Frequency converter

Abstract

The utility model discloses a frequency converter, the frequency converter comprises a housing and a heat conduction structure, the housing is internally provided with a heat radiation air channel and an installation cavity which are arranged at intervals, and the installation cavity is internally provided with an electrical element; the heat conduction structure is installed in the shell and arranged between the heat dissipation air channel and the installation cavity so that heat in the installation cavity can be guided into the heat dissipation air channel for heat dissipation. According to the technical scheme provided by the utility model, the heat dissipation air channel and the mounting cavity are arranged at intervals, so that dust escaping from the heat dissipation air channel to the mounting cavity is reduced, electrical elements in the mounting cavity are prevented from being contaminated by dust, the service life of a product is guaranteed, and the service life of the product is prolonged. The heat in the mounting cavity is conducted to the heat dissipation air channel for heat dissipation in a heat conduction structure mode, and the dustproof effect is achieved on the premise that heat dissipation of the product is not affected.

Description

Technical Field

[0001] The utility model relates to the technical field of frequency conversion, in particular to a frequency converter. Background Art

[0002] Low-voltage inverters are mainly used to control and adjust the speed and torque of three-phase AC asynchronous motors and three-phase AC permanent magnet motors. They can be used to drive textile, papermaking, wire drawing, machine tools, packaging, food, fans, water pumps and various automated production equipment.

[0003] The electrical components of current inverters, such as PCB board components, power modules, etc., are easily contaminated with dust, which will reduce the service life of the product. Utility Model Content

[0004] The main purpose of the utility model is to provide a frequency converter, aiming to solve the problem that the electrical components inside the existing frequency converter are easily contaminated with dust.

[0005] In order to achieve the above object, the utility model provides a frequency converter, comprising:

[0006] A housing, wherein a heat dissipation duct and an installation cavity are formed in the housing, and an electrical component is installed in the installation cavity; and

[0007] The heat-conducting structure is installed in the shell and disposed between the heat dissipation duct and the installation cavity to guide the heat in the installation cavity into the heat dissipation duct for heat dissipation.

[0008] Optionally, a working cavity is formed in the shell, and the inverter further includes a partition assembly, which is installed in the working cavity to separate the working cavity into the heat dissipation duct and the installation cavity, and the partition assembly at least includes the heat conductive structure.

[0009] Optionally, the partition assembly further includes a dust isolation plate, which is installed at one end of the heat-conducting structure, and the dust isolation plate and the heat-conducting structure together separate the working cavity to form the heat dissipation duct and the installation cavity.

[0010] Optionally, the heat-conducting structure includes a plurality of heat-dissipating fins extending toward the heat-dissipating air duct.

[0011] Optionally, the electrical component includes a power component, and the power component is mounted on the heat-conducting structure; and / or,

[0012] The electrical component includes a PCB assembly, and the PCB assembly is mounted on the dust isolation plate.

[0013] Optionally, the dust shielding plate at least partially extends to above the power element, and the dust shielding plate is provided with guide holes along the thickness direction thereof to position the installation of the power element.

[0014] Optionally, the guide hole is expanded toward the opening end of the power element.

[0015] Optionally, the dust shield is provided with a positioning column, and the PCB assembly is provided with a guide hole, and the positioning column and the guide hole are used to guide the PCB assembly when the PCB assembly is installed; and / or,

[0016] The PCB assembly and the dust shield are connected via fasteners.

[0017] Optionally, the frequency converter further comprises a fan arranged in the heat dissipation duct;

[0018] The dust shielding plate at least partially extends to the upper part of the fan, and a wire groove is formed in the upper part of the dust shielding plate, and the wire groove is used for installing the wires of the fan.

[0019] Optionally, a guide structure is provided between the dust shielding plate and the shell, and the guide structure includes a guide portion and a matching portion, wherein one of the guide portion and the matching portion is provided on the dust shielding plate, and the other is provided on the shell, so as to guide the installation of the shell.

