
It achieves instantaneous annihilation of thermal shock, avoids excessive local temperature of the chip, improves the stability and response speed of the heat dissipation system, and reduces the risk of performance throttling or system crash due to heat dissipation lag.
Smart Images
Figure CN123035651A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of heat dissipation technology, specifically to heat dissipation devices and electronic equipment. Background Technology
[0002] In recent years, with the rapid development of industries such as cloud computing, big data, and artificial intelligence, the demand for computing power has continued to rise, leading to a sharp increase in energy density and heat dissipation requirements. In particular, the heat flux density of high-power chips such as processors is constantly breaking through the limits of traditional heat dissipation solutions, posing unprecedented challenges to the efficiency, response speed, and reliability of cooling technologies.
[0003] In related technologies, liquid cooling plates have become the mainstream solution for heat dissipation of high heat flux density electronic components. This solution typically uses a high thermal conductivity metal as the thermally conductive substrate, with heat dissipation fins on the substrate. The heat generated by the chip is transferred to the heat dissipation fins. Coolant flows over the heat dissipation fins, carrying away the heat and reducing the chip temperature. This can increase the heat dissipation capacity of a single chip to the kilowatt level while maintaining low noise.
[0004] However, under high dynamic load scenarios, when the chip power increases instantaneously, there is a significant delay in the process from temperature sensing and signal feedback to the drive pump, which then increases the coolant flow rate to cool the chip. During this period, the coolant flow rate cannot keep up with the surge in the chip's thermal load, which can easily lead to localized overheating of the chip, causing performance throttling or even system crashes, seriously threatening the stability and security of the system. Summary of the Invention
[0005] This invention provides a heat dissipation device and electronic equipment to solve or improve the problem that when the power of the heat-generating unit increases instantaneously, the chip cannot be cooled down immediately, resulting in chip performance downclocking or even crashing.
[0006] In a first aspect, the present invention provides a heat dissipation device, comprising: A heat-conducting plate has a first heat-conducting surface and a second heat-conducting surface arranged opposite to each other, the first heat-conducting surface being adapted to be connected to a heating unit; A cover is sealed on the second heat-conducting surface, and a liquid cooling channel is formed between the cover and the second heat-conducting surface. The cover has an inlet and an outlet that communicate with the liquid cooling channel. At least one heat-conducting tank is disposed in the liquid cooling channel, and the slot end of the heat-conducting tank is sealed to the second heat-conducting surface to form a phase change energy storage cavity. A phase change energy storage device that can absorb or release latent heat during the phase change process is installed inside the phase change energy storage cavity.
[0007] In this embodiment, phase change energy storage material is a material that utilizes the absorption or release of a large amount of latent heat during a phase change process (usually a solid / liquid phase change) to convert energy. This application utilizes the principle of phase change energy storage material absorbing a large amount of latent heat from a solid to a liquid state to address situations where a large amount of instantaneous heat cannot be transferred when the power of the heating unit (chip) increases dramatically.
[0008] The heating unit is connected to the first heat-conducting surface. The heat generated by the heating unit is transferred to the second heat-conducting surface through the first heat-conducting surface. Coolant flows in the liquid cooling channel, and the heat on the second heat-conducting surface is transferred to the coolant. The coolant cools the heating unit.
[0009] When the power of the heating unit increases dramatically, generating a large amount of heat energy, this heat energy is rapidly transferred to the phase change energy storage device through the first and second heat-conducting surfaces. The phase change energy storage device undergoes a phase change, transforming from a solid to a liquid state. During this phase change, it absorbs a large amount of heat energy, enabling it to quickly absorb the heat energy released by the heating unit. This process is a physical phase change, requiring no external signal triggering or energy input, with a response time on the order of milliseconds or even microseconds, achieving "instantaneous annihilation" of thermal shock.
[0010] Phase change energy storage devices absorb sudden bursts of heat, providing an important buffer window for delayed response caused by heat dissipation through coolant in active cooling systems. This avoids the risk of performance degradation or system crashes caused by excessively high local temperatures in heat-generating units due to delayed heat dissipation.
[0011] The phase change energy storage chamber is located directly inside the liquid cooling channel and surrounded by coolant, forming a highly efficient dual heat exchange mode. The first mode (cavity wall and phase change material) is responsible for rapidly absorbing the peak heat transferred by the heating unit and storing it in the form of latent heat. The second mode (cavity wall and coolant) is responsible for continuously and evenly transferring the stored latent heat and the steady-state heat of the heating unit to the coolant flow.
