Electronic device

Abstract

The application discloses an electronic device, and relates to the technical field of electronic devices, and the electronic device comprises a PCB board, a plurality of power devices and an outer shell body, the plurality of power devices are arranged on two sides of the PCB board and are mounted on the PCB board along the thickness direction of the PCB board, the outer shell body comprises two sub outer shell bodies, the two sub outer shell bodies are arranged along the thickness direction and jointly define a mounting space, at least part of the PCB board and the plurality of power devices are assembled in the mounting space, the sub outer shell body and the power device on the same side of the PCB board are in heat exchange cooperation, and heat exchange medium flow channels for the flow of heat exchange medium are formed in the two sub outer shell bodies. According to the electronic device provided by the application, the effect of synchronous cooling of the electronic device on both sides along the thickness direction of the PCB board can be achieved, the uniformity of the cooling of the electronic device can be improved, the heat dissipation capacity of the electronic device can be improved, the heat dissipation effect of the electronic device can be improved, and the reliability of the electronic device can be improved.

Description

Technical Field

[0001] This invention relates to the field of electronic equipment technology, and in particular to an electronic device. Background Technology

[0002] In related technologies, existing solid-state drives (SSDs) have single-sided heat dissipation, resulting in heat dissipation blind spots. This leads to large temperature differences and localized high temperatures among internal components, which can easily reduce the storage read / write performance and stability of the SSD. While the SSD's casing, liquid cooling plate, and piping are fixedly connected to ensure reliable heat dissipation, this makes it inconvenient to install and remove the SSD. In-line hot-swapping is not possible. Furthermore, the rigid fit or simple compression between the liquid cooling plate and the casing prevents a constant and uniform contact pressure, easily leading to problems such as localized gaps, warping, or poor adhesion. This affects the thermal conductivity of the liquid cooling plate and the overall heat dissipation performance of the SSD. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one objective of this invention is to provide a device that facilitates simultaneous cooling of both sides of an electronic device along the thickness direction of a PCB board, improves the uniformity of cooling, enhances the heat dissipation capacity, and further improves the reliability of the electronic device.

[0004] An electronic device according to an embodiment of the present invention includes: a PCB board, a plurality of power devices, and a housing. Along the thickness direction of the PCB board, the plurality of power devices are respectively located on both sides of the PCB board and mounted on the PCB board. The housing includes two sub-housing bodies, which are arranged along the thickness direction and jointly define an installation space. At least a portion of the PCB board and the plurality of power devices are assembled in the installation space. The sub-housing bodies located on the same side of the PCB board and the power devices are heat exchanged. Each of the two sub-housing bodies has a heat exchange medium flow channel for supplying a heat exchange medium.

[0005] According to the embodiments of this application, the electronic device has heat exchange medium channels formed on both sides of the outer casing along the thickness direction of the PCB board. The heat exchange medium cooperates with multiple power devices for heat exchange, and the power devices on both sides of the PCB board along the thickness direction of the PCB board cool down simultaneously. This is beneficial to achieve the effect of synchronous cooling on both sides of the electronic device along the thickness direction of the PCB board, which helps to reduce the probability of the electronic device having heat dissipation blind spots that result in poor local temperature heat dissipation, improves the uniformity of cooling of the electronic device, improves the heat dissipation capacity of the electronic device, and also improves the heat dissipation effect of the electronic device, which helps to improve the reliability of the electronic device.

[0006] According to some embodiments of the present invention, the electronic device further includes: a communication structure connected between the two sub-shells to communicate the heat exchange medium flow channels of the two sub-shells.

[0007] According to some embodiments of the present invention, the PCB board has through holes that penetrate the PCB board along the thickness direction, and the connecting structure passes through the through holes.

[0008] According to some embodiments of the present invention, the connecting structure is plugged into both of the sub-outer shells, and the connecting structure is sealed to both of the sub-outer shells.

[0009] According to some embodiments of the present invention, a medium inlet and a medium outlet are formed on one side of the outer shell along a first direction. The medium inlet and the medium outlet are respectively formed in two sub-outer shells. The medium inlet is connected to the heat exchange medium flow channel of the corresponding sub-outer shell, and the medium outlet is connected to the heat exchange medium flow channel of the corresponding sub-outer shell. The first direction is perpendicular to the thickness direction.

[0010] According to some embodiments of the present invention, the electronic device further includes: an inlet temperature detection element and an outlet temperature detection element, wherein the inlet temperature detection element is disposed on the sub-outer housing having the medium inlet and is used to detect the temperature information of the heat exchange medium at the medium inlet, and the outlet temperature detection element is disposed on the sub-outer housing having the medium outlet and is used to detect the temperature information of the heat exchange medium at the medium outlet, and both the inlet temperature detection element and the outlet temperature detection element are connected to the PCB board.

[0011] According to some embodiments of the present invention, along the thickness direction, the orthographic projection of the heat exchange medium channel is arranged around the orthographic projection of the power device on the corresponding side.