[0020] In the technical solution provided by the utility model, the heat dissipation duct and the installation cavity are spaced apart, thereby reducing dust dissipated from the heat dissipation duct to the installation cavity, preventing the electrical components in the installation cavity from being contaminated by dust, and ensuring the service life of the product. In addition, a heat-conducting structure is used to conduct the heat in the installation cavity to the heat dissipation duct for heat dissipation, thereby playing a dust-proof role without affecting the heat dissipation of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0022] Figure 1 An exploded diagram of an embodiment of a frequency converter provided by the utility model;

[0023] Figure 2 for Figure 1 An exploded diagram of the internal structure of the inverter;

[0024] Figure 3 for Figure 2 A partial cross-sectional view of the internal structure of the frequency converter;

[0025] Figure 4 for Figure 3 A local enlarged view of point A in FIG.

[0026] Figure 5 for Figure 1 Assembly drawing of the internal structure of the inverter;

[0027] Figure 6 for Figure 1 A three-dimensional schematic diagram of the dust screen in FIG.

[0028] Description of Figure Numbers:

[0029] Label name Label name 100 Frequency Converter 10 case 20 PCB Assembly 30 Power Components 40 Thermally conductive structure 41 Heat sink 42 Thermal Conductive Sheet 50 Dust-proof board 51 Guide hole 52 Positioning column 60 fastener 70 fan 53 Wire duct 54 Guide groove 11 Cooling duct 12 Mounting cavity

[0030] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0033] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0034] Low-voltage inverters are mainly used to control and adjust the speed and torque of three-phase AC asynchronous motors and three-phase AC permanent magnet motors. They can be used to drive textile, papermaking, wire drawing, machine tools, packaging, food, fans, water pumps and various automated production equipment.

[0035] The electrical components of current inverters, such as PCB board components, power modules, etc., are easily contaminated with dust, which will reduce the service life of the product.

[0036] In order to solve the above problems, the utility model provides a frequency converter 100. Figure 1 An exploded diagram of an embodiment of a frequency converter 100 provided by the utility model; Figure 2 for Figure 1 An exploded diagram of the internal structure of the frequency converter 100; Figure 3 for Figure 2 A partial cross-sectional view of the internal structure of the frequency converter 100; Figure 4 for Figure 3 A local enlarged view of point A in FIG. Figure 5 for Figure 1 An assembly diagram of the internal structure of the frequency converter 100; Figure 6 for Figure 1 A three-dimensional schematic diagram of the dust shield 50 in FIG.

[0037] See also Figures 1 to 6 The inverter 100 includes a shell 10 and a heat-conducting structure 40. The shell 10 is formed with a heat-dissipating duct 11 and a mounting cavity 12 arranged at intervals. An electrical component is installed in the mounting cavity 12. The heat-conducting structure 40 is installed in the shell 10 and is arranged between the heat-dissipating duct 11 and the mounting cavity 12 to guide the heat in the mounting cavity 12 into the heat-dissipating duct 11 for heat dissipation.

[0038] In the technical solution provided by the utility model, the heat dissipation duct 11 and the installation cavity 12 are spaced apart, thereby reducing dust dissipated from the heat dissipation duct 11 to the installation cavity 12, preventing the electrical components in the installation cavity 12 from being contaminated by dust, and ensuring the service life of the product. In addition, a heat-conducting structure is used to conduct the heat in the installation cavity 12 to the heat dissipation duct 11 for heat dissipation, thereby playing a dust-proof role without affecting the heat dissipation of the product.

[0039] It should be noted that the specific implementation form of the electrical component is not limited, and it can be an integrated circuit board, or a power component 30, etc., and no limitation is made here. The specific shape of the heat-conducting structure 40 is not limited, and it can be any shape, such as a rectangle, a circle, etc., as long as it can conduct the heat in the installation cavity 12 into the heat dissipation duct 11.

[0040] It should be emphasized that the formation method of the heat dissipation duct 11 and the installation cavity 12 is not limited. It can be two independent cavities formed in the shell 10, or the shell 10 can have a large inner cavity, and then form independent heat dissipation ducts 11 and installation cavities 12 by setting partitions, etc., which are not limited here.

