Circuit board, motor base and motor

Abstract

The utility model discloses a circuit board, a motor base and a motor, and the circuit board comprises a substrate, a plurality of electric connection parts, a conductive circuit, and a blocking layer. The electric connection part is arranged on the surface of the substrate, and the electric connection part is used for being electrically connected with an external electronic component; the conductive circuit is arranged on the surface of the substrate and is electrically connected with the electric connection part; the barrier layer covers the surface of the substrate, and the barrier layer covers the conductive circuits and separates each electric connection part into an independent unit. The circuit board, the motor base and the motor are used for preventing conductive fluid from diffusing between adjacent electric connection parts, between adjacent conductive circuits or between the electric connection parts and the conductive circuits so as to reduce the risk of short circuit.

Description

Technical Field

[0001] The utility model relates to the technical field of motors, and in particular to a circuit board, a motor base and a motor. Background Art

[0002] Existing electronic devices such as mobile phones and tablets usually install camera modules to realize the camera function. The motor is one of the main components in the camera module. The motor is used to enable the camera module to realize the focus or anti-shake function. The motor base is a main component in the motor. The motor base usually includes a base, electronic components and a circuit board. The circuit board is connected to the electronic components and is provided with conductive circuits, pads, connecting pieces and other structures. The pads and connecting pieces are electrically connected to the electronic components through solder paste or conductive gel. When the solder paste or conductive gel is applied to the solder pad or connecting piece, it is in a fluid state and will diffuse to the surroundings. When the gap between any two of the solder pads, connecting pieces and conductive lines is small, the solder paste or conductive gel may contact the adjacent solder pads, connecting pieces or conductive lines, thereby causing a short circuit.

[0003] The existing Chinese invention patent with patent number CN116707227A discloses a motor base, a voice coil motor and a manufacturing method thereof, wherein a plurality of spaced pads are formed on the surface of a ceramic substrate in the motor base for welding with a high-density integrated circuit, and a plurality of spaced conductive sheets are formed around the surface of the ceramic substrate for welding with terminals. When the number of pads and conductive sheets is large, the adjacent gaps gradually become smaller; and when solder paste is applied to the pads or conductive sheets, since the solder paste is usually in liquid form and has a certain fluidity, it is easy to cause a short circuit risk between adjacent pads or conductive sheets, and when the distance between the circuit and the pad or conductive sheet is close, the solder paste is also easy to flow to the circuit and cause a short circuit. Utility Model Content

[0004] The utility model aims to provide a circuit board, a motor base and a motor, which are used to prevent the diffusion of conductive fluid between adjacent electrical connection parts, adjacent conductive circuits or between electrical connection parts and conductive circuits, so as to reduce the risk of short circuit.

[0005] The purpose of the utility model is achieved by the following technical solutions:

[0006] A circuit board, comprising:

[0007] substrate;

[0008] A plurality of electrical connection parts are arranged on the surface of the substrate, and the electrical connection parts are used to electrically connect with external electronic components;

[0009] A conductive circuit is disposed on the surface of the substrate and electrically connected to the electrical connection portion;

[0010] A barrier layer is covered on the surface of the substrate, and the barrier layer covers the conductive circuit and separates each of the electrical connecting parts to form an independent unit.

[0011] Preferably, the barrier layer is provided with a receiving groove penetrating along the thickness direction of the barrier layer, the receiving groove is used to accommodate the electrical connection part, and the wall forming the receiving groove separates the electrical connection part to form an independent unit, the radial cross-sectional dimension of the receiving groove is larger than the corresponding radial cross-sectional dimension of the electrical connection part, and the receiving groove is a groove closed on all sides or a groove with an opening on one side.

[0012] Preferably, the thickness of the barrier layer is less than or equal to the thickness of the corresponding electrical connection portion.

[0013] Preferably, the substrate includes a first surface and a second surface relative to each other, the electrical connection portion is arranged on the first surface, the conductive circuit is distributed on the first surface and the second surface, the barrier layer covers the first surface and the second surface, and at the same time directly covers the conductive circuit distributed on the first surface and the second surface.