[0012] According to some embodiments of the present invention, the sub-shell includes: a solid heat exchange section, the solid heat exchange section being in heat exchange cooperation with the power device located on the same side of the PCB board, and the heat exchange medium flow channel being disposed around the solid heat exchange section.

[0013] According to some embodiments of the present invention, the number of the sub-shell housings forming the solid heat exchange sections is the same as and corresponds one-to-one with the number of the power devices located on the same side of the PCB board, and the heat exchange medium flow channels are arranged around each of the solid heat exchange sections.

[0014] According to some embodiments of the present invention, a heat-conducting structure is provided between the power device and the corresponding sub-casing.

[0015] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a cross-sectional view of an electronic device according to an embodiment of this application; Figure 2 This is another cross-sectional view of an electronic device according to an embodiment of this application; Figure 3 This is a schematic diagram of the internal structure of the first sub-outer shell according to an embodiment of this application.

[0017] Figure label: Electronic device 1, PCB board 11, through hole 111, connector 112, power device 12, 20 outer casing, 21 sub-outer casing, 211 heat exchange medium flow channel, 212 solid heat exchange section, 22 installation space, 23 medium inlet, 24 medium outlet, 25 assembly hole, 26 first sub-outer casing, 27 second sub-outer casing. Connected structure 30, Import temperature sensor 41, export temperature sensor 42. Thermally conductive structure 50, External piping 2. Detailed Implementation

[0018] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0019] The following is for reference. Figures 1-3 An electronic device 1 according to an embodiment of the present invention is described.

[0020] Electronic device 1 according to an embodiment of the present invention, such as Figures 1-3As shown, the electronic device 1 may include: a PCB board 11, a plurality of power devices 12 and a housing 20. Along the thickness direction of the PCB board 11, the plurality of power devices 12 are respectively located on both sides of the PCB board 11 and mounted on the PCB board 11. The housing 20 includes two sub-housing bodies 21. The two sub-housing bodies 21 are arranged along the thickness direction and together define an installation space 22. At least a portion of the PCB board 11 and the plurality of power devices 12 are assembled in the installation space 22. The sub-housing bodies 21 located on the same side of the PCB board 11 and the power devices 12 are heat exchanged together. Each of the two sub-housing bodies 21 has a heat exchange medium channel 211 for supplying heat exchange medium flow.

[0021] It should be noted that existing solid-state drives (SSDs) have single-sided heat dissipation, resulting in heat dissipation blind spots. This leads to large temperature differences among internal components and localized high temperatures, which can easily reduce the storage read / write performance and stability of the SSD. While the SSD's casing, liquid cooling plate, and piping are fixedly connected to ensure reliable heat dissipation, this makes it inconvenient to install and remove the SSD. In-line hot-swapping is not possible. Furthermore, the rigid fit or simple compression between the liquid cooling plate and the casing prevents a constant and uniform contact pressure, easily leading to localized gaps, warping, or poor adhesion. This affects the thermal conductivity of the liquid cooling plate and the overall heat dissipation performance of the SSD.

[0022] Based on this, this application proposes an electronic device 1, in which a PCB board 11 (Printed Circuit Board) serves as a supporting structure for power devices 12 and also as a carrier for the electrical connection of multiple power devices 12. Along the thickness direction of the PCB board 11, multiple power devices 12 can be located on both sides of the PCB board 11, and the number of power devices 12 on both sides of the PCB board 11 can be the same or different. Multiple power devices 12 can be mounted on the PCB board 11 by soldering, crimping, or other methods, and the PCB board 11 provides fixed support for the multiple power devices 12. When the electronic device 1... Figure 1 When setting the orientation, the thickness direction of PCB board 11 is... Figure 1The outer casing 20 may include two sub-outer casings 21, which can be arranged along the thickness direction of the PCB board 11. The two sub-outer casings 21 together define the mounting space 22, that is, the electronic device 1 has a mounting space 22 for assembling the PCB board 11 and multiple power devices 12. The two sub-outer casings 21 can be fixedly connected by means of snap-fit, bolt connection, etc. The two sub-outer casings 21 can be separate parts, which facilitates the assembly of the PCB board 11 and power devices 12 into the mounting space 22. At least a part of the PCB board 11 and multiple power devices 12 are assembled into the mounting space 22, thereby achieving the effect of jointly setting the PCB board 11 and multiple power devices 12 in the electronic device 1. The multiple power devices 12 generate heat when working.

[0023] As an example, electronic device 1 can be a solid-state memory, and power device 12 can be the core components of solid-state memory such as main control chip, NAND flash memory chip and DRAM memory chip. The copper foil lines on PCB board 11 can electrically connect multiple power devices 12 to form a complete storage or computing module of solid-state memory.

[0024] As an example, part of the PCB board 11 is assembled within the mounting space 22, while another part of the PCB board 11 extends out of the mounting space 22. A mounting hole 25 can be formed on one end face of the housing 20 along the first direction, penetrating the housing 20 along the first direction. The PCB board 11 passes through the mounting hole 25, thereby assembling part of the PCB board 11 within the mounting space 22, while another part of the PCB board 11 extends out of the mounting space 22. A connector 112 can be provided on the side of the PCB board 11 located outside the mounting space 22 along the first direction away from the housing 20. The connector 112 is used for communication connection with external devices. When the electronic device 1... Figure 1 When setting the direction, the first direction is Figure 1 The X-direction in the first direction is perpendicular to the thickness direction of the PCB board 11.

