Resonant wafer assembly
By using conductive connection sheets in the assembly of the crystal resonator to set the conductive holes at the diagonal position of the quartz wafer, the problem of difficulty in matching the rectangular quartz wafer with the square base pin is solved, and the frequency and temperature characteristic curve is achieved to meet the conventional requirements and usage scenario expansion.
Patent Information
- Application Number
- CN202420124571.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-17
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-01-17
AI Technical Summary
During the production process of crystal resonators, it is difficult to match the pins on the conventional square base on the two conductive electrodes of the rectangular quartz wafer on the same side, resulting in the frequency temperature characteristic curve not meeting the wide temperature requirements of conventional crystal resonators, limiting Limitations of usage scenarios and adaptation equipment.
Design a resonant chip assembly, using positive metal conductors and negative metal conductors to contact the conductive electrodes of the quartz wafer, and through the conductive connecting sheet, the conductive holes are set at the diagonal position of the quartz wafer to match the metal guide on the lower surface of the base to avoid short circuits and improve matching.
It realizes effective matching of quartz wafers with conductive electrodes on the same side, meets the frequency and temperature characteristics requirements of conventional crystal resonators, expands the scope of use scenarios and adaptive equipment, and avoids the risk of short circuit.
Smart Images
Figure CN222147582U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of resonant chip devices, and more specifically, to a resonant chip assembly. Background Art
[0002] In the production process of the crystal resonator, it is necessary to design the device allocation on the assembly of the crystal resonator accordingly according to the assembled quartz wafer. There is a kind of quartz wafer which is rectangular and has two conductive electrodes arranged on the same side of the rectangle. The pins of the conventional assembly of the crystal resonator are usually arranged at the diagonal corners of the square base of the crystal resonator, which cannot be well matched with the quartz wafer with two conductive electrodes arranged on the same side. It is often necessary to specially design the assembly of the crystal resonator for this kind of quartz wafer.
[0003] In the production process of crystal resonators, different types of crystal resonators are matched together. For example, for a rectangular quartz wafer, its two conductive electrodes are set at the diagonals of the rectangle. Correspondingly, a conductive structure is set at the diagonals of the upper surface of the square base of the crystal resonator to lead the line to the corresponding diagonals of the lower surface of the square base for easy connection.
[0004] However, in actual production testing, it was found that the temperature characteristic curve of the crystal resonator equipped with the quartz wafer with the above conductive electrodes arranged at the diagonal angles is as follows: Figure 4 As shown, it does not meet the wide temperature requirement of conventional crystal resonators. The wide temperature requirement of conventional crystal resonators is that the frequency range is -20 to 20ppm within the temperature range of -40 to 85 degrees, and the narrow temperature requirement is that the frequency range is -10 to 10ppm within the temperature range of -20 to 70 degrees. The above-mentioned crystal resonator is obviously unqualified, resulting in certain limitations in its usage scenarios and compatible equipment. However, in actual use, the above-mentioned type of crystal resonator is still needed to meet the installation and connection requirements of electronic devices. Utility Model Content
[0005] The utility model aims to overcome at least one defect of the above-mentioned prior art and provide a crystal resonant assembly, which uses a quartz wafer with two conductive electrodes arranged on the same side to replace the quartz wafer with two conductive electrodes arranged diagonally to meet actual application scenarios.
[0006] The technical solution adopted by the utility model is:
[0007] The utility model provides a resonant chip assembly, which is used to assemble a rectangular quartz chip, wherein two conductive electrodes of the quartz chip are arranged on the same side of the quartz chip, and the assembly comprises a base, wherein a positive metal conductive sheet and a negative metal conductive sheet are arranged on the upper surface of the base, and the positive metal conductive sheet and the negative metal conductive sheet are respectively contacted and connected with the two conductive electrodes of the quartz chip;
[0008] The lower surface of the base is provided with a first metal pin and a second metal pin;
[0009] The base is provided with a first conductive hole and a second conductive hole penetrating the base, the first conductive hole and the second conductive hole are arranged diagonally relative to the quartz wafer, and the first conductive hole is arranged at the position where the positive metal guide piece / negative metal guide piece of the base is located;
[0010] A conductive connecting sheet is also provided on the upper surface of the base, one end of the conductive connecting sheet is connected to the negative metal conductor / positive metal conductor, and the other end of the conductive connecting sheet is in contact with the second conductive hole;
[0011] One end of the first conductive via contacts the positive metal conductor / negative metal conductor, and the other end contacts the first metal pin; one end of the second conductive via contacts the conductive connecting sheet, and the other end contacts the second metal pin.