[0012] The phase change energy storage chamber is located directly in the liquid cooling channel and surrounded by coolant. This means that the phase change energy storage unit is no longer an additional heat dissipation module independent of the main heat dissipation mode (second mode). It acts directly on the core channel of heat transfer and can "shave peaks and fill valleys" in real time, transforming unstable, high-density instantaneous heat into a relatively gentle heat load that can be continuously carried away by the coolant, making the entire heat dissipation system more stable. Attached Figure Description
[0013] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0014] Figure 1 This is a schematic diagram of a heat dissipation device according to an embodiment of the present invention; Figure 2 This is a schematic diagram of a heat dissipation device according to an embodiment of the present invention, with the output pipe and return pipe removed; Figure 3 This is an exploded view of a heat dissipation device according to an embodiment of the present invention, comprising a heat-conducting plate, a cover, a heat-conducting groove, and a heat-generating unit. Figure 4 for Figure 3 Another structural diagram from a different angle; Figure 5 This is a schematic diagram of the structure of the heat-conducting plate, cover and heat dissipation fins in a heat dissipation device according to an embodiment of the present invention; Figure 6 for Figure 5 Sectional view of AA; Figure 7 This is a schematic diagram of the structure of a heat dissipation device, including a heat-conducting plate, heat dissipation fins, and a heat-conducting groove, according to an embodiment of the present invention. Figure 8 This is a schematic diagram of the structure of the heat-conducting plate, heat dissipation fins, and heat-conducting groove in another heat dissipation device according to an embodiment of the present invention. Figure 9 for Figure 8 A magnified view of part B in the diagram; Figure 10 This is a schematic diagram of the internal structure of the heat-conducting groove in a heat dissipation device according to an embodiment of the present invention; Figure 11 This is a schematic diagram of the internal structure of the heat-conducting groove in another heat dissipation device according to an embodiment of the present invention; Figure 12 This is a schematic diagram of the internal structure of the heat-conducting groove in another heat dissipation device according to an embodiment of the present invention; Figure 13 for Figure 12 A magnified view of part C in the diagram.
[0015] Explanation of reference numerals in the attached figures: 1. Heat-conducting plate; 101. First heat-conducting surface; 102. Second heat-conducting surface; 2. Cover; 201. Liquid inlet; 202. Liquid outlet; 3. Liquid cooling channel; 4. Heat-conducting tank; 401. First tank; 402. Second tank; 5. Phase change energy storage chamber; 501. Inlet; 6. Baffle assembly; 601. Baffle column; 602. Baffle plate; 6021. First baffle section; 6022. Second baffle section; 6023. Third baffle section; 7. Heat dissipation fins; 8. Heating unit; 9. Output pipeline; 10. Return pipeline; 11. Mounting bracket; 12. Thermally conductive silicone sheet; 13. Locking component; X, First direction; Y, Second direction. Detailed Implementation
[0016] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0017] In recent years, with the rapid development of industries such as cloud computing, big data, and artificial intelligence, the demand for computing power in servers and data centers has continued to rise, leading to a sharp increase in their energy density and heat dissipation requirements. In particular, the heat flux density of high-power chips such as CPUs and GPUs is constantly breaking through the limits of traditional heat dissipation solutions, posing unprecedented challenges to the efficiency, response speed, and reliability of cooling technologies.
[0018] In related technologies, liquid cooling plates have become the mainstream solution for heat dissipation of high heat flux density electronic components. This solution typically uses a high thermal conductivity metal as the thermally conductive substrate, with heat dissipation fins on the substrate. The heat generated by the chip is transferred to the heat dissipation fins. Coolant flows over the heat dissipation fins, carrying away the heat and reducing the chip temperature. Although this can increase the heat dissipation capacity of a single chip to the kilowatt level while maintaining low noise, some problems still exist under high dynamic load scenarios: 1. When chip power surges instantaneously, there is a significant delay in the process from temperature sensing and signal feedback to the drive pump, which then adjusts the coolant flow rate. During this period, the coolant flow rate cannot keep up with the surge in chip heat load, easily leading to localized overheating of the chip, causing performance throttling or even system crashes, seriously threatening the stability and safety of system operation. Furthermore, increasing the power of the drive pump to improve chip heat dissipation increases costs.
[0019] 2. The heat source distribution inside high-power chips is often uneven, with multiple local hot spots. Traditional uniform coolant channels are insufficient for targeted heat dissipation of these multiple hot spots, resulting in poor heat dissipation. To address this, this application provides a heat dissipation device and electronic equipment to solve or improve the problem that when the power of the heat-generating unit increases instantaneously, the chip cannot be cooled down immediately, leading to chip performance throttling or even system crashes.
[0020] The following is combined Figures 1 to 13 The following describes embodiments of the present invention.
[0021] According to an embodiment of the present invention, in one aspect, a heat dissipation device is provided, such as... Figures 1 to 3As shown, the device includes a heat-conducting plate 1, a cover 2, at least one heat-conducting groove 4, and a phase change energy storage device. Specifically, the heat-conducting plate 1 has a first heat-conducting surface 101 and a second heat-conducting surface 102 arranged opposite to each other. The first heat-conducting surface 101 is adapted to be connected to the heating unit 8. The cover 2 is sealed and covered on the second heat-conducting surface 102, and a liquid cooling channel 3 is formed between the cover 2 and the second heat-conducting surface 102. The cover 2 has an inlet 201 and an outlet 202 that communicate with the liquid cooling channel 3. At least one heat-conducting groove 4 is disposed in the liquid cooling channel 3, and the groove end of the heat-conducting groove 4 is sealed and connected to the second heat-conducting surface 102 to form a phase change energy storage cavity 5. The phase change energy storage device can absorb or release latent heat during the phase change process, and the phase change energy storage device is disposed in the phase change energy storage cavity 5.
[0022] In this embodiment, the phase change energy storage material is a material that utilizes the absorption or release of a large amount of latent heat during a phase change process (usually a solid / liquid phase change) to convert energy. In this application, the principle of the phase change energy storage material absorbing a large amount of latent heat from solid to liquid state is utilized to address the situation where a large amount of instantaneous heat cannot be transferred when the power of the heating unit 8 (chip) increases instantaneously.