[0025] When the power device 12 operates, it generates heat. The sub-shell 21 located on the same side of the PCB board 11 and the corresponding power device 12 can exchange heat, meaning the heat generated by the power device 12 can be transferred to the corresponding sub-shell 21. Both sub-shells 21 can have heat exchange medium channels 211 for the flow of heat exchange medium. The heat exchange medium in the heat exchange medium channels 211 can exchange heat with multiple power devices 12 through the sub-shells 21. The heat exchange medium in the heat exchange medium channels 211 can absorb the heat dissipated by multiple power devices 12, thereby reducing the temperature of multiple power devices 12 and achieving the effect of cooling the electronic device 1. Furthermore, the heat exchange medium that has absorbed heat and heated up can flow out of the heat exchange medium channels 211. By continuously introducing a low-temperature heat exchange medium into the heat exchange medium channels 211, the effect of continuous cooling of multiple power devices 12 by the low-temperature heat exchange medium can be achieved.

[0026] Along the thickness direction of the PCB board 11, heat exchange medium can flow within the sub-shells 21 on both sides of the PCB board 11. The heat exchange medium in the heat exchange medium channels 211 on both sides of the PCB board can exchange heat with the power devices 12 on the corresponding sides, allowing the power devices 12 on both sides of the PCB board 11 to cool down simultaneously. This is beneficial for achieving synchronous cooling of the electronic device 1 on both sides of the PCB board 11 along the thickness direction, reducing the probability of heat dissipation blind spots in the electronic device 1 resulting in poor local temperature dissipation, improving the uniformity of cooling, enhancing the heat dissipation effect, and improving the reliability of the electronic device 1. Compared with the prior art, this application, by forming heat exchange medium channels 211 for heat exchange medium flow within the shell 20, eliminates the need for additional cooling devices for cooling the electronic device 1. This facilitates the assembly and disassembly of the electronic device 1 while providing good cooling effect, and reduces the risk of improper installation of cooling devices affecting the cooling effect, further improving the reliability of the electronic device 1.

[0027] In this embodiment, by setting heat exchange medium channels 211 with heat exchange medium flowing on both sides of the outer casing 20 along the thickness direction of the PCB board 11, the heat exchange medium cooperates with multiple power devices 12 for heat exchange, and the power devices 12 on both sides of the PCB board 11 along the thickness direction of the PCB board 11 cool down simultaneously. This is beneficial to achieve the effect of synchronous cooling of both sides of the electronic device 1 along the thickness direction of the PCB board 11, which helps to reduce the probability that the electronic device 1 has heat dissipation blind spots, resulting in poor local temperature heat dissipation effect, which helps to improve the cooling uniformity of the electronic device 1, which helps to improve the heat dissipation capacity of the electronic device 1, and also improves the heat dissipation effect of the electronic device 1, which helps to improve the reliability of the electronic device 1.

[0028] In some embodiments of the present invention, such as Figures 1-3As shown, the electronic device 1 may further include: a connecting structure 30, which is connected between two sub-outer shells 21 to connect the heat exchange medium flow channels 211 of the two sub-outer shells 21.

[0029] The heat exchange medium channels 211 of the two sub-shells 21 can be connected, and the heat exchange medium in one heat exchange medium channel 211 can flow into the other heat exchange medium channel 211. The heat exchange medium in the two heat exchange medium channels 211 can be mixed, which is beneficial to make the temperature of the heat exchange medium in the two heat exchange medium channels 211 more uniform, which is beneficial to reduce the probability of a large temperature difference of the heat exchange medium introduced into the two heat exchange medium channels 211, which is beneficial to reduce the probability of different heat exchange effects between the heat exchange medium and the power devices 12 on different sides of the PCB board 11, and is beneficial to further improve the uniformity of cooling of the electronic device 1. Furthermore, the heat exchange medium can flow into the corresponding heat exchange medium channel 211 from the inlet of one heat exchange medium channel 211, and after heat exchange with the power device 12 on the corresponding side, it flows into the other heat exchange medium channel 211 and flows out from the outlet of the corresponding heat exchange medium channel 211. That is, only one inlet and one outlet of the heat exchange medium channel 211 need to be provided on the entire outer casing 20, which helps to simplify the structure of the heat exchange medium channel 211, reduces the interfaces between the electronic device 1 and the external pipeline 2, and simplifies the assembly method of the electronic device 1. By continuously supplying heat exchange medium to the inlet of one heat exchange medium channel 211 and continuously discharging the heated heat exchange medium from the outlet of the other heat exchange medium channel 211, the effect of continuous cooling of multiple power devices 12 by the heat exchange medium can be further achieved.

