LED light source packaging structure for plant illumination
By setting up a red chip and a blue chip in the packaging structure of the plant lighting LED light source, and using fluorescent glue to emit white light under the excitation of the blue chip, the problems of low production efficiency and low light conversion efficiency in the existing technology are solved, and high efficiency is achieved pink purple light is generated.
Patent Information
- Application Number
- CN202420080028.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-12
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-01-12
AI Technical Summary
The existing Pink-Veronic spectral generation method of LED light sources with LED light sources with low production efficiency and low light conversion efficiency, especially the high proportion of red phosphors leads to energy absorption and low light conversion efficiency of light source.
Using an LED light source packaging structure for plant lighting, the red light chip and blue light chip are set in the heat dissipation bracket, and the fluorescent glue emits white light under the excitation of the blue light chip. The red light chip and the blue light chip are connected in series to produce pink purple light. Solve the problem that different types of light sources require separate packaging and patches.
This improves production efficiency, enhances the light conversion efficiency of the light source, and realizes the synchronous generation of pink purple light for plant lighting in the same package structure.
Smart Images
Figure CN222146226U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor lighting, and in particular relates to an LED light source packaging structure for plant lighting. Background Art
[0002] In recent years, with the continuous decrease in the agricultural working population and the continuous decline in per capita arable land area, the number of plant factories has increased rapidly. Therefore, LED plant lighting sources have come into being. LED plant lighting sources can use their spectral characteristics to meet the needs of plants at various growth stages, thereby improving the yield rate and growth efficiency of plants.
[0003] The existing LED light sources for plant lighting mostly have a pink-purple spectrum in demand, and there are currently two ways for lamps to use the pink-purple spectrum: Method 1: Monochromatic red light is used in conjunction with LED white light to produce a pink-purple spectrum. The two different types of light sources need to be packaged and mounted separately, and the production efficiency is low; Method 2: Blue light chips are used in conjunction with red phosphors to produce a pink-purple spectrum. In this packaging method, the proportion of red phosphors is high, most of the energy is absorbed by the phosphors, and the light source light conversion efficiency is low.
[0004] Based on the above problems, the utility model proposes an LED light source packaging structure for plant lighting. Utility Model Content
[0005] The purpose of the utility model is to provide an LED light source packaging structure for plant lighting, which emits white light under the excitation of a blue light chip through fluorescent glue, and the red light chip and the blue light chip are connected in series to synchronously generate pink-purple light for plant lighting; it solves the problem in the prior art that the red phosphor accounts for a high proportion, most of the energy is absorbed by the phosphor, and the light source has low light conversion efficiency.
[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:
[0007] An LED light source packaging structure for plant lighting, including a heat dissipation bracket, a positive and negative isolation belt, a red light chip, a blue light chip, and fluorescent glue;
[0008] A positive and negative electrode isolation belt is embedded in the bottom of the heat dissipation bracket, and the positive and negative electrode isolation belt divides the heat dissipation bracket into a positive electrode functional area and a negative electrode functional area;
[0009] The red light chip is arranged in the positive electrode functional area in the heat dissipation bracket;
[0010] The blue light chip is arranged in the negative electrode functional area in the heat dissipation bracket;
[0011] The red light chip and the blue light chip are arranged in series via bonding wires;
[0012] The fluorescent glue is used to fill the heat dissipation bracket to package the red light chip and the blue light chip into one.
[0013] Furthermore, the red light chip is a single-electrode chip structure with a wavelength of 640-660nm, and the polarity of the electrode above the red light chip is negative.
[0014] Furthermore, the red light chip is connected to the positive electrode functional area of the heat dissipation bracket through silver glue.
[0015] Furthermore, the blue light chip is a dual-electrode chip structure with a wavelength of 440-460nm, and two positive and negative electrodes are arranged above the blue light chip; the blue light chip excites the fluorescent glue to emit white light.
[0016] Furthermore, the blue light chip is connected to the negative electrode functional area of the heat dissipation bracket through a bonding adhesive.
[0017] Furthermore, a positive electrode pin is arranged at the bottom of the positive electrode functional area of the heat dissipation bracket, and a negative electrode pin is arranged at the bottom of the negative electrode functional area thereof, and the positive electrode pin and the negative electrode pin are used to energize to form a control circuit.
[0018] Furthermore, the heat dissipation bracket is configured as a bowl-cup shaped structure, and its wall surface is curved.
[0019] Furthermore, the fluorescent glue is poured into the heat dissipation bracket by dispensing, and the upper surface of the fluorescent glue 11 is not higher than the upper surface of the heat dissipation bracket 3 .