[0023] Specifically, phase change energy storage materials can be paraffins, such as mixtures of alkanes (n-octadecane, n-eicosane) and paraffins; they can also be fatty acids, such as decanoic acid, lauric acid, palmitic acid and their mixtures; or they can be hydrated salts, such as sodium acetate trihydrate, calcium chloride hexahydrate, and sodium sulfate hydrate.
[0024] like Figure 3 , Figure 4 and Figure 6 As shown, the heating unit 8 is connected to the first heat-conducting surface 101. The heat generated by the heating unit 8 is transferred to the second heat-conducting surface 102 through the first heat-conducting surface 101. Coolant flows in the liquid cooling channel 3, and the heat on the second heat-conducting surface 102 is transferred to the coolant. The coolant cools the heating unit 8.
[0025] When the power of the heating unit 8 increases dramatically, generating a large amount of heat, the heat is rapidly transferred to the phase change energy storage device through the first heat-conducting surface 101 and the second heat-conducting surface 102. The phase change energy storage device undergoes a phase change, changing from a solid to a liquid state. During the phase change process, it absorbs a large amount of heat energy, which can quickly absorb the heat energy released by the heating unit 8. This process is a physical phase change, requiring no external signal trigger or energy input, with a response time on the order of milliseconds or even microseconds, achieving "instantaneous annihilation" of thermal shock.
[0026] The phase change energy storage device absorbs the sudden burst of heat, providing an important buffer window for the delayed response caused by heat dissipation through the coolant in the active cooling system. This avoids the risk of performance degradation or shutdown caused by excessively high local temperature of the heat-generating unit 8 due to heat dissipation lag.
[0027] like Figure 3and Figure 4 As shown, the phase change energy storage cavity 5 is directly located inside the liquid cooling channel 3 and surrounded by coolant, forming a highly efficient dual heat exchange mode. The first mode (cavity wall and phase change material) is responsible for quickly absorbing the peak heat transferred by the heating unit 8 and storing it in the form of latent heat. The second mode (cavity wall and coolant) is responsible for continuously and evenly transferring the stored latent heat and the steady-state heat of the heating unit 8 to the coolant flow.
[0028] The phase change energy storage chamber 5 is located directly inside the liquid cooling channel 3 and surrounded by coolant. This means that the phase change energy storage unit is no longer an additional heat dissipation module independent of the main heat dissipation mode (second mode). It directly acts on the core channel of heat transfer and can "shave peaks and fill valleys" in real time, transforming unstable, high-density instantaneous heat into a relatively gentle heat load that can be continuously carried away by the coolant, making the entire heat dissipation system more stable.
[0029] In some embodiments, such as Figure 1 and Figure 2 As shown, it also includes a mounting bracket 11, which is connected to the heat-conducting plate 1. The mounting bracket 11 is provided with a plurality of locking parts 13, which are adapted to be locked with the server so that the first heat-conducting surface 101 is pressed against the heating unit 8.
[0030] In some embodiments, the coolant may be pure water, a 25% ethylene glycol solution, or a 25% propylene glycol solution.
[0031] In some embodiments, such as Figure 3 As shown, a thermally conductive grease or thermally conductive silicone sheet 12 is provided between the first thermally conductive surface 101 and the heating unit 8, which can fill the tiny gap between the first thermally conductive surface 101 and the heating unit 8 and improve the heat transfer efficiency.
[0032] In some embodiments, such as Figure 1 and Figure 2 As shown, it includes a refrigeration system, which includes an output end and a return end. The output end is connected to the liquid inlet 201, and the return end is connected to the liquid outlet 202.
[0033] In some embodiments, the heat-conducting plate 1 may be made of copper or aluminum alloy.
[0034] In some embodiments, such as Figure 10 and Figure 11 As shown, the phase change energy storage cavity 5 is a rectangular cavity, and the heat conduction tank 4 and part of the second heat conduction surface 102 form a square tube structure.
[0035] In one embodiment, the phase change energy storage device includes a phase change energy storage material and a thermally conductive material, wherein the phase change energy storage material is filled in the phase change energy storage cavity 5; the thermally conductive material is mixed with the phase change energy storage material and filled in the phase change energy storage cavity 5.
[0036] In this embodiment, although phase change energy storage materials (such as paraffin wax, fatty acids, etc.) have high latent heat of phase change, their thermal conductivity is usually very low, which severely restricts their charging and releasing rates. Heat is difficult to transfer quickly from the cavity wall of the phase change energy storage chamber 5 to the interior of the phase change energy storage material, resulting in only the surface layer of the phase change energy storage material near the cavity wall of the phase change energy storage chamber 5 undergoing a phase change. The interior of the phase change energy storage material remains in an inactive state, causing its heat storage capacity to be insufficient, which in turn significantly reduces the heat dissipation response speed of the heating unit 8.
[0037] By uniformly mixing thermally conductive materials with phase change energy storage materials, composite phase change materials are prepared, thereby significantly improving the overall effective thermal conductivity of phase change energy storage devices. Specifically, the thermally conductive materials can be graphene powder, carbon nanotubes, metal powders such as copper or aluminum powder, or high thermal conductivity ceramic particles.