[0030] As an example, when the heat exchange medium is used to cooperate with multiple power devices 12, the heat exchange medium can fill the heat exchange medium flow channel 211, thereby improving the reliability of the heat exchange medium cooperation with multiple power devices 12. This helps to reduce the probability that a certain power device 12 will have poor cooling effect due to the absence of heat exchange medium flow in a local sub-shell 21. It also helps to further reduce the probability that the electronic device 1 has heat dissipation blind spots, resulting in poor local temperature heat dissipation effect, and further improves the uniformity of cooling of the electronic device 1.

[0031] The connecting structure 30 can be connected between two sub-outer shells 21. The connecting structure 30 can be connected to two heat exchange medium channels 211 respectively, thereby connecting the heat exchange medium channels 211 of the two sub-outer shells 21. One heat exchange medium channel 211 can form an outlet connected to the connecting structure 30, and the other heat exchange medium channel 211 can form an inlet connected to the connecting structure 30. The outlet of the corresponding heat exchange medium channel 211 and the inlet of the other heat exchange medium channel 211 can be opposite each other along the thickness direction of the PCB board 11. The connecting structure 30 can connect the heat exchange medium channels 211 of the two sub-outer shells 21 along the thickness direction of the PCB board 11, which helps to shorten the flow path length of the heat exchange medium from one heat exchange medium channel 211 to the other heat exchange medium channel 211, and helps to improve the efficiency of the heat exchange medium flowing from one heat exchange medium channel 211 to the other heat exchange medium channel 211, thus improving the heat exchange efficiency of the electronic device 1.

[0032] In some embodiments of the present invention, such as Figures 1-3 As shown, the PCB board 11 has a through hole 111, which penetrates the PCB board 11 along the thickness direction, and the connecting structure 30 passes through the through hole 111.

[0033] The PCB board 11 may have a through hole 111, which can penetrate the PCB board 11 along its thickness direction. The through hole 111 can be positioned opposite to the two sub-outer shells 21 along the thickness direction of the PCB board 11, and can conduct heat exchange medium flow channels 211 of the two sub-outer shells 21. A connecting structure 30 can be inserted through the through hole 111, and can be limited and matched with the inner wall of the through hole 111. The connecting structure 30 is fixedly connected to the PCB board 11. The through hole 111 can be arranged opposite to the outlet of one heat exchange medium flow channel 211 and the inlet of another heat exchange medium flow channel 211 along the thickness direction of the PCB board 11. The two sub-shells 21 are separate parts, and the two sub-shells 21 are respectively arranged on opposite sides of the through hole 111 along the thickness direction of the PCB board 11. The connecting structure 30 is inserted through the through hole 111, that is, the outlet of one heat exchange medium flow channel 211 and the inlet of another heat exchange medium flow channel 211 can be respectively arranged on both sides of the connecting structure 30.

[0034] The portions of the outer casing 21 and the PCB board 11 extending out of the mounting space 22 are opposite and in contact along the thickness direction of the PCB board 11. The portions of the connecting structure 30 and the PCB board 11 extending out of the mounting space 22 are located on the same side of the outer casing 20 along the first direction. The PCB board 11 needs to be provided with through holes 111 to facilitate the assembly of the connecting structure 30. This helps to reduce the probability of the connecting structure 30 interfering with the PCB board 11 while connecting the two heat exchange medium channels 211, and helps to improve the reliability of the connecting structure 30.

[0035] As an example, the connecting structure 30 can be located on different sides of the outer shell 20 along the first direction with the overall inlet and overall outlet of the two interconnected heat exchange medium channels 211. This allows the heat exchange medium that has just flowed into the heat exchange medium channel 211 to flow through the corresponding sub-outer shell 21 along the first direction. It also allows the heat exchange medium to flow out of the corresponding heat exchange medium channel 211 after flowing through the corresponding sub-outer shell 21 along the first direction. This is beneficial for increasing the flow path length of the heat exchange medium in the two heat exchange medium channels 211, for increasing the heat exchange area of ​​the heat exchange medium and multiple power devices 12, for enabling the heat exchange medium and multiple power devices 12 to exchange heat effectively, for further improving the heat dissipation capacity of the electronic device 1, and for further improving the heat dissipation effect of the electronic device 1, and for further improving the reliability of the electronic device 1.

[0036] The connecting structure 30 can extend along the thickness direction of the PCB board 11. Both ends of the connecting structure 30 can be connected to the corresponding side heat exchange medium channels 211, which is beneficial for further realizing the effect of connecting the connecting structure 30 along the thickness direction of the PCB board 11 to the heat exchange medium channels 211 of the two sub-shells 21. This further shortens the flow path length of the heat exchange medium from one heat exchange medium channel 211 to the other, and further improves the efficiency of the heat exchange medium flowing from one heat exchange medium channel 211 to the other. The connecting structure 30 is embedded in the PCB board 11 and the two sub-shells 21, requiring no external space, which helps improve the structural compactness of the electronic device 1 and reduces the space occupied by the electronic device 1.

