High-heat-dissipation multilayer HDI circuit board

Abstract

The utility model is suitable for the technical field of circuit boards, and provides a high-heat-dissipation multilayer HDI circuit board which comprises an assembly frame. The frame groove is formed in the assembling frame; the HDI plate slides in the frame groove; the cooling piece is arranged in the assembly frame; the cooling piece comprises cold water bins symmetrically arranged on the two sides of the assembling frame. The micro circulating pump is arranged beside one cold water bin; one end of the micro circulating pump is communicated with one cold water bin through a circulating pipe, and the other end of the micro circulating pump is communicated with the other cold water bin through a circulating pipe; according to the utility model, through the arrangement of the cooling piece, the cooling liquid can continuously or intermittently circularly flow between the cold water bins, heat generated by the HDI board can be taken away in time, due to the circular flow of the cooling liquid, the temperature of the circuit board can be maintained in a stable range, the normal operation of equipment is ensured, the service life is prolonged, and meanwhile, the service life of the equipment is prolonged. And the cold water bin and the micro circulating pump are compact in design and do not occupy too much space, so that the overall structure is more compact.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit boards, and in particular relates to a high-heat dissipation multi-layer HDI circuit board. Background Art

[0002] With the continuous development of science and technology, high-density integrated circuit boards (HDI boards) are increasingly used in electronic devices, such as smart phones, tablet computers, wearable devices, etc.; Since the electronic components on HDI boards are highly dense, the heat generated by them also increases accordingly. If the heat cannot be dissipated in a timely and effective manner, the temperature of the circuit board will rise, and the heat sink will have a poor heat dissipation effect. The HDI circuit board cannot dissipate heat quickly, which will burn out its internal working components, reduce its service life, and affect the stability and reliability of the equipment. Therefore, in order to solve the heat dissipation problem of HDI boards, researchers are constantly exploring more efficient heat dissipation technologies and methods;

[0003] Traditional heat dissipation methods mainly rely on natural convection or the installation of heat sinks, but for high-density HDI boards, the heat dissipation effect of these methods is not ideal; therefore, a more efficient heat dissipation technology is needed to solve the heat dissipation problem of HDI boards. Utility Model Content

[0004] The utility model provides a high heat dissipation multilayer HDI circuit board, aiming to solve the problem that due to the high density of electronic components on the HDI board, the heat generated by the HDI board also increases accordingly. If the heat cannot be dissipated in a timely and effective manner, the temperature of the circuit board will increase, the heat dissipation effect of the heat sink will be poor, and the HDI circuit board will not be able to dissipate heat quickly, thereby burning its internal working components, reducing its service life, and affecting the stability and reliability of the equipment.

[0005] The utility model is realized in this way. A high heat dissipation multilayer HDI circuit board comprises an assembly frame; a frame groove arranged inside the assembly frame, one side of the frame groove is open; an HDI board sliding in the frame groove; a cooling member arranged in the assembly frame; wherein the cooling member comprises: cold water bins symmetrically arranged on both sides of the assembly frame; a micro-circulation pump arranged beside one of the cold water bins; one end of the micro-circulation pump is connected with the cold water bin through a circulation pipe, and the other end of the micro-circulation pump is connected with another cold water bin through the circulation pipe.

[0006] Preferably, the circulation pipe is arranged in a ring shape, a heat-conducting silicone sheet is arranged on the outer side of the circulation pipe, and a plurality of heat dissipation holes are arranged on the heat-conducting silicone sheet.

[0007] Preferably, the HDI board includes several layers of circuit boards, and an insulating layer is provided between every two adjacent circuit boards.

[0008] Preferably, the assembly frame is provided with a group of first assembly holes adjacent to its open position, and the HDI board is provided with second assembly holes matching the apertures of the first assembly holes.

[0009] Preferably, protective pads are arranged at the outer sides of the four corners of the assembly frame, and the protective pads are flexibly arranged.

[0010] Preferably, a temperature sensor is provided on the assembly frame.

[0011] Preferably, a plurality of heat dissipation slots are provided on the end side of the assembly frame.

[0012] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0013] By setting up cooling parts, the coolant can circulate continuously or intermittently between the cold water tanks, ensuring that the heat generated by the HDI board can be taken away in time. Due to the circulation of the coolant, the temperature of the circuit board can be maintained within a stable range, ensuring the normal operation of the equipment and extending its service life. At the same time, the design of the cold water tank and the micro-circulation pump is compact and does not take up too much space, making the overall structure more compact and suitable for integration into various limited spaces. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0015] Figure 2 It is a three-dimensional structural schematic diagram of the assembly frame of the utility model;

[0016] Figure 3 It is a schematic diagram of the cooling element structure of the utility model;

[0017] Figure 4 This is a schematic diagram of the HDI board structure of the utility model;