[0038] Mixing thermally conductive materials with phase change energy storage materials significantly accelerates the thermal shock response speed. The high thermal conductivity composite phase change material can rapidly diffuse the peak heat released by the heating unit 8 from the phase change energy storage material's change layer to the interior, causing a larger volume of phase change energy storage material to simultaneously reach the phase change temperature and participate in latent heat absorption in a shorter time. This enables the heat absorption power of the heat dissipation device to cope with instantaneous heat power to be multiplied, and the buffering effect to be more rapid.
[0039] Traditional low thermal conductivity phase change materials tend to result in the outer layer liquefying while the inner core remains solid, rendering the internal material ineffective. By mixing thermally conductive materials, heat can penetrate deep into the spatial interior of the phase change energy storage cavity 5, allowing most of the phase change energy storage material filling the cavity to participate in the phase change process. This maximizes the utilization of the phase change energy storage cavity 5 and provides stronger thermal buffering capacity within the same volume.
[0040] When the load on the heating unit 8 decreases and the phase change energy storage material needs to release the stored heat to restore the initial state, the thermally conductive material can also allow the heat to be quickly transferred from the inside of the phase change energy storage material to the cavity wall of the phase change energy storage chamber 5, and then to the coolant, which shortens the recovery time of the phase change energy storage device and enables it to cope with the next thermal shock more quickly, making it suitable for high-frequency and fluctuating load scenarios.
[0041] The faster heat diffusion inside the composite phase change material reduces local temperature differences, avoids local overheating and decomposition of the composite phase change material that may be caused by poor heat conduction, and improves the long-term cycle stability and reliability of the heat dissipation device.
[0042] In one embodiment, the device further includes a plurality of heat-conducting pillars, one end of which is connected to the cavity wall of the phase change energy storage cavity 5, and the phase change energy storage material is in contact with the outer wall of the heat-conducting pillar.
[0043] In this embodiment, the heat-conducting pillars increase the effective heat transfer area. Traditional heat transfer relies solely on the surface area of the phase change energy storage cavity 5. With the heat-conducting pillars, the heat transfer surface expands to include the cavity wall area and the side surface area of all the heat-conducting pillars. This allows the heating unit 8 to transfer more heat to the phase change energy storage material per unit time, or to dissipate the heat stored in the phase change energy storage material, significantly improving the ability of heat to pass through the walls of the phase change energy storage cavity 5. Specifically, multiple heat-conducting pillars are arranged in an array within the phase change energy storage cavity 5.
[0044] The heat-conducting pillars significantly shorten the heat diffusion path. For phase change energy storage materials or composite phase change materials, heat transfer from the walls of the phase change energy storage cavity 5 to the center of the material requires penetrating the entire material thickness, resulting in a long path and high resistance. The heat-conducting pillars act like "heat-conducting needles" inserted into the material, establishing a "highway" that allows heat to penetrate directly from the walls of the phase change energy storage cavity 5 into the material's interior. Heat can be preferentially and rapidly transferred through the heat-conducting pillars, and then diffused radially from their side surfaces into the surrounding phase change energy storage materials or composite phase change materials, increasing the heat conduction rate within the phase change energy storage materials or composite phase change materials.
[0045] During the transformation of phase change energy storage materials or composite phase change materials from a solid to a liquid state, the liquid portion undergoes natural convection, which facilitates mixing and heat transfer. The heat-conducting column can turbulentize the liquid portion, promoting the mixing of hot and cold fluids and further enhancing heat transfer in the liquid phase. During the solidification stage, the heat-conducting column acts as an adhesion substrate, allowing the liquid phase change energy storage material or composite phase change material to adhere and solidify on the heat-conducting column.
[0046] In one embodiment, a heat-conducting shell is also included, which is connected to the cavity wall of the phase change energy storage chamber 5. The phase change energy storage element is enclosed in the heat-conducting shell. The phase change energy storage chamber 5 has an inlet 501 and an outlet along the first direction X. Both the inlet 501 and the outlet are connected to the liquid cooling channel 3. The first direction X is the direction from the liquid inlet 201 to the liquid outlet 202.
[0047] In this embodiment, the phase change energy storage cavity 5 mainly relies on its outer wall (i.e., the wall of the heat conduction tank 4) to exchange heat with the coolant flowing around it. The heat transfer path is the heating unit 8, the first heat conduction surface 101, the second heat conduction surface 102, the cavity wall of the phase change energy storage cavity 5, and the phase change energy storage material, and the heat is released in the opposite direction.
[0048] This design achieves the shortest heat transfer path between the coolant and the phase change energy storage material (PCE). The coolant directly washes over the inner surface of the heat-conducting shell, while the inner wall of the shell is in close contact with the PCE. During the heat release phase, the heat released by the PCE as it solidifies from a liquid state is transferred almost unimpeded (by only the heat-conducting shell wall) to the flowing low-temperature coolant. This results in a large temperature difference, low thermal resistance, and high heat transfer intensity. This significantly accelerates the cooling rate within the PCE chamber 5, allowing it to rapidly release the stored heat into the system circulation after absorbing one thermal shock, thus preparing for the next shock. This design is particularly suitable for applications with frequent load fluctuations.
[0049] Valves can be installed at the inlet 501 or outlet to regulate the flow rate of coolant through the phase change energy storage chamber 5. When the heating unit 8 is in a steady state or under low load, an appropriate flow rate can be allocated through the phase change energy storage chamber 5 to pre-cool it, ensuring that the phase change energy storage material is in a completely solidified state and its energy storage capacity is at full capacity. When the heating unit 8 is about to enter or is under high load, this direct flow channel can act as a highly efficient heat dissipation component, working in conjunction with the latent heat absorption of the phase change energy storage material to achieve dual-channel heat dissipation.