[0041] In one embodiment, a working cavity is formed in the shell 10, and the inverter 100 also includes a partition assembly, which is installed in the working cavity to separate the working cavity into the heat dissipation duct 11 and the installation cavity 12, and the partition assembly at least includes the heat conductive structure 40.

[0042] With such arrangement, during the installation process, the partition assembly, the heat-conducting structure 40 and the electrical components can be first installed on the base, and then the shell 10 can be covered and installed on the base. At this time, the partition assembly separates the working cavity to form the heat dissipation duct 11 and the installation cavity 12, and the installation process is relatively simple and convenient. However, when two chambers are directly formed in the shell 10, it is difficult to install the partition assembly, the heat-conducting structure 40 and the electrical components.

[0043] Moreover, in the present embodiment, the partition assembly at least includes the heat-conducting structure 40, so that the heat dissipation duct 11 and the installation cavity 12 are directly separated by the heat-conducting structure 40. On the one hand, it is convenient for the heat-conducting structure 40 to directly introduce the heat in the installation cavity 12 into the heat dissipation duct 11 for heat dissipation. On the other hand, a part of the partition can be omitted to reduce costs and make the overall structure more streamlined.

[0044] It can be understood that the partition assembly may include only the heat-conducting structure 40, so that the heat-conducting structure 40 alone separates the working cavity to form the heat dissipation duct 11 and the installation cavity 12, or the partition assembly may also include components other than the heat-conducting structure 40, such as other partitions, and multiple components together separate the working cavity to form the heat dissipation duct 11 and the installation cavity 12, and so on, which is not limited here.

[0045] Furthermore, since the heat-conducting structure 40 alone forms the partition assembly, the overall size of the heat-conducting structure 40 needs to be made very large, and the corresponding cost will be relatively high. Therefore, in one embodiment, the partition assembly also includes a dust-proof plate 50, and the dust-proof plate 50 is installed at one end of the heat-conducting structure 40, and the dust-proof plate 50 and the heat-conducting structure 40 jointly separate the working cavity to form the heat dissipation duct 11 and the installation cavity 12.

[0046] In the technical solution of this embodiment, by providing the dust isolation plate 50, the dust isolation plate 50 and the heat conducting structure 40 together separate the working cavity into the heat dissipation duct 11 and the installation cavity 12, so that the overall size of the heat conducting structure 40 does not need to be made large. In addition, the dust isolation plate 50 can also be extended toward the installation cavity 12, so as to divide the installation cavity 12 into two parts, respectively for the installation of the PCB board and the power component 30.

[0047] Furthermore, in order to improve the heat dissipation effect of the thermally conductive structure 40, the thermally conductive structure 40 includes a plurality of heat sinks 41 extending toward the heat dissipation duct 11. In the technical solution of this embodiment, by providing a plurality of heat sinks 41 extending toward the heat dissipation duct 11, the contact area between the thermally conductive structure 40 and the airflow in the heat dissipation duct 11 is increased, thereby improving the heat dissipation effect of the thermally conductive structure 40.

[0048] In a further embodiment, the electrical component includes a power element 30, and the power element 30 is installed on the heat-conducting structure 40. In the technical solution of this embodiment, by directly installing the power element 30 on the heat-conducting structure 40, the heat generated by the power element 30 during operation can be directly conducted to the heat dissipation duct 11 through the conduction effect of the heat-conducting structure 40 for dissipation, and the heat dissipation effect is better. Compared with the existing direct-blowing heat dissipation, the heat dissipation airflow does not need to directly enter the installation cavity 12, thereby avoiding dust from entering the installation cavity 12 and extending the service life of the inverter 100 product.

[0049] It should be noted that the power element 30 generates a large amount of heat during operation, and installing it directly on the heat-conducting structure 40 can improve the heat dissipation effect of the power element 30. Specifically, the heat-conducting structure 40 includes a heat-conducting sheet 42 and a heat sink 41, the heat sink 41 is installed on the heat-conducting sheet 42, and the power element 30 is arranged on the upper part and the front part of the heat-conducting sheet 42, and is screwed or crimped on the heat-conducting sheet 42.