[0012] By adding the conductive connecting piece, the positive metal conductive piece and the negative metal conductive piece can be set to match the two conductive electrodes of the quartz wafer, and the negative metal conductive piece / positive metal conductive piece can be connected to the second conductive hole through the conductive connecting piece, so that the first conductive hole and the second conductive hole can be correspondingly set at the diagonal positions of the quartz wafer, matching the positions of the first metal pin and the second metal pin set on the lower surface of the base; the quartz wafer with two conductive electrodes set on the same side is used to replace the quartz wafer with the conductive electrodes set diagonally, and correspondingly certain circuit improvements can well match the use scenarios originally suitable for the quartz wafer with the conductive electrodes set diagonally.
[0013] Furthermore, the thickness of the positive metal conductor and the negative metal conductor are the same, and the thickness of the positive metal conductor / negative metal conductor is greater than the thickness of the conductive connecting sheet.
[0014] The thickness of the positive metal conductor / negative metal conductor is greater than the thickness of the conductive connecting piece, so that the quartz wafer can avoid contact with the conductive connecting piece and cause a short circuit when being set.
[0015] Furthermore, the inner walls of the first conductive hole and the second conductive hole are both plated with conductive metal material.
[0016] Furthermore, the first conductive hole and the second conductive hole are filled with a sealing medium.
[0017] Furthermore, the sealing medium is a non-conductive insulating material.
[0018] Furthermore, the plane shape of the base is a rectangle, the quartz wafer is arranged at the center of the base, and each side of the quartz wafer is parallel to each side of the base.
[0019] The quartz wafer is arranged at the center of the base, which facilitates the distribution and arrangement of various accessories.
[0020] Furthermore, the assembly also includes a sealing cover, in which a groove is arranged, and the shape of the groove matches the shape of the quartz wafer. The sealing cover is used to seal the quartz wafer on the base.
[0021] Compared with the prior art, the beneficial effects of the utility model are:
[0022] 1. The utility model adds the conductive connecting piece so that the positive metal conductive piece and the negative metal conductive piece can be matched with the two conductive electrodes of the quartz wafer for setting, and the negative metal conductive piece / positive metal conductive piece can be connected with the second conductive hole through the conductive connecting piece, so that the first conductive hole and the second conductive hole can be correspondingly set at the diagonal positions of the quartz wafer, matching the positions of the first metal pin and the second metal pin set on the lower surface of the base, so that the assembly of the utility model can well match the quartz wafer with the two conductive electrodes set on the same side; the quartz wafer with the two conductive electrodes set on the same side is replaced by the quartz wafer with the conductive electrodes set diagonally, and correspondingly certain circuit improvements can well match the use scenarios originally suitable for the quartz wafer with the conductive electrodes set diagonally.
[0023] 2. The utility model can effectively prevent the quartz wafer from contacting the conductive connecting piece during installation and causing a short circuit by setting the positive metal conductor and the negative metal conductor to be thicker than the conductive connecting piece, thereby protecting the quartz wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 It is the overall structure diagram of the utility model.
[0025] Figure 2 It is a top view of the base of the utility model.
[0026] Figure 3 It is a bottom view of the base of the utility model.
[0027] Figure 4The temperature characteristic curve of a crystal resonator based on a rectangular quartz crystal wafer with two conductive electrodes arranged at opposite corners.
[0028] Figure 5 is the temperature characteristic curve of the crystal resonator of this embodiment.
[0029] The accompanying drawings are labeled: base 1, quartz wafer 2, sealing cover 3, positive metal guide 11, negative metal guide 12, conductive connecting piece 13, first conductive hole 14, second conductive hole 15, first metal pin 16, second metal pin 17. DETAILED DESCRIPTION
[0030] The drawings of the present invention are only used for illustrative purposes and cannot be construed as limiting the present invention. In order to better illustrate the following embodiments, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted.
