Clamping assembly for coating of semiconductor electronic component

Abstract

The utility model relates to the technical field of semiconductor electronic component processing, and discloses a semiconductor electronic component coating clamping assembly which comprises an L-shaped plate, the back face of the L-shaped plate is connected with an adjusting box in a sliding mode, and a right-hand threaded rod and a left-hand threaded rod are rotationally connected between the left side and the right side of an inner cavity of the adjusting box through bearings. By arranging the L-shaped plate, the adjusting box, the positive and negative threaded rod, the convex plates, a movable plate, a rotating shaft, a clamping assembly, a gear motor, a stud and a limiting nut, the clamping distance and the clamping height of the semiconductor electronic component can be conveniently adjusted, meanwhile, the clamping distance and the clamping height of the semiconductor electronic component can be conveniently adjusted, and the clamping efficiency is improved. Through the arrangement of the rotating shaft and the gear motor, the semiconductor electronic components can be overturned conveniently, and through the arrangement of the structure, the semiconductor electronic components of different specifications and sizes can be clamped and limited conveniently, so that the clamping limitation is avoided, and meanwhile, the use requirements of customers can be met.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor electronic component processing, in particular to a semiconductor electronic component coating clamping assembly. Background Art

[0002] Semiconductor electronic components are electronic components or integrated circuits made of semiconductor materials. At present, there are three commonly used semiconductor materials: silicon, germanium, and gallium arsenide. With the development of science and technology, there are more and more types of semiconductor electronic components. In the process of processing semiconductor electronic components, it is necessary to coat the semiconductor electronic components. Therefore, clamping components are required to clamp the semiconductor electronic components so that the coating process can proceed smoothly.

[0003] Among them, the existing patent with announcement number CN220126748U discloses a semiconductor electronic component coating clamping assembly, including a base, a vertical mounting plate A and a vertical mounting plate B are respectively welded at the two ends of the top of the base, and a stepper motor is provided on the inner side of the vertical mounting plate A and the vertical mounting plate B, and the output end of the stepper motor is connected to a clamping jaw, and the upper end of the clamping jaw is provided with a fastening screw by opening a threaded hole; however, the above patent does not have the function of adjusting the clamping distance, resulting in the clamping assembly being able to only clamp and limit semiconductor electronic components of the same specification and size, and this method leads to limitations in clamping, thereby failing to meet customer usage needs.

[0004] Therefore, those skilled in the art provide a semiconductor electronic component coating clamping assembly to solve the problems raised in the above background technology. Utility Model Content

[0005] In order to improve the problem of lack of clamping distance adjustment function, the utility model provides a semiconductor electronic component coating clamping assembly.

[0006] The utility model provides a semiconductor electronic component coating clamping assembly, which adopts the following technical solution:

[0007] The left and right sides of the front face of the adjusting box are fixedly connected with studs, and the front side of the studs penetrates the L-shaped plate and is threadedly connected with a limiting nut, and the outer surface of the limiting nut is tightly fitted with the connection of the L-shaped plate.

[0008] By adopting the above technical solution, when the staff adjusts the clamping distance according to semiconductor electronic components of different specifications and sizes, the staff rotates the turning handle so that the turning handle drives the positive and negative threaded rods to rotate on the inner surface threads of the convex plates on both sides, so that the convex plates drive the movable plate to slide on the outer surface of the first slide rail. At the same time, the movable plate drives the rotating shaft and the concave plate to move, so that the concave plates on both sides move to the appropriate clamping distance, thereby completing the adjustment of the clamping distance of the semiconductor electronic components;

[0009] When the clamping height needs to be adjusted, the staff moves the adjusting box upwards, so that the adjusting box drives the movable plate and the concave frame to slide upwards on the outer surface of the second slide rail. At the same time, the adjusting box drives the stud to slide upwards on the inner surface of the movable groove. When the concave frames on both sides move to the appropriate clamping height, the staff turns the limit nuts on both sides in turn, so that the limit nuts rotate and move on the outer surface of the stud and fit tightly with the connection between the L-shaped plate, thereby limiting the connection between the adjusting box and the L-shaped plate to complete the adjustment of the clamping height.

[0010] Optionally, the clamping assembly includes a concave plate, the outer surface of the concave plate is fixedly connected to the connection of the rotating shaft, the top of the concave plate is threadedly connected to a screw tube, the bottom of the screw tube passes through the concave plate and is rotatably connected to a pressure plate through a bearing.

[0011] By adopting the above technical solution, the arrangement of the concave plate, the spiral tube and the pressure plate can facilitate the clamping and limiting of semiconductor electronic components.

[0012] Optionally, rubber pads are fixedly connected to opposite sides of the pressure plate and the concave plate, and the number of the rubber pads is four.

[0013] By adopting the above technical solution and setting the rubber pad, semiconductor electronic components can be protected when they are clamped and limited.