[0050] In some embodiments, the heat-conducting shell is capsule-shaped.
[0051] In one embodiment, such as Figure 10 and Figure 11 As shown, it also includes a turbulence component 6, which is connected to the cavity wall of the phase change energy storage cavity 5.
[0052] In this embodiment, during fluid heat exchange, the layer of fluid closely adhering to the wall is called the boundary layer. Its flow velocity is very low, and heat transfer mainly relies on conduction, making it the primary source of thermal resistance. The core function of the turbulence-inducing component 6 is to disrupt or thin this thermal boundary layer and stimulate fluid turbulence.
[0053] like Figure 10 and Figure 11 As shown, the turbulence-inducing components 6 (such as protrusions, pits, fins, etc.) can change the flow direction and velocity of the coolant, generating complex flow structures such as turbulence and vortices. This strongly disturbs the boundary layer, continuously drawing the high-speed, low-temperature coolant in the mainstream region to the vicinity of the cavity wall of the phase change energy storage chamber 5, while simultaneously bringing the heated coolant near the cavity wall into the mainstream for mixing. This process greatly promotes the transfer of heat from the cavity wall to the coolant, increasing the convective heat transfer coefficient. After absorbing heat, the phase change energy storage chamber 5 can transfer the heat to the coolant more quickly through its cavity, or be more effectively pre-cooled as the coolant flows through it.
[0054] The turbulence-disrupting component 6 can prevent local overheating of the coolant in the phase change energy storage chamber 5. In a traditional smooth flow channel, the coolant temperature will gradually increase along the flow direction, which may lead to poor cooling effect in the downstream phase change energy storage chamber 5 or the area of the heating unit 8. The turbulence-disrupting component 6 turbulents the coolant, causing strong mixing of coolant in different areas, making the temperature distribution of the coolant more uniform in the flow direction and perpendicular to the flow direction. This ensures that all positions of the phase change energy storage material in the phase change energy storage chamber 5 can obtain coolant at a temperature close to that at the inlet 501, thereby achieving balanced and efficient heat exchange and preventing the phase change energy storage material from recovering too slowly in different positions due to uneven cooling.
[0055] In some embodiments, a pressure pump is provided to ensure that the heat stored in the phase change energy storage material can be efficiently and quickly removed by the coolant.
[0056] In one embodiment, such as Figure 10 and Figure 11 As shown, the turbulence assembly 6 includes multiple turbulence columns 601, which are connected to the cavity wall of the phase change energy storage cavity 5. The multiple turbulence columns 601 are arranged at an angle to the cavity wall of the correspondingly connected phase change energy storage cavity 5.
[0057] In this embodiment, such as Figure 11 As shown, the turbulence column 601 is vertically arranged with the cavity wall of the corresponding phase change energy storage cavity 5. The liquid cooling plate flows through the vertical turbulence column 601, and the turbulence column 601 may form vortices in the downstream direction, causing turbulence of the coolant.
[0058] like Figure 10 As shown, the inclined baffle column 601, when the coolant flow impacts the baffle column 601, not only generates vortices, but also induces longitudinal vortices (whose rotation axis is parallel to the mainstream direction) on the side of the baffle column 601 due to the guiding effect of the inclined surface of the baffle column 601 on the flow. These longitudinal vortices can continuously sweep the low-temperature fluid in the core area towards the cavity wall, while simultaneously drawing the high-temperature coolant near the cavity wall to the center of the mainstream, resulting in better mixing.
[0059] like Figure 10 As shown, when the turbulence column 601 is tilted at an angle, the coolant can partially pass through the inclined surface of the turbulence column 601, reducing the projected area of the turbulence column 601 on the plane perpendicular to the first direction X, thereby significantly reducing drag. At the same time, the tilt angle can guide the fluid to bypass the turbulence column 601 more smoothly, reducing severe turbulence in the downstream region of the turbulence column 601.
[0060] like Figure 10As shown, the angle setting allows the turbulence-disrupting columns 601 to be arranged on the cavity wall at different angles, densities, and arrangements (such as staggered arrangements). The inclination angle of the turbulence-disrupting columns 601 can be flexibly optimized according to the specific flow direction inside the phase change energy storage cavity 5 and the expected heat transfer intensity distribution.
[0061] In some embodiments, such as Figure 9 and Figure 10 As shown, a smaller tilt angle is used at the inlet 501 of the phase change energy storage chamber 5 to smooth out the initial disturbance, a larger tilt angle is used in the middle section to enhance heat transfer, and the angle is adjusted at the outlet section to stabilize the coolant.
[0062] In one embodiment, using the same phase change energy storage material and ensuring the coolant enters the inlet 501 in the same state, compared to not having a baffle column 601, when the baffle column 601 is perpendicular to the cavity wall, the phase change time of the phase change energy storage material can be effectively reduced by 15% to 40%, and the heat transfer efficiency can be increased by an average of 30%, but the frictional pressure drop increases by an average of 60%. Compared to not having a baffle column 601, when the baffle column 601 is obliquely set to the cavity wall, the phase change time of the phase change energy storage material can be effectively reduced by 10% to 30%, and the overall heat transfer efficiency can be increased by 24%, but the frictional pressure drop only increases by about 30%.