[0031] Example 1
[0032] Conventionally, the pins on the assembly of the crystal resonator are usually arranged on both sides of the lower surface of the square base 1 of the assembly, or at the diagonal of the lower surface, the purpose of which is to facilitate the access of the circuit; correspondingly, such an arrangement can well match the model in which the two conductive electrodes of the square quartz wafer 2 are arranged at the diagonal. However, in actual production testing, the temperature characteristic curve of the frequency of the crystal resonator formed by the quartz wafer 2 with two conductive electrodes arranged at the diagonal does not meet the requirements of conventional crystal resonators. The wide temperature requirement of conventional crystal resonators is that the frequency range within the temperature range of -40 to 85 degrees is -20 to 20ppm, and the narrow temperature requirement is that the frequency range within the temperature range of -20 to 70 degrees is -10 to 10ppm, while the temperature characteristic curve of the frequency of the crystal resonator formed by the quartz wafer 2 with conductive electrodes arranged at the diagonal is as follows: Figure 4 As shown, it can be seen that within the corresponding temperature range, its frequency does not meet the requirements, so this type of crystal resonator cannot meet the use scenario requirements of the conventional crystal resonator, so it is necessary to use another type of quartz wafer 2 to replace the two conductive electrodes set at the diagonal quartz wafer 2. The two conductive electrodes of this type of quartz wafer 2 are set on the same side of the quartz wafer 2. Correspondingly, other accessories on the crystal resonator also need some corresponding settings;
[0033] Specifically, Figure 1 As shown, in order to match the quartz wafer 2 with two conductive electrodes arranged on the same side, this embodiment provides a crystal resonant assembly, the assembly includes a base 1. In this embodiment, the plane shape of the base 1 can be set to a rectangle;
[0034] Specifically, in this embodiment, if Figure 2 As shown, a positive metal conductor 11 and a negative metal conductor 12 are provided on the upper surface of the base 1, and the positive metal conductor 11 and the negative metal conductor 12 are respectively in contact and connected with the two conductive electrodes of the quartz wafer 2; wherein, the shapes of the positive metal conductor 11 and the negative metal conductor 12 can be set to be circular or square, and no further limitation is made here; the conductive electrodes of the quartz wafer 2 can be bonded to the positive metal conductor 11 and the negative metal conductor 12 by silver glue, and the bonding by silver glue makes the quartz wafer 2 have a certain flexibility at the connection with the positive metal conductor 11 and the negative metal conductor 12, and prevents the conductive electrodes of the quartz wafer 2 from being damaged due to vibration while ensuring conductivity.
[0035] During setting, the quartz chip 2 can be set at the center of the base 1, and the planar shapes of the quartz chip 2 and the base 1 are both rectangular. By setting each edge of the quartz chip 2 and each edge of the base 1 to be parallel, the distribution of various accessories on the assembly can be regularized and organized, which is convenient for production and processing.
[0036] like Figure 3 As shown, four metal pins are arranged on the lower surface of the base 1, respectively arranged at the four corners of the lower surface of the base 1, including a first metal pin 16 and a second metal pin 17; the arrangement position of the first metal pin 16 corresponds to the position of the positive metal guide piece 11 / negative metal guide piece 12, and the second metal pin 17 is arranged at a diagonal position relative to the first metal pin 16. It corresponds to the pin arrangement of a conventional crystal resonator.
[0037] Further, the base 1 is provided with a first conductive hole 14 and a second conductive hole 15 penetrating the base 1, wherein the first conductive hole 14 is provided at the location of the positive metal guide piece 11 / the negative metal guide piece 12 of the base 1, and the second conductive hole 15 is provided diagonally with respect to the first conductive hole 14 relative to the quartz wafer 2, that is, the first conductive hole 14 corresponds to the first metal pin 16, and the second conductive hole 15 corresponds to the second metal pin 17;
[0038] A conductive connecting sheet 13 is also provided on the upper surface of the base 1, one end of the conductive connecting sheet 13 is connected to the negative metal conductor 12 / positive metal conductor 11, and the other end is in contact with the second conductive hole 15;
[0039] Specifically, one end of the first conductive hole 14 contacts the positive metal conductor 11 / negative metal conductor 12, and the other end contacts the first metal pin 16; one end of the second conductive hole 15 contacts the conductive connecting piece 13, and the other end contacts the second metal pin 17.
[0040] By adding the conductive connecting piece 13, the positive metal conductive piece 11 and the negative metal conductive piece 12 can be set to match the two conductive electrodes of the quartz wafer 2, and the negative metal conductive piece 12 / positive metal conductive piece 11 can be connected to the second conductive hole 15 through the conductive connecting piece 13, so that the first conductive hole 14 and the second conductive hole 15 can be correspondingly set at the diagonal positions of the quartz wafer 2, matching the positions of the first metal pin 16 and the second metal pin 17 set on the lower surface of the base 1.