[0014] Preferably, the electrical connection portion is a conductive sheet or a welding pad, a number of the conductive sheets are distributed at the edge of the substrate and are used to be fixedly connected to the connection terminal through a conductive fluid, a number of the welding pads are distributed in the middle of the substrate and are used to be fixedly connected to the electronic component through a conductive fluid, and the barrier layer is used to prevent the conductive fluid from diffusing in the electrical connection portion;

[0015] And / or, the barrier layer is an ink layer.

[0016] Preferably, the circuit board is a ceramic substrate, and the electrical connection portion and the conductive circuit are plated on the surface of the ceramic substrate.

[0017] A motor base, comprising:

[0018] A circuit board of any of the above;

[0019] Electronic components;

[0020] The insulating base is provided with a containing cavity, and the circuit board and at least part of the electronic components are arranged in the containing cavity.

[0021] Preferably, the barrier layer is provided with a receiving groove for receiving the electrical connection portion, and the radial cross-sectional dimension of the receiving groove is larger than the radial cross-sectional dimension of the corresponding electrical connection portion;

[0022] The motor base also includes a conductive fluid, which is disposed in the accommodating groove. The electronic components and the electrical connecting portion are electrically connected via the conductive fluid; after the conductive fluid is cured, the electronic components and the electrical connecting portion are fixed.

[0023] Preferably, the electronic component comprises an electronic element and a connecting terminal, the connecting terminal is embedded in the insulating base; the electrical connection portion is a conductive sheet or a welding pad; the electronic element is electrically connected to the welding pad, and the connecting terminal is electrically connected to the conductive sheet.

[0024] Preferably, the accommodating cavity comprises a first cavity and a second cavity, the radial cross-sectional dimension of the first cavity is smaller than that of the second cavity, the first cavity is used to accommodate the circuit board, and the second cavity is used to accommodate the electronic component.

[0025] Preferably, the connection end surface of the connection terminal is exposed to the first cavity, and at least a portion of the connection end surface is located at the same height as at least a portion of the conductive sheet, and the conductive fluid fills the radial distance between the connection end surface and the conductive sheet, so that the connection terminal is horizontally connected to the conductive sheet;

[0026] And / or, the electronic component covers the welding pad along the height direction of the motor base, and is connected to the welding pad up and down through the conductive fluid.

[0027] Preferably, the conductive fluid is solder paste or conductive gel.

[0028] A motor comprises any one of the above motor bases.

[0029] Compared with the prior art, the beneficial effects of the present invention include at least:

[0030] By providing a barrier layer to separate each electrical connection part into an independent unit, the conductive fluid coated on the electrical connection part will be blocked by the barrier layer when diffusing toward another electrical connection part or conductive line, thereby effectively preventing the conductive fluid from short-circuiting due to contact with another electrical connection part or conductive line. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a structural schematic diagram of a motor base of an embodiment of the utility model;

[0032] Figure 2 is an exploded schematic diagram of a motor base according to an embodiment of the utility model;

[0033] Figure 3 It is a schematic diagram of the structure of a circuit board in an embodiment of the utility model;

[0034] Figure 4 It is an exploded schematic diagram of a circuit board of an embodiment of the utility model;

[0035] Figure 5 It is a structural schematic diagram of the circuit board in another viewing angle of the embodiment of the utility model.

[0036] In the figure: 1, circuit board; 11, substrate; 111, first surface; 112, second surface; 12, electrical connection part; 121, conductive sheet; 122, welding pad; 13, conductive circuit; 14, barrier layer; 141, accommodating groove; 21, electronic component; 22, connecting terminal; 221, connecting end surface; 222, upper end surface; 3, insulating base; 31, accommodating cavity; 311, first chamber; 312, second chamber. DETAILED DESCRIPTION

[0037] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete and to fully convey the concepts of example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted.