[0037] In some embodiments of the present invention, the connecting structure 30 is plugged into and assembled with the two sub-outer shells 21, and the connecting structure 30 is sealed to the two sub-outer shells 21.

[0038] The connecting structure 30 can be an annular structure, with its outer peripheral wall and the inner peripheral wall of the through hole 111 contacting and limiting each other. The internal space of the annular structure contains heat exchange medium. The connecting structure 30 is plugged into both sub-outer shells 21. Both ends of the connecting structure 30 along the thickness direction of the PCB board 11 can extend into the heat exchange medium flow channels 211 of the two sub-outer shells 21, which helps to reduce the probability of heat exchange medium leakage from the connection between the connecting structure 30 and the corresponding sub-outer shells 21. The connecting structure 30 is sealed to both sub-outer shells 21. A sealing ring can be provided at the connection between the connecting structure 30 and the two sub-outer shells 21, and sealant can also be applied at the connection between the connecting structure 30 and the two sub-outer shells 21, thereby improving the sealing performance between the connecting structure 30 and the two sub-outer shells 21. This prevents the heat exchange medium from flowing out from the gap between the outer peripheral wall of the connecting structure 30 and the through hole 111. The connecting structure 30 can isolate the heat exchange medium flow channel 211 and the through hole 111, which helps to reduce the probability of the heat exchange medium flowing onto the PCB board 11, reduces the probability of short circuit on the PCB board 11, and further improves the reliability of the electronic device 1.

[0039] In some embodiments of the present invention, such as Figure 1 and Figure 2 As shown, along the first direction, a medium inlet 23 and a medium outlet 24 are formed on one side of the outer shell 20. The medium inlet 23 and the medium outlet 24 are respectively formed on two sub-outer shells 21. The medium inlet 23 is connected to the heat exchange medium flow channel 211 of the corresponding sub-outer shell 21, and the medium outlet 24 is connected to the heat exchange medium flow channel 211 of the corresponding sub-outer shell 21. The first direction is perpendicular to the thickness direction.

[0040] Along the first direction, a medium inlet 23 and a medium outlet 24 are formed on one side of the outer casing 20. The medium inlet 23 and the medium outlet 24 are located on the same side of the outer casing 20 along the first direction, which facilitates the arrangement of the external pipeline 2 and simplifies the routing of the external pipeline 2 connected to the medium inlet 23 and the medium outlet 24. As an example, the medium inlet 23 and the medium outlet 24 can be arranged opposite each other along the thickness direction of the PCB board 11, which helps to make the length of the external pipeline 2 between the external liquid supply device and the medium inlet 23 and the medium outlet 24 the same or almost the same. The medium inlet 23 and the medium outlet 24 can be formed in two sub-outer casings 21 respectively. The medium inlet 23 and the medium outlet 24 can be located on the side wall of the corresponding sub-outer casing 21 along the first direction. The medium inlet 23 and the medium outlet 24 can pass through the side wall of the corresponding sub-outer casing 21 along the first direction. The medium inlet 23 is connected to the heat exchange medium flow channel 211 of the corresponding sub-outer casing 21, that is, the heat exchange medium can flow into the corresponding heat exchange medium flow channel 211 through the medium inlet 23. The medium outlet 24 is connected to the heat exchange medium flow channel 211 of the corresponding sub-outer shell 21, that is, the heat exchange medium can flow out of the corresponding heat exchange medium flow channel 211 through the medium inlet 23.

[0041] Furthermore, the connecting structure 30 can be located on the other side of the outer shell 20 away from the medium inlet 23 and the medium outlet 24 along the first direction. The connecting structure 30 can be located on a different side of the outer shell 20 from the medium inlet 23 and the medium outlet 24 along the first direction, thereby further facilitating the flow of the heat exchange medium flowing into the corresponding heat exchange medium channel 211 through the medium inlet 23 along the first direction through the corresponding sub-outer shell 21. It can also further facilitate the flow of the heat exchange medium in another heat exchange medium channel 211 through the corresponding sub-outer shell 21 along the first direction and then out of the corresponding heat exchange medium channel 211 through the medium outlet 24, which is beneficial for increasing the efficiency of heat exchange medium flow. The path length of the two heat exchange medium channels 211 along the first direction is beneficial to increasing the flow path length of the heat exchange medium in the two heat exchange medium channels 211, which is beneficial to further increase the heat exchange area of ​​the heat exchange medium and multiple power devices 12, which is beneficial to further enable the heat exchange medium and multiple power devices 12 to exchange heat together, which is beneficial to further reduce the probability that the electronic device 1 has heat dissipation blind spots, resulting in poor local temperature heat dissipation effect, which is beneficial to further improve the heat dissipation capacity of the electronic device 1, and can also further improve the heat dissipation effect of the electronic device 1, which is beneficial to further improve the reliability of the electronic device 1.