[0018] In the figure: 1. assembly frame; 2. frame groove; 3. HDI board; 401. cold water tank; 402. micro circulation pump; 403. circulation pipe; 5. thermal conductive silicone sheet; 6. heat dissipation hole; 7. circuit board; 8. insulation layer; 9. first assembly hole; 10. second assembly hole; 11. protective pad; 12. heat dissipation groove. DETAILED DESCRIPTION

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0020] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0021] The utility model embodiment provides a high heat dissipation multi-layer HDI circuit board, such as Figure 1-4 As shown, it includes an assembly frame 1; a frame groove 2 arranged inside the assembly frame 1, one side of the frame groove 2 is open; an HDI board 3 sliding in the frame groove 2; a cooling member arranged in the assembly frame 1; wherein the cooling member includes: cold water tanks 401 symmetrically arranged on both sides of the assembly frame 1; a micro-circulation pump 402 arranged beside one of the cold water tanks 401; one end of the micro-circulation pump 402 is connected to the cold water tank 401 through a circulation pipe 403, and the other end of the micro-circulation pump 402 is connected to the other cold water tank 401 through the circulation pipe 403.

[0022] It should be noted that, due to the high density of electronic components on the HDI board 3, the heat generated by them also increases accordingly. If the heat cannot be dissipated in a timely and effective manner, the temperature of the circuit board 7 will increase, the heat dissipation effect of the heat sink will be poor, and the HDI circuit board 7 will not be able to dissipate heat quickly, which will burn out its internal working components, reduce its service life, and affect the stability and reliability of the equipment. In this solution, by setting a cooling part, the coolant can circulate continuously or intermittently between the cold water tanks 401, ensuring that the heat generated by the HDI board 3 can be taken away in time. Due to the circulation of the coolant, the temperature of the circuit board 7 can be maintained within a stable range, ensuring the normal operation of the equipment and extending its service life. At the same time, the design of the cold water tank 401 and the micro-circulation pump 402 is compact and does not take up too much space, making the overall structure more compact and suitable for integration into various limited spaces.

[0023] Specifically, in this embodiment, the scheme mainly includes an assembly frame 1; a frame groove 2 provided inside the assembly frame 1, one side of the frame groove 2 being open; an HDI board 3 sliding inside the frame groove 2; the HDI board 3 is slid into the frame groove 2 inside the assembly frame 1, and since one side of the frame groove 2 is open, the HDI board 3 can be easily slid into the frame groove 2 and remain stable, and then, the cooling member is started, and the cooling member includes cold water tanks 401 symmetrically arranged on both sides of the assembly frame 1, and a micro circulation pump 402 is arranged next to one of the cold water tanks 401, and the micro circulation pump 402 is arranged next to the cold water tank 401. One end of the circulation pump 402 is connected to the cold water tank 401 through the circulation pipe 403, and the other end is connected to another cold water tank 401 through the circulation pipe 403. The micro circulation pump 402 starts to work and drives the coolant to circulate between the cold water tanks 401. This process can be continuous or intermittent. The design of the cold water tank 401 and the function of the micro circulation pump 402 are to help absorb and dissipate the heat generated by the HDI board 3; through the circulating coolant, the heat is effectively taken away from the circuit board 7 and dissipated to the surrounding environment through the heat dissipation holes 6 and the heat dissipation slots 12.

[0024] In a further preferred embodiment of the present invention, Figure 3 As shown, the circulation pipe 403 is arranged in a ring shape, and a heat-conducting silicone sheet 5 is arranged on the outer side of the circulation pipe 403 , and a plurality of heat dissipation holes 6 are arranged on the heat-conducting silicone sheet 5 .

[0025] In this embodiment, the circulating coolant absorbs heat from the circuit board 7 through the thermally conductive silicone sheet 5 ; the heat is dissipated to the surrounding environment through the heat dissipation holes 6 on the thermally conductive silicone sheet 5 .

[0026] In a further preferred embodiment of the present invention, Figure 4 As shown, the HDI board 3 includes several layers of circuit boards 7 , and an insulating layer 8 is provided between every two adjacent circuit boards 7 .

[0027] In this embodiment, the insulating layer 8 is provided to improve the electrical performance and stability.

[0028] In a further preferred embodiment of the present invention, Figure 2-4 As shown, the assembly frame 1 is provided with a group of first assembly holes 9 near its open position, and the HDI board 3 is provided with second assembly holes 10 whose diameters match those of the first assembly holes 9 .

[0029] In this embodiment, the second assembly hole 10 on the HDI board 3 can cooperate with the first assembly hole 9, and screws, pins or other fasteners are usually used to pass through these two holes to achieve the fixation between the assembly frame 1 and the HDI board 3; this design ensures the accurate alignment between the two components and can provide sufficient mechanical strength and stability to support and fix the components to prevent them from moving or loosening during operation.

[0030] In a further preferred embodiment of the present invention, Figure 1-2 As shown, protective pads 11 are arranged at the outer sides of the four corners of the assembly frame 1, and the protective pads 11 are flexibly arranged.