[0038] The words expressing positions and directions described in the present utility model are all explained by taking the drawings as examples, but they can be changed as needed, and all the changes are included in the protection scope of the present utility model.

[0039] like Figures 3 to 5 As shown, a circuit board 1 corresponding to an embodiment of the present invention includes a substrate 11 , an electrical connection portion 12 , a conductive circuit 13 and a barrier layer 14 .

[0040] The substrate 11 includes a first surface 111 and a second surface 112 opposite to each other along the thickness direction thereof. The substrate 11 is made of insulating material, such as ceramic, insulating plastic, etc. Preferably, the substrate 11 is a ceramic substrate made of ceramic material. The substrate 11 is used as a carrier to carry the electrical connection portion 12, the conductive line 13, and the barrier layer 14.

[0041] Reference Figure 3 and Figure 4, the electrical connection part 12 is used to electrically connect with external electronic components to realize the electrical connection between the circuit board 1 and external electronic components. There can be multiple electrical connection parts 12, and the multiple electrical connection parts 12 can be arranged on the first surface 111 of the substrate 11, for example, the electrical connection part 12 is plated on the first surface 111 of the substrate 11. Among them, any one of the multiple electrical connection parts 12 can be a conductive sheet 121 or a welding pad 122; preferably, part of the multiple electrical connection parts 12 are conductive sheets 121, and the other part are welding pads 122. Both the conductive sheet 121 and the welding pad 122 can be arranged in multiples, and the adjacent conductive sheets 121, the adjacent welding pads 122, and the conductive sheet 121 and the welding pad 122 are arranged at intervals.

[0042] The conductive sheet 121 is used to electrically connect with the connection terminal 22 in the external electronic component. To facilitate the connection between the conductive sheet 121 and the connection terminal 22, the conductive sheet 121 can be arranged at the edge of the substrate 11 and electrically connected with the connection terminal 22 located at the edge of the substrate 11. The welding pad 122 is used to electrically connect with the electronic element 21 in the external electronic component. The welding pad 122 can be located in the middle of the substrate 11. The edge of the substrate 11 can be a position adjacent to the side of the substrate 11, and the middle of the substrate 11 can be a position of the substrate 11 excluding the edge.

[0043] Reference Figure 4 and Figure 5 , the conductive circuit 13 is arranged on the surface of the substrate 11, for example, the conductive circuit 13 is plated on the surface of the substrate 111; the conductive circuit 13 is electrically connected to the electrical connection portion 12. Since there are many conductive circuits 13, in order to facilitate the distribution of the conductive circuits 13, the conductive circuits 13 can be distributed on the first surface 111 and the second surface 112 of the substrate 11. The conductive circuit 13 located on the second surface 112 can be electrically connected to the electrical connection portion 12 or the conductive circuit 13 located on the first surface 111 through a conductive through hole or a conductive column penetrating the substrate 11.

[0044] Reference Figure 3 and Figure 4 , the barrier layer 14 covers the surface of the substrate 11, and the barrier layer 14 separates each electrical connection part 12 to form an independent unit, that is, each electrical connection part 12 is blocked from another electrical connection part 12 or the conductive circuit 13 by the barrier layer 14. The barrier layer 14 is used to prevent the diffusion of the conductive fluid at the electrical connection part 12. Therefore, when the conductive fluid is applied to the electrical connection part 12, the conductive fluid will be blocked by the barrier layer 14 during diffusion, and cannot continue to flow to other electrical connections 12 or conductive circuits 13, thereby effectively avoiding the occurrence of short circuits. Among them, the barrier layer 14 can be an ink layer, preferably a green oil layer.

[0045] In some specific embodiments, the barrier layer 14 may only cover the first surface 111 of the substrate 11 to separate the electrical connection portion 12 located on the first surface 111 into an independent unit. The barrier layer 14 covering the first surface 111 may cover the conductive circuit 13 to separate the conductive circuit 13 from the electronic components or other conductive circuits 13.