[0042] Two heat exchange medium channels 211 are connected. The heat exchange medium can flow into the heat exchange medium channel 211 through the medium inlet 23. The heat exchange medium flows into the other heat exchange medium channel 211 through the connecting structure 30 from the outlet of the corresponding heat exchange medium channel 211. After heat exchange with the power device 12 in the other heat exchange medium channel 211, the heat exchange medium flows out of the corresponding heat exchange medium channel 211 through the medium outlet 24, thereby realizing the circulation of the heat exchange medium in the outer shell 20. This can further realize the effect of continuously introducing heat exchange medium into the electronic device 1, and further realize the effect of continuously cooling the electronic device 1.

[0043] As an example, when the outer casing 20 is positioned with the thickness direction of the PCB board 11 as its height direction, the two sub-outer casings 21 can be referred to as the first sub-outer casing 26 and the second sub-outer casing 27, respectively. The sub-outer casing 21 located on the upper side is the first sub-outer casing 26, and the sub-outer casing 21 located on the lower side is the second sub-outer casing 27. The medium inlet 23 is formed in the first sub-outer casing 26, and the medium outlet 24 is formed in the second sub-outer casing 27. The heat exchange medium flows into the heat exchange medium flow channel 211 in the first sub-outer casing 26 through the medium inlet 23, and flows into the heat exchange medium flow channel 211 in the second sub-outer casing 27 through the connecting structure 30. The heat exchange medium flows out of the corresponding heat exchange medium flow channel 211 through the medium outlet 24. The heat exchange medium flows into the interior of the outer casing 20 from the upper side and exits from the lower side. During the flow from the heat exchange medium channel 211 of the first sub-outer casing 26 to the heat exchange medium channel 211 of the second sub-outer casing 27, the heat exchange medium can flow downwards under gravity, increasing its flow velocity. Furthermore, the external liquid supply device can drive the flow of the heat exchange medium, which further improves the flow rate within the heat exchange medium channel 211, enhancing the efficiency of the heat exchange medium in carrying away the heat generated by the power device 12, and ultimately improving the heat dissipation efficiency of the electronic device 1.

[0044] In some embodiments of the present invention, such as Figure 1 and Figure 2 As shown, the electronic device 1 may further include: an inlet temperature detector 41 and an outlet temperature detector 42. The inlet temperature detector 41 is disposed on the sub-outer housing 21 with a medium inlet 23 and is used to detect the temperature information of the heat exchange medium at the medium inlet 23. The outlet temperature detector 42 is disposed on the sub-outer housing 21 with a medium outlet 24 and is used to detect the temperature information of the heat exchange medium at the medium outlet 24. Both the inlet temperature detector 41 and the outlet temperature detector 42 are connected to the PCB board 11.

[0045] The inlet temperature sensor 41 and the outlet temperature sensor 42 can be temperature sensors, both used to detect the temperature of the heat exchange medium at the designated location. The inlet temperature sensor 41 can be located on the sub-shell 21 with the medium inlet 23, and can detect the temperature of the heat exchange medium at the medium inlet 23. When the heat exchange medium flows from the medium inlet 23 into the corresponding heat exchange medium channel 211, the inlet temperature sensor 41 can detect the temperature of the heat exchange medium just entering the heat exchange medium channel 211 before heat exchange occurs. The outlet temperature sensor 42 can be located on the sub-shell 21 with the medium outlet 24, and can detect the temperature of the heat exchange medium at the medium outlet 24. When the heat exchange medium flows out of the corresponding heat exchange medium channel 211 from the medium outlet 24, the outlet temperature sensor 42 can detect the temperature of the heat exchange medium after heat exchange has occurred.

[0046] The inlet temperature sensor 41 and the outlet temperature sensor 42 can be respectively disposed on both sides of the PCB board 11 along the thickness direction of the PCB board 11. Both the inlet temperature sensor 41 and the outlet temperature sensor 42 are connected to the PCB board 11. The inlet temperature sensor 41 and the outlet temperature sensor 42 can send the detected temperature information to the PCB board 11. The PCB board 11 is connected to an external device through a connector 112. The external device can process and analyze the temperature information detected by the inlet temperature sensor 41 and the outlet temperature sensor 42, thereby realizing the effect of monitoring the temperature change of the heat exchange medium inside the electronic device 1. This is beneficial for realizing the effect of real-time monitoring of the heat dissipation capacity of the electronic device 1 and further improving the reliability of the electronic device 1.

[0047] In some embodiments of the present invention, such as Figure 3 As shown, along the thickness direction, the orthographic projection of the heat exchange medium flow channel 211 is arranged around the orthographic projection of the corresponding side power device 12.