[0063] In one embodiment, such as Figure 12 and Figure 13 As shown, the turbulence assembly 6 includes multiple turbulence plates 602, which are spaced apart and connected to the cavity wall of the phase change energy storage cavity 5. The turbulence plates 602 are arranged in a first turbulence section 6021, a second turbulence section 6022 and a third turbulence section 6023 in a first cyclic arrangement along the first direction X. The extension direction of the second turbulence section 6022 is parallel to the first direction X. The extension direction of the first turbulence section 6021 is set at a first deflection angle with the first direction X. The extension direction of the third turbulence section 6023 is set at a second deflection angle with the first direction X. The deflection directions of the first deflection angle and the second deflection angle are opposite.
[0064] In this embodiment, such as Figure 12 and Figure 13 As shown, the first turbulence section 6021 and the third turbulence section 6023, which alternately change direction, guide the coolant to generate periodic lateral oscillations. Unlike the sudden flow separation and impact caused by vertical or inclined turbulence columns 601, the turbulence plate 602 can guide the coolant to form waves. After the coolant is briefly stabilized in the second turbulence section 6022, it is guided to change direction by the third turbulence section 6023. This process continuously disrupts the stability of the boundary layer, prompting the mainstream coolant to continuously exchange with the coolant near the cavity wall, thereby maintaining a high heat transfer intensity. At the same time, since the 90-degree right-angle impact is avoided, the kinetic energy loss of the flow is small, and the overall flow resistance increase is relatively gradual.
[0065] In one embodiment, when using the same phase change energy storage material and ensuring that the coolant enters the inlet 501 in the same state, compared with not setting the baffle 601, setting the baffle 602 on the cavity wall can effectively increase the heat transfer efficiency by more than 40% and increase the friction pressure drop by about 50%.
[0066] The periodically reverse-deflecting baffles 602 induce transverse secondary flows in the liquid-cooled channel 3. The scale of these secondary flows is comparable to the distance between adjacent baffles 602. These large-scale transverse secondary flows effectively drive the low-temperature coolant in the central region of the main flow to the vicinity of the cavity wall, and carry the high-temperature coolant near the cavity wall towards the central region of the main flow. This results in a uniform temperature distribution across the entire cross-section of the liquid-cooled channel 3, preventing coolant temperature stratification and ensuring that the entire wall of the phase change energy storage chamber 5 is in contact with coolant at a temperature close to that of the inlet 501, thereby improving heat exchange efficiency.
[0067] In some embodiments, the baffle 602 has multiple notches on the side of the cavity wall away from the phase change energy storage cavity 5, which can further improve the disturbance of the coolant.
[0068] In one embodiment, such as Figure 3 , Figure 7 and Figure 8 As shown, multiple heat conduction grooves 4 are provided, and the multiple heat conduction grooves 4 are arranged at intervals. And / or, it also includes a plurality of heat dissipation fins 7, which are disposed on the second heat-conducting surface 102 and / or on the heat-conducting groove 4.
[0069] In this embodiment, the capacity and position of a single phase change energy storage cavity 5 are fixed. By setting multiple independent heat conduction grooves 4, multiple phase change energy storage units can be flexibly arranged on the heat conduction plate 1 according to the size of the heating unit 8, the distribution of heat sources (such as the heat generation difference of different core clusters in a multi-core CPU), and the expected heat buffering requirements.
[0070] In some embodiments, a heat-conducting groove 4 is provided on the heat-conducting plate 1 at each of the four corners and the center of the corresponding chip (heat-generating unit 8, CPU, GPU); alternatively, multiple heat-conducting grooves 4 can be densely arranged on the heat-conducting plate 1 to correspond to high heat flux density areas (such as the chip center). This allows the heat dissipation device of this application to be highly adaptable to chips of different models and architectures. At the same time, multiple phase change energy storage cavities 5 also improve the redundancy of the system. Even if a phase change energy storage cavity 5 experiences a slight performance change due to long-term cycling, the overall buffering capacity can still be maintained. In addition, the spaced arrangement ensures that the coolant can flow smoothly between adjacent phase change energy storage cavities 5, and allows heat to be absorbed and carried away more evenly in the liquid cooling channel 3.
[0071] In some embodiments, the distance between two adjacent heat-conducting grooves 4 is 10 mm.
[0072] By placing the heat dissipation fins 7 (typically high-density, thin-walled toothed structures) on the second heat-conducting surface 102, the contact area between the heat-conducting plate 1 and the coolant is greatly increased, improving the heat dissipation capacity of the heat-generating unit 8 in steady state. Further placing the heat dissipation fins 7 on the heat-conducting groove 4 (i.e., the outer surface of the phase change energy storage cavity 5) directly enhances the heat exchange capacity between the phase change energy storage cavity 5 and the coolant. Especially during the heat release phase, this helps to dissipate the heat stored in the phase change energy storage cavity 5 more quickly. Furthermore, when the phase change energy storage material completely liquefies, resulting in the loss of thermal buffering capacity, the heat dissipation fins 7 located on the phase change energy storage cavity 5 can continue to provide a certain degree of heat dissipation protection for the heat-generating unit 8 through heat exchange, preventing temperature runaway and improving the heat dissipation device's tolerance under extreme operating conditions.