[0020] The utility model adopts the above technical solution, which has the following advantages:
[0021] Compared with the prior art, the utility model discloses a LED light source packaging structure for plant lighting. In the present invention, a red light chip, a blue light chip and fluorescent glue are arranged in the same packaging heat dissipation bracket, wherein the red light chip emits red light by itself, and the fluorescent glue emits white light under the excitation of the blue light chip. The red light chip and the blue light chip are connected in series to synchronously generate pink-purple light for plant lighting. The packaging structure solves the problem in the prior art that two different types of light sources need to be packaged and mounted separately, resulting in low production efficiency. At the same time, it also solves the problem in the prior art that the proportion of red fluorescent powder is high, most of the energy is absorbed by the fluorescent powder, and the light source light conversion efficiency is low. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 It is a schematic diagram of the overall structure of the LED light source packaging structure for plant lighting of the present utility model.
[0023] Figure 2 It is a front view of the LED light source packaging structure for plant lighting of the utility model.
[0024] The figure numbers are as follows: 1-positive electrode pin, 2-negative electrode pin, 3-heat dissipation bracket, 4-positive and negative electrode isolation belt, 5-silver glue, 6-solid crystal glue, 7-notch, 8-red light chip, 9-blue light chip, 10-bonding wire, 11-fluorescent glue. DETAILED DESCRIPTION
[0025] The following will be combined with the accompanying drawings to describe the preferred embodiments of the present invention in detail, so as to more clearly understand the purpose, characteristics and advantages of the present invention. It should be understood that the embodiments shown in the accompanying drawings are not intended to limit the scope of the present invention, but are only intended to illustrate the essential spirit of the technical solution of the present invention.
[0026] like Figure 1-Figure 2 The utility model is a LED light source packaging structure for plant lighting, comprising a heat dissipation bracket 3, a positive and negative isolation belt 4, a red light chip 8, a blue light chip 9, and a fluorescent glue 11; a positive and negative isolation belt 4 is embedded in the bottom of the heat dissipation bracket 3, and the positive and negative isolation belt 4 divides the heat dissipation bracket 3 into a positive electrode functional area and a negative electrode functional area; the red light chip 8 is arranged in the positive electrode functional area of the heat dissipation bracket 3; the blue light chip 9 is arranged in the negative electrode functional area of the heat dissipation bracket 3; the red light chip 8 and the blue light chip 9 are arranged in series through a bonding wire 10; the fluorescent glue 11 is used to fill the heat dissipation bracket 3, and is used to package the red light chip 8 and the blue light chip 9 arranged in the heat dissipation bracket 3 into one.
[0027] The fluorescent glue 11 emits 2000K-6000K white light under the excitation of the blue light chip 9, and the red light chip 8 emits red light by itself. The red light chip 8 and the blue light chip 9 are connected in series to synchronously generate pink-purple light for plant lighting.
[0028] As a preferred embodiment, the fluorescent glue 11 is a mixed liquid of red, green and yellow phosphors and silica gel, with a mixing ratio of 0.05-0.1:0.5-2.0:0.1-1.5:2.0-3.0, wherein the red phosphor is nitride, and the yellow and green phosphors are LuAG, which are encapsulated into the heat dissipation bracket 3 by dispensing, and are flush with or slightly concave on the upper surface of the heat dissipation bracket 3, and generate 2000K-6000K white light under the excitation of the blue light chip 9, and at the same time, the red light chip 8 is connected in series, and the two emit light synchronously to form an LED light source for plant lighting;
[0029] As a preferred embodiment, the bonding wire 10 is selected to have a diameter of 0.8-1.0 mil and is made of an alloy wire composed of gold, silver and palladium, wherein the palladium content is ≤10% and the rest are gold and silver elements, and has good electrical conductivity and low thermal resistivity.
[0030] Specifically, a positive pin 1 is provided at the bottom of the positive functional area of the heat dissipation bracket 3, and a negative pin 2 is provided at the bottom of the negative functional area thereof, and the positive pin 1 and the negative pin 2 are used to energize to form a control circuit. A notch 7 is also provided on the heat dissipation bracket 3, and the notch 7 is used to distinguish between positive and negative poles.