[0031] In this embodiment, the flexibly arranged protective pad 11 can play a role in shock absorption and buffering, effectively absorbing and dispersing external forces and reducing direct impacts on corner positions; in addition, the flexible protective pad 11 also has a certain elasticity, and can better adapt to different shapes and sizes of external forces, providing a more comprehensive protection effect.

[0032] In a further preferred embodiment of the present invention, Figure 1-4 As shown, a temperature sensor is provided on the assembly frame 1 .

[0033] In this embodiment, the temperature sensor (PT100) monitors the temperature of the circuit board 7 in real time and feeds the data back to the control system.

[0034] In a further preferred embodiment of the present invention, Figure 1-2 As shown, a plurality of heat dissipation slots 12 are provided on the end side of the assembly frame 1 .

[0035] In this embodiment, the design of the heat dissipation slots 12 increases the heat dissipation area and ventilation volume, which helps to improve the heat dissipation effect.

[0036] Working principle: When the device is used, the HDI board 3 slides into the frame groove 2 inside the assembly frame 1 and is fixed to the assembly frame 1 through the first assembly hole 9 and the second assembly hole 10; the micro circulation pump 402 is started to drive the coolant to circulate between the cold water tank 401 and the circulation pipe 403;

[0037] The circulating coolant absorbs heat from the circuit board 7 through the thermally conductive silicone sheet 5; the heat is dissipated to the surrounding environment through the heat dissipation holes 6 on the thermally conductive silicone sheet 5;

[0038] The temperature sensor monitors the temperature of the circuit board 7 in real time and feeds the data back to the control system; according to the data of the temperature sensor, the control system can adjust the working state of the micro-circulation pump 402 to keep the temperature of the circuit board 7 stable;

[0039] Through the first assembly hole 9 and the second assembly hole 10, the HDI board 3 is firmly connected to the assembly frame 1 to form a stable structure;

[0040] The open position of the assembly frame 1 matches the opening position of the HDI board 3, so that the HDI board 3 can be easily slid into the frame groove 2; the design of the heat dissipation groove 12 increases the heat dissipation area and ventilation volume, which helps to improve the heat dissipation effect; through this structural design, the high heat dissipation multi-layer HDI circuit board 7 not only has good electrical performance and stability, but also has efficient heat dissipation performance and installation convenience.

[0041] It should be noted that, for the above-mentioned embodiments, for the sake of simplicity, they are all described as a series of action combinations, but those skilled in the art should know that the utility model is not limited by the described action sequence, because according to the utility model, some steps may be performed in other sequences or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the utility model.

[0042] In the several embodiments provided in the present application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are merely schematic, such as the division of the above-mentioned units. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection between devices or units can be in the form of telecommunication or other forms.

[0043] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0044] The above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit the protection scope of the utility model. Obviously, the described embodiments are only some embodiments of the utility model, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Although the utility model has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the utility model according to the circumstances without conflict, without making creative work, so as to obtain different other technical solutions that do not deviate from the concept of the utility model in essence, and these technical solutions also belong to the scope of protection of the utility model.

Claims

1. A high heat dissipation multilayer HDI circuit board, characterized in that: include: Assembly frame; A frame groove is arranged inside the assembly frame, and one side of the frame groove is open; An HDI board sliding in the frame groove; A cooling member disposed in the assembly frame; Wherein, the cooling element comprises: Cold water bins symmetrically arranged on both sides of the assembly frame; A micro-circulation pump located next to one of the cold water tanks; One end of the micro-circulation pump is connected to the cold water tank through a circulation pipe, and the other end of the micro-circulation pump is connected to another cold water tank through a circulation pipe.

2. A high heat dissipation multilayer HDI circuit board as claimed in claim 1, characterized in that: The circulation pipe is arranged in a ring shape, a heat-conducting silicone sheet is arranged on the outer side of the circulation pipe, and a plurality of heat dissipation holes are arranged on the heat-conducting silicone sheet.

3. A high heat dissipation multilayer HDI circuit board as claimed in claim 1, characterized in that: The HDI board includes several layers of circuit boards, and an insulating layer is arranged between every two adjacent circuit boards.

4. A high heat dissipation multilayer HDI circuit board as claimed in claim 1, characterized in that: The assembly frame is provided with a group of first assembly holes adjacent to its open position, and the HDI board is provided with second assembly holes matching the apertures of the first assembly holes.

5. A high heat dissipation multilayer HDI circuit board as claimed in claim 4, characterized in that: The outer sides of the four corners of the assembly frame are all provided with protective pads, and the protective pads are flexibly arranged.

6. A high heat dissipation multilayer HDI circuit board as claimed in claim 5, characterized in that: The assembly frame is provided with a temperature sensor.

7. A high heat dissipation multilayer HDI circuit board as claimed in claim 6, characterized in that: A plurality of heat dissipation slots are provided on the end side of the assembly frame.

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