[0073] In one embodiment, multiple heat-conducting grooves 4 and multiple heat dissipation fins 7 are provided simultaneously, which greatly enhances the heat dissipation effect of the heat dissipation device.
[0074] In some embodiments, the heat dissipation fins 7 are prepared by CNC machining, specifically, the thickness of the heat dissipation fins 7 is 0.08 mm to 0.12 mm.
[0075] In one embodiment, at least two heat conduction grooves 4 are provided, and the at least two heat conduction grooves 4 include a first groove 401 and a second groove 402, wherein the width of the first groove 401 is greater than the width of the second groove 402.
[0076] In this embodiment, the heat-generating unit 8 (such as a large CPU or GPU) integrates billions of transistors and numerous computing cores. Its power consumption distribution is not uniform. When performing specific computing tasks, some core clusters (such as CUDA core-dense areas or AI acceleration units) may be under full load, generating a large amount of heat locally, while other areas may be relatively idle. A wider first tank 401 is arranged in the area where a large amount of heat is generated (thus forming a phase change energy storage cavity 5 with a larger capacity), while a narrower second tank 402 is arranged in the area with a lower temperature.
[0077] In some embodiments, such as Figure 7 As shown, multiple second grooves 402 are provided on the heat-conducting plate 1. The second grooves 402 extend along the first direction X and are arranged at intervals along the second direction Y. This arrangement can cope with the scenario where the main heat-generating area of the heat-generating unit 8 is relatively evenly distributed.
[0078] In some embodiments, such as Figure 8As shown, the heat-conducting plate 1 is provided with two first grooves 401 and multiple second grooves 402. The two first grooves 401 and multiple second grooves 402 are arranged at intervals along the second direction Y. The multiple second grooves 402 are arranged between the two first grooves 401. This arrangement can cope with the scenario where the main heat-generating area of the heat-generating unit 8 is located in its edge area.
[0079] In some embodiments, such as Figure 9 As shown, a first groove 401 and a plurality of second grooves 402 are provided on the heat-conducting plate 1. The first groove 401 and the plurality of second grooves 402 are arranged at intervals along the second direction Y. The first groove 401 is disposed between the plurality of second grooves 402. This arrangement can cope with the scenario where the main heat-generating area of the heat-generating unit 8 is arranged in the middle area.
[0080] According to an embodiment of the present invention, another aspect provides a server including a heat dissipation device.
[0081] This implementation significantly improves the computational reliability and continuity of the server under dynamic loads. For data centers, server downtime means huge economic losses and a decline in service quality. Traditional servers face a high risk of CPU / GPU throttling or even downtime when encountering sudden high loads. Servers using the cooling device of this application, with their millisecond-level passive thermal buffering capability, can easily handle instantaneous peak computing tasks, greatly reducing downtime caused by thermal delays.
[0082] Traditional heat dissipation solutions may cause chips to frequently throttle due to sudden temperature increases, resulting in an actual operating frequency lower than the standard value. The heat dissipation device in this application effectively smooths out temperature fluctuations, allowing the chip to maintain a higher frequency for a longer period of time, thereby achieving stronger sustained computing performance.
[0083] The following is an example, combined with Figures 1 to 13 A comprehensive explanation of all the above-mentioned plans is provided.
[0084] Example 1 This embodiment provides a heat dissipation device, mainly used for cooling chips (such as CPUs). The heat dissipation device includes a heat-conducting plate 1, a cover 2, multiple heat-conducting grooves 4, and a phase change energy storage device.
[0085] The heatsink 1 is typically made of a metal material with high thermal conductivity, such as copper or aluminum alloy. It has a first heatsink surface 101 and a second heatsink surface 102. The first heatsink surface 101 is tightly attached to the back of the chip via a thermal interface material (such as thermal grease). Multiple heat dissipation fins 7 are formed on the second heatsink surface 102 by means of CNC machining or welding.
[0086] The cover 2 is sealed and mounted on the second heat-conducting surface 102 of the heat-conducting plate 1 by a sealing ring (not shown in the figure) and fasteners, covering the heat dissipation fins 7. The space between the cover 2 and the second heat-conducting surface 102 forms the liquid cooling channel 3. The cover 2 is provided with a liquid inlet 201 and a liquid outlet 202, which are used to connect to the output end and return end of the refrigeration system, respectively.
[0087] Multiple heat-conducting grooves 4 are elongated structures made of the same material as the heat-conducting plate 1. The heat-conducting grooves 4 are connected by welding the heat-conducting plate 1 or are integrally formed with the heat-conducting plate 1. The groove ends of the heat-conducting grooves 4 are sealed and connected to the second heat-conducting surface 102. Each heat-conducting groove 4 and the second heat-conducting surface 102 enclose an independent, sealed phase change energy storage cavity 5.
[0088] Phase change energy storage components are filled into each phase change energy storage cavity 5. In this embodiment, the phase change energy storage components are mainly composed of paraffin-based phase change energy storage materials (melting point between 50°C and 70°C) and uniformly doped graphite powder to improve the thermal conductivity of the phase change composite material.