[0048] The heat exchange medium channel 211 has an orthographic projection along the thickness direction of the PCB board. The power device 12, located on the same side of the PCB board as the heat exchange medium channel 211, also has an orthographic projection along the thickness direction of the PCB board. Along the thickness direction of the PCB board, the orthographic projection of the heat exchange medium channel 211 can be arranged around the orthographic projection of the corresponding power device 12. That is, no heat exchange medium channel 211 is formed within the corresponding sub-shell 21 at the position corresponding to the power device 12 along the thickness direction; the corresponding sub-shell 21 and the corresponding power device 12 at the position corresponding to each other along the thickness direction are solid structures. The solid structure within the corresponding sub-shell 21 and the corresponding power device 12 are arranged correspondingly along the thickness direction of the PCB board. When the power device 12 generates heat during operation, the heat generated by the corresponding power device 12 can be transferred to the corresponding solid structure. When the heat exchange medium flows in the heat exchange medium channel 211, the heat exchange medium flows around the corresponding solid structure. The heat exchange medium can flow along the perimeter of the corresponding solid structure and can contact the outer peripheral wall of the corresponding solid structure for heat exchange. This contact between the heat exchange medium and the outer peripheral wall of the corresponding solid structure is beneficial to increasing the heat exchange area when the heat exchange medium absorbs the heat generated by the power device 12. This is beneficial to further improve the working efficiency of the heat exchange medium in flowing and carrying away the heat generated by the power device 12, and to further improve the heat dissipation efficiency of the electronic device 1.

[0049] In some embodiments of the present invention, such as Figure 3 As shown, the sub-shell 21 may include: a solid heat exchange section 212, which is in heat exchange cooperation with the power device 12 located on the same side of the PCB board 11, and the heat exchange medium flow channel 211 is arranged around the solid heat exchange section 212.

[0050] The solid heat exchange section 212 is connected to the corresponding sub-shell 21 at both ends along the thickness direction of the PCB board 11. The solid heat exchange section 212 and the sub-shell 21 can be constructed as an integral structure. The solid heat exchange section 212 is in heat exchange cooperation with the power device 12 located on the same side of the PCB board 11. The solid heat exchange section 212 and the power device 12 opposite it are in contact for heat exchange. The heat generated by the power device 12 can be conducted to the solid heat exchange section 212. When a fan is working or airflow is blowing outside the electronic device 1, the heat conducted to the solid heat exchange section 212 can be carried away by the airflow. Thus, the electronic device 1 can achieve the effect of cooling and heat dissipation even when there is no heat exchange medium in the heat exchange medium flow channel 211. This enables the electronic device 1 to have the function of air cooling and heat dissipation, which is beneficial to increasing the application scenarios of the electronic device 1. The electronic device 1 can be used in scenarios where there is no heat exchange medium, which is beneficial to improving the versatility and practicality of the electronic device 1.

[0051] Furthermore, the heat exchange medium flow channel 211 is arranged around the solid heat exchange part 212. When the heat exchange medium flows through the heat exchange medium flow channel 211, the heat generated by the power device 12 can be conducted to the solid heat exchange part 212. The heat exchange medium can cooperate with the solid heat exchange part 212 for heat exchange, which helps to shorten the distance between the heat exchange medium and the power device 12. This reduces the probability that the solid heat exchange part 212 inside the sub-shell 21 will affect the heat exchange cooperation effect between the heat exchange medium and the power device 12. The electronic device 1 can still use the heat exchange medium to achieve the cooling effect, which is beneficial to ensure that the electronic device 1 has the function of air cooling without affecting its ability to use the heat exchange medium for cooling. The electronic device 1 can use the heat exchange medium to achieve cooling, the electronic device 1 can have the function of liquid cooling, and the electronic device 1 can also have the function of air cooling.

[0052] When electronic device 1 is operating and requires cooling, if electronic device 1 has a heat exchange medium flowing through it and there are no fans or other mechanisms in the external environment that can generate airflow, electronic device 1 can achieve cooling solely through its liquid cooling function. If electronic device 1 does not have a heat exchange medium flowing through it and there are fans or other mechanisms in the external environment that can generate airflow, electronic device 1 can achieve cooling solely through its air cooling function. If electronic device 1 has a heat exchange medium flowing through it and there are fans or other mechanisms in the external environment that can generate airflow, electronic device 1 can achieve cooling simultaneously through both liquid cooling and air cooling. The cooling effect of electronic device 1 using liquid cooling is the same or roughly the same as that using air cooling, which is beneficial for further expanding the application scenarios of electronic device 1 and further improving its versatility and practicality. Furthermore, when electronic device 1 uses both liquid cooling and air cooling simultaneously, it is beneficial for further improving the heat exchange efficiency of electronic device 1 and further improving its heat dissipation effect.

[0053] In some embodiments of the present invention, such as Figure 3 As shown, the number of solid heat exchange sections 212 formed by the sub-outer shell 21 is the same as the number of power devices 12 located on the same side of the PCB board 11 and corresponds one-to-one. The heat exchange medium flow channel 211 is arranged around each solid heat exchange section 212.