[0046] In addition, the barrier layer 14 may also cover both the first surface 111 and the second surface 112 of the substrate 11, and the barrier layer 14 covering the second surface 112 of the substrate 11 covers the conductive circuit 13 on the second surface 112. The conductive fluid may flow from the first surface 111 to the second surface 112 through the conductive through hole or the edge of the substrate 11. At this time, the barrier layer 14 covering the second surface 112 can block the further flow of the conductive fluid, thereby preventing the conductive fluid flowing to the second surface 112 from contacting the two conductive circuits 13 at the same time and causing a short circuit.

[0047] In some specific embodiments, the barrier layer 14 is provided with a receiving groove 141 penetrating along the thickness direction of the barrier layer 14, the receiving groove 141 is used to accommodate the electrical connection part 12, and the wall forming the receiving groove 141 can separate the electrical connection part 12 disposed in the receiving groove 141 from other electrical connection parts 12 and the conductive circuit 13, so that the electrical connection part 12 installed in the receiving groove 141 is separated to form an independent unit. The number of the receiving grooves 141 can be the same as the number of the electrical connection parts 12, and they correspond one to one.

[0048] In some preferred embodiments, the radial cross-sectional dimension of the receiving groove 141 is larger than the radial cross-sectional dimension of the corresponding electrical connection part 12 disposed in the receiving groove 141. When the conductive fluid is coated on the electrical connection part 12, the receiving groove 141 can contain the conductive fluid to prevent the conductive fluid from overflowing, and when the conductive fluid is filled in the receiving groove 141, it can contact the surface and surrounding sides of the electrical connection part 12 disposed in the receiving groove 141, thereby increasing the stability of the connection between the conductive fluid and the electrical connection part 12 after solidification. Among them, the radial cross-sectional dimension of the receiving groove 141 and the electrical connection part 12 is the cross-sectional dimension formed by the receiving groove 141 and the electrical connection part 12 along a cross section perpendicular to the thickness direction of the circuit board 1. The conductive fluid can be solder paste or conductive gel. After the conductive fluid is coated on the electrical connection part 12 and connected with the electronic components, it can be cured by drying so that the electrical connection part 12 and the electronic components remain fixed and achieve electrical connection.

[0049] The accommodating groove 141 is preferably a groove closed on all sides or a groove with an opening on one side, wherein, after the barrier layer 14 is covered on the substrate 11, the accommodating groove 141 near the middle position of the substrate 11 is preferably a groove closed on all sides, and the accommodating groove 141 near the edge position of the substrate 11 can be a groove closed on all sides or a groove with an opening on one side, and the opening of the accommodating groove 141 can face the edge of the substrate 11. The accommodating groove 141 near the edge position of the substrate 11 is preferably a groove closed on all sides, which can prevent the conductive fluid from flowing from one surface to another surface at the edge position of the substrate 11 when making an electrical connection.

[0050] In some preferred embodiments, since the electrical connection portion 12 may form an upper and lower connection with the external electronic components along the thickness direction of the circuit board 1, in order to ensure that the electrical connection portion 12 can contact with the external electronic components, and further ensure the stability of the electrical connection between the electrical connection portion 12 and the external electronic components, the thickness of the barrier layer 14 is less than the thickness of the corresponding electrical connection portion 12, that is, the thickness of the portion of the barrier layer 14 surrounding an electrical connection portion 12 is less than the thickness of the electrical connection portion 12, so that the electrical connection portion 12 can protrude outward from the barrier layer 14, to ensure that the electrical connection portion 12 can contact with the external electronic components, and to avoid the risk of the barrier layer 14 being too high and causing the barrier layer 14 to contact with the external electronic components and cause cold soldering.

[0051] Reference Figure 1 and Figure 2 The utility model also provides a motor base, including the above-mentioned circuit board 1, electronic components, conductive fluid and insulating base 3.