[0041] In addition, the thickness of the positive metal conductor 11 and the negative metal conductor 12 are the same, the thickness of the positive metal conductor 11 / negative metal conductor 12 is greater than the thickness of the conductive connecting piece 13, and the thickness of the conductive connecting piece 13 is less than the thickness of the positive metal conductor 11 / negative metal conductor 12, so that when the quartz chip 2 is in contact and connected with the positive metal conductor 11 and the negative metal conductor 12, due to the thickness difference between the conductive connecting piece 13 and the positive metal conductor 11 / negative metal conductor 12, the quartz chip 2 will not contact the conductive connecting piece 13, thereby avoiding the quartz chip 2 contacting the conductive connecting piece 13 to cause a short circuit, thereby improving the safety of the assembly.
[0042] In the setting of the first conductive hole 14 and the second conductive hole 15, the inner walls of the first conductive hole 14 and the second conductive hole 15 are plated with conductive metal materials, and the first conductive hole 14 and the second conductive hole 15 are filled with a sealing medium, which is a non-conductive insulating material; the positive metal conductor 11 / negative metal conductor 12 can be connected to the first metal pin 16 through the conductive metal material on the inner wall of the first conductive hole 14 in contact with it, and the conductive connecting piece 13 can be connected to the second metal pin 17 through the conductive metal material on the inner wall of the second conductive hole 15 in contact with it.
[0043] In addition, the assembly also includes a sealing cover 3, in which a groove is provided. The shape of the groove matches the shape of the quartz wafer 2. The quartz wafer 2 is sealed on the base 1 through the sealing cover 3. The groove of the sealing cover 3 can well accommodate the quartz wafer 2 and protect the quartz wafer 2.
[0044] The temperature characteristic curve of the frequency of the crystal resonator in this embodiment is as follows: Figure 5As shown, it can be seen that within the wide temperature range of -40 to 85 degrees, its frequency does not exceed the frequency range of -20 to 20ppm, and within the narrow temperature range of -20 to 70 degrees, its frequency does not exceed the frequency range of -10 to 10ppm, so the crystal resonator of this embodiment meets the application standards of conventional crystal resonators.
[0045] Obviously, the above embodiments of the utility model are only examples for clearly explaining the technical solution of the utility model, and are not intended to limit the specific implementation methods of the utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the claims of the utility model shall be included in the protection scope of the claims of the utility model.
Claims
1. A resonant chip assembly for assembling a rectangular quartz chip, wherein two conductive electrodes of the quartz chip are arranged on the same side of the quartz chip, and the assembly comprises a base, characterized in that: A positive metal conductor and a negative metal conductor are disposed on the upper surface of the base, and the positive metal conductor and the negative metal conductor are respectively in contact and connected with the two conductive electrodes of the quartz wafer; The lower surface of the base is provided with a first metal pin and a second metal pin; The base is provided with a first conductive hole and a second conductive hole penetrating the base, the first conductive hole and the second conductive hole are arranged diagonally relative to the quartz wafer, and the first conductive hole is arranged at the position where the positive metal guide piece / negative metal guide piece of the base is located; A conductive connecting sheet is also provided on the upper surface of the base, one end of the conductive connecting sheet is connected to the negative metal conductor / positive metal conductor, and the other end of the conductive connecting sheet is in contact with the second conductive hole; One end of the first conductive via contacts the positive metal conductor / negative metal conductor, and the other end contacts the first metal pin; one end of the second conductive via contacts the conductive connecting sheet, and the other end contacts the second metal pin.
2. A resonant chip assembly according to claim 1, characterized in that: The thickness of the positive metal conductor and the negative metal conductor are the same, and the thickness of the positive metal conductor / negative metal conductor is greater than the thickness of the conductive connecting sheet.
3. A resonant chip assembly according to claim 1, characterized in that: The inner walls of the first conductive hole and the second conductive hole are both plated with conductive metal material.
4. A resonant chip assembly according to claim 1, characterized in that: The first conductive hole and the second conductive hole are filled with sealing medium.
5. A resonant chip assembly according to claim 4, characterized in that: The sealing medium is a non-conductive insulating material.
6. A resonant chip assembly according to any one of claims 1 to 5, characterized in that: The plane shape of the base is a rectangle, the quartz wafer is arranged at the center of the base, and each side of the quartz wafer is parallel to each side of the base.
7. A resonant chip assembly according to claim 6, characterized in that: The assembly also includes a sealing cover, in which a groove is arranged, and the shape of the groove matches the shape of the quartz wafer. The sealing cover is used to seal the quartz wafer on the base.