[0031] As a preferred embodiment, the heat dissipation bracket 3 is configured as a bowl-shaped structure, and its wall surface is configured as an irregular curved surface, which indirectly increases the contact area between the fluorescent glue layer 11 and the heat dissipation bracket 3, increases the penetration path of external gas, and improves the air tightness of the product; the heat dissipation bracket 3 is made of PPA or PCT material as a whole, and a 40-80u thick silver plating layer is used on the bottom to increase thermal conductivity and light source brightness; the bottom is divided into positive and negative functional areas by a positive and negative isolation belt 4 to form a positive pin 1 and a negative pin 2, which control the red light chip 8 and the blue light chip 9 to form a control circuit when powered on.
[0032] Specifically, the red light chip 8 uses a single-electrode chip structure with a wavelength of 640-660 nm, and the polarity of the electrode above the red light chip 8 is negative.
[0033] Specifically, the red light chip 8 is connected to the positive functional area of the heat dissipation bracket 3 through the silver glue 5. The silver glue 5 is a mixed silver glue containing 70%-95% silver in an epoxy resin base material, which has electrical and thermal conductivity. The higher the silver content, the stronger the thermal conductivity, and the thermal conductivity is 2-25W / (m·K);
[0034] As a preferred embodiment, the red light chip 8 can also be fixed to the positive electrode functional area of the heat dissipation bracket 3 by solder paste.
[0035] Specifically, the blue light chip 9 adopts a dual-electrode chip structure with a wavelength of 440-460nm, and two positive and negative electrodes are arranged above the blue light chip 9.
[0036] Specifically, the blue light chip 9 is connected to the negative electrode functional area of the heat dissipation bracket 3 through the bonding adhesive 6. The bonding adhesive 6 is composed of organic silicon, which is non-conductive and has a thermal conductivity of 0.2-1.0 W / (m·K).
[0037] The utility model arranges a red light chip, a blue light chip and fluorescent glue in the same package heat dissipation bracket, wherein the red light chip emits red light by itself, and the fluorescent glue emits white light under the excitation of the blue light chip, and the red light chip and the blue light chip are connected in series to synchronously generate pink-purple light for plant lighting; the packaging structure solves the problem in the prior art that two different types of light sources need to be packaged and mounted separately, resulting in low production efficiency; it also solves the problem in the prior art that the proportion of red fluorescent powder is high, most of the energy is absorbed by the fluorescent powder, and the light source light conversion efficiency is low.
Claims
1. A LED light source packaging structure for plant lighting, characterized in that: It comprises a heat dissipation bracket (3), a positive and negative electrode isolation belt (4), a red light chip (8), a blue light chip (9), and a fluorescent glue (11); A positive and negative electrode isolation belt (4) is embedded at the bottom of the heat dissipation support (3), and the positive and negative electrode isolation belt (4) divides the heat dissipation support (3) into a positive electrode functional area and a negative electrode functional area; The red light chip (8) is arranged in the positive electrode functional area; The blue light chip (9) is arranged in the negative electrode functional area; The red light chip (8) and the blue light chip (9) are connected in series via a bonding wire (10); The fluorescent glue (11) is filled in the heat dissipation bracket (3) and is used to package the red light chip (8) and the blue light chip (9) into one.
2. The LED light source packaging structure for plant lighting according to claim 1, characterized in that: The red light chip (8) is a single-electrode chip structure with a wavelength of 640-660 nm, and the polarity of the electrode above the red light chip (8) is negative.
3. The LED light source packaging structure for plant lighting according to claim 1 or 2, characterized in that: The red light chip (8) is connected to the positive electrode functional area via silver glue (5).
4. The LED light source packaging structure for plant lighting according to claim 3, characterized in that: The blue light chip (9) is a dual-electrode chip structure with a wavelength of 440-460 nm, and two positive and negative electrodes are arranged above the blue light chip (9); the blue light chip (9) is used to excite the fluorescent glue (11) to emit white light.
5. The LED light source packaging structure for plant lighting according to claim 4, characterized in that: The blue light chip (9) is connected to the negative electrode functional area via a crystal bonding adhesive (6).
6. The LED light source packaging structure for plant lighting according to claim 5, characterized in that: A positive electrode pin (1) is arranged at the bottom of the positive electrode functional area, and a negative electrode pin (2) is arranged at the bottom of the negative electrode functional area. The positive electrode pin (1) and the negative electrode pin (2) are used to energize to form a control circuit.
7. The LED light source packaging structure for plant lighting according to claim 6, characterized in that: The heat dissipation support (3) is configured as a bowl-cup shaped structure, and its wall surface is curved.
8. The LED light source packaging structure for plant lighting according to claim 7, characterized in that: The fluorescent glue (11) is encapsulated inside the heat dissipation bracket (3), and the upper surface of the fluorescent glue (11) is not higher than the upper surface of the heat dissipation bracket (3).