[0089] Working Process: When the chip is under normal load, most of the heat generated is transferred to the heat sink fins 7 through the heat conduction plate 1 and carried away by the coolant flowing through the liquid cooling channel 3. When the chip experiences a sudden power surge due to a sudden task, the chip temperature rises rapidly, and the heat is quickly conducted to the phase change energy storage chamber 5. When the phase change energy storage material in the chamber reaches its melting point, it begins to melt. This process absorbs a large amount of latent heat of phase change, effectively suppressing the rate of temperature rise of the chip and keeping it within a safe range. During this period, the cooling system has sufficient time to adjust the coolant flow rate or temperature based on feedback signals. When the chip load decreases, the phase change energy storage material gradually solidifies, releasing the stored heat. This heat is carried away by the continuously flowing coolant, allowing the phase change energy storage chamber 5 to return to a state where it can absorb heat again.
[0090] Example 2 This embodiment provides a server, including a chassis, a motherboard, and at least one heat dissipation device as described in Embodiment 1.
[0091] The motherboard is installed inside the chassis, and high-power chips such as the CPU and GPU are mounted on it. The heat dissipation device is tightly mounted to the back of the corresponding CPU or GPU chip through the first heat-conducting surface 101 of its heat-conducting plate 1.
[0092] The refrigeration system is usually located in the computer room and contains a circulating pump, heat exchanger, liquid storage tank and control unit. 9 Output pipe 9 connects the output end of the refrigeration system to the liquid inlet 201 of the heat dissipation device, and 10 Return pipe 10 connects the return end of the refrigeration system to the liquid outlet 202, forming a closed cooling circulation loop.
[0093] In this server, the heat dissipation device and the cooling system work together to form a responsive and powerful tiered heat dissipation system, which ensures the continuous and stable operation of the server under highly dynamic and high-performance computing tasks and significantly reduces the risk of system failure due to heat dissipation delay.
[0094] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended application.
Claims
1. A heat dissipation device, characterized in that, include: The heat-conducting plate (1) has a first heat-conducting surface (101) and a second heat-conducting surface (102) arranged opposite to each other, and the first heat-conducting surface (101) is adapted to be connected to the heating unit (8); The cover (2) is sealed on the second heat-conducting surface (102), and a liquid cooling channel (3) is formed between the cover (2) and the second heat-conducting surface (102). The cover (2) is provided with an inlet (201) and an outlet (202) that connect the liquid cooling channel (3). At least one heat-conducting groove (4) is disposed in the liquid cooling channel (3), and the groove end of the heat-conducting groove (4) is sealed to the second heat-conducting surface (102) to form a phase change energy storage cavity (5). A phase change energy storage device that can absorb or release latent heat during the phase change process is installed inside the phase change energy storage cavity (5).
2. The heat dissipation device according to claim 1, characterized in that, The phase change energy storage device includes: Phase change energy storage material is filled into the phase change energy storage cavity (5); The thermally conductive material is mixed with the phase change energy storage material and filled into the phase change energy storage cavity (5).
3. The heat dissipation device according to claim 2, characterized in that, It also includes multiple heat-conducting columns, one end of which is connected to the cavity wall of the phase change energy storage cavity (5), and the phase change energy storage material is in contact with the outer wall of the heat-conducting column.
4. The heat dissipation device according to any one of claims 1 to 3, characterized in that, It also includes a heat-conducting shell, which is connected to the cavity wall of the phase change energy storage chamber (5). The phase change energy storage component is enclosed in the heat-conducting shell. The phase change energy storage chamber (5) has an inlet (501) and an outlet along the first direction (X). The inlet (501) and the outlet are both connected to the liquid cooling channel (3). Wherein, the first direction (X) is the direction from the liquid inlet (201) to the liquid outlet (202).
5. The heat dissipation device according to claim 4, characterized in that, It also includes a turbulence component (6), which is connected to the cavity wall of the phase change energy storage cavity (5).
6. The heat dissipation device according to claim 5, characterized in that, The turbulence assembly (6) includes a plurality of turbulence columns (601), which are connected to the cavity wall of the phase change energy storage cavity (5). The plurality of turbulence columns (601) are arranged at an angle to the cavity wall of the correspondingly connected phase change energy storage cavity (5).
7. The heat dissipation device according to claim 5, characterized in that, The turbulence assembly (6) includes a plurality of turbulence plates (602), which are spaced apart and connected to the cavity wall of the phase change energy storage cavity (5). The turbulence plates (602) are arranged in a first turbulence section (6021), a second turbulence section (6022) and a third turbulence section (6023) in a cyclic arrangement along the first direction (X). The extension direction of the second turbulence section (6022) is parallel to the first direction (X). The extension direction of the first turbulence section (6021) is set at a first deflection angle with the first direction (X). The extension direction of the third turbulence section (6023) is set at a second deflection angle with the first direction (X). The deflection directions of the first deflection angle and the second deflection angle are opposite.
8. The heat dissipation device according to any one of claims 1 to 3, characterized in that, Multiple heat-conducting grooves (4) are provided, and the multiple heat-conducting grooves (4) are arranged at intervals; And / or, it also includes a plurality of heat dissipation fins (7), the plurality of heat dissipation fins (7) being disposed on the second heat-conducting surface (102) and / or on the heat-conducting groove (4).
9. The heat dissipation device according to any one of claims 1 to 3, characterized in that, At least two heat-conducting grooves (4) are provided, and the at least two heat-conducting grooves (4) include a first groove (401) and a second groove (402), wherein the width of the first groove (401) is greater than the width of the second groove (402).
10. An electronic device, characterized in that, Includes the heat dissipation device as described in any one of claims 1 to 9.