[0050] Specifically, the power element 30 includes a power module, a rectifier bridge, and a thermistor. The rectifier bridge and the thermistor are respectively locked on the upper part of the heat conductive sheet 42 by fasteners 60. The power module is attached to the heat sink 41 and then pressed against the heat conductive sheet 42 by a pressing sheet.

[0051] At the same time, the electrical component may also include a PCB assembly, and the PCB assembly is installed on the dust isolation plate 50. In the scheme of this embodiment, the dust isolation plate 50 can isolate the heat dissipation duct 11 and the PCB assembly installation cavity, thereby preventing dust from entering the installation cavity of the PCB assembly. In addition, the dust isolation plate 50 can also guide the IGBT pins in the PCB assembly, fix the fan and NTC wiring paths, and limit the position of the PCB assembly.

[0052] Specifically, the inverter 100 further includes a control board, and the control board is disposed at the uppermost part of the PCB assembly.

[0053] Furthermore, the dust-shielding plate 50 at least partially extends above the power element 30 , and the dust-shielding plate 50 is provided with guide holes 51 along the thickness direction thereof to guide the installation of the power element 30 .

[0054] In the technical solution of this embodiment, by providing the guide hole 51 on the dust shielding plate 50 , when the power element 30 is installed, the guide hole 51 can play a guiding role in the installation of the power element 30 .

[0055] Furthermore, the opening end of the guide hole 51 toward the power element 30 is flared. In this way, the flared opening end of the guide hole 51 forms a guide surface at one end of the guide hole 51 toward the power element 30, so that the power element 30 can play a role in position correction during installation.

[0056] At the same time, since the PCB assembly is installed on the dust isolation plate 50, in order to position and install the PCB assembly, the dust isolation plate 50 is provided with a positioning column 52, and the PCB assembly is provided with a positioning hole. The positioning column 52 and the positioning hole are used to position the PCB assembly when the PCB assembly is installed. In the technical solution of this embodiment, by providing a positioning column 52 on the dust isolation plate 50 and providing a positioning hole on the PCB assembly, during the installation process, the dust isolation plate 50 is first installed to one end of the heat conductive structure 40, and then the positioning hole of the PCB assembly is aligned with the positioning column 52, and the PCB assembly is installed downward, and the installation of the PCB assembly can be completed, which is simple and fast.

[0057] In one embodiment, the PCB assembly and the dust shielding plate 50 are connected via a fastener 60 . After the PCB assembly is positioned and placed, the fastener 60 can be used to tightly combine the PCB assembly and the dust shielding plate 50 .

[0058] In the meantime, please see Figures 2 to 3 The inverter 100 also includes a fan 70 arranged in the heat dissipation duct 11. By setting the fan 70, airflow can be blown into the heat dissipation duct 11 to dissipate heat from the heat dissipation duct 11. The dust shield 50 at least partially extends above the fan 70, and a wire groove 53 is provided on the dust shield 50 located above the fan 70. The wire groove 53 is used for installing the wires of the fan 70. By setting the wire groove 53, the wires of the fan 70 can be positioned and installed, thereby ensuring the rationality and stability of the wiring. Since the wire groove 53 is opened above the fan 70, the distance between the wire groove 53 and the fan 70 is small, thereby improving the stability of the wiring harness fixation.

[0059] It should be noted that the installation position of the fan 70 in the heat dissipation duct 11 is not limited. Figure 1 and Figure 5 In one embodiment, the lower part of the dust shield plate 50 is divided into the heat dissipation duct 11 and the power module installation cavity of the installation cavity 12. Specifically, the heat dissipation duct 11 is divided into a heat sink installation duct and a fan installation duct. The heat sink installation duct is located on one side of the power module installation cavity of the installation cavity 12, and the fan installation duct is located at one end of the installation cavity. The heat sink installation duct and the fan installation duct together constitute an L-shaped heat dissipation duct. The heat dissipation duct 12 can be arranged around the periphery of the power module installation cavity of the installation cavity 12 in a range of approximately 180° to dissipate heat, thereby improving the heat dissipation effect.