[0052] The insulating base 3 is provided with a receiving chamber 31, and the receiving chamber 31 is used to receive the circuit board 1 and at least some electronic components. The receiving chamber 31 may include a first chamber 311 and a second chamber 312, and the radial cross-sectional dimension of the first chamber 311 is smaller than that of the second chamber 312, so that a step surface is formed at the connection between the first chamber 311 and the second chamber 312. For example, the second chamber 312 may be arranged above the insulating base 3, and the first chamber 311 may be formed by being concave downward from the bottom wall of the second chamber 312. The first chamber 311 is used to receive the circuit board 1, and the second chamber 312 may be used to receive at least some electronic components. Among them, the radial cross-sectional dimension of the first chamber 311 and the second chamber 312 is the cross-sectional dimension formed by the first chamber 311 and the second chamber 312 along a cross section perpendicular to the thickness direction of the insulating base 3.

[0053] The electronic components may include an electronic component 21 and a connection terminal 22. The electronic component 21 is contained in the second chamber 312. The electronic component 21 may include components such as a capacitor and an IC (integrated circuit). The electronic component 21 may cover the welding pad 122 of the circuit board 1 along the height direction of the motor base, and realize an electrical fixed connection with the welding pad 122 in the up and down directions through a conductive fluid. The up and down directions are two relative directions along the height direction of the motor base.

[0054] The connection terminal 22 can be integrally embedded in the insulating base 3, and the upper end surface 222 of the connection terminal 22 can be exposed to the second cavity 312, and the connection end surface 221 of the connection terminal 22 can be exposed to the first cavity 311; specifically, the upper end surface 222 of the connection terminal 22 is flush with the bottom wall forming the second cavity 312, and the connection end surface 221 of the connection terminal 22 is flush with the side wall surrounding the first cavity 311. The connection end surface 221 of the connection terminal 22 can be used to electrically connect with the conductive sheet 121. Since the side wall of the first cavity 311 is located near the edge of the substrate 11 in the circuit board 1, the conductive sheet 121 is arranged at the edge of the substrate 11, which can facilitate the electrical connection between the connection end surface 221 and the conductive sheet 121. Specifically, at least a portion of the connection end surface 221 may be located at the same height as at least a portion of the conductive sheet 121, and the conductive fluid fills the radial spacing between the connection end surface 221 and the conductive sheet 121, so that the connection terminal 22 and the conductive sheet 121 are electrically fixedly connected in a horizontal direction. The horizontal connection between the connection terminal 22 and the conductive sheet 121 can facilitate users to observe the connection between the connection terminal 22 and the conductive sheet 121.

[0055] The accommodating groove 141 in the circuit board 1 can contain a conductive fluid, and then the electronic component is connected to the electrical connection portion 12 in the accommodating groove 141. After drying and curing, the electronic component 21 is fixed to the welding pad 122, so that the electronic component 21 and the circuit board 1 are kept fixed; the connecting terminal 22 is fixed to the conductive sheet 121, so that the insulating base 3 and the circuit board 1 are kept fixed.

[0056] The utility model also provides a motor, comprising the motor base mentioned above. The motor is used to enable the camera module to achieve focusing or anti-shake function.

[0057] Although the embodiments of the utility model have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the utility model. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the utility model without departing from the principles and purpose of the utility model. All of these changes should fall within the scope of protection of the claims of the utility model.

Claims

1. A circuit board, It is characterized in that include: base(11); A plurality of electrical connection parts (12) are arranged on the surface of the substrate (11), and the electrical connection parts (12) are used to electrically connect with external electronic components; A conductive circuit (13) is disposed on the surface of the substrate (11) and is electrically connected to the electrical connection portion (12); A barrier layer (14) is covered on the surface of the substrate (11); the barrier layer (14) covers the conductive line (13) and separates each electrical connection portion (12) to form an independent unit.