[0014] Optionally, first slide rails are fixedly connected to the upper and lower positions of the back side of the adjustment box, and the outer surface of the first slide rail is slidably connected to the inner surface of the movable plate.

[0015] By adopting the above technical solution, the provision of the first slide rail can guide and support the movable plate.

[0016] Optionally, a guide plate is fixedly connected to the front of the convex plate, and guide grooves for use with the guide plate are provided on both left and right sides of the front of the inner cavity of the adjustment box, and the outer surface of the guide plate is slidably connected to the inner surface of the guide groove.

[0017] By adopting the above technical solution and setting the guide plate and the guide groove, the convex plate can be guided and limited.

[0018] Optionally, second slide rails are fixedly connected to the left and right sides of the back side of the L-shaped plate and the outer surfaces of the studs, and the outer surfaces of the second slide rails are slidably connected to the inner surface of the adjustment box.

[0019] By adopting the above technical solution, the provision of the second slide rail can provide guiding support for the adjustment box.

[0020] Optionally, the right end of the forward and reverse threaded rod passes through the adjustment box and is fixedly connected to a rotating handle, and mounting holes are provided on both left and right sides of the bottom of the inner cavity of the L-shaped plate.

[0021] By adopting the above technical solution, the setting of the rotating handle can facilitate the rotation of the forward and reverse threaded rods, and by setting the mounting holes, the device can be easily installed.

[0022] Optionally, movable grooves for use with studs are provided on both left and right sides of the back side of the inner cavity of the L-shaped plate, and the studs are located in the inner cavity of the movable grooves.

[0023] By adopting the above technical solution and setting the movable groove, the movement of the stud can be facilitated.

[0024] In summary, the utility model has the following beneficial effects:

[0025] 1. The utility model can conveniently adjust the clamping spacing and clamping height of semiconductor electronic components by arranging an L-shaped plate, an adjustment box, positive and negative threaded rods, a convex plate, a movable plate, a rotating shaft, a clamping assembly, a reduction motor, a stud and a limit nut. At the same time, the arrangement of the rotating shaft and the reduction motor can facilitate the flipping of semiconductor electronic components, and the arrangement of the clamping assembly can clamp and limit the semiconductor electronic components, thereby facilitating their painting. By arranging the above structure, semiconductor electronic components of different specifications and sizes can be conveniently clamped and limited, thereby avoiding limitations in clamping, and at the same time, it can meet the usage needs of customers.

[0026] 2. The utility model can conveniently clamp and limit semiconductor electronic components by setting concave plates, screw tubes and pressure plates. The setting of rubber pads can protect semiconductor electronic components when clamping and limiting them. The setting of the first slide rail can guide and support the movable plate. The setting of the guide plate and the guide groove can guide and limit the convex plate. The setting of the second slide rail can guide and support the adjustment box. The setting of the turning handle can facilitate the rotation of the positive and negative threaded rods. The setting of the mounting holes can facilitate the installation of the device. The setting of the movable groove can facilitate the movement of the stud. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the structure of the utility model.

[0028] Figure 2 It is a top sectional view of the regulating box structure of the utility model.

[0029] Figure 3 This utility model Figure 2 Enlarged view of structure A.

[0030] Figure 4 It is a three-dimensional diagram of the connection structure of the convex plate and the guide plate of the utility model.

[0031] Figure 5 It is a schematic diagram of the structure of the clamping assembly of the utility model.

[0032] Description of reference numerals:

[0033] 1. L-shaped plate; 2. Adjustment box; 3. Positive and negative threaded rods; 4. Convex plate; 5. Movable plate; 6. Rotating shaft; 7. Clamping assembly; 701. Concave plate; 702. Screw tube; 703. Pressing plate; 8. Reducer motor; 9. Stud; 10. Limiting nut; 11. Rubber pad; 12. First slide rail; 13. Guide plate; 14. Guide groove; 15. Second slide rail; 16. Turn handle; 17. Mounting hole; 18. Moving groove. DETAILED DESCRIPTION

[0034] The following is combined with Figure 1-5 This application is described in further detail.

[0035] Embodiment 1:

[0036] Please refer to Figure 1-5 , a semiconductor electronic component coating clamping assembly comprises an L-shaped plate 1, an adjusting box 2 is slidably connected to the back of the L-shaped plate 1, and adjusting grooves used in conjunction with a convex plate 4 are provided on the left and right sides of the back of the adjusting box 2, so as to facilitate the movement of the convex plate 4, and positive and negative threaded rods 3 are rotatably connected between the left and right sides of the inner cavity of the adjusting box 2 through bearings, and the left and right sides of the outer surfaces of the positive and negative threaded rods 3 are threadedly connected to the convex plate 4, and the left and right sides of the back of the adjusting box 2 are slidably connected to a movable plate 5, and the back of the convex plate 4 penetrates the adjusting box 2 and is fixedly connected to the connection of the movable plate 5, and a rotating shaft 6 is rotatably connected to the rear position of one side of the movable plate 5 through a bearing, and a clamping assembly 7 is fixedly arranged at one end of the rotating shaft 6, and a reduction motor 8 is fixedly installed on the left side of the left movable plate 5, and the output end of the reduction motor 8 penetrates the movable plate 5 and is fixedly connected to the connection of the rotating shaft 6, and the left and right sides of the front of the adjusting box 2 are fixedly connected with studs 9, and the front of the studs 9 penetrates the L-shaped plate 1 and is screwed The threaded connection is provided with a limit nut 10, and the outer surface of the limit nut 10 is tightly fitted with the connection of the L-shaped plate 1. The upper and lower positions on the back of the adjusting box 2 are fixedly connected with the first slide rail 12, and the outer surface of the first slide rail 12 is slidably connected with the inner surface of the movable plate 5. The front of the convex plate 4 is fixedly connected with a guide plate 13. The left and right sides of the front of the inner cavity of the adjusting box 2 are provided with guide grooves 14 used in conjunction with the guide plates 13, and the outer surface of the guide plate 13 is slidably connected with the inner surface of the guide groove 14. The left and right sides of the back of the L-shaped plate 1 and the outer surfaces of the studs 9 are fixedly connected with the second slide rails 15, and the outer surface of the second slide rail 15 is slidably connected with the inner surface of the adjusting box 2. The right end of the positive and negative threaded rod 3 penetrates the adjusting box 2 and is fixedly connected with a turning handle 16. The left and right sides of the bottom of the inner cavity of the L-shaped plate 1 are provided with mounting holes 17, and the left and right sides of the back of the inner cavity of the L-shaped plate 1 are provided with moving grooves 18 used in conjunction with the studs 9, and the studs 9 are located in the inner cavity of the moving grooves 18.

[0037] In this embodiment: The utility model can conveniently adjust the clamping spacing and clamping height of semiconductor electronic components by arranging L-shaped plate 1, adjustment box 2, positive and negative threaded rods 3, convex plate 4, movable plate 5, rotating shaft 6, clamping assembly 7, reduction motor 8, stud 9 and limiting nut 10. At the same time, the arrangement of rotating shaft 6 and reduction motor 8 can facilitate the flipping of semiconductor electronic components, so as to facilitate the painting thereof. By arranging the above structure, semiconductor electronic components of different specifications and sizes can be conveniently clamped and limited, so as to avoid the limitations of clamping, and at the same time, it can meet the usage needs of customers.

[0038] Embodiment 2:

[0039] Reference Figure 1 , Figure 2 and Figure 5 The clamping assembly 7 includes a concave plate 701, the outer surface of the concave plate 701 is fixedly connected to the connection point of the rotating shaft 6, the top of the concave plate 701 is threadedly connected with a screw tube 702, the bottom of the screw tube 702 penetrates the concave plate 701 and is rotatably connected with a pressure plate 703 through a bearing, and the opposite side of the pressure plate 703 and the concave plate 701 are fixedly connected with rubber pads 11, and the number of rubber pads 11 is four.

[0040] In this embodiment: the utility model can conveniently clamp and limit the semiconductor electronic components by providing the concave plate 701, the screw tube 702 and the pressing plate 703.

[0041] The implementation principle of the utility model is as follows: when in use, the staff fixes the device at the designated position by using the mounting hole 17 and the external screws. Then, when the staff adjusts the clamping distance according to the semiconductor electronic components of different specifications and sizes, the staff rotates the turning handle 16, so that the turning handle 16 drives the positive and negative threaded rods 3 to rotate on the inner surface of the convex plates 4 on both sides, so that the convex plates 4 drive the movable plate 5 to slide on the outer surface of the first slide rail 12. At the same time, the movable plate 5 drives the rotating shaft 6 and the concave plate 701 to move, so that the concave plates 701 on both sides move to the appropriate clamping distance, thereby completing the adjustment of the clamping distance of the semiconductor electronic components;

[0042] When the clamping height needs to be adjusted, the staff moves the adjustment box 2 upward, so that the adjustment box 2 drives the movable plate 5 and the concave plate 701 to slide upward on the outer surface of the second slide rail 15. At the same time, the adjustment box 2 drives the stud 9 to slide upward on the inner surface of the moving groove 18. When the concave plates 701 on both sides move to a suitable clamping height, the staff rotates the limiting nuts 10 on both sides in turn, so that the limiting nuts 10 rotate and move on the outer surface of the stud 9 to fit tightly with the connection between the L-shaped plate 1, thereby limiting the connection between the adjustment box 2 and the L-shaped plate 1, and completing the adjustment of the clamping height;

[0043] Next, the staff moves the semiconductor electronic component so that the two sides of the semiconductor electronic component move and insert into the inner cavity of the concave plate 701. At the same time, the bottom of the semiconductor electronic component fits tightly with the connection of the rubber pad 11. Then, the staff rotates the screw tube 702 in sequence so that the screw tube 702 drives the pressure plate 703 to rotate and move downward on the inner surface thread of the concave plate 701, so that the pressure plate 703 drives the rubber pad 11 to fit tightly with the top of the semiconductor electronic component, thereby completing the clamping and limiting of the semiconductor electronic component. Next, the staff energizes the reducer motor 8 plug and starts the external controller of the reducer motor 8 so that the output end of the reducer motor 8 drives the rotating shaft 6 to rotate, and the rotating shaft 6 drives the concave plate 701 to rotate, so that the concave plates 701 and the rotating shaft 6 on both sides are used in coordination to drive the semiconductor electronic components to rotate, so as to facilitate the staff to paint the semiconductor electronic components. The device is simple to operate and is convenient for clamping and limiting semiconductor electronic components of different specifications and sizes, thereby avoiding limitations in clamping and at the same time, it can meet the customer's usage needs.

[0044] The above are all preferred embodiments of the present utility model, and are not intended to limit the protection scope of the present utility model. Therefore, any equivalent changes made based on the structure, shape, and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A semiconductor electronic component coating clamping assembly, comprising an L-shaped plate (1), characterized in that: The back side of the L-shaped plate (1) is slidably connected to an adjustment box (2); a positive and negative threaded rod (3) is rotatably connected between the left and right sides of the inner cavity of the adjustment box (2) via a bearing; a convex plate (4) is threadedly connected to the left and right sides of the outer surface of the positive and negative threaded rod (3); a movable plate (5) is slidably connected to the left and right sides of the back side of the adjustment box (2); the back side of the convex plate (4) penetrates the adjustment box (2) and is fixedly connected to the connection point of the movable plate (5); a rotating shaft is rotatably connected to the rear side of one side of the movable plate (5) via a bearing. (6), a clamping assembly (7) is fixedly provided at one end of the rotating shaft (6), a reduction motor (8) is fixedly installed on the left side of the movable plate (5) on the left side, the output end of the reduction motor (8) passes through the movable plate (5) and is fixedly connected to the connection of the rotating shaft (6), the left and right sides of the front of the adjustment box (2) are fixedly connected with studs (9), the front of the studs (9) passes through the L-shaped plate (1) and is threadedly connected with a limit nut (10), and the outer surface of the limit nut (10) is tightly fitted with the connection of the L-shaped plate (1).

2. A semiconductor electronic component coating clamping assembly according to claim 1, characterized in that: The clamping assembly (7) comprises a concave plate (701), the outer surface of the concave plate (701) is fixedly connected to the connection point of the rotating shaft (6), the top of the concave plate (701) is threadedly connected to a screw tube (702), the bottom of the screw tube (702) passes through the concave plate (701) and is rotatably connected to a pressure plate (703) via a bearing.

3. A semiconductor electronic component coating clamping assembly according to claim 2, characterized in that: The pressure plate (703) and the concave plate (701) are both fixedly connected to one side opposite to the other side with rubber pads (11), and the number of the rubber pads (11) is four.

4. A semiconductor electronic component coating clamping assembly according to claim 1, characterized in that: The upper and lower positions of the back side of the adjustment box (2) are fixedly connected with first slide rails (12), and the outer surface of the first slide rail (12) is slidably connected to the inner surface of the movable plate (5).

5. The semiconductor electronic component coating clamping assembly according to claim 1, characterized in that: A guide plate (13) is fixedly connected to the front of the convex plate (4), and guide grooves (14) for use with the guide plate (13) are provided on both left and right sides of the front of the inner cavity of the adjustment box (2), and the outer surface of the guide plate (13) is slidably connected to the inner surface of the guide groove (14).

6. A semiconductor electronic component coating clamping assembly according to claim 1, characterized in that: Second slide rails (15) are fixedly connected to the left and right sides of the back of the L-shaped plate (1) and are located on the outer surfaces of the studs (9), and the outer surfaces of the second slide rails (15) are slidably connected to the inner surface of the adjustment box (2).

7. A semiconductor electronic component coating clamping assembly according to claim 1, characterized in that: The right end of the forward and reverse threaded rod (3) passes through the adjustment box (2) and is fixedly connected to a rotating handle (16); and mounting holes (17) are provided on both left and right sides of the bottom of the inner cavity of the L-shaped plate (1).

8. The semiconductor electronic component coating clamping assembly according to claim 1, characterized in that: The left and right sides of the back side of the inner cavity of the L-shaped plate (1) are provided with movable grooves (18) for use with the studs (9), and the studs (9) are located in the inner cavity of the movable grooves (18).

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