[0054] Along the thickness direction of the PCB board 11, the number of solid heat exchange sections 212 formed in the sub-outer shell 21 is the same as the number of power devices 12 located on the same side of the PCB board 11 and corresponds one-to-one. That is, each power device 12 has a corresponding solid section, and the heat generated by each power device 12 can be conducted to the corresponding solid heat exchange section 212, which is beneficial to enhance the air-cooling function of the electronic device 1. Furthermore, the heat exchange medium flow channel 211 is arranged around each solid heat exchange part 212, and heat exchange medium flows around each solid heat exchange part 212. This is beneficial to further shorten the distance between the heat exchange medium and the power device 12, to increase the contact area between the solid heat exchange part 212 and the heat exchange medium, to make full use of the internal space of the sub-outer shell 21 while forming a solid heat exchange part 212 inside the sub-outer shell 21, to allow as much heat exchange medium as possible to be introduced into the sub-outer shell 21, to enhance the air cooling function of the electronic device 1 while ensuring the ability of the electronic device 1 to cool down using the heat exchange medium, to further improve the heat exchange efficiency of the electronic device 1, to further improve the heat dissipation effect of the electronic device 1, and to further improve the versatility and practicality of the electronic device 1.

[0055] In some embodiments of the present invention, such as Figure 1 and Figure 2 As shown, a heat-conducting structure 50 is provided between the power device 12 and the corresponding sub-shell 21.

[0056] A heat-conducting structure 50 can be provided between the power device 12 and the corresponding sub-shell 21. The heat-conducting structure 50 can be located in the gap between the power device 12 and the corresponding sub-shell 21 along the thickness direction of the PCB board 11, which is beneficial to further realize contact heat dissipation between the power device 12 and the corresponding physical heat exchange part 212. The heat-conducting structure 50 can be thermal grease, graphite pad, or other high thermal conductivity materials. The heat-conducting structure 50 has good thermal conductivity, thereby improving the efficiency of heat conduction from the power device 12 to the corresponding physical heat exchange part 212, which is beneficial to further improve the heat dissipation capacity of the electronic device 1.

[0057] As an example, the thermally conductive structure 50 can also be elastic, which can buffer and protect the power device 12. It can provide some protection when installing and removing the power device 12, which helps to reduce the probability of damage to the power device 12.

[0058] Other configurations and operations of the electronic device 1 according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0059] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0060] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, include: A PCB board (11) and a plurality of power devices (12), wherein the plurality of power devices (12) are located on both sides of the PCB board (11) and mounted on the PCB board (11) along the thickness direction of the PCB board (11); The outer casing (20) includes two sub-outer casings (21), which are arranged along the thickness direction and together define an installation space (22). At least a portion of the PCB board (11) and a plurality of the power devices (12) are assembled in the installation space (22). The sub-outer casings (21) located on the same side of the PCB board (11) and the power devices (12) are heat exchanged together. Each of the two sub-outer casings (21) has a heat exchange medium channel (211) for supplying heat exchange medium.

2. The electronic device according to claim 1, characterized in that, The electronic device (1) further includes a connecting structure (30) connected between the two sub-outer shells (21) to connect the heat exchange medium channels (211) of the two sub-outer shells (21).

3. The electronic device according to claim 2, characterized in that, The PCB board (11) has a through hole (111) that penetrates the PCB board (11) along the thickness direction, and the connecting structure (30) passes through the through hole (111).

4. The electronic device according to claim 2, characterized in that, The connecting structure (30) is plugged into and assembled with the two sub-outer shells (21), and the connecting structure (30) is sealed to the two sub-outer shells (21).

5. The electronic device according to claim 2, characterized in that, Along the first direction, a medium inlet (23) and a medium outlet (24) are formed on one side of the outer shell (20). The medium inlet (23) and the medium outlet (24) are respectively formed in two sub-outer shells (21). The medium inlet (23) is connected to the heat exchange medium channel (211) of the corresponding sub-outer shell (21), and the medium outlet (24) is connected to the heat exchange medium channel (211) of the corresponding sub-outer shell (21). The first direction is perpendicular to the thickness direction.

6. The electronic device according to claim 5, characterized in that, The electronic device (1) further includes an inlet temperature detector (41) and an outlet temperature detector (42). The inlet temperature detector (41) is disposed on the sub-outer housing (21) with the medium inlet (23) and is used to detect the temperature information of the heat exchange medium at the medium inlet (23). The outlet temperature detector (42) is disposed on the sub-outer housing (21) with the medium outlet (24) and is used to detect the temperature information of the heat exchange medium at the medium outlet (24). Both the inlet temperature detector (41) and the outlet temperature detector (42) are connected to the PCB board (11).

7. The electronic device according to claim 1, characterized in that, Along the thickness direction, the orthographic projection of the heat exchange medium channel (211) is arranged around the orthographic projection of the power device (12) on the corresponding side.

8. The electronic device according to any one of claims 1-7, characterized in that, The sub-outer shell (21) includes a solid heat exchange section (212), which is in heat exchange cooperation with the power device (12) located on the same side of the PCB board (11), and the heat exchange medium flow channel (211) is arranged around the solid heat exchange section (212).

9. The electronic device according to claim 8, characterized in that, The number of solid heat exchange sections (212) formed by the sub-outer shell (21) is the same as the number of power devices (12) located on the same side of the PCB board (11) and corresponds one-to-one. The heat exchange medium flow channel (211) is arranged around each solid heat exchange section (212).

10. The electronic device according to any one of claims 1-7, characterized in that, A heat-conducting structure (50) is provided between the power device (12) and the corresponding sub-shell (21).

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