2. The circuit board according to claim 1, It is characterized in that The barrier layer (14) is provided with a receiving groove (141) penetrating along the thickness direction of the barrier layer (14); the receiving groove (141) is used to accommodate the electrical connection part (12); and the wall forming the receiving groove (141) separates the electrical connection part (12) to form an independent unit; the radial cross-sectional dimension of the receiving groove (141) is larger than the corresponding radial cross-sectional dimension of the electrical connection part (12); the receiving groove (141) is a groove closed on all sides or a groove with one side open.

3. The circuit board according to claim 1, It is characterized in that The thickness of the barrier layer (14) is less than or equal to the thickness of the corresponding electrical connection portion (12).

4. The circuit board according to claim 1, It is characterized in that The substrate (11) comprises a first surface (111) and a second surface (112) which are opposite to each other; the electrical connection portion (12) is arranged on the first surface (111); the conductive circuit (13) is distributed on the first surface (111) and the second surface (112); the barrier layer (14) covers the first surface (111) and the second surface (112), and simultaneously directly covers the conductive circuit (13) distributed on the first surface (111) and the second surface (112).

5. The circuit board according to claim 1, It is characterized in that The electrical connection portion (12) is a conductive sheet (121) or a welding pad (122); a plurality of the conductive sheets (121) are distributed at the edge of the substrate (11) and are used to be fixedly connected to the connection terminal (22) via a conductive fluid; a plurality of the welding pads (122) are distributed at the middle of the substrate (11) and are used to be fixedly connected to the electronic component (21) via a conductive fluid; and the barrier layer (14) is used to prevent the conductive fluid from diffusing in the electrical connection portion (12); And / or, the barrier layer (14) is an ink layer.

6. The circuit board according to claim 1, It is characterized in that The circuit board is a ceramic substrate, and the electrical connection portion (12) and the conductive circuit (13) are plated on the surface of the ceramic substrate.

7. A motor base, It is characterized in that include: The circuit board (1) according to any one of claims 1 to 6; Electronic components; The insulating base (3) is provided with a containing cavity (31), and the circuit board (1) and at least part of the electronic components are arranged in the containing cavity (31).

8. The motor base according to claim 7, It is characterized in that The barrier layer (14) is provided with a receiving groove (141) for receiving the electrical connection portion (12), and the radial cross-sectional dimension of the receiving groove (141) is larger than the radial cross-sectional dimension of the corresponding electrical connection portion (12); The motor base also includes a conductive fluid, which is disposed in the accommodating groove (141), and the electronic component and the electrical connection portion (12) are electrically connected via the conductive fluid; after the conductive fluid is cured, the electronic component and the electrical connection portion (12) are fixed.

9. The motor base according to claim 7, It is characterized in that The electronic component comprises an electronic element (21) and a connecting terminal (22), wherein the connecting terminal (22) is embedded in the insulating base (3); the electrical connection portion (12) is a conductive sheet (121) or a welding pad (122); the electronic element (21) is electrically connected to the welding pad (122), and the connecting terminal (22) is electrically connected to the conductive sheet (121).

10. The motor base according to claim 9, It is characterized in that The accommodating cavity (31) comprises a first cavity (311) and a second cavity (312); the radial cross-sectional dimension of the first cavity (311) is smaller than that of the second cavity (312); the first cavity (311) is used to accommodate the circuit board (1), and the second cavity (312) is used to accommodate the electronic component (21).

11. The motor base according to claim 10, It is characterized in that The connection end surface (221) of the connection terminal (22) is exposed to the first cavity (311), and at least a portion of the connection end surface (221) is located at the same height as at least a portion of the conductive sheet (121), and the conductive fluid fills the radial distance between the connection end surface (221) and the conductive sheet (121), so that the connection terminal (22) is horizontally connected to the conductive sheet (121); And / or, the electronic component (21) covers the welding pad (122) along the height direction of the motor base, and is connected to the welding pad (122) in an upper and lower manner through the conductive fluid.

12. The motor base according to claim 7, It is characterized in that The conductive fluid is solder paste or conductive gel.

13. A motor, It is characterized in that Comprising a motor base as described in any one of claims 7-12.

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