[0060] Furthermore, in order to facilitate the installation of the shell 10, a guide structure is arranged between the dust shielding plate 50 and the shell 10, and the guide structure includes a guide part and a matching part, one of the guide part and the matching part is arranged on the dust shielding plate 50, and the other is arranged on the shell 10, so as to guide the installation of the shell 10.

[0061] In the technical solution of this embodiment, the partition assembly, the heat-conducting structure 40 and the electrical components are first installed on the base, and then the shell 10 is covered and installed on the base. During the installation of the shell 10, the installation of the shell 10 can be guided by the guiding cooperation between the guide part and the matching part.

[0062] It can be understood that, the guide portion and the matching portion, one of which is arranged on the dust shielding plate 50, and the other is arranged on the shell 10. The guide portion can be arranged on the dust shielding plate 50, and the matching portion can be arranged on the shell 10, or the guide portion can be arranged on the shell 10, and the matching portion can be arranged on the dust shielding plate 50. No limitation is made herein. The specific forms of the guide portion and the matching portion are not limited, and can be the matching of a rib and a guide groove, or the matching of a guide column and a guide hole, etc., which are not limited herein. In one embodiment, the guide portion includes a guide groove 54 arranged on the dust shielding plate 50, and the matching portion includes a rib arranged on the shell 10.

[0063] The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structural changes made by using the contents of the utility model specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the utility model.

Claims

1. A frequency converter, characterized in that: include: A housing, wherein heat dissipation ducts and an installation cavity are formed in the housing, and an electrical component is installed in the installation cavity; as well as, The heat-conducting structure is installed in the shell and disposed between the heat dissipation duct and the installation cavity to guide the heat in the installation cavity into the heat dissipation duct for heat dissipation.

2. The frequency converter according to claim 1, characterized in that: A working cavity is formed in the shell, and the inverter further includes a partition assembly, which is installed in the working cavity to separate the working cavity into the heat dissipation duct and the installation cavity, and the partition assembly at least includes the heat conduction structure.

3. The frequency converter according to claim 2, characterized in that: The partition assembly also includes a dust isolation plate, which is installed at one end of the heat-conducting structure. The dust isolation plate and the heat-conducting structure together separate the working cavity to form the heat dissipation duct and the installation cavity.

4. The frequency converter according to claim 3, characterized in that: The heat-conducting structure includes a plurality of heat-dissipating fins extending toward the heat-dissipating air duct.

5. The frequency converter according to claim 3, characterized in that: The electrical component includes a power component, and the power component is mounted on the heat-conducting structure; and / or, The electrical component includes a PCB assembly, and the PCB assembly is mounted on the dust isolation plate.

6. The frequency converter according to claim 5, characterized in that: The dust-shielding plate at least partially extends above the power element, and the dust-shielding plate is provided with guide holes along the thickness direction thereof to guide the installation of the power element.

7. The frequency converter according to claim 6, characterized in that: The guide hole is expanded toward the opening end of the power element.

8. The frequency converter according to claim 5, characterized in that: The dust shield is provided with a positioning column, and the PCB assembly is provided with a positioning hole, and the positioning column and the positioning hole are used to position the PCB assembly when the PCB assembly is installed; and / or, The PCB assembly and the dust shield are connected via fasteners.

9. The frequency converter according to claim 3, characterized in that: The frequency converter further comprises a fan arranged in the heat dissipation duct; The dust shielding plate at least partially extends to the upper part of the fan, and a wire groove is formed in the upper part of the dust shielding plate, and the wire groove is used for installing the wires of the fan.

10. The frequency converter according to claim 3, characterized in that: A guide structure is arranged between the dust-shielding plate and the shell, and the guide structure comprises a guide portion and a matching portion, wherein one of the guide portion and the matching portion is arranged on the dust-shielding plate, and the other is arranged on the shell, so as to guide the installation